Die bonder blue film changing method, readable storage medium, computer equipment and system

Abstract

The invention discloses a blue film replacing method for a die bonder, a readable storage medium, computer equipment and a system, and relates to the field of Mini LED display screen manufacturing, and the method comprises the steps: driving a material box to return a next blue film in a waiting station to an operation layer; driving a manipulator to transfer the current blue film on the wafer workbench to a transfer platform, and taking the current blue film as an invalid blue film; driving the material box to push the standby blue film in the standby layer into a waiting station, and taking the standby blue film as a new current blue film; driving the manipulator to transfer the new current blue film in the waiting station to the wafer workbench, and picking crystal grains from the new current blue film to continue to execute the current die bonding process; driving a manipulator to transfer the invalid blue film on the transfer platform to a waiting station; and the material box is driven to return the invalid blue film in the waiting station to the standby layer. According to the invention, the blue film can be replaced at any time, the equipment does not stop, the equipment efficiency is improved, and the labor cost is saved.

Description

Technical Field

[0001] The invention relates to the field of Mini LED display screen manufacturing, and in particular to a method for replacing a blue film in a crystal bonding machine, a readable storage medium, a computer device and a system. Background Art

[0002] In the production process of Mini LED display screens, it is a common work step to remove the wafer from the blue film and place it on the material sheet to complete the crystal removal and crystal bonding operation.

[0003] In the prior art, when the wafer on a wafer blue film is removed, it is usually necessary to shut down the equipment and sound an alarm to prompt the operator to switch to a new wafer blue film; when switching to a new wafer blue film, the operator needs to first take an unfinished blue film, then open the equipment door, remove the produced blue film, and then put in the unproduced blue film, and then press the machine start button to restart the equipment. That is, the equipment can only continue production after the operator has changed the blue film.

[0004] However, it takes about 30 seconds to replace the blue film each time, and the manual processing time is about 60 seconds, that is, it takes about 90 seconds to replace a blue film on average. Therefore, the existing technology requires the operator to always pay attention to the progress of crystal retrieval, and the crystal retrieval and crystal bonding work cannot be continuous, resulting in low production efficiency. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a method for replacing the blue film of a crystal bonding machine, a readable storage medium, a computer device and a system, which can replace the blue film at any time without stopping the equipment, thereby improving equipment efficiency and saving labor costs.

[0006] In order to solve the above technical problems, the present invention provides a method for replacing blue film in a crystal bonding machine. When all the grains in the current blue film on the wafer workbench have been removed and the current crystal bonding process has not been completed, the method for replacing blue film in the crystal bonding machine includes: driving the material box to return the next blue film in the waiting station to the working layer; driving the manipulator to transfer the current blue film on the wafer workbench to the transfer platform, and use the current blue film as an invalid blue film; driving the material box to push the spare blue film in the spare layer to the waiting station, and use the spare blue film as the new current blue film; driving the manipulator to transfer the new current blue film in the waiting station to the wafer workbench, and remove grains from the new current blue film to continue the current crystal bonding process; driving the manipulator to transfer the invalid blue film on the transfer platform to the waiting station; driving the material box to return the invalid blue film in the waiting station to the spare layer.

[0007] As an improvement of the above-mentioned scheme, the method for replacing the blue film in the crystal bonding machine also includes: after completing the current crystal bonding process, driving the robot to transfer the new current blue film to the transfer platform; driving the material box to push the next blue film in the working layer to the waiting station; driving the robot to transfer the next blue film in the waiting station to the wafer workbench to execute the next crystal bonding process.

[0008] As an improvement of the above solution, the method for replacing the blue film in the die bonding machine also includes: driving the manipulator to transfer the current blue film on the transfer platform to the waiting station; driving the material box to return the current blue film in the waiting station to the working layer.

[0009] As an improvement of the above solution, the method for replacing the blue film in a die bonding machine further includes: generating a blue film replacement signal when the invalid blue film is returned to the spare layer.

[0010] As an improvement of the above-mentioned scheme, when not all the grains in the current blue film on the wafer workbench have been removed and the current crystal bonding process has ended, the method for replacing the blue film in the crystal bonding machine also includes: driving the robot to transfer the current blue film on the wafer workbench to the transfer platform; driving the robot to transfer the next blue film in the waiting station to the wafer workbench to execute the next crystal bonding process.

[0011] As an improvement on the above scheme, when all the grains in the current blue film on the wafer workbench have been removed and the current crystal bonding process has ended, the method for replacing the blue film in the crystal bonding machine also includes: driving the robot to transfer the current blue film on the wafer workbench to the transfer platform, and using the current blue film as an invalid blue film; driving the robot to transfer the next blue film in the waiting station to the wafer workbench to execute the next crystal bonding process; driving the robot to transfer the invalid blue film on the transfer platform to the waiting station; driving the material box to return the invalid blue film in the waiting station to the idle spare layer; driving the material box to push the spare blue film in the spare layer to the waiting station, and using the spare blue film as the new current blue film.

[0012] Correspondingly, the present invention further provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the above-mentioned method for replacing the blue film in a die bonding machine.

[0013] Correspondingly, the present invention also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, wherein the processor implements the steps of the above-mentioned method for replacing the blue film of the die bonding machine when executing the computer program.

[0014] Correspondingly, the present invention also provides a blue film replacement system for a die bonding machine, which includes a material box, a transfer platform, a wafer workbench, a waiting station, a robot and the above-mentioned computer equipment, and the computer equipment is connected to the robot to control the robot to perform the blue film replacement operation.

[0015] As an improvement of the above solution, at least two reference layers and at least one spare layer are provided in the material box.

[0016] The implementation of the present invention has the following beneficial effects:

[0017] The present invention uses the excess layers in the material box as spare layers. After each blue film is printed (that is, all the grains in the blue film have been removed), the printed blue film is first placed on the transfer platform, and then the spare layer of blue film is placed on the wafer workbench, and finally the printed blue film is placed on the spare layer; therefore, the present invention can replace the blue film at any time, and the equipment does not need to be shut down, which greatly improves equipment efficiency and saves labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a flow chart of a first embodiment of a method for replacing a blue film in a die bonding machine according to the present invention;

[0019] Figure 2 This is a flow chart of a second embodiment of the method for replacing a blue film in a die bonding machine of the present invention;

[0020] Figure 3 It is a flow chart of a third embodiment of the method for replacing a blue film in a die bonding machine of the present invention;

[0021] Figure 4 is a flow chart of a fourth embodiment of a method for replacing a blue film in a die bonding machine of the present invention;

[0022] Figure 5 is a flow chart of a fifth embodiment of a method for replacing a blue film in a die bonding machine of the present invention;

[0023] Figure 6 This is a schematic diagram of the structure of an embodiment of a blue film replacement system for a die bonding machine of the present invention;

[0024] Figure 7 It is a schematic diagram of the structure of an embodiment of a material box in a blue film replacement system of a die bonding machine of the present invention;

[0025] Figure 8 It is a schematic diagram of the structure of an embodiment of a display module. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. It is hereby stated that the directional terms such as up, down, left, right, front, back, inside, outside, etc. that appear or will appear in the text of the present invention are only based on the accompanying drawings of the present invention, and are not specific limitations of the present invention.

[0027] like Figure 6 and Figure 7 As shown, the blue film replacement system of the die bonding machine of the present invention includes a material box 1, a transfer platform 2, a wafer workbench 3, a waiting station 4, a manipulator and a computer device (see Figure 6 ), wherein the material box 1 is provided with at least two reference layers 11 and at least one spare layer 12 (see Figure 7 ).

[0028] It should be noted that when bonding the display module, considering that the grains on different blue films have slight color differences, the present invention needs to pick the grains from multiple blue films separately, and make the grains in different blue films staggered and bonded on the display module, so as to ensure a uniform transition of the display effects in each area of ​​the display module and between adjacent display modules, and avoid the situation where the brightness of a local area on the display module is abnormally changed, or the brightness difference between adjacent display modules is obvious.

[0029] In the present invention, two reference layers 11 and multiple spare layers 12 are provided in the material box 1, wherein a blue film A is stored in one reference layer 11, a blue film B is stored in another reference layer 11, and a blue film C is stored in a spare layer 12; when solidifying, the crystal grains a can be firstly picked from the blue film A, and the crystal grains a can be evenly dispersed and solidified on the display module, and then, the crystal grains b can be picked from the blue film B, and the vacancies on the display module can be filled with the crystal grains b, thereby realizing the staggered solidification of the crystal grains a and the crystal grains b.

[0030] like Figure 8 As shown, when the grains are picked from the blue film A, if the grain a in the blue film A has been completely picked but the current grain a's bonding process has not been completed, a large blank area D will be formed on the display module; at this time, the grain b on the blue film B cannot be used to bond the blank area D, otherwise, if the grain b is continued to be used to fill the vacancies later, the blank area D will be composed entirely of grains b; therefore, the blue film C needs to be replaced to pick up the grain c and continue bonding, and after the grain b is used to fill the vacancies later, the blank area D will be alternately distributed with grains b and grains c, which can overcome certain color difference defects.

[0031] See also Figure 1 , Figure 1 The flowchart of the first embodiment of the method for replacing the blue film with a die bonder of the present invention is shown. When all the grains in the current blue film on the wafer workbench have been removed and the current die bonding process has not yet ended, the method for replacing the blue film with a die bonder includes:

[0032] S101, driving the material box to return the next blue film in the waiting station to the working layer;

[0033] Different from the prior art, the present invention uses the extra layers in the material box as spare layers, that is, in this embodiment, two reference layers and one spare layer are provided in the material box.

[0034] S102, driving the robot to transfer the current blue film on the wafer workbench to the transfer platform, and treating the current blue film as an invalid blue film;

[0035] S103, driving the material box to push the spare blue film in the spare layer to the waiting station, and use the spare blue film as the new current blue film;

[0036] S104, driving the robot to transfer the new current blue film in the waiting station to the wafer workbench, and picking the die from the new current blue film to continue the current die bonding process;

[0037] S105, driving the manipulator to transfer the invalid blue film on the transfer platform to the waiting station;

[0038] S106, driving the material box to return the invalid blue film in the waiting station to the spare layer.

[0039] Therefore, in the present invention, after each blue film is printed (i.e., all the grains in the blue film have been removed), the printed blue film is first placed on the transfer platform, then the spare layer of blue film is placed on the wafer workbench, and finally the printed blue film is placed on the spare layer.

[0040] Furthermore, when the invalid blue film is returned to the spare layer, a blue film replacement signal is generated so that the operator can replace the blue film of the spare layer in time.

[0041] In summary, the present invention adopts the method of spare ring, the blue film can be replaced at any time, the equipment will not be shut down, the equipment efficiency is improved, and labor costs are saved.

[0042] See also Figure 2 , Figure 2 The flowchart of the second embodiment of the method for replacing the blue film with a die bonder of the present invention is shown. When all the grains in the current blue film on the wafer workbench have been removed and the current die bonding process has not yet ended, the method for replacing the blue film with a die bonder includes:

[0043] S201, driving the material box to return the next blue film in the waiting station to the working layer;

[0044] S202, driving the robot to transfer the current blue film on the wafer workbench to the transfer platform, and treating the current blue film as an invalid blue film;

[0045] S203, driving the material box to push the spare blue film in the spare layer to the waiting station, and use the spare blue film as the new current blue film;

[0046] S204, driving the robot to transfer the new current blue film in the waiting station to the wafer workbench, and picking the die from the new current blue film to continue the current die bonding process;

[0047] S205, driving the manipulator to transfer the invalid blue film on the transfer platform to the waiting station;

[0048] S206, driving the material box to return the invalid blue film in the waiting station to the spare layer.

[0049] S207, after completing the current crystal bonding process, drive the manipulator to transfer the new current blue film to the transfer platform;

[0050] S208, driving the material box to push the next blue film in the working layer to the waiting station;

[0051] S209, driving the robot arm to transfer the next blue film in the waiting station to the wafer workbench to execute the next die bonding process.

[0052] and Figure 1 What is different from the first embodiment shown is that in this embodiment, after the new current blue film completes the current crystal bonding process, the next blue film in the operating layer can be pushed out to the waiting station, so as to continue the subsequent crystal bonding process to achieve alternating crystals of two groups of blue films.

[0053] See also Figure 3 , Figure 3 The flowchart of the third embodiment of the method for replacing the blue film in a die bonder of the present invention is shown. When all the grains in the current blue film on the wafer workbench have been removed and the current die bonding process has not yet ended, the method for replacing the blue film in the die bonder includes:

[0054] S301, driving the material box to return the next blue film in the waiting station to the working layer;

[0055] S302, driving the robot to transfer the current blue film on the wafer workbench to the transfer platform, and treating the current blue film as an invalid blue film;

[0056] S303, driving the material box to push the spare blue film in the spare layer to the waiting station, and using the spare blue film as the new current blue film;

[0057] S304, driving the robot to transfer the new current blue film in the waiting station to the wafer workbench, and picking the die from the new current blue film to continue the current die bonding process;

[0058] S305, driving the manipulator to transfer the invalid blue film on the transfer platform to the waiting station;

[0059] S306, driving the material box to return the invalid blue film in the waiting station to the spare layer.

[0060] S307, after completing the current crystal bonding process, drive the manipulator to transfer the new current blue film to the transfer platform;

[0061] S308, driving the material box to push the next blue film in the working layer to the waiting station;

[0062] S309, driving the robot to transfer the next blue film in the waiting station to the wafer workbench to execute the next die bonding process.

[0063] S310, driving the manipulator to transfer the current blue film on the transfer platform to the waiting station;

[0064] S311, driving the material box to return the current blue film in the waiting station to the working layer.

[0065] and Figure 2 The difference between the second embodiment shown is that in this embodiment, after one round of production, the blue film of the spare layer can be put back into the working layer of normal production to replace the blue film whose grains have been completely removed.

[0066] See also Figure 4 , Figure 4 The flowchart of the fourth embodiment of the method for replacing the blue film in a die bonder of the present invention is shown. When the grains in the current blue film on the wafer workbench have not been completely removed and the current die bonding process has ended, the method for replacing the blue film in the die bonder further includes:

[0067] S401, driving the robot to transfer the current blue film on the wafer workbench to the transfer platform;

[0068] S402, driving the robot to transfer the next blue film in the waiting station to the wafer workbench to execute the next die bonding process.

[0069] and Figure 3 The difference from the third embodiment shown is that in this embodiment, when the grains in the current blue film have not been completely picked and the current die bonding process has ended, the original blue film switching method is maintained and there is no need to replace the blue film.

[0070] See also Figure 5 , Figure 5 The flowchart of the fifth embodiment of the method for replacing the blue film in a die bonder of the present invention is shown. When all the grains in the current blue film on the wafer workbench have been removed and the current die bonding process has ended, the method for replacing the blue film in the die bonder further includes:

[0071] S501, driving the robot to transfer the current blue film on the wafer workbench to the transfer platform, and treating the current blue film as an invalid blue film;

[0072] S502, driving the robot to transfer the next blue film in the waiting station to the wafer workbench to perform the next die bonding process;

[0073] S503, driving the manipulator to transfer the invalid blue film on the transfer platform to the waiting station;

[0074] S504, driving the material box to return the invalid blue film in the waiting station to the idle standby layer;

[0075] and Figure 1 The difference from the first embodiment shown is that in this embodiment, two reference layers and two standby layers are provided in the material box.

[0076] S505, driving the material box to push the spare blue film in the spare layer to the waiting station, and using the spare blue film as the new current blue film.

[0077] It should be noted that in the case where "all the grains in the current blue film on the wafer workbench have been removed and the current die bonding process has ended", Figure 3 The embodiment shown is used for processing, and this embodiment can also be used for processing.

[0078] For example, when all the crystals in the current blue film on the wafer workbench have been removed and the current crystal bonding process has ended, if no processing is done, when the crystals in the current blue film need to be removed again, the state of "when all the crystals in the current blue film on the wafer workbench have been removed and the current crystal bonding process has not ended" will be entered. Figure 3 The embodiment shown is processed;

[0079] For example, when all the grains in the current blue film on the wafer workbench have been removed and the current crystal bonding process has ended, if this embodiment is used for processing, the spare blue film can be quickly pushed out and the invalid blue film can be recovered, further reducing the steps of blue film replacement and improving equipment efficiency.

[0080] Correspondingly, the present invention further discloses a computer-readable storage medium on which a computer program is stored, wherein when the computer program is executed by a processor, the steps of the above-mentioned method for replacing the blue film in a die bonding machine are implemented.

[0081] At the same time, the present invention also discloses a computer device, including a memory and a processor, wherein the memory stores a computer program, wherein the processor implements the steps of the above-mentioned method for replacing the blue film of the die bonding machine when executing the computer program.

[0082] See also Figure 6 , Figure 6 The specific structure of the blue film changing system of the crystal bonding machine of the present invention is shown, which includes a material box 1, a transfer platform 2, a wafer workbench 3, a waiting station 4, a manipulator and the above-mentioned computer equipment. The computer equipment is connected to the manipulator to control the manipulator to perform the blue film changing operation, thereby realizing the steps of the above-mentioned crystal bonding machine blue film changing method.

[0083] like Figure 7 As shown, at least two reference layers 11 and at least one standby layer 12 are provided in the material box 1 .

[0084] Different from the prior art, the present invention uses the excess layers in the material box 1 as spare layers 12, which greatly improves the storage method of the blue film, so as to better cooperate with the control logic of the blue film replacement method of the crystal bonding machine, ensure that the blue film can be replaced at any time, the equipment will not stop, improve equipment efficiency, and save labor costs.

[0085] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A method for replacing blue film in a die bonding machine, characterized in that: When all the crystal grains in the current blue film on the wafer workbench have been removed and the current crystal bonding process has not yet ended, the method for replacing the blue film in the crystal bonding machine includes: The drive box returns the next blue film in the waiting position to the working layer; Driving the robot to transfer the current blue film on the wafer workbench to the transfer platform, and treating the current blue film as an invalid blue film; The material box is driven to push the spare blue film in the spare layer to the waiting station, and the spare blue film is used as the new current blue film; The robot is driven to transfer the new current blue film in the waiting station to the wafer workbench, and picks the die from the new current blue film to continue the current die bonding process; Drive the manipulator to transfer the invalid blue film on the transfer platform to the waiting station; The drive material box returns the invalid blue film in the waiting position to the spare layer.

2. The method for replacing blue film in a die bonder according to claim 1, characterized in that: Also includes: After completing the current crystal bonding process, drive the robot to transfer the new current blue film to the transfer platform; The drive box pushes the next blue film in the working layer to the waiting position; The robot arm is driven to transfer the next blue film in the waiting station to the wafer workbench to execute the next die bonding process.

3. The method for replacing blue film in a die bonder according to claim 2, characterized in that: Also includes: Drive the robot to transfer the current blue film on the transfer platform to the waiting position; The drive material box returns the current blue film in the waiting position to the working layer.

4. The method for replacing blue film in a die bonding machine according to claim 1, characterized in that: Also includes: When the invalid blue film is returned to the spare layer, a blue film replacement signal is generated.

5. The method for replacing blue film in a die bonder according to claim 1, characterized in that: When all the grains in the current blue film on the wafer workbench have not been removed and the current crystal bonding process has ended, the method for replacing the blue film in the crystal bonding machine further includes: Driving the manipulator to transfer the current blue film on the wafer workbench to the transfer platform; The robot arm is driven to transfer the next blue film in the waiting station to the wafer workbench to execute the next die bonding process.

6. The method for replacing blue film in a die bonder according to claim 1, characterized in that: When all the crystal grains in the current blue film on the wafer workbench have been removed and the current crystal bonding process has ended, the method for replacing the blue film in the crystal bonding machine further includes: Driving the robot to transfer the current blue film on the wafer workbench to the transfer platform, and treating the current blue film as an invalid blue film; Drive the robot to transfer the next blue film in the waiting position to the wafer workbench to perform the next die bonding process; Drive the manipulator to transfer the invalid blue film on the transfer platform to the waiting station; The drive box returns the invalid blue film in the waiting position to the idle standby layer; The material box is driven to push the spare blue film in the spare layer into the waiting station, and the spare blue film is used as the new current blue film.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method for replacing a blue film in a die bonder according to any one of claims 1 to 6 are implemented.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method for replacing the blue film in a die bonder according to any one of claims 1 to 6 are implemented.

9. A blue film replacement system for a die bonder, characterized in that: It comprises a material box, a transfer platform, a wafer workbench, a waiting station, a robot and the computer device as claimed in claim 8, wherein the computer device is connected to the robot to control the robot to perform a blue film changing operation.

10. The blue film replacement system for a die bonder according to claim 9, characterized in that: At least two reference layers and at least one standby layer are arranged in the material box.

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