Surface mounting method of subminiature light-sensitive chip

Abstract

The invention discloses a chip mounting method for a subminiature light sensing chip, and relates to the technical field of chip mounting. The method comprises the steps of obtaining a to-be-cut circuit board; the circuit board to be cut is pre-cut, and two longitudinal edges are removed; after a sticky protective film is pasted to the bottom of the circuit board to be cut, the circuit board to be cut is placed in a cutting machine; the connecting block is cut through a cutting machine; after the to-be-cut circuit board is washed and dried, a supporting plate is arranged at the bottom of an adhesive protective film of the to-be-cut circuit board; after the to-be-cut circuit board provided with the supporting plate is placed on a chip mounter, a light sensing chip is placed on each substrate through the chip mounter; and removing the support plate and the adhesive protective film to obtain a plurality of light-sensitive chip products. According to the surface mounting method of the subminiature light-sensitive chip, the risk that the light-sensitive chip is lost or damaged in the cutting and washing process can be avoided, and therefore the product yield is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounting, and in particular to a method for mounting an ultra-small photosensitive chip. Background Art

[0002] For the traditional circuit board patch process, the SMT process is usually used to mount components on the circuit board, and then the entire circuit board is cut by a cutting machine to obtain multiple products. However, for photosensitive chip products, photosensitive chips are usually used in wireless chargers for electronic devices such as mobile phones, and their size is very small. Therefore, if the photosensitive chip is first attached to the circuit board and then cut by a cutting machine, the cutting machine will flush the circuit board while cutting, which may cause the chip to be washed away or cut, resulting in the loss of the photosensitive chip; moreover, the photosensitive chip is usually provided with a sensing port. If water enters the sensing port, the photosensitive chip may be damaged. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a method for mounting an ultra-small photosensitive chip, which can prevent the photosensitive chip from being damaged during the cutting process.

[0004] On the one hand, a method for attaching an ultra-small photosensitive chip according to an embodiment of the present invention comprises the following steps: Obtain a circuit board to be cut; the circuit board to be cut comprises a frame, the frame comprises two oppositely arranged horizontal sides and two oppositely arranged vertical sides, the frame comprises a first area and a second area, the first area and the second area are separated by a partition, the partition is arranged parallel to the horizontal side, the first area and the second area are symmetrically arranged with multiple columns of substrates, any two adjacent substrates in each column of substrates are connected by a connecting block, and the two substrates at both ends of each column of substrates are respectively connected to the corresponding horizontal sides and the partition through connecting blocks; Pre-cutting the circuit board to be cut to remove the two longitudinal edges; After sticking an adhesive protective film on the bottom of the circuit board to be cut, the circuit board to be cut is placed in a cutting machine; the cutting machine includes a driving device, a first cutting tool and a second cutting tool, the first cutting tool and the second cutting tool are arranged at an interval, and the interval between the first cutting tool and the second cutting tool is equal to the width of the first area plus the width of the partition; The driving device drives the first cutting tool and the second cutting tool to cut the connecting blocks of the first area and the second area respectively according to cutting parameters and cutting paths; After washing and drying the circuit board to be cut, a support plate is arranged at the bottom of the adhesive protective film of the circuit board to be cut; After placing the circuit board to be cut provided with the support plate on a chip mounter, a photosensitive chip is placed on each of the substrates by the chip mounter; The support plate and the adhesive protective film are removed to obtain a plurality of photosensitive chip products.

[0005] According to some embodiments of the present invention, the cutting machine further comprises: a vacuum adsorption platform and a measuring device; the step of placing the circuit board to be cut in the cutting machine comprises: Placing the circuit board to be cut on the vacuum adsorption platform, and the vacuum adsorption platform performs vacuum adsorption on the circuit board to be cut; The height and thickness of the connection block are measured by the measuring device, and the cutting parameters and the cutting path are determined according to the height and the thickness.

[0006] According to some embodiments of the present invention, the chip mounter includes a feeding device, a printing device, a chip mount device, a material transfer device and a reflow device; a first conveyor belt is provided between the feeding device and the printing device, a second conveyor belt is provided between the printing device and the chip mount device, a third conveyor belt is provided between the chip mount device and the material transfer device, and a fourth conveyor belt is provided between the material transfer device and the reflow device; After placing the circuit board to be cut provided with the support plate on a chip mounter, the step of placing a photosensitive chip on each of the substrates by the chip mounter comprises: Placing the circuit board to be cut provided with the support plate on the loading device; The loading device conveys the circuit board to be cut to the printing device via the first conveyor belt; After the printing device prints solder paste on each substrate of the circuit board to be cut, the printing device conveys the printed circuit board to be cut to the patch device through the second conveyor belt; After the patch device attaches the photosensitive chip to the corresponding substrate, the circuit board to be cut is conveyed to the material transfer device via the third conveyor belt; The material transfer device changes the conveying direction of the circuit board to be cut, and conveys the circuit board to be cut to the reflow soldering device through the fourth conveyor belt, and the reflow soldering device performs reflow soldering on the circuit board to be cut. According to some embodiments of the present invention, the loading device includes a lifting frame, a pushing rod and a first detection device; the lifting frame includes a plurality of placement tables arranged in sequence from top to bottom, each of the placement tables is used to place a circuit board to be cut provided with the support plate; the pushing rod is arranged on a side of the lifting frame away from the first conveyor belt, and the first detection device is arranged between the lifting frame and the first conveyor belt; The step of the feeding device conveying the circuit board to be cut to the printing device via the first conveyor belt comprises: After the pushing rod pushes the circuit board to be cut on the placement table at the corresponding height onto the first conveyor belt, the lifting frame rises to raise the next placement table to the height of the pushing rod; When the first detection device detects the circuit board to be cut, the first conveyor belt starts to run, and after the circuit board to be cut is conveyed to a side close to the printing device, the first conveyor belt stops running; When the printing device completes printing of the last circuit board to be cut, a signal is sent to the first conveyor belt, and the first conveyor belt continues to run to convey the circuit board to be cut on the first conveyor belt to the printing device, and the pushing rod pushes the next circuit board to be cut onto the first conveyor belt. According to some embodiments of the present invention, the printing device includes a first frame, a lifting assembly arranged in the first frame, a first guide rail and a printing assembly, the first guide rail is arranged below the printing assembly, the lifting assembly is arranged below the first guide rail, a fixing plate is further arranged on the lifting assembly, two clamping plates are arranged on both sides of the first guide rail, and a second detection device and a retractable blocking rod are arranged at the bottom of the printing assembly; After the printing device prints solder paste on each substrate of the circuit board to be cut, the printing device conveys the printed circuit board to be cut to the patch device through the second conveyor belt, comprising: When the second detection device detects that the feeding device transfers the circuit board to be cut to the first guide rail, the blocking rod extends downward to block the circuit board to be cut from moving forward, the first guide rail stops running, and the blocking rod resets upward; The lifting assembly rises to the fixed plate to support the circuit board to be cut, and adjusts the position of the circuit board to be cut through the two clamping plates; The lifting assembly continues to rise, driving the first guide rail and the circuit board to be cut on the first guide rail to rise to the bottom of the printing assembly; The printing component prints solder paste on the circuit board to be cut. After printing is completed, the lifting component descends to reset the first guide rail. The first guide rail continues to run to convey the printed circuit board to be cut to the patch device through the second conveyor belt. According to some embodiments of the present invention, the printing assembly includes a printing steel mesh and a printing roller, the printing roller is located above the printing steel mesh, the printing steel mesh is provided with a plurality of through holes, and a limited position protective film is provided on the surface of the printing steel mesh; The step of printing solder paste on the circuit board to be cut by the printing component includes: According to the position of the pad of each substrate of the circuit board to be cut, the limiting protection film is laser-opened to obtain a window corresponding to the pad; the window is located at the corresponding through hole, and the size of the window is smaller than the through hole; The printing roller prints solder paste on the surface of the limiting protection film, so that the solder paste passes through the window and the through hole and reaches the soldering pad. According to some embodiments of the present invention, the material transfer device includes a second frame, a second guide rail disposed in the second frame, and a third guide rail, wherein the second guide rail is disposed on the third guide rail; The step of the material transfer device changing the conveying direction of the circuit board to be cut and conveying the circuit board to be cut to the reflow soldering device through the fourth conveyor belt specifically includes: The second guide rail receives the circuit board to be cut sent by the third conveyor belt, and adjusts the posture of the circuit board to be cut; The third guide rail transfers the second guide rail and the circuit board to be cut on the second guide rail to a side of the third guide rail close to the reflow soldering device; The second guide rail conveys the circuit board to be cut to the reflow soldering device through the fourth conveyor belt.

[0007] According to some embodiments of the present invention, the step of receiving the circuit board to be cut sent by the third conveyor belt by the second guide rail and adjusting the posture of the circuit board to be cut specifically includes: After receiving the cut circuit board sent by the third conveyor belt, the second guide rail conveys the circuit board to be cut to the side wall of the second frame away from the third conveyor belt, so that the circuit board to be cut remains parallel to the side wall of the second frame; The second guide rail then transports the circuit board to be cut in the reverse direction, and after the circuit board to be cut maintains a preset distance from the side wall of the second rack, the second guide rail stops running.

[0008] According to some embodiments of the present invention, after the step of removing the support plate and the adhesive protective film to obtain a plurality of light sensing chip products, the step further includes: Performing AOI inspection on the photosensitive chip product by using an AOI inspection device; The photosensitive chip product that has passed the AOI inspection is packaged in a taping manner.

[0009] The method for mounting an ultra-small photosensitive chip according to an embodiment of the present invention has at least the following beneficial effects: the circuit board to be cut is first cut to remove the connecting blocks between the substrates, and then the photosensitive chip is placed on the substrate to form a photosensitive chip product. The risk of losing the photosensitive chip or damaging the photosensitive chip during the cutting and washing process can be avoided, thereby improving the product yield.

[0010] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 A flowchart of the steps of a method for attaching an ultra-small photosensitive chip according to an embodiment of the present invention; Figure 2 A schematic structural diagram of a circuit board to be cut according to another embodiment of the present invention; Figure 3 It is a schematic structural diagram of another embodiment of the present invention after the longitudinal edges of the circuit board to be cut are removed; Figure 4 It is a structural schematic diagram of a chip mounter according to an embodiment of the present invention; Figure 5 It is a schematic structural diagram of a feeding device and a first conveyor belt according to an embodiment of the present invention; Figure 6 It is a schematic structural diagram of a first conveyor belt, a printing device and a second conveyor belt according to an embodiment of the present invention; Figure 7 for Figure 6 The main view of Figure 8 It is a schematic structural diagram of a third conveyor belt, a material transfer device and a fourth conveyor belt according to an embodiment of the present invention; Reference numerals: The circuit board to be cut 100, the frame 110, the horizontal edge 111, the vertical edge 112, the first area 113, the second area 114, the partition 115, the substrate 120, the connecting block 130, the placement machine 200, the loading device 210, the lifting frame 211, the push rod 212, the placement table 213, the printing device 220, the first frame 221, the lifting component 222, the first guide rail 223, the printing component 224, the fixing plate 225, the clamping plate 226, the blocking rod 227, the printing steel mesh 228, the printing roller 229, the second detection device 2211, the placement device 230, the material transfer device 240, the second frame 241, the second guide rail 242, the third guide rail 243, the reflow device 250, the first conveyor belt 260, the second conveyor belt 270, the third conveyor belt 280, and the fourth conveyor belt 290. DETAILED DESCRIPTION

[0012] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and are not to be construed as limitations on the present application. For the step numbers in the following embodiments, they are only provided for the convenience of explanation, and the order between the steps is not limited in any way, and the execution order of each step in the embodiment can be adaptively adjusted according to the understanding of those skilled in the art.

[0013] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0014] The terms "first", "second", "third" and "fourth" etc. in the specification and claims of the present invention and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0015] Reference to "embodiments" in the present invention means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0016] For the traditional circuit board patch process, the SMT process is usually used to mount components on the circuit board, and then the entire circuit board is cut by a cutting machine to obtain multiple products. However, for photosensitive chip products, photosensitive chips are usually used in wireless chargers for electronic devices such as mobile phones, and their size is very small. Therefore, if the photosensitive chip is first attached to the circuit board and then cut by a cutting machine, the cutting machine will flush the circuit board while cutting, which may cause the chip to be washed away or cut, resulting in the loss of the photosensitive chip; moreover, the photosensitive chip is usually provided with a sensing port. If water enters the sensing port, the photosensitive chip may be damaged.

[0017] To this end, an embodiment of the present invention provides a method for mounting an ultra-small photosensitive chip, which first cuts the circuit board to be cut, removes the connecting blocks between the substrates, and then places the photosensitive chip on the substrate to form a photosensitive chip product. This can avoid the risk of losing the photosensitive chip or damaging the photosensitive chip during the cutting and washing process, thereby improving the product yield.

[0018] The following is combined with Figure 1-8 , a detailed description of the chip mounting method of the ultra-small photosensitive chip according to an embodiment of the present invention is given.

[0019] On the one hand, the embodiment of the present invention provides a method for attaching an ultra-small photosensitive chip, such as Figure 1 As shown, the method comprises the following steps: Step S100: obtaining a circuit board 100 to be cut; Specifically, Figure 2As shown, in this example, the circuit board 100 to be cut includes a frame 110, the frame 110 includes two oppositely arranged horizontal edges 111 and two oppositely arranged vertical edges 112, the frame 110 includes a first area 113 and a second area 114, the first area 113 and the second area 114 are separated by a partition 115, the partition 115 is arranged parallel to the horizontal edge 111, the first area 113 and the second area 114 are respectively provided with multiple columns of substrates 120, and the multiple columns of substrates 120 in the first area 113 and the multiple columns of substrates 120 in the second area 114 are symmetrically distributed, any two adjacent substrates 120 in each column of substrates 120 are connected by a connecting block 130, and the two substrates 120 at both ends of each column of substrates 120 are respectively connected to the corresponding horizontal edge 111 and the partition 115 by the connecting block 130. In the embodiment of the present application, the substrate 120 is used as a carrier circuit board for the photosensitive chip, and the photosensitive chip is used as a wireless charging sensor for electronic products such as mobile phones, and its volume is very small, so the volume of the required substrate 120 is also relatively small. During the production process of the substrate 120, multiple substrates 120 will be produced simultaneously on a circuit board 100 to be cut, thereby improving the production efficiency of the substrate 120; on the circuit board 100 to be cut, each substrate 120 is connected together through a connecting block 130, and the substrate 120 is connected to the frame 110 of the circuit board 100 to be cut through the connecting block 130. After the substrate is produced, it is necessary to cut off the connecting block 130 to separate the various substrates 120 from each other and the substrate 120 from the frame 110, thereby obtaining multiple separate substrates 120.

[0020] Step S200: pre-cutting the circuit board 100 to be cut, removing two longitudinal edges 112; Specifically, Figure 2 and Figure 3 As shown, in this example, in order to facilitate the subsequent cutting of the connection block 130, it is necessary to use CNC equipment to pre-cut the circuit board 100 to be cut, so as to remove the two longitudinal edges 112 to prevent the longitudinal edges 112 from blocking the cutting path of the connection block 130. Since the precision requirement for removing the longitudinal edges 112 is not high, the cutting efficiency can be improved by using CNC equipment to cut the circuit board 100 to be cut. Figure 3 shown.

[0021] Step S300: After sticking an adhesive protective film on the bottom of the circuit board 100 to be cut, the circuit board 100 to be cut is placed in a cutting machine; the cutting machine includes a driving device, a first cutting tool and a second cutting tool, the first cutting tool and the second cutting tool are arranged at an interval, and the interval between the first cutting tool and the second cutting tool is equal to the width of the first area plus the width of the partition; Specifically, after the connecting block 130 is cut, each substrate 120 will be separated from the frame 110. In order to prevent the substrate 120 from falling, it is necessary to stick an adhesive protective film on the bottom of the circuit board 100 to be cut. The circuit board 100 to be cut and the substrate 120 are stuck to the adhesive protective film, so that after the cutting is completed, the substrate 120 is attached to the adhesive protective film and will not be lost.

[0022] Step S400: The driving device drives the first cutting tool and the second cutting tool to cut the connecting block 130 of the first area 113 and the second area 114 respectively according to the cutting parameters and the cutting path; It should be noted that, in the example, the first cutting tool and the second cutting tool have the same moving path during the cutting process, but the initial positions are different. For the first cutting tool, its cutting path is to cut the first row of connecting blocks 130 in the first area 113 from left to right or from right to left, and after cutting the first row of connecting blocks 130, cut the second row of connecting blocks 130 in the same way, and cut row by row until the last row of connecting blocks 130 in the first area 113 is cut. The second cutting tool cuts the first row of connecting blocks 130 in the second area 114 from left to right or from right to left, and then cuts row by row to the last row of connecting blocks 130 in the second area 114. By cutting the first area 113 and the second area 114 synchronously by the first tool and the second tool, the cutting efficiency can be improved.

[0023] Furthermore, in some embodiments of the present invention, the cutting machine also includes: a vacuum adsorption platform and a measuring device; when the circuit board 100 to be cut is placed in the cutting machine, the circuit board 100 to be cut is placed on the vacuum adsorption platform, and the vacuum adsorption platform performs vacuum adsorption on the circuit board 100 to be cut; then the height and thickness of the connecting block 130 are measured by the measuring device, and the cutting parameters and cutting path of the cutting tool are adjusted according to the height and thickness, so that the first cutting tool and the second cutting tool perform cutting according to the cutting parameters and cutting path.

[0024] Specifically, after placing the circuit board 100 to be cut on the vacuum adsorption platform, the vacuum adsorption platform will vacuum adsorb the circuit board 100 to be cut, so that the circuit board 100 to be cut remains fixed during cutting and cleaning, thereby avoiding cutting errors and improving cutting accuracy. Then, the measuring device will measure the height and thickness of the connecting block 130, so as to adjust the cutting position and cutting depth of the cutting tool to ensure the accuracy of cutting. Among them, the measuring device can use a machine vision system to perform image recognition on the circuit board 100 to be cut, identify the height and thickness of the connecting block 130, and the position of each connecting block 130. Then, according to the position of the connecting block 130, determine the cutting path, wherein the cutting path needs to pass through all the connecting blocks 130 to ensure that all the connecting blocks 130 are cut off, and the cutting path needs to be as short as possible, thereby improving cutting efficiency.

[0025] Step S500: After washing and drying the circuit board 100 to be cut, a support plate is arranged at the bottom of the adhesive protective film of the circuit board 100 to be cut; It should be noted that, in this example, the cutting machine also includes a flushing device and a drying device. Dust and impurities will be generated during the cutting process. In order to prevent dust and impurities from adhering to the substrate 120 and affecting the subsequent processing flow and quality of the substrate 120, the circuit board 100 to be cut needs to be flushed by a flushing device to remove the dust generated by cutting, and to prevent dust from adhering to the substrate 120 and affecting the subsequent processing flow of the substrate 120. After the cutting and flushing of the circuit board 100 to be cut are completed, a drying device is required to dry the circuit board 100 to be cut, so that the substrate 120 remains dry, which is convenient for subsequent processes. At the same time, since the sticky protective film is a soft and easily deformable material, a support plate needs to be provided at the bottom of the sticky protective film, so as to support and fix the sticky protective film and the circuit board 100 to be cut, so that the positions of the circuit board 100 to be cut and each substrate 120 remain fixed.

[0026] Step S600: After placing the circuit board 100 to be cut provided with the support plate on the chip mounter 200, the photosensitive chip is placed on each substrate 120 by the chip mounter 200; Step S700: remove the support plate and the sticky protective film to obtain a plurality of photosensitive chip products.

[0027] Specifically, the photosensitive chip is placed on each substrate 120 by the chip mounter 200 to complete the chip mounting work, so that the substrate 120 and the photosensitive chip form a photosensitive chip product. Since each substrate 120 is still attached to the adhesive protective film after the chip mounting is completed, the support plate and the adhesive protective film need to be removed, so that each substrate 120 is separated from each other to obtain multiple independent photosensitive chip products.

[0028] According to the method for mounting an ultra-small photosensitive chip in an embodiment of the present invention, the circuit board 100 to be cut is first cut, the connecting blocks 130 between the substrates 120 are removed, and then the photosensitive chip is placed on the substrate 120 to form a photosensitive chip product. The risk of losing the photosensitive chip or damaging the photosensitive chip during the cutting and washing process can be avoided, thereby improving the product yield.

[0029] Further, in some embodiments of the present invention, Figure 4 As shown, the SMT machine 200 includes a loading device 210, a printing device 220, a SMT device 230, a material transfer device 240 and a reflow soldering device 250; a first conveyor belt 260 is arranged between the loading device 210 and the printing device 220, a second conveyor belt 270 is arranged between the printing device 220 and the SMT device 230, a third conveyor belt 280 is arranged between the SMT device 230 and the material transfer device 240, and a fourth conveyor belt 290 is arranged between the material transfer device 240 and the reflow soldering device 250.

[0030] The above step S600: after placing the circuit board 100 to be cut provided with the support plate on the placement machine 200, the step of placing the photosensitive chip on each substrate 120 by the placement machine 200 includes the following five steps: Step S1: placing the circuit board 100 to be cut provided with a support plate on the loading device 210; Step S2: The loading device 210 conveys the circuit board 100 to be cut to the printing device 220 via the first conveyor belt 260; Step S3: After the printing device 220 prints solder paste on each substrate 120 of the circuit board 100 to be cut, the printing device 220 conveys the printed circuit board 100 to the patch device 230 through the second conveyor belt 270; Step S4: After the patch device 230 attaches the photosensitive chip to the corresponding substrate 120, the third conveyor belt 280 conveys the circuit board 100 to be cut to the material transfer device 240; Step S5: the material transfer device 240 changes the conveying direction of the circuit board 100 to be cut, and conveys the circuit board 100 to be cut to the reflow device 250 via the fourth conveyor belt 290. The reflow device 250 performs reflow on the circuit board 100 to be cut.

[0031] The placement machine 200 realizes automatic loading, printing, placement and reflow of the circuit board 100 to be cut through the loading device 210, the printing device 220, the placement device 230, the material transfer device 240 and the reflow device 250, so as to automatically attach the photosensitive chip to the substrate 120, realize the production of photosensitive chip products, and thus improve production efficiency.

[0032] Further, in some embodiments of the present invention, Figure 5 As shown, the loading device 210 includes a lifting frame 211, a pushing rod 212 and a first detection device; the lifting frame 211 includes a plurality of placing tables 213 arranged in sequence from top to bottom, each placing table 213 is used to place a circuit board 100 to be cut with a support plate; the pushing rod 212 is arranged on one side of the lifting frame 211 away from the first conveyor belt 260 (i.e. Figure 5 The first detection device is disposed between the lifting frame 211 and the first conveyor belt 260. The above step S2: the loading device 210 conveys the circuit board 100 to be cut to the printing device 220 via the first conveyor belt 260, specifically includes the following three steps: Step S21: After the push rod 212 pushes the circuit board 100 to be cut on the placement table 213 at the corresponding height onto the first conveyor belt 260, the lifting frame 211 rises to raise the next placement table 213 to the height of the push rod 212; Step S22: When the first detection device detects the circuit board 100 to be cut, the first conveyor belt 260 starts to run, and after the circuit board 100 to be cut is conveyed to the side close to the printing device 220 (i.e., the circuit board 100 to be cut is conveyed from the left side of the first conveyor belt 260 to the right side), the first conveyor belt 260 stops running; Step S23: When the printing device 220 completes printing of the previous circuit board 100 to be cut, a signal is sent to the first conveyor belt 260, and the first conveyor belt 260 continues to run, and the circuit board 100 to be cut on the first conveyor belt 260 is conveyed to the printing device 220, and the push rod 212 pushes the next circuit board 100 to be cut onto the first conveyor belt 260.

[0033] Specifically, during operation, a plurality of circuit boards 100 to be cut will be placed in advance in the lifting frame 211, and each placement table 213 can place a circuit board 100 to be cut; at the same time, the lifting frame 211 can rise and fall. When a circuit board 100 to be cut is to be processed, the lifting frame 211 will raise or lower the placement table 213 corresponding to the circuit board 100 to be cut to the same height as the pushing rod 212. At this time, the pushing rod 212 is pushed outward, and the circuit board 100 to be cut in the placement table 213 can be pushed onto the first conveyor belt 260, and then the first conveyor belt 260 will convey the circuit board 100 to be cut to the printing device 220 for subsequent process steps.

[0034] It should be noted that, after the push rod 212 pushes the circuit board 100 to be cut on the placement table 213 of the corresponding height onto the first conveyor belt 260, the lifting frame 211 may be raised by the height of one placement table 213, or may be lowered by the height of one placement table 213. If the circuit boards 100 to be cut in the lifting frame 211 are processed in a top-down order, the lifting frame 211 rises by the height of one placement table 213 each time the push rod 212 pushes out a circuit board 100 to be cut, so that the subsequent pushing rod 212 pushes out the circuit board 100 to be cut located below; conversely, if the circuit boards 100 to be cut in the lifting frame 211 are processed in a bottom-up order, the lifting frame 211 drops by the height of one placement table 213 each time the push rod 212 pushes out a circuit board 100 to be cut, so that the subsequent pushing rod 212 pushes out the circuit board 100 to be cut located above. In this example, the top-down order is adopted, and of course, it can be changed to a bottom-up order according to actual needs. The first detection device can be a common detection device such as a photoelectric sensor, a proximity sensor or a limit switch. The first detection device is arranged between the lifting frame 211 and the first conveyor belt 260 to detect whether the circuit board 100 to be cut is pushed from the lifting frame 211 to the first conveyor belt 260. When the first detection device cannot detect that the circuit board 100 to be cut is pushed from the lifting frame 211 to the first conveyor belt 260, the first conveyor belt 260 is in a stopped state. This arrangement can save energy on the one hand, and on the other hand, when the printing device 220 is in a working state, the first conveyor belt 260 cannot continue to send the circuit board 100 to be cut into the printing device 220. It is necessary to wait until the printing device 220 completes the work before the first conveyor belt 260 can continue to run and send the circuit board 100 to be cut into the printing device 220. If the first conveyor belt 260 is always in a running state, the circuit board 100 to be cut will be continuously sent in before the printing device 220 completes the work, which will cause the system to fail. Therefore, only when the first detection device detects the circuit board 100 to be cut, the first conveyor belt 260 will start to run, and convey the circuit board 100 to be cut from the left to the right, and then stop running, waiting for the printing device 220 to complete the printing of the previous circuit board 100 to be cut, and send instructions to the first conveyor belt 260, the first conveyor belt 260 will continue to run, convey the circuit board 100 to be cut on the first conveyor belt 260 to the printing device 220, and then wait for the next circuit board 100 to be cut to be pushed onto the first conveyor belt 260.

[0035] Further, in some embodiments of the present invention, Figure 6 and Figure 7As shown, the printing device 220 includes a first frame 221, a lifting assembly 222 arranged in the first frame 221, a first guide rail 223 and a printing assembly 224. The first guide rail 223 is arranged below the printing assembly 224, the lifting assembly 222 is arranged below the first guide rail 223, a fixing plate 225 is also arranged on the lifting assembly 222, two clamping plates 226 are arranged on both sides of the first guide rail 223, and a second detection device 2211 and a retractable blocking rod 227 are arranged at the bottom of the printing assembly 224. The above-mentioned step S3: After the printing device 220 prints solder paste on each substrate 120 of the circuit board 100 to be cut, the printing device 220 transfers the printed circuit board 100 to the patch device 230 through the second conveyor belt 270, includes the following four steps: Step S31: When the second detection device 2211 detects that the loading device 210 transfers the circuit board 100 to be cut onto the first guide rail 223, the blocking rod 227 extends downward to block the circuit board 100 to be cut from moving forward, the first guide rail 223 stops running, and the blocking rod 227 resets upward; Step S32: the lifting assembly 222 rises to the fixed plate 225 to support the circuit board 100 to be cut, and adjusts the position of the circuit board 100 to be cut through the two clamping plates 226; Step S33: the lifting assembly 222 continues to rise, driving the first guide rail 223 and the circuit board 100 to be cut on the first guide rail 223 to rise to the bottom of the printing assembly 224; Step S34: the printing component 224 prints solder paste on the circuit board 100 to be cut. After printing, the lifting component 222 descends to reset the first guide rail 223. The first guide rail 223 continues to run and conveys the printed circuit board 100 to be cut to the patch device 230 through the second conveyor belt 270.

[0036] Specifically, Figure 6 and Figure 7As shown, after the first conveyor belt 260 delivers the circuit board 100 to be cut onto the first guide rail 223, the first guide rail 223 will run to drive the circuit board 100 to be cut forward. When the circuit board 100 to be cut passes the second detection device 2211, the blocking rod 227 will extend downward to block the circuit board 100 to be cut from continuing to move forward. At the same time, the first guide rail 223 will stop running. After the first guide rail 223 stops completely, the blocking rod 227 will reset upward. Among them, the second detection device 2211 can be a common detection device such as a photoelectric sensor, a proximity sensor or a limit switch, which is used to detect whether the circuit board 100 to be cut has reached the processing position of the printing device 220; and the blocking rod 227 is used to roughly position the circuit board 100 to be cut, ensuring that the circuit board 100 to be cut stays at the processing position. The blocking rod 227 can be a device that can be extended and retracted, such as a cylinder. When the blocking rod 227 is in the reset state, it will not block the circuit board 100 to be cut. Only when the blocking rod 227 extends downward, will it block the circuit board 100 to be cut. After the blocking rod 227 realizes the rough positioning of the circuit board 100 to be cut and the first guide rail 223 stops running, the lifting assembly 222 under the first guide rail 223 will rise until the fixed plate 225 supports the circuit board 100 to be cut, wherein the fixed plate 225 plays a supporting role for the circuit board 100 to be cut, so as to facilitate the subsequent lifting of the circuit board 100 to be cut to the position of the printing assembly 224 for printing. At the same time, since the circuit board 100 to be cut is pushed out of the lifting frame 211 by the push rod 212, and then the circuit board 100 to be cut is conveyed to the first guide rail 223 by the first conveyor belt 260, and then the blocking rod 227 blocks the circuit board 100 to be cut and the fixed plate 225 supports the circuit board 100 to be cut, the circuit board 100 to be cut may be tilted. If the circuit board 100 to be cut is not adjusted, the printing position of the printing assembly 224 on the circuit board 100 to be cut will be incorrect, resulting in defective products. Therefore, in this example, the circuit board 100 to be cut is clamped and positioned by two clamping plates 226, thereby ensuring the accurate position of the circuit board 100 to be cut and improving the printing accuracy. Then, the lifting assembly 222 continues to rise, driving the first guide rail 223 and the circuit board 100 to be cut on the first guide rail 223 to rise to the bottom of the printing assembly 224. It should be noted that in this example, the lifting assembly 222 can drive the entire first guide rail 223 to rise and fall. When the lifting assembly 222 drives the first guide rail 223 to rise, the fixing plate 225 will drive the circuit board 100 to be cut to rise together. During the rising process, since the two clamping plates 226 clamp the circuit board 100 to be cut, the position of the circuit board 100 to be cut will not be offset.The lifting assembly 222 raises the circuit board 100 to be cut to the bottom of the printing assembly 224, so that the printing assembly 224 can print the circuit board 100 to be cut and print solder paste on the pads of the circuit board 100 to be cut. When the printing assembly 224 completes printing, the lifting assembly 222 descends to reset the first guide rail 223, and then the lifting assembly 222 continues to descend to reset the fixing plate 225. Subsequently, the first guide rail 223 continues to operate to send the printed circuit board 100 to be cut to the second conveyor belt 270, and the second conveyor belt 270 sends the circuit board 100 to be cut to the patch device 230. Subsequently, the printing device 220 receives the next circuit board 100 to be cut.

[0037] Furthermore, if Figure 6 As shown, in some embodiments of the present invention, the printing assembly 224 includes a printing steel mesh 228 and a printing roller 229. The printing roller 229 is located above the printing steel mesh 228. The printing steel mesh 228 is provided with a plurality of through holes. A limited position protective film (not shown) is provided on the surface of the printing steel mesh 228. The above-mentioned step S34: the step of printing solder paste by the printing assembly 224 on the circuit board 100 to be cut includes the following two steps: Step S341: laser-cutting a window on the position-limiting protective film according to the position of the pad of each substrate 120 of the circuit board 100 to be cut, to obtain a window corresponding to the pad; the window is located at the corresponding through hole, and the size of the window is smaller than the through hole; Step S342: The printing roller 229 prints solder paste on the surface of the limiting protection film so that the solder paste passes through the window and the through hole and reaches the solder pad.

[0038] Specifically, since the sizes of circuit boards of different products are different, if a corresponding printing steel mesh 228 is set for each circuit board and holes are made in the printing steel mesh 228, the production cost will be high; in the present application, considering that the size of the substrate 120 is small and the printing steel mesh 228 itself has through holes, before using the printing component 224 to print solder paste on the substrate 120, a limiting protective film is first attached to the surface of the printing steel mesh 228, and then the limiting protective film is laser-opened according to the position of the pad of the substrate 120, so that the window size and position correspond to the pad, and each through hole of the printing steel mesh 228 can accommodate multiple windows, so that the solder paste on the printing roller 229 can pass through the windows and through holes to reach the pad on the substrate 120, and the printing solder paste on the substrate 120 is completed. In this way, there is no need to re-make the printing steel mesh 228, thereby saving costs and improving production efficiency.

[0039] After receiving the printed solder paste printed circuit board 100, the patch device 230 sucks the photosensitive chip in the feeder through the suction nozzle and places the photosensitive chip on the corresponding substrate 120 to complete the patch operation. It should be noted that the patch device 230 is a common device in the technical field, and its specific structure is not described in detail here.

[0040] Furthermore, if Figure 8 As shown, in some embodiments of the present invention, the material transfer device 240 includes a second frame 241, a second guide rail 242 and a third guide rail 243 disposed in the second frame 241, and the second guide rail 242 is disposed on the third guide rail 243. The above-mentioned step S5: the material transfer device 240 changes the conveying direction of the circuit board 100 to be cut, and conveys the circuit board 100 to be cut to the reflow soldering device 250 through the fourth conveyor belt 290. The reflow soldering device 250 performs reflow soldering on the circuit board 100 to be cut, which specifically includes the following three steps: Step S51: the second guide rail 242 receives the circuit board 100 to be cut sent by the third conveyor belt 280, and adjusts the posture of the circuit board 100 to be cut; Step S52: The third guide rail 243 transfers the second guide rail 242 and the circuit board 100 to be cut on the second guide rail 242 to a side of the third guide rail 243 close to the reflow soldering device 250; Step S53 : the second guide rail 242 conveys the circuit board 100 to be cut to the reflow soldering device 250 via the fourth conveyor belt 290 .

[0041] Specifically, when the second guide rail 242 receives the circuit board 100 to be cut sent by the third conveyor belt 280, it will first adjust the posture of the circuit board 100 to be cut; the specific adjustment method is: after the second guide rail 242 receives the circuit board 100 to be cut sent by the third conveyor belt 280, it conveys the circuit board 100 to be cut to the side wall of the second frame 241 away from the third conveyor belt 280, so that the circuit board 100 to be cut is kept parallel to the side wall of the second frame 241; the second guide rail 242 then conveys the circuit board 100 to be cut in the opposite direction, so that the circuit board 100 to be cut is kept at a preset distance from the side wall of the second frame 241, and then the second guide rail 242 stops running, and at this time the third guide rail 243 starts to start. That is, after the second guide rail 242 receives the circuit board 100 to be cut sent by the third conveyor belt 280, it will continue to run until the circuit board 100 to be cut touches the side wall of the second rack 241, and adjust the posture of the circuit board 100 to be cut with the help of the side wall of the second rack 241, so that the circuit board 100 to be cut and the side wall of the second rack 241 remain parallel; then, the second guide rail 242 changes the running direction, so that the circuit board 100 to be cut keeps a certain distance from the side wall of the second rack 241, and then the second guide rail 242 stops running. At this time, the third guide rail 243 starts to run, driving the second guide rail 242 and the circuit board 100 to be cut to move together, close to the reflow soldering device 250. Then, the third guide rail 243 stops running, and the second guide rail 242 sends the circuit board 100 to be cut to the fourth conveyor belt 290, and then the fourth conveyor belt 290 sends the circuit board 100 to be cut to the reflow soldering device 250. It should be noted that the material transfer device 240 plays the role of changing the conveying direction of the circuit board 100 to be cut, and transferring the circuit board 100 to be cut to the reflow soldering device 250. If the conveying direction of the circuit board 100 to be cut is not changed, the occupied space of the entire placement machine 200 will be too large. By setting up the material transfer device 240, it is possible to reasonably utilize the space and reduce the occupied space of the placement machine 200. At the same time, if the loading device 210, the printing device 220, and the placement device 230 are regarded as a whole as a semi-finished product processing mechanism, then one material transfer device 240 can be connected to multiple semi-finished product processing mechanisms at the same time, and the circuit boards 100 to be cut that have been patched by multiple semi-finished product processing mechanisms can be transferred to the same reflow soldering device 250. Figure 8 As shown, the fourth conveyor belt 290 and the reflow soldering device 250 both have a plurality of conveying lanes, and a plurality of circuit boards 100 to be cut can be sent to the reflow soldering device 250 for reflow soldering, thereby improving efficiency.

[0042] Furthermore, in some embodiments of the present invention, the method for mounting the ultra-small light sensing chip further includes the following steps: Perform AOI inspection on photosensitive chip products through AOI inspection device; Tape and package the photosensitive chip products that have passed AOI inspection.

[0043] Specifically, by performing AOI inspection on the photosensitive chip products, it is possible to check whether the products have faults and prevent defective products from being shipped out. Finally, the photosensitive chip products that have passed the AOI inspection are taped and packaged to complete the product shipment.

[0044] The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions under the shared conditions without violating the spirit of the present invention. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A method for mounting an ultra-small photosensitive chip, characterized in that: The following steps are involved: Obtain a circuit board to be cut; the circuit board to be cut comprises a frame, the frame comprises two oppositely arranged horizontal sides and two oppositely arranged vertical sides, the frame comprises a first area and a second area, the first area and the second area are separated by a partition, the partition is arranged parallel to the horizontal side, the first area and the second area are symmetrically arranged with multiple columns of substrates, any two adjacent substrates in each column of substrates are connected by a connecting block, and the two substrates at both ends of each column of substrates are respectively connected to the corresponding horizontal sides and the partition through connecting blocks; Pre-cutting the circuit board to be cut to remove the two longitudinal edges; After sticking an adhesive protective film on the bottom of the circuit board to be cut, the circuit board to be cut is placed in a cutting machine; the cutting machine includes a driving device, a first cutting tool and a second cutting tool, the first cutting tool and the second cutting tool are arranged at an interval, and the interval between the first cutting tool and the second cutting tool is equal to the width of the first area plus the width of the partition; The driving device drives the first cutting tool and the second cutting tool to cut the connecting blocks of the first area and the second area respectively according to cutting parameters and cutting paths; After washing and drying the circuit board to be cut, a support plate is arranged at the bottom of the adhesive protective film of the circuit board to be cut; After placing the circuit board to be cut provided with the support plate on a chip mounter, a photosensitive chip is placed on each of the substrates by the chip mounter; The support plate and the adhesive protective film are removed to obtain a plurality of photosensitive chip products.

2. The method for attaching an ultra-small photosensitive chip according to claim 1, characterized in that: The cutting machine further comprises: a vacuum adsorption platform and a measuring device; the step of placing the circuit board to be cut in the cutting machine comprises: Placing the circuit board to be cut on the vacuum adsorption platform, and the vacuum adsorption platform performs vacuum adsorption on the circuit board to be cut; The height and thickness of the connection block are measured by the measuring device, and the cutting parameters and the cutting path are determined according to the height and the thickness.

3. The method for attaching an ultra-small photosensitive chip according to claim 1, characterized in that: The chip mounter includes a feeding device, a printing device, a chip mount device, a material transfer device and a reflow soldering device; a first conveyor belt is arranged between the feeding device and the printing device, a second conveyor belt is arranged between the printing device and the chip mount device, a third conveyor belt is arranged between the chip mount device and the material transfer device, and a fourth conveyor belt is arranged between the material transfer device and the reflow soldering device; After placing the circuit board to be cut provided with the support plate on a chip mounter, the step of placing a photosensitive chip on each of the substrates by the chip mounter comprises: Placing the circuit board to be cut provided with the support plate on the loading device; The loading device conveys the circuit board to be cut to the printing device via the first conveyor belt; After the printing device prints solder paste on each substrate of the circuit board to be cut, the printing device conveys the printed circuit board to be cut to the patch device through the second conveyor belt; After the patch device attaches the photosensitive chip to the corresponding substrate, the circuit board to be cut is conveyed to the material transfer device via the third conveyor belt; The material transfer device changes the conveying direction of the circuit board to be cut, and conveys the circuit board to be cut to the reflow soldering device through the fourth conveyor belt, and the reflow soldering device performs reflow soldering on the circuit board to be cut.

4. The method for attaching an ultra-small photosensitive chip according to claim 3, characterized in that: The loading device includes a lifting frame, a pushing rod and a first detection device; the lifting frame includes a plurality of placement tables arranged in sequence from top to bottom, each of the placement tables is used to place a circuit board to be cut provided with the support plate; the pushing rod is arranged on a side of the lifting frame away from the first conveyor belt, and the first detection device is arranged between the lifting frame and the first conveyor belt; The step of the feeding device conveying the circuit board to be cut to the printing device via the first conveyor belt comprises: After the pushing rod pushes the circuit board to be cut on the placement table at the corresponding height onto the first conveyor belt, the lifting frame rises to raise the next placement table to the height of the pushing rod; When the first detection device detects the circuit board to be cut, the first conveyor belt starts to run, and after the circuit board to be cut is conveyed to a side close to the printing device, the first conveyor belt stops running; When the printing device completes printing of the last circuit board to be cut, a signal is sent to the first conveyor belt, and the first conveyor belt continues to run to convey the circuit board to be cut on the first conveyor belt to the printing device, and the pushing rod pushes the next circuit board to be cut onto the first conveyor belt.

5. The method for attaching an ultra-small photosensitive chip according to claim 3, characterized in that: The printing device comprises a first frame, a lifting assembly arranged in the first frame, a first guide rail and a printing assembly, wherein the first guide rail is arranged below the printing assembly, the lifting assembly is arranged below the first guide rail, a fixing plate is also arranged on the lifting assembly, two clamping plates are arranged on both sides of the first guide rail, and a second detection device and a retractable blocking rod are arranged at the bottom of the printing assembly; After the printing device prints solder paste on each substrate of the circuit board to be cut, the printing device conveys the printed circuit board to be cut to the patch device through the second conveyor belt, comprising: When the second detection device detects that the feeding device transfers the circuit board to be cut to the first guide rail, the blocking rod extends downward to block the circuit board to be cut from moving forward, the first guide rail stops running, and the blocking rod resets upward; The lifting assembly rises to the fixed plate to support the circuit board to be cut, and adjusts the position of the circuit board to be cut through the two clamping plates; The lifting assembly continues to rise, driving the first guide rail and the circuit board to be cut on the first guide rail to rise to the bottom of the printing assembly; The printing component prints solder paste on the circuit board to be cut. After printing is completed, the lifting component descends to reset the first guide rail. The first guide rail continues to run to convey the printed circuit board to be cut to the patch device through the second conveyor belt.

6. The method for attaching an ultra-small photosensitive chip according to claim 5, characterized in that: The printing assembly comprises a printing steel mesh and a printing roller, wherein the printing roller is located above the printing steel mesh, the printing steel mesh is provided with a plurality of through holes, and a limited position protection film is provided on the surface of the printing steel mesh; The step of printing solder paste on the circuit board to be cut by the printing component includes: According to the position of the pad of each substrate of the circuit board to be cut, laser windowing is performed on the position-limiting protective film to obtain a window corresponding to the pad; The window is located at the corresponding through hole, and the size of the window is smaller than the through hole; The printing roller prints solder paste on the surface of the limiting protection film, so that the solder paste passes through the window and the through hole and reaches the soldering pad.

7. The method for attaching an ultra-small photosensitive chip according to claim 5, characterized in that: The material transfer device comprises a second frame, a second guide rail and a third guide rail arranged in the second frame, wherein the second guide rail is arranged on the third guide rail; The step of the material transfer device changing the conveying direction of the circuit board to be cut and conveying the circuit board to be cut to the reflow soldering device through the fourth conveyor belt specifically includes: The second guide rail receives the circuit board to be cut sent by the third conveyor belt, and adjusts the posture of the circuit board to be cut; The third guide rail transfers the second guide rail and the circuit board to be cut on the second guide rail to a side of the third guide rail close to the reflow soldering device; The second guide rail conveys the circuit board to be cut to the reflow soldering device through the fourth conveyor belt.

8. The method for attaching an ultra-small photosensitive chip according to claim 7, characterized in that: The step of the second guide rail receiving the circuit board to be cut sent by the third conveyor belt and adjusting the posture of the circuit board to be cut specifically includes: After receiving the cut circuit board sent by the third conveyor belt, the second guide rail conveys the circuit board to be cut to the side wall of the second frame away from the third conveyor belt, so that the circuit board to be cut remains parallel to the side wall of the second frame; The second guide rail then transports the circuit board to be cut in the reverse direction, and after the circuit board to be cut maintains a preset distance from the side wall of the second rack, the second guide rail stops running.

9. The method for attaching an ultra-small photosensitive chip according to claim 1, characterized in that: After the step of removing the support plate and the adhesive protective film to obtain a plurality of light sensing chip products, the method further includes: Performing AOI inspection on the photosensitive chip product by using an AOI inspection device; The photosensitive chip product that has passed the AOI inspection is packaged in a taping manner.

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