Columnar ceramic part micropore cleaning process

Abstract

The invention discloses a columnar ceramic part micropore cleaning process, and relates to the technical field of ceramic electronic component cleaning. The cleaning technology comprises the following steps that a to-be-cleaned ceramic part is put into a cleaning agent to be cleaned; adding alkali liquor into the reaction kettle, heating until the liquid is boiled, putting the ceramic part into the reaction kettle, and starting to extract negative pressure; taking out the ceramic part, cleaning and then centrifugally dewatering; the dewatered ceramic part is put into an ultrasonic roller cleaning machine, a vacuumizing button is turned on, and the first-section negative pressure and the rotating speed and the cleaning time of a roller are adjusted; and then the second-section negative pressure, the rotating speed of the roller and the cleaning time are adjusted, vacuumizing is stopped after cleaning, pressure relief is conducted, the ceramic part is taken out, and dewatering is conducted after cleaning. The vacuum negative pressure principle technology is adopted, meanwhile, one-time alkali boiling pre-cleaning is added, oil dirt in the inner hole of the ceramic part is emulsified in advance, then vacuum and roller rotating cleaning are used for removing the oil dirt, and the inner hole cleaning efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of cleaning ceramic electronic components, and in particular to a micropore cleaning process of a columnar ceramic part. Background Art

[0002] At present, the cleaning process for columnar ceramic parts with through holes (such as ceramic ferrules, splitters, etc.) is mainly to scatter the ceramic parts in a drum ultrasonic cleaning machine, add a cleaning agent, and clean the through holes of the columnar ceramic parts through the continuous turning of the drum and the cavitation of the ultrasonic wave. However, since the grinding liquid of the previous processing process remains in the through holes of the ceramic parts, and the main components of the grinding liquid are mineral oil and vegetable oil, if it is directly placed in the cleaning equipment for cleaning, the dirt remaining in the hole will directly enter the cleaning liquid, the dirt concentration will increase, and the cleaning difficulty will increase. And since the through holes are mostly below 0.2mm, the aperture is extremely small, and the inner hole of the ceramic parts is filled with air before being placed in the cleaning equipment. When the ceramic parts are placed in the cleaning equipment, the ceramic parts are gradually immersed in the cleaning liquid. Due to the small aperture, the air in the through hole will not overflow from the inner hole immediately, resulting in the cleaning agent being unable to enter the inner hole, and the dirt remaining in the inner hole is difficult to be emulsified, and since there is no water in the through hole, the ultrasonic wave cannot play a cavitation effect, resulting in the cleaning effect not reaching the target, and there is a problem of incomplete cleaning. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a micropore cleaning process for columnar ceramic parts. The present invention adopts the principle technology of vacuum negative pressure, and quickly removes the air in the inner hole of the ceramic part through vacuum negative pressure, thereby improving the efficiency and cleaning capacity of the inner hole. At the same time, a caustic soda pre-cleaning is added to emulsify the oil in the inner hole in advance, and then remove it by vacuum and drum rotation cleaning, thereby improving the efficiency of inner hole cleaning.

[0004] To achieve the above object, the technical solution adopted by the present invention is:

[0005] The present invention provides a micropore cleaning process for a columnar ceramic part, comprising the following steps:

[0006] S1: putting the ceramic parts to be cleaned into the cleaning agent for cleaning;

[0007] S2: Add alkali solution into the reactor and heat it until the liquid boils. Then put the cleaned ceramic parts into the reactor and start to pump negative pressure. The negative pressure is 0.1-0.5MPa and the heating and boiling time is 20-35min.

[0008] S3: Take out the ceramic parts, wash them and then centrifuge and dehydrate them;

[0009] S4: Put the dehydrated ceramic parts into the ultrasonic drum cleaning machine, turn on the ultrasound, and then start the first cleaning process, turn on the vacuum button, adjust the first negative pressure to 0.1-0.4MPa, and then start the drum cleaning machine, the drum speed is 10-40r / min, and the cleaning time is 10-20min; then start the second cleaning process, adjust the second negative pressure to 0.1-0.2MPa, the drum speed is 5-30r / min, and the cleaning time is 5-15min. After cleaning, turn off the vacuum, release the pressure, and take out the ceramic parts;

[0010] S5: Put the taken out ceramic parts into the water drum, wash and dehydrate them.

[0011] The present invention adds a alkali boiling process, which uses negative pressure to press out the air in the micropores of the ceramic part, allowing the alkali solution to enter the inner hole. The alkali solution reacts with the residual oil stains in the inner hole at high temperature to undergo a saponification reaction, converting the water-insoluble oil stains in the inner hole into saponified substances soluble in water, and then dehydrating the saponified substances, impurities and mixed water in the inner hole to be thrown out together. Then, a vacuum pumping component is added to the drum cleaning equipment to extract the air in the micropores of the ceramic part, allowing the cleaning agent to enter the inner hole. The cleaning agent decomposes the residual dirt in the inner hole in the inner hole, and the rolling of the drum cleaning machine is added to quickly clean the inner hole of the ceramic part. And by setting two stages of cleaning, in the second stage of cleaning, there is no air in the inner hole of the material, and the cleaning agent is completely immersed in the inner hole, which can appropriately reduce the pressure, reduce the energy consumption caused by the negative pressure and the damage to the equipment. The rotation speed can also be appropriately reduced to reduce the missing corners caused by the impact of the material.

[0012] The present invention controls the alkali boiling time to be 20-35 minutes. When the alkali boiling time is less than 20 minutes, the time is too short, the alkali solution cannot be fully combined with and decomposed with the dirt, and the cleaning effect is poor; when the alkali boiling time is greater than 35 minutes, when the alkali boiling time is 35 minutes, the cleaning effect has reached the optimal level, and extending the alkali boiling time cannot further improve the cleaning effect, which will cause waste of electricity and reduce production efficiency.

[0013] During the cleaning process, the first section of negative pressure is set to 0.1-0.4MPa. When the negative pressure is too low, the pressure is insufficient to extract the air in the inner hole of the ceramic part, and the cleaning agent cannot penetrate into the inner hole, resulting in poor cleaning effect. When the negative pressure is too large and exceeds 0.4MPa, it cannot improve the quality, but instead causes excessive load on the equipment, which can easily cause equipment loss.

[0014] The negative pressure in the second stage of the cleaning process is set to 0.1-0.2MPa. When the negative pressure is insufficient, the vacuum state cannot be maintained during the cleaning process, and the inner hole cleaning effect is poor; in this stage, only appropriate pressure maintenance is required. When the negative pressure exceeds 0.2MPa, the cleaning effect is limited, power is wasted, the equipment load is too large, and equipment loss is easy to occur.

[0015] During the first cleaning process, the speed of the drum is set to 10-40r / min. When the speed is too low (less than 10r / min), the cleaning effect is difficult to achieve due to the low rolling frequency and the small number of physical flipping. When the speed is too fast (greater than 40r / min), the drum speed is fast, and the material flips violently in the drum, causing the material to directly hit the drum wall, which will cause the corners of the material to be chipped by the metal drum wall.

[0016] During the second cleaning process, the speed of the drum is set to 5-30r / min. When the speed is too low (less than 5r / min), the cleaning effect is difficult to achieve due to the low rolling frequency and the small number of physical flipping. When the speed is too fast (greater than 30r / min), the drum speed is fast, and the material flips violently in the drum, causing the material to directly hit the drum wall, which will cause the corners of the material to be chipped by the metal drum wall.

[0017] Preferably, in step S1, the cleaning agent includes at least one of detergent, metal cleaning agent, industrial oil cleaning agent, and hydrocarbon cleaning agent.

[0018] Preferably, in step S2, the alkali solution includes at least one of sodium hydroxide solution, potassium hydroxide solution, sodium carbonate solution and sodium bicarbonate solution.

[0019] Preferably, in step S2, the mass concentration of the alkali solution is 8-15%.

[0020] Preferably, in step S2, the negative pressure of alkali boiling is 0.3-0.5 MPa.

[0021] Preferably, in step S4, the ultrasonic frequency is 20-35 Hz.

[0022] Preferably, in step S4, the first stage negative pressure is 0.3-0.4 MPa, the rotation speed of the drum is 10-20 r / min, and the cleaning time is 15-20 min.

[0023] Preferably, in step S4, the second stage negative pressure is 0.15-0.2 MPa, the rotation speed of the drum is 15-20 r / min, and the cleaning time is 10-15 min.

[0024] Preferably, in step S5, the drum cleaning time is 15-40 minutes.

[0025] Preferably, the ceramic component is a ceramic ferrule.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] The present invention improves the cleaning efficiency and cleaning capacity of the inner hole by adopting the alkali boiling process and quickly removing the air in the inner hole of the ceramic part by vacuum negative pressure. In addition, a alkali boiling pre-cleaning is added to emulsify the oil stains in the inner hole in advance, and then remove them by setting two cleaning processes and adopting vacuum negative pressure and drum rotation cleaning, which further improves the cleaning efficiency of the inner hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The present invention is a flow chart of the micropore cleaning process of the columnar ceramic part and the existing cleaning process. DETAILED DESCRIPTION

[0029] In order to better illustrate the purpose, technical solutions and advantages of the present invention, the present invention will be further described below in conjunction with specific embodiments, but the protection scope and implementation methods of the present invention are not limited thereto.

[0030] Unless otherwise specified, the materials and reagents used in the following examples are commercially available.

[0031] Example 1

[0032] A micropore cleaning process for a columnar ceramic part comprises the following steps:

[0033] S1: Put the ceramic ferrule to be cleaned into detergent for cleaning, and wash away the oil and ground powder on the surface until there is no obvious dirt on the surface.

[0034] S2: Add sodium hydroxide with a mass concentration of 10% into the reaction boiler and heat it until the liquid boils. Then put the cleaned ceramic insert into the reaction boiler and start to pump negative pressure. The negative pressure is 0.3MPa and the heating and alkali boiling time is 30min.

[0035] S3: Take out the ceramic insert in S2, rinse it with clean water, and then centrifuge it for 10 minutes to remove the alkali solution, oil stains and saponification reaction products in the inner hole by centrifugation.

[0036] S4: Place the dehydrated ceramic ferrule into an ultrasonic drum cleaning machine, turn on the ultrasound, the ultrasonic frequency is 28 Hz, then start the first cleaning process, turn on the vacuum button, and adjust the first negative pressure to 0.3 MPa; then start the drum cleaning machine, the drum speed is 25 r / min, and the cleaning time is 15 min; then start the second cleaning process, adjust the second negative pressure to 0.15 MPa, the drum speed is 15 r / min, and the cleaning time is 10 min. After cleaning, turn off the vacuum, release the pressure, and take out the ceramic ferrule.

[0037] S5: Put the taken out ceramic insert into a clean water drum, wash it for 20 minutes, and then dehydrate it.

[0038] Examples 2-3, Comparative Examples 1-3

[0039] The difference from Example 1 is that in step S2, the negative pressure for boiling alkali is different from that in Example 1.

[0040] Example 4-5, Comparative Example 4-5

[0041] The difference from Example 1 is that in step S2, the alkali boiling time is different from that in Example 1.

[0042] Example 6-8, Comparative Example 6-8

[0043] The difference from Example 1 is that in step S4, the first cleaning process and the first negative pressure are different from those in Example 1.

[0044] Examples 9-12, Comparative Examples 9-10

[0045] The difference from Example 1 is that in step S4, during the first cleaning process, the rotation speed of the drum is different from that of Example 1.

[0046] Examples 13-14, Comparative Examples 11-12

[0047] The difference from Example 1 is that in step S4, the first cleaning process and the cleaning time are different from those in Example 1.

[0048] Examples 15-16, Comparative Examples 13-15

[0049] The difference from Example 1 is that in step S4, the second cleaning process and the second negative pressure are different from those in Example 1.

[0050] Examples 17-20, Comparative Examples 16-17

[0051] The difference from Example 1 is that in step S4, during the second cleaning process, the rotation speed of the drum is different from that of Example 1.

[0052] Examples 21-22, Comparative Examples 18-19

[0053] The difference from Example 1 is that in step S4, the second cleaning process and the cleaning time are different from those in Example 1.

[0054] Comparative Example 20

[0055] The difference from Example 1 is that in step S4, cleaning is performed for 25 minutes only according to the negative pressure and rotation speed of the first stage.

[0056] Comparative Example 21

[0057] The difference from Example 1 is that in step S4, no negative pressure is applied during the drum cleaning stage.

[0058] The cleaning process parameters in the above embodiments and comparative examples are shown in Table 1:

[0059] Table 1

[0060]

[0061]

[0062]

[0063] Performance Testing

[0064] 1. Inner hole cleanliness: Take 500 ceramic ferrules, use steel wire to pass through the inner hole of the ceramic ferrule, and then put the ceramic ferrule under a 200x end inspection instrument to confirm the number of dirty products. Test standard: qualified rate> 90%.

[0065] 2. Missing corner rate: Take 1,000 ceramic ferrules and insert them into the testing tool. First look at one end of the ceramic ferrule, then turn it over and look at the other end to confirm the number of missing corners at both ends. Test standard: Missing corner rate <0.2%.

[0066] Note: The ceramic ferrule in the specific embodiment of the present invention is an SC single-mode ferrule with an outer diameter of 2.499±0.0020 mm and an inner diameter of 0.1250-0.1260 mm.

[0067] Table 2

[0068]

[0069]

[0070] Note: In the table It means that when the boiling time increases or the negative pressure increases during cleaning, the cleaning effect and the chipping are both qualified, but it will cause waste of electricity, easy damage to equipment or reduced production efficiency.

[0071] It can be seen from Examples 1-3 and Comparative Examples 1-3 that when the negative pressure of alkali boiling increases from 0 to 0.3 MPa, the qualified rate of inner hole cleanliness gradually increases. When the negative pressure is 0.3 MPa, the cleanliness is not significantly improved with the increase of negative pressure, and the missing corner rate does not change significantly. When the negative pressure is 0.1-0.3 MPa, the cleaning effect meets the requirements. If the negative pressure is less than 0.1 MPa or greater than 0.3 MPa, the cleaning effect is poor.

[0072] It can be seen from Examples 4-5 and Comparative Examples 4-5 that as the alkali boiling time increases from 0 min to 30 min, the cleanliness of the inner hole gradually improves, but after 35 min, the cleanliness changes very little, and the corner defect rate does not change significantly. The cleaning effect meets the requirements when the alkali boiling time is 20-35 min, and the cleaning effect is poor when it is less than 20 min. When the time exceeds 35 min, the cleaning effect no longer improves, which wastes electricity and reduces the cleaning efficiency.

[0073] It can be seen from Examples 6-8 and Comparative Examples 6-8 that the inner hole cleanliness qualification rate increases higher with the increase of the first-stage negative pressure from 0 to 0.3 MPa. When the negative pressure is 0.3 MPa, the cleanliness does not improve significantly with the increase of the negative pressure, and the corner defect rate does not change significantly. When the first-stage negative pressure is between 0.1 and 0.3 MPa, the cleaning effect meets the requirements. When the negative pressure is less than 0.1 MPa, the cleaning effect is not good. When the negative pressure is greater than 0.3 MPa, the cleaning effect no longer improves, resulting in a waste of electric energy.

[0074] It can be seen from Examples 9-12 and Comparative Examples 9-10 that the faster the speed in the first stage, the higher the qualified rate of inner hole cleanliness. After the speed reaches 40 r / min, the corner chipping rate increases significantly. When the speed in the first stage is 10-40 r / min, the cleaning effect meets the requirements. When the speed is less than 10 r / min, the cleaning effect does not meet the requirements. When the speed exceeds 40 r / min, the corner chipping rate does not meet the requirements.

[0075] It can be seen from Examples 13-14 and Comparative Examples 11-12 that as the first period of time increases from 5 min to 15 min, the cleanliness of the inner hole gradually improves with the increase of time, but after 15 min, the cleanliness of the inner hole no longer improves, and the corner missing rate does not change significantly. When the first period of time is 10-20 min, the cleaning effect meets the requirements. When the cleaning time is less than 10 min, the cleaning effect does not meet the requirements. When the time exceeds 20 min, the cleaning effect no longer improves, resulting in waste of electricity and reduced cleaning efficiency. In addition, the corner missing rate increases due to excessively long cleaning time.

[0076] It can be seen from Examples 15-16 and Comparative Examples 13-15 that as the negative pressure in the second stage increases, the higher the negative pressure, the higher the qualified rate of inner hole cleanliness. When the negative pressure exceeds 0.15 MPa, the qualified rate of inner hole cleanliness no longer increases, and the missing corner rate does not change significantly. When the negative pressure in the second stage is between 0.1 and 0.2 MPa, the cleaning effect meets the requirements. When the negative pressure is less than 0.1 MPa, the cleaning effect does not meet the requirements. When the negative pressure in the second stage is greater than 0.2 MPa, the cleaning effect is no longer improved, resulting in a waste of electric energy.

[0077] It can be seen from Examples 17-20 and Comparative Examples 16-17 that when the second-stage speed gradually increases from 2r / min to 35r / min, the cleanliness of the inner hole gradually improves, but the corner defect rate increases significantly after the speed exceeds 15r / min. When the second-stage speed is between 5 and 30r / min, the cleaning effect meets the requirements. When the second-stage speed is less than 5r / min, the cleaning effect does not meet the requirements. When the speed is greater than 30r / min, the corner defect rate increases and does not meet the requirements.

[0078] It can be seen from Examples 21-22 and Comparative Examples 18-19 that when the second time period is increased from 2 min to 15 min, the qualified rate of inner hole cleanliness gradually increases. When it exceeds 15 min, the cleanliness no longer increases. When the second time period is 5 to 15 min, the cleaning effect meets the requirements. When the second time period is less than 5 min, the cleaning effect does not meet the requirements. When the second time period exceeds 15 min, the cleaning effect no longer increases, resulting in a waste of electric energy. In addition, the cleaning time is too long, resulting in an increase in the corner chipping rate.

[0079] It can be seen from Comparative Examples 20-21 and Example 1 that if cleaning is performed only according to the negative pressure and rotation speed of the first stage, the cleaning effect cannot meet the requirements; if negative pressure is not applied during the drum cleaning process, the cleaning requirements cannot be met.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.

Claims

1. A micropore cleaning process for a columnar ceramic part, characterized in that: The following steps are involved: S1: putting the ceramic parts to be cleaned into the cleaning agent for cleaning; S2: Add alkali solution into the reactor and heat it until the liquid boils. Then put the cleaned ceramic parts into the reactor and start to pump negative pressure. The negative pressure is 0.1-0.5MPa and the heating and boiling time is 20-35min. S3: Take out the ceramic parts, wash them and then centrifuge and dehydrate them; S4: Put the dehydrated ceramic parts into the ultrasonic drum cleaning machine, turn on the ultrasound, and then start the first cleaning process, turn on the vacuum button, adjust the first negative pressure to 0.1-0.4MPa, and then start the drum cleaning machine, the drum speed is 10-40r / min, and the cleaning time is 10-20min; then start the second cleaning process, adjust the second negative pressure to 0.1-0.2MPa, the drum speed is 5-30r / min, and the cleaning time is 5-15min. After cleaning, turn off the vacuum, release the pressure, and take out the ceramic parts; S5: Put the taken out ceramic parts into the water drum, wash and dehydrate them.

2. The micropore cleaning process of a columnar ceramic part according to claim 1, characterized in that: In step S1, the cleaning agent includes at least one of detergent, metal cleaning agent, industrial oil cleaning agent, and hydrocarbon cleaning agent.

3. The micropore cleaning process of a columnar ceramic member according to claim 1, characterized in that: In step S2, the alkaline solution includes at least one of a sodium hydroxide solution, a potassium hydroxide solution, a sodium carbonate solution, and a sodium bicarbonate solution.

4. The micropore cleaning process of a columnar ceramic member according to claim 1, characterized in that: In step S2, the mass concentration of the alkali solution is 8-15%.

5. The micropore cleaning process of a columnar ceramic member according to claim 1, characterized in that: In step S2, the negative pressure of alkali boiling is 0.3-0.5 MPa.

6. The micropore cleaning process of a columnar ceramic member according to claim 1, characterized in that: In step S4, the ultrasonic frequency is 20-35 Hz.

7. The micropore cleaning process of a columnar ceramic member according to claim 1, characterized in that: In step S4, the first stage negative pressure is 0.3-0.4 MPa, the rotation speed of the drum is 10-20 r / min, and the cleaning time is 15-20 min.

8. The micropore cleaning process of a columnar ceramic member according to claim 1, characterized in that: In step S4, the second stage negative pressure is 0.15-0.2 MPa, the rotation speed of the drum is 15-20 r / min, and the cleaning time is 10-15 min.

9. The micropore cleaning process of a columnar ceramic member according to claim 1, characterized in that: In step S5, the drum cleaning time is 15-40 minutes.

10. The micropore cleaning process of a columnar ceramic member according to claim 1, characterized in that: The ceramic component includes a ceramic ferrule.

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