Display panel, manufacturing method thereof and display device

Abstract

The invention relates to a display panel, a manufacturing method thereof and a display device. The display panel comprises a display area and a non-display area, the non-display area at least partially surrounds the display area, and the display panel comprises a substrate, a wiring layer, a light-emitting layer and an isolation structure. The wiring layer is located on one side of the substrate and comprises a metal layer located in the display area and a signal line layer located in the non-display area. The light-emitting layer is located on the side, opposite to the substrate, of the wiring layer and comprises a plurality of light-emitting units. The isolation structure is located on the side, opposite to the substrate, of the wiring layer, and the isolation structure is provided with an isolation opening used for containing the light-emitting unit. Wherein the isolation structure is electrically connected with the signal line layer, and one side, opposite to the substrate, of at least part of the signal line layer is provided with a protection part. According to the invention, the possibility of damage to the signal line layer in the non-display area can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Flat display panels such as Organic Light Emitting Display (OLED) panels and display panels using light emitting diode (LED) devices have the advantages of high image quality, power saving, thin body and wide application range. They are widely used in various consumer electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, desktop computers, etc., becoming the mainstream in display devices.

[0003] However, some current organic light emitting diode display panels still have the problem of poor signal. Summary of the invention

[0004] Embodiments of the present invention provide a display panel and a manufacturing method thereof, and a display device, which can reduce the possibility of signal wiring damage in a non-display area.

[0005] In a first aspect, an embodiment of the present invention provides a display panel, the display panel includes a display area and a non-display area, the non-display area is at least partially arranged around the display area, and the display panel includes a substrate, a wiring layer, a light-emitting layer and an isolation structure. The wiring layer is located on one side of the substrate, and the wiring layer includes a metal layer located in the display area and a signal line layer located in the non-display area. The isolation structure is located on the side of the wiring layer facing away from the substrate, and the isolation structure is provided with an isolation opening for accommodating the light-emitting unit. The isolation structure is electrically connected to the signal line layer, and a protective portion is provided on at least part of the signal line layer on the side facing away from the substrate.

[0006] In some embodiments, the signal line layer includes a first surface located on a side thereof facing away from the substrate and a second surface connected to both sides of the first surface and extending toward the substrate, and the protection portion covers the first surface and the second surface.

[0007] In some embodiments, the signal line layer and the metal layer are disposed on the same layer and at least partially made of the same material.

[0008] In some embodiments, the routing layer also includes a conductive connection portion located in the display area, the substrate includes a driving circuit, and the display panel also includes a first electrode, the first electrode is located on the side of the conductive connection portion facing away from the driving circuit, and the first electrode and the driving circuit are connected via the conductive connection portion.

[0009] In some embodiments, the display panel also includes a pixel definition layer, which is disposed on a substrate. The pixel definition layer includes a pixel defining portion and a pixel opening defined by the pixel defining portion. The pixel opening is connected to the isolation opening to accommodate the light-emitting unit. The orthographic projection of the inner wall of each pixel opening on the substrate is located within the orthographic projection of the inner wall of each isolation opening on the substrate. At least part of the protective portion and the pixel defining portion are arranged with the same material.

[0010] In some embodiments, the isolation structure is disposed on a side of the pixel defining portion facing away from the substrate, or a receiving groove is disposed on the pixel defining portion, and the isolation structure is disposed in the receiving groove.

[0011] In some embodiments, the material of the protection part includes an inorganic material.

[0012] In some embodiments, the pixel defining portion is provided with a via hole, and the signal line layer is electrically connected to the isolation structure through the via hole.

[0013] In some embodiments, the substrate also includes a planarization layer, the protective portion includes a first sublayer and a second sublayer stacked along the thickness direction of the substrate, the first sublayer and the planarization layer are made of the same material, and the second sublayer and the pixel defining portion are made of the same material.

[0014] In some embodiments, the isolation structure includes a first isolation portion and a second isolation portion located on a side of the first isolation portion away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate. The display panel also includes a conductive portion located in the non-display area, the conductive portion is located on a side of the protection portion facing away from the signal line layer, and the conductive portion and the first isolation portion are provided with the same material.

[0015] In some embodiments, the material of the conductive part includes molybdenum or aluminum.

[0016] In some embodiments, the isolation structure further includes a third isolation portion, the first isolation portion is located between the third isolation portion and the second isolation portion, and the conductive portion and the third isolation portion are made of the same material.

[0017] In a second aspect, an embodiment of the present invention provides a method for manufacturing a display panel, the steps of which are as follows: forming a wiring layer on one side of a substrate, the wiring layer including a metal layer located in a display area and a signal line layer located in a non-display area. Forming a protective material layer on the side of the signal line layer facing away from the substrate, patterning the protective material layer to form a protective portion located on the side of the signal line layer facing away from the substrate. Forming an isolation structure on the side of the wiring layer facing away from the substrate, the isolation structure encloses an isolation opening for accommodating a light-emitting unit.

[0018] In some embodiments, a protective material layer is formed on the side of the signal line layer facing away from the substrate, and the protective material layer is patterned to form a protective portion located on the side of the signal line layer facing away from the substrate: the protective material layer is patterned to further form a pixel defining portion and a pixel opening, the pixel opening is connected with the isolation opening to accommodate the light-emitting unit, the inner wall of each pixel opening is located within the orthographic projection of each isolation opening on the substrate, the pixel opening is used to accommodate the light-emitting unit, and at least part of the protective portion and the pixel defining portion are set with the same material.

[0019] In a third aspect, an embodiment of the present invention provides a display device, comprising the display panel as described above.

[0020] The embodiment of the present invention provides a display panel and a manufacturing method thereof, and a display device. In the manufacturing process of the display panel, the signal line layer is manufactured before the isolation structure, and before the isolation structure or the subsequent film layer of the signal line layer is manufactured, a protective portion can also be prepared on the side of the signal line layer facing away from the substrate, thereby reducing the possibility of erosion of the signal line layer during the manufacturing process of the isolation structure or other subsequent film layers, resulting in damage to the signal line layer, thereby improving the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Other features, objects and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.

[0022] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0023] Figure 2 yes Figure 1 A schematic diagram of the relative position relationship between the isolation structure and the first signal line in the middle region Q;

[0024] Figure 3 yes Figure 2 Schematic diagram of the cross-sectional structure at AA in the middle;

[0025] Figure 4 is a schematic diagram of a cross-sectional structure of another display panel at AA provided by an embodiment of the present invention;

[0026] Figure 5 is a schematic diagram of a cross-sectional structure of another display panel at AA provided by an embodiment of the present invention;

[0027] Figure 6 is a schematic cross-sectional structure diagram of a display panel provided by an embodiment of the present invention;

[0028] Figure 7is a schematic diagram of a cross-sectional structure of another display panel at AA provided by an embodiment of the present invention;

[0029] Figure 8 is a schematic diagram of a cross-sectional structure of another display panel at AA provided by an embodiment of the present invention;

[0030] Fig. 9 is a schematic diagram of a cross-sectional structure of another display panel at AA provided by an embodiment of the present invention;

[0031] Fig.10 is a schematic flow chart of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0032] Figures 10a to 10c is a schematic diagram of a manufacturing process of a method for manufacturing a display panel provided by an embodiment of the present invention;

[0033] Figure 11a to Figure 11b It is a schematic diagram of a preparation process of another method for preparing a display panel provided in an embodiment of the present invention.

[0034] Description of reference numerals:

[0035] 10. substrate; 11. driving circuit; 12. planarization layer;

[0036] 20. Isolation structure; 21. Isolation opening; 22. First isolation part; 23. Second isolation part; 24. Third isolation part;

[0037] 30. Light emitting unit;

[0038] 40, routing layer; 41, signal line layer; 411, first surface; 412, second surface; 42, conductive connection portion; 43, signal line connection portion;

[0039] 50. protection part; 51. first sublayer; 52. second sublayer;

[0040] 60. a first electrode;

[0041] 70. a second electrode;

[0042] 80, pixel definition layer; 81, pixel defining portion; 811, receiving groove; 82, pixel opening; 90, conductive portion;

[0043] D1, protective material layer; D2, pixel definition material layer; IC, driver chip;

[0044] AA, display area; NA, non-display area;

[0045] X, first direction; Y, thickness direction.

[0046] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale. DETAILED DESCRIPTION

[0047] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In the detailed description below, many specific details are proposed in order to provide a comprehensive understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention. In the drawings and the following description, at least part of the known structures and technologies are not shown in order to avoid unnecessary ambiguity of the present invention; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0048] In the description of the present invention, it should be noted that, unless otherwise specified, "plurality" means more than two; the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0049] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present invention. In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0050] In the related art, a variety of circuit structures are usually arranged at the frame of the display panel to meet the normal operation requirements of the display panel. After these circuit structures are manufactured, other structures are usually manufactured in the display area. During the manufacturing process of other structures, the circuit structures will be corroded, causing damage to the circuit structures themselves, resulting in reduced signal transmission effect or even failure.

[0051] Therefore, in order to solve the above problems, in a first aspect, embodiments of the present invention provide a display panel and a manufacturing method thereof, and a display device.

[0052] Figure 1It is a schematic diagram of the structure of a display panel provided by an embodiment of the present invention. Figure 2 yes Figure 1 Schematic diagram of the relative position relationship between the isolation structure and the first signal line in the middle area Q. Figure 3 yes Figure 2 Schematic diagram of the cross-sectional structure at AA in the middle.

[0053] like Figures 1 to 3 As shown, the display panel provided by the present invention includes a display area AA and a non-display area NA, and the non-display area NA is at least partially arranged around the display area AA. The display panel includes a substrate 10, a wiring layer 40, a light-emitting layer, and an isolation structure 20. The wiring layer 40 is located on one side of the substrate 10, and the wiring layer 40 includes a metal layer located in the display area AA and a signal line layer 41 located in the non-display area NA. The isolation structure 20 is located on the side of the wiring layer 40 facing away from the substrate 10, and the isolation structure 20 is provided with an isolation opening 21 for accommodating the light-emitting unit 30. Among them, the isolation structure 20 is electrically connected to the signal line layer 41, and a protective portion 50 is provided on the side of at least part of the signal line layer 41 facing away from the substrate 10.

[0054] The display panel has at least two areas, a display area AA and a non-display area NA. The display area AA is the main area in the display panel for achieving the display effect. The non-display area NA is arranged on the outer peripheral side of the display area AA and is mainly used to arrange the signal lines in the display panel. The embodiment of the present invention does not limit the size and shape of the display area AA and the non-display area NA. For example, the display area AA can be a rectangular structure, and the non-display area NA is arranged on at least one side of the circumference of the display area AA. The non-display area NA can be an annular, semi-annular or strip-shaped structure.

[0055] The substrate 10 mainly plays a supporting role, and other film layers are stacked on the substrate 10 in sequence. The stacking arrangement mentioned here means that the other film layers are arranged in sequence along the thickness direction Y of the substrate 10. Among them, the substrate 10 may include multiple film layer structures, and the embodiment of the present invention does not limit the specific film layer structure composition of the substrate 10. And the thickness direction Y of other film layers located on one side of the substrate 10 is usually consistent with the thickness direction Y of the substrate 10 itself. Therefore, for the convenience of expression, the thickness direction Y of the substrate 10 or the thickness direction Y of other film layers mentioned later in the embodiment of the present invention are all illustrated in the same direction.

[0056] The isolation structure 20 is located on the side of the wiring layer 40 facing away from the substrate 10. The isolation structure 20 encloses an isolation opening 21 for accommodating the light-emitting unit 30. The light-emitting unit 30 is one of the main devices for realizing light-emitting display. Among them, the light-emitting unit 30 includes but is not limited to a red light-emitting unit for emitting red light, a blue light-emitting unit for emitting blue light, and a green light-emitting unit for emitting green light. Each light-emitting unit 30 may include a stacked hole injection layer (Hole Inject Layer, HIL), a hole transport layer (Hole Transport Layer, HTL), a light-emitting layer, an electron injection layer (Electron Inject Layer, EIL) and an electron transport layer (Electron Transport Layer, ETL).

[0057] The isolation opening 21 formed by the isolation structure 20 can accommodate the light-emitting unit 30. In other words, the orthographic projection of the light-emitting unit 30 on the substrate 10 is at least partially overlapped with the orthographic projection of the isolation opening 21 on the substrate 10, and the orthographic projection of the light-emitting unit 30 on the substrate 10 is at least partially located within the orthographic projection of the isolation opening 21 on the substrate 10. Furthermore, during the preparation of the light-emitting unit 30, due to the presence of the isolation structure 20, the light-emitting material can be separated into mutually independent light-emitting units 30 by the isolation structure 20, and the precision metal mask evaporation process can be omitted.

[0058] For example, taking the preparation of the red light-emitting unit before the preparation of the green light-emitting unit as an example, since the precision metal mask is eliminated, the red light-emitting material corresponding to the red light-emitting unit will first fall into each isolation opening 21, and then selectively etch and remove the red light-emitting material in part of the isolation opening 21, and retain the red light-emitting material in part of the isolation opening 21 to form a red light-emitting unit. After that, the green light-emitting material corresponding to the green light-emitting unit 30 will fall into each isolation opening 21, and then selectively etch and remove the green light-emitting material in part of the isolation opening 21, and retain the green light-emitting material in part of the isolation opening 21 to form a green light-emitting unit.

[0059] Further, the display panel may include a second electrode 70, the second electrode 70 and the first electrode 60 are respectively arranged on both sides of the light-emitting unit, and the second electrode 70 can be electrically connected to the isolation structure 20, that is, the isolation structure 20 may include a conductive material, and the second electrode 70 and the conductive material in the isolation structure 20 can be interconnected, so that the second electrodes in different isolation openings are interconnected to form a surface electrode through the isolation structure. Optionally, the second electrode 70 can be a cathode.

[0060] The conductive material in the isolation structure 20 for electrically connecting with the second electrode 70 may be in a grid shape in the display area, so that the second electrodes 70 in the display area can be interconnected to form a surface electrode with the help of the isolation structure 20. Alternatively, the conductive material in the isolation structure 20 for electrically connecting with the second electrode 70 may also be divided into a plurality of mutually independent conductive parts, that is, at least some of the second electrodes 70 may also receive or transmit power signals of different voltages with the help of the isolation structure 20, so as to realize independent or partitioned control of the light-emitting unit 30, which is not limited in the embodiment of the present invention.

[0061] The wiring layer 40 is arranged on one side of the substrate 10, and the wiring layer 40 includes a signal line layer 41 located in the non-display area NA, that is, the signal line layer 41 is insulated from other conductive film layers in the substrate 10 by an insulating layer. Optionally, a driver chip IC is also arranged in the non-display area NA of the display panel, and the signal line layer 41 is located between the driver chip IC and the display area AA. Optionally, the material of the signal line layer 41 includes a conductive material, and illustratively, the material of the signal line layer 41 includes a metal material.

[0062] The signal line layer 41 can be used to transmit the corresponding power signal to the second electrode 70. In the related art, the second electrode 70 is arranged in the entire display area, and the signal line layer 41 for electrically connecting with the second electrode 70 is usually located in the non-display area NA and arranged in a ring structure around the outer periphery of the second electrode 70. This arrangement causes the first electrode 60 to occupy too much size at the position of the display panel frame, which is not conducive to achieving a narrow frame effect.

[0063] In the embodiment of the present invention, the signal line layer 41 is not directly connected to the second electrode 70, but the power signal is transmitted to each second electrode 70 by means of the isolation structure 20. Specifically, since the isolation structure 20 itself is arranged corresponding to each second electrode 70, and signal transmission can be achieved between the two. Therefore, it is not necessary to extend the signal line layer 41 to the position of each second electrode 70, that is, the signal line layer 41 does not need to be arranged around each second electrode 70, and it is only necessary to arrange the signal line layer 41 on one side of the isolation structure 20 along the first direction X, and electrically connect and arrange it with the isolation structure 20. In this way, the power signal in the signal line layer 41 can be transmitted to each second electrode 70 by means of the isolation structure 20, so as to meet the needs of signal transmission. And since the signal line layer 41 is only located on one side of the isolation structure 20 along the first direction X, rather than in a ring structure, it helps to reduce the frame size of the display panel and improve the display effect. Optionally, the first direction X is arranged to intersect with the thickness direction Y.

[0064] It should be noted that the embodiment of the present invention does not limit the specific routing form of the signal line layer 41. In addition, according to different actual conditions, the signal line layer 41 can be completely located on one side of the isolation structure 20 along the first direction X, or a small number of signal line layers 41 can be located on other sides of the isolation structure 20 along different directions, as long as most of the signal line layers 41 are located on the same side of the isolation structure 20.

[0065] In the manufacturing process of the display panel provided by the embodiment of the present invention, the signal line layer 41 can be manufactured before the isolation structure 20, and before manufacturing the isolation structure 20 or manufacturing the subsequent film layer of the signal line layer 41, a protective portion 50 can also be prepared on the side of the signal line layer 41 facing away from the substrate 10, thereby reducing the possibility of erosion of the signal line layer 41 by the isolation structure 20 or other subsequent film layers during the manufacturing process, resulting in damage to the signal line layer 41, thereby improving the reliability of the display panel.

[0066] In some embodiments, Figure 3 As shown, the signal line layer 41 includes a first surface 411 located on the side facing away from the substrate 10 and a second surface 412 connected to both sides of the first surface 411 and extending toward the substrate 10 . The protection portion 50 covers the first surface 411 and the second surface 412 .

[0067] The embodiment of the present invention does not limit the specific size and shape of the signal line layer 41. For example, the cross section of the signal line layer 41 can be rectangular or trapezoidal, so as to reduce the resistance of the signal line layer 41. Taking the shape of the cross section of the signal line layer 41 as a trapezoid as an example, the first surface 411 and the second surface 412 of the signal line layer 41 can be the upper base and the waist of the trapezoid.

[0068] In the embodiment of the present invention, by setting the protection part 50 to cover the first surface 411 and the second surface 412, the possibility of the isolation structure 20 or other film layers corroding the signal line layer 41 during the manufacturing process is further reduced, and the possibility of the signal line layer 41 being damaged is reduced.

[0069] In some embodiments, the signal line layer 41 and the metal layer are disposed in the same layer and at least partially made of the same material, so that the signal line layer 41 and the metal layer can be manufactured and formed in the same process step.

[0070] Figure 4 It is a schematic diagram of the cross-sectional structure of another display panel at AA provided by an embodiment of the present invention.

[0071] In some embodiments, Figure 4As shown, the wiring layer 40 also includes a conductive connection portion 42 located in the display area AA, the substrate 10 includes a driving circuit 11, and the display panel also includes a first electrode 60 located between the light-emitting layer and the substrate. The first electrode 60 is located on the side of the conductive connection portion 42 facing away from the driving circuit 11, and the first electrode 60 and the driving circuit 11 are connected via the conductive connection portion 42.

[0072] Optionally, the first electrode 60 and the second electrode 70 are disposed on opposite sides of the light emitting unit 30 along the thickness direction Y, and the number of the first electrodes 60 is multiple, each first electrode 60 is disposed corresponding to each light emitting unit 30, and the first electrode 60 and the second electrode 70 jointly drive and control whether the light emitting unit 30 emits light. Exemplarily, the first electrode 60 is an anode, and the second electrode 70 is a cathode. A plurality of insulating layers may be disposed between the first electrode 60 and the driving circuit 11, and a through hole is disposed in the insulating layer, and the conductive connection portion 42 connects the first electrode 60 and the driving circuit 11 via the through hole.

[0073] Optionally, the material of the conductive connection part 42 is the same as that of the signal line layer 41. Exemplarily, the conductive connection part 42 and the signal line layer 41 are prepared and formed in the same process step.

[0074] In addition, the signal line layer 41 may be completely located in the non-display area NA, or the signal line layer 41 may also partially extend into the display area AA. Similarly, the isolation structure 20 may be completely located in the display area AA, or the isolation structure 20 may also partially extend into the non-display area NA. Similarly, the conductive connection portion 42 may be completely located in the display area AA, or the conductive connection portion 42 may also partially extend into the non-display area NA.

[0075] In some embodiments, Figure 3 and Figure 4 As shown, the display panel also includes a pixel definition layer 80, which is arranged on the substrate 10. The pixel definition layer 80 includes a pixel defining portion 81 and a pixel opening 82 defined by the pixel defining portion 81. The pixel opening 82 is connected with the isolation opening 21 to accommodate the light-emitting unit 30. The orthographic projection of each pixel opening 82 on the substrate 10 is located within the orthographic projection of each isolation opening 21 on the substrate 10. At least part of the protection portion 50 and the pixel defining portion 81 are set with the same material.

[0076] The pixel definition layer 80 includes a pixel defining portion 81 and a pixel opening 82. The pixel opening 82 is arranged corresponding to the isolation opening 21. For example, the orthographic projection of the pixel opening 82 on the substrate 10 can be located within the orthographic projection of the isolation opening 21 on the substrate 10, and the light-emitting unit 30 and part of the structure in the second electrode 70 can be located within the pixel opening 82.

[0077] In some examples, at least a portion of the protection portion 50 and the pixel defining portion 81 are made of the same material, that is, the protection portion 50 and the pixel defining portion 81 can be prepared and formed in the same process step.

[0078] From the foregoing content, it can be seen that the signal line layer 41 and the conductive connection part 42 can be prepared and formed in the same process step, so the distance between the signal line layer 41 and the substrate in the substrate 10 and the distance between the conductive connection part 42 and the substrate in the substrate 10 can be the same, so that the distance between the protective part 50 and the substrate can be less than or equal to the distance between the pixel defining part 81 and the substrate, thereby improving the influence of the protective part 50 on the film thickness of the non-display area NA, and then reducing the overall film thickness of the non-display area NA.

[0079] Figure 5 It is a schematic diagram of the cross-sectional structure of another display panel at AA provided by an embodiment of the present invention.

[0080] In some embodiments, Figure 4 and Figure 5 As shown, the isolation structure 20 is disposed on a side of the pixel defining portion 81 away from the substrate 10 , or a receiving groove 811 is disposed on the pixel defining portion 81 , and the isolation structure 20 is disposed in the receiving groove 811 .

[0081] The isolation structure 20 is arranged on the side of the pixel defining portion 81 away from the substrate 10, that is, the orthographic projection of the isolation structure 20 on the substrate 10 falls within the orthographic projection of the pixel defining portion 81 on the substrate 10, so as to improve the isolation effect of the isolation opening 21 enclosed by the isolation structure 20.

[0082] The pixel defining portion 81 is provided with a receiving groove 811, which can be formed by a depression on the side of the pixel defining portion 81 facing away from the substrate 10. Optionally, the depression depth of the receiving groove 811 can be the same as or different from the depression depth of the pixel opening 82. Optionally, the receiving groove 811 can be provided through the pixel defining portion 81.

[0083] Optionally, one or more accommodating grooves 811 may be provided between two adjacent pixel openings 82. The isolation structure 20 is provided in the accommodating groove 811, which can reduce the space occupied by the isolation structure 20 in the thickness direction Y of the display panel, thereby reducing the overall thickness of the display panel.

[0084] In some embodiments, the material of the protection part 50 includes inorganic material, so that the protection part 50 has better density, thereby reducing the possibility of the protection part 50 being corroded when it contacts the isolation structure 20 or other film layer etching liquid or etching gas, thereby reducing the possibility of the protection part 50 exposing at least part of the signal line layer 41, causing the signal line layer 41 to be corroded and leading to failure of the signal line layer 41.

[0085] Figure 6 It is a schematic diagram of the cross-sectional structure of a display panel provided by an embodiment of the present invention.

[0086] In some embodiments, Figure 6 As shown, the pixel defining portion 81 is provided with a via hole 43 , and the signal line layer 41 is electrically connected to the isolation structure 20 through the via hole 43 .

[0087] Optionally, a portion of the structure of the signal line layer 41 may extend to the display area AA, and a via hole is provided through the pixel defining portion 81 along the thickness direction of the display panel.

[0088] In other examples, part of the structure of the isolation structure 20 is located in the non-display area NA, and a via hole can be provided on the protection part 50. Specifically, after the isolation structure 20 is manufactured, a via hole 43 is formed on the protection part 50, and the part of the structure of the isolation structure 20 located in the non-display area NA can be electrically connected to the signal line layer 41 through the via hole 43.

[0089] Figure 7 It is a schematic diagram of the cross-sectional structure of another display panel at AA provided by an embodiment of the present invention.

[0090] In some embodiments, Figure 7 As shown, the substrate 10 also includes a planarization layer 12, and the protection part 50 includes a first sublayer 51 and a second sublayer 52 stacked along the thickness direction Y of the substrate 10, the first sublayer 51 and the planarization layer 12 are made of the same material, and the second sublayer 52 and the pixel defining part 81 are made of the same material.

[0091] Optionally, the areas of the signal line layer 41 covered by the first sublayer 51 and the second sublayer 52 of the protection portion 50 may be the same. For example, the first sublayer 51 covers the first surface 411 and the second surface 412 of the signal line layer 41, and the second sublayer 52 covers the areas of the first sublayer 51 corresponding to the first surface 411 and the second surface 412 of the signal line layer 41. Of course, the areas of the signal line layer 41 covered by the first sublayer 51 and the second sublayer 52 may also be different. For example, the first sublayer 51 covers the first surface 411 of the signal line layer 41, and the second sublayer 52 covers the areas of the first sublayer 51 corresponding to the first surface 411 of the signal line layer 41 and the second surface 412 of the signal line layer 41.

[0092] The first sublayer 51 and the planarization layer 12 are made of the same material, that is, the first sublayer 51 can be prepared and formed in the same process step as the planarization layer 12. The second sublayer 52 and the pixel defining portion 81 are made of the same material, that is, the second sublayer 52 and the pixel defining portion 81 can be prepared and formed in the same process step, which reduces the possibility that the second sublayer 52 reacts with other substances and causes the first sublayer 51 to also react with other substances, thereby improving the reliability of the protection portion 50.

[0093] Figure 8 It is a schematic diagram of the cross-sectional structure of another display panel at AA provided by an embodiment of the present invention.

[0094] In some embodiments, Figure 8 As shown, the isolation structure 20 includes a first isolation portion 22 and a second isolation portion 23 located on a side of the first isolation portion 22 away from the substrate 10, and the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the second isolation portion 23 on the substrate 10. The display panel further includes a conductive portion 90 located in the non-display area NA, the conductive portion 90 is located on a side of the protection portion 50 facing away from the signal line layer 41, and the conductive portion 90 and the first isolation portion 22 are provided with the same material.

[0095] The embodiment of the present invention does not limit the specific size and shape of the first isolation portion 22 and the second isolation portion 23. For example, the longitudinal section of the isolation structure 20 can be T-shaped. This design helps in the process of preparing the light-emitting unit 30 and the second electrode 70, making it difficult for the light-emitting material and the electrode material to extend along the side wall of the first isolation portion 22 to the side wall of the second isolation portion 23, thereby realizing the preparation and mutual separation of the light-emitting unit 30 and the second electrode 70 in different isolation openings 21 without the need for a fine metal mask.

[0096] The embodiment of the present invention does not limit the material composition of the first isolation portion 22 and the second isolation portion 23. The first isolation portion 22 and the second isolation portion 23 may both include conductive materials, or the first isolation portion 22 includes conductive materials, while the second isolation portion 23 includes insulating materials, as long as the two electrodes can achieve signal transmission with the help of the isolation structure 20.

[0097] The conductive part 90 can be used to connect the functional film layer in the display area AA of the driver chip IC to the driver chip IC, so that the signal in the driver chip IC can be transmitted to the functional film layer. The conductive part 90 and the first isolation part 22 are set with the same material, that is, the conductive part 90 and the first isolation part 22 can be prepared and formed in the same process step, so that the conductive part 90 can be manufactured synchronously during the manufacturing process of the first isolation part 22, thereby reducing the manufacturing cost.

[0098] In some embodiments, the material of the conductive portion 90 includes molybdenum or aluminum, thereby improving the conductivity of the conductive portion 90 .

[0099] Fig. 9 It is a schematic diagram of the cross-sectional structure of another display panel at AA provided by an embodiment of the present invention.

[0100] In some embodiments, Fig. 9As shown, the isolation structure 20 further includes a third isolation portion 24 , the first isolation portion 22 is located between the third isolation portion 24 and the second isolation portion 23 , and the conductive portion 90 and the third isolation portion 24 are made of the same material.

[0101] The isolation structure 20 includes at least a first isolation portion 22, a second isolation portion 23, and a third isolation portion 24. The embodiment of the present invention does not limit the size and shape of the first isolation portion 22, the second isolation portion 23, and the third isolation portion 24. Exemplarily, the orthographic projection of the first isolation portion 22 on the substrate 10 is located within the orthographic projection of the third isolation portion 24 on the substrate 10, that is, the longitudinal cross-section of the first isolation portion 22, the second isolation portion 23, and the third isolation portion 24 is in an I-shape.

[0102] Similar to the first isolation portion 22, the third isolation portion 24 also includes a conductive material, and the second electrode 70 can directly contact the third isolation portion 24 to achieve electrical connection with the first isolation portion 22 by means of the third isolation portion 24. Optionally, the second electrode 70 is overlapped with the third isolation portion 24. Further, the second electrode 70 can be partially located on the side of the third isolation portion 24 away from the substrate 10, and the provision of the third isolation portion 24 helps to improve the reliability of the electrical connection between the second electrode 70 and the isolation structure 20.

[0103] The conductive part 90 is made of the same material as the third isolation part 24, that is, the conductive part 90 can be made of the same material as the third isolation part 24. It can be seen from the foregoing that the conductive part 90 can be made of the same material as the third isolation part 24. The conductive part 90 may include a first sub-part and a second sub-part stacked along the thickness direction Y of the substrate 10, the first sub-part and the third isolation part 24 are made of the same material, and the second sub-part and the first isolation part 22 are made of the same material, thereby further reducing the resistance of the conductive part 90 and improving the reliability of the conductive part 90.

[0104] In some examples, the conductive portion 90 may be formed of the same material as the first isolation portion 22 . In other examples, the conductive portion 90 may be formed of the same material as the third isolation portion 24 .

[0105] Fig.10 It is a schematic flow chart of a method for preparing a display panel provided by an embodiment of the present invention. Figures 10a to 10c It is a schematic diagram of the preparation process of a method for preparing a display panel provided by an embodiment of the present invention. Figure 11a to Figure 11b It is a schematic diagram of a preparation process of another method for preparing a display panel provided in an embodiment of the present invention.

[0106] Second, as Fig.10 As shown, the manufacturing method of the display panel provided by the present invention, the display panel can be Figures 1 to 9 A display panel, wherein the method for preparing the display panel comprises:

[0107] S100 , forming a wiring layer 40 on one side of the substrate 10 , wherein the wiring layer 40 includes a metal layer located in the display area AA and a signal line layer 41 located in the non-display area NA.

[0108] In some embodiments, Fig.10a As shown, in step S100, a wiring layer 40 is formed on one side of the substrate 10, that is, a conductive material layer is provided on one side of the substrate 10, and the conductive material layer is patterned to form a signal line layer 41 and a metal layer. Optionally, the material of the signal line layer 41 includes a titanium-aluminum-titanium three-layer metal structure.

[0109] S200 , forming a protective material layer D1 on the side of the signal line layer 41 facing away from the substrate 10 , and patterning the protective material layer D1 to form a protective portion 50 located on the side of the signal line layer 41 facing away from the substrate 10 .

[0110] In some embodiments, Fig.10b As shown, in step S200, after the protective material layer D1 is patterned, only the protective portion 50 may be formed, or other film layers in the display area AA may be formed while the protective portion 50 is formed. Optionally, the protective material layer D1 may be manufactured by processes such as photolithography.

[0111] S300 , forming an isolation structure 20 on a side of the wiring layer 40 facing away from the substrate 10 , wherein the isolation structure 20 encloses an isolation opening 21 for accommodating the light-emitting unit 30 .

[0112] In some embodiments, Fig.10c As shown, in step S300, in order to facilitate the production of the first isolation portion 22 and the second isolation portion 23 during the production process of the isolation structure 20, the first isolation portion 22 will be produced by wet etching. The etching solution used in the production process of the first isolation portion 22 will corrode the metal material. In order to reduce the possibility of the etching solution corroding the signal line layer 41, the protection portion 50 can be arranged to cover the surface of the signal line layer 41.

[0113] S400 , forming a light-emitting unit in the isolation opening.

[0114] In some embodiments, Fig.10c As shown, in step S400, light emitting units 30 of different colors are formed in the isolation openings 21. Exemplarily, red light emitting units, green light emitting units and blue light emitting units are respectively formed in the plurality of isolation openings 21. In the process of forming the light emitting units 30, the isolation structure can be used to replace the precision metal mask.

[0115] In some embodiments, Fig.10c , Fig.11a as well as Fig.11b As shown, step S200 includes:

[0116] S210, patterning the protective material layer D1 to form a pixel defining portion 81 and a pixel opening 82, the pixel opening 82 is connected with the isolation opening 21 to accommodate the light-emitting unit 30, the orthographic projection of the inner wall of each pixel opening 82 on the substrate 10 is located within the orthographic projection of the inner wall of each isolation opening 21 on the substrate 10, and at least part of the protective portion 50 and the pixel defining portion 81 are set with the same material.

[0117] In some embodiments, in step S210, the pixel defining portion 81 and the pixel opening 82 may be manufactured before the isolation structure 20 is manufactured, or the pixel defining portion 81 and the pixel opening 82 may be manufactured after the isolation structure 20 is manufactured. The embodiment of the present invention is described by taking the example that the pixel defining portion 81 and the pixel opening 82 may be manufactured after the isolation structure 20 is manufactured. Fig.11a As shown, the protective material layer D1 may cover the display area AA and the non-display area NA. Fig.11b As shown, the protective material layer D1 is patterned to form a pixel definition material layer D2 and a protective portion, and then an isolation structure 20 is formed in the corresponding area of ​​the pixel definition material layer D2, and then a pixel defining portion 81 and a pixel opening 82 are formed to reduce the possibility of the isolation structure 20 causing damage to the signal line layer 41 and the first electrode 60 during the manufacturing process.

[0118] In a third aspect, an embodiment of the present invention further provides a display device, comprising any one of the display panels described above. Since the display device provided by the embodiment of the present invention comprises any one of the display panels described above, the display device provided by the embodiment of the present invention has the beneficial effects of any one of the display panels described above, which will not be described in detail here.

[0119] The display device in the embodiment of the present invention includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart fixed-line phones, consoles and other devices with display functions.

[0120] Although the present invention has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, comprising a display area and a non-display area, wherein the non-display area is at least partially arranged around the display area, characterized in that: include: substrate; A wiring layer, located at one side of the substrate, the wiring layer comprising a metal layer located in the display area and a signal line layer located in the non-display area; A light-emitting layer, located on a side of the wiring layer facing away from the substrate, the light-emitting layer comprising a plurality of light-emitting units; An isolation structure, located on a side of the wiring layer facing away from the substrate, the isolation structure being provided with an isolation opening for accommodating a light-emitting unit; The isolation structure is electrically connected to the signal line layer, and a protection portion is provided on a side of at least a portion of the signal line layer facing away from the substrate.

2. The display panel according to claim 1, characterized in that: The signal line layer includes a first surface located on a side thereof facing away from the substrate and a second surface connected to both sides of the first surface and extending toward the substrate, and the protection portion covers the first surface and the second surface; Preferably, the signal line layer and the metal layer are provided in the same layer and at least partially made of the same material.

3. The display panel according to claim 1, characterized in that: The metal layer includes a conductive connection portion, the substrate includes a driving circuit, and the display panel also includes a first electrode located between the light-emitting layer and the substrate, the first electrode is located on a side of the conductive connection portion facing away from the driving circuit, and the first electrode and the driving circuit are connected via the conductive connection portion.

4. The display panel according to claim 1, characterized in that: The display panel further comprises a pixel definition layer, the pixel definition layer is arranged on the substrate, the pixel definition layer comprises a pixel definition portion and a pixel opening defined by the pixel definition portion, the pixel opening is connected with the isolation opening to accommodate the light emitting unit, the orthographic projection of the inner wall of each pixel opening on the substrate is located within the orthographic projection of the inner wall of each isolation opening on the substrate, and at least part of the protection portion and the pixel definition portion are arranged with the same material; Preferably, the isolation structure is arranged on a side of the pixel defining portion away from the substrate, or a receiving groove is arranged on the pixel defining portion, and the isolation structure is arranged in the receiving groove; Preferably, the material of the protection portion includes an inorganic material; Preferably, the pixel defining portion is provided with a via hole, and the signal line layer is electrically connected to the isolation structure through the via hole.

5. The display panel according to claim 4, characterized in that: The substrate further includes a planarization layer, and the protection portion includes a first sublayer and a second sublayer stacked along the thickness direction of the substrate, the first sublayer and the planarization layer are made of the same material, and the second sublayer and the pixel defining portion are made of the same material.

6. The display panel according to claim 1, characterized in that: The isolation structure comprises a first isolation portion and a second isolation portion located at a side of the first isolation portion away from the substrate, wherein an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the second isolation portion on the substrate; Wherein, the display panel further comprises a conductive portion located in the non-display area, the conductive portion is located on a side of the protection portion facing away from the signal line layer, and the conductive portion and the first isolation portion are made of the same material; Preferably, the material of the conductive part includes molybdenum or aluminum.

7. The display panel according to claim 6, characterized in that: The isolation structure further includes a third isolation portion, the first isolation portion is located between the third isolation portion and the second isolation portion, and the conductive portion and the third isolation portion are made of the same material.

8. A method for manufacturing a display panel, characterized in that: include: Forming a wiring layer on one side of the substrate, the wiring layer comprising a metal layer located in the display area and a signal line layer located in the non-display area; forming a protective material layer on a side of the signal line layer facing away from the substrate, and patterning the protective material layer to form a protective portion located on a side of the signal line layer facing away from the substrate; An isolation structure is formed on a side of the wiring layer facing away from the substrate, wherein the isolation structure is provided with an isolation opening for accommodating a light-emitting unit; The light emitting unit is formed in the isolation opening.

9. The method for manufacturing a display panel according to claim 8, characterized in that: In the step of forming a protective material layer on the side of the signal line layer facing away from the substrate, and patterning the protective material layer to form a protective portion located on the side of the signal line layer facing away from the substrate: patterning the protective material layer also forms a pixel defining portion and a pixel opening, the pixel opening is connected with the isolation opening to accommodate the light-emitting unit, the inner wall of each pixel opening is located within the orthographic projection of the inner wall of each isolation opening on the substrate, the pixel opening is used to accommodate the light-emitting unit, and at least part of the protective portion and the pixel defining portion are set with the same material.

10. A display device, characterized in that: Comprising the display panel as described in any one of claims 1-7.

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