SiC epitaxial substrate conveying system

Abstract

The invention relates to the technical field of semiconductors, in particular to a SiC epitaxial substrate conveying system, which comprises a loading box, a disc ring placing box, an edge finder, a deviation rectifying platform, a merging and splitting module and a manipulator, and is characterized in that the edge finder, the deviation rectifying platform and the merging and splitting module are respectively provided with a first positioning reference, a second positioning reference and a third positioning reference; the edge finder carries out edge finding and deviation rectification on a wafer according to a first positioning reference so as to determine the position and angle of the wafer, the deviation rectification platform carries out edge finding and deviation rectification on a graphite disc according to a second positioning reference so as to determine the position and angle of the graphite disc, and the merging and splitting module carries out edge finding and deviation rectification on a graphite ring according to a third positioning reference so as to determine the position and angle of the graphite disc. Determining the position and the angle of the graphite ring; according to the invention, the wafer, the graphite ring and the graphite disc can independently complete edge searching and deviation correction, and the wafer, the graphite ring and the graphite disc can be accurately combined, so that accurate positioning of the wafer is realized, and the wafer processing quality is ensured.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a SiC epitaxial substrate conveying system. Background Art

[0002] Generally, a semiconductor device manufacturing process is performed by repeatedly performing a plurality of unit processes, such as an exposure process, an etching process, a diffusion process, a deposition process, and a metal process on a wafer, and the wafer loaded on a carrier within the facility is introduced or taken out by a wafer transfer device.

[0003] The wafer transfer device is equipped with a robot that supports the wafer at the front end of the arm. The wafer is transferred while being supported by the robot. The wafer is supported by a carrier during transfer, which facilitates the smooth loading of the wafer into the epitaxial device. However, the existing method of manually placing the wafer on the carrier affects the positioning accuracy of the wafer, makes it inconvenient for the robot to grab the wafer, and makes it difficult to ensure the processing quality. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a SiC epitaxial substrate conveying system, in which the wafer, graphite ring and graphite disk can independently complete edge finding and deviation correction, the graphite ring and wafer or graphite disk can be accurately merged or split, and the wafer can be smoothly placed in an epitaxial growth environment, thereby ensuring the wafer processing quality.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A SiC epitaxial substrate conveying system, comprising a loading box for storing wafers, a disk-ring placing box for storing a combination of graphite rings and graphite disks, an edge finder for finding edges of wafers, a deviation correction platform for finding edges of graphite disks, a merging and splitting module, and a manipulator, wherein the manipulator is used to grab or place wafers, graphite rings, or graphite disks;

[0007] The edge finder, the deflection correction platform and the merging and splitting module are respectively provided with a first positioning reference, a second positioning reference and a third positioning reference. The edge finder performs edge finding and deflection correction on the wafer according to the first positioning reference to determine the position and angle of the wafer. The deflection correction platform performs edge finding and deflection correction on the graphite disk according to the second positioning reference to determine the position and angle of the graphite disk. The merging and splitting module performs edge finding and deflection correction on the graphite ring according to the third positioning reference to determine the position and angle of the graphite ring.

[0008] When edge-finding the wafer, the manipulator loads the combination of the graphite disk and the graphite ring into the merging and splitting module, the merging and splitting module separates the graphite disk from the graphite ring, the manipulator puts the graphite disk into the deviation correction platform for edge-finding to determine the position and angle of the graphite disk, and the graphite ring is edge-finded by the merging and splitting module to determine the position and angle of the graphite ring. The manipulator successively grabs the wafer and the graphite disk after edge-finding and loads them into the merging and splitting module, so that the center position and the hypotenuse direction of the wafer or the graphite disk are consistent with the center position and the hypotenuse direction of the graphite ring. The merging and splitting module merges the wafer, the graphite ring and the graphite disk, and the manipulator transfers the merged wafer, the graphite ring and the graphite disk as a whole to the epitaxial growth environment;

[0009] After the wafer has undergone epitaxial growth, the robot puts the combination of the wafer, graphite ring and graphite disk into a merging and splitting module, the merging and splitting module separates the graphite disk from the graphite ring, the robot puts the graphite disk into the correction platform and performs edge finding and correction according to the second positioning reference to determine the position and angle of the graphite disk, the merging and splitting module separates the wafer from the graphite ring, the robot takes the wafer away and puts it into a loading box, the robot puts the graphite disk into the merging and splitting module, the merging and splitting module merges the graphite disk and the graphite ring, and the robot puts the merged graphite ring and graphite disk as a whole into the disk-ring placement box.

[0010] The merging and splitting module includes a base frame, a plurality of ring brackets connected to the top of the base frame, a tray and a lifting mechanism, wherein the ring brackets are distributed around the base frame, the lifting mechanism is connected to the tray by driving, the base frame is penetrated by movable openings at the top and bottom, the output end of the lifting mechanism is penetrated by the movable opening, and the lifting mechanism drives the tray to move up and down, so that the tray moves up and down inside the ring bracket;

[0011] When the graphite ring and the graphite disk are separated, the lifting mechanism drives the tray to move upward to a required height, the manipulator puts the combination of the graphite disk and the graphite ring into the merging and splitting module, the ring bracket and the tray support the graphite ring and the graphite disk respectively, and the lifting mechanism drives the tray to move downward, so that the graphite disk moves downward synchronously with the tray to be separated from the graphite ring;

[0012] When the wafer is combined with the graphite ring, the lifting mechanism drives the tray to move upward to a desired height, the robot puts the wafer into the tray, and the lifting mechanism descends to drive the wafer to descend synchronously, so that the wafer is supported by the graphite ring.

[0013] The merging and splitting module further includes a detaching and splitting driving mechanism, a detaching and splitting ring light source, a surface light source and a collection device. The detaching and splitting driving mechanism is used to drive the base frame to move along the X-axis and the Y-axis and to make the base frame rotate. The detaching and splitting ring light source is located between the base frame and the surface light source. The front end of the collection device passes through the surface light source and corresponds to the detaching and splitting ring light source.

[0014] When the graphite ring is searching for an edge, the ring bracket supports the graphite ring, the surface light source and the detachable ring light source provide supplementary light for the graphite ring and the acquisition device, the acquisition device visually takes pictures to determine the position and angle of the graphite ring, and the detachable driving mechanism drives the base frame to move along the X-axis and / or Y-axis according to the data obtained by the acquisition device, and makes the base frame rotate, so that the graphite ring determines its own position and angle according to the third positioning reference.

[0015] Among them, the disassembling and assembling driving mechanism includes a disassembling and assembling X-axis module, a disassembling and assembling Y-axis module drivingly connected to the disassembling and assembling X-axis module, and a disassembling and assembling rotating unit drivingly connected to the disassembling and assembling Y-axis module. The disassembling and assembling X-axis module drives the disassembling and assembling Y-axis module to move along the X-axis, and the disassembling and assembling Y-axis module drives the disassembling and assembling rotating unit to move along the Y-axis. The disassembling and assembling rotating unit is drivingly connected to the base frame, and the disassembling and assembling rotating unit is used to drive the base frame to rotate. The disassembling and assembling rotating unit is installed with a shield, and the shield is penetrated with mounting openings above and below, and the output end of the lifting mechanism is penetrated through the mounting opening.

[0016] The deflection correction platform includes a deflection correction platform, a deflection correction driving mechanism connected to the deflection correction platform, a deflection correction annular light source and a deflection correction collector. The deflection correction driving mechanism is used to drive the deflection correction platform to move along the X-axis and the Y-axis and make the deflection correction platform rotate. The deflection correction annular light source is located between the deflection correction platform and the deflection correction collector. The deflection correction collector corresponds to the deflection correction annular light source.

[0017] When the graphite disk is finding its edge, the deflection correction table supports the graphite disk, the deflection correction ring light source provides supplementary light for the graphite disk, the deflection correction collector visually takes photos to determine the position and angle of the graphite disk, and the deflection correction drive mechanism drives the deflection correction table to move along the X-axis and / or Y-axis according to the data obtained by the deflection correction collector, and makes the deflection correction table rotate, so that the graphite disk determines its own position and angle according to the second positioning reference.

[0018] Among them, the deflection correction driving mechanism includes a deflection correction X-axis module, a deflection correction Y-axis module drivingly connected to the deflection correction X-axis module, and a deflection correction rotation unit drivingly connected to the deflection correction Y-axis module, the deflection correction X-axis module drives the deflection correction Y-axis module to move along the X-axis, the deflection correction Y-axis module drives the deflection correction rotation unit to move along the Y-axis, the deflection correction rotation unit is drivingly connected to the deflection correction table, and the deflection correction rotation unit is used to drive the deflection correction table to rotate.

[0019] Wherein, the ring bracket is provided with a ring supporting opening, and when the ring bracket supports the graphite ring, the bottom outer edge of the graphite ring extends into the ring supporting opening.

[0020] Among them, the bottom end of the graphite ring is provided with an annular disk accommodating groove, and when the graphite disk and the graphite ring are combined, the top outer edge of the graphite disk extends into the disk accommodating groove, and the top end of the graphite ring is provided with an annular sheet accommodating groove, and when the wafer and the graphite ring are combined, the bottom outer edge of the wafer extends into the sheet accommodating groove.

[0021] Among them, the SiC epitaxial substrate conveying system also includes a cleaning mechanism. The robot puts the combination of graphite disk and graphite ring into the cleaning mechanism, first removes the dust adhering to the graphite disk and graphite ring through the cleaning mechanism, and then the robot transfers the graphite disk and graphite ring in the cleaning mechanism to the disk and ring placement box.

[0022] Beneficial effects of the present invention:

[0023] Wafers, graphite rings and graphite disks can all independently complete edge finding and deviation correction. The robot only needs to perform fixed actions of grabbing or placing wafers, graphite rings or graphite disks. It can accurately merge or split the graphite ring with the wafer or graphite disk and achieve precise positioning of the wafer. The robot can transfer the merged wafer, graphite ring and graphite disk as a whole to the epitaxial growth environment to ensure the wafer processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the SiC epitaxial substrate conveying system of the present invention.

[0025] Figure 2 This is a schematic diagram of the structure when the graphite ring and graphite disk are combined.

[0026] Figure 3 Schematic diagram of the exploded structure with wafer, graphite ring and graphite disk.

[0027] Figure 4 It is a three-dimensional diagram showing the graphite ring, graphite disk and the combined split module separated.

[0028] Figure 5 This is a schematic diagram of the positional relationship between the tray, graphite ring and ring bracket before the wafer and graphite ring are combined.

[0029] Figure 6 It is a schematic diagram of the three-dimensional structure of the merged and split modules.

[0030] Figure 7 Schematic diagram of the exploded structure of the disassembly and assembly of the drive mechanism.

[0031] Figure 8 Schematic diagram of the three-dimensional structure of the correction platform Figure 1 .

[0032] Fig. 9 Schematic diagram of the three-dimensional structure of the correction platform Figure 2 .

[0033] Fig.10 It is a structural schematic diagram of the separation of the graphite ring and the ring bracket.

[0034] Fig.11 Schematic diagram of the local structure when the graphite ring is separated from the graphite disk.

[0035] Fig.12 This is a three-dimensional image of the wafer and graphite ring when separated.

[0036] Fig.13 It is a schematic diagram of the three-dimensional structure of the cleaning mechanism and the robot.

[0037] 01. Wafer; 02. Graphite ring;

[0038] 021, disc receiving groove; 022, sheet receiving groove; 03, graphite disc;

[0039] 1. Loading box; 2. Ring placing box; 3. Edge finder;

[0040] 4. Correction platform;

[0041] 41. Deviation correction platform; 42. Deviation correction driving mechanism;

[0042] 421, deviation correction X-axis module; 422, deviation correction Y-axis module; 423, deviation correction rotation unit; 43, deviation correction ring light source; 44, deviation correction collector;

[0043] 5. Merge and split modules;

[0044] 51, bottom frame; 511, movable opening; 52, ring bracket; 521, supporting ring opening;

[0045] 53. Tray; 54. Lifting mechanism; 55. Disassembly and assembly drive mechanism;

[0046] 551, disassembling and assembling the X-axis module; 552, disassembling and assembling the Y-axis module; 553, disassembling and assembling the rotating unit; 5531, protective cover; 5532, installation port;

[0047] 56. Disassembled ring light source; 57. Surface light source; 58. Collection equipment;

[0048] 6. Robotic arm; 7. Cleaning mechanism. DETAILED DESCRIPTION

[0049] To facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with examples and drawings. Specific implementation methods of the present invention will be described below. It should be pointed out that in the specific description of these implementation methods, in order to provide a concise description, this specification cannot provide a detailed description of all features of the actual implementation methods.

[0050] refer to Figures 1 to 13As shown, the present invention provides a SiC epitaxial substrate conveying system, comprising a loading box 1 for storing wafers 01, a disk-ring placing box 2 for storing a combination of graphite rings 02 and graphite disks 03, an edge finder 3 for finding edges of wafers 01, a correction platform 4 for finding edges of graphite disks 03, a merging and splitting module 5 and a manipulator 6, wherein the manipulator 6 is used to grab or place wafers 01, graphite rings 02 or graphite disks 03; the edge finder 3, the correction platform 4 and the merging and splitting module 5 are respectively provided with a first positioning reference, a second positioning reference and a third positioning reference, the edge finder 3 performs edge finding and correction on the wafer 01 according to the first positioning reference to determine the position and angle of the wafer 01, the correction platform 4 performs edge finding and correction on the graphite disk 03 according to the second positioning reference to determine the position and angle of the graphite disk 03, and the merging and splitting module 5 performs edge finding and correction on the graphite ring 02 according to the third positioning reference to determine the position and angle of the graphite ring 02.

[0051] refer to Figure 1 As shown, in actual application, the manipulator 6 is a dual-arm four-axis robot, and the manipulator 6 is provided with a suction arm, which is convenient for smoothly grasping or placing the wafer 01, the graphite ring 02 or the graphite disk 03. First, the manipulator 6 puts the wafer 01 into the edge finder 3 for edge finding. Specifically, the first positioning reference has been determined by debugging before the edge finder 3 works. The position and angle of the wafer 01 can be accurately determined through the first positioning reference. When the position and angle of the wafer 01 coincide with the position and angle of the first positioning reference, the edge finding of the wafer 01 is completed. The edge finding of the wafer 01 can be completed independently, thereby improving the edge finding efficiency of the wafer 01. Figure 2As shown, the manipulator 6 loads the combination of the graphite disk 03 and the graphite ring 02 into the merging and splitting module 5, and the merging and splitting module 5 separates the graphite disk 03 from the graphite ring 02. The manipulator 6 puts the graphite disk 03 into the deviation correction platform 4 to find the edge so as to determine the position and angle of the graphite disk 03. The merging and splitting module 5 finds the edge of the graphite ring 02 so as to determine the position and angle of the graphite ring 02. Specifically, the second positioning reference has been determined by debugging before the deviation correction platform 4 works, and the third positioning reference has been determined by debugging before the merging and splitting module 5 works. When the position and angle of the graphite disk 03 coincide with the position and angle of the second positioning reference, the graphite disk 03 is at the correct position. The edge finding of disk 03 is completed. When the position and angle of graphite ring 02 coincide with the position and angle of the third positioning reference, the edge finding of graphite ring 02 is completed, and independent edge finding of wafer 01, graphite ring 02 and graphite disk 03 is realized respectively. It does not need to rely on changes in the external environment, has high stability, and improves the positioning speed of wafer 01. Then, the robot 6 successively grabs the wafer 01 and graphite disk 03 after edge finding and loads them into the merging and splitting module 5, so that the center position and hypotenuse direction of the wafer 01 or graphite disk 03 are consistent with the center position and hypotenuse direction of the graphite ring 02. The merging and splitting module 5 merges the wafer 01, graphite ring 02 and graphite disk 03. Therefore, after the center position and hypotenuse direction of the wafer 01 are determined by the edge finder 3, they will no longer undergo secondary adjustments by the deflection correction platform 4, the merging and splitting module 5 or the manipulator 6. The deflection correction platform 4 and the merging and splitting module 5 also use independent edge finding for the positioning and edge finding of their respective graphite disks 03 and graphite rings 02. The wafer 01, the graphite ring 02 and the graphite disk 03 can all independently complete edge finding and deflection correction. The manipulator 6 only needs to perform fixed grabbing or placing actions of the wafer 01, the graphite ring 02 or the graphite disk 03, thereby saving a lot of reference calibration time between the edge finder 3, the deflection correction platform 4 and the merging and splitting module 5, reducing the calculation complexity of the equipment, and enabling the transmission system to achieve high-precision positioning through a pre-set positioning reference.

[0052] After the wafer 01 has undergone epitaxial growth, the robot 6 takes out the combination of the wafer 01, the graphite ring 02 and the graphite disk 03 from the reaction chamber and puts it into the merging and splitting module 5. The merging and splitting module 5 separates the graphite disk 03 from the graphite ring 02. The robot 6 puts the graphite disk 03 into the correction platform 4 and performs edge finding and correction according to the second positioning reference to determine the position and angle of the graphite disk 03. The graphite ring 02 is effectively supported by the merging and splitting module 5. Specifically, after the correction platform 4 finds the edge of the graphite disk 03, the position and angle information of the graphite disk 03 is not transmitted to the robot 6 and the merging and splitting module 5. The robot 6 adopts a fixed grasping or placing action to realize the taking and placing of the graphite disk 3, and smoothly realizes the individual edge finding of the graphite disk 03; refer to Figure 3As shown, the merging and splitting module 5 separates the wafer 01 from the graphite ring 02, and the robot 6 takes the wafer 01 and puts it into the loading box 1, and successfully loads the wafer 01 after epitaxial growth; the robot 6 puts the graphite disk 03 into the merging and splitting module 5, and Figure 2 As shown, the merging and splitting module 5 merges the graphite disk 03 and the graphite ring 02, and the manipulator 6 places the merged graphite ring 02 and graphite disk 03 as a whole into the disk-ring placement box 2, and smoothly places the combination of the graphite ring 02 and the graphite disk 03 back into the disk-ring placement box 2, so as to facilitate the recycling of the combination of the graphite ring 02 and the graphite disk 03 and facilitate the manipulator 6 to take and place the graphite ring 02 and the graphite disk 03.

[0053] Therefore, the present application enables the wafer 01, graphite ring 02 and graphite disk 03 to independently complete edge finding and deviation correction. The robot 6 only needs to perform fixed actions of grabbing or placing the wafer 01, graphite ring 02 or graphite disk 03, and can accurately merge or split the graphite ring 02 with the wafer 01 or graphite disk 03, achieve precise positioning of the wafer 01, and can transfer the merged wafer 01, graphite ring 02 and graphite disk 03 as a whole to the epitaxial growth environment through the robot 6 to ensure the wafer processing quality.

[0054] refer to Figure 4 As shown, in this embodiment, the merging and splitting module 5 includes a base frame 51, a plurality of ring brackets 52 connected to the top of the base frame 51, a tray 53 and a lifting mechanism 54. The ring brackets 52 are distributed around the base frame 51, and the lifting mechanism 54 is drivingly connected to the tray 53. The base frame 51 is penetrated by a movable opening 511 from top to bottom, and the output end of the lifting mechanism 54 is penetrated by the movable opening 511. The lifting mechanism 54 drives the tray 53 to move up and down, so that the tray 53 moves up and down on the inner side of the ring bracket 52. The structure is compact and space occupancy is saved.

[0055] In actual application, the lifting mechanism 54 is a cylinder, an oil cylinder or an electric cylinder, and the lifting mechanism 54 drives the tray 53 to move upward to the required height. The manipulator 6 puts the combination of the graphite disk 03 and the graphite ring 02 into the merging and splitting module 5, and the ring bracket 52 and the tray 53 respectively support the graphite ring 02 and the graphite disk 03. The lifting mechanism 54 drives the tray 53 to move downward, so that the graphite disk 03 moves downward synchronously with the tray 53 to separate from the graphite ring 02. The manipulator 6 grabs the graphite disk 03 to the deviation correction platform 4 for edge finding, so as to accurately position the graphite disk 03; after the edge finding of the wafer 01 and the graphite ring 02 is completed, refer to Figure 5As shown, the lifting mechanism 54 drives the tray 53 to move upward to the required height, the robot 6 puts the wafer 01 into the tray 53, the tray 53 stably supports the wafer 01, and the lifting mechanism 54 descends to drive the wafer 01 to descend synchronously, so that the wafer 01 is supported by the graphite ring 02, and the wafer 01 and the graphite ring 02 are merged; similarly, after the graphite ring 02 and the wafer 01 are merged, the graphite disk 03 is loaded into the merging and splitting module 5, and the lifting mechanism 54 drives the graphite disk 03 to lift the graphite ring 02 and the wafer 01 upward, and the merging of the wafer 01, the graphite ring 02 and the graphite disk 03 is completed. The structure is ingenious, which is convenient for rapid merging and splitting, and ensures the processing quality of the wafer 01.

[0056] refer to Figure 6 As shown, in this embodiment, the merging and splitting module 5 also includes a merging and splitting driving mechanism 55, a merging and splitting ring light source 56, a surface light source 57 and a collection device 58. The merging and splitting driving mechanism 55 is used to drive the base frame 51 to move along the X-axis and the Y-axis, and to make the base frame 51 rotate. The merging and splitting ring light source 56 is located between the base frame 51 and the surface light source 57. The front end of the collection device 58 passes through the surface light source 57 and corresponds to the merging and splitting ring light source 56.

[0057] refer to Figure 5 As shown, in actual application, the graphite ring 02 is supported by the ring bracket 52, referring to Figure 6 As shown, the surface light source 57 and the detachable annular light source 56 provide supplementary light for the graphite ring 02 and the acquisition device 58. The acquisition device 58 takes visual photos to determine the position and angle of the graphite ring 02. The detachable driving mechanism 55 drives the base frame 51 to move along the X-axis and / or Y-axis according to the data obtained by the acquisition device 58, and causes the base frame 51 to rotate, so that the graphite ring 02 determines its own position and angle according to the third positioning reference, thereby achieving accurate positioning of the graphite ring 02 and completing the edge finding of the graphite ring 02. Specifically, after the merging and splitting module 5 finds the edge of the graphite ring 02, the position and angle information of the graphite disk 03 is not transmitted to the manipulator 6 and the merging and splitting module 5. The manipulator 6 can realize the picking and placing of the graphite ring 02 by using a fixed grasping or placing action, thereby smoothly realizing the individual edge finding of the graphite ring 02.

[0058] refer to Figure 7As shown, in this embodiment, the disassembly and assembly driving mechanism 55 includes a disassembly and assembly X-axis module 551, a disassembly and assembly Y-axis module 552 drivingly connected to the disassembly and assembly X-axis module 551, and a disassembly and assembly rotation unit 553 drivingly connected to the disassembly and assembly Y-axis module 552. The disassembly and assembly X-axis module 551 and the disassembly and assembly Y-axis module 552 are linear motors, oil cylinders or electric cylinders. The disassembly and assembly X-axis module 551 drives the disassembly and assembly Y-axis module 552 to move along the X-axis, and the disassembly and assembly Y-axis module 552 drives the disassembly and assembly rotation unit 553 along the Y-axis. The disassembling and assembling rotating unit 553 is a servo motor or a driving motor, and the disassembling and assembling rotating unit 553 is drivingly connected to the base frame 51. The disassembling and assembling rotating unit 553 is used to drive the base frame 51 to rotate. The disassembling and assembling rotating unit 553 is installed with a shield 5531, and the shield 5531 is penetrated by mounting openings 5532 from top to bottom. The output end of the lifting mechanism 54 is penetrated by the mounting opening 5532, and the front end of the lifting mechanism 54 is hidden in the shield 5531. The structure is compact and space-saving.

[0059] refer to Figure 8 As shown, in this embodiment, the deflection correction platform 4 includes a deflection correction table 41, a deflection correction driving mechanism 42 driven and connected to the deflection correction table 41, a deflection correction ring light source 43 and a deflection correction collector 44, the deflection correction driving mechanism 42 is used to drive the deflection correction table 41 to move along the X-axis and the Y-axis, and to make the deflection correction table 41 rotate, the deflection correction ring light source 43 is located between the deflection correction table 41 and the deflection correction collector 44, and the deflection correction collector 44 corresponds to the deflection correction ring light source 43; refer to Fig. 9 As shown, in actual application, the graphite disk 03 is supported by the deflection correction platform 41, the deflection correction ring light source 43 supplements the graphite disk 03, the deflection correction collector 44 visually takes pictures to determine the position and angle of the graphite disk 03, and the deflection correction drive mechanism 42 drives the deflection correction platform 41 to move along the X-axis and / or Y-axis according to the data obtained by the deflection correction collector 44, and makes the deflection correction platform 41 rotate, so that the graphite disk 03 determines its own position and angle according to the second positioning reference, thereby adjusting the position and angle of the graphite disk 03, realizing accurate positioning of the graphite disk 03, and completing the edge finding of the graphite disk 03; specifically, after the deflection correction platform 4 finds the edge of the graphite disk 03, the position and angle information of the graphite disk 03 is not transmitted to the manipulator 6 and the merging and splitting module 5, and the manipulator 6 can realize the taking and placing of the graphite disk 03 by using a fixed grasping or placing action, and smoothly realizes the individual edge finding of the graphite disk 03.

[0060] refer to Fig. 9As shown, in this embodiment, the deflection correction drive mechanism 42 includes a deflection correction X-axis module 421, a deflection correction Y-axis module 422 drivingly connected to the deflection correction X-axis module 421, and a deflection correction rotation unit 423 drivingly connected to the deflection correction Y-axis module 422. The deflection correction X-axis module 421 and the deflection correction Y-axis module 422 are linear motors, oil cylinders or electric cylinders. The deflection correction X-axis module 421 drives the deflection correction Y-axis module 422 to move along the X-axis, and the deflection correction Y-axis module 422 drives the deflection correction rotation unit 423 to move along the Y-axis. The deflection correction rotation unit 423 is a servo motor or a drive motor. The deflection correction rotation unit 423 is drivingly connected to the deflection correction table 41, and the deflection correction rotation unit 423 is used to drive the deflection correction table 41 to rotate.

[0061] refer to Fig.10 As shown, in this embodiment, the ring bracket 52 is provided with a ring supporting opening 521. When the ring bracket 52 supports the graphite ring 02, the bottom outer edge of the graphite ring 02 extends into the ring supporting opening 521, and the graphite ring 02 is supported by the ring supporting opening 521, which facilitates the positioning of the graphite ring 02.

[0062] refer to Fig.11 As shown, in this embodiment, the bottom end of the graphite ring 02 is provided with an annular disk accommodating groove 021. When the graphite disk 03 is combined with the graphite ring 02, the top outer edge of the graphite disk 03 extends into the disk accommodating groove 021, and part of the graphite disk 03 is hidden in the graphite ring 02. The structure is compact, space is saved, and the graphite disk 03 is accurately positioned on the graphite ring 02. Fig.12 As shown, the top of the graphite ring 02 is provided with an annular sheet accommodating groove 022. When the wafer 01 and the graphite ring 02 are combined, the bottom outer edge of the wafer 01 extends into the sheet accommodating groove 022, so that part of the wafer 01 is hidden in the graphite ring 02. The structure is compact, space is saved, and it is beneficial for the wafer 01 to be accurately positioned in the graphite ring 02.

[0063] refer to Fig.13 As shown, in this embodiment, the SiC epitaxial substrate conveying system also includes a cleaning mechanism 7, which is an ultrasonic cleaning machine. The manipulator 6 puts the combination of the graphite disk 03 and the graphite ring 02 into the cleaning mechanism 7, and first uses the cleaning mechanism 7 to remove dust adhering to the graphite disk 03 and the graphite ring 02 to ensure that the graphite ring 02 and the graphite disk 03 are clean and tidy. Then, the manipulator 6 transfers the graphite disk 03 and the graphite ring 02 in the cleaning mechanism 7 to the disk-ring placement box 2, which is conducive to the recycling of the graphite ring 02 and the graphite disk 03.

[0064] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention is disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent changes and modifications made to the above embodiments according to the technology of the present invention are within the scope of the technical solution of the present invention without departing from the content of the technical solution of the present invention.

Claims

1. A SiC epitaxial substrate conveying system, characterized in that: It comprises a loading box (1) for storing wafers (01), a disk-ring placement box (2) for storing a combination of graphite rings (02) and graphite disks (03), an edge finder (3) for finding the edge of the wafer (01), a deviation correction platform (4) for finding the edge of the graphite disk (03), a merging and splitting module (5) and a robot (6), wherein the robot (6) is used to grab or place the wafer (01), the graphite ring (02) or the graphite disk (03); The edge finder (3), the deflection correction platform (4) and the merging and splitting module (5) are respectively provided with a first positioning reference, a second positioning reference and a third positioning reference; the edge finder (3) performs edge finding and deflection correction on the wafer (01) according to the first positioning reference to determine the position and angle of the wafer (01); the deflection correction platform (4) performs edge finding and deflection correction on the graphite disk (03) according to the second positioning reference to determine the position and angle of the graphite disk (03); and the merging and splitting module (5) performs edge finding and deflection correction on the graphite ring (02) according to the third positioning reference to determine the position and angle of the graphite ring (02); When edge finding is performed on the wafer (01), the robot (6) loads the combination of the graphite disk (03) and the graphite ring (02) into the merging and splitting module (5), and the merging and splitting module (5) separates the graphite disk (03) from the graphite ring (02). The robot (6) places the graphite disk (03) on the deviation correction platform (4) to find the edge, thereby determining the position and angle of the graphite disk (03). The merging and splitting module (5) finds the edge of the graphite ring (02), thereby determining the position and angle of the graphite ring (02). The manipulator (6) successively grabs the wafer (01) and the graphite disk (03) after edge finding and loads them into the merging and splitting module (5), so that the center position and the hypotenuse direction of the wafer (01) or the graphite disk (03) are consistent with the center position and the hypotenuse direction of the graphite ring (02); the merging and splitting module (5) merges the wafer (01), the graphite ring (02) and the graphite disk (03); the manipulator (6) transfers the merged wafer (01), the graphite ring (02) and the graphite disk (03) as a whole to an epitaxial growth environment; After the wafer (01) undergoes epitaxial growth, the robot (6) places the combination of the wafer (01), the graphite ring (02) and the graphite disk (03) into a merging and splitting module (5), the merging and splitting module (5) separates the graphite disk (03) from the graphite ring (02), the robot (6) places the graphite disk (03) on a deviation correction platform (4) and performs edge finding and deviation correction according to a second positioning reference to determine the position and angle of the graphite disk (03), and the merging and splitting module (5) separates the graphite disk (03) from the graphite ring (02). The sub-module (5) separates the wafer (01) from the graphite ring (02), the robot (6) takes the wafer (01) and puts it into the loading box (1), the robot (6) puts the graphite disk (03) into the merging and splitting module (5), the merging and splitting module (5) merges the graphite disk (03) and the graphite ring (02), and the robot (6) puts the merged graphite ring (02) and the graphite disk (03) as a whole into the disk-ring placement box (2).

2. The SiC epitaxial substrate conveying system according to claim 1, characterized in that: The merging and splitting module (5) comprises a base frame (51), a plurality of ring brackets (52) connected to the top of the base frame (51), a tray (53) and a lifting mechanism (54); the ring brackets (52) are distributed around the base frame (51); the lifting mechanism (54) is drivingly connected to the tray (53); a movable opening (511) is passed through the base frame (51) from top to bottom; an output end of the lifting mechanism (54) is passed through the movable opening (511); the lifting mechanism (54) drives the tray (53) to move up and down, so that the tray (53) moves up and down inside the ring bracket (52); When the graphite ring (02) and the graphite disk (03) are separated, the lifting mechanism (54) drives the tray (53) to move upward to a desired height, the manipulator (6) places the combination of the graphite disk (03) and the graphite ring (02) into the merging and splitting module (5), the ring bracket (52) and the tray (53) respectively support the graphite ring (02) and the graphite disk (03), and the lifting mechanism (54) drives the tray (53) to move downward, so that the graphite disk (03) moves downward synchronously with the tray (53) and is separated from the graphite ring (02); When the wafer (01) and the graphite ring (02) are combined, the lifting mechanism (54) drives the tray (53) to move upward to a required height, the robot (6) places the wafer (01) into the tray (53), and the lifting mechanism (54) descends to drive the wafer (01) to descend synchronously, so that the wafer (01) is supported by the graphite ring (02).

3. The SiC epitaxial substrate conveying system according to claim 2, characterized in that: The merging and splitting module (5) further comprises a merging and splitting driving mechanism (55), a merging and splitting annular light source (56), a surface light source (57) and a collection device (58); the merging and splitting driving mechanism (55) is used to drive the base frame (51) to move along the X-axis and the Y-axis and to make the base frame (51) rotate; the merging and splitting annular light source (56) is located between the base frame (51) and the surface light source (57); and the front end of the collection device (58) passes through the surface light source (57) and corresponds to the merging and splitting annular light source (56); When the graphite ring (02) is edge finding, the ring bracket (52) supports the graphite ring (02), the surface light source (57) and the detachable annular light source (56) provide supplementary light for the graphite ring (02) and the collection device (58), the collection device (58) visually photographs to determine the position and angle of the graphite ring (02), and the detachable driving mechanism (55) drives the base frame (51) to move along the X-axis and / or the Y-axis according to the data obtained by the collection device (58), and causes the base frame (51) to rotate, so that the graphite ring (02) determines its own position and angle according to the third positioning reference.

4. The SiC epitaxial substrate conveying system according to claim 3, characterized in that: The disassembly and assembly driving mechanism (55) comprises a disassembly and assembly X-axis module (551), a disassembly and assembly Y-axis module (552) drivingly connected to the disassembly and assembly X-axis module (551), and a disassembly and assembly rotating unit (553) drivingly connected to the disassembly and assembly Y-axis module (552); the disassembly and assembly X-axis module (551) drives the disassembly and assembly Y-axis module (552) to move along the X-axis; the disassembly and assembly Y-axis module (552) drives the disassembly and assembly rotating unit (553) to move along the Y-axis; the disassembly and assembly rotating unit (553) is drivingly connected to the base frame (51); the disassembly and assembly rotating unit (553) is used to drive the base frame (51) to rotate; the disassembly and assembly rotating unit (553) is installed with a protective cover (5531); the protective cover (5531) is penetrated with an installation opening (5532) at the top and bottom; and the output end of the lifting mechanism (54) is arranged through the installation opening (5532).

5. The SiC epitaxial substrate conveying system according to claim 1, characterized in that: The deflection correction platform (4) comprises a deflection correction platform (41), a deflection correction driving mechanism (42) drivingly connected to the deflection correction platform (41), a deflection correction annular light source (43) and a deflection correction collector (44); the deflection correction driving mechanism (42) is used to drive the deflection correction platform (41) to move along the X-axis and the Y-axis and to make the deflection correction platform (41) rotate; the deflection correction annular light source (43) is located between the deflection correction platform (41) and the deflection correction collector (44); and the deflection correction collector (44) corresponds to the deflection correction annular light source (43); When the graphite disk (03) is edge finding, the deflection correction platform (41) supports the graphite disk (03), the deflection correction ring light source (43) provides supplementary light for the graphite disk (03), the deflection correction collector (44) visually photographs to determine the position and angle of the graphite disk (03), and the deflection correction drive mechanism (42) drives the deflection correction platform (41) to move along the X-axis and / or the Y-axis according to the data obtained by the deflection correction collector (44), and causes the deflection correction platform (41) to rotate, so that the graphite disk (03) determines its own position and angle according to the second positioning reference.

6. The SiC epitaxial substrate conveying system according to claim 5, characterized in that: The deflection correction driving mechanism (42) comprises a deflection correction X-axis module (421), a deflection correction Y-axis module (422) drivingly connected to the deflection correction X-axis module (421), and a deflection correction rotation unit (423) drivingly connected to the deflection correction Y-axis module (422); the deflection correction X-axis module (421) drives the deflection correction Y-axis module (422) to move along the X-axis; the deflection correction Y-axis module (422) drives the deflection correction rotation unit (423) to move along the Y-axis; the deflection correction rotation unit (423) is drivingly connected to the deflection correction platform (41); and the deflection correction rotation unit (423) is used to drive the deflection correction platform (41) to rotate.

7. The SiC epitaxial substrate conveying system according to claim 2, characterized in that: The ring bracket (52) is provided with a ring supporting opening (521), and when the ring bracket (52) supports the graphite ring (02), the bottom outer edge of the graphite ring (02) extends into the ring supporting opening (521).

8. The SiC epitaxial substrate conveying system according to claim 2, characterized in that: The bottom end of the graphite ring (02) is provided with an annular disk accommodating groove (021); when the graphite disk (03) is combined with the graphite ring (02), the top outer edge of the graphite disk (03) extends into the disk accommodating groove (021); the top end of the graphite ring (02) is provided with an annular sheet accommodating groove (022); when the wafer (01) is combined with the graphite ring (02), the bottom outer edge of the wafer (01) extends into the sheet accommodating groove (022).

9. The SiC epitaxial substrate conveying system according to claim 1, characterized in that: The SiC epitaxial substrate conveying system also includes a cleaning mechanism (7). The robot (6) places the combination of a graphite disk (03) and a graphite ring (02) into the cleaning mechanism (7), firstly removes dust adhering to the graphite disk (03) and the graphite ring (02) through the cleaning mechanism (7), and then the robot (6) transfers the graphite disk (03) and the graphite ring (02) in the cleaning mechanism (7) to the disk and ring placement box (2).

Images