Head-mounted device

Abstract

The embodiment of the invention provides head-mounted equipment, which comprises a main body part, a wearing part, an optical machine and a heat dissipation device, and is characterized in that the main body part comprises a frame body and a display part, the display part is mounted on the frame body, and the wearing part is connected with the main body part and is used for wearing. The light machine is arranged on the wearing part or the main body part and configured to project image light towards the display part, the heat dissipation device comprises a heat conduction part and a heat dissipation pipeline, the heat conduction part is attached to the light machine, the heat dissipation pipeline comprises a first pipeline and a second pipeline which are communicated end to end, the first pipeline is arranged on the frame body, and the second pipeline is in direct or indirect contact with the heat conduction part. According to the head-mounted equipment, the heat dissipation device is arranged in the head-mounted equipment, the heat dissipation pipeline of the heat dissipation device extends to the frame body of the main body part, heat generated by the optical machine is guided to the second pipeline of the heat dissipation pipeline through the heat conduction piece and exchanges heat with the liquid medium in the heat dissipation pipeline, and the heat can be guided to the frame body of the main body part; therefore, the convection heat dissipation area is increased, and the purpose of faster heat dissipation is achieved.

Description

Technical Field

[0001] The present application relates to the field of consumer electronic products, and in particular to a head-mounted device. Background Art

[0002] In the related technology, head-mounted devices such as smart glasses and AR glasses have gradually entered the lives of users, providing users with an immersive experience. The current head-mounted devices mainly project image light in the display area through an optical machine through optical waveguides and other methods for display. The current optical machines mainly include DLP optical machines, Lcos optical machines, Micro OLED optical machines, Micro LED optical machines, etc. These optical machines will generate a lot of heat during operation. If the heat is not dissipated in time, on the one hand, it may cause the image projected by the optical machine to freeze, affecting the use of the optical machine. On the other hand, because the optical machine is close to the user's head, a large amount of heat concentration will cause the user to feel overheated, which is not suitable for users to wear for a long time. Summary of the invention

[0003] The purpose of this application is to provide a head-mounted device to improve the above-mentioned technical problems.

[0004] The embodiment of the present application also provides a head-mounted device, including a main body, a wearable part, an optical machine and a heat dissipation device, the main body includes a frame and a display part, the display part is installed in the frame, and the wearable part is connected to the main body and is used for wearing. The optical machine is arranged on the wearable part or the main body, and is configured to project image light toward the display part, the heat dissipation device includes a heat conductor and a heat dissipation pipe filled with a liquid medium, the heat conductor is attached to the optical machine, the heat dissipation pipe includes a first pipe and a second pipe connected end to end, the first pipe is arranged on the frame, and the second pipe is in direct or indirect contact with the heat conductor.

[0005] The head-mounted device provided in the embodiment of the present application is equipped with a heat dissipation device in the head-mounted device. The heat dissipation pipe of the heat dissipation device extends to the frame of the main body. The heat generated by the optical machine is guided to the second pipe of the heat dissipation pipe through the heat conductive member, and heat is exchanged with the liquid medium in the heat dissipation pipe. The heat can be guided to the frame of the main body, thereby increasing the convection heat dissipation area and achieving a faster heat dissipation purpose.

[0006] These and other aspects of the present application will become more clearly understood in the description of the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0008] Figure 1 It is a structural schematic diagram of a head-mounted device shown in an embodiment of the present application.

[0009] Figure 2 It is a schematic structural diagram of a main body of a head-mounted device shown in an embodiment of the present application.

[0010] Figure 3 It is a partial perspective structural diagram of a head-mounted device provided in an embodiment of the present application.

[0011] Figure 4 It is a structural schematic diagram of a heat dissipation device in a head-mounted device provided in an embodiment of the present application.

[0012] Figure 5 This is a logical block diagram of a head-mounted device provided in an embodiment of the present application.

[0013] Figure 6 This is a schematic diagram of the structure of a first pipe in a head-mounted device provided in an embodiment of the present application.

[0014] Figure 7 This is a schematic diagram of the structure of a second pipe in a head-mounted device provided in an embodiment of the present application.

[0015] Figure 8 yes Figure 7 A schematic diagram of the installation structure of the second pipeline is shown.

[0016] Fig. 9 This is a schematic diagram of the installation structure of another second pipe in a head-mounted device provided in an embodiment of the present application.

[0017] Fig.10 This is a schematic diagram of the installation structure of another second pipe in a head-mounted device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0019] Virtual Reality (VR) is a computer simulation system that can create and experience a virtual world. It uses computers to generate a simulated environment and immerse users in it. Virtual reality technology uses real-life data, electronic signals generated by computer technology, and combines them with various output devices to transform them into phenomena that people can feel. These phenomena can be real objects in reality or substances that are invisible to our naked eyes, which are expressed through three-dimensional models.

[0020] Augmented Reality (AR) technology is a technology that cleverly integrates virtual information with the real world, superimposing virtual display content on real scenes. It uses computer technology to generate virtual information, such as visual images, sounds, etc., and then applies the virtual information to the real world. Virtual reality technology not only displays real-world information, but also can display virtual information at the same time. The two types of information complement and overlap each other.

[0021] Mixed Reality (MR) introduces real-world scene information into a virtual environment, building an interactive feedback information loop between the virtual world, the real world, and the user to enhance the realism of the user experience.

[0022] In the related technologies, AR glasses and other head-mounted devices are virtual reality devices that use AR, VR and MR technologies. They need to be worn for a long time when in use, so they must meet the requirements of being light and thin. Among them, AR glasses using free-form surface solutions and Birdbath solutions are usually thicker and heavier, and are not suitable for long-term wear, otherwise they are prone to fatigue; although head-mounted devices using geometric optical waveguides with Micro OLED optical machine solutions can also meet the requirements of being light and thin, the two-dimensional geometric optical waveguide technology solution for pupil expansion is very immature and not yet mass-producible; the head-mounted device solution using diffraction optical waveguides with Micro LED optical machines is the lightest and thinnest solution with mass production at this stage.

[0023] In order to achieve extreme lightness and thinness, the head-mounted device solution based on diffraction optical waveguide and Micro LED optical engine needs to design the size of the structural parts to be extremely small, so the space available for setting up the heat dissipation structure is small and the heat dissipation effect is poor. The power of Micro LED optical engine is large and the heat generation is serious. During the long-term use of the head-mounted device, the temperature of the optical engine rises significantly. The display brightness of the red light display of the Micro LED optical engine is strongly related to the temperature. The higher the temperature of the optical engine, the more serious the brightness attenuation of the red light. Therefore, how to improve the heat dissipation capacity of the optical engine while minimizing the impact on the thinness of the glasses is a problem that needs to be solved urgently.

[0024] Based on this, the inventor of this application proposes a head-mounted device in order to improve the above technical problems. The following is a detailed description in conjunction with specific embodiments and drawings:

[0025] Figure 1 as well as Figure 2 A head mounted device 10 is shown, comprising a main body 20, a wearable part 30, an optical machine 40 and a heat dissipation device 50, wherein the wearable part 30 is connected to the main body 20 and is used for being worn by a user, and the main body 20 may include a frame 21 and a display part 22, and the display part 22 may be used for displaying information. In this embodiment, for ease of description, the head mounted device 10 is described in detail in the form of a pair of smart glasses, that is, the main body 20 may be configured as a lens-like structure, and the wearable part 30 may be configured as a frame.

[0026] Specifically, the main body 20 includes a frame 21 and a display unit 22. The frame 21 may include two independent frame structures, and the two frame structures correspond to the left eye and the right eye of the user respectively. The display unit 22 may be a continuous display unit 22, which is installed on two frame structures at the same time. The display unit 22 may also include two display units 22 separated from each other, which are installed on two frame structures respectively. Among them, in a more specific embodiment, the display unit 22 may be a diffractive light waveguide lens. Of course, the display unit 22 may also be a geometric light waveguide lens, which is not limited in this embodiment.

[0027] The frame 21 may be a roughly annular frame 21, the display unit 22 is disposed inside the frame 21 and surrounded by the frame 21, and the frame 21 may be made of various materials such as metal, plastic, ceramic, etc., which is not limited in this embodiment. In some embodiments, the frame 21 may only half surround the display unit 22, for example, the upper edge of the display unit 22 is assembled on the frame 21, and the lower edge is hollowed out.

[0028] The wearing part 30 is connected to the frame 21 of the main body 20. For example, the wearing part 30 may include two frame legs. The structures of the two frame legs are substantially the same. The two frame legs are respectively arranged on opposite sides of the frame 21 and connected to the frame 21. The two frame legs are arranged in a substantially symmetrical structure, and in some embodiments, the frame legs may be connected to the frame 21 in a hinged manner to facilitate storage of the frame legs. Of course, in some other embodiments, the frame legs may also be fixedly connected to the frame 21.

[0029] In this embodiment, the main body 20 is also provided with a heat exchange area 23, which can be arranged at a position of the main body 20 adjacent to the wearable part 30, and the heat exchange area 23 can be used for heat exchange for the heat dissipation device 50. It can be understood that in this embodiment, the heat exchange area 23 can be a continuous area, and the heat exchange area 23 can be located on the outer side of the main body 20, and the outer side refers to the side of the main body 20 that does not contact the user's skin. In this embodiment, since there is heat exchange in the heat exchange area 23, the temperature changes greatly. Setting it on the outer side of the main body 20 can reduce the chance of direct contact with the user's skin and reduce the impact on the user's use. There can be two heat exchange areas 23, and the two heat exchange areas 23 are respectively arranged at the opposite ends of the frame 21. The heat exchange area 23 can be used to connect with the wearable part 30, for example, the heat exchange area 23 can be hinged with the wearable part 30. In some other embodiments, the heat exchange area 23 can also be arranged on the wearable part 30, and the heat exchange area 23 and the frame 21 can be connected by hinged means.

[0030] In some other embodiments, the heat exchange area 23 may also be a discontinuous area, which is not limited in this embodiment. In addition, the heat exchange area 23 may also be arranged at other positions of the main body 20, or arranged on the wearable part 30, which is not limited in this embodiment.

[0031] See also Figure 3 , the optical machine 40 is arranged on the wearable part 30 or the main body 20. In this embodiment, the optical machine 40 is arranged on the main body 20. In this embodiment, the optical machine 40 can be a Micro LED optical machine. In some other embodiments, the optical machine 40 can also be a DLP optical machine, an Lcos optical machine, a Micro OLED optical machine, etc., which is not specifically limited in this embodiment. The optical machine 40 can be one and arranged on the main body 20. The optical machine 40 is used to project image light to the display part 22 so that the user can watch the image of the display part 22. The number of optical machines 40 can also be two. The two optical machines 40 can be respectively arranged on two heat exchange areas 23 or the wearable part 30, or a heat exchange area 23 is respectively arranged on both sides of the frame 21. The two optical machines 40 are respectively arranged on the heat exchange areas 23 on both sides of the frame 21. The two optical machines 40 are used to project image light to the display part 22. It can be understood that when there are two optical machines 40, the projection areas when the two optical machines 40 project image light to the display part 22 can be different areas.

[0032] Specifically, the optical engine 40 can be arranged adjacent to the heat exchange area 23 or arranged in the heat exchange area 23 to shorten the path of heat transfer from the optical engine 40 to the heat exchange area 23 and improve the heat exchange efficiency. In one embodiment, the optical engine 40 can be at least partially arranged in the heat exchange area 23 to perform heat exchange and heat dissipation faster. In particular, in one embodiment, the optical engine 40 can be completely located in the heat exchange area 23. The optical engine 40 is at least partially arranged in the heat exchange area 23. Since the heat exchange area 23 is located on the outer side of the main body 20, the setting of the optical engine 40 will not affect the user wearing the head-mounted device 10. At the same time, the optical engine 40 can also have a larger setting space, which is conducive to the heat dissipation of the optical engine 40. Since there is enough space, in some embodiments, the optical engine 40 can also be provided with heat dissipation fins and other structures to exchange heat with the air to dissipate heat.

[0033] Please also read Figure 3 and Figure 4 The heat dissipation device 50 is used to dissipate heat from the optical engine 40 to improve the heat dissipation efficiency of the optical engine 40 and prevent the optical engine 40 from overheating. Specifically, the heat dissipation device 50 includes a heat conductor 51 and a heat dissipation pipe 52. The heat conductor 51 is attached to the optical engine 40. The heat conductor 51 is made of a material with a large thermal conductivity coefficient. For example, the heat conductor 51 can be a graphite sheet. The graphite sheet has good thermal conductivity and is easy to process. The graphite sheet has a unique grain orientation and can conduct heat uniformly in two directions. The lamellar structure can adapt well to any surface and is easy to fit with the optical engine 40, thereby conducting the heat generated by the optical engine 40 to the heat exchange area 23. In some embodiments, the heat conductor 51 can also be a metal foil layer, such as a copper foil layer, an aluminum foil layer, a silver foil layer, etc. The metal foil layer is easy to process and has a certain flexibility and ductility. It can fit well with the optical engine 40 and the heat exchange area 23, increase the contact area, and improve the heat exchange efficiency. It should be noted that the heat conducting member 51 may be a substantially planar configuration, and the heat conducting member 51 may also include one or more bent surfaces or other configurations, which is not limited in this embodiment.

[0034] Please continue reading Figure 4 , the heat-conducting member 51 can transfer the heat generated by the optical machine 40 to the heat exchange area 23, and then dissipate it through the heat dissipation pipe 52. The heat dissipation pipe 52 includes a first pipe 521 and a second pipe 522 connected end to end, the first pipe 521 and the second pipe 522 are connected to form one or more loops, the first pipe 521 is arranged in the frame 21, and the second pipe 522 can be in direct or indirect contact with the heat-conducting member 51 to achieve heat transfer and heat exchange. Specifically, in this embodiment, the second pipe 522 is arranged in the heat exchange area 23, and the second pipe 522 located in the heat exchange area 23 can exchange heat with the heat-conducting member 51 to transfer heat to the frame 21.

[0035] It should be noted that there may be one or more heat dissipation pipes 52. For example, when there is one optical engine 40, there may be only one heat dissipation pipe 52. When there are two optical engines 40, and the two optical engines 40 are respectively arranged in two heat exchange areas 23, there may also be multiple heat dissipation devices 50, and multiple heat dissipation devices 50 may be respectively arranged corresponding to one optical engine 40, so that each optical engine 40 can dissipate heat in a timely manner.

[0036] The heat dissipation pipe 52 is filled with a liquid medium, and the liquid medium can flow in the loop formed in the heat dissipation pipe 52, and then absorb heat in the heat exchange area 23, and bring the heat to other areas of the heat dissipation pipe 52 for heat dissipation. The liquid medium is preferably a liquid with a large specific heat capacity, which is conducive to rapid heat exchange in the heat exchange area 23. For example, the liquid medium can be selected from at least one of water, ethanol and ethylene glycol, that is, the liquid medium can be a pure substance of water, ethanol and ethylene glycol, or a mixture of any two or three. Water, ethanol and ethylene glycol have good fluidity and all have an increased specific heat capacity, which can quickly absorb heat and flow, thereby improving the heat exchange efficiency. It can be understood that in some other embodiments, the liquid medium can also be other liquids, for example, the liquid medium can also be a salt solution, etc., which is not specifically limited in this embodiment.

[0037] After the liquid medium in the second pipe 522 exchanges heat with the heat exchange area 23, the temperature of this part of the liquid medium increases, while the temperature of the liquid medium in the first pipe 521 is lower than that of the liquid medium in the second pipe 522. The temperature difference provides power for the flow of the liquid medium, driving the liquid medium in the second pipe 522 to flow into the first pipe 521, and then bringing heat to the first pipe 521, and diffusing it from the first pipe 521 to the frame 21. Since the area of ​​the frame 21 is relatively large, the heat can be dissipated quickly. At the same time, the liquid medium in the first pipe 521 flows in the opposite direction to the second pipe 522 for heat exchange and heat absorption, forming a flow cycle of the liquid medium.

[0038] When the heat generated by the optical engine 40 is not large, the temperature difference between the liquid medium in the first pipe 521 and the liquid medium in the second pipe 522 is small, so the driving force provided to the flow of the liquid medium is small, and the convection speed is slow. In order to increase the flow driving force of the liquid medium, in some embodiments, the heat dissipation device 50 may also include a micro pump 53, which may be arranged in the heat exchange area 23 and located on the loop formed by the heat dissipation pipe 52, that is, the micro pump 53 is connected to the heat dissipation pipe 52, and the micro pump 53 may be used to provide a driving force for the liquid medium in the heat dissipation pipe 52 to drive the liquid medium to flow in the loop in the heat dissipation pipe 52, thereby improving the heat exchange efficiency.

[0039] See also Figure 5The head mounted device 10 may further include a control unit 80, which is electrically connected to the micro pump 53 and used to control the opening or closing of the micro pump 53 and the output power of the micro pump 53. The micro pump 53 may be always kept in an open state, that is, always in a working state. In one embodiment, the control unit 80 is also electrically connected to the optical engine 40, and the control unit 80 controls the micro pump 53 to open only when the optical engine 40 is in an excitation state, that is, when the optical engine 40 is in a working state, and the control unit 80 controls the micro pump 53 to close when the optical engine 40 is in a non-working state. In one embodiment, the heat dissipation device 50 may further include one or more temperature sensors 70, and the temperature sensor 70 may be used to detect the temperature of the liquid medium in the heat dissipation pipe 52, and the control unit 80 may also control the micro pump 53 to adjust the output power according to the temperature of the liquid medium. Alternatively, the temperature sensor 70 may also be used to detect the temperature of the optical engine 40, and the control unit 80 may also control the micro pump 53 to adjust the output power according to the temperature of the optical engine 40, so that the liquid medium can maintain an appropriate circulation flow speed in the heat dissipation pipe 52.

[0040] Among them, the control unit 80 may include one or more processors and memories. The processor uses various interfaces and lines to connect various parts in the entire head-mounted device 10, and executes various functions and processes data of the head-mounted device 10 by running or executing instructions, programs, code sets or instruction sets stored in the memory, and calling data stored in the memory. Optionally, the processor can be implemented in at least one hardware form of digital signal processing (Digital Signal Processing, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). The processor can integrate one or a combination of a central processing unit (Central Processing Unit, CPU), a graphics processing unit (Graphics Processing Unit, GPU), and a modem. Among them, the CPU mainly processes the operating system, user interface, and application programs; the GPU is responsible for rendering and drawing display content; and the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor, but may be implemented separately through a communication chip.

[0041] The memory may include a random access memory (RAM) or a read-only memory (ROM). The memory may be used to store instructions, programs, codes, code sets or instruction sets. The memory may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for implementing at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the following various method embodiments, etc. The data storage area may also store data (such as a phone book, audio and video data, chat record data) created by the head mounted device 10 during use. The memory may store instructions for turning on / off the micro pump 53 and adjusting the output power, and the processor may call these instructions and control the micro pump 53 to perform corresponding operations.

[0042] The micro pump 53 can be arranged at any position of the wearable part 30 or the main body 20, and this embodiment does not limit this. In this embodiment, the micro pump 53 is arranged in the heat exchange area 23 and is located on the second pipe 522. On the one hand, the heat exchange area 23 has enough space to arrange the micro pump 53. On the other hand, the micro pump 53 is arranged in the arrangement area of ​​the second pipe 522, which can increase the flow rate of the liquid medium in the second pipe 522 and reduce power loss. It should be noted that the number of micro pumps 53 can be one or more.

[0043] In order to increase the heat dissipation effect of the first pipe 521, when the first pipe 521 is arranged in the frame 21, the length of the first pipe 521 can be extended as much as possible, so that the heat exchange area between the frame 21 and the air can be increased, and the heat exchange rate can be improved. At the same time, a larger volume of liquid medium can be accommodated to avoid the temperature of the liquid medium rising too fast. In one embodiment, the first pipe 521 can be arranged around the display unit 22, and the first pipe 521 can be provided with one or more bending structures during the extension process. The bending structure can be S-shaped, serpentine, Z-shaped, etc., which is not limited in this embodiment. This bending structure can have the effect of extending the length of the first pipe 521, and at the same time, it can play a role in slowing down the flow rate of the liquid medium, so that when the liquid medium flows to the position of the frame 21, the contact time between the frame 21 increases, the contact area increases, and it is conducive to faster transfer of heat to the frame 21, and then dissipation to the outside.

[0044] The first pipe 521 can be directly formed on the frame 21. For example, in a more specific embodiment, the first pipe 521 can be a copper pipe, which is directly arranged on the frame 21 or embedded in the frame 21. Specifically, during the preparation of the frame 21, the first pipe 521 can be formed in the frame 21 in advance. For example, in a more specific embodiment, see Figure 6The first pipe 521 can be formed in the following manner: the frame 21 pre-forms the mounting groove 211, and then forms a third metal layer 525 in the mounting groove 211 by plating or pasting. The third metal layer 525 can completely cover the wall surrounding the mounting groove 211, and then a fourth metal layer 526 is used to cover the mounting groove 211, and the third metal layer 525 is welded to form the first pipe 521, wherein the third metal layer 525 and the fourth metal layer 526 can be formed of materials such as copper and aluminum. The first pipe 521 can be formed on the inner side of the frame 21, or on the outer side of the frame 21. The inner side refers to the side of the frame 21 facing the user's eyes, and the outer side is the side opposite to the inner side. The fourth metal layer 526 can be kept flush with the surface of the frame 21, so that the appearance consistency of the entire frame 21 is better.

[0045] The longitudinal section of the first pipe 521 can be a roughly rectangular structure, and the thickness of the third metal layer 525 can be 100nm-500nm. If the thickness is too large, it will affect the structural strength of the frame 21. If the thickness is too small, the heat dissipation efficiency is not high enough. The width of the first pipe 521 can be 0.5mm-3mm. If the width is too small, the flow resistance of the liquid medium is too large, the flow rate is slow, and the heat dissipation efficiency is affected; if the width is too large, the width of the frame is too large, affecting the appearance effect and being too thick. The thickness of the first pipe 521 can be 0.1mm-0.5mm. If the thickness is too small, the flow resistance of the liquid medium is too large, the flow rate is slow, and the heat dissipation efficiency is affected; if the thickness is too large, it will affect the strength of the frame 21 and the reliability, wherein the thickness refers to the spacing between the third metal layer 525 and the fourth metal layer 526. It can be understood that in some other embodiments, the longitudinal section of the first pipe 521 can also be other configurations, which are not limited in this embodiment.

[0046] In one embodiment, please refer to Figure 7 and Figure 8, the second pipe 522 can be directly attached to the heat conducting member 51 to exchange heat. For example: the heat exchange area 23 is provided with a guide groove 231, and the second pipe 522 of the heat dissipation pipe 52 can be arranged in the guide groove 231, and the heat conducting member 51 covers the guide groove 231, so that the heat conducting member 51 is in direct contact with the heat dissipation pipe 52 to form heat exchange. The second pipe 522 includes a first metal layer 523 and a second metal layer 524, the first metal layer 523 is arranged in the guide groove 231 and covers the wall surrounding the guide groove 231, and the second metal layer 524 is connected and sealed with the first metal layer 523 to form the second pipe 522. For example, in a more specific embodiment, the second pipe 522 can be formed in the following manner: the heat exchange area 23 pre-forms a guide groove 231, and then a first metal layer 523 is formed in the guide groove 231 by plating or pasting. The first metal layer 523 can completely cover the wall surrounding the installation groove 211, and then the second metal layer 524 is used to cover the guide groove 231, and the first metal layer 523 is welded to the edge to form the second pipe 522, wherein the first metal layer 523 and the second metal layer 524 can be formed of materials such as copper and aluminum. The second metal layer 524 can be configured to be roughly flat and completely fit the heat conductor 51 for heat transfer. In one embodiment, the second metal layer 524 and the heat conductor 51 can also be made of the same material, for example, copper. During assembly, the heat conductor 51 and the second metal layer 524 are directly welded together to form a fixed body.

[0047] The longitudinal section of the second pipe 522 can be a roughly rectangular structure, and the thickness of the first metal layer 523 can be 100nm-500nm. If the thickness is too large, it will affect the structural strength of the frame 21. If the thickness is too small, the heat dissipation efficiency is not high enough. The width of the first pipe 521 can be 0.5mm-3mm. If the width is too small, the flow resistance of the liquid medium is too large, the flow rate is slow, and the heat dissipation efficiency is affected; if the width is too large, the width of the frame is too large, affecting the appearance effect and being too thick. The thickness of the second pipe 522 can be 0.1mm-0.5mm. If the thickness is too small, the flow resistance of the liquid medium is too large, the flow rate is slow, and the heat dissipation efficiency is affected; if the thickness is too large, it will affect the strength of the frame 21 and affect the reliability, wherein the thickness refers to the spacing between the first metal layer 523 and the second metal layer 524. It can be understood that in some other embodiments, the longitudinal section of the second pipe 522 can also be other configurations, which are not limited in this embodiment.

[0048] In order to improve the heat exchange efficiency between the second metal layer 524 and the heat conductor 51, the area of ​​the second metal layer 524 can be increased, so that the contact area between the second metal layer 524 and the heat conductor 51 is increased, so that the heat conducted by the heat conductor 51 can be transferred to the second metal layer 524 more quickly, and then absorbed by the liquid medium, so as to achieve the purpose of rapid cooling. In a more specific embodiment, the second metal layer 524 can be completely in contact with the heat conductor 51 extending to the heat exchange area 23. In another more specific embodiment, the second metal layer 524 can completely cover the heat exchange area 23, and the portion of the heat conductor 51 extending to the heat exchange area 23 is completely in contact with the second metal layer 524. By increasing the contact area between the second metal layer 524 and the heat conductor 51, the heat exchange efficiency can be improved, and the purpose of rapid cooling of the optical machine 40 can be achieved.

[0049] In another embodiment, see Fig. 9 The heat dissipation device 50 may further include a heat-conducting medium layer 54, which is filled between the heat-conducting member 51 and the second pipe 522, that is, the heat-conducting medium layer 54 is filled between the heat-conducting member 51 and the second metal layer 524. The heat-conducting medium layer 54 may be made of a material with a high thermal conductivity, for example, the heat-conducting medium layer 54 may be made of thermally conductive silicone grease, which has a high thermal conductivity and a certain viscosity, so that the heat-conducting member 51 and the second metal layer 524 can be bonded together, thereby facilitating assembly. The heat-conducting medium layer 54 formed by the thermally conductive silicone grease has a certain elasticity, so that during use, even if the head-mounted device 10 is hit, shaken, etc., the heat dissipation device 50 can still work stably.

[0050] Specifically, the heat-conducting medium layer 54 can be coated on the surface of the heat-conducting member 51 facing the second metal layer 524, and the area of ​​the heat-conducting medium layer 54 can be roughly equivalent to the area of ​​the portion of the heat-conducting member 51 located in the heat exchange area 23. The thickness of the heat-conducting medium layer 54 can be, for example, 0.1mm-0.5mm. The heat-conducting medium layer 54 can be pre-coated on the surface of the heat-conducting member 51 and integrally mounted on the heat exchange area 23, and then bonded to the second metal layer 524. When the heat dissipation device 50 is working, the heat-conducting member 51 transfers the heat generated by the optical machine 40 to the heat-conducting medium layer 54, and the heat-conducting medium layer 54 transfers the heat to the second metal layer 524, which is then absorbed by the liquid medium in the second pipe 522. The heat absorbed by the liquid medium is dissipated outward on the frame 21 as the liquid medium circulates.

[0051] In order to further improve the heat exchange efficiency between the liquid medium and the heat conducting medium layer 54, in one embodiment, refer to Fig.10, a plurality of protrusions 527 are formed on the surface of the second pipe 522 in contact with the heat-conducting medium layer 54, and the plurality of protrusions 527 are embedded in the heat-conducting medium layer 54, and the heat-conducting medium layer 54 covers the protrusions 527. The advantage of this arrangement is that the contact area between the second pipe 522 and the heat-conducting medium layer 54 can be increased, so that the heat transfer efficiency can be improved. Among them, the protrusions 527 can be formed by the thickness change of the second metal layer 524. In this embodiment, the protrusions 527 are formed by the shell of the second pipe 522 being recessed toward the heat-conducting member 51. Specifically in this embodiment, the second metal layer 524 serves as the shell of the second pipe 522, and is recessed toward the heat-conducting member 51 to form a plurality of protrusions 527. The protrusions 527 can also be formed at the position of the second metal layer 524 corresponding to the heat exchange area 23. In this embodiment, at least part of the protrusion 527 is formed at a position of the second metal layer 524 corresponding to the first metal layer 523, that is, the protrusion 527 is located in the second pipe 522. This arrangement can not only increase the contact area between the second metal layer 524 and the heat conductive medium layer 54, but also increase the volume in the second pipe 522, thereby increasing the storage capacity of the liquid medium, thereby increasing the amount of heat that the liquid medium can absorb.

[0052] Please continue reading Fig.10The longitudinal cross section of the protrusion 527 may be in any shape, and this embodiment does not specifically limit this. For example, in one embodiment, the longitudinal cross section of the protrusion 527 may be in any shape such as a rectangle or an ellipse. In this embodiment, the longitudinal cross section of the protrusion 527 is roughly arc-shaped, and in particular, the longitudinal cross section of the protrusion 527 may also be in an arc shape. The arc-shaped protrusion 527 is more convenient to process, and can be quickly processed by, for example, stamping. Furthermore, a content cavity 528 is formed in the protrusion 527, and the content cavity 528 has an opening 529 connected to the second pipe 522. The diameter of the opening 529 is smaller than the maximum diameter of the content cavity 528. Specifically, the longitudinal cross-section of the protrusion 527 is roughly arc-shaped, and the curvature of the arc-shaped protrusion 527 is between π and 2π, for example, 2π / 3. The advantage of this arrangement is that the opening 529 of the content cavity 528 of the protrusion 527 is smaller. When the liquid medium circulates in the second pipe 522, it enters the protrusion 527 through the opening 529. In the inner cavity 528, the liquid medium will flow along the inner wall of the protrusion 527 in the direction of its movement. Since the curvature of the arc-shaped protrusion 527 is greater than π and the diameter of the opening 529 is relatively small, when the liquid medium enters the inner cavity 528, an eddy current will be formed in the inner cavity 528, thereby decelerating the flow speed of the liquid medium, thereby extending the time from the liquid medium entering the inner cavity 528 to the liquid medium flowing out of the inner cavity 528. In this way, the liquid medium in the inner cavity 528 can more fully exchange heat with the second metal layer 524 and the heat conductive medium layer 54, thereby improving the heat exchange effect and efficiency.

[0053] The head mounted device 10 described above can be prepared in the following manner: a guide groove 231 is formed in advance in the heat exchange region 23 of the wearable portion 30, and then a first metal layer 523 is formed in the mounting groove 211 and the guide groove 231, and then a second metal layer 524 is attached to the heat exchange region 23, and is welded to the first metal layer 523 to form a second pipe 522. A mounting groove 211 is formed in advance at a predetermined position of the frame 21, and then a third metal layer 525 is formed in the mounting groove 211, and then a fourth metal layer 526 is attached to the mounting groove 211, and is welded to the third metal layer 525 to form a first pipe 521.

[0054] The wearable part 30 and the main body 20 are connected, and the connection between the first pipe 521 and the second pipe 522 is sealed and welded. When welding, a small hole is reserved first, and the heat dissipation pipe 52 is evacuated through the small hole, and then the liquid medium is injected into the heat dissipation pipe 52. After the liquid medium is injected, the heat dissipation pipe 52 is sealed and welded, and the liquid medium is encapsulated in the heat dissipation pipe 52. The heat conductive member 51 is attached to the optical machine 40 and the heat exchange area 23, and the heat conductive member 51 is directly in contact with the second metal layer 524 or indirectly in contact with it through the heat conductive medium layer 54 to form heat transfer.

[0055] The head-mounted device 10 provided in this embodiment is provided with a heat dissipation device 50 in the head-mounted device 10. The heat dissipation pipe 52 of the heat dissipation device 50 extends to the frame 21 of the main body 20. The heat generated by the optical engine 40 is guided to the heat exchange area 23 through the heat conductor 51, and heat is exchanged with the liquid medium in the heat dissipation pipe 52. The heat can be guided to the frame 21 of the main body 20, thereby increasing the convection heat dissipation area and achieving a faster heat dissipation purpose.

[0056] It is understandable that the non-conflicting technical means in the above embodiments can be combined and replaced with each other. In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the embodiments can be referenced to each other.

[0057] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A head mounted device, characterized in that: include: A main body, the main body comprising a frame and a display unit, the display unit being mounted on the frame; A wearing part, the wearing part is connected to the main body and is used for wearing; an optical machine, the optical machine being disposed at the wearable portion or the main body portion and configured to project image light toward the display portion; A heat dissipation device, the heat dissipation device comprising a heat conductive member and a heat dissipation pipe filled with a liquid medium, the heat conductive member being attached to the optical machine, the heat dissipation pipe comprising a first pipe and a second pipe connected end to end, the first pipe being arranged on the frame, and the second pipe being in direct or indirect contact with the heat conductive member.

2. The head mounted device according to claim 1, wherein: The heat dissipation device further comprises a micro pump, which is communicated with the heat dissipation pipeline and is used to provide driving force for the liquid medium.

3. The head mounted device according to claim 2, wherein: The micro pump is arranged on the main body or the wearable part.

4. The head mounted device according to claim 1, wherein: The second pipe is in direct contact with the heat conducting member.

5. The head mounted device according to claim 1, wherein: The heat dissipation device further comprises a heat-conducting medium layer, and the heat-conducting medium layer is filled between the heat-conducting member and the second pipe.

6. The head mounted device according to claim 5, characterized in that: A plurality of protrusions are formed on the surface of the second pipe in contact with the heat-conducting medium layer, and the protrusions are embedded in the heat-conducting medium layer.

7. The head mounted device according to claim 6, wherein: The protrusion is formed by the tube shell of the second pipe being recessed toward the heat conducting member.

8. The head mounted device according to any one of claims 4 to 7, characterized in that: The main body is provided with a heat exchange area, the heat exchange area is provided with a guide groove, and the second pipeline is arranged in the guide groove.

9. The head mounted device according to claim 8, wherein: The second pipeline includes a first metal layer and a second metal layer. The first metal layer is arranged in the guide groove and covers the wall surrounding the guide groove. The second metal layer is connected and sealed with the first metal layer to form the second pipeline.

10. The head mounted device according to claim 9, wherein: The second metal layer covers the heat exchange area and is opposite to the heat conducting member.

11. The head mounted device according to claim 9, wherein: The thickness of the first metal layer is 100nm-500nm.

12. The head mounted device according to claim 9, wherein: The cross section of the second pipe is rectangular, the width of the second pipe is 0.5 mm-3 mm, and the thickness of the second pipe is 0.1 mm-0.5 mm.

13. The head mounted device according to claim 6, wherein: The heat-conducting medium layer is formed by heat-conducting silicone grease.

14. The head mounted device according to claim 1, wherein: The liquid medium is selected from at least one of water, ethanol and ethylene glycol.

15. The head mounted device according to claim 1, wherein: The heat conducting member is a graphite sheet or a metal foil layer.

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