PCB cutting device with automatic clamping direction adjusting function

By designing a composite mechanism and loading mechanism that automatically adjusts the clamping orientation, the insufficient fixing effect and debris problems of existing PCB board cutting devices are solved, and a more efficient and accurate cutting process is achieved.

CN119545671AInactive Publication Date: 2025-02-28FUDA ELECTRONICS WUJIANG CO LTD
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Patent Information

Application Number
CN202411901103.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-23
Publication Date
2025-02-28
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

During operation, the existing PCB board cutting device has insufficient fixing effect, which affects the cutting efficiency, resulting in insufficient cutting accuracy, and there are debris during cutting, causing wear to the PCB board.

Method used

A PCB board cutting device with automatic clamping orientation is designed. Through the design of the composite mechanism and the loading mechanism, automatic clamping and cutting of the PCB board is realized to avoid deviation and debris during cutting.

Benefits of technology

It improves the accuracy and efficiency of PCB board cutting, reduces the generation and wear of debris, and enhances the stability and flexibility of the device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a PCB cutting device with an automatic clamping direction adjusting function, and relates to the technical field of cutting. According to the PCB cutting device capable of automatically adjusting the clamping direction, through the design of a composite mechanism, the cross beam slides on the inner side of the supporting frame body, so that the effect of adjusting the direction is achieved, the file is supported by the bearing block, the bearing block slides in the cutting machine body so that the file can be attached to a PCB conveniently, and the effect of cutting materials is achieved; the PCB is placed on the inner side of the loading mechanism, materials are fixed through the loading mechanism, so that cutting is facilitated, the situation that the cutting effect is affected due to deviation during cutting is avoided, the loading mechanism slides on the inner side of the square groove, the loading mechanism is matched with the cutting machine body through sliding, meanwhile, the loading mechanism can rotate, and the cutting efficiency is improved. Therefore, flexibility of parts is improved, cutting efficiency is improved, and cutting dead angles are reduced.
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Description

Technical Field

[0001] The invention relates to the technical field of cutting, in particular to a PCB board cutting device capable of automatically adjusting a clamping position. Background Art

[0002] PCB, or printed circuit board, is an important electronic component. It provides electrical connections between electronic components by printing conductive lines on insulating substrate materials and installing pads for electronic components. It is a key support and connection carrier for electronic products. You can think of it as a city's transportation network. Electronic components are like buildings in the city, and the lines on the PCB are the roads connecting these buildings, allowing electronic signals to be transmitted smoothly between components. PCB cutting device is a device used to cut large printed circuit boards into specific sizes or shapes. Its basic principle is to separate the substrate material and conductive lines of the PCB board through mechanical force, thermal energy or chemical energy to meet the diverse requirements for PCB board size and shape in the production process of electronic products.

[0003] The existing PCB cutting device has insufficient fixing effect on the PCB board during operation, which affects the cutting efficiency and leads to insufficient cutting accuracy. In addition, there are debris during cutting, which causes wear on the PCB board. Therefore, a new design is made to address this situation. Summary of the invention

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a PCB board cutting device with automatic adjustment of clamping orientation, comprising:

[0005] A composite mechanism, which is used to cut the PCB board;

[0006] A processing mechanism, the processing mechanism is used to clean the composite mechanism;

[0007] The top of the composite mechanism is fixedly connected to the bottom of the processing mechanism;

[0008] Wherein, the composite mechanism comprises a composite platform, the bottom of the composite platform is fixedly connected with a composite frame, one side of the top of the composite platform is fixedly connected with a support frame, a crossbeam is slidably connected between opposite surfaces of the support frame, and the crossbeam slides inside the support frame to achieve the effect of adjusting the direction, the outer side of the crossbeam is slidably connected with a cutting body, and one side of the outer side of the cutting body is slidably connected with a receiving block, the receiving block supports the file, and the receiving block slides inside the cutting body to facilitate approaching the PCB board, so as to achieve the effect of cutting the material, and the outer side of the receiving block is fixedly connected A file is connected, and a square groove is opened on the top of the composite platform. The inner side of the square groove is slidably connected to a loading mechanism. The PCB board is placed inside the loading mechanism and the material is fixed by the loading mechanism, so as to facilitate cutting and avoid deviation during cutting, which affects the cutting effect. The side of the top of the composite platform away from the supporting frame is fixedly connected to the bottom of the processing mechanism, and slides on the inner side of the square groove through the loading mechanism. The loading mechanism is adapted to the cutting body by sliding and can be rotated by the loading mechanism, so as to improve the flexibility of the components, improve the cutting efficiency and reduce the cutting dead angle.

[0009] Preferably, the loading mechanism includes a loading frame, and sliding blocks are fixedly connected to both sides of the bottom of the loading frame, and the sliding blocks slide on the inner sides of the square grooves to improve the mechanical docking effect and facilitate the placement and movement of materials. The outer side of the sliding block is slidably connected to the inner side of the square groove, and a driven block is fixedly connected to the middle of the top of the loading frame, and an active block is meshingly connected to the inner side of the driven block, and the active block rotates on the inner side of the driven block to facilitate the adjustment of the component angle. By adjusting the component angle, the flexibility of PCB board cutting is increased, and the operation efficiency is improved. A connecting block is fixedly connected to the side of the active block away from the loading frame, and a clamping mechanism is fixedly connected to the side of the connecting block away from the active block. The PCB board is clamped by the clamping mechanism, so as to fix the object and improve the stability of the object during operation.

[0010] Preferably, the clamping mechanism includes a clamping base, the bottom of the clamping base is fixedly connected to the top of the connecting block, one side of the top of the clamping base is fixedly connected to a clamping frame, and one side of the outside of the clamping frame is fixedly connected to a first electric push rod, and the square frame is controlled by the first electric push rod to squeeze toward the middle of the clamping base, so as to achieve the effect of fixing the object. By fixing the object, subsequent operations are facilitated, the stability during operation is improved, and deviation is prevented. The outside of the first electric push rod is fixedly connected to a square frame on a side away from the clamping frame.

[0011] Preferably, the outer side of the square frame is slidably connected to a sliding rod, and a clamping plate is fixedly connected to the side of the sliding rod away from the first electric push rod. When the square frame is squeezed, the clamping plate is driven to move. When the clamping plate clamps the object, it causes the spring bar to be squeezed, thereby achieving the effect of shock absorption and buffering, reducing the clamping force, preventing damage to the object caused by excessive clamping, and playing a certain protective role on the object. A silicone block is fixedly connected to the side of the clamping plate away from the sliding rod. The silicone block is arranged on one side of the clamping plate, and the silicone material plays a buffering and shock-absorbing effect. At the same time, the silicone material reduces the friction between the component and the object, thereby reducing the wear on the object and preventing damage to the object. A spring bar is sleeved on the side of the sliding rod close to the clamping plate.

[0012] Preferably, the processing mechanism includes a processing top plate, and a second electric push rod is fixedly connected to the bottom of the processing top plate. When cutting is completed, the loading mechanism drives the PCB board to move toward the processing mechanism, and the height of the processing top plate is controlled by the second electric push rod, so as to facilitate the cleaning of debris and avoid the movement of the blocking component. The side of the outside of the second electric push rod away from the processing top plate is fixedly connected to the top of the composite platform, and a rotating mechanism is fixedly connected to the middle of the top of the processing top plate. A collecting mechanism is plugged and connected to one side of the outside of the rotating mechanism. Wind force is generated by the collecting mechanism, and the debris is sucked into the inner side of the collecting mechanism from one side of the square nozzle through the wind force, so as to achieve the cleaning effect of the debris on the surface of the PCB board, avoid the debris from causing wear on the board surface and affecting the use effect, facilitate the disassembly of the collecting mechanism, and facilitate subsequent cleaning. The side of the outside of the rotating mechanism close to the composite platform is fixedly connected to the square nozzle.

[0013] Preferably, the rotating mechanism includes a circular shell, one side of the outside of the circular shell is plug-connected with the outside of the collecting mechanism, the top of the inner wall of the circular shell is fixedly connected with a connecting shaft, the outside of the connecting shaft is rotatably connected with a rotating block, the outside of the rotating block is fixedly connected with a connecting rod, and the side of the connecting rod away from the rotating block is fixedly connected with a paddle board, the paddle board is driven to rotate by wind force, and the contact area with wind force is increased by the paddle board, thereby improving the force effect of the component and increasing the rotation effect of the component, and the paddle board is fixedly connected with a buffer mechanism on the side away from the connecting rod, which plays a shock-absorbing and buffering role, reduces the amplitude caused by friction, and avoids affecting the rotation efficiency, and the side of the buffer mechanism away from the paddle board is fixedly connected with a friction mechanism, and the friction mechanism is driven by the rotation of the paddle board to rub the inner wall of the circular shell, thereby achieving the effect of cleaning the inner wall, by cleaning the debris and absorbing the residual debris by the collecting mechanism, which is convenient for subsequent cleaning.

[0014] Preferably, the buffer mechanism includes a cylindrical shell, one side of the outside of the cylindrical shell is fixedly connected to the outside of the friction mechanism, a metal ring is provided on the inside of the cylindrical shell, and a connecting rod is slidably connected to the inner wall of the cylindrical shell. When the friction mechanism rubs against the inner wall, the cylindrical shell squeezes the metal ring to achieve the effect of shock absorption and buffering, reduce the amplitude of the component, and improve the stability of the component. The side of the connecting rod outside the cylindrical shell away from the outer side of the paddle board is fixedly connected.

[0015] Preferably, the friction mechanism includes a friction shell, the inner side of the friction shell is fixedly connected to a rotating shaft, the outer side of the rotating shaft is rotatably connected to a friction column, the friction shell rotates along with the connecting rod, so that the friction column rubs against the inner wall of the equipment, so as to clean the debris adsorbed on the inner wall, disperse the debris to facilitate reabsorption by the collection mechanism, thereby reducing internal debris residue and avoiding excessive accumulation of debris, which affects the ventilation efficiency. A cylindrical groove is provided on the outer side of the friction column. By providing the cylindrical groove and increasing the contact area through grooving, the friction effect is improved, and the cleaning efficiency is further improved.

[0016] Preferably, the inner wall of the friction shell is fixedly connected to a ladder frame, and the inner side of the ladder frame is fixedly connected to an air cushion block, which supports the ladder frame and reduces the amplitude of the component. A friction plate is fixedly connected to one side of the outside of the ladder frame, and when the friction column rotates, it rubs against the surface of the friction plate to achieve the effect of cleaning debris on the surface of the component, and has a certain self-cleaning effect, avoiding affecting the subsequent friction effect. A plate surface cutout is provided on the side of the outside of the friction plate away from the ladder frame. By providing the plate surface cutout and grooving, the chip removal effect is increased, debris adsorption is reduced, and the impact of debris residue on the friction effect is avoided.

[0017] Preferably, the collection mechanism includes a collection shell, which generates wind through a fan to promote the absorption of PCB board debris, thereby achieving the effect of cleaning the debris. The collection shell serves to store the debris. An annular block is fixedly connected to the inner side of the collection shell, and the annular block increases the adsorption effect of the debris, thereby achieving the effect of facilitating the storage of debris and preventing debris leakage. An arc-shaped groove is provided on the inner side of the annular block. By providing the arc-shaped groove, the contact area is increased through the grooving, the friction area is increased, and the adsorption effect is improved. The outer side of the collection shell is fixedly connected to a fan.

[0018] The present invention provides a PCB cutting device with automatic adjustment of clamping position, which has the following beneficial effects:

[0019] 1. The PCB cutting device with automatic adjustment of the clamping position is designed with a composite mechanism. The crossbeam slides inside the support frame to adjust the direction. The receiving block supports the file. The receiving block slides inside the cutting body to facilitate the PCB board and cut the material. The PCB board is placed inside the loading mechanism and the material is fixed by the loading mechanism to facilitate cutting and avoid offset during cutting to affect the cutting effect. The loading mechanism slides inside the square groove to adapt to the cutting body by sliding. At the same time, the loading mechanism can be rotated to improve the flexibility of the components, improve the cutting efficiency, and reduce the cutting dead angle.

[0020] Second, the PCB cutting device with automatic adjustment of the clamping position is designed with a loading mechanism. The sliding block slides inside the square groove to improve the mechanical docking effect, and is convenient for placing and moving materials. The active block rotates inside the driven block to facilitate the adjustment of the component angle. By adjusting the component angle, the flexibility of PCB cutting is increased, and the operation efficiency is improved. The PCB is clamped by the clamping mechanism to fix the object and improve the stability of the object during operation.

[0021] 3. The PCB cutting device with automatic adjustment of the clamping position is designed with a clamping mechanism. The square frame is controlled by the first electric push rod to squeeze toward the middle of the clamping base, so as to fix the object. By fixing the object, it is convenient for subsequent operations, improves the stability during operation, and prevents deviation. The square frame drives the clamping plate to move when squeezing. When the clamping plate clamps the object, it causes the spring bar to be squeezed, so as to achieve the effect of shock absorption and buffering, reduce the clamping force, prevent excessive clamping from causing damage to the object, and play a certain protective role on the object. The silicone block is arranged on one side of the clamping plate, and the silicone material plays a buffering and shock absorbing effect. At the same time, the silicone material reduces the friction between the component and the object, so as to reduce the wear on the object and prevent damage to the object.

[0022] Fourth, the PCB cutting device with automatic adjustment of the clamping position is designed with a processing mechanism. After cutting is completed, the loading mechanism drives the PCB to move toward the processing mechanism. The height of the processing top plate is controlled by the second electric push rod, which is convenient for cleaning the debris and avoids the movement of the blocking parts. The wind force is generated by the collecting mechanism, and the debris is sucked into the inner side of the collecting mechanism from one side of the square nozzle through the wind force, so as to achieve the cleaning effect of the debris on the surface of the PCB board, avoid the debris from causing wear on the board surface and affecting the use effect, and then the collecting mechanism is easy to disassemble for subsequent cleaning.

[0023] 5. The PCB cutting device with automatic adjustment of the clamping position is designed with a friction mechanism. The friction shell rotates with the connecting rod, so that the friction column rubs against the inner wall of the equipment, so as to clean the debris adsorbed on the inner wall and disperse the debris to facilitate the collection mechanism to reabsorb it, thereby reducing the internal debris residue and avoiding excessive accumulation of debris to affect the ventilation efficiency. By opening a cylindrical groove, the contact area is increased by the groove, the friction effect is improved, and the cleaning efficiency is further improved. When the friction column rotates, it rubs against the surface of the friction plate to achieve the effect of cleaning the debris on the surface of the component, which has a certain self-cleaning effect and avoids affecting the subsequent friction effect. By opening a plate surface incision and grooving to increase the chip removal effect, the debris adsorption is reduced and the debris residue is avoided to affect the friction effect. The air cushion block supports the ladder frame and slows down the amplitude of the component. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the external structure of a PCB board cutting device capable of automatically adjusting the clamping position according to the present invention;

[0025] Figure 2 It is a schematic diagram of the composite mechanism structure of the present invention;

[0026] Figure 3 It is a schematic diagram of the cross-sectional structure of the loading mechanism of the present invention;

[0027] Figure 4 It is a schematic diagram of the structure of the clamping mechanism of the present invention;

[0028] Figure 5 It is a schematic diagram of the partial structure of the clamping mechanism of the present invention;

[0029] Figure 6 It is a schematic diagram of the structure of the processing mechanism of the present invention;

[0030] Figure 7 It is a schematic diagram of the cross-sectional structure of the rotating mechanism of the present invention;

[0031] Figure 8 It is a schematic diagram of the cross-sectional structure of the buffer mechanism of the present invention;

[0032] Fig. 9 It is a schematic diagram of the cross-sectional structure of the friction mechanism of the present invention;

[0033] Fig.10 It is a schematic diagram of the structure of the collecting mechanism of the present invention.

[0034] In the figure: 1. composite mechanism; 2. processing mechanism; 11. composite platform; 12. composite frame; 13. support frame; 14. crossbeam; 15. cutting body; 16. receiving block; 17. file; 18. square groove; 19. loading mechanism; 191. loading frame; 192. sliding block; 193. driven block; 194. active block; 195. connecting block; 196. clamping mechanism; 1961. clamping base; 1962. clamping frame; 1963. first electric push rod; 1964. square frame; 1965. sliding rod; 1966. clamping plate; 1967. silicone block; 1968. spring bar; 21. processing top plate; 22. Two electric push rods; 23, rotating mechanism; 24, square nozzle; 25, collecting mechanism; 231, circular shell; 232, connecting shaft; 233, rotating block; 234, connecting rod; 235, paddle board; 236, buffer mechanism; 237, friction mechanism; 2361, cylindrical shell; 2362, metal ring; 2363, connecting rod; 2371, friction shell; 2372, rotating shaft; 2373, friction column; 2374, cylindrical groove; 2375, ladder frame; 2376, air cushion block; 2377, friction plate; 2378, plate surface cutout; 251, collecting shell; 252, fan; 253, annular block; 254, arc groove. DETAILED DESCRIPTION

[0035] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0036] The first embodiment, as Figures 1 to 5 As shown, the present invention provides a technical solution: a PCB board cutting device with automatic adjustment of clamping orientation, comprising a composite mechanism 1, the composite mechanism 1 is used to cut the PCB board;

[0037] A processing mechanism 2, the processing mechanism 2 is used to clean the composite mechanism 1;

[0038] The top of the composite mechanism 1 is fixedly connected to the bottom of the processing mechanism 2;

[0039] Among them, the composite mechanism 1 includes a composite platform 11, the bottom of the composite platform 11 is fixedly connected to a composite frame 12, one side of the top of the composite platform 11 is fixedly connected to a support frame 13, a crossbeam 14 is slidably connected between opposite surfaces of the support frame 13, a cutting body 15 is slidably connected to the outer side of the crossbeam 14, a receiving block 16 is slidably connected to one side of the outside of the cutting body 15, a file 17 is fixedly connected to the outer side of the receiving block 16, a square groove 18 is opened on the top of the composite platform 11, and a loading mechanism 19 is slidably connected to the inner side of the square groove 18, and the side of the top of the composite platform 11 away from the support frame 13 is fixedly connected to the bottom of the processing mechanism 2. The crossbeam 14 slides on the inner side of the support frame 13 to adjust the direction. The receiving block 16 supports the file 17. The receiving block 16 slides inside the cutting body 15 to facilitate the close proximity to the PCB board, thereby achieving the effect of cutting the material. The PCB board is placed on the inner side of the loading mechanism 19 and the material is fixed by the loading mechanism 19 to facilitate cutting and avoid deviation during cutting, which affects the cutting effect. The loading mechanism 19 slides on the inner side of the square groove 18 to adapt to the cutting body 15 by sliding. At the same time, the loading mechanism 19 can be rotated to improve the flexibility of the components, improve the cutting efficiency, and reduce the cutting dead angle.

[0040] The loading mechanism 19 comprises a loading frame 191, and sliding blocks 192 are fixedly connected to both sides of the bottom of the loading frame 191, and the outer side of the sliding block 192 is slidably connected to the inner side of the square groove 18, and a driven block 193 is fixedly connected to the middle of the top of the loading frame 191, and the inner side of the driven block 193 is meshedly connected to the active block 194, and the outer side of the active block 194 is fixedly connected to the side away from the loading frame 191, and the outer side of the active block 194 is fixedly connected to the side away from the active block 194. The sliding block 192 slides inside the square groove 18 to improve the mechanical docking effect, and at the same time, it is convenient to place and move materials. The active block 194 rotates inside the driven block 193 to facilitate the adjustment of the angle of the component, and the flexibility of PCB board cutting is increased by adjusting the angle of the component, and the operation efficiency is improved. The PCB board is clamped by the clamping mechanism 196 to achieve the effect of fixing the object and improve the stability of the object during operation.

[0041] The clamping mechanism 196 includes a clamping base 1961, the bottom of the clamping base 1961 is fixedly connected to the top of the connection block 195, a clamping frame 1962 is fixedly connected to one side of the top of the clamping base 1961, a first electric push rod 1963 is fixedly connected to one side of the outside of the clamping frame 1962, and a square frame 1964 is fixedly connected to one side of the outside of the first electric push rod 1963 away from the clamping frame 1962. The square frame 1964 is controlled by the first electric push rod 1963 to squeeze toward the middle of the clamping base 1961, so as to achieve the function of fixing objects, and by fixing objects, subsequent operations are facilitated, the stability during operation is improved, and deviation is prevented.

[0042] The outer side of the square frame 1964 is slidably connected with a sliding rod 1965, the side of the sliding rod 1965 away from the first electric push rod 1963 is fixedly connected with a clamping plate 1966, the side of the clamping plate 1966 away from the sliding rod 1965 is fixedly connected with a silicone block 1967, and the side of the sliding rod 1965 close to the clamping plate 1966 is sleeved with a spring bar 1968. When the square frame 1964 is squeezed, it drives the clamping plate 1966 to move. When the clamping plate 1966 clamps the object, it squeezes the spring bar 1968, thereby achieving the effect of shock absorption and buffering, reducing the clamping force, preventing excessive clamping from causing damage to the object, and playing a certain protective role for the object. The silicone block 1967 is set on one side of the clamping plate 1966, and plays a buffering and shock absorption effect through the silicone material. At the same time, the silicone material reduces the friction between the component and the object, thereby reducing the wear on the object and preventing damage to the object.

[0043] The second embodiment is based on the first embodiment. Figures 6 to 8 As shown, the processing mechanism 2 includes a processing top plate 21, a second electric push rod 22 is fixedly connected to the bottom of the processing top plate 21, a side of the second electric push rod 22 away from the processing top plate 21 is fixedly connected to the top of the composite platform 11, a rotating mechanism 23 is fixedly connected to the middle of the top of the processing top plate 21, a collecting mechanism 25 is plugged and connected to one side of the rotating mechanism 23, and a square nozzle 24 is fixedly connected to the side of the rotating mechanism 23 close to the composite platform 11. When the cutting is completed, the loading mechanism 19 drives the PCB board to move toward the processing mechanism 2, and the height of the processing top plate 21 is controlled by the second electric push rod 22, so as to facilitate the cleaning of the debris and avoid the movement of the blocking parts. The wind force is generated by the collecting mechanism 25, and the debris is sucked into the inner side of the collecting mechanism 25 from one side of the square nozzle 24 by the wind force, so as to achieve the cleaning effect of the debris on the surface of the PCB board, and avoid the debris from causing wear on the board surface and affecting the use effect. Then, the collecting mechanism 25 is easy to disassemble for subsequent cleaning.

[0044] The rotating mechanism 23 includes a circular shell 231, one side of the outside of the circular shell 231 is plugged into the outside of the collecting mechanism 25, the top of the inner wall of the circular shell 231 is fixedly connected with a connecting shaft 232, the outside of the connecting shaft 232 is rotatably connected with a rotating block 233, the outside of the rotating block 233 is fixedly connected with a connecting rod 234, the side of the outside of the connecting rod 234 away from the rotating block 233 is fixedly connected with a paddle board 235, the side of the paddle board 235 away from the connecting rod 234 is fixedly connected with a buffer mechanism 236, and the side of the outside of the buffer mechanism 236 away from the paddle board 235 is fixedly connected with a friction mechanism 237. The paddle plate 235 is driven by wind force to rotate, and the paddle plate 235 increases the contact area with the wind, thereby improving the force effect of the component and increasing the rotation effect of the component. The paddle plate 235 rotates to drive the friction mechanism 237 to rub the inner wall of the circular shell 231, thereby cleaning the inner wall. The debris is cleaned and then the remaining debris is absorbed by the collection mechanism 25 for subsequent cleaning. The buffer mechanism 236 plays a shock-absorbing and buffering role, reducing the amplitude caused by friction and avoiding affecting the rotation efficiency.

[0045] The buffer mechanism 236 includes a cylindrical shell 2361, one side of the outer side of the cylindrical shell 2361 is fixedly connected to the outer side of the friction mechanism 237, a metal ring 2362 is arranged on the inner side of the cylindrical shell 2361, a connecting rod 2363 is slidably connected to the inner wall of the cylindrical shell 2361, and the outer side of the connecting rod 2363 away from the cylindrical shell 2361 is fixedly connected to the outer side of the paddle 235. When the friction mechanism 237 rubs against the inner wall, the cylindrical shell 2361 squeezes the metal ring 2362, thereby achieving the effect of shock absorption and buffering, reducing the amplitude of the component, and improving the stability of the component.

[0046] The third embodiment is based on the first and second embodiments. Figures 9 and 10 As shown, the friction mechanism 237 includes a friction shell 2371, the inner side of the friction shell 2371 is fixedly connected with a rotating shaft 2372, the outer side of the rotating shaft 2372 is rotatably connected with a friction column 2373, and the outer side of the friction column 2373 is provided with a cylindrical groove 2374. The friction shell 2371 rotates with the connecting rod 234, so that the friction column 2373 rubs against the inner wall of the device, thereby cleaning the debris adsorbed on the inner wall, dispersing the debris to facilitate the collection mechanism 25 to reabsorb it, thereby reducing the internal debris residue, avoiding excessive accumulation of debris, and affecting the ventilation efficiency. By opening the cylindrical groove 2374, the contact area is increased by grooving, the friction effect is improved, and the cleaning efficiency is further improved.

[0047] The inner wall of the friction housing 2371 is fixedly connected with a ladder frame 2375, the inner side of the ladder frame 2375 is fixedly connected with an air cushion block 2376, the outer side of the ladder frame 2375 is fixedly connected with a friction plate 2377, and the outer side of the friction plate 2377 away from the ladder frame 2375 is provided with a plate surface cutout 2378. When the friction column 2373 rotates, it is frictionally adapted with the surface of the friction plate 2377, so as to achieve the effect of cleaning the debris on the surface of the component, play a certain self-cleaning effect, and avoid affecting the subsequent friction effect. By opening the plate surface cutout 2378 and grooving, the chip removal effect is increased, the debris adsorption is reduced, and the debris residue is prevented from affecting the friction effect. The air cushion block 2376 supports the ladder frame 2375 and slows down the amplitude of the component.

[0048] The collecting mechanism 25 includes a collecting shell 251, an annular block 253 is fixedly connected to the inner side of the collecting shell 251, an arc-shaped groove 254 is provided on the inner side of the annular block 253, and a fan 252 is fixedly connected to the outer side of the collecting shell 251. The fan 252 generates wind force to absorb the PCB board debris, thereby achieving the effect of cleaning the debris. The collecting shell 251 plays the role of storing the debris, and the annular block 253 increases the adsorption effect of the debris, thereby achieving the effect of facilitating the storage of the debris and preventing the debris from leaking. The arc-shaped groove 254 is provided to increase the contact area through the slotting, increase the friction area, and improve the adsorption effect.

[0049] When in use, the staff will place the PCB board inside the loading mechanism 19, and the loading mechanism 19 will fix the object to avoid sliding during cutting, prevent affecting the cutting accuracy, and avoid affecting the product quality. The loading mechanism 19 will move from the inner side of the square groove 18 to the side of the cutting body 15, and the cutting body 15 will control the file 17 to cut the PCB board, thereby meeting the work needs. In order to improve the cutting efficiency and avoid dead angles that affect the cutting effect, the loading mechanism 19 will drive the PCB board to rotate, so as to meet the needs of different cutting angles and improve the work efficiency. After the PCB board is cut by the composite mechanism 1, debris will be generated on the surface of the PCB board. The loading mechanism 19 drives the PCB board to slide toward the side of the processing mechanism 2, and the collecting mechanism 25 inside the processing mechanism 2 generates wind force, so as to absorb the debris on the surface of the PCB board, so as to achieve the effect of cleaning the debris, thereby avoiding the wear of the object by the residual debris, and preventing the product quality from being affected. The rotating mechanism 23 is driven by wind force to rotate, and the rotating mechanism 23 rotates to rub the inner wall of the pipe, so as to achieve the effect of cleaning the inner wall to absorb the debris, so that the residual debris floats again, so as to facilitate the movement to the inside of the collecting mechanism 25 with the wind force, so as to achieve the effect of improving the cleaning effect, and at the same time prevent the residual debris from affecting the ventilation effect. Secondly, by disassembling the collecting mechanism 25, it is convenient to clean the debris later.

[0050] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A PCB cutting device with automatic adjustment of clamping position, characterized in that: include: A composite mechanism (1), the composite mechanism (1) is used for cutting a PCB board; A processing mechanism (2), the processing mechanism (2) is used to clean the composite mechanism (1); The top of the composite mechanism (1) is fixedly connected to the bottom of the processing mechanism (2); The composite mechanism (1) comprises a composite platform (11), the bottom of the composite platform (11) is fixedly connected to a composite frame (12), one side of the top of the composite platform (11) is fixedly connected to a support frame (13), a crossbeam (14) is slidably connected between opposite surfaces of the support frame (13), a cutting body (15) is slidably connected to the outer side of the crossbeam (14), a receiving block (16) is slidably connected to the outer side of the cutting body (15), a file (17) is fixedly connected to the outer side of the receiving block (16), a square groove (18) is provided on the top of the composite platform (11), a loading mechanism (19) is slidably connected to the inner side of the square groove (18), and a side of the top of the composite platform (11) away from the support frame (13) is fixedly connected to the bottom of the processing mechanism (2).

2. A PCB cutting device with automatic clamping position adjustment according to claim 1, characterized in that: The loading mechanism (19) comprises a loading frame (191), wherein sliding blocks (192) are fixedly connected to both sides of the bottom of the loading frame (191), the outer side of the sliding block (192) is slidably connected to the inner side of the square groove (18), a driven block (193) is fixedly connected to the middle of the top of the loading frame (191), the inner side of the driven block (193) is meshingly connected to an active block (194), a connecting block (195) is fixedly connected to the side of the active block (194) away from the loading frame (191), and a clamping mechanism (196) is fixedly connected to the side of the connecting block (195) away from the active block (194).

3. A PCB cutting device with automatic clamping position adjustment according to claim 2, characterized in that: The clamping mechanism (196) includes a clamping base (1961), the bottom of the clamping base (1961) is fixedly connected to the top of the connecting block (195), one side of the top of the clamping base (1961) is fixedly connected to a clamping frame (1962), one side of the outside of the clamping frame (1962) is fixedly connected to a first electric push rod (1963), and one side of the outside of the first electric push rod (1963) away from the clamping frame (1962) is fixedly connected to a square frame (1964).

4. A PCB cutting device with automatic clamping position adjustment according to claim 3, characterized in that: The outer side of the square frame (1964) is slidably connected to a sliding rod (1965), the outer side of the sliding rod (1965) away from the first electric push rod (1963) is fixedly connected to a clamping plate (1966), the outer side of the clamping plate (1966) away from the sliding rod (1965) is fixedly connected to a silicone block (1967), and the outer side of the sliding rod (1965) close to the clamping plate (1966) is sleeved with a spring bar (1968).

5. The PCB cutting device with automatic clamping position adjustment according to claim 1, characterized in that: The processing mechanism (2) comprises a processing top plate (21), a second electric push rod (22) is fixedly connected to the bottom of the processing top plate (21), a side of the second electric push rod (22) away from the processing top plate (21) is fixedly connected to the top of the composite platform (11), a rotating mechanism (23) is fixedly connected to the middle of the top of the processing top plate (21), a collecting mechanism (25) is plugged into one side of the rotating mechanism (23), and a square nozzle (24) is fixedly connected to one side of the rotating mechanism (23) close to the composite platform (11).

6. A PCB cutting device with automatic clamping position adjustment according to claim 5, characterized in that: The rotating mechanism (23) comprises a circular shell (231), one side of the outside of the circular shell (231) is plug-connected with the outside of the collecting mechanism (25), the top of the inner wall of the circular shell (231) is fixedly connected with a connecting shaft (232), the outside of the connecting shaft (232) is rotatably connected with a rotating block (233), the outside of the rotating block (233) is fixedly connected with a connecting rod (234), the outside of the connecting rod (234) is fixedly connected with a paddle board (235) away from the rotating block (233), the side of the paddle board (235) away from the connecting rod (234) is fixedly connected with a buffer mechanism (236), and the side of the buffer mechanism (236) away from the paddle board (235) is fixedly connected with a friction mechanism (237).

7. A PCB cutting device with automatic clamping position adjustment according to claim 6, characterized in that: The buffer mechanism (236) includes a cylindrical shell (2361), one side of the outside of the cylindrical shell (2361) is fixedly connected to the outside of the friction mechanism (237), a metal ring (2362) is provided on the inside of the cylindrical shell (2361), a connecting rod (2363) is slidably connected to the inner wall of the cylindrical shell (2361), and the side of the outside of the connecting rod (2363) away from the cylindrical shell (2361) is fixedly connected to the outside of the paddle board (235).

8. The PCB cutting device with automatic clamping position adjustment according to claim 6, characterized in that: The friction mechanism (237) comprises a friction shell (2371), the inner side of the friction shell (2371) is fixedly connected to a rotating shaft (2372), the outer side of the rotating shaft (2372) is rotatably connected to a friction column (2373), and the outer side of the friction column (2373) is provided with a cylindrical groove (2374).

9. A PCB cutting device with automatic clamping position adjustment according to claim 8, characterized in that: The inner wall of the friction shell (2371) is fixedly connected to a ladder frame (2375), the inner side of the ladder frame (2375) is fixedly connected to an air cushion block (2376), the outer side of the ladder frame (2375) is fixedly connected to a friction plate (2377), and the outer side of the friction plate (2377) away from the ladder frame (2375) is provided with a plate surface cutout (2378).

10. The PCB cutting device with automatic clamping position adjustment according to claim 5, characterized in that: The collecting mechanism (25) comprises a collecting shell (251), an annular block (253) is fixedly connected to the inner side of the collecting shell (251), an arc-shaped groove (254) is provided on the inner side of the annular block (253), and a fan (252) is fixedly connected to the outer side of the collecting shell (251).

Citation Information

Patent Citations

  • Galvanometer laser stitch welding equipment

    CN113770528A

  • Cutting equipment and cutting method for aluminum alloy profile machining

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