Immersed cooling system and method

Abstract

A method includes forming a cooling device by cooling a device in and through a first vessel of a submerged cooler; performing a semiconductor process by communicating information between a process tool and the cooling device; determining whether the cooling device is in a removable state from the immersion cooler; if the cooling device is not in the state, cooling the device through the immersed cooler; and removing the device from the first container if the cooling device is in the state, including: placing a second container over the first container; and when the second container covers the first container: opening a lid of the first container; and removing the device from the first container.

Description

Technical Field

[0001] The invention relates to an immersion cooling system and method. Background Art

[0002] The semiconductor integrated circuit (IC) industry has experienced exponential growth. Technological advances in IC materials and design have produced multiple generations of ICs, each with smaller and more complex circuits than the previous generation. Over the course of IC evolution, functional density (i.e., the number of interconnected devices per chip area) has generally increased, while geometry (i.e., the smallest component (or line) that can be created using a manufacturing process) has decreased. This downscaling process generally provides benefits by increasing production efficiency and reducing associated costs. This downscaling also increases the complexity of IC processing and manufacturing. For example, data centers that include a large number of servers support the planning and manufacturing of ICs. A single server can be cooled by passive cooling, air cooling, water cooling, or immersion cooling. For a variety of reasons, none of these cooling methods is sufficient. Summary of the invention

[0003] According to at least one embodiment, a method includes: forming a cooling device by cooling a device in and through a first container of an immersion cooler; performing a semiconductor process by transmitting information between a process tool and the cooling device; determining whether the cooling device is in a state where it can be removed from the immersion cooler; if the cooling device is not in the state, cooling the device through the immersion cooler; and if the cooling device is in the state, removing the device from the first container, including: placing a second container above the first container; and when the second container covers the first container: opening a lid of the first container; and removing the device from the first container.

[0004] According to at least one embodiment, a method includes: covering an immersion cooler with a container; positioning the container above the immersion cooler; opening a cover of the immersion cooler; and inserting a device into the immersion cooler; cooling the device by the immersion cooler; and performing a semiconductor process by transmitting information between a process tool and the device cooled by the immersion cooler.

[0005] According to at least one embodiment, a system includes: an immersion cooler having a storage tank and a lid covering the storage tank; a device located in the storage tank of the immersion cooler; an outer box; and a transport vehicle having a shell, wherein the transport vehicle, when in operation,: places the outer box above the storage tank; and when the outer box is located above the storage tank, removes the device from the storage tank and places the device into the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] When with the attached Figure 1 When read together, the drawings or the present invention can be best understood from the following detailed description. It should be noted that, in accordance with industry standard practice, the various features are not drawn to scale. In fact, the size of various features can be increased or decreased arbitrarily for the clarity of discussion.

[0007] Figure 1 is a schematic perspective view of a system for immersion cooling according to an embodiment of the present invention.

[0008] Figures 2 to 6 are multiple views of a system for immersion cooling according to various aspects of the present invention.

[0009] Figure 7 and Figure 8 are a plurality of method flow charts according to various aspects of the present invention.

[0010] Fig. 9 is a diagram for performing a semiconductor process according to various embodiments.

[0011] Description of Reference Numerals

[0012] 10, 20, 40, 50, 60, 90: System

[0013] 100: Storage tank

[0014] 110: Coolant

[0015] 120, 320: Steam

[0016] 130: Lid

[0017] 150: Server rack

[0018] 160:Frame

[0019] 200:Outer box

[0020] 230: Window

[0021] 330: Side wall

[0022] 340: Top wall

[0023] 350: Bottom wall

[0024] 400: Track

[0025] 410: Carrier / overhead suspension transport

[0026] 500: Transporter

[0027] 510:Robot Arm

[0028] 520: Pump

[0029] 530, 570: pipe

[0030] 540:Filter

[0031] 550:Wheels

[0032] 560: Shell

[0033] 600: Recirculation system

[0034] 900: Immersion Cooling Server Rack

[0035] 920:Semiconductor Process Tools

[0036] 10002000:Method

[0037] 1010, 1020, 1030, 1040, 1050, 1060, 2010, 2020, 2030, 2040, 2050: Action

[0038] H1: Height

[0039] D1: Length DETAILED DESCRIPTION

[0040] The present invention provides many different embodiments or examples for implementing the different features of the present invention. The following describes specific examples of components and arrangements to simplify the present invention. Of course, these are only examples and are not intended to be limiting. For example, the following description of forming a first feature on a second feature or on a second feature may include an embodiment in which the first feature and the second feature are formed to be in direct contact, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the present invention may reuse reference numbers and / or letters in various examples. This repetition is for the purpose of brevity and clarity, rather than representing the relationship between the various embodiments and / or configurations discussed.

[0041] In addition, for ease of description, spatially relative terms such as "beneath," "below," "lower," "above," "upper," and the like may be used herein to describe the relationship of one component or feature illustrated in the figures to another (other) component or feature. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0042] For the convenience of description, the terms "about", "roughly", "substantially", etc. may be used herein. A person with ordinary knowledge in the relevant technical field will be able to understand and deduce the meaning of these terms.

[0043] Semiconductor manufacturing generally involves forming electronic circuits by performing multiple depositions, etchings, anneals, and / or implantations of material layers, thereby forming a stacked structure including many semiconductor devices and interconnections therebetween. Other support processes may be performed before and after semiconductor manufacturing. For example, simulation and modeling, design and layout, supply chain management, quality control, energy management, research and development, security and data protection, inventory and logistics management, and customer support are all functions that provide support for semiconductor process operations in a semiconductor foundry. The semiconductor process itself, as well as the support functions just mentioned, can utilize the computing power of a data center.

[0044] In short, the components of a data center can include physical infrastructure, servers and hardware, network equipment, data storage systems, cooling systems, power infrastructure, security hardware / software, and monitoring and management systems. A data center should have high availability and redundancy, as well as good scalability, which is conducive to providing continuous support for various semiconductor processes and supporting functions.

[0045] Immersion cooling is a cooling technique used in data centers and high-performance computing (HPC) environments in which electronic components such as servers or graphics processing units (GPUs) are submerged in a non-conductive liquid coolant rather than using air-based cooling methods. There are several benefits to using immersion cooling. These include improved cooling efficiency, increased power density, reduced energy consumption, silent operation, extended hardware life, heat reuse opportunities, reduced data center footprint, safety and environmental benefits, and easier hardware maintenance. However, immersion cooling also has its own set of challenges and considerations, such as initial setup costs, potential leak risks, and compatibility with existing hardware. For example, to cool a server in operation, the server can be submerged in a tank filled with a dielectric coolant. When the coolant becomes hot, the coolant can undergo a phase change from liquid to vapor to effectively remove heat. However, when the server is to be removed, such as for inspection or replacement, the lid of the tank is opened to access the server. During this process, coolant vapor may escape into the open environment, which may present safety and / or environmental contamination issues.

[0046] In an embodiment of the present invention, an enclosure is placed above the tank, and when the lid is opened, the enclosure completely covers the tank. The enclosure is conducive to confining the coolant vapor within the enclosure without escaping to the external environment. The enclosure can be mobile so that it can be removed after the server removal, installation or exchange operation is completed. This is also conducive to sharing an enclosure between a large number of tanks. A robotic arm can be present in the enclosure to perform selected functions, such as removing a failed server from the tank. The enclosure can also include a pump that can exhaust vapor and establish a negative pressure environment that is conducive to allowing the lid to be opened. The enclosure can be integrated or used with an automated materials handling system (AMHS), such as overhead transport (OHT). The enclosure may include a filtration system that can filter the coolant vapor in the enclosure. The enclosure may include a recirculation system, such as a condenser, which can condense the vapor and store it in the tank for reuse.

[0047] Figure 1 is a schematic perspective view of a cooling system 10 according to various embodiments. Figure 1 and one or more components may be omitted from the view for clarity of illustration.

[0048] The cooling system or "system" 10 includes a tank or "first container" 100 and a cover 130. The tank 100 can be partially filled with a liquid coolant or "coolant" 110. The coolant 110 can be a dielectric coolant. One or more server racks 150 (or high-performance computing (HPC) systems) can be placed in the box 100 and immersed in the coolant 110. The upper portion of the outer box 100 can be substantially free of liquid coolant 110, but coolant vapor 120 and air can be present therein. The cover 130 covers the tank 100 and prevents the vapor 120 from escaping to the surrounding atmosphere or environment. In some embodiments, the cooling system 10 is an immersion cooling system. In some embodiments, the immersion cooling system is a single-phase, two-phase cooling system, or a multi-phase cooling system. When the coolant 110 becomes hot due to the heat of the server rack 150 components, the coolant 110 undergoes a phase change (e.g., from liquid to gas) and effectively removes heat. For example, the coolant 110 may have a boiling point in the range of about 50° C. to about 60° C. The vapor 120 rising through the coolant 110 stirs the coolant 110 to cool the surface of the server rack 150. The cooling system 10 may further include a condenser located in the upper portion of the storage tank 100, which condenses the vapor 120 into a liquid that falls back to the coolant 110. To simplify the description, Figure 1 The condenser is not shown separately.

[0049] The server rack 150 or high performance computing system may include one or more of a motherboard, a central processing unit (CPU), a random access memory (RAM), storage drives, a graphics processing unit (GPU), network interface cards, interconnects, and cables. Some or all components of the server rack 150 may be immersed in the coolant 110. In some embodiments, the server rack 150 may be electrically connected to a passive device, an amplifier, a filter, a memory, a combination thereof, etc., which may be immersed in the coolant 110 or may be outside the coolant 110. The passive component may include an inductor, a capacitor, or a resistor.

[0050] When the server rack 150 is removed from the tank 100 for inspection, replacement, or removal, the tank's lid 130 is opened to provide access to the server rack 150. During this process, coolant vapor 120 may escape into the open environment, which may be a safety or environmental issue. In an embodiment of the present invention, a second container or "enclosure" 200 is placed above the tank 100 so that when the lid 130 is opened, the vapor 120 is contained within the enclosure 200 and does not escape into the surrounding environment.

[0051] Figure 2 is a schematic perspective view of a system 20 including a master box 200 according to various embodiments. Figure 3 is a schematic side view of system 20 .

[0052] System 20 includes a storage tank 100 which is similar in most respects to that described above with reference to Figure 1 The described storage tank 100 is substantially the same or similar. In some embodiments, when the lid 130 is opened, the outer box 200 completely covers the storage tank 100. In some embodiments, when the lid 130 is opened, the outer box 200 substantially covers the storage tank 100. The outer box 200 helps to form a boundary that limits the diffusion of the vapor 120.

[0053] exist Figure 3 In the embodiment of the present invention, the outer box 200 covers the tank 100. The outer box 200 may have a plurality of side walls 330 and a top wall 340. The outer box 200 may include a bottom wall 350. In some embodiments, the bottom wall 350 has an opening or cutout through which the tank 100 and / or the lid 130 may extend before the lid 130 is opened. The opening has a larger profile than the cross-sectional view of the tank 100. In some embodiments, the bottom wall 350 is not present, which may facilitate easier positioning of the outer box 200 on the tank 100. That is, the outer box 200 may be a "semi-enclosed" outer box 200. On the other hand, the presence of the bottom wall 350 may facilitate improved containment of the vapor 320 inside the outer box 200. The plurality of side walls 330, a top wall 340, and the optional bottom wall 350 may be collectively referred to as "a plurality of walls". The vapor 320 is the same as the vapor 120 except that the vapor 320 is in the outer box 200 and the vapor 120 is in the tank 100.

[0054] The plurality of walls 330, 340, 350 may be steel or include steel, such as stainless steel, powder coated steel, etc. In some embodiments, the plurality of walls 330, 340, 350 include aluminum, which may be advantageous in reducing the weight of the outer box 200. In some embodiments, the plurality of walls 330, 340, 350 include plastic, such as polypropylene, etc., which may be advantageous in further reducing the weight of the outer box 200. The plurality of side walls 330 may have a height H1 that exceeds the length D1 of the lid 130. That is, the height H1 is large enough so that the lid 130 has sufficient clearance to open completely vertically within the outer box 200.

[0055] One or more of the multiple walls 330, 340, 350 may include a window 230, which may be transparent. The window 230 may be or include tempered glass, safety glass, acrylic resin, plastic, etc. Multiple inner surfaces of the outer box 200 may include one or more linings, such as polypropylene, etc. The window 230 facilitates an operator or camera to observe the storage tank 100 and / or the robot arm 510 (see FIG. 1 ) during the removal, replacement, or installation of the server rack 150. Figure 5 ) operation.

[0056] In the system 20, the server rack 150 may be mounted to a frame or platform 160 within the tank 100. The frame or platform 160 may be operable to securely hold the server rack 150 and position the server rack 150 at a selected depth in the coolant, which facilitates the server rack 150 to remain stable and properly immersed in the coolant 110, thereby allowing multiple electronic components to effectively transfer heat and cool. The server rack 150 is securely attached to the frame or platform 160 to prevent movement or displacement during the cooling process. In some embodiments, the system 20 has an adjustable platform or bracket to accommodate different server rack sizes, or may have multiple fixed mounting points for a selected server rack model. This facilitates providing proper support and stability for the mounting system so that multiple servers are fully immersed and there are no gaps or air gaps between the multiple servers and the coolant. Proper immersion improves cooling efficiency and achieves the benefits of immersion cooling, such as improved heat dissipation and reduced energy consumption.

[0057] Figure 4 A system 40 according to various embodiments is depicted. The system 40 includes a storage tank 100 and an outer tank 200, and also includes a track 400 and a carrier 410 of an overhead transport (OHT) system.

[0058] Overhead suspension transport system is a beneficial component of automated material handling system for semiconductor manufacturing, logistics and warehousing. Overhead suspension transport system is designed to automatically transport materials, products or goods between different locations in the factory, usually using overhead track or railway system. Overhead suspension transport system may include one or more (overhead suspension transport 410) transport vehicles. Overhead suspension transport is an automatic transport vehicle that travels along overhead track 400. Overhead suspension transport 410 may include wheels or rollers that engage with track 400 to move smoothly. Overhead suspension transport 410 can be configured to transport various types of loads, including semiconductor wafer carriers, pallets, containers, or in an embodiment, outer box 200.

[0059] The overhead track 400 is a structure installed on the ceiling or overhead of the plant. The track 400 may include a track or guide path for guiding the movement of the overhead suspended transport 410. The track layout can be selected to suit the layout of the plant and the material flow operation. The overhead suspended transport 410 may be equipped with a guidance and control system that is conducive to accurate navigation along the overhead track 400. Various technologies can be used for this purpose, such as laser-based positioning, magnetic sensors or optical markers. The overhead suspended transport 410 is equipped with a load handling mechanism (e.g., outer box 200) selected to facilitate the material or product it transports. The load handling mechanism may include lifters, clamps or vacuum-based systems to securely fix and move the outer box 200. The overhead suspended transport 410 can be controlled by a central control system or an overall software platform that manages the movement and coordination of multiple overhead suspended transports. The control system optimizes material flow, coordinates traffic and reduces waiting time and collisions. At the loading station, materials or products such as outer boxes 200 are placed on the overhead suspended transport. This can be done manually (e.g., by an operator) or automatically (e.g., by a robot arm). Once loaded, the overhead suspended transport 410 moves along the overhead track following a selected route to transfer the outer box 200 to the storage tank 100 or a nearby unloading station. At the unloading station, the overhead suspended transport 410 can safely store the outer box 200. The overhead suspended transport system is conducive to a high level of coordination and synchronization. Multiple overhead suspended transports can run simultaneously, thereby improving material flow efficiency and reducing idle time.

[0060] In some embodiments, the outer box 200 can be transported by an overhead suspended transport system and / or positioned above the tank 100. For example, an overhead suspended transport or "carrier" 410 can be operable to move along the track 400, and the outer box 200 can be mounted to the carrier 410 for movement. This advantageously allows a single outer box 200 to serve more than one tank 100. In some embodiments, the outer box 200 is attached to the track 400 by the carrier 410 during removal, installation, or replacement of the server rack 150. In some embodiments, the carrier 410 transfers the outer box 200 to the tank 100, but then transfers the outer box 200 to another mount or cart located on the floor rather than overhead (e.g., attached to the ceiling). During the removal, installation, or replacement operation, keeping the outer box 200 attached to the overhead suspended transport 410 may be advantageous in simplifying the positioning of the outer box 200 above the tank 100, because the outer box 200 can be lowered above the tank 100, rather than extended above the tank 100, to clear the lid 130 and any components protruding upward therefrom (e.g., handles). Once the removal, installation, or replacement operation is completed, the carrier 410 can remove the outer box 200 from above the tank 100 and transport the outer box 200 to another tank or storage. For example, the carrier 410 can raise or retract the outer box 200 to clear the tank 100 and then move the outer box 200 along the railroad 400 to another tank or unloading station.

[0061] Figure 5 is a diagram of a system 50 according to various embodiments. Figure 5 , the outer box 200 is transported to the storage tank 100 by a transport vehicle 500. The transport vehicle 500 may include one or more of a robot arm 510, a pump 520, and a filter 540. The transport vehicle 500 may have a housing 560 mounted on wheels 550. The transport vehicle 500 may be movable to transport the outer box 200 to the vicinity of the storage tank 100 and to maintain the outer box 200 in a position above the storage tank 100 during removal, installation, or replacement operations. The pump 520, the filter 540, and the robot arm 510 may be mounted in the housing 560.

[0062] The transport vehicle 500 may have a payload capability and may include an outer box 200, a robotic arm 510, and an optional pump 520, filter 540, and / or a recirculation system 600 (eg, Figure 6). The dimensions of the transporter 500 are selected to facilitate the transporter 500 to navigate through narrow aisles and limited spaces within a semiconductor manufacturing plant. The length, width, and height can facilitate the efficient movement and carrying of the outer box 200. The transporter 500 can move at a controlled and consistent speed when transporting the outer box 200. The acceleration and deceleration are selected to prevent damage to the outer box 200 and surrounding equipment and / or injury to the operator. The transporter 500 may include a navigation and control system that facilitates accurate positioning and collision avoidance within the manufacturing plant environment. The navigation and control system may include a laser or vision-based guidance system, a sensor, and an automatic control algorithm. The transporter 500 may comply with clean room standards so that the transporter 500 does not generate particles or contaminants that affect the cleanliness of the chip. To this end, the transporter 500 is equipped with selected filters and materials to maintain a clean environment. The transporter 500 may be equipped with a reliable and gentle load handling system to firmly grasp and transport the outer box 200 without causing any damage to the outer box 200 or the storage tank 100. The transporter 500 may be able to seamlessly communicate and integrate with the central control system or manufacturing execution system (MES) of the manufacturing plant, which is conducive to effective work scheduling, tracking and coordination with other equipment and processes. The transporter 500 may include safety features that are conducive to protecting personnel and preventing accidents, and may include an emergency stop button, obstacle detection and fail-safe mechanisms. The transporter 500 may be powered by one or more batteries. For battery-powered transporters 500, the battery life can be selected to meet the operating parameters of the manufacturing plant. High-efficiency charging stations can be set up in the manufacturing plant to reduce downtime caused by battery charging. In some embodiments, the transporter 500 does not include a motor, but is moved by an operator.

[0063] The robotic arm 510 is operable to grasp the server rack 150, remove the server rack 150 from the tank 100, and place the server rack 150 in the housing 560. During the installation operation, the robotic arm 510 is operable to grasp the server rack 150 in the housing 560, transport the server rack 150 into the tank 100, and install the server rack 150 in the frame or platform of the tank 100.

[0064] The robot arm 510 can be a multi-jointed robot arm designed to mimic human arm movements, with three to six degrees of freedom, allowing the robot arm 510 to move in multiple directions and rotate around different axes. The robot arm 510 can be mounted on a fixed base or mounted on a mobile platform, such as a transporter 500 or an overhead suspended transport 410. The robot arm 510 may include an end effector or a gripper, which is selected to firmly hold and transport the server rack 150 without causing damage or contamination. In some embodiments, different types of grippers can be used, such as vacuum-based grippers, edge-grip grippers, or a combination of vacuum and edge grippers. Typically, because the robot arm 510 is operated in an immersion environment, the robot arm 510 includes an edge gripper. The robot arm 510 can be controlled by a complex system that facilitates operation with high precision and accuracy, coordinating its movement with other equipment during removal, installation or replacement. The robotic arm 510 may include a vision system and sensors that facilitate mapping the position and orientation of the server rack 150, so that the robotic arm 510 can pick up the server rack 150 and place it at a precise location, for example, in the housing 560. In some embodiments, the robotic arm 510 includes one or more of a distance sensor, a gyroscope sensor, an acceleration sensor, a lens and / or a camera, etc. The robotic arm 510 may include safety features such as collision detection and emergency stop that facilitate a safe working environment. The robotic arm 510 can be integrated into a central control system or manufacturing execution system of a semiconductor manufacturing plant or data center to communicate with other equipment and maintain a clean room compatible environment. In the above description, the robotic arm 510 is operated to remove, replace or install a server rack 150 in the tank 100. In some embodiments, the robotic arm 510 can remove, replace or install other components in the tank 100, such as the frame 160, optical fibers or other components.

[0065] The robot arm 510 is generally operable to extend into the tank 100 and be mounted in the cart 500 or the overhead suspended transport 410. Therefore, the bottom wall 350 of the outer box 200 may include one or more second openings located above the cart 500. The second opening(s) may include a single opening of substantially the same size as the horizontal cross-sectional view profile of the cart 500, so that the housing 560 and the interior of the outer box 200 are a single connected space. In some embodiments, the bottom wall 350 may cover the cart 500 and may include a plurality of second openings corresponding to the size of the robot arm 510 and / or the tube 530 connected to the pump 520. That is, the pump 520 may reduce the pressure inside the outer box 200 without substantially reducing the pressure inside the housing 560 of the cart 500.

[0066] The pump 520 is mounted in the transport vehicle 500 and can be connected to the outer box 200 via a tube 530 extending from the pump 520 to the outer box 200. The pump 520 can be a mobile vacuum pump that is conducive to creating and maintaining a vacuum or near-vacuum environment in the outer box 200. One advantage of a mobile vacuum pump is portability, allowing the pump 520 to be easily moved and set at different locations within the factory or even between different locations. The pump 520 can include wheels and have a compact design, making it easy to transport and place in different work areas. In some embodiments, the pump 520 includes a motor drive system that draws air and / or gas (e.g., steam 120) from the outer box 200, thereby effectively reducing the pressure to a selected vacuum level. In some embodiments, the pump 520 is a rotary vane pump, a diaphragm pump, a scroll pump, etc. The flow rate and vacuum capacity of the pump 520 that are conducive to the environment of the outer box 200 can be selected. The pump 520 may be equipped with safety features and monitoring systems to control and / or monitor vacuum conditions to prevent contamination or adverse effects on the process.Creating a vacuum, near-vacuum, or reduced pressure environment in the outer box 200 may be beneficial in reducing the force applied to open the lid 130. Figure 5 A single pump 520 is depicted. In some embodiments, two or more pumps 520 are placed in housing 560 and communicate with outer tank 200 to reduce the pressure in outer tank 200.

[0067] The filter 540 can be connected to the outer box 200 by a tube 570. The filter 540 can be a gas phase filter that facilitates the capture and removal of volatile organic compounds (VOCs), gases, and other impurities present in the coolant 110 vapor 120. These impurities may be caused by outgassing of materials in the cooling system 20 or by the electronic components themselves. The filter 540 may contain an adsorbent material, such as activated carbon or other selected media, which has a large surface area and is capable of adsorbing gases and volatile organic compounds. When the coolant vapor 120 passes through the filter 540, the adsorbent material captures and retains impurities, allowing only clean vapor 120 to continue its circulation in the cooling system 20. The gas phase filter is typically located in the transport vehicle 500, but can also be located in the transport vehicle 500. In some embodiments, it can be integrated into the outer box 200. The filter 540 can be replaced regularly to maintain efficiency. In some embodiments, the filter 540 is integrated with the pump 520, rather than as a separate component installed in the transport vehicle 500. In such an embodiment, tube 570 may be omitted.

[0068] The robotic arm 510, pump 520, and filter 540 can all be powered by electricity. In some embodiments, the cart 500 includes an internal power supply, such as a battery that provides power to the robotic arm 510, pump 520, and filter 540. In some embodiments, the cart 500 includes an electrical cord that allows the robotic arm 510, pump 520, and filter 540 to be powered by the main electrical grid, for example by plugging into an electrical outlet in a manufacturing plant.

[0069] exist Figure 6, a system 60 is depicted according to various embodiments. In some embodiments, the transport vehicle 500 has a recirculation system 600 therein. The recirculation system 600 may include one or more condensers for condensing the vapor 120 within the housing 560 and for storing the liquid coolant formed by the condenser from the vapor 120. The condenser is a beneficial component responsible for effectively removing heat from the vapor 120. When the coolant 110 circulates through the storage tank 100 and contacts the hot electronic components of the server rack 150, the coolant 110 absorbs heat and evaporates into the vapor 120. The condenser is operable to cool and condense the vapor 120 back to a liquid state (e.g., coolant 110), allowing the coolant 110 to recirculate and continue the cooling process. The condenser may be located within the housing 560 and may be provided with a cooling medium, such as water or air. The evaporated coolant (vapor 120) flows through or over the condenser coils, wherein the vapor 120 loses heat to the cooling medium, causing the vapor 120 to condense back to a liquid form (e.g., coolant 110). The coolant 110 then returns to the storage tank 100 to cool the server racks 150 again, completing the cooling cycle.

[0070] In some embodiments, the recirculation system 600 includes a reservoir that stores the coolant 110 formed by the vapor 120 by means of a condenser. The reservoir can be made of a material that is chemically compatible with the coolant 110. The coolant 110 is typically a dielectric fluid, such as a mineral oil-based or synthetic fluid. Materials such as stainless steel, polypropylene, or high-density polyethylene (HDPE) may be suitable for storing these types of coolants 110. The reservoir may be a barrel or container that is fluidly connected to the condenser. In some embodiments, the recirculation system 600 is integrated with or directly connected to the pump 520. In some embodiments, the recirculation system 600 is a separate system that is not connected to the pump 520 but operates independently of it. When connected to the pump 520, the air discharged from the outer box 200 including the vapor 120 can be transported to the condenser and converted into liquid coolant 110 stored in the reservoir.

[0071] Although systems 50 and 60 are depicted as including different components, it should be understood that systems 50 and 60 may include one or more components of the other system. For example, system 60 may include filter 540 and recirculation system 600. That is, transport vehicle 500 may have robot arm 510 and one or more of pump 520, filter 540, and recirculation system 600 located in housing 560 thereof.

[0072] Figure 7 and Figure 8 Flowcharts of methods 1000 , 2000 for processing a semiconductor device are shown according to various aspects of the present invention. Figure 7 and Figure 8 The actions shown can be based on the reference Figures 2 to 6 and Fig. 9 The described system 20, 40, 50, 60 or system 90 is performed. Figure 7 and Figure 8 Flowcharts of methods 1000, 2000 for processing semiconductor devices are depicted in accordance with one or more aspects of the present invention. Methods 1000, 2000 are examples and are not intended to limit the present invention to what is explicitly depicted in methods 1000, 2000. Additional actions may be provided before, during, and after methods 1000, 2000, and some of the described actions may be replaced, eliminated, or moved to other embodiments of the method. For example, methods 1000, 2000 may also be used to remove, replace, or install server racks in a data center that does not participate in semiconductor processing by omitting actions 1020 and 2050 from methods 1000, 2000, respectively. For simplicity, not all actions are described in detail herein. For example, actions associated with detailed manufacturing operations of IC dies on a wafer are omitted from the view and are not described in detail herein. Similarly, for example, actions associated with the segmentation and packaging of IC dies after methods 1000, 2000 are also omitted from the view and are not described in detail herein. The following references Figures 2 to 6 and Fig. 9 The actions of the methods 1000, 2000 are described with reference to the components of the systems 20, 40, 50, 60, and 90. It should be understood that the methods 1000, 2000 are not limited to being performed by the systems 20, 40, 50, 60, and 90, and may be performed by systems that differ in one or more aspects from the systems 20, 40, 50, 60, and 90 in other embodiments.

[0073] Fig. 9 A system 90 for performing semiconductor processing is depicted according to various embodiments. In the system 90, an immersion-cooled high-performance computing device 900 communicates data with a semiconductor process tool 920. In some embodiments, the high-performance computing device 900 may be a server rack 150 and may control and / or provide information to the semiconductor process tool 920. The high-performance computing device 900 may receive output data, such as metrology data, from the semiconductor process tool 920.

[0074] The semiconductor process tool 920 may be or include an etch tool, a deposition tool, a lithography tool, a metrology tool, a chemical mechanical planarization (CMP) tool, a rapid thermal processing (RTP) tool, an ion implantation tool, a chemical vapor deposition (CVD) tool, a physical vapor deposition (PVD), an atomic layer deposition (ALD) tool, an annealing tool, a wet processing tool, a plasma ashing tool, a wafer bonding tool, an inspection tool, a defect inspection tool, a chemical delivery system (CDS) tool, a gas delivery system (GDS) tool, a wafer detection tool, an automatic test equipment (ATE) tool, an advanced packaging equipment tool, etc.

[0075] In some embodiments, the high performance computing device or server rack 900 communicates data with one or more of the semiconductor process tools 920 described above via a data network. For example, the immersion cooling server rack 900 can be connected to a data center network, which includes switches, routers and other network devices. The data center network allows the server rack to communicate with other servers, storage systems and external resources. The server rack can communicate indirectly with the semiconductor process tool 920 through the data center network. Data transmission between the server rack and the process tool is carried out through the network infrastructure. In a semiconductor manufacturing plant, the semiconductor process tool 920 may be part of an automated production line, and their operation is managed by a central control system or manufacturing execution system. The control system sends commands and instructions to the semiconductor process tool 920 based on data received from various sources including the immersion cooling server rack 900. The immersion cooling server rack 900 can process data and perform various computing tasks that are beneficial to semiconductor processing. The immersion server rack 900 can generate data related to simulation, data analysis or other processing steps that are beneficial to semiconductor manufacturing. The communication between the immersion cooling server rack 900 and the semiconductor process tool 920 can follow a standard data exchange protocol, such as the Transmission Control Protocol (TCP) / Internet Protocol (IP). The immersion cooling server rack 900 can also be connected to a storage system or database for storing and retrieving data related to the semiconductor manufacturing process.

[0076] exist Figure 7 In the method 1000, the device is cooled by immersion cooling in a first container. The device can be a server rack or a high performance computing device 150. The device 150 is immersed in a coolant 110 in a tank 100. The first container can be a tank 100. As shown in reference Figure 1 and Figure 2 As described, the device 150 can be cooled in the tank 100. For example, the device 150 can be cooled by the coolant 110, which has a boiling point in the range of about 50 degrees Celsius to about 60 degrees Celsius. The vapor 120 can be generated by the heat of the electronic components of the server rack 150. The vapor 120 bubbles and stirs the coolant 110, further distributing the coolant 110 on the surface of the server rack 150.

[0077] Following act 1010 is act 1020. When the device is cooled, a semiconductor process is performed using the cooled device in act 1020. As described above, the server rack 150, 900 provides data, instructions, recipes, or other information to a semiconductor process tool 920 that is used in processing wafers to form IC devices.

[0078] The wafer may be or include a semiconductor device. The semiconductor device may be any semiconductor device, such as but not limited to a logic device, a memory device, or any other semiconductor device. The semiconductor device typically includes a semiconductor device layer, a frontside interconnection structure, an optional backside interconnection structure, and one or more electrical contacts. In most embodiments, the wafer is a semiconductor wafer having a plurality of integrated circuit chips or grains formed therein. The semiconductor device layer may include a semiconductor substrate, which may be referred to as a substrate. The substrate may be any suitable substrate. In some embodiments, the substrate may be a semiconductor wafer. In some embodiments, the substrate may be a monocrystalline silicon (Si) wafer, an amorphous silicon (amorphous Si) wafer, a gallium arsenide (GaAs) wafer, or any other semiconductor wafer.

[0079] The semiconductor device layer includes one or more semiconductor devices. The semiconductor device included in the semiconductor device layer may be any semiconductor device in various embodiments. In some embodiments, the semiconductor device layer includes one or more transistors, which may include any suitable transistor structure, including, for example, a planar transistor, a fin transistor (fin field effect transistor) or a nanostructure transistor, such as a gate-all-around (GAA) transistor, etc. In some embodiments, the semiconductor device layer includes one or more GAA transistors. In some embodiments, the semiconductor device layer may be a logic layer including one or more semiconductor devices, and may also include their interconnection line structure, which is configured and arranged to provide logical functions, such as AND, OR, XOR, XNOR or NOT, or storage functions, such as flip-flops or latches. In some embodiments, the semiconductor device layer may include a memory device, which may be any suitable memory device, such as a static random access memory (SRAM) device. The memory device may include a plurality of memory cells constructed in rows and columns, but other embodiments are not limited to this arrangement. Each memory cell may include a plurality of transistors (e.g., six) connected between a first voltage source (e.g., VDD) and a second voltage source (e.g., VSS or ground) such that one of two storage nodes may be occupied by information to be stored, while complementary information is stored at the other storage node. The semiconductor device layer of the device may also include various circuits electrically coupled to the semiconductor device layer. For example, the semiconductor device layer may include power management or other circuitry electrically coupled to one or more semiconductor devices of the semiconductor device layer. The power management circuitry may include any suitable circuitry for controlling or otherwise managing communication signals (e.g., input power signals) to or from semiconductor devices of the semiconductor device layer. In some embodiments, the power management circuitry may include power-gating circuitry that may, for example, reduce power consumption by cutting off current to unused circuit diagrams (e.g., diagrams or electrical features in the semiconductor device layer), thereby reducing standby or leakage power. In some embodiments, the semiconductor device layer includes one or more switching devices, such as multiple transistors, which are used to transmit electrical signals to or receive electrical signals from semiconductor devices in the semiconductor device layer, such as turning on and off circuits of the semiconductor device layer (e.g., transistors, etc.).

[0080] Semiconductor processes may include reference Fig. 9 Any process performed by the semiconductor process tool 920 described herein. For example, the semiconductor process may include development, etching, deposition (e.g., chemical vapor deposition, physical vapor deposition, atomic layer deposition), rapid thermal annealing, plasma ashing, etc. One or more parameters, schedules, or instructions related to the semiconductor process may be provided by the server rack 150, 900 to the semiconductor process tool 920.

[0081] After action 1020 is action 1030. During or after the semiconductor process operation in action 1020, it is determined in action 1030 whether the device (e.g., server rack 150) is in a removable state. For example, server rack 150, 900 may be selected for removal due to failure, routine maintenance, or other suitable reasons. For when server rack 150 is not scheduled for removal, method 1000 returns to action 1010, where server rack 150 continues to be cooled, and the semiconductor process proceeds to action 1020 using server rack 150. For when server rack 150 is selected for removal, method 1000 proceeds to action 1040. In some embodiments, the device will be exchanged from one frame to another frame in the same tank. For example, server rack 150 can be separated from frame 160 and installed in another different frame in tank 100. In such an embodiment, server rack 150 can be completely or partially continuously immersed throughout the exchange operation. The exchange can be performed by robot arm 510.

[0082] When the server rack or high performance computing device 150, 900 is to be removed from the storage tank 100, action 1030 is followed by action 1040. In action 1040, the storage tank 100 is covered with a second container (e.g., outer box 200), which is advantageously to contain the vapor 120 evaporated from the coolant 110. The storage tank 100 can be covered by reference Figures 2 to 6 The outer box 200 may be covered by any of the methods described above. For example, the outer box 200 may be lowered to a position above the tank 100 by an overhead suspension transport 410. In another embodiment, the outer box 200 may be placed above the tank 100 by a transport vehicle 500. In some embodiments, the outer box 200 includes a bottom wall 350 having an opening corresponding to the tank 100. The outer box 200 may be lowered to the top of the tank 100 under the guidance of an optical guidance system. For example, the outer box 200 may have one or more cameras attached thereto that capture images of the tank 100 or identification marks (such as visible patterns, etc.). The outer box 200 may be lowered to a position where the bottom wall 350 is substantially coplanar with the lid 130 of the tank 100. In some embodiments, the outer box 200 is lowered to a position slightly below the upper surface of the tank 100.

[0083] Action 1040 is followed by action 1050. In action 1050, after covering the first container with the second container, the lid of the first container is opened. For example, after placing the outer box 200 over the tank 100, the lid 130 of the tank 100 is opened. This has the advantage of containing any vapor 120 that may escape the tank 100 in the outer box 200 above the tank 100. In some embodiments, the lid 130 may be opened before placing the outer box 200 over the tank 100, but some vapor 120 may escape to the surrounding environment. However, some benefits are still obtained because the outer box 200 is located above the open tank 100 during most of the time that the robotic arm 510 spends performing the removal, replacement, or installation operation.

[0084] Action 1050 is followed by action 1060. In action 1050, after the lid is opened, the device is removed from the first container. For example, the robot arm 510 grasps the server rack or high-performance computing device 150 immersed in the coolant 110 in the tank 100, and then the robot arm 510 transports the server rack 150 to the housing 560.

[0085] Additional actions may be performed after action 1060. For example, after the server rack 150 is placed in the housing 560 of the transport vehicle 500 or in the overhead suspended transport 410 by the robot arm 510, the transport vehicle 500 or the overhead suspended transport 410 may lift the outer box 200 from the storage tank 100 and transport the outer box 200 to a location away from the storage tank 100, for example, to another storage tank having a server rack or high-performance computing device 150 to be removed, replaced, or installed, or to a removal area where the outer box 200 can be removed. Save for later use.

[0086] In some embodiments, after removing the server rack or high-performance computing device 150 from the tank 100, the robotic arm 510 may install a replacement server rack or high-performance computing device in the tank 100. For example, the robotic arm 510 may grasp a replacement server rack stored in the housing 560, then lower the replacement server rack into the coolant 110 in the tank 100, and install the replacement server rack into the frame 160.

[0087] Figure 8 is a flow chart of method 2000 according to various embodiments.

[0088] exist Figure 8In the method 2000, the method 2000 begins at act 2010, which includes covering the immersion cooler with a second container. For example, the storage tank 100 may be covered by an outer box 200, similar to Figures 2 to 6 and Figure 7 as described in action 1040.

[0089] Act 2010 is followed by act 2020. In act 2020, after covering the immersion cooler with the second container, the lid of the immersion cooler is opened. Act 2020 is similar in most respects to Figure 7 The method 1000 of claim 1050 may be the same or similar to the method 1050 of claim 1051. That is, the lid 130 of the tank 100 may be opened with the outer box 200 placed thereon. Alternatively, in some embodiments, the lid 130 may be opened only before the action 2010, in which the outer box 200 is placed on the tank 100.

[0090] Action 2020 is followed by action 2030. In action 2030, after opening the lid of the immersion cooler, the device can be installed in the immersion cooler from the second container. For example, the server rack or high-performance computing device can be stored in the housing 560 of the transport vehicle 500 or in the overhead suspended transport 410. The server rack or high-performance computing device can be grasped by the robotic arm 510 and then transported by the robotic arm 510 to the coolant 110 in the tank 100. The robotic arm 510 can install the server rack or high-performance computing device into the frame 160 to be immersed in the coolant 110 in the tank 100. The robotic arm 510 can then be retracted into the transport vehicle 500 or the overhead suspended transport 410.

[0091] Act 2030 is followed by act 2040. In act 2040, after the device is mounted in the immersion cooler, the device is cooled by the immersion cooler, which in most respects may be similar to Figure 7 The method 1000 of claim 1010 is an action 1010. For example, a server rack or a high-performance computing device may be cooled by a coolant 110 that is a dielectric coolant in a storage tank 100. The coolant 110 may evaporate due to the high temperature of the electronic chips of the server rack or the HPC device, and the evaporation stirs the coolant 110 to flow over the surface of the server rack or the high-performance computing device, thereby cooling the server rack or the high-performance computing device.

[0092] Act 2040 is followed by act 2050. In act 2050, after or while the device is cooled by the immersion cooler, the device is used in connection with a semiconductor process. Act 2050 may be similar in most respects to act 1020. The semiconductor process may be related to Figure 7Any of the operations described in action 1020. For example, a high performance computing device cooled by an immersion cooler can provide support (eg, scheduling, recipes, control) to tools (eg, development tools, deposition tools, etching tools) in a semiconductor manufacturing plant.

[0093] It should be understood that in some embodiments, action 2050 may be omitted or modified. For example, action 2050 may be modified to perform computations unrelated to semiconductor processing, such as computations associated with cloud computing services or any tasks that can be supported by computations of an overhead suspended transport device.

[0094] Various embodiments may provide advantages. When the lid 130 is open, the outer box 200 located above the tank 100 contains the vapor 120 that would otherwise escape into the surrounding environment. Containing the vapor 120 improves environmental cleanliness and safety. The outer box 200 may be carried by a truck 500 or an overhead suspended transport 410 so as to be mobile, such that a single outer box 200 may be used to service multiple immersion cooling tanks.

[0095] According to at least one embodiment, a method includes: forming a cooling device by cooling a device in and through a first container of an immersion cooler; performing a semiconductor process by transmitting information between a process tool and the cooling device; determining whether the cooling device is in a state that can be removed from the immersion cooler; if the cooling device is not in the state, cooling the device through the immersion cooler; and if the cooling device is in the state, removing the device from the first container, including: placing a second container above the first container; and when the second container covers the first container: opening a lid of the first container; and removing the device from the first container. In one embodiment, the removing the device includes removing the device by a robot arm. In one embodiment, the removing the device by a robot arm includes removing the device by the robot arm installed in a transport vehicle. In one embodiment, the removing the device includes removing the device by the robot arm installed in an overhead suspended transport. In one embodiment, the method further includes: reducing the pressure in the second container via a pump in the transport vehicle. In one embodiment, the method further comprises: filtering the vapor of the coolant of the first container through a filtering system in the transport vehicle. In one embodiment, the method further comprises: condensing the vapor of the coolant of the first container into liquid coolant through a recirculating system in the transport vehicle. In one embodiment, the method further comprises: storing the liquid coolant in a reservoir of the recirculating system in the transport vehicle.

[0096] According to at least one embodiment, a method includes: covering an immersion cooler with a container; positioning the container above the immersion cooler; opening the cover of the immersion cooler; and inserting a device into the immersion cooler; cooling the device by the immersion cooler; and performing a semiconductor process by transmitting information between a process tool and the device cooled by the immersion cooler. In one embodiment, the method further includes: before covering the immersion cooler, transporting the container by a transporter, the container being mounted on the transporter, the transporter holding the container above the immersion cooler. In one embodiment, covering the immersion cooler includes lowering the container to a position above the immersion cooler by overhead suspension transport. In one embodiment, the method further includes: after inserting the device, lifting the container by the overhead suspension transport and transporting the container away from the immersion cooler. In one embodiment, transporting the container by the transporter includes transporting the container by the transporter having a robot arm and a pump positioned therein. In one embodiment, transporting the container via a transport vehicle includes transporting the container via the transport vehicle further having a filtration system and a recirculation system therein.

[0097] According to at least one embodiment, a system includes: an immersion cooler having a tank and a cover covering the tank; a device located in the tank of the immersion cooler; an outer box; and a transport vehicle having a housing, wherein the transport vehicle, when in operation, places the outer box above the tank; and when the outer box is located above the tank, removes the device from the tank and places the device in the housing. In one embodiment, the system further includes: a robot arm located in the transport vehicle, wherein the robot arm, when in operation, grasps the device in the tank and transports the device to the housing. In one embodiment, the transport vehicle is an overhead suspended transport. In one embodiment, the system further includes: a pump located in the transport vehicle, wherein the pump, when in operation, reduces the pressure in the outer box and the tank during the removal of the device from the tank. In one embodiment, the system further includes: a filter located in the transport vehicle, wherein the filter, when in operation, filters the vapor of the coolant in the tank. In one embodiment, the system further comprises a condenser located in the transport vehicle, wherein the condenser, when in operation, forms a liquid coolant from the vapor.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for implementing a cooling system, characterized in that: include: forming a cooled device by cooling the device in and through a first vessel of an immersion cooler; performing a semiconductor process by communicating information between a process tool and the cooling device; determining whether the cooling device is in a state to be removed from the immersion cooler; If the cooling device is not in the state, cooling the device by the immersion cooler; as well as For the cooling device to be in the state, removing the device from the first container comprises: placing a second container above the first container; and When the second container covers the first container: opening the lid of the first container; and The device is removed from the first container.

2. The method for executing a cooling system according to claim 1, characterized in that: Wherein removing the device comprises removing the device by a robotic arm.

3. The method for executing a cooling system according to claim 2, characterized in that: Wherein removing the device by a robot arm comprises removing the device by the robot arm installed in a transport vehicle.

4. The method for executing a cooling system according to claim 3, characterized in that: Also includes: The pressure in the second container is reduced via a pump in the truck.

5. The method for executing a cooling system according to claim 3, characterized in that: Also includes: The coolant vapor of the first container is filtered by a filtration system in the transport vehicle.

6. The method for implementing a cooling system according to claim 1, characterized in that: Also includes: The vapor from the cooler of the first container is condensed into liquid coolant by a recirculation system in the truck.

7. A method for implementing a cooling system, characterized in that: include: Covering the immersion cooler with a container; Position the vessel above the immersion cooler: opening a lid of the immersion cooler; as well as inserting a device into the immersion cooler; cooling the device by means of the immersion cooler; as well as A semiconductor process is performed by communicating information between a process tool and the device cooled by the immersion cooler.

8. A cooling system, characterized in that: include: An immersion cooler having a storage tank and a cover covering the storage tank; a device located in the storage tank of the immersion cooler; outer box; as well as A transport vehicle having a housing, wherein the transport vehicle, when in operation: placing the outer box above the storage tank; as well as When the outer box is positioned above the tank, the device is removed from the tank and placed into the housing.

9. The cooling system according to claim 8, characterized in that: Also includes: A robotic arm is located in the transporter, wherein the robotic arm, when in operation, grasps the device in the tank and transports the device into the housing.

10. The cooling system according to claim 9, characterized in that Also includes: A pump is located in the transport vehicle, wherein the pump, when operated, reduces the pressure in the outer box and the tank during the period when the device is removed from the tank.

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