Light-emitting device and display device

Abstract

The invention discloses a light-emitting device and a display device. The light-emitting device comprises a transparent layer, an empty space layer, a bonding layer, a plurality of light-emitting elements and a wiring layer, the empty space layer is formed on the surface of the transparent layer, the empty space layer comprises a first surface and a second surface, the first surface is attached to the transparent layer, at least one groove is formed in the second surface of the empty space layer, and the groove is sunken in the direction from the second surface to the first surface; the bonding layer is at least formed on the second surface; the light-emitting elements are arranged on the second surface of the bonding layer at intervals, at least one light-emitting element corresponds to one groove, and the edges of the light-emitting elements make contact with the bonding layer; the wiring layer is arranged on the plurality of light-emitting elements, and the wiring layer is electrically connected with each light-emitting element. The light emitting intensity of the light emitting device can be improved, and the reliability of the device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a light-emitting device and a display device. Background Art

[0002] LED chips are widely used in display devices, vehicle lamps, general lighting and other fields due to their high reliability, long life and low power consumption. For example, LED chips can be used as backlight sources for various display devices. At present, the size of micro-chips (micro-LED chips, generally less than 100nm) is too small, and it is difficult to grab the chips and fix them on the display panel. Therefore, the three RGB chips are formed into a unit pixel package, so that the process of grabbing the unit pixel and fixing it to the display panel is relatively simple.

[0003] However, there are some problems to be solved in the existing unit pixel package. For example, as the unit pixel tends to be miniaturized, it becomes more difficult to fix the unit pixel to the display substrate; the unreasonable setting of the internal structure of the unit pixel package will lead to a decrease in the unit pixel luminous intensity or light loss; the light emitting angle of the light emitting element inside the unit pixel package is small, resulting in uneven light emission of the entire package, etc. The above problems seriously affect the light emission efficiency, reliability and yield of the unit pixel, and are problems that technicians in this field need to solve urgently. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a light emitting device and a display device to further improve the light extraction efficiency of an LED package.

[0005] In order to achieve the above-mentioned object and other related objects, the present invention provides a light emitting device, comprising:

[0006] Transparent layer;

[0007] The overhead layer is formed on the surface of the transparent layer, and includes a first surface and a second surface that are oppositely arranged, the first surface is in contact with the transparent layer, and at least one groove is formed on the second surface of the overhead layer, and the groove is concave in a direction from the second surface to the first surface;

[0008] An adhesive layer is formed at least on the second surface of the overhead layer;

[0009] A plurality of light emitting elements are arranged on the adhesive layer at intervals, and at least one light emitting element corresponds to one groove so that a portion of the surface of the light emitting element contacts the adhesive layer;

[0010] The wiring layer is arranged on the plurality of light emitting elements, and the wiring layer is electrically connected to each light emitting element.

[0011] According to another aspect of the present invention, the present invention further provides a display device, comprising:

[0012] Display substrate;

[0013] At least one light emitting device is arranged on the surface of the display substrate, the protection electrode of the light emitting device is electrically connected to the display substrate, and the light emitting device is the light emitting device mentioned above.

[0014] Compared with the prior art, the light emitting device and the display device of the present invention have at least the following beneficial effects:

[0015] The light-emitting device of the present invention is provided with an overhead layer between a transparent layer and an adhesive layer, and the overhead layer is formed on the surface of the transparent layer. The overhead layer includes a first surface and a second surface that are arranged opposite to each other. The first surface is in contact with the transparent layer, and at least one groove is formed on the second surface, and the groove is recessed from the second surface to the first surface. The adhesive layer is formed at least on the second surface. A plurality of light-emitting elements are arranged on the adhesive layer at intervals, and at least one light-emitting element corresponds to a groove. The edge of the light-emitting element contacts the adhesive layer, so that the light-emitting area of ​​the light-emitting element is suspended on the groove. The adhesive layer is separated from the light-emitting area of ​​the light-emitting element by the groove arranged on the overhead layer, so as to avoid the light emission of the light-emitting element affecting the properties of the adhesive layer, thereby ultimately affecting the light emission intensity of the entire device, and improving the reliability of the device.

[0016] The display device described in the present invention includes any of the above-mentioned light-emitting devices and also has the above-mentioned technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1a It is a schematic diagram of a top view of a specific embodiment of Embodiment 1 of the present invention;

[0018] Figure 1b A schematic diagram of a top view of a wiring layer in a specific embodiment of Embodiment 1 of the present invention;

[0019] Figure 2a This is an embodiment of embodiment 1 of the present invention. Figure 1a A-A' cross-sectional schematic diagram;

[0020] Figure 2b for Figure 2a Enlarged view of point A in the middle;

[0021] Figure 2c It is a schematic cross-sectional view of another embodiment of Embodiment 1 of the present invention along the line AA' of FIG. 1 ;

[0022] Figure 3 It is a schematic diagram of a top view of a specific embodiment of Embodiment 2 of the present invention;

[0023] Figure 4a for Figure 3 Schematic diagram of the cross section in the B-B' direction;

[0024] Figure 4b for Figure 3 Schematic diagram of the C-C' section;

[0025] Figure 5a-5c They are respectively schematic top views of the structures of multiple specific embodiments in Embodiment 2 of the present invention;

[0026] Figure 6a-6b It is a schematic diagram of the top view of multiple specific embodiments in Embodiment 2 of the present invention;

[0027] Figure 7 It is a cross-sectional view (along the AA' line in FIG1 ) of a specific embodiment in Embodiment 2 of the present invention;

[0028] Figure 8a The cross section (along the Figure 3 Schematic diagram (C-C' direction);

[0029] Figure 8b The cross section (along the Figure 3 Schematic diagram (B-B' direction);

[0030] Fig. 9 This is a cross section of another specific embodiment of Embodiment 3 of the present invention (along the Figure 3 Schematic diagram (C-C' direction);

[0031] Fig.10 A cross section (along the line) of another specific embodiment of Embodiment 3 of the present invention is shown in FIG. Figure 3 Schematic diagram (C-C' direction);

[0032] Fig.11 This is a cross section (along the line) of another specific embodiment of Embodiment 3 of the present invention. Figure 3 Schematic diagram (C-C' direction);

[0033] Fig.12a A cross section of a specific embodiment of Example 4 of the present invention (along the Figure 3 Schematic diagram (C-C' direction);

[0034] Figure 12b A cross section of a specific embodiment of Example 4 of the present invention (along the Figure 3 Schematic diagram (B-B' direction);

[0035] Fig.13 This is a cross section (along the line) of another specific embodiment in Embodiment 4 of the present invention. Figure 3 Schematic diagram (C-C' direction);

[0036] Fig.14A cross section (along the line) of another specific embodiment of Embodiment 4 of the present invention is shown in FIG. Figure 3 Schematic diagram (C-C' direction);

[0037] Fig.15 A cross section (along the Figure 3 Schematic diagram (C-C' direction);

[0038] Fig.16a A cross section of a specific embodiment of Example 5 of the present invention (along the Figure 3 Schematic diagram (C-C' direction);

[0039] Fig.16b A cross section of a specific embodiment of Example 5 of the present invention (along the Figure 3 Schematic diagram (B-B' direction);

[0040] Fig.17 This is a cross section (along the line) of another specific embodiment in Embodiment 5 of the present invention. Figure 3 Schematic diagram (C-C' direction);

[0041] Fig.18 This is a cross section (along the line) of another specific embodiment of Embodiment 5 of the present invention. Figure 3 Schematic diagram (C-C' direction);

[0042] Fig.19 This is a cross section (along the Figure 3 Schematic diagram (C-C' direction);

[0043] Fig. 20 For example, in Example 1 of the present invention, Figure 1a and Figure 2a A schematic diagram of light emission angles of a light emitting element in the light emitting device described in the figure;

[0044] Fig.21 In Example 5 of the present invention Fig.17 A schematic diagram of the light emission angle of the light emitting element in the light emitting device;

[0045] Fig. 22 Schematic diagram of the structure of the display device described in Example 6 of the present invention.

[0046] List of reference numerals:

[0047] 100 transparent layer 700a first region

[0048] 200 Skyscraper 700b Second Area

[0049] 201 first surface 700c third area

[0050] 202 second surface 800 insulation layer

[0051] 203 groove 800a lower surface

[0052] 300 Adhesive layer 800b Upper surface

[0053] 301 opening 800c side surface

[0054] 400 Angle adjustment layer 801 Opening

[0055] 401 first angle adjustment layer 802 notch portion

[0056] 402 second angle adjustment layer 900 protection electrode

[0057] 403 The third angle adjustment layer 900a The first part

[0058] 501 first light emitting element 900b second part

[0059] 502 second light emitting element 910 first protective electrode

[0060] 503 third light emitting element 920 second protective electrode

[0061] 504 first electrode 930 third protective electrode

[0062] 505 second electrode 940 fourth protective electrode

[0063] 600 filling layer 901 first side wall

[0064] 601 gap 902 second side wall

[0065] 602 groove 903 third side wall

[0066] 610 first filling structure 904 fourth side wall

[0067] 620 second filling structure 1001 first side

[0068] 611 first sublayer 1002 second side

[0069] 612 Second sublayer X First direction

[0070] 700 Wiring layer Y Second direction

[0071] 701 First layer 001 First side

[0072] 702 Second layer 002 Second side

[0073] 710 First sub-wiring 003 Third side

[0074] 720 Second sub-wiring 004 Fourth side

[0075] 730 Third sub-wiring 005 Light-emitting device

[0076] 740 Fourth sub wiring 006 Display substrate DETAILED DESCRIPTION

[0077] The following specific embodiments illustrate the embodiments of the present invention, and those familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0078] It should be noted that the diagrams provided in the embodiments of the present invention are only used to illustrate the basic concept of the present invention in a schematic manner. Although the diagrams only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of each component can be changed at will during actual implementation, and the layout of the components may also be more complex. The structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that can be implemented in this application, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by the present invention.

[0079] At present, light-emitting devices are gradually becoming miniaturized, and the electrodes formed on the light-emitting devices are also becoming smaller. As a result, when the light-emitting device is transferred to the display panel, an opening is formed in the insulating layer on the side of the light-emitting device with the electrode. This opening forms a negative pressure on the blue film when the light-emitting device is transferred, making it difficult to reverse the film during the transfer, which in turn leads to a decrease in transfer efficiency. If the reverse molding process is manually intervened, it will inevitably cause damage to the light-emitting device, affecting the yield of the device. At the same time, due to the reduction in the package size of the light-emitting device, the wiring layer design in the light-emitting device also faces certain challenges.

[0080] Light-emitting devices also face the problem of releasing the photoelectric performance of LED chips. When light-emitting devices are applied to the field of direct display screens, in order to avoid display problems caused by reflection, scattering, chip side light crosstalk, etc., the back of the light-emitting device package is usually made black. The black layer on the back of the package will inevitably cause a loss of light output effect, further inhibiting the release of the chip's optical performance.

[0081] As the size of Micro LED chips gets smaller and smaller, the two-dimensional effect of the light-emitting device package continues to increase, resulting in an increase in the electric field and current density inside the package, and greatly increasing the sensitivity of circuit performance to defects. At the same time, new applications require Micro LED products to operate under harsh conditions such as high voltage, high temperature, strong radiation, high frequency and high power, making the reliability issues faced by the products increasingly severe.

[0082] The light-emitting elements in the light-emitting device are arranged at intervals. Since the light-emitting angle of each light-emitting element is small, there is a light-emitting blind area in the area between adjacent light-emitting elements, which affects the light-emitting effect.

[0083] In order to solve the above technical problems, this embodiment provides a light emitting device, including:

[0084] Transparent layer;

[0085] The overhead layer is formed on the surface of the transparent layer, and includes a first surface and a second surface that are oppositely arranged, the first surface is in contact with the transparent layer, and at least one groove is formed on the second surface of the overhead layer, and the groove is concave in a direction from the second surface to the first surface;

[0086] An adhesive layer is formed at least on the second surface of the overhead layer;

[0087] A plurality of light emitting elements are arranged on the adhesive layer at intervals, and at least one light emitting element corresponds to one groove so that a portion of the surface of the light emitting element contacts the adhesive layer;

[0088] The wiring layer is arranged on the plurality of light-emitting elements, and the wiring layer is electrically connected to each light-emitting element. In this embodiment, the bonding layer is separated from the light-emitting area of ​​the light-emitting element by the groove arranged on the overhead layer, so as to avoid the light emission of the light-emitting element affecting the properties of the bonding layer, thereby ultimately affecting the light emission intensity of the entire device, and improving the reliability of the device.

[0089] Optionally, the groove passes through a portion of the overhead layer, and the depth of the groove is less than the thickness of the overhead layer.

[0090] Optionally, the overhead layer is formed as a light-transmitting layer.

[0091] Optionally, the material of the light-transmitting layer is transparent polyimide.

[0092] Optionally, the groove passes through the overhead layer, and the bottom of the groove exposes the surface of the transparent layer.

[0093] Optionally, the overhead layer is formed as a photoresist layer.

[0094] Optionally, the photoresist layer contains a black filling component, and the black filling component includes at least one of carbon black, titanium nitride, iron oxide, ferroferric oxide or iron powder.

[0095] Optionally, an adhesive layer is formed on the second surface and the inner wall of the groove.

[0096] Optionally, a vertical distance between the adhesive layer on the bottom wall of the groove and the light emitting area of ​​the corresponding light emitting element is between 5 μm and 17 μm.

[0097] Optionally, an adhesive layer is formed on the second surface.

[0098] Optionally, the material of the adhesive layer is epoxy resin.

[0099] Optionally, the plurality of light emitting elements include at least three light emitting elements emitting lights of different colors from each other, and one of the light emitting elements is a light emitting element radiating blue light.

[0100] Optionally, a groove is formed on the second surface of the overhead layer, and the groove corresponds to the light emitting area of ​​the blue light emitting element.

[0101] Optionally, the plurality of light-emitting elements include three light-emitting elements, each of which is a light-emitting element radiating blue light.

[0102] Optionally, three grooves are formed on the second surface of the overhead layer, and the grooves correspond to the light-emitting areas of each light-emitting element one by one.

[0103] Optionally, the light emitting device further comprises:

[0104] The filling layer is filled between adjacent light-emitting elements.

[0105] Optionally, the wiring layer includes:

[0106] The first layer is in contact with the light emitting element and the filling layer, and is electrically connected to the light emitting element;

[0107] The second layer has one side electrically connected to the first layer and the other side connected to the protection electrode.

[0108] Optionally, the light emitting device further comprises:

[0109] A plurality of protection electrodes are formed on the wiring layer at intervals and are electrically connected to the wiring layer.

[0110] Optionally, the light emitting device further comprises:

[0111] An insulating layer is formed on a portion of the wiring layer.

[0112] This embodiment also provides a display device, including:

[0113] Display substrate;

[0114] At least one light emitting device is disposed on the surface of the display substrate, the light emitting device is electrically connected to the display substrate, and the light emitting device is the light emitting device in any of the above schemes. Similarly, the display device in this embodiment includes the above light emitting device and also has the technical effects of the above light emitting device.

[0115] The present embodiment is described in detail below in conjunction with specific embodiments.

[0116] Example 1

[0117] Figure 1a This is a schematic diagram of a top view of a specific embodiment of the present invention; Figure 2a For along Figure 1a Schematic diagram of the A-A' cross section.

[0118] This embodiment provides a light emitting device, referring to Figure 1a and Figure 2a The light emitting device includes a transparent layer 100 , a plurality of light emitting elements, a wiring layer 700 and an insulating layer 800 .

[0119] Reference Figure 1a and Figure 2a , the transparent layer 100 may have a light transmittance of more than 60% in the visible light range. Optionally, the transparent layer 100 may be a transparent substrate, and the transparent substrate may be a light-transmitting substrate such as PET, glass, quartz, sapphire, transparent ceramic, etc. The light-emitting device needs to have a certain thickness for easy use by the client, so the thickness of the transparent layer 100 is preferably greater than 10μm, specifically preferably 30μm to 50μm, 50μm to 100μm or 100μm to 300μm. A plurality of light-emitting elements are arranged on the surface of the transparent layer 100. The side of the transparent layer 100 away from the light-emitting element is the light-emitting surface of the light-emitting device, that is, the light emitted by the light-emitting element is emitted outward through the transparent layer 100.

[0120] Reference Figure 2a, multiple light-emitting elements are arranged on the transparent layer 100. Since different light-emitting elements usually have different thicknesses, an adhesive layer 300 is arranged between the transparent layer 100 and the light-emitting element, wherein the material of the adhesive layer 300 can be an elastic material such as silicone, so that the light-emitting element will partially sink into the adhesive layer 300 to keep the electrode surface of the light-emitting element at the same level, and the height difference of the light-emitting surface of each light-emitting element can be reduced, so that the light emitted from the side of the light-emitting element is absorbed by the filling layer 600 described below as much as possible, so as to improve the contrast of the light-emitting device. The thickness of the adhesive layer 300 is preferably 1μm to 15μm or 3μm to 10μm. If the thickness of the adhesive layer 300 is greater than 15μm, the alignment accuracy of the light-emitting element may be affected.

[0121] The light-emitting element in this embodiment mainly refers to a micron-sized light-emitting diode, whose width or length ranges from 2 to 5 μm, 5 to 10 μm, 10 to 20 μm, 20 to 50 μm or 50 to 100 μm, and whose thickness ranges from 2 to 15 μm, preferably 5 to 10 μm.

[0122] Specifically, each light-emitting element includes a semiconductor stack layer, which may include a first semiconductor layer, a second semiconductor layer, and an active layer arranged in sequence, wherein the first semiconductor layer is an N-type semiconductor layer, the second semiconductor layer is a P-type semiconductor layer, and the active layer is a multi-layer quantum well layer, which can provide red light, green light, or blue light radiation. The N-type semiconductor layer, the multi-layer quantum well layer, and the P-type semiconductor layer are only the basic constituent units of the light-emitting element 500. On this basis, the light-emitting element 500 may also include other functional structural layers that have an optimization effect on the performance of the light-emitting element 500.

[0123] The first light-emitting element 501, the second light-emitting element 502 and the third light-emitting element 503 radiate light of different wavelength ranges, respectively, for example, the first light-emitting element 501 radiates blue light, the second light-emitting element 502 radiates green light, and the third light-emitting element 503 radiates red light. In one embodiment, different light-emitting elements 500 may have different semiconductor stacking layers, so as to directly radiate light of different wavelength ranges, and the specific material of the semiconductor stacking layer is selected according to the wavelength of the radiated light, including but not limited to aluminum gallium arsenide, gallium arsenide phosphide, aluminum gallium indium phosphide, gallium nitride, indium gallium nitride, zinc selenide or gallium phosphide. In another embodiment, different light-emitting elements 500 may have the same semiconductor stacking layer, for example, the semiconductor stacking layers in the first light-emitting element 501, the second light-emitting element 502 and the third light-emitting element 503 all radiate blue light, and a wavelength conversion layer is set on the light-emitting surface of the second light-emitting element 502 to convert the radiated blue light into green light, and a wavelength conversion layer is set on the light-emitting surface of the third light-emitting element 503 to convert the radiated blue light into red light.

[0124] Each light emitting element 500 further includes a first electrode and a second electrode. The semiconductor stack layer has a mesa exposing the first semiconductor layer, the first electrode is formed on the mesa and electrically connected to the first semiconductor layer, and the second electrode is formed on the second semiconductor layer and electrically connected to the second semiconductor layer.

[0125] Reference Figure 2a A filling layer 600 is provided between adjacent light-emitting elements or around the side walls of the light-emitting elements. The provision of the filling layer 600 can prevent color mixing or light interference between adjacent light-emitting elements, thereby improving the contrast of the light-emitting device. The filling layer 600 is provided as a black glue layer that absorbs light. Specifically, the filling layer 600 can be a component formed by dispersing a black filling component with a particle size not greater than 1 μm in a transparent or translucent material such as silica gel, epoxy resin, polyimide, low-temperature glass, polysiloxane, polysilazane, etc. The black filling component in the filling layer 600 includes but is not limited to carbon black, titanium nitride, iron oxide, ferroferric oxide, iron powder, etc. The particle size range of the black filling component is preferably 10 to 100 nm, or 100 to 200 nm, or 200 to 300 nm, or 300 nm to 500 nm. The filling layer 600 can also be made of black dye.

[0126] Reference Figure 2a , the wiring layer 700 is arranged above the light-emitting element and the filling layer 600, and is electrically connected to each light-emitting element through the metal wiring therein. The wiring layer 700 includes a plurality of wirings, and the wiring layer 700 is surrounded by an insulating layer to electrically isolate adjacent wirings. The wiring layer 700 can be a single layer or multiple layers made of at least one material selected from titanium, copper, chromium, nickel, gold, platinum, aluminum, titanium nitride, tantalum nitride or tantalum. In this embodiment, the wiring layer 700 includes a two-layer structure, specifically a first layer 701 and a second layer 702, the first layer 701 is in direct contact with the light-emitting element, and the second layer 702 is formed on the first layer 701. The first layer 701 is used to adhere the second layer 702 to the light-emitting element and the filling layer 600, and the second layer 702 mainly plays a conductive role. The material of the first layer 701 includes but is not limited to one or more of titanium, nickel, titanium nitride, tantalum nitride or tantalum, and the material of the second layer 702 includes but is not limited to one or more of copper, aluminum or gold. The wiring layer 700 can be prepared by sputtering, evaporation, or the like.

[0127] In one embodiment, referring to Figure 1bThe wiring layer 700 includes a first sub-wiring 710, a second sub-wiring 720, a third sub-wiring 730 and a fourth sub-wiring 740, wherein the first sub-wiring 710 is used as a common wiring, the first electrodes of the first light-emitting element 501, the second light-emitting element 502 and the third light-emitting element 503 are commonly connected to the first sub-wiring 710, the second electrode of the first light-emitting element 501 is connected to the second sub-wiring 720, the second electrode of the second light-emitting element 502 is connected to the third sub-wiring 730, and the second electrode of the third light-emitting element 503 is connected to the fourth sub-wiring 740. The wiring layer 300 can be formed together on the filling layer 210.

[0128] Alternatively, the first sub-wiring 710 is used as a common wiring, and the second electrodes in the first light-emitting element 501, the second light-emitting element 502, and the third light-emitting element 503 are commonly connected to the first sub-wiring 710, the first electrode in the first light-emitting element 501 is connected to the second sub-wiring 720, the first electrode in the second light-emitting element 502 is connected to the third sub-wiring 730, and the first electrode in the third light-emitting element 503 is connected to the fourth sub-wiring 740. The wiring layer 700 can be formed together on the filling layer 600. In one embodiment, referring to Figure 1b , each sub-wiring includes a first region 700a connected to the light-emitting element, a second region 700b that is subsequently bonded to the circuit substrate through a bonding material, and a third region 700c that connects the first region 700a and the second region 700b. The first region 700a and the third region 700b can be linear structures with a width less than or equal to 50μm, preferably 5μm to 20μm or 10μm to 30μm or 20μm to 40μm. Since the size of the light-emitting device is very small, the formation position space of the wiring layer 700 on the light-emitting element is limited. If the width is greater than 50μm, electrical problems are likely to occur; if the width is less than 5μm, the structures of the first region 700a and the third region 700b are too fragile and prone to the risk of fracture. The shape of the second region 700b can be set to any shape, such as a rectangle, a circle or other polygonal shapes. In this embodiment, the second region 700b is rectangular or quasi-rectangular for illustration. The second region 700b is a location for subsequent bonding with the circuit substrate through bonding materials. If the area is too small, the light emitting device and the substrate will not be stably bonded, so a certain area needs to be maintained.

[0129] Reference Figure 1a and Figure 2a , the insulating layer 800 is formed on the wiring layer 700, and the insulating layer 800 can be partially removed by exposure and development, etc., to form a plurality of openings 801 to expose a portion of the surface of the wiring layer 700, that is, the second area 700b of the wiring layer 700. In one embodiment, referring to Figure 2aThe opening 801 of the insulating layer 800 includes a lower surface 800a in contact with the wiring layer 700, an upper surface 800b opposite to the lower surface 800a, and a side surface 800c connecting the upper surface 800b and the lower surface 800a, and an angle α is formed between the side surface 800c and the lower surface 800a, and the angle α is less than or equal to 80°. For example, less than or equal to 70°, less than or equal to 60°, or less than or equal to 50°.

[0130] In one embodiment, the insulating layer 800 may be formed of materials such as epoxy resin, polysiloxane or photoresist, which can prevent the wiring layer 700 from being oxidized and electrically isolate different wirings to prevent leakage failure of the light-emitting device.

[0131] The light emitting device is subsequently mounted on the circuit substrate using a bonding material such as solder. Specifically, the bonding material can bond the wiring layer 700 exposed to the opening 801 of the insulating layer 800 with the electrode pad on the circuit substrate. Since the exposed surface of the wiring layer 700 is easily oxidized in the air, it may easily lead to problems such as poor electrical properties. Therefore, in one embodiment, refer to Figure 1a and Figure 2a A protective electrode 900 is formed on the surface of the wiring layer exposed in the opening 801 of the insulating layer 800, that is, on the second region 700b. When the material forming the wiring layer 700 is easily oxidized, for example, in one embodiment, when the surface metal of the wiring layer 700 is Cu, the protective electrode 900 can be formed to protect the exposed wiring layer 700. Among them, a plurality of protective electrodes 900 are formed on the second region 700b of the exposed wiring layer 700 to form an electrical connection with the wiring layer 700. The shape of the protective electrode 900 can be set to any shape, such as a rectangle, a circle or other polygonal shapes. In this embodiment, the protective electrode 900 is described as being rectangular or quasi-rectangular. Figure 1a Each protective electrode 900 includes four side walls, which are respectively a first side wall 901, a second side wall 902, a third side wall 903 and a fourth side wall 904. The first side wall 901 and the second side wall 902 of each protective electrode 900 are away from the edge of the light-emitting device and are arranged close to the center of the light-emitting device. In addition, in this embodiment, a total of four protective electrodes 900 are arranged.

[0132] In one embodiment, referring to Figure 1aThe light emitting device includes a first side 001, a second side 002, a third side 003 and a fourth side 004 connected in sequence, wherein the first side 001 and the third side 003 are substantially parallel, and the second side 002 and the fourth side 004 are substantially parallel, or it can be said that the first side 001 and the third side 003 are parallel, and the second side 002 and the third side 004 are parallel. The first side 001 is substantially parallel to the first side wall 901, the second side 002 is substantially parallel to the second side wall 902, the third side 003 is substantially parallel to the third side wall 903, and the fourth side 004 is substantially parallel to the fourth side wall 904.

[0133] In one embodiment, referring to Figure 1a The length of the first side 001 is equal to the length of the second side 002 (due to measurement errors, the error range can be allowed to be controlled within 10%), and the length of the first side wall 901 of the protective electrode 900 is equal to the length of the second side wall 902 (due to measurement errors, the error range can be allowed to be controlled within 10%).

[0134] In another embodiment, referring to Figure 1a , the length of the first side 001 is less than the length of the second side 002, and the plurality of light emitting elements are arranged in the direction of the second side 002. The ratio of the length of the first side 001 to the length of the second side 002 is greater than the ratio of the length of the first side wall 901 to the length of the second side wall 902 of the protective electrode 900. In a preferred embodiment, when the ratio of the length of the first side 001 to the length of the second side 002 is between 0.6 and 0.9, the ratio of the length of the first side wall 901 to the length of the second side wall 902 of the protective electrode 900 is between 0.4 and 0.8, which can ensure that when the size of the light emitting device is further reduced, the protective electrode has enough area to be combined with the display panel.

[0135] In one embodiment, referring to Figure 2b The protection electrode 900 includes a first portion 900a formed on the second region 700b of the wiring layer 700 and a second portion 900b formed on the side surface 800c of the opening 801 of the insulating layer 800. The first portion 900a and the second portion 900b may be in contact with each other and continuous to form a good contact with the solder paste during subsequent soldering. The thickness of the first portion 900a is greater than that of the second portion 900b, and the thickness of the second portion 900b gradually decreases as it moves away from the first portion 900a.

[0136] In one embodiment, the material of the protection electrode 900 may be one or more of metals such as nickel, gold, platinum, etc., or may be chromium, tin, or palladium. The thickness of the protection electrode 900 is between 1 and 6 μm, for example, the thickness of the protection electrode 900 may be 2 μm, 3 μm, 4 μm, 5 μm, etc.

[0137] In one embodiment, the protective electrode 900 includes a first sublayer and a second sublayer, the thickness of the first sublayer is greater than the thickness of the second sublayer. In a preferred embodiment, the first sublayer may be a nickel layer, the second sublayer may be a gold layer, the thickness of the first sublayer is 2 μm to 5 μm, and the thickness of the second sublayer is The setting of the thickness ratio can achieve better flatness.

[0138] In one embodiment, the thickness of the protection electrode 900 is greater than the thickness of the wiring layer 700, and the thickness of the protection electrode 900 is less than the thickness of the insulating layer 800. In one embodiment, the thickness of the insulating layer 800 is between 2 and 10 μm, for example, the thickness of the insulating layer 800 may be 4 μm, 5 μm, 6 μm, 7 μm, etc. The thicker the insulating layer 800 is within the above range, the better the mechanical strength of the product. However, if the insulating layer 800 is too thick, it may cause poor electrical properties beyond the above range.

[0139] In one embodiment, referring to Figure 2a , the thickness of the protective electrode 900 is less than the thickness of the insulating layer 800, there is a minimum distance D1 between the surface of the protective electrode 900 and the upper surface 800b of the insulating layer 800, the thickness of the insulating layer 800 is H1, and the height difference between D1 and H1 is between 0 and 10 μm. If D1 is too large, the light-emitting device may need to use more volume of solder or other bonding materials to be mounted on the circuit substrate. The larger D1 is, the longer the bonding material heating time is, which may affect the performance of the light-emitting device.

[0140] Figure 2c Another embodiment of the present invention is Figure 1a In one embodiment, referring to Figure 1a and Figure 2c , the protection electrode 900 is formed on the second region 700b of the wiring layer 700, and the insulating layer 800 covers the surface of the wiring layer 700 and the sidewall and part of the surface of the protection electrode 900. Specifically, the insulating layer 800 is formed on the wiring layer 700, and an opening 801 is formed to expose the surface of the protection electrode 900, and the projection of the opening 801 has an overlapping area with the protection electrode 900. In a preferred embodiment, the projection of the opening 801 is located within the projection of the protection electrode 900. The edge and sidewall of the protection electrode 900 are covered by the insulating layer 800, which can prevent external water vapor from entering the interior of the light-emitting device, so as to improve the reliability of the light-emitting device. In addition, in this embodiment, the protective electrode 900 can first be formed on the second area 700b of the wiring layer 700 through a wet process, and then the insulating layer 800 covers the surface of the wiring layer 700 and the side walls and part of the surface of the protective electrode 900, which can prevent the side walls 800c of the opening 801 of the insulating layer 800 from forming cracks with the surface of the wiring layer 700, thereby improving the reliability of the light-emitting device.

[0141] Example 2

[0142] This embodiment provides a light emitting device. The similarities between the light emitting device and the light emitting device in Embodiment 1 are not described here. The difference between the light emitting device and the light emitting device is as follows:

[0143] Figure 3 This is a schematic diagram of a top view of a specific embodiment of the present invention; Figure 4a For along Figure 3 Schematic diagram of the B-B' section; Figure 4b For along Figure 3 Schematic diagram of the C-C' cross section.

[0144] Reference Figures 3 to 4b In this embodiment, a plurality of notches 802 are formed at intervals on the edge of the insulating layer 800. Optionally, the wiring layer 700 (i.e., the second region 700b) may be exposed in each notch 802, and the protective electrode 900 formed on the second region 700b of the wiring layer 700 may also be exposed. Since the thickness of the protective electrode 900 is less than the thickness of the insulating layer 800 in Embodiment 1, a depression is formed on the surface of the insulating layer 800 by the opening 801. At the same time, since the size of the light-emitting element in this embodiment is small, the size of the package is also small, resulting in a small size of the protective electrode 900 exposed on the surface of the insulating layer 800, and accordingly, a smaller size of the depression formed on the insulating layer 800. When the entire light-emitting device is transferred using a blue film, the blue film is attached to the side of the insulating layer 800 of the light-emitting device having the depression. Since there is a small depression on the surface of the insulating layer 800 and the size of the depression is small, a large negative pressure is easily generated during the reverse molding process, resulting in the inability to perform efficient reverse molding of the light-emitting device, affecting the transfer efficiency. As a result, a plurality of notches 802 are formed at the edge of the insulating layer 800 of the present embodiment, and the notches 802 at least expose a portion of the edge of the light-emitting device. Furthermore, since the protective electrode 900 is exposed in the notches 802 located at the edge of the insulating layer 800, no depression is formed on the surface of the insulating layer 800. Therefore, when the entire light-emitting device is transferred, no negative pressure is generated between the light-emitting device and the blue film. Therefore, the light-emitting device of the present embodiment can improve the transfer efficiency and the device yield.

[0145] Reference Figure 3 There is a minimum distance D2 between the edge of the notch 802 of the insulating layer 800 and the edge of the light-emitting device, and the minimum distance D2 is less than 120 μm. Optionally, the minimum distance can be set within 20 to 80 μm so that the insulating layer can completely cover the wiring layer or circuit on the light-emitting device.

[0146] In one embodiment, referring to Figure 3Each notch portion 802 includes a first edge and a second edge, the first edge of the notch portion 802 is arranged approximately parallel to the second side 002, the second edge of the notch portion 802 is arranged approximately parallel to the first side 001, the ratio of the minimum distance D2 from the first edge to the second side 002 to the first side 001 is 0.1 to 0.5, and the ratio of the minimum distance D3 from the second edge to the first side 001 to the length of the second side 002 is 0.3 to 0.6.

[0147] In one embodiment, referring to Figure 3 The light emitting device includes a first side 001, a second side 002, a third side 003 and a fourth side 004. The first side 001 and the third side 003 are arranged opposite to each other, the second side 002 and the fourth side 004 are arranged opposite to each other, the length of the second side 002 is greater than the length of the first side 001, and along the extension direction of the second side 002, the distance D4 between two adjacent protective electrodes 900 is greater than 40 μm. Optionally, the ratio of the distance D4 between two adjacent protective electrodes 900 to the length of the second side 002 is 1:4, and the ratio of the distance D4 between adjacent protective electrodes to the length of the first side 001 is 1:2. Optionally, along the extension direction of the second side 002, the distance D4 between two adjacent protective electrodes is 40 μm to 100 μm.

[0148] In one embodiment, referring to Figures 3 to 4b , a plurality of light emitting elements are arranged at intervals on the transparent layer 100, and the projection area of ​​the insulating layer 800 on the transparent layer 100 accounts for 0.4 to 0.8 of the area of ​​the transparent layer 100. Optionally, the projection area of ​​the notches 802 of the plurality of insulating layers 800 on the transparent layer 100 accounts for 0.2 to 0.6 of the area of ​​the transparent layer 100.

[0149] Reference Figures 3 to 4b In this embodiment, the size of each protective electrode 900 is smaller than the size of each notch 802, each protective electrode 900 is exposed in each notch 802, and the edge of the protective electrode 900 is spaced from the edge of the light-emitting device, so that the protective electrode 900 can be prevented from being formed at the edge of the wiring layer 700. In this embodiment, the protective electrode 900 is arranged at a position close to the center of the light-emitting device to avoid exposure of the protective electrode 900, prevent leakage or damage to the protective electrode 900. Optionally, the material of the protective electrode 900 is tin, gold, or a tin-gold alloy. The area of ​​the protective electrode 900 exposed in the notch 802 of the insulating layer 800 is much smaller than the area of ​​the wiring layer 700. Exposing the protective electrode 900 only in the notch 802 or the opening 801, rather than directly plating tin or gold materials on the entire wiring layer 700, can save the amount of tin-gold materials and reduce production costs.

[0150] In a specific embodiment of this embodiment, refer to Figure 5a-5bThe insulating layer 800 includes two gaps 802 arranged at intervals, and two protection electrodes 900 are exposed in each gap 802. The two protection electrodes 900 are arranged at intervals in the gap 802. For example, the insulating layer 800 completely covers the second side wall 902 of the protection electrode 900, so that the insulating layer 800 is in the shape of a "|". Figure 5a The insulating layer 800 completely covers the second side wall 902 and partially covers the third side wall 903 adjacent to the second side wall 902, so that the insulating layer 800 is in an "I" shape, as shown in FIG. Figure 5b Furthermore, the insulating layer 800 may not only cover the sidewalls of the protective electrode 900, but also cover a portion of the surface of the protective electrode 900, such as Figure 5b In the above embodiment, the length of the first side wall 901 of the protection electrode 900 is greater than the length of the second side wall 902 .

[0151] In a specific embodiment, referring to Figure 5c The insulating layer 800 includes three gaps 802 arranged at intervals. The insulating layer 800 completely covers the second side wall 902 of each protection electrode 900 and covers the first side walls 901 of two adjacent protection electrodes 900 arranged opposite to each other to completely cover the wiring layer at the bottom.

[0152] In a specific embodiment of this embodiment, refer to Figure 3 , 6a 6b, the insulating layer 800 includes four gaps 802 arranged at intervals, and a protective electrode 900 is exposed in each gap 802. For example, the insulating layer 800 completely covers the first side wall 901 and the second side wall 902 of each protective electrode 900, so that the insulating layer 800 is in a "cross" shape, such as Figure 3 The insulating layer 800 completely covers the first side wall 901 and the second side wall 902 of each protection electrode 900, and extends from the first side wall 901 to the fourth side wall 904, and extends from the second side wall 902 to the third side wall 903, as shown in FIG. Figure 6a Or as shown in 6b. At the same time, Figure 6b As shown, the insulating layer 800 not only covers the sidewalls of the protection electrode 900 , but also covers a portion of the surface of the protection electrode 900 .

[0153] It should be noted that the insulating layer 800 in this embodiment can be in any shape, as long as the surface of the insulating layer 800 does not form a depression, the problem of avoiding negative pressure between the blue film and the light-emitting device can be solved. At the same time, the protective electrode 900 can also be provided to solve the above-mentioned problem in this embodiment. For example, Figure 7 As shown, the thickness of the protective electrode 900 is set to be greater than or equal to the thickness of the insulating layer 800, so that no depression is formed on the surface of the insulating layer 800, thereby avoiding the problem of negative pressure between the blue film and the light-emitting device.

[0154] Example 3

[0155] This embodiment is similar to the embodiment described in Example 1. Figure 1a and 2a Or attach Figure 3 and 4a The similarities of the light emitting devices of -4b are not repeated here, and the differences are as follows:

[0156] Figure 8a In this embodiment, a specific embodiment is Figure 3 Schematic diagram of the cross section along the C-C' direction; Figure 8b In this embodiment, a specific embodiment is Figure 3 Schematic diagram of the cross section along the B-B' direction. Figure 8a Or refer to Figure 8b In this embodiment, the filling layer 600 formed between adjacent light-emitting elements includes a first filling structure, the filling structure is at least arranged at the side wall of each light-emitting element, and the first filling structure includes a first sublayer 611 and a second sublayer 612 formed on the first sublayer 611, and the thickness of the first sublayer 611 is less than the thickness of the second sublayer 612. Among them, the first sublayer 611 can absorb the light emitted from the adjacent light-emitting elements, avoid the light crosstalk between the adjacent light-emitting elements, and form a good contrast with the second sublayer 612. The second sublayer 612 can reflect the light at the side wall of the light-emitting element to the light-emitting direction, and can also avoid the light crosstalk between the adjacent light-emitting elements. At the same time, due to the presence of the second sublayer 612, the contrast of the light-emitting device can also be improved, which is conducive to the improvement of the display effect. The filling layer 600 in Example 1 is formed as a whole layer of black light-absorbing layer. Only the black light-absorbing layer is used to absorb the light emitted from the side of the chip, which will increase the light loss of the chip itself. Therefore, compared with the setting of the filling layer 600 in Example 1, the light output of this embodiment is increased and the display effect is better.

[0157] Optionally, the first sublayer 611 in this embodiment is a black material layer, and the black material layer contains a black filling component, and the black filling component includes at least one of carbon black, titanium nitride, iron oxide, ferroferric oxide or iron powder. The second sublayer 612 is a white reflective material layer or a DBR reflective layer, and specifically can be a white reflective material layer, and then the white reflective material layer can form a strong contrast with the black material layer of the first sublayer 611. Optionally, the white reflective material layer can be a foam material of polyethylene terephthalate, a highly reflective white polypropylene, a white polycarbonate (PC) resin, etc.

[0158] Specifically, refer to Figure 8a , Figure 8b or Fig. 9The filling layer 600 may be integrally formed into a first filling structure 610 , which includes a first sub-layer 611 and a second sub-layer 612 .

[0159] In a specific embodiment of this embodiment, Figure 8a and 8b As shown, the filling layer 600 is formed as a first filling structure 610 as a whole, and along the direction from the light-emitting element to the wiring layer 700, the first filling structure 610 includes a first sublayer 611 and a second sublayer 612 in sequence along the side wall of the light-emitting element, and the ratio of the thickness of the first sublayer 611 to the second sublayer 612 is 0.2 to 1, and optionally, the ratio of the thickness of the first sublayer 611 to the second sublayer 612 is 0.4 to 0.8. For example, the ratio of the thickness of the first sublayer 611 to the second sublayer 612 is 5:8, and this ratio of the first sublayer 611 to the second sublayer 612 can effectively improve the brightness of the light-emitting element. The light-emitting device obtained by Figures 1 and 2 in Example 1 and the light-emitting device obtained in this embodiment are tested for brightness, and it can be obtained that the brightness of the red light-emitting element, the green light-emitting element and the blue light-emitting element in the light-emitting device obtained by Figures 1 and 2 in Example 1 can all reach 100%. In the light-emitting device obtained in this embodiment, the brightness of the red light-emitting element can be increased to 101%, the green light-emitting element can be increased to 102.5%, and the blue light-emitting element can be increased to 103%. Fig. 9 As shown, the filling layer 600 is formed as a first filling structure 610 as a whole, and along the direction from the light-emitting element to the wiring layer 700, the filling structure includes a first sublayer 611 and a second sublayer 612 in sequence along the side wall of the light-emitting element, and the thickness ratio of the first sublayer 611 to the second sublayer 612 is 0.2-1. At the same time, in order to avoid the lateral emission of the backlight of the light-emitting device causing crosstalk. The insulating layer 800 in this embodiment is also set as a black material layer, and the black material layer contains a black filling component, and the black filling component includes at least one of carbon black, titanium nitride, iron oxide, ferroferric oxide or iron powder. Furthermore, the insulating layer 800 can avoid crosstalk caused by the lateral emission of the backlight. Optionally, a material layer is also formed between the two electrodes of each light-emitting element. The material layer and the insulating layer 800 are not realized based on the same process. The material layer can be a black material layer or a white reflective material layer. For example, when the material layer is a white material layer, it can reflect the backlight incident to increase the brightness of the light-emitting device.

[0160] Reference Fig.10 or Fig.11 The filling layer 600 may also include a first filling structure 610 and a second filling structure 620. In a specific embodiment of this embodiment, as Fig.10As shown, the filling layer 600 includes a first filling structure 610 and a second filling structure 620. There is a gap 601 between the second filling structure 620 and the side wall of the light emitting element, and the first filling structure 610 is filled in the gap 601. Along the direction from the light emitting element to the wiring layer 700, the filling structure includes a first sublayer 611 and a second sublayer 612 in sequence along the side wall of the light emitting element. The ratio of the thickness of the first sublayer 611 to the second sublayer 612 is 0.2 to 1. In a specific embodiment of this embodiment, as shown in FIG. Fig.11 As shown, the filling layer 600 includes a first filling structure 610 and a second filling structure 620. A groove 203 is formed on the surface of the second filling structure 620 close to the wiring layer 700. The bottom wall of the groove 203 is formed as a first sublayer 611. A second sublayer 612 is formed in the groove 203. In addition, the second sublayer 612 is formed as a DBR reflective layer. In the direction from the light-emitting element to the wiring layer 700, the filling structure includes the first sublayer 611 and the second sublayer 612 in sequence along the side wall of the light-emitting element. The ratio of the thickness of the first sublayer 611 to the second sublayer 612 is 0.2 to 1.

[0161] Optionally, the adhesive layer 300 used to bond the transparent layer 100 and the plurality of light emitting elements can be replaced with a high refractive index material to avoid the reduction of the light emitted by the light emitting element at the interface between the light emitting element and the adhesive layer 300, thereby further increasing the brightness of the light emitting device. For example, the material of the adhesive layer 300 can be epoxy resin.

[0162] Example 4

[0163] This embodiment is similar to the embodiment described in Example 1. Figure 1a and 2a Or attach Figure 3 and 4a The similarities of the light emitting devices of -4b are not repeated here, and the differences are as follows:

[0164] Fig.12a This is a specific embodiment of the present embodiment. Figure 3 Schematic diagram of the C-C' section, Figure 12b This is a specific embodiment of the present embodiment. Figure 3 Schematic diagram of the cross section along B-B'.

[0165] Reference Fig.12aOr 12b, in this embodiment, an overhead layer 200 is provided between the transparent layer 100 and the adhesive layer 300, and the overhead layer 200 is formed on the surface of the transparent layer 100. The overhead layer 200 includes a first surface 201 and a second surface 202 which are arranged opposite to each other. The first surface 201 is in contact with the transparent layer 100, and at least one groove 602 is formed on the second surface 202, and the groove 602 is recessed from the second surface 202 to the first surface 201. The adhesive layer 300 is formed at least on the second surface 202 of the overhead layer 200. A plurality of light-emitting elements are arranged at intervals on the adhesive layer 300, and at least one light-emitting element corresponds to one groove 602, and a part of the surface of the light-emitting element is in contact with the adhesive layer 300. When the luminous intensity of the light-emitting element is large or the luminous intensity changes suddenly, the adhesive layer 300 located on the light-emitting side of the light-emitting element will also age under high temperature or high humidity environment, resulting in the thickness of the adhesive layer 300 becoming thinner or bubbles being generated in the layer, and the change in the structure of the adhesive layer 300 will also affect the light emitted from the light-emitting element to the transparent layer 100, and even change the luminous intensity of the light-emitting element, resulting in unstable reliability of the product, especially for blue light-emitting elements. This phenomenon is particularly significant. In this embodiment, an overhead layer 200 is set between the transparent layer 100 and the adhesive layer 300, and the adhesive layer 300 is separated from the light-emitting area of ​​the light-emitting element by the groove 602 set on the overhead layer 200, so as to avoid the light emitted by the light-emitting element affecting the properties of the adhesive layer 300, thereby ultimately affecting the light emission intensity of the entire device and improving the reliability of the device.

[0166] Specifically, refer to Fig.12a , 12b Alternatively, the groove 602 formed on the overhead layer 200 may also completely penetrate the overhead layer 200 to expose the surface of the transparent layer 100. At this time, the overhead layer 200 may be a light-transmitting layer or a photoresist layer. Optionally, the photoresist layer contains a black filling component, and the black filling component includes at least one of carbon black, titanium nitride, iron oxide, ferroferric oxide or iron powder. Optionally, the light-transmitting layer may be transparent silicon dioxide, transparent polyimide, etc. Fig.14 The groove 602 formed on the overhead layer 200 may partially penetrate the overhead layer 200, so that the depth of the groove 602 is less than the thickness of the overhead layer 200. At this time, the overhead layer 200 is formed as a light-transmitting layer as a whole to avoid blocking the light output of the light-emitting element.

[0167] Reference Fig.12a , 12b Alternatively, 13, the adhesive layer 300 is formed at least on the second surface 202. Fig.13 , the adhesive layer 300 may be formed only on the second surface 202; Fig.12a , 12b, 14 or 15, can also be formed on the second surface 202 and the inner wall of the groove 602 at the same time. When the adhesive layer 300 is formed on the inner wall of the groove 602, it is necessary to control the distance between the adhesive layer 300 located on the bottom wall of the groove 602 and the light-emitting element suspended above the groove 602 to ensure that when the light-emitting intensity of the light-emitting element suddenly changes, the light-emitting intensity affects the structure of the adhesive layer 300. In this embodiment, Fig.12a , 12b , 14 or 15, the vertical distance between the adhesive layer 300 located on the bottom wall of the groove 602 and the light-emitting area of ​​the corresponding light-emitting element is between 5μm and 17μm, and the thickness of the overhead layer 200 and the depth of the groove 602 can be adjusted according to the vertical distance between the adhesive layer 300 and the light-emitting area of ​​the corresponding light-emitting element, which will not be described in detail here.

[0168] Reference Figures 12a to 15 , multiple light-emitting elements are arranged on the adhesive layer 300 at intervals, the light emission area of ​​at least one light-emitting element corresponds to a groove 602, and the edge of the light-emitting element is in contact with the adhesive layer 300 formed on the second surface 202 of the overhead layer 200, so that the light-emitting area of ​​the light-emitting element is suspended on the groove 602. Optionally, the multiple light-emitting elements may include at least three light-emitting elements that emit light of different colors from each other, and one of the light-emitting elements is a light-emitting element that radiates blue light. In this case, only one groove 602 may be formed on the overhead layer 200, and the light-emitting area of ​​the light-emitting element that radiates blue light corresponds to the groove 602. Optionally, the multiple light-emitting elements include three light-emitting elements, each of which is a light-emitting element that radiates blue light. In this case, three grooves 602 are arranged on the overhead layer 200, and each groove 602 corresponds to one light-emitting element. Optionally, when the multiple light-emitting elements are respectively a light-emitting element that radiates red light, a light-emitting element that radiates blue light, and a light-emitting element that radiates blue light, three grooves 602 may also be arranged on the overhead layer 200,

[0169] In a specific embodiment of this embodiment, if Fig.12a As shown, three grooves 602 are arranged on the second surface 202 of the overhead layer 200, and the grooves 602 completely penetrate the overhead layer 200, so that the bottom of the grooves 602 exposes the transparent layer 100. The adhesive layer 300 is formed on the second surface 202 of the overhead layer 200 and the inner wall of the grooves 602. In addition, the light-emitting device in this embodiment includes three light-emitting elements, namely a first light-emitting element 501, a second light-emitting element 502 and a third light-emitting element 503, wherein the first light-emitting element 501 is a red light-emitting element, the second light-emitting element 502 is a green light-emitting element, and the third light-emitting element 503 is a blue light-emitting element, and the light-emitting area of ​​each light-emitting element corresponds to a groove 602 overhead arrangement. The overhead layer 200 is formed as a light-blocking layer to prevent light crosstalk between adjacent light-emitting elements.

[0170] In a specific embodiment of this embodiment, if Fig.13 As shown, the adhesive layer 300 is only formed on the second surface 202 of the overhead layer 200. In addition, the groove 602 completely penetrates the overhead layer 200, so that the bottom of the groove 602 exposes the transparent layer 100.

[0171] In a specific embodiment of this embodiment, if Fig.14 As shown, the groove 602 penetrates part of the overhead layer 200, and the depth of the groove 602 is less than the thickness of the overhead layer 200. At this time, the overhead layer 200 is a light-transmitting layer so that light can pass through the bottom wall of the groove 602 through the overhead layer 200. The material of the light-transmitting layer is transparent polyimide.

[0172] In a specific embodiment of this embodiment, if Fig.15 As shown, a groove 602 is provided on the second surface 202 of the overhead layer 200, and the groove 602 penetrates the overhead layer 200 so that the bottom of the groove 602 exposes the surface of the transparent layer 100. At this time, the overhead layer 200 is formed as a light blocking layer to prevent light crosstalk between adjacent light-emitting elements. The adhesive layer 300 is formed on the second surface 202 and the inner wall of the groove 602. The light-emitting device in this embodiment includes three light-emitting elements, namely a first light-emitting element 501, a second light-emitting element 502 and a third light-emitting element 503. The first light-emitting element 501 is a red light-emitting element, the second light-emitting element 502 is a green light-emitting element, and the third light-emitting element 503 is a blue light-emitting element. The light-emitting area of ​​the blue light-emitting element corresponds to the groove 602 on the overhead layer 200.

[0173] Example 5

[0174] This embodiment is similar to the Figures 1 and 2a or Figure 2 described in Example 1. Figure 3 The similarities with the light emitting device of 4 are not repeated here, and the difference is that:

[0175] Reference Figure 16a-19 The light-emitting device in this embodiment is further provided with a plurality of angle adjustment layers 400 between the transparent layer 100 and the plurality of light-emitting elements, and the angle adjustment layers 400 correspond to the light-emitting elements one by one. The angle adjustment layer 400 can adjust the light-emitting angle of each light-emitting element and expand the light-emitting angle of each light-emitting element to avoid the occurrence of a light-emitting blind area between adjacent light-emitting elements, thereby affecting the display effect. Optionally, the angle adjustment layer 400 can be a DBR reflective layer, which can have a reflectivity of more than 80% for light with an incident angle of 0 to 20 degrees, a reflectivity of 45% to 60% for light with an incident angle of 20 to 35 degrees, and a reflectivity of less than 40% for light with an incident angle of 35 to 90 degrees.

[0176] Specifically, refer to Fig.16a or Fig.17 , the number of light-emitting elements is three, and when the three light-emitting elements are red light-emitting elements, green light-emitting elements, and blue light-emitting elements, respectively, the angle adjustment layer 400 corresponding to each light-emitting element is different. At this time, the angle adjustment layer 400 includes a first angle adjustment layer 401, a second angle adjustment layer 402, and a third angle adjustment layer 403, wherein the first angle adjustment layer 401 corresponds to the red light-emitting element; the second angle adjustment layer 402 corresponds to the green light-emitting element, and the third angle adjustment layer 403 corresponds to the blue light-emitting element. In addition, the first angle adjustment layer 401 can have a reflectivity of more than 80% for light with a wavelength range of 620nm to 760nm and an incident angle of 0 to 20 degrees, a reflectivity of 45% to 60% for light with a wavelength range of 620nm to 760nm and an incident angle of 20 to 35 degrees, and a reflectivity of less than 40% for light with a wavelength range of 620nm to 760nm and an incident angle of 35 to 90 degrees. The second angle adjustment layer 402 can have a reflectivity of more than 80% for light with a wavelength range of 490nm to 577nm and an incident angle of 0 to 20 degrees, a reflectivity of 45% to 60% for light with a wavelength range of 490nm to 577nm and an incident angle of 20 to 35 degrees, and a reflectivity of less than 40% for light with a wavelength range of 490nm to 577nm and an incident angle of 35 to 90 degrees. The third angle adjustment layer 403 can have a reflectivity of more than 80% for light with a wavelength range of 420nm to 480nm and an incident angle of 0 to 20 degrees, a reflectivity of 45% to 60% for light with a wavelength range of 420nm to 480nm and an incident angle of 20 to 35 degrees, and a reflectivity of less than 40% for light with a wavelength range of 420nm to 480nm and an incident angle of 35 to 90 degrees. Reference Fig.18 When all three light-emitting elements are blue light-emitting elements, the structure of the angle adjustment layer 400 provided on each light-emitting element and the reflectivity of each light angle are the same, that is, the angle adjustment layer 400 corresponding to each light-emitting element is the same angle adjustment layer 400. The angle adjustment layer 400 can have a reflectivity of more than 80% for light with a wavelength range of 420nm to 480nm and an incident angle of 0 to 20 degrees, a reflectivity of 45% to 60% for light with a wavelength range of 420nm to 480nm and an incident angle of 20 to 35 degrees, and a reflectivity of less than 40% for light with a wavelength range of 420nm to 480nm and an incident angle of 35 to 90 degrees.

[0177] Reference Fig. 20 , the light output angle in embodiment 1 is only between -65° and +60°, while in this embodiment, the light output angle range of each light emitting element can reach between -80° and +80° through the arrangement of the angle adjustment layer 400. Fig.21 shown.

[0178] Optionally, each angle adjustment layer 400 is a DBR reflective layer, and the DBR reflective layer is formed by alternating layers of materials with different refractive indices. The material of the DBR reflective layer is at least two of the different materials of SiO2, TiO2, ZnO2, ZrO2, and Cu2O3. In this embodiment, the DBR reflective layer may be an alternately stacked TiO2 layer / SiO2 layer structure. Each layer may have an optical thickness of 1 / 4 of a specific wavelength and may be formed into 4 to 20 pairs. The specific DBR reflective layer structure may be designed for the reflectivity of the desired angle range or wavelength range, which will not be described in detail herein.

[0179] In a specific embodiment of this embodiment, refer to Fig.16a The three light-emitting elements of the light-emitting device are red light-emitting element, green light-emitting element and blue light-emitting element, respectively, and the angle adjustment layer 400 includes a first angle adjustment layer 401, a second angle adjustment layer 402 and a third angle adjustment layer 403. A plurality of openings 301 are provided on the adhesive layer 300, and an angle adjustment layer 400 is embedded in each opening 301.

[0180] In a specific embodiment of this embodiment, refer to Fig.17 The three light-emitting elements of the light-emitting device are respectively a red light-emitting element, a green light-emitting element and a blue light-emitting element. The angle adjustment layer 400 includes a first angle adjustment layer 401, a second angle adjustment layer 402 and a third angle adjustment layer 403. Each angle adjustment layer 400 is arranged on the surface of the adhesive layer 300 close to the multiple light-emitting elements.

[0181] In a specific embodiment of this embodiment, refer to Fig.18 The three light-emitting elements of the light-emitting device are all blue light-emitting elements, and the angle adjustment layer 400 corresponding to each light-emitting element is the same. Each angle adjustment layer 400 is arranged on the surface of the adhesive layer 300 close to the multiple light-emitting elements.

[0182] In a specific embodiment of this embodiment, refer to Fig.19, the three light-emitting elements in the light-emitting device are respectively a red light-emitting element, a green light-emitting element and a blue light-emitting element, the angle adjustment layer 400 includes a first angle adjustment layer 401, a second angle adjustment layer 402 and a third angle adjustment layer 403, each angle adjustment layer 400 is arranged on the transparent layer 100, and the adhesive layer 300 covers the angle adjustment layer 400 and the transparent layer 100 between the adjacent angle adjustment layers 400. The three light-emitting elements are formed on the adhesive layer 300 and correspond to the first angle adjustment layer 401, the second angle adjustment layer 402 and the third angle adjustment layer 403. Optionally, the area of ​​each angle adjustment layer is larger than the area of ​​each light-emitting element, so as to facilitate the angle adjustment of the lateral light output of the light-emitting element.

[0183] It should be noted that any two or more of the above-mentioned embodiments 1 to 5 can be combined. For example, any insulating layer structure described in embodiment 1 can be applied to embodiment 2, or the filling structure in embodiment 2 can be applied to embodiment 3, 4 or 5, or embodiments 2 to 5 can be applied to embodiment 1 at the same time, etc. Other combinations will not be listed one by one here.

[0184] Example 6

[0185] This embodiment provides a display device, referring to Fig. 22 The display device includes a display substrate 005 and at least one light-emitting device 006 formed on the display substrate 005. The light-emitting device can fix the wiring layer with the display substrate 005 and form an electrical connection by means of solder paste or the like, or can form a protective electrode on the wiring layer, and then fix the protective electrode with the display substrate 005 and form an electrical connection by means of solder paste or the like. The light-emitting device is any one of the light-emitting devices described in any one of the above embodiments 1 to 5, or any combination of the above embodiments. Similarly, it has the technical effects possessed by the above light-emitting devices.

[0186] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A light emitting device, characterized in that: include: Transparent layer; An overhead layer is formed on the surface of the transparent layer, the overhead layer comprises a first surface and a second surface which are arranged opposite to each other, the first surface is in contact with the transparent layer, at least one groove is formed on the second surface of the overhead layer, and the groove is concave in a direction from the second surface to the first surface; An adhesive layer is formed at least on the second surface of the overhead layer; A plurality of light emitting elements are arranged on the adhesive layer at intervals, and at least one of the light emitting elements corresponds to one of the grooves so that a portion of the surface of the light emitting element contacts the adhesive layer; The wiring layer is disposed on the plurality of light emitting elements, and the wiring layer is electrically connected to each light emitting element.

2. The light emitting device according to claim 1, characterized in that: The groove passes through a portion of the overhead layer, and the depth of the groove is less than the thickness of the overhead layer.

3. The light emitting device according to claim 2, characterized in that: The overhead layer is formed as a light-transmitting layer.

4. The light emitting device according to claim 3, characterized in that: The material of the light-transmitting layer is transparent polyimide.

5. The light emitting device according to claim 1, characterized in that: The groove passes through the overhead layer, and the bottom of the groove exposes the surface of the transparent layer.

6. The light emitting device according to claim 5, characterized in that: The overhead layer is formed as a photoresist layer.

7. The light emitting device according to claim 6, characterized in that: The photoresist layer contains a black filling component, and the black filling component includes at least one of carbon black, titanium nitride, iron oxide, ferroferric oxide or iron powder.

8. The light emitting device according to claim 1, characterized in that: The adhesive layer is formed on the second surface and the inner wall of the groove.

9. The light emitting device according to claim 8, characterized in that: The vertical distance between the adhesive layer on the bottom wall of the groove and the corresponding light emitting area of ​​the light emitting element is between 5 μm and 17 μm.

10. The light emitting device according to claim 1, characterized in that: The adhesive layer is formed on the second surface.

11. The light emitting device according to claim 1, characterized in that: The material of the adhesive layer is epoxy resin.

12. The light emitting device according to claim 1, characterized in that: The plurality of light emitting elements include at least three light emitting elements emitting light of different colors from each other, wherein one of the light emitting elements is a light emitting element radiating blue light.

13. The light emitting device according to claim 12, characterized in that: A groove is formed on the second surface of the overhead layer, and the groove corresponds to the light emitting area of ​​the blue light emitting element.

14. The light emitting device according to claim 1, characterized in that: The plurality of light-emitting elements include three light-emitting elements, each of which is a light-emitting element that radiates blue light.

15. The light emitting device according to claim 12 or 14, characterized in that: Three grooves are formed on the second surface of the overhead layer, and the grooves correspond to the light-emitting areas of each of the light-emitting elements one by one.

16. The light emitting device according to claim 1, characterized in that: The light emitting device further comprises: The filling layer is filled between adjacent light emitting elements.

17. The light emitting device according to claim 16, characterized in that: The wiring layer comprises: The first layer is in contact with the light emitting element and the filling layer, and is electrically connected to the light emitting element; The second layer has one side electrically connected to the first layer.

18. The light emitting device according to claim 1, characterized in that: The light emitting device further comprises: A plurality of protection electrodes are formed on the wiring layer at intervals and are electrically connected to the wiring layer.

19. The light emitting device according to claim 1, characterized in that: The light emitting device further comprises: An insulating layer is formed on a portion of the wiring layer.

20. A display device, characterized in that: include: Display substrate; At least one light-emitting device is disposed on the surface of the display substrate, the light-emitting device is electrically connected to the display substrate, and the light-emitting device is the light-emitting device according to any one of claims 1 to 19.

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