Diode two-connection base

Abstract

The invention discloses a diode dual-connection base, which comprises a bottom plate and a heat dissipation main body, the heat dissipation main body is arranged on the bottom plate, the heat dissipation main body comprises a heat dissipation fin A, a heat dissipation fin B and a heat dissipation fin C, the heat dissipation fin A is connected with the bottom plate through support columns, and the heat dissipation fin A, the heat dissipation fin B and the heat dissipation fin C are connected through support columns. According to the invention, the heat dissipation main bodies are arranged at intervals, so that the contact area between the heat dissipation fins and air is increased, and the heat dissipation effect is improved. Through the arrangement of the corresponding grooves in the cooling fins, the overall weight is reduced, and meanwhile a wiring space is reserved. The structure is simple, two diodes can be fixed at the same time to form a duplex diode structure, the duplex installation process of the high-power diodes is effectively simplified, meanwhile, a good heat dissipation way can be provided, a large amount of space can be saved, and the overall weight can be reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of diode installation, and in particular relates to a diode double-mounted base. Background Art

[0002] High-power diodes have many important functions in electronic circuits, such as rectification, voltage regulation, switching, protection, and signal processing. They are one of the indispensable components in electronic technology. However, since high-power diodes generate heat rapidly during operation, excessive temperature rise can easily reduce their rectification efficiency and performance, shorten their service life, and affect their reliability and stability. Therefore, effective heat dissipation methods must be adopted. Existing high-power diodes are usually installed on heat sinks, and then dissipated by natural cooling, forced air cooling, and water cooling. This method is obviously not suitable for systems with strict space and weight restrictions. There are also heat dissipation devices specially developed for high-power diodes, which can usually be regarded as small systems containing functional components and heat dissipation devices. This heat dissipation device has a complex structure and high cost.

[0003] In addition, circuit systems often use two high-power diodes in parallel to increase current carrying capacity and reliability. Existing high-power diode bases are usually single-mounted and do not meet the requirements of dual-mounting, resulting in more space and weight being occupied, and poor heat dissipation, which can easily cause local overtemperature. Therefore, a dual-mount diode base with better heat dissipation and small space is needed.

[0004] The patent document with announcement number CN206595285U discloses a metal packaged ultraviolet LED component, including a copper column, an ultraviolet light-emitting diode chip and a ceramic base, wherein the second mounting hole on the ceramic base is connected to the first mounting hole on the aluminum alloy substrate by bolts, and the aluminum alloy substrate is mounted on the top of the ceramic base, and the top of the aluminum alloy substrate is provided with a second step connection hole, and the third internal thread on the second step connection hole is connected to the first external thread on the second step by threads, and a copper column is provided at the top of the second step, and the second external thread on the copper column is connected to the first internal thread on the through hole by threads. The fin-shaped heat sink of the patent does not have a groove for reducing weight, and the lampshade can only be set at one place, and cannot be set in a double-mounted manner. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a diode double-mounted base.

[0006] The present invention is achieved through the following technical solutions.

[0007] The present invention provides a diode dual-mounted base, comprising a base plate and a heat dissipation body, wherein the heat dissipation body is arranged on the base plate, and the heat dissipation body comprises a heat sink A, a heat sink B and a heat sink C, wherein the heat sink A is connected to the base plate via a support column, and the heat sink A, the heat sink B and the heat sink C are connected via a support column.

[0008] Preferably, grooves A are symmetrically arranged on both sides of the heat sink A, grooves B are symmetrically arranged on both sides of the heat sink B, grooves C are symmetrically arranged on both sides of the heat sink C, the heat sink A is arranged below the heat sink B, and the heat sink C is arranged above the heat sink B.

[0009] Preferably, the groove A, groove B and groove C are coaxially arranged.

[0010] Preferably, grooves D are respectively arranged at the four corners of the heat sink A, grooves E are respectively arranged at the four corners of the heat sink B, and grooves F are respectively arranged at the four corners of the heat sink C.

[0011] Preferably, a hole B, a hole C and a wire clip are provided on the bottom plate, and the wire clip is fastened to the bottom plate by a bolt B passing through the hole C.

[0012] Preferably, a hole A is provided on the heat sink C, and a fastener is provided on the hole A.

[0013] Preferably, the fastener is an M5 nut.

[0014] Preferably, the thickness of the heat sink A and the heat sink C is greater than the thickness of the heat sink B.

[0015] Preferably, the base plate and the heat dissipation body are made of aluminum alloy.

[0016] The beneficial effects of the present invention are:

[0017] The present invention increases the contact area between the heat sink and the air and improves the heat dissipation effect by setting the intervals of the heat dissipation body. By setting the corresponding grooves on the heat sink, the wiring space is reserved while reducing the overall weight. The structure of the present invention is simple and can fix two diodes at the same time to form a double-mounted diode structure, which not only effectively simplifies the two-mounted installation process of high-power diodes, but also is easy to process and has low cost. It can ensure the firm installation of the two-mounted diodes, and can also provide a good heat dissipation path, save a lot of space and reduce the overall weight. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the present invention;

[0019] Figure 2 It is a schematic diagram of installing a diode according to the present invention;

[0020] In the figure: 1-base plate, 11-hole B, 12-hole C, 2-heat dissipation body, 3-heat sink A, 31-groove A, 32-groove D, 4-heat sink B, 41-groove B, 42-groove E, 5-heat sink C, 51-groove C, 52-groove F, 53-hole A, 6-support column, 7-fastener, 8-line card, 81-bolt B, 9-diode, 10-connecting wire. DETAILED DESCRIPTION

[0021] The technical solution of the present invention is further described below, but the scope of protection claimed is not limited to the description.

[0022] Example:

[0023] like Figure 1 , 2 As shown, a diode dual-mounted base includes a base plate 1 and a heat dissipation body 2, wherein the heat dissipation body 2 is arranged on the base plate 1, and the heat dissipation body 2 includes a heat sink A3, a heat sink B4 and a heat sink C5, wherein the heat sink A3 is connected to the base plate 1 via a support column 6, and the heat sink A3, the heat sink B4 and the heat sink C5 are connected to each other via the support column 6. This arrangement increases the contact area between the heat sink A3, the heat sink B4 and the heat sink C5 and the air, thereby increasing the heat dissipation effect.

[0024] Grooves A31 are symmetrically arranged on both sides of the heat sink A3, grooves B41 are symmetrically arranged on both sides of the heat sink B4, grooves C51 are symmetrically arranged on both sides of the heat sink C5, the heat sink A3 is arranged below the heat sink B4, the heat sink C5 is arranged above the heat sink B4, and different numbers of heat sinks B4 can be arranged as needed.

[0025] The groove A31 , the groove B41 and the groove C51 are coaxially arranged, and the length and width of the groove A31 , the groove B41 and the groove C51 are all 30 mm, which is used to reserve a routing space for the connecting line 10 .

[0026] The four corners of the heat sink A3 are respectively provided with grooves D32, the four corners of the heat sink B4 are respectively provided with grooves E42, and the four corners of the heat sink C5 are respectively provided with grooves F52. This arrangement can provide operating space for the installation and fixation of the base.

[0027] The bottom plate 1 is provided with a hole B11, a hole C12 and a wire clip 8, and the wire clip 8 is connected and fastened to the bottom plate 1 by a bolt B81 penetrating the hole C12. The wire clip 8 is used to fix the connecting wire 10. Four holes B11 with a diameter of φ3.4 mm are provided, and the base can be fixed on the mounting platform by setting corresponding bolts penetrating the holes B11.

[0028] A hole A53 is provided on the heat sink C5, and a fastener 7 is provided on the hole A53. The fastener 7 is an M5 nut, which is riveted and can fix the diode 9 on the heat sink C5 through the fastener 7. Two diodes 9 can be provided on the heat sink C5, respectively on both sides of the groove C51, for easy installation and disassembly.

[0029] The thickness of the heat sink A3 and the heat sink C5 is greater than that of the heat sink B4, the thickness of the heat sink A3 and the heat sink C5 is 4 mm, and the thickness of the heat sink B4 is 2 mm. This arrangement can ensure the strength and reliability of the base structure while ensuring processability, reducing weight and volume, and providing good heat dissipation effect.

[0030] The base plate 1 and the heat dissipation body 2 are made of 2A12 aluminum alloy, which has good heat dissipation effect and light weight.

Claims

1. A diode dual-mount base, characterized in that: The invention comprises a base plate (1) and a heat dissipation body (2), wherein the heat dissipation body (2) is arranged on the base plate (1), and the heat dissipation body (2) comprises a heat dissipation fin A (3), a heat dissipation fin B (4) and a heat dissipation fin C (5), wherein the heat dissipation fin A (3) is connected to the base plate (1) via a support column (6), and the heat dissipation fin A (3), the heat dissipation fin B (4) and the heat dissipation fin C (5) are connected to each other via a support column (6).

2. A diode dual-mount base as claimed in claim 1, characterized in that: Grooves A (31) are symmetrically arranged on both sides of the heat sink A (3), grooves B (41) are symmetrically arranged on both sides of the heat sink B (4), and grooves C (51) are symmetrically arranged on both sides of the heat sink C (5). The heat sink A (3) is arranged below the heat sink B (4), and the heat sink C (5) is arranged above the heat sink B (4).

3. A diode dual-mount base as claimed in claim 2, characterized in that: The groove A (31), the groove B (41) and the groove C (51) are coaxially arranged.

4. A diode dual-mount base as claimed in claim 1, characterized in that: The four corners of the heat sink A (3) are respectively provided with grooves D (32), the four corners of the heat sink B (4) are respectively provided with grooves E (42), and the four corners of the heat sink C (5) are respectively provided with grooves F (52).

5. The diode dual-mount base according to claim 1, characterized in that: The base plate (1) is provided with a hole B (11), a hole C (12) and a line clamp (8), and the line clamp (8) is connected and fastened to the base plate (1) by a bolt B (81) passing through the hole C (12).

6. The diode dual-mount base according to claim 1, characterized in that: The heat sink C (5) is provided with a hole A (53), and the hole A (53) is provided with a fastener (7).

7. A diode dual-mount base as claimed in claim 6, wherein the manufacturing method thereof is characterized in that the fastener (7) is an M5 nut.

8. The diode dual-mount base according to claim 1, characterized in that: The thickness of the heat sink A (3) and the heat sink C (5) is greater than the thickness of the heat sink B (4).

9. The diode dual-mount base according to claim 1, characterized in that: The base plate (1) and the heat dissipation body (2) are made of aluminum alloy.

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