Device for reducing misalignment between a sputter target and a shield

Abstract

A spacer guide on a dark space shield for a sputtering chamber includes a horizontal body having a first end, a second end opposite the first end, and a thickness, the horizontal body configured to rest on an end of the dark space shield; a first leg extending laterally from the first end of the horizontal body and configured to rest against an outer surface of the dark space shield; and a second leg extending laterally from the second end of the horizontal body and configured to rest against an inner surface of the shield.

Description

Devices used to reduce misalignment between sputtering targets and shielding components.

[0001] Cross-references to related applications

[0002] This patent application claims priority to U.S. Patent Application No. 18 / 195,985, filed May 11, 2023, and U.S. Provisional Application No. 63 / 390,052, filed July 18, 2022, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to a device and method of using it for reducing misalignment between a sputtering target and a shield. Background Technology

[0004] Physical vapor deposition (“PVD”) is a method used to form thin films or material layers on various substrates. PVD methods can be used, for example, in semiconductor manufacturing processes to form metallization layers in the fabrication of integrated circuit structures and devices. In a PVD process known as sputtering, atoms are ejected from the surface of a sputtering target by bombardment with gaseous ions such as argon. Thus, the sputtering target is the source of material deposited on the substrate.

[0005] In some current PVD chambers, the process kit or dark space shield is mounted to the main body of the PVD chamber. The sputtering target is mounted separately from the shield on a removable cover of the PVD chamber. During use, when the cover is closed, the sputtering target descends into the chamber body.

[0006] It has been found that misalignment between the dark space shield and the sputtering target can cause various performance problems, such as arcing, particle formation, and film inhomogeneity. A device and method are needed to improve the alignment of the dark space shield with the sputtering target. Summary of the Invention

[0007] These and other requirements are addressed by the various aspects and configurations of this disclosure.

[0008] In Embodiment 1, a spacer guide for a dark space shield in a sputtering chamber includes a horizontal body having a first end, a second end opposite the first end, and a thickness, the horizontal body being configured to rest on the end of the dark space shield; a first leg extending laterally from the first end of the horizontal body and configured to rest against the outer surface of the dark space shield; and a second leg extending laterally from the second end of the horizontal body and configured to rest against the inner surface of the shield. The horizontal body, the first leg, and the second leg are formed of an insulating material.

[0009] In Embodiment 2, the spacer guide of Embodiment 1 has a horizontal body thickness of about 1 mm to about 30 mm.

[0010] In Example 3, the spacer guide of Example 1 has a second leg with a thickness of no more than about 30 mm.

[0011] In Embodiment 4, the spacer guide of Embodiment 1 has different widths, lengths, and thicknesses for the first leg and the second leg.

[0012] In Embodiment 5, the spacer guide of Embodiment 1 is integrally formed with a horizontal body, a first leg, and a second leg.

[0013] In Embodiment 6, a dark space shielding assembly for use in a sputtering chamber includes an annular dark space shielding having a first end configured to approach a substrate support base and a second end configured to approach a sputtering target; and a plurality of spacer guides positioned on the second end of the annular dark space shielding. Each spacer guide includes a horizontal body having a first end, a second end opposite the first end, and a thickness, the horizontal body being configured to rest on the second end of the annular dark space shielding; a first leg extending laterally from the first end of the horizontal body and configured to rest against the outer surface of the annular dark space shielding; and a second leg extending laterally from the second end of the horizontal body and configured to rest against the inner surface of the shielding, wherein the horizontal body, the first leg, and the second leg are formed of an insulating material.

[0014] In Example 7, the dark space shielding assembly of Example 6 is used, wherein a plurality of spacer guides are attached to the annular dark space shielding only by friction.

[0015] In Example 8, the dark space shielding assembly of Example 6 is provided, wherein a plurality of spacer guides are attached to the annular dark space shielding by fasteners.

[0016] In Example 9, the dark space shielding assembly of Example 6 is used, wherein the spacer guide maintains the misalignment of the sputtering target and the annular dark space shielding along the horizontal axis within about 5 mm.

[0017] In Example 10, the dark space shield assembly of Example 9 is provided, wherein the spacer guide maintains the misalignment of the sputtering target and the annular dark space shield along the horizontal axis within approximately 1 mm.

[0018] In Example 11, the dark space shielding assembly of Example 9 has a horizontal body thickness of no more than about 30 mm.

[0019] In Example 12, the dark space shielding assembly of Example 9, wherein the thickness of the second leg does not exceed about 30 mm.

[0020] In embodiment 13, the sputtering chamber assembly includes a sputtering target; an annular dark space shield having a first end configured to approach a substrate support base and a second end configured to approach the sputtering target; and a plurality of spacer guides positioned on the second end of the annular dark space shield. Each spacer guide includes a horizontal body having a first end, a second end opposite the first end, and a thickness, the horizontal body being configured to rest on the second end of the annular dark space shield; a first leg extending laterally from the first end of the horizontal body and configured to rest against the outer surface of the annular dark space shield; and a second leg extending laterally from the second end of the horizontal body and configured to rest against the inner surface of the shield, wherein the horizontal body, the first leg, and the second leg are formed of an insulating material.

[0021] In Example 14, the sputtering chamber assembly of Example 13 is used, wherein a plurality of spacer guides are attached to the annular dark space shield only by friction.

[0022] In Example 15, the sputtering chamber assembly of Example 13 is provided, wherein a plurality of spacer guides are attached to an annular dark space shield by fasteners.

[0023] In Example 16, the sputtering chamber assembly of Example 13 is provided, wherein the spacer guide maintains the misalignment of the sputtering target and the annular dark space shield along the horizontal axis within approximately 1 mm.

[0024] In Example 17, the sputtering chamber assembly of Example 16 is provided, wherein the spacer guide maintains the misalignment of the sputtering target and the annular dark space shield along the vertical axis within 1 mm.

[0025] In Example 18, the sputtering chamber assembly of Example 13 is used, wherein the thickness of the horizontal body is from about 1 mm to about 30 mm.

[0026] In Example 19, the sputtering chamber assembly of Example 13, wherein the thickness of the second leg does not exceed about 30 mm.

[0027] While several embodiments have been disclosed, those skilled in the art will understand other embodiments of the invention from the specific details of the exemplary embodiments shown and described below. Therefore, the drawings and detailed descriptions are to be considered illustrative rather than restrictive in nature. Attached Figure Description

[0028] Figure 1 is a simplified cross-sectional view of the physical vapor deposition chamber 100.

[0029] Figure 2 is a schematic cross-sectional view of a portion of the splash chamber.

[0030] Figure 3 is a perspective view of one implementation scheme.

[0031] Figures 4A and 4B are perspective views of an alternative implementation.

[0032] Figure 5 is a perspective view of the spacer guide.

[0033] Various modifications and additions can be made to the exemplary embodiments discussed without departing from the scope of the invention. For example, while the above embodiments relate to specific features, the scope of the invention also includes embodiments with different combinations of features and embodiments that do not include all of the above features. Detailed Implementation

[0034] This document discloses a sputtering chamber component for use within a sputtering chamber to improve the alignment of a sputtering target with a dark space shield, and a method of using the same. Embodiments of the invention can reduce or prevent arcing between the sputtering target and the shield by improving the alignment between them. As used herein, alignment refers to placing the sputtering target and the dark space shield concentrically such that the gap between the outer edge of the sputtering target and the inner surface of the dark space shield is consistent or substantially consistent along the periphery of the sputtering target. During the sputtering process, a thin film is deposited on the flange of the sputtering target. The alignment between the sputtering target and the dark space shield is measured by removing the sputtering target from the sputtering chamber and determining the distance from the radially outer edge of the deposited film to the target sidewall at several locations near parameters of the sputtering target. In one embodiment, the distance is determined by measuring the distance from the O-ring groove in the flange to the sputtering target sidewall using calipers, measuring the distance from the O-ring groove in the flange to the radially outer edge of the deposited film using calipers, and calculating the difference between these two values. The maximum distance determined is the misalignment.

[0035] Embodiments of the present invention may additionally or alternatively reduce particle formation by reducing arc discharge events. Arc discharge events generate particles. Particle deposition is undesirable because particle deposition on the substrate can damage devices with small feature sizes fabricated on the substrate. Therefore, it is desirable to avoid particle formation in the chamber. Embodiments of the present invention may further or additionally improve the uniformity of the deposited thin film. Large misalignment between the sputtering target and the dark space shield can cause gap inhomogeneity, which can create an inhomogeneous electric field between the dark space shield and the sputtering target. Inhomogeneous electric field can cause inhomogeneous plasma distribution, and thus result in inhomogeneous thin film deposition on the substrate.

[0036] Figure 1 is a cross-sectional view of a physical vapor deposition chamber 100 including a chamber cover 134 and a chamber body 136. The chamber cover 134 can be removed from the chamber body 136 and is shown in the closed position in Figure 1.

[0037] The sputtering target assembly 138, including the backing plate 146 and the sputtering target 106, can be mounted to or detachably attached to the chamber cover 134, for example, by means of pins or screws (not shown). When the chamber cover 134 is closed, the sputtering surface of the sputtering target 106 faces the substrate support base 102. The sputtering target assembly 138 may be a single piece.

[0038] The power supply structure 110 and source distribution plate 122 are used to distribute power to the sputtering target 106. The power supply structure 110 couples RF energy and optionally DC energy to the sputtering target 106. The power supply structure 110 includes a body 112 having a first end 114, a second end 116, and a central opening 115. The first end 114 is coupled to an RF power source 118 and optionally to a DC power source 120, which can be used to supply RF and DC power to the sputtering target 106. The second end 116 is coupled to a chamber cover 134. The central opening 115 extends from the first end 114 through the body 112 to the second end 116. The power supply structure 110 may be made of a suitable conductive material to conduct RF and DC energy from the RF power source 118 and the DC power source 120. Those skilled in the art will recognize that other configurations of the power supply structure can be used.

[0039] Source distribution plate 122 may be coupled to a second end 116 of body 112 and may be used to distribute energy applied via feed structure 110 to the peripheral edge of sputtering target 106 via conductive member 125. Source distribution plate 122 may include a hole 124 aligned with a central opening 115 of body 112. Source distribution plate 122 may be made of a suitable conductive material to conduct RF and DC energy from feed structure 110.

[0040] The conductive member 125 may be a tubular member having a first end 126 coupled to the source distribution plate 122 and a second end 130 coupled to the backing plate 146 of the sputtering target assembly. A grounding shield 140 may cover the outer surface of the chamber cover 134. The grounding shield 140 may be made of a suitable conductive material. An insulating gap 139 is provided between the grounding shield 140 and the outer surfaces of the source distribution plate 122, the conductive member 125, and the sputtering target 106 (and / or the backing plate 146). The insulating gap prevents RF current and DC current from being directly routed to ground. The insulating gap 139 may be filled with air or a suitable dielectric material, such as ceramic.

[0041] The chamber cover 134 can be rotatably opened from the top of the chamber body 136. In some cases, the chamber cover 134 can be opened to install or replace a sputtering target or for maintenance of the physical vapor deposition chamber 100. In some embodiments, the chamber cover 134 can be moved about a horizontal axis of rotation from a closed position to an open position. For example, the chamber cover 134 can move in an arc about the axis of rotation between the closed and open positions.

[0042] The chamber body 136 may be formed by a grounded outer shell wall 108 and an upper chamber wall 142, and may include a substrate support base 102, an internal volume 144, and a dark space shield or processing shield 150. The substrate support base 102 receives the substrate 104.

[0043] The dark space shield 150 includes an annular body having an inner surface 152 and an outer surface 154 defining a central opening 158. The dark space shield 150 extends downward along the upper chamber wall 142 and the grounded outer casing wall 108 below the top surface of the substrate support base 102, and then upward back to reach the top surface of the substrate support base 102. Opposite ends of the dark space shield 150 approach the sputtering target 106. The dark space shield 150 is spaced apart from the sputtering target 106 by a radial gap 170.

[0044] In use, electrons are emitted from a negatively charged sputtering target 106. These electrons collide with argon atoms to form ionized atoms or plasma, which are then accelerated toward the negatively charged sputtering target 106. The argon atoms bombard the sputtering target 106, causing a series of collisional chain reactions and displacing atoms in the sputtering target 106, thereby forming a thin film on a substrate 104. In some embodiments, a suitable substrate 104 comprises a wafer for semiconductor fabrication. For example, the sputtering target 106 is bombarded with energy until atoms from its surface are released into the surrounding atmosphere and subsequently deposited on the substrate 104. In some embodiments, plasma sputtering is used to deposit a thin metal film onto a wafer for use in electronic devices.

[0045] Figure 2 is a schematic cross-sectional view of a portion of a sputtering chamber 200. In the sputtering chamber 200, a dark space shield 250 radially surrounds the sputtering target 206 of the sputtering target assembly 238. In the radial direction (or along the horizontal axis in Figure 2), the inner surface 252 of the dark space shield 250 is spaced apart from the outer surface or radial surface 288 of the sputtering target 206 by distances 277a and 277b (commonly referred to as distance 277). In some embodiments, distance 277 may be between about 3 mm and about 6 mm, or between about 2 mm and about 4 mm. Misalignment between the sputtering target 106 and the dark space shield 250 results in unequal distances 277 surrounding the sputtering target 206. For example, it may cause 277a and 277b to be unequal. For example, as shown in Figure 2, the dark space shield 250 is closer to the sputtering target 206 on the left side, resulting in distance 277b being larger than distance 277a. In some embodiments, the variation of the radial clearance 277 around the periphery of the sputtering target 206 is no more than about 5 mm, about 2 mm, or about 1 mm. That is, for example, the variation between distances 277a and 277b is no more than about 1 mm. As discussed herein, misalignment between the sputtering target 206 and the dark space shield 250 can cause performance problems. It has been found that when the variation of the distance 277 around the periphery of the sputtering target 206 is about 1 mm or less, or when the radial misalignment between the sputtering target 206 and the dark space shield 250 is about 1 mm or less, the performance of the sputtering target is generally more acceptable or improved.

[0046] In the vertical direction, the ends of the dark space shield 250 are also spaced apart from the sputtering target assembly 238, and, as shown in FIG2, spaced apart from the backing plate 146 by distances 279 and 279b (generally referred to as distance 279). Misalignment of the dark space shield 250 with the sputtering target 206 may cause 279a and 279b to be unequal. In some embodiments, the variation of distance 279 around the periphery of the sputtering target 206 is no more than about 1 mm. That is, for example, the variation between distances 279a and 279b is no more than about 1 mm. As discussed herein, misalignment of the sputtering target 206 with the dark space shield 250 can cause performance problems. It has been found that when the variation of distance 279 around the periphery of the sputtering target 206 is about 1 mm or less, or in other words, when the vertical misalignment of the sputtering target 206 with the dark space shield 250 is about 1 mm or less, the performance of the sputtering target is acceptable or improved.

[0047] Spacer guide 290 is fitted or positioned on the end of dark space shield 250. A portion of spacer guide 290 is positioned between the end of dark space shield 250 and backing plate 246. Another portion of spacer guide 290 is positioned between the radial surface 288 of sputtering target 206 and dark space shield 250. Spacer guide 290 minimizes the spacing between sputtering target assembly 238 and dark space shield 250. In the radial direction (or along the horizontal axis in FIG. 2), the inner surface of dark space shield 250 is spaced 277 from the outer surface or radial surface 288 of sputtering target 206. In the vertical direction, the end of shield 250 is spaced from sputtering target assembly 238 and, as shown in FIG. 2, spaced 279 from backing plate 146. In FIG. 2, spacer guide 290 minimizes this spacing on both the horizontal and vertical axes. However, the spacer guide 290 can be designed to maintain a minimum along only one of the horizontal and vertical axes. In some embodiments, the spacer guide 290 is designed such that the misalignment between the sputtering target 206 and the shield 250 cannot exceed about 1 mm.

[0048] An appropriate number of spacer guides 290 can be used to space, align, or isolate the dark space shield 250 from the sputtering target 206. In some embodiments, three spacer guides 290 are positioned (e.g., equidistantly spaced) on the ends of the dark space shield 250 and around its circumference. In some embodiments, more than three spacer guides 290 may be used on the dark space shield 250.

[0049] Figure 3 is a perspective view of one embodiment in which spacer guides 290 (three are shown in Figure 3) are positioned or resting on the end 251 of the dark space shield 250a. As shown, the spacer guides 290 extend from the end 251 of the dark space shield 250a. In this way, the spacer guides 290 minimize the distance along the vertical axis between the dark space shield 250a and the sputtering target 206. In some embodiments, the spacer guides 290 are equidistantly spaced around the dark space shield 250a. In other embodiments, the spacer guides 290 are not equidistantly spaced.

[0050] Figures 4A and 4B are perspective views of another embodiment in which portions along the end 251 of the dark space shield 250b are disassembled at a notch 253 to accommodate spacer guides 290 (shown in an enlarged view of Figure 4B). Figure 4B is an enlarged view of the dark space shield 250b with the spacer guides 290 positioned in the notch 253. As shown in Figure 4B, in some embodiments, the top of the spacer guides 290 protrudes or extends from the end of the dark space shield 250b. In other embodiments, the top of the spacer guides 290 is aligned or substantially aligned with the end of the dark space shield 250b. In some embodiments, the spacer guides 290 project radially from the inner surface of the dark space shield 250b. In some embodiments, the spacer guides 290 are equidistantly spaced around the dark space shield 250b. In other embodiments, the spacer guides 290 are not equidistantly spaced.

[0051] Figure 5 is a perspective view of a spacer guide 290 according to one embodiment. The spacer guide 290 includes a horizontal body 291, a first leg 293, and a second leg 295. The first leg 293 extends vertically or laterally from a first end 297 of the horizontal body 291. The second leg 295 extends vertically or laterally from a second end 299 of the horizontal body 291. The horizontal body 291, the first leg 293, and the second leg 295 may be separate individual pieces, which are joined together to form the spacer guide 290. Alternatively, the horizontal body 291, the first leg 293, and the second leg 295 may be formed as a single integral piece. The spacer guide 290 may be formed of any suitable insulating material such as polytetrafluoroethylene or ceramic.

[0052] The horizontal body 291 has a width of W1, a length of L1, and a thickness of T1. The length L1 is selected such that when the spacer guide 290 is positioned on the shield 250, the first leg 293 and the second leg 295 are respectively positioned abutting the inner surface 252 and the outer surface 254 of the dark space shield 250. In some embodiments, the length L1 is selected such that the spacer guide 290 is held on the dark space shield 250 by gravity and / or friction, and no other connectors or fasteners such as screws or pins are required. In some embodiments, the spacer guide 290 can be fastened to the dark space shield 250. For example, fasteners such as screws or pins can be positioned through the ends of the horizontal body 291 and the dark space shield 250. The length L1 is selected such that the spacer guide 290 can be positioned on the dark space shield 250. If the length L1 is too short, the spacer guide 290 will not remain on the dark space shield 250. Furthermore, the length L1 is chosen to be accommodated within the space defined by the dark space shield 250 and the target sidewall. If the length L1 is too long, the spacer guide 290 will not be able to fit into the space between the dark space shield 250 and the sputtering target 206. In some embodiments, the length L1 is from about 10 mm to about 100 mm, such as from about 15 mm to about 30 mm. After the spacer guide 290 is installed, the space defined by the dark space shield 250 and the sidewall of the sputtering target 206 is partially occupied by the spacer guide 290, and the remaining space remains empty.

[0053] The width W1 is chosen to ensure that the horizontal body 291 is properly stable and has the desired maneuverability. If the width W1 is too small, the spacer guide 290 may be insecure, unstable, or fragile. If the width W1 is too large, the spacer guide 290 may not conform to the curvature of the dark space shield 250 and may be difficult to install. In some embodiments, the width W1 may be from about 1 mm to about 100 mm, such as from about 5 mm to about 50 mm or from about 10 mm to about 30 mm.

[0054] The thickness T1 is chosen to form a stable horizontal body 291. If the thickness T1 is too small, the horizontal body 291 may be prone to tearing or breakage. If the thickness T1 is too large, the horizontal body 291 may be too rigid and may be difficult to conform to the shape of the dark space shield 250. Furthermore, if the thickness T1 is too large, the spacer guide 290 may be difficult to accommodate in the tight space between the dark space shield 250 and the sputtering target 206. In some embodiments, the thickness T1 may be chosen to minimize the distance between the dark space shield 250 and the radial surface 288 of the sputtering target 206. In some embodiments, the thickness T1 may be at least about 2 mm. Since the spacer guide thickness T1 prevents direct contact between the dark space shield 250 and the sputtering target assembly surface 206b, this helps to reduce or eliminate arc discharge caused by vertical misalignment between the dark space shield and the surface 206b of the sputtering target assembly 238. In some embodiments, the thickness T1 can be from about 1 mm to about 30 mm, or from about 2 mm to about 20 mm, or from about 3 mm to about 10 mm. In embodiments where the spacer guide 290 is fitted within the recess 253 of the dark space shield 250, the thickness T1 can be greater than about 30 mm.

[0055] A first leg 293 and a second leg 295 extend laterally from and perpendicular to a horizontal body 291. The first leg 293 has an inner surface 293a and an outer surface 293b. The inner surface 293a is configured to be adjacent to or rest against the outer surface 254 of the dark space shield 250. The second leg 295 has an inner surface 295a and an outer surface 295b. The inner surface 295a is configured to be adjacent to or rest against the inner surface 252 of the dark space shield 250.

[0056] The first leg 293 has a width of W2, a length of L2, and a thickness of T2. The thickness T2 is chosen such that the first leg 293 is thick enough to keep the leg sturdy and thin enough to be installed in the tight space between the dark space shield 150 and the upper chamber wall 142.

[0057] The thickness of the second leg 295 is T3. In some embodiments, the thickness T3 is selected to minimize the gap between the inner surface 252 of the dark space shield 250 and the sputtering target assembly 238. In some embodiments, the thickness T3 may be at least 1 mm. This limits the radial misalignment of the dark space shield 250 and the radial surface 288 of the sputtering target 206. In some embodiments, the thickness T3 may be about 1 mm to about 20 mm, or about 2 mm to about 15 mm, or about 3 mm to about 10 mm.

[0058] Those skilled in the art will recognize that the second leg 295 also has width and length. In some embodiments, the first leg 293 and the second leg 295 have the same shape. In other embodiments, the first leg 293 and the second leg 295 may have different shapes. For example, the first leg 293 and the second leg 295 may have different thicknesses.

[0059] Misalignment between the dark space shield and the target assembly can account for 50% or more of all target-related performance problems in the sputtering chamber. Data suggests that small misalignments, such as less than about 1 mm, can improve target performance or at least not adversely affect it. However, misalignments exceeding about 1 mm can negatively impact target performance. For example, misalignment between the target and the dark space shield can cause outward protrusions around the outer radial periphery of the target. Furthermore, misalignment can also lead to arcing, particle problems, and / or thin film uniformity issues.

[0060] Spacer guide 290 physically and electrically separates sputtering target 206 and dark space shield 250. Spacer guide 290 may space sputtering target 206 and dark space shield 250 around the periphery or circumference of sputtering target 206 by a distance greater than about 3 mm and less than or equal to about 10 mm, as measured in the radial or horizontal direction. Similarly, spacer guide 290 may space sputtering target and dark space shield 250 by a distance greater than about 3 mm and less than or equal to about 10 mm in the vertical direction around the periphery or circumference of sputtering target 206. Maintaining the spacer within this range is important because if the spacing is too small, irregular target surfaces or accumulated flakes may cause power shortages and arcing, or if the spacing is too large, plasma leakage may occur between the dark space shield and the sputtering target assembly surfaces 206b or 288, also causing power shortages. Maintaining a spacing in the radial and / or vertical directions improves the alignment of the sputtering target 206 with the dark space shield 250. In some embodiments, the spacing guide 290 reduces arc discharge events that occur during the sputtering process.

[0061] Methods of using the spacer guide 290 are also provided. In some embodiments, the spacer guide 290 is placed on a commercially available dark space shield 250 such that one leg 295 of the spacer guide 290 is stationary along the inner surface 252 of the dark space shield 250, and the other leg 293 of the spacer guide 290 is stationary along the outer surface 254 of the dark space shield. The inner surface of the horizontal body of the spacer guide 290 is stationary on or adjacent to an end of the dark space shield 250. In some embodiments, the three spacer guides 290 are equidistantly spaced around the periphery of the dark space shield 250. In other embodiments, the three spacer guides 290 are not equidistantly spaced around the periphery of the dark space shield 250. When the sputtering chamber is closed, for example when the sputtering chamber is in use, the spacer guide 290 minimizes the distance between the dark space shield 250 and the sputtering target 206 in the horizontal and / or vertical directions.

[0062] In some embodiments, the dark space shield 250 is modified to receive the spacer guides 290. For example, as shown in FIG4, portions of the dark space shield 250b are removable to form recesses or notches in which the spacer guides 290 are positioned. In some embodiments, three spacer guides 290 are equidistantly spaced around the periphery of the dark space shield 250b. In other embodiments, more than three spacer guides are used. When the sputtering chamber is closed, such as when the sputtering chamber is in use, the spacer guides 290 prevent the dark space shield 250 from getting too close to the sputtering target 206, and thus minimize the horizontal distance between the dark space shield 250 and the sputtering target 206.

[0063] Various modifications and additions can be made to the exemplary embodiments discussed without departing from the scope of the invention. For example, while the above embodiments relate to features, the scope of the invention also includes embodiments with different combinations of features and embodiments that do not include all of the above features.

Claims

1. A spacer guide for a dark space shield in a sputtering chamber, the spacer guide comprising: A horizontal body having a first end, a second end opposite to the first end, and a thickness, the horizontal body being configured to rest on the end of the dark space shield; and a first leg extending laterally from the first end of the horizontal body and being configured to rest against the outer surface of the dark space shield. The second leg extends laterally from the second end of the horizontal body and is configured to rest against the inner surface of the shield, wherein the horizontal body, the first leg, and the second leg are formed of an insulating material.

2. The spacer guide according to claim 1, wherein, The thickness of the horizontal body is 1 mm to 30 mm.

3. The spacer guide according to claim 1, wherein, The thickness of the second leg does not exceed 30 millimeters.

4. The spacer guide according to claim 1, wherein, The width, length, and thickness of the first leg and the second leg are different.

5. The spacer guide according to claim 1, wherein, The horizontal main body, the first leg, and the second leg are integrally formed.

6. A dark space shielding assembly for use in a sputtering chamber, the dark space shielding assembly comprising: An annular dark space shield having a first end configured to approach a substrate support base and a second end configured to approach a sputtering target; The annular dark space shield includes a plurality of spacer guides positioned on the second end of the annular dark space shield. Each spacer guide includes: a horizontal body having a first end, a second end opposite to the first end, and a thickness, the horizontal body being configured to rest on the second end of the annular dark space shield; a first leg extending laterally from the first end of the horizontal body and configured to rest against the outer surface of the annular dark space shield; and a second leg extending laterally from the second end of the horizontal body and configured to rest against the inner surface of the shield, wherein the horizontal body, the first leg, and the second leg are formed of an insulating material.

7. The dark space shielding assembly according to claim 6, wherein, The plurality of spaced guide members are attached to the annular dark space shield only by friction.

8. The dark space shielding assembly according to claim 6, wherein, The plurality of spacer guides are attached to the annular dark space shield by fasteners.

9. The dark space shielding assembly according to claim 6, wherein, The spacer guide keeps the misalignment between the sputtering target and the annular dark space shield within 5 mm along the horizontal axis.

10. The dark space shielding assembly according to claim 9, wherein, The spacer guide keeps the misalignment between the sputtering target and the annular dark space shield within 1 mm along the horizontal axis.

11. The dark space shielding assembly according to claim 9, wherein, The thickness of the horizontal body does not exceed 30 mm.

12. The dark space shielding assembly according to claim 9, wherein, The thickness of the second leg does not exceed 30 millimeters.

13. A sputtering chamber assembly, the sputtering chamber assembly comprising: Sputtering target; An annular dark space shield having a first end configured to approach a substrate support base and a second end configured to approach the sputtering target; The annular dark space shield includes a plurality of spacer guides positioned on the second end of the annular dark space shield. Each spacer guide includes: a horizontal body having a first end, a second end opposite to the first end, and a thickness, the horizontal body being configured to rest on the second end of the annular dark space shield; a first leg extending laterally from the first end of the horizontal body and configured to rest against the outer surface of the annular dark space shield; and a second leg extending laterally from the second end of the horizontal body and configured to rest against the inner surface of the shield, wherein the horizontal body, the first leg, and the second leg are formed of an insulating material.

14. The sputtering chamber assembly of claim 13, wherein, The spacer guide keeps the misalignment between the sputtering target and the annular dark space shield within 1 mm along the horizontal axis.

15. The sputtering chamber assembly of claim 14, wherein, The spacer guide keeps the misalignment between the sputtering target and the annular dark space shield within 1 mm along the vertical axis.

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