High-speed turret detecting and packaging equipment for semiconductors

Abstract

The invention discloses high-speed turret detecting and packaging equipment for semiconductors, and relates to the technical field of semiconductor production, the high-speed turret detecting and packaging equipment comprises a machine table, a vibration feeding mechanism is arranged on the machine table, a material distributing mechanism is arranged at the discharging end of the vibration feeding mechanism, and a turret detecting mechanism is arranged on one side of the material distributing mechanism; a carrier tape packaging mechanism is arranged on one side of the turret detection mechanism, the turret detection mechanism comprises a suction nozzle rotating mechanism installed in the machine table and a lifting driving mechanism arranged above the suction nozzle rotating mechanism, and the suction nozzle rotating mechanism comprises a disc rotationally arranged on the machine table. A plurality of vacuum suction nozzles arranged at equal intervals are installed on the disc, an air pipe connecting column is arranged at the upper end of the disc, a suction nozzle rotating motor for driving the disc to rotate is arranged at the lower end of the disc, the vacuum suction nozzles are connected to the disc in an up-down sliding mode, and reset springs are arranged on the outer sides of the vacuum suction nozzles. According to the invention, multi-station defect detection can be carried out on the chip, and the detection precision and efficiency are greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor production, in particular to a high-speed turret detection and packaging device for semiconductors. Background Art

[0002] As the semiconductor discrete device industry occupies a pivotal position in the international market and maintains continuous, rapid and stable development, the development of the electronic machine, consumer electronic products and other markets has increased the demand for semiconductor discrete devices. Therefore, modern production plants need a high-speed, high-performance test and sorting equipment to meet their production needs. However, conventional semiconductor discrete device test and sorting machines have a low operating speed, which makes it impossible to meet the production needs of high capacity and high quality. Therefore, the present invention proposes a high-speed turret detection and packaging equipment for semiconductors. Summary of the invention

[0003] Technical issues solved

[0004] The purpose of the present invention is to make up for the deficiencies of the prior art and to provide a high-speed turret inspection and packaging device for semiconductors.

[0005] Technical Solution

[0006] To achieve the above object, the present invention provides the following technical solution: a high-speed turret inspection and packaging equipment for semiconductors, comprising a machine platform, a vibration feeding mechanism is arranged on the machine platform, a material separation mechanism is arranged at the discharge end of the vibration feeding mechanism, and a turret inspection mechanism is arranged on one side of the material separation mechanism;

[0007] A carrier tape packaging mechanism is provided on one side of the turret detection mechanism, and the turret detection mechanism includes a nozzle rotating mechanism installed in the machine platform and a lifting drive mechanism arranged above the nozzle rotating mechanism;

[0008] The nozzle rotating mechanism comprises a disc rotatably arranged on the machine platform, a plurality of vacuum nozzles arranged at equal intervals are installed on the disc, an air pipe connecting column is arranged at the upper end of the disc, a nozzle rotating motor for driving the disc to rotate is arranged at the lower end of the disc, the vacuum nozzle is connected to the disc in a sliding manner up and down, and a return spring is arranged on the outer side of the vacuum nozzle;

[0009] The lifting drive mechanism includes a lifting mechanism bracket fixedly mounted to the machine platform, the lifting mechanism bracket is provided with a plurality of lifting drive units, the lifting drive unit includes a lifting drive motor, the output shaft of the lifting drive motor is downwardly connected with a cam, one side of the cam is provided with a fixed seat fixedly connected to the lifting mechanism bracket, one side of the fixed seat is slidably connected with a slide seat, a cam follower roller is installed on the upper end of the slide seat, the cam is in contact with the cam follower roller, the slide seat is connected to the fixed seat through a spring, and a plurality of detection mechanisms are arranged directly below the vacuum suction nozzle.

[0010] Preferably, the plurality of detection mechanisms include a chip detection jig, the chip detection jig includes a socket, the socket has a pair of spaced-apart pins, an elastic ejector pin is disposed between the pair of pins, a plurality of probes are disposed on both sides of the elastic ejector pin, and the probes are electrically connected to a test instrument.

[0011] Preferably, a laser marking mechanism is also provided on one side of the plurality of detection mechanisms, and the laser marking mechanism comprises a marking seat body fixedly connected to the machine platform, a rotatable chip fixing fixture table is provided on the marking seat body, four chip placement slots are provided on the chip fixing fixture table, a vacuum negative pressure channel is provided in the chip fixing fixture and connected to the bottoms of the four chip placement slots, the chip fixing fixture is driven to rotate by a marking seat motor, and a laser generator and a CCD detection camera are respectively provided on one side of the chip fixing fixture.

[0012] Preferably, the material distribution mechanism comprises a material distribution frame fixedly connected to the machine platform, a material distribution track is installed on the material distribution mechanism, a blocking mechanism is arranged at one end of the material distribution track, and a material receiving mechanism is arranged at one side of the blocking mechanism;

[0013] The blocking mechanism comprises a blocking block connected to the material distribution frame for sliding up and down movement, and a tension spring is connected between the blocking block and the material distribution frame;

[0014] The material receiving mechanism comprises a material receiving seat connected to the material distributing mechanism in a forward and backward sliding manner, a tension spring is connected between the material receiving mechanism and the material distributing frame, a vacuum negative pressure pipeline is arranged in the material receiving seat, a fixing groove matching the chip is arranged on the material receiving seat, a vacuum suction hole is arranged in the fixing groove, and a material receiving seat driving roller is connected to the material receiving seat;

[0015] A material distributing motor is installed on the material distributing frame, and the output shaft of the material distributing motor is connected with a cam, the front end of the cam abuts against the driving roller of the material receiving seat, and the side wall of the cam abuts against the stopper.

[0016] Preferably, a first CCD camera detection unit is provided on one side of the material dividing mechanism.

[0017] Preferably, a defective product collection mechanism is also provided on one side of the plurality of detection mechanisms.

[0018] Preferably, a second defective product sorting mechanism is also provided on one side of the plurality of detection mechanisms, the second defective product sorting mechanism comprises a defective product bin rack, a rotatable sorting switching wheel is provided in the defective product bin rack, a plurality of sorting holes are provided on the sorting switching wheel, an upper cover plate and a lower cover plate are respectively installed at the upper and lower ends of the sorting switching wheel, a chip entrance is provided on the upper cover plate, and two oppositely arranged discharge ports are provided on the lower cover plate, the two discharge ports are respectively connected to two defective product collection boxes, and the defective product collection boxes are placed in the defective product bin rack.

[0019] Preferably, a flipping mechanism is also provided on one side of the plurality of detection mechanisms, the flipping mechanism comprises a flipping base fixedly connected to the machine platform, a rotatable support frame is provided in the flipping base through a bearing, a clamping positioning motor is installed on the support frame, the output shaft of the clamping positioning motor is upwardly driven to connect to an opening and closing cam, a clamping fixture is provided on the top of the support frame, the clamping fixture comprises four clamping blocks movably connected to the top of the support frame, a driving roller is installed at the bottom of the clamping block, the opening and closing cam is provided between the driving rollers, a synchronous wheel is installed at the bottom end of the support frame, the synchronous wheel is connected to a driving wheel via a belt, the driving wheel is installed on the output shaft of the flipping motor, and the flipping motor is connected to the synchronous wheel via a belt drive to rotate the support frame.

[0020] Preferably, a defective product blowing and rejecting mechanism is provided on one side of the flipping mechanism.

[0021] Preferably, the carrier packaging mechanism includes a carrier frame, a plurality of carrier guide wheels are provided on the carrier frame, a carrier tape is placed on the carrier guide wheels, a carrier moving motor for driving the carrier tape to move is provided on one side of the carrier tape, the carrier moving motor is driven and connected to a driving wheel, the driving wheel presses the carrier tape, a sealing film loading tray is installed on the carrier frame, a sealing film roll is placed on the sealing film loading tray, the sealing film roll is pulled to the carrier tape surface by a plurality of guide wheels and passes through the bottom of a plurality of hot pressing blocks together with the carrier tape, the hot pressing block is installed on a lifting slide, the lifting slide can be slidably connected to the carrier frame up and down, a driving groove is provided on the top of the lifting slide, a lifting driving roller is provided in the driving groove, the lifting driving roller is installed on an eccentric block, and the eccentric block is connected to a pressing block lifting driving motor.

[0022] Beneficial effects:

[0023] Compared with the prior art, the high-speed turret inspection and packaging equipment for semiconductors has the following beneficial effects:

[0024] The present invention can perform multi-station defect detection on chips, and the detection accuracy and efficiency are greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the present invention;

[0026] Figure 2 It is a structural schematic diagram of the turret detection mechanism of the present invention;

[0027] Figure 3 It is a structural schematic diagram of another perspective of the present invention;

[0028] Figure 4 It is a structural schematic diagram of the nozzle rotating mechanism of the present invention;

[0029] Figure 5 It is a structural schematic diagram of the lifting drive mechanism of the present invention;

[0030] Figure 6 It is a structural schematic diagram of the lifting drive mechanism of the present invention;

[0031] Figure 7 It is a structural schematic diagram of the detection mechanism of the present invention;

[0032] Figure 8 It is a structural schematic diagram of the laser marking mechanism of the present invention;

[0033] Fig. 9 It is a structural schematic diagram of the material dispensing mechanism of the present invention;

[0034] Fig.10 It is a structural schematic diagram of the material dispensing mechanism of the present invention;

[0035] Fig.11 It is a structural schematic diagram of the second defective product sorting mechanism of the present invention;

[0036] Fig.12 It is a structural schematic diagram of the second defective product sorting mechanism of the present invention;

[0037] Fig.13 It is a structural schematic diagram of the second defective product sorting mechanism of the present invention;

[0038] Fig.14 It is a structural schematic diagram of the carrier tape packaging mechanism of the present invention;

[0039] Fig.15 It is a structural schematic diagram of the carrier tape packaging mechanism of the present invention;

[0040] Fig.16 It is a structural schematic diagram of the carrier tape packaging mechanism of the present invention;

[0041] Fig.17 It is a structural schematic diagram of the turning mechanism of the present invention;

[0042] Fig.18It is a structural schematic diagram of the shape of the chip to be detected in the present invention.

[0043] In the figure:

[0044] 1. Machine; 2. Vibration feeding mechanism; 3. Material separation mechanism; 4. Turret detection mechanism; 5. Carrier packaging mechanism; 6. First CCD camera detection unit; 7. Defective product collection mechanism; 8. Second defective product separation mechanism; 9. Turning mechanism; 10. Defective product blowing and rejection mechanism;

[0045] 41. Nozzle rotating mechanism; 42. Lifting drive mechanism; 43. Detection mechanism; 44. Laser marking mechanism; 411. Disc; 412. Vacuum nozzle; 413. Nozzle rotating motor; 414. Return spring; 421. Lifting mechanism bracket; 422. Lifting drive motor; 423. Cam; 424. Fixed seat; 425. Sliding seat; 426. Cam follower roller; 431. Card seat; 432. Card foot; 433. Elastic ejector pin; 434. Probe; 441. Marking seat body; 442. Chip fixing fixture table; 443. Chip placement slot; 444. Marking seat motor; 445. Laser generator; 446. CCD detection camera;

[0046] 31. Material distribution rack; 32. Material distribution track; 33. Blocking mechanism; 34. Material receiving mechanism; 331. Stopper; 332. Tension spring; 341. Material receiving seat; 342. Tension spring 2; 343. Vacuum negative pressure pipeline; 344. Fixed groove; 345. Vacuum suction hole; 346. Material receiving seat driving roller; 311. Material distribution motor; 312. Cam; 81. Defective product storage rack; 82. Material distribution switching wheel; 83. Material distribution hole; 84. Upper cover plate; 85. Lower cover plate; 86. Defective product collection box;

[0047] 91. Turning machine base; 92. Support frame; 93. Clamping and positioning motor; 94. Opening and closing cam; 95. Clamping fixture; 96. Synchronous wheel; 97. Belt; 98. Driving wheel; 99. Turning motor; 951. Clamping block; 952. Driving roller; 953. Opening and closing cam;

[0048] 51. Carrier rack; 52. Carrier guide wheel; 53. Driving carrier; 54. Carrier moving motor; 55. Driving wheel; 56. Sealing film loading tray; 57. Sealing film roll; 58. Hot pressing block; 59. Lifting slide; 510. Lifting driving roller; 511. Eccentric block; 512. Lifting driving motor. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] See also Figure 1 to Figure 17 As shown, the present invention provides a technical solution: a high-speed turret inspection and packaging equipment for semiconductors, comprising a machine platform 1, a vibration feeding mechanism 2 is arranged on the machine platform 1, a material separation mechanism 3 is arranged at the discharge end of the vibration feeding mechanism 2, and a turret inspection mechanism 4 is arranged on one side of the material separation mechanism 3;

[0051] A carrier packaging mechanism 5 is provided on one side of the turret detection mechanism 4. The turret detection mechanism 4 includes a nozzle rotating mechanism 41 installed in the machine platform 1 and a lifting drive mechanism 42 provided above the nozzle rotating mechanism 41.

[0052] The nozzle rotating mechanism 41 comprises a disc 411 rotatably arranged on the machine platform 1, a plurality of vacuum nozzles 412 arranged at equal intervals are mounted on the disc 411, an air pipe connecting column 412 is arranged at the upper end of the disc 411, a nozzle rotating motor 413 driving the disc 411 to rotate is arranged at the lower end of the disc 411, the vacuum nozzle 412 is connected to the disc 411 in a manner that it can slide up and down, and a return spring 414 is arranged on the outer side of the vacuum nozzle 412;

[0053] The lifting drive mechanism 42 includes a lifting mechanism bracket 421 fixedly installed to the machine platform 1, the lifting mechanism bracket 421 is provided with multiple lifting drive units, the lifting drive units include a lifting drive motor 422, the output shaft of the lifting drive motor 422 is downwardly connected with a cam 423, one side of the cam 423 is provided with a fixed seat 424 fixedly connected to the lifting mechanism bracket 421, one side of the fixed seat 424 is slidably connected with a slide 425, a cam follower roller 426 is installed on the upper end of the slide 425, the cam 423 is in contact with the cam follower roller 426, the slide 425 is connected to the fixed seat 424 through a spring, and multiple detection mechanisms 43 are arranged directly below the vacuum suction nozzle 412.

[0054] Please pay attention to Figure 3 to Figure 8, multiple detection mechanisms 43 include a chip detection fixture, the chip detection fixture includes a holder 431, the holder 431 has a pair of interval-arranged card pins 432, an elastic ejector pin 433 is arranged between the pair of card pins 432, and multiple probes 434 are arranged on both sides of the elastic ejector pin 433, and the probes 434 are electrically connected to the test instrument. A laser marking mechanism 44 is also arranged on one side of the multiple detection mechanisms 43, and the laser marking mechanism 44 includes a marking seat body 441 fixedly connected to the machine 1, and a rotatable chip fixing fixture table 442 is arranged on the marking seat body 441, and four chip placement slots 443 are arranged on the chip fixing fixture table 422. A vacuum negative pressure channel 447 is arranged in the chip fixing fixture 442 and connected to the bottom of the four chip placement slots 443. The chip fixing fixture 442 is driven to rotate by a marking seat motor 444, and a laser generator 445 and a CCD detection camera 446 are respectively arranged on one side of the chip fixing fixture 442.

[0055] Please pay attention to Fig. 9 and Fig.10 The material distribution mechanism 3 includes a material distribution frame 31 fixedly connected to the machine platform 1, a material distribution track 32 is installed on the material distribution mechanism 31, a blocking mechanism 33 is arranged at one end of the material distribution track 32, and a material receiving mechanism 34 is arranged at one side of the blocking mechanism 33;

[0056] The blocking mechanism 33 includes a block 331 slidably connected to the material distribution frame 31 up and down, and a tension spring 332 is connected between the block 331 and the material distribution frame 31;

[0057] The material receiving mechanism 34 includes a material receiving seat 341 connected to the material distributing mechanism 31 in a forward and backward sliding manner. A tension spring 342 is connected between the material receiving mechanism 34 and the material distributing frame 31. A vacuum negative pressure pipeline 343 is arranged in the material receiving seat 341. A fixing groove 344 matching the chip is arranged on the material receiving seat 341. A vacuum suction hole 345 is arranged in the fixing groove 344. A material receiving seat driving roller 346 is connected to the material receiving seat 341.

[0058] A material distributing motor 311 is installed on the material distributing frame 31 , and the output shaft of the material distributing motor 311 is connected to a cam 312 . The front end of the cam 312 abuts against the driving roller 346 of the material receiving seat, and the side wall of the cam 312 abuts against the stopper 331 .

[0059] Please pay attention to Fig.11 and Fig.13A first CCD camera detection unit 6 is arranged on one side of the dividing mechanism 3, a defective product collecting mechanism 7 is also arranged on one side of the multiple detection mechanisms 43, and a second defective product dividing mechanism 8 is also arranged on one side of the multiple detection mechanisms 43. The second defective product dividing mechanism 8 includes a defective product storage rack 81, and a rotatable dividing switching wheel 82 is arranged in the defective product storage rack 81. A plurality of dividing holes 83 are arranged on the dividing switching wheel 82. An upper cover plate 84 and a lower cover plate 85 are respectively installed at the upper and lower ends of the dividing switching wheel 82, a chip entrance 841 is arranged on the upper cover plate 84, and two oppositely arranged discharge ports 851 are arranged on the lower cover plate 85. The two discharge ports 851 are respectively connected to two defective product collection boxes 86, and the defective product collection boxes 86 are placed in the defective product storage rack 81.

[0060] A flipping mechanism 9 is also provided on one side of the multiple detection mechanisms 43. The flipping mechanism 9 includes a flipping base 91 fixedly connected to the machine table 1. A rotatable support frame 92 is provided in the flipping base 91 through a bearing. A clamping positioning motor 93 is installed on the support frame 92. The output shaft of the clamping positioning motor 93 is driven upward to connect to an opening and closing cam 94. A clamping fixture 95 is provided at the top of the support frame 92. The clamping fixture 95 includes four clamping blocks 951 movably connected to the top of the support frame 92. A driving roller 952 is installed at the bottom of the clamping block 951. An opening and closing cam 953 is provided between the driving rollers 952. A synchronous wheel 96 is installed at the bottom of the support frame 92. The synchronous wheel 96 is connected to a driving wheel 98 through a belt 97. The driving wheel 98 is installed on the output shaft of the flipping motor 99. The flipping motor 99 is connected to the synchronous wheel 96 through a belt 97 to rotate the support frame 92. A defective product blowing and rejection mechanism 10 is provided on one side of the flipping mechanism 9.

[0061] The carrier packaging mechanism 5 includes a carrier frame 51, on which a plurality of carrier guide wheels 52 are arranged, on which a carrier 53 is placed, and on one side of the carrier 53 a carrier moving motor 54 is arranged for driving the carrier 53 to move, and the carrier moving motor 54 is connected to a driving wheel 55, and the driving wheel 55 presses the carrier 53, and a sealing film loading tray 56 is installed on the carrier frame 51, on which a sealing film roll 57 is placed, and the sealing film roll 57 passes through a plurality of A guide wheel 52 is pulled to the surface of the carrier tape 53 and passes through the bottom of multiple hot pressing blocks 58 together with the carrier tape 53. The hot pressing blocks 58 are installed on a lifting slide 59. The lifting slide 59 can slide up and down and is connected to the carrier tape frame 51. A driving groove 591 is set on the top of the lifting slide 59. A lifting driving roller 510 is set in the driving groove 591. The lifting driving roller 510 is installed on an eccentric block 511, and the eccentric block 511 is connected to a pressing block lifting driving motor 512.

[0062] Working principle: Fig.18The chip shown has two pins on one side and one pin on the other side. The detection process for the chip is as follows: first, the chip flows out from the discharge track of the vibrating feeder disk and flows to the material dividing mechanism. The material dividing motor synchronously drives the block to move up and down and drives the receiving mechanism to engage and disengage with the discharge track through the material dividing cam. When the block is lifted, the receiving seat of the receiving mechanism is seamlessly connected with the discharge track. Due to the blowing of the blowing mechanism, the front end chip moves into the receiving seat. Then the material dividing motor works again, driving the block to sink and close the discharge track. At the same time, the receiving seat is separated from the discharge track. In this way, a chip is successfully moved to the receiving mechanism (vacuum adsorbed at the same time). The design principle of this structure is mainly because chips have pins, and pins are easily hooked together. In order to prevent hooking, this mechanism is used for material dividing. When receiving the material, the baffle is lifted, and after receiving the material, the baffle sinks and the receiving mechanism is separated from the track, preventing the subsequent chip pins from hooking with each other, separating the chips into discrete states, avoiding the chip materials from being hooked together, which is not conducive to subsequent retrieval.

[0063] At this time, the chip is vacuum-adsorbed on the receiving mechanism (with vacuum suction holes at the bottom), sucked by the vacuum nozzle above and lifted up to rotate one step. The chip is transferred to the top of the CCD camera detection station, and the CCD camera takes a picture of the chip. When the chip pins are inconsistent with the set direction, the chip is moved to the top of the flip mechanism. The clamping positioning motor of the flip mechanism drives the four clamps to clamp the chip from all sides, and then the flip motor drives the chip to rotate 180 degrees, so that all the chips keep the pins facing each other (that is, both pins are in the same position).

[0064] The vacuum nozzle then absorbs the chip and continues to rotate and pass through the elastic ejector pins of multiple chip detection fixtures in turn, so that the pins of the chip are electrically connected to the test instrument through the probe for detection.

[0065] After being tested by multiple inspection jigs for different parameters, the qualified chips are transferred to the laser marking mechanism for laser marking and appearance inspection of the words after marking.

[0066] At the same time, when the defective chips found through testing pass through the defective product sorting mechanism, the chips fall from the chip entrance of the upper cover plate into the sorting hole of the sorting switching wheel, and then the sorting motor drives the sorting wheel to rotate, so that the chips with the same defective problem fall into the same collection box below.

[0067] Finally, the good chips are placed on the carrier tape one by one by the vacuum nozzle, and sealed with the sealing film after heat pressing. Finally, the whole process of good product testing and packaging is completed.

[0068] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-speed turret inspection and packaging equipment for semiconductors, characterized in that: The machine comprises a platform (1), on which a vibrating feeding mechanism (2) is arranged, a material distribution mechanism (3) is arranged at the material discharging end of the vibrating feeding mechanism (2), and a turret detection mechanism (4) is arranged on one side of the material distribution mechanism (3); A carrier packaging mechanism (5) is provided on one side of the turret detection mechanism (4), and the turret detection mechanism (4) comprises a nozzle rotating mechanism (41) installed in the machine platform (1) and a lifting drive mechanism (42) arranged above the nozzle rotating mechanism (41); The nozzle rotating mechanism (41) comprises a disc (411) rotatably arranged on the machine platform (1); a plurality of vacuum nozzles (412) arranged at equal intervals are mounted on the disc (411); an air pipe connecting column (412) is arranged at the upper end of the disc (411); a nozzle rotating motor (413) for driving the disc (411) to rotate is arranged at the lower end of the disc (411); the vacuum nozzle (412) is connected to the disc (411) in a manner that it can slide up and down; and a return spring (414) is arranged on the outer side of the vacuum nozzle (412); The lifting drive mechanism (42) comprises a lifting mechanism bracket (421) fixedly mounted on the machine platform (1); the lifting mechanism bracket (421) is provided with a plurality of lifting drive units; the lifting drive units comprise a lifting drive motor (422); the output shaft of the lifting drive motor (422) is downwardly connected to a cam (423); a fixed seat (424) fixedly connected to the lifting mechanism bracket (421) is provided on one side of the cam (423); a slide seat (425) is slidably connected to one side of the fixed seat (424); a cam follower roller (426) is mounted on the upper end of the slide seat (425); the cam (423) abuts against the cam follower roller (426); the slide seat (425) is connected to the fixed seat (424) via a spring; and a plurality of detection mechanisms (43) are provided directly below the vacuum suction nozzle (412).

2. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: The plurality of detection mechanisms (43) include a chip detection fixture, wherein the chip detection fixture includes a card seat (431), wherein the card seat (431) has a pair of card pins (432) arranged at intervals, an elastic ejector pin (433) is arranged between the pair of card pins (432), and a plurality of probes (434) are arranged on both sides of the elastic ejector pin (433), and the probes (434) are electrically connected to a test instrument.

3. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: A laser marking mechanism (44) is also provided on one side of the plurality of detection mechanisms (43). The laser marking mechanism (44) comprises a marking seat body (441) fixedly connected to the machine platform (1). A rotatable chip fixing fixture table (442) is provided on the marking seat body (441). Four chip placement slots (443) are provided on the chip fixing fixture table (422). A vacuum negative pressure channel (447) is provided in the chip fixing fixture (442) and is connected to the bottoms of the four chip placement slots (443). The chip fixing fixture (442) is driven to rotate by a marking seat motor (444). A laser generator (445) and a CCD detection camera (446) are respectively provided on one side of the chip fixing fixture (442).

4. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: The material distribution mechanism (3) comprises a material distribution frame (31) fixedly connected to the machine platform (1); a material distribution track (32) is installed on the material distribution mechanism (31); a blocking mechanism (33) is arranged at one end of the material distribution track (32); and a material receiving mechanism (34) is arranged at one side of the blocking mechanism (33); The blocking mechanism (33) comprises a blocking block (331) connected to the material distribution frame (31) in an up-and-down sliding manner, and a tension spring (332) is connected between the blocking block (331) and the material distribution frame (31); The material receiving mechanism (34) comprises a material receiving seat (341) connected to the material distributing mechanism (31) in a forward and backward sliding manner, a tension spring (342) is connected between the material receiving mechanism (34) and the material distributing frame (31), a vacuum negative pressure pipeline (343) is arranged in the material receiving seat (341), a fixing groove (344) matching the chip is arranged on the material receiving seat (341), a vacuum suction hole (345) is arranged in the fixing groove (344), and a material receiving seat driving roller (346) is connected to the material receiving seat (341); A material distributing motor (311) is installed on the material distributing frame (31), and the output shaft of the material distributing motor (311) is connected to a cam (312), the front end of the cam (312) abuts against a material receiving seat driving roller (346), and the side wall of the cam (312) abuts against a stopper (331).

5. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: A first CCD camera detection unit (6) is provided on one side of the material distribution mechanism (3).

6. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: A defective product collection mechanism (7) is also provided on one side of the plurality of detection mechanisms (43).

7. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: A second defective product sorting mechanism (8) is also provided on one side of the plurality of detection mechanisms (43), and the second defective product sorting mechanism (8) comprises a defective product storage rack (81), a rotatable sorting switching wheel (82) is provided in the defective product storage rack (81), a plurality of sorting holes (83) are provided on the sorting switching wheel (82), an upper cover plate (84) and a lower cover plate (85) are respectively installed at the upper and lower ends of the sorting switching wheel (82), a chip entrance (841) is provided on the upper cover plate (84), and two discharge ports (851) arranged opposite to each other are provided on the lower cover plate (85), and the two discharge ports (851) are respectively connected to two defective product collection boxes (86), and the defective product collection boxes (86) are placed in the defective product storage rack (81).

8. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: A flip mechanism (9) is also provided on one side of the plurality of detection mechanisms (43), the flip mechanism (9) comprising a flip base (91) fixedly connected to the machine platform (1), a rotatable support frame (92) being provided in the flip base (91) via a bearing, a clamping positioning motor (93) being installed on the support frame (92), an output shaft of the clamping positioning motor (93) being upwardly driven and connected to an opening and closing cam (94), a clamping fixture (95) being provided at the top end of the support frame (92), the clamping fixture (95) comprising four movably connected to the support frame (92) A clamping block (951) is provided at the top, a driving roller (952) is installed at the bottom of the clamping block (951), an opening and closing cam (953) is provided between the driving rollers (952), a synchronous wheel (96) is installed at the bottom end of the support frame (92), the synchronous wheel (96) is connected to a driving wheel (98) through a belt (97), the driving wheel (98) is installed on the output shaft of a flip motor (99), and the flip motor (99) is connected to the synchronous wheel (96) through a belt (97) to rotate the support frame (92).

9. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: A defective product blowing and rejecting mechanism (10) is provided on one side of the turning mechanism (9).

10. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: The carrier packaging mechanism (5) comprises a carrier frame (51), a plurality of carrier guide wheels (52) are arranged on the carrier frame (51), a carrier tape (53) is placed on the carrier guide wheel (52), a carrier moving motor (54) for driving the carrier tape (53) to move is arranged on one side of the carrier tape (53), the carrier moving motor (54) is connected to a driving wheel (55), the driving wheel (55) presses against the carrier tape (53), a sealing film loading tray (56) is installed on the carrier frame (51), a sealing film roll (57) is placed on the sealing film loading tray (56), and the sealing film roll (57) is pressed against the carrier tape (53). 57) is pulled to the surface of the carrier tape (53) through a plurality of guide wheels (52) and passes through the bottom of a plurality of hot pressing blocks (58) together with the carrier tape (53). The hot pressing blocks (58) are mounted on a lifting slide (59). The lifting slide (59) can be slid up and down and connected to the carrier tape frame (51). A driving groove (591) is provided on the top of the lifting slide (59). A lifting driving roller (510) is provided in the driving groove (591). The lifting driving roller (510) is mounted on an eccentric block (511). The eccentric block (511) is connected to a pressing block lifting driving motor (512).

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