Laser scanning processing system and control method thereof

Abstract

The invention relates to the technical field of laser processing, discloses a laser scanning processing system and a control method thereof, and aims to solve the problem that the processing precision and the processing effect are poor due to the fact that the defocusing amount cannot be accurately controlled in the laser processing process. The laser scanning processing system comprises a light source part, modulation equipment and an optical collector. When the laser scanning processing system is in a detection state, the light source part emits a detection light beam, the detection light beam gradually scans the surface of a preset object through the modulation equipment, and the optical collector collects an imaging pattern of the detection light beam on the surface of the preset object and is used for calculating the three-dimensional contour shape and size of the preset object. When the laser scanning processing system is in a processing state, the light source part emits a processing light beam, and the processing light beam is controlled by the modulation equipment to process a preset object. Therefore, the modulation equipment can meet the modulation of the detection light beam and the processing light beam, the processing precision and effect of the preset object can be improved, and the weight reduction and miniaturization design of the system are facilitated.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser scanning processing system and a control method thereof. Background Art

[0002] Due to the characteristics of laser processing such as high precision, high quality, small heat impact, no recast layer and the ability to process a variety of complex materials, it has gradually been widely used in many fields such as aerospace, electronic circuits, and shipbuilding. Laser processing includes laser cutting, laser marking, laser welding, laser engraving or laser drilling and other processing methods.

[0003] During the laser processing process, at the preset object (i.e., the workpiece to be processed), the distance between the focus of the light beam and the surface of the preset object is the defocus amount. Accurately controlling the defocus amount within a small and appropriate range can improve the laser processing effect.

[0004] However, since the surface shape of the preset object cannot be known before processing or there is an error between the known surface information and the actual surface, the laser cannot be accurately focused on the processing surface of the preset object, that is, the defocus amount cannot be accurately controlled, which will affect the processing accuracy and effect of the preset object. Summary of the invention

[0005] The purpose of the present application is to provide a laser scanning processing system and a control method thereof, aiming to solve the problem of poor processing accuracy and processing effect caused by the inability to accurately control the defocus amount during laser processing.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions:

[0007] On the one hand, some embodiments of the present application provide a laser scanning processing system, including a light source, a modulation device, and an optical collector, wherein the modulation device is used to modulate a laser beam emitted by the light source. The laser scanning processing system has a detection state and a processing state, and the laser beam includes a detection beam and a processing beam.

[0008] When the laser scanning processing system is in the detection state, the light source emits a detection beam, and through the modulation device, the detection beam is gradually scanned on the surface of the preset object, and the optical collector collects the imaging pattern of the detection beam on the surface of the preset object, which is used to calculate the three-dimensional contour shape and size of the preset object.

[0009] When the laser scanning processing system is in a processing state, the light source component emits a processing beam, and controls the processing beam through the modulation device to process a preset object.

[0010] In this way, before using the processing beam to process the preset object, the laser scanning processing system can scan and measure the surface of the preset object through the detection beam, and collect the imaging pattern of the detection beam on the surface of the preset object through the optical collector to calculate and obtain the accurate three-dimensional contour shape and size of the preset object. Subsequently, the processing beam is emitted through the light source, and the focusing direction, focusing angle and defocusing amount of the processing beam passing through the modulation device are flexibly adjusted to perform precise processing such as laser cutting, laser marking, laser welding, laser engraving or laser drilling on the preset object.

[0011] Because before using the laser scanning processing system to accurately process the preset object, the three-dimensional contour shape and size of the preset object can be accurately obtained through the detection state. When the laser scanning processing system is in the processing state, it is convenient to accurately control the defocus amount of the processing light beam within a smaller suitable range, and to accurately control the focusing direction and focusing angle of the processing light beam. In this way, it can be avoided that the laser beam cannot be accurately focused on the processing surface of the preset object due to the surface size error of the preset object during the processing, that is, the defocus amount cannot be accurately controlled. It is conducive to improving the precise control of the laser scanning processing system on the defocus amount of the processing light beam, thereby improving the processing accuracy and effect of the preset object.

[0012] In addition, in the embodiment of the present application, since the detection beam is in the process of scanning and imaging, it can be achieved by reducing the emission power of the light source and by flexible control of the modulation device. There is no need to add an additional structured light projection setting. The laser scanning processing system can have the three-dimensional scanning and ranging function of the preset object only through the added optical collector. While realizing the functional integration of the laser processing platform, the integration of the integrated system is further improved, which is conducive to the miniaturization design of the laser scanning processing system and reduces the weight of the whole equipment.

[0013] In some embodiments, the laser scanning processing system further includes a processing module, which is electrically connected to the light source, the modulation device, and the optical collector, and is used to control the laser scanning processing system to be in a detection state or a processing state. When the laser scanning processing system is in the detection state, the processing module receives the imaging pattern and calculates the three-dimensional contour shape and size of the preset object.

[0014] In some embodiments, the bearing surface supporting the preset object along the first straight line direction is a reference plane, and the first straight line direction is perpendicular to the reference plane. Along the first straight line direction, the light outlet of the modulation device and the optical collector are installed at the same height from the reference plane.

[0015] In some embodiments, when the processing module switches to the detection state, the processing module calculates the three-dimensional contour shape and size of the preset object by the following formula:

[0016] .

[0017] Wherein, h is the height dimension of one point of the preset object compared to the reference plane along the first straight line direction. L is the distance dimension between the optical collector and the reference plane along the first straight line direction. d is the minimum distance dimension between the light outlet of the modulation device and the optical collector along the second straight line direction, and the second straight line direction is perpendicular to the first straight line direction. T is the grating period of the detection light beam. is the new information parameter of the phase.

[0018] In some embodiments, the laser scanning processing system further includes a stage and a driving assembly. The stage is used to carry a preset object. The processing module is electrically connected to the driving assembly and is used to adjust the relative position of the stage and the modulation device.

[0019] In some embodiments, the drive assembly includes a first drive member and / or a second drive member. The first drive member is connected and installed with the stage, and the processing module is electrically connected to the first drive member for adjusting the position state of the stage. At least the light source member and the modulation device are connected and installed with the second drive member, and the processing module is electrically connected to the second drive member for adjusting the position state of the light source member and the modulation device.

[0020] In some embodiments, the modulation device includes a galvanometer assembly, a lens assembly, and an aperture member. The galvanometer assembly is used to adjust the deflection direction and deflection angle of the laser beam. The lens assembly is used to adjust the focus position of the laser beam. The aperture member is used to adjust the size of the laser beam.

[0021] In some embodiments, when the laser scanning processing system is in a detection state, the scanning trajectory of the detection light beam within a preset time is a preset stripe pattern or a preset grid pattern.

[0022] In some embodiments, the optical collector continuously collects imaging patterns at a preset object within a preset time.

[0023] On the other hand, some embodiments of the present application provide a control method of a laser scanning processing system, which is used to control the laser scanning processing device in the above aspect, and the control method includes:

[0024] The light source is controlled to emit a detection light beam, and the modulation device is controlled to gradually scan the detection light beam on the surface of the preset object.

[0025] During the scanning process of the detection beam, the optical collector is controlled to synchronously collect the imaging pattern of the detection beam on the surface of the preset object.

[0026] Calculate the 3D outline shape and size of a given object.

[0027] The light source is controlled to emit a processing light beam, and the processing light beam is controlled by a modulation device to process the preset object according to the three-dimensional contour shape and size of the preset object.

[0028] Since the control method of the laser scanning processing system is used to control the laser scanning processing system in the above aspect, the control method has all the beneficial effects of the above-mentioned laser scanning processing system, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 A schematic diagram of the structure of a laser scanning processing system provided in an embodiment of the present application;

[0031] Figure 2 for Figure 1 A schematic diagram of an optical path simulation of a modulation device and an optical collector shown in;

[0032] Figure 3 A schematic diagram of the connection structure of a laser scanning processing system provided in an embodiment of the present application;

[0033] Figure 4 A flow chart of a control method for a laser scanning processing system provided in an embodiment of the present application.

[0034] Reference numerals:

[0035] 100. Laser scanning processing system;

[0036] 10. Light source; 20. Modulation device; 21. Galvanometer assembly; 22. Lens assembly; 23. Aperture assembly; 30. Optical collector; 40. Processing module; 50. Stage; 51. Reference surface;

[0037] 60. driving assembly; 61. first driving member; 62. second driving member;

[0038] 200. Preset objects. DETAILED DESCRIPTION

[0039] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0040] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0041] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0042] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0043] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0044] Due to the characteristics of laser processing such as high precision, high quality, small heat impact, no recast layer and the ability to process a variety of complex materials, it has gradually been widely used in many fields such as aerospace, electronic circuits, and shipbuilding. Laser processing includes laser cutting, laser marking, laser welding, laser engraving or laser drilling and other processing methods.

[0045] During the laser processing process, at the preset object (i.e., the workpiece to be processed), the distance between the focus of the light beam and the surface of the preset object is the defocus amount. Accurately controlling the defocus amount within a small and appropriate range can improve the laser processing effect.

[0046] However, since the surface shape of the preset object cannot be known before processing or there is an error between the known surface information and the actual shape, the laser cannot be accurately focused on the processing surface of the preset object, that is, the defocus amount cannot be accurately controlled, which will affect the processing accuracy and effect of the preset object, resulting in the inability to accurately control the defocus amount, that is, the laser scanning processing system cannot accurately process the surface of the preset object.

[0047] The related solution uses the visual inspection module to collect the surface information of the preset object in real time to cooperate with the laser beam to improve the processing accuracy. At present, the laser scanning processing system with a visual inspection module is mainly used to find and locate the x-axis and z-axis positions of the light spot level, or to observe the processing traces on the surface of the preset object. In this way, the preset object and the light beam can be adjusted during the processing to improve the processing effect and accuracy.

[0048] However, in actual application, due to the influence of processing debris or cooling structure, the visual inspection module cannot accurately obtain the exact situation at the processing position, which will also affect the processing accuracy and effect.

[0049] On the one hand, if Figure 1 As shown, Figure 1 The present invention provides a schematic diagram of the structure of a laser scanning processing system 100 provided in an embodiment of the present invention. The laser scanning processing system 100 includes a light source 10, a modulation device 20, and an optical collector 30. The modulation device 20 is used to modulate the laser beam emitted by the light source 10. For example, the focusing direction, focusing angle, and defocusing amount of the light beam can be flexibly controlled by the modulation device 20.

[0050] The laser scanning processing system 100 has a detection state and a processing state. Correspondingly, the laser beam emitted by the light source 10 includes a detection beam and a processing beam. The power of the processing beam is greater than or equal to the power of the detection beam to prevent the detection beam with a higher power from damaging the surface of the preset object 200.

[0051] Reference Figure 1 and Figure 2 , Figure 2 for Figure 1 A schematic diagram of light path simulation of the modulation device 20 and the optical collector 30 is shown in FIG. When the laser scanning processing system 100 is in the detection state, the light source 10 emits a detection beam, and the modulation device 20 causes the detection beam to gradually scan the surface of the preset object 200. The optical collector 30 collects the imaging pattern of the detection beam on the surface of the preset object 200, which is used to calculate the three-dimensional contour shape and size of the preset object 200.

[0052] When the laser scanning processing system 100 is in a processing state, the light source 10 emits a processing beam, and controls the processing beam to process a preset object 200 through the modulation device 20 .

[0053] Among them, in the detection state, the laser beam with lower power can form stripe structured light (i.e., preset stripe pattern) or grid structured light (i.e., preset grid pattern) by scanning for a preset time, and the above detection beam will produce different degrees of deformation (i.e., imaging pattern) after irradiating the surface of the preset object 200 within the preset time. By comparing and calculating the preset structured light and the imaging pattern, the phase difference of the preset object 200 can be obtained, thereby obtaining the accurate three-dimensional contour shape and size of the surface of the preset object 200. And the detection beam with lower power will not affect the preset object 200 itself.

[0054] Thus, before the processing beam is used to process the preset object 200, the laser scanning processing system 100 can scan and measure the surface of the preset object 200 through a relatively low-power detection beam, and collect the imaging pattern of the detection beam on the surface of the preset object 200 through the optical collector 30, so as to calculate and obtain the accurate three-dimensional contour shape and size of the preset object 200. Subsequently, a relatively high-power processing beam is emitted through the light source 10, and the focusing direction, focusing angle and defocusing amount of the processing beam passing through the modulation device 20 are flexibly adjusted, so as to perform precise processing such as laser cutting, laser marking, laser welding, laser engraving or laser drilling on the preset object 200.

[0055] Because before the laser scanning processing system 100 is used to accurately process the preset object 200, the three-dimensional contour shape and size of the preset object 200 can be accurately obtained through the detection state. When the laser scanning processing system 100 is in the processing state, it is convenient to accurately control the defocus amount of the processing light beam within a smaller suitable range, and to accurately control the focusing direction and focusing angle of the processing light beam. In this way, it can be avoided that the laser beam cannot be accurately focused on the processing surface of the preset object 200 due to the surface size error of the preset object 200 during the processing, that is, the defocus amount cannot be accurately controlled. This is conducive to improving the precise control of the laser scanning processing system 100 on the defocus amount of the processing light beam, thereby improving the processing accuracy and effect of the preset object 200.

[0056] In addition, in the embodiment of the present application, since the detection beam is in the process of scanning and imaging, it can be achieved by reducing the emission power of the light source 10 and flexibly controlling the modulation device 20. There is no need to add an additional structured light projection setting, and the laser scanning processing system 100 can have a three-dimensional scanning and ranging function for the preset object 200 only through the additional optical collector 30. While realizing the functional integration of the laser processing platform, the integration of the integrated system is further improved, which is conducive to the miniaturization design of the laser scanning processing system 100 and reduces the weight of the whole equipment.

[0057] It is understandable that the laser beams including the detection beam and the processing beam can be emitted from the same light source element 10 and emitted from the same light outlet of the modulation device 20 toward the preset object 200. Alternatively, the number of light source elements 10 can be arranged in multiples to facilitate adjustment of the emission power of different laser beams. In this case, the multiple light source elements 10 can be arranged in sequence along the axial direction of the modulation device 20 at the light inlet, so that the detection beam and the processing beam are emitted into the modulation device 20 along the same axial direction for modulation, which is not limited.

[0058] In addition, for the processing beam and the detection beam, the power of the detection beam is usually less than or equal to the power of the processing beam. However, in other required scenarios, the power of the detection beam can also be arranged to be greater than the power of the processing beam, which is not limited.

[0059] It should be noted that, when the laser scanning processing system 100 is in the detection state, the detection beam can be presented as stripe structured light (i.e., a preset stripe pattern) or grid structured light (i.e., a preset grid pattern) through continuous scanning for a preset time. That is, the scanning trajectory of the detection beam within the preset time is a preset stripe pattern or a preset grid pattern.

[0060] Exemplarily, the preset stripe pattern may be sinusoidal stripes, Gray code stripes, high dynamic range stripes, or the like.

[0061] Alternatively, a grating element may be provided in the modulation device 20 so that the detection light beam passing through the grating element is directly projected to form a corresponding stripe structured light or grid structured light, which is not limited thereto.

[0062] In some embodiments, Figure 3 As shown, Figure 3 Schematic diagram of the connection structure of a laser scanning processing system 100 provided in an embodiment of the present application. The laser scanning processing system 100 also includes a processing module 40. The processing module 40 is electrically connected to the light source 10, the modulation device 20 and the optical collector 30, and is used to control the laser scanning processing system 100 to be in a detection state or a processing state. When the laser scanning processing system 100 is in the detection state, the processing module 40 receives the imaging pattern of the detection beam and calculates the preset object 200 (such as Figure 2 3D contour shape and size as shown).

[0063] Exemplarily, under the action of the modulation device 20, the detection light beam projected by the light source 10 in the vertical plane presents a series of parallel, equidistant stripe patterns within a preset time. These stripes can be sinusoidal waveforms or other shapes, and they form regular structured light in space. When the stripe structured light is projected onto the surface of the preset object 200. Due to the geometric shape of the surface of the preset object 200, these stripes will be deformed on the surface of the preset object 200, such as bending or twisting. At this time, the deformed stripe pattern (i.e., imaging pattern) can be captured and collected by other optical collectors 30 such as high-speed cameras. These imaging patterns contain the encoding of the three-dimensional information of the surface of the preset object 200. Through the processing module 40 electrically connected to the optical collector 30, after acquiring the above-mentioned deformed stripe pattern (i.e., imaging pattern), the processing module 40 can analyze and calculate the phase difference (i.e., phase information parameter) between the original stripe and the deformed stripe (i.e., imaging pattern) according to the preset algorithms such as Phase Measurement Profilometry (PMP) and Fourier Transform Profilometry (FTP), so as to calculate the three-dimensional coordinates of each point on the surface of the preset object 200. Subsequently, using the above-calculated phase information, combined with the geometric position and optical parameters of the optical collector 30, the three-dimensional morphology of the preset object 200, i.e., the precise three-dimensional contour shape and size of the preset object 200, can be reconstructed in the preset coordinate system.

[0064] Alternatively, under the action of the modulation device 20, the detection light beam projected by the light source 10 in the vertical plane presents a series of parallel equidistant stripes in the horizontal and vertical directions within a preset time and forms a grid pattern, i.e., grid structured light. When the grid structured light is projected onto the surface of the preset object 200. Due to the geometric shape of the surface of the preset object 200, these grids will be deformed on the surface of the preset object 200, such as bending or twisting. At this time, the deformed grid pattern (i.e., imaging pattern) can be captured and collected by other optical collectors 30 such as high-speed cameras, and these images contain the encoding of the three-dimensional information of the surface of the preset object 200. Through the processing module 40 electrically connected to the optical collector 30, after the processing module 40 obtains the above-mentioned deformed grid pattern (i.e., imaging pattern), the processing module 40 can analyze and calculate the phase difference (i.e., phase information parameter) between the original grid and the deformed grid (i.e., stripe pattern) according to algorithms such as preset phase extraction, phase main value calculation, phase unwrapping, and phase unwrapping technology, thereby calculating the three-dimensional coordinates of each point on the surface of the preset object 200. Subsequently, by using the phase information calculated above, combined with the geometric position and optical parameters of the optical collector 30 , the three-dimensional shape of the preset object 200 , ie, the precise three-dimensional contour shape and size of the preset object 200 , can be reconstructed in the preset coordinate system.

[0065] Among them, through the stripe structured light solution, the processing module 40 has a smaller amount of calculation in the process of calculating the three-dimensional contour of the preset object 200, which is beneficial to reducing the overall cost of the laser scanning processing system 100.

[0066] With the grid structured light solution, the processing module 40 needs to analyze and calculate the three-dimensional contour of the preset object 200 in a more complex manner, but at the same time, the three-dimensional contour shape and size of the preset object 200 obtained have better accuracy, which is beneficial to further improve the processing accuracy and effect of the laser scanning processing system 100.

[0067] In the above scheme, compared with the original laser processing system including the light source 10 and the modulation device 20, by adding a high-speed camera (optical collector 30) and a computing module (such as a processing module 40) to the original laser processing system, and connecting the computing module with the relevant control module of the laser processing system for data interaction, the laser processing system is modified to form a laser scanning processing system 100 and integrates an accurate three-dimensional scanning ranging function for the preset object 200, thereby improving the processing accuracy and effect of the preset object 200.

[0068] Based on this, since the projection function of the structured light (i.e., the detection beam) can be realized by the processing module 40 controlling the light source 10 and the modulation device 20, there is no need to add an additional structured light projection device, which is conducive to improving the integration and miniaturization effect of the laser scanning processing system 100.

[0069] It should be noted that, in the process of improving the laser scanning processing system 100, if the control module of the laser processing system itself meets the computing power requirements, the processing module 40 can be the control module or a part of the control module. If the control module of the laser processing system itself cannot meet the computing power requirements, the processing module 40 can be an additional computing power device, or the processing module 40 with sufficient computing power can replace the control module to meet the computing power requirements.

[0070] Based on this, after receiving the instruction, the processing module 40 reduces the power of the light source 10 to emit the detection beam. And by regulating the various components of the modulation device 20, while improving the resolution of the detection beam, the detection beam is scanned in sequence on the surface of the preset object 200 with the preset template of the structured light. Within the preset time of the detection state, the optical collector 30 such as a high-speed camera can collect the imaging pattern of the detection beam on the surface of the preset object 200 through continuous exposure or multiple intervals of rapid exposure, and send it to the processing module 40. The processing module 40 calculates the phase difference based on the original pattern of the laser beam (i.e., the preset structured light template) and the imaging pattern to obtain the three-dimensional coordinates of the surface of the preset object 200. Finally, the processing module 40 reconstructs the three-dimensional morphology (i.e., the three-dimensional contour shape and size) of the preset object 200 in combination with the geometric positions of the preset object 200, the modulation device 20 and the optical collector 30, so as to facilitate the precise processing of the preset object 200 by the processing beam.

[0071] When the processing module 40 controls the laser scanning processing system 100 to be in a processing state, based on the three-dimensional contour shape and size, combined with the light outlet of the modulation device 20 and the spatial position of the preset object 200, the processing module 40 can accurately calculate the defocus amount of the processing light beam during the processing process and the deflection direction and angle of the processing light beam, and control the light source component 10 and the modulation device 20 to use the processing light beam to accurately process the preset object 200.

[0072] It should be noted that the laser scanning processing system 100 includes a detection state and a processing state, and also includes a calibration state. After the processing state, the processing module 40 controls the laser scanning processing system 100 to switch to the calibration state, so that through the cooperation of the light source 10, the modulation device 20 and the optical collector 30, the processing preset object 200 is imaged and scanned by the detection beam, and the three-dimensional contour shape and size are calculated, so as to extend whether the processing size and accuracy of the preset object 200 meet the design requirements.

[0073] In some embodiments, Figure 1 and Figure 2As shown, the laser scanning processing system 100 further includes a stage 50, on which the preset object 200 is placed, and is located between the stage 50 and the modulation device 20 along a first straight line direction (i.e., the Z direction). The bearing surface supporting the preset object 200 along the first straight line direction is defined as a reference surface 51, and the Z direction is perpendicular to the reference surface 51. That is, the reference surface 51 is the side of the stage 50 facing the modulation device 20 along the Z direction, such as the reference surface 51 is the upper side plane of the stage 50.

[0074] Based on this, refer to Figure 1 and Figure 2 , along the Z direction, the light outlet of the modulation device 20 and the optical collector 30 are set to have the same installation height from the reference plane 51. Exemplarily, P is the first reference point of the optical collector 30, and I is the second reference point of the modulation device 20 at the light outlet. The adjustment of the installation height of the modulation device 20 at the light outlet and the optical collector 30 is to adjust the spacing between the second reference point I and the first reference point P compared to the reference plane 51 along the Z direction.

[0075] Since the processing module 40 needs to calculate the phase information parameters in combination with the spatial coordinates of the reference plane 51, the second reference point I and the first reference point P in the process of calculating the projection pattern (such as the preset stripe or grid projection) and the imaging pattern (i.e. the deformed stripe or grid projection), the light outlet of the modulation device 20 and the optical collector 30 are set to have the same installation height from the reference plane 51, that is, the second reference point I and the first reference point P have the same height coordinates compared to the reference plane 51, which is conducive to reducing the demand for computing power of the processing module 40.

[0076] In some other embodiments, along the first straight line direction, the height distance between the light outlet of the modulation device 20 and the optical collector 30 and the reference surface 41 can also be set to a preset difference, and the preset difference is a known quantity. At this time, the processing module 33 can also calculate the parameters such as the phase difference through the spatial coordinates between different points, so as to simplify the assembly and installation accuracy and process of the laser processing system 100 in the whole machine assembly.

[0077] Combination Figure 1 and Figure 2 When arranging the optical collector 30, the optical collector 30 is arranged along the Z direction toward and perpendicular to the reference plane 51 of the stage 50. At this time, the installation height L of the optical collector 30 along the Z direction is the length of OP, and the point O is the intersection position of the optical collector 30 along the Z direction perpendicular to the reference plane 51. Correspondingly, the installation height of the light outlet of the modulation device 20 along the Z direction is the vertical distance between the second reference point I and the reference plane 51, which is also L.

[0078] In some embodiments, the processing module 40 can calculate the three-dimensional contour shape and size of the preset object 200 by the following formula:

[0079] .

[0080] Combination Figure 1 and Figure 2 , h is the height dimension of one point of the preset object 200 along the Z direction with respect to the reference plane 51. Since the reference plane 51 is a preset calibration plane, and the horizontal coordinate (such as the x-axis coordinate) and the vertical coordinate (such as the y-axis coordinate) of the point can be regarded as known quantities. The above formula can be used to calculate the height coordinates (such as the z-axis coordinate, i.e. h) at multiple points on the surface of the preset object 200, thereby obtaining multiple three-dimensional coordinate parameters of the surface of the preset object 200. Among them, the specific accuracy requirements can be flexibly allocated according to the computing power requirements and resolution requirements.

[0081] In the above formula, combined with Figure 2 , L is the distance between the optical collector 30 and the reference plane 51 along the Z direction. d is the minimum distance between the light outlet of the modulation device 20 and the optical collector 30 along the second straight line direction (i.e., the X direction), that is, the distance between the first reference point P and the second reference point I on the x-axis. T is the grating period of the structured light, also known as the grating constant, which refers to the distance between two adjacent grating lines on the grating. is the phase information parameter.

[0082] When the laser scanning processing system 100 is installed and set up, when calculating the point information parameters of the preset object 200, the above parameters L and d are known quantities, or can be directly calculated and obtained through known coordinate parameters. Parameter T can be obtained based on the structured light (projection pattern) of the detection beam. The processing module 40 can calculate and obtain this phase information parameter according to a preset algorithm such as phase measurement profilometry and Fourier transform profilometry combined with known parameters, so that the processing module 40 can calculate the height dimensions of multiple points on the surface of the preset object 200 along the Z direction according to the above parameters and formulas, thereby obtaining the three-dimensional surface contour shape and size of the preset object 200 within the corresponding resolution range.

[0083] Through the above scheme, under the requirement of preset accuracy, the coordinate parameter information (i.e., three-dimensional shape and size) of multiple points on the surface of the preset object 200 can be obtained by measurement and calculation. On this basis, since the coordinate parameters of the light outlet of the modulation device 20 are also known quantities. Based on the coordinate parameters of the light outlet and the coordinate parameters of multiple points on the surface of the preset object 200, according to the requirements of processing accuracy and processing shape and size, the accurate parameters of the defocus amount, deflection direction and deflection angle of the laser beam when processing the preset points can be calculated, thereby improving the processing accuracy and effect of the laser scanning processing system 100.

[0084] It should be noted that, during the process of processing the preset object 200 , the deflection direction, deflection angle and defocus amount of the laser beam can be adjusted by the modulation device 20 , or by other structures.

[0085] In some embodiments, Figure 1 and Figure 3 As shown, the modulation device 20 includes a galvanometer assembly 21 and a lens assembly 22. The galvanometer assembly 21 is used to adjust the deflection direction and deflection angle of the laser beam, and the lens assembly 22 is used to adjust the focusing position (focal position) of the laser beam.

[0086] For example, Figure 1 As shown, the number of the galvanometer components 21 can be multiple, and the galvanometer component 21 includes a first galvanometer and a second galvanometer for example. The first galvanometer can be controlled to rotate around a first axis by a first driving member, and the second galvanometer can be controlled to rotate around a second axis by a second driving member, and the angle formed by the first axis and the second axis is an acute angle, an obtuse angle or a right angle. In the process of the laser beam emitted by the light source component 10 passing through the first galvanometer and the second galvanometer in sequence and being reflected, the deflection angle and direction of the laser beam are changed by adjusting the deflection angle of the first galvanometer and the second galvanometer, that is, the deflection angle and direction of the laser beam in the x-axis direction and the y-axis direction are adjusted.

[0087] Correspondingly, the lens assembly 22 may include one or more lenses, such as a convex lens or a concave lens, etc., between the second galvanometer and the light outlet, and by adjusting the position spacing of the lens components, the focal position (i.e., focal length) of the laser beam can be precisely adjusted, thereby achieving fine-tuning of the defocus amount.

[0088] Continue to refer to Figure 1 and Figure 3 The modulation device 20 further includes an aperture member 23, which is used to adjust the size of the laser beam. Exemplarily, the aperture member 23 can be installed between the lens assembly 22 and the galvanometer assembly 21 to adjust the shape and size of the parallel laser beam from the galvanometer assembly 21 to the lens assembly 22.

[0089] Exemplarily, along the transmission direction of the laser beam, the aperture member 23 is disposed upstream of the galvanometer assembly 21. For example, in the modulation device 20, the aperture member 23 is disposed close to the light inlet of the modulation device, so that the laser beam adjusted by the aperture member 23 is further modulated through the galvanometer assembly 21 and the lens assembly 22 in sequence.

[0090] For example, the aperture member 23 can be the edge of a lens, a frame, or a specially set screen with holes. The functions of the aperture member 23 are mainly divided into two aspects: limiting the light beam and limiting the size of the field of view (imaging range). For example, the aperture that limits the light beam the most is the aperture aperture, and the aperture that limits the size of the field of view the most is the field aperture. The shape of the laser beam of the aperture member 23 can be circular, square, or rectangular, and the size can be fixed or variable.

[0091] In addition, the aperture member 23 can also be configured to have a stray light elimination effect. The stray light elimination aperture is a specially configured aperture in the optical system to limit stray light from reaching the image plane. This aperture can block a portion of stray light to reduce the effect of stray light on the image quality. For example, the stray light elimination aperture can reduce the contrast of the image on the image plane, submerge the image with very low contrast or the details of the image, and directly improve the image quality of the optical system. It helps to reduce the stray light generated by internal reflection and scattering of the optical system. By installing the stray light elimination aperture, the effect of stray light on the imaging can be reduced, the contrast and clarity of the image can be improved, and the imaging quality and the overall performance of the system can be improved.

[0092] Exemplarily, the stray light diaphragm is installed in front of the instrument objective, i.e., the light shield. The design of the light shield should prevent any light directly hitting its inner surface from entering the entrance pupil of the objective after the first reflection. Several stray light diaphragms can be placed on the inner wall of the light shield, and the edges of all diaphragms must be along the boundary of the light tube. The length of the light shield and the incident aperture can be calculated by specific formulas. Given the length or diameter of the light shield, the number and position of the stray light diaphragms can be determined. The positions of these diaphragms can be determined by drawing to ensure that they can effectively limit stray light. Stray light can also be reduced by machining threads on the inner wall of the lens barrel and painting it black, and using black paint to coat the non-working surfaces of optical parts.

[0093] So, combined Figure 3 The processing module 40 is electrically connected to the galvanometer assembly 21, the lens assembly 22 and the aperture member 23, so as to control the deflection direction, deflection angle, defocus amount, imaging size and imaging quality of the laser beam by adjusting the galvanometer assembly 21, the lens assembly 22 and the aperture member 23. Among them, through the setting of the aperture member 23, in conjunction with the regulation of the processing module 40, the processing beam (high power) and the detection beam (low power) can be differentially adjusted to improve the adaptation effect of the modulation device 20 in the detection state and the processing state.

[0094] In addition, combined Figure 1 and Figure 3 The laser scanning processing system 100 also includes a driving component 60, and the processing module 40 is electrically connected to the driving component 60, which is used to adjust the distance between the modulation device 20 (its light outlet) and the stage 50, thereby adjusting the defocusing amount of the laser beam to facilitate the precise processing of the preset object 200.

[0095] In the process of adjusting the defocus amount of the laser beam through the driving component 60, the spatial position on the side of the stage 50 can be adjusted, the spatial position on the side of the modulation device 20 can be adjusted, and the spatial position on the side of the stage 50 and the modulation device 20 can also be adjusted at the same time, without limitation.

[0096] For example, Figure 3 As shown, the driving assembly 60 includes a first driving member 61, and the first driving member 61 is electrically connected to the processing module 40. Figure 1 , a first driving member 61 may be provided to be connected and installed with the stage 50, such as being connected to a side of the stage 50 away from the modulation device 20 along the Z direction, and used to carry the stage 50, so that the processing module 40 adjusts the position state of the stage 50 by controlling the first driving member 61. Thus, the defocus amount, deflection direction and deflection angle of the laser beam can be flexibly adjusted.

[0097] For example, the first driving member 61 is a multi-axis adjustment structure, which is used to adjust the spatial position of the stage 50 on the x-axis, y-axis and z-axis. The defocus amount of the laser beam is adjusted by controlling the first driving member 61 to move up and down along the z-axis direction. When the first driving member 61 is controlled, the moving direction and displacement of the stage 50 are adjusted along at least one of the x-axis direction and the y-axis direction, so that the deflection direction and deflection angle of the laser beam can be flexibly controlled, so as to facilitate the precise processing of the preset object 200 on the stage 50.

[0098] Reference Figure 1 and Figure 3 The driving assembly 60 includes a second driving member 62, and the second driving member 62 is electrically connected to the processing module 40. Figure 1 At least the light source 10 and the modulation device 20 are connected and installed with the second driving member 62, so that the second driving member 62 can drive the light source 10 and the modulation device 20 to adjust the spatial position state. Thus, the defocus amount, deflection direction and deflection angle of the laser beam compared to the stage 50 can be flexibly adjusted.

[0099] For example, the second driving member 62 is a multi-axis adjustment structure, which is used to adjust the spatial position of the light source member 10 and the modulation device 20 on the x-axis, y-axis and z-axis. The defocus amount of the laser beam is adjusted by controlling the second driving member 62 to move up and down along the z-axis direction. When controlling the second driving member 62, by adjusting the moving direction and displacement of the light source member 10 and the modulation device 20 along at least one of the x-axis direction and the y-axis direction, the deflection direction and deflection angle of the laser beam can be flexibly controlled, which is convenient for the precise processing of the preset object 200 on the stage 50.

[0100] The light source 10 and the modulation device 20 can be configured as split structures and respectively installed at corresponding positions of the second driving member 62 , so that the laser beam emitted by the light source 10 can accurately enter the light entrance of the modulation device 20 .

[0101] Alternatively, the light source 10 and the modulation device 20 may be arranged as an integrated component, that is, the light source 10 is fixedly installed at the light entrance of the modulation device 20, which is not limited thereto.

[0102] In some embodiments, the optical collector 30 may be fixedly connected to one side of the modulation device 20, so that the second driving member 62 can drive the light source member 10, the modulation device 20 and the optical collector 30 to move synchronously, thereby maintaining the light outlet of the modulation device 20 and the optical collector 30 at the same installation height along the Z direction.

[0103] On the other hand, Figure 4 As shown, Figure 4 A flow chart of a control method of a laser scanning processing system provided in an embodiment of the present application. The control method is used to control the laser scanning processing equipment in the above aspect, and includes the following steps:

[0104] Scanning step S110: controlling the light source to emit a detection light beam, and enabling the modulation device to control the detection light beam to gradually scan the surface of a preset object.

[0105] Acquisition step S120: During the scanning process of the detection light beam, the optical collector is controlled to synchronously acquire an imaging pattern of the detection light beam on the surface of a preset object.

[0106] Calculation step S130: Calculate the three-dimensional contour shape and size of the preset object.

[0107] Processing step S200: Control the light source to emit a processing light beam, and control the processing light beam to process the preset object through a modulation device according to the three-dimensional contour shape and size of the preset object.

[0108] Since the detection beam is continuously scanned to form a corresponding structured light within a preset time, the scanning step S110 and the acquisition step S120 are performed synchronously, so that the optical collector can collect the imaging changes of the structured light at each time point in real time. The calculation step S130 calculates the phase difference, the three-dimensional contour shape and size of the preset object by the point state of the detection beam and its preset structured light and the actual imaging state of the point.

[0109] The calculation step S130 can be performed synchronously with the scanning step S110 and the acquisition step S120, that is, after obtaining the imaging changes of the detection beam before and after each point, the phase difference parameter of the point is synchronously calculated by the calculation step S130. Alternatively, after the detection beam scans and images within a preset time, and the imaging pattern is completely collected by the optical collector, that is, after the scanning step S110 and the acquisition step S120 are completely completed, the phase difference parameter is calculated by the calculation step S130. Both can enable the laser scanning processing system to obtain the precise three-dimensional contour shape and size of the preset object in the detection state, and there is no limitation on this.

[0110] Since the control method of the laser scanning processing system is used to control the laser scanning processing system in the above aspect, the control method has all the beneficial effects of the above-mentioned laser scanning processing system, which will not be described in detail here.

[0111] In the embodiment of the present application, the laser scanning processing system can be controlled to run the scanning step, the acquisition step and the calculation step to put the laser scanning processing system in a detection state. Subsequently, the laser scanning processing system is controlled to run the processing step to put it in a processing state.

[0112] After the laser scanning processing system is controlled to process the preset object, the laser scanning processing system can also be controlled to enter the proofreading state. That is, after the processing step, the control method can also include a proofreading step, which includes a scanning step, a collection step, and a calculation step that are repeatedly run. After the calculation step, the three-dimensional contour shape and size of the preset object are compared to see if they are consistent with the preset parameters through a comparison step. If they are consistent, the processing state is terminated. Otherwise, a prompt is issued through a sound or indicator light, or the processing step is repeated, and there is no limitation on this.

[0113] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0114] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A laser scanning processing system, characterized in that: It includes a light source, a modulation device and an optical collector, wherein the modulation device is used to modulate the laser beam emitted by the light source; Wherein, the laser scanning processing system has a detection state and a processing state, and the laser beam includes a detection beam and a processing beam; When the laser scanning processing system is in the detection state, the light source emits a detection beam, and the detection beam is gradually scanned on the surface of the preset object through the modulation device, and the optical collector collects the imaging pattern of the detection beam on the surface of the preset object, which is used to calculate the three-dimensional contour shape and size of the preset object; When the laser scanning processing system is in a processing state, the light source component emits a processing light beam, and controls the processing light beam to process a preset object through a modulation device.

2. The laser scanning processing system according to claim 1, characterized in that: The laser scanning processing system also includes: A processing module, the processing module is electrically connected to the light source, the modulation device and the optical collector, and is used to control the laser scanning processing system to be in the detection state or the processing state; When the laser scanning processing system is in the detection state, the processing module receives the imaging pattern and calculates the three-dimensional contour shape and size of the preset object.

3. The laser scanning processing system according to claim 2, characterized in that: The bearing surface supporting the preset object along the first straight line direction is a reference surface, and the first straight line direction is arranged perpendicular to the reference surface; Along the first straight line direction, the light outlet of the modulation device and the optical collector are installed at the same height from the reference plane.

4. The laser scanning processing system according to claim 3, characterized in that: When the processing module switches to the detection state, the processing module calculates the three-dimensional contour shape and size of the preset object by the following formula: ； Wherein, h is the height dimension of one point of the preset object along the first straight line direction compared to the reference plane; L is the distance dimension between the optical collector and the reference plane along the first straight line direction; d is the minimum distance dimension between the light outlet of the modulation device and the optical collector along the second straight line direction, and the second straight line direction is perpendicular to the first straight line direction; T is the grating period of the detection light beam; is the new information parameter of the phase.

5. The laser scanning processing system according to any one of claims 2 to 4, characterized in that: The laser scanning processing system also includes: A loading platform, used for carrying the preset object; and a driving component, wherein the processing module is electrically connected to the driving component and is used to adjust the relative position of the stage and the modulation device.

6. The laser scanning processing system according to claim 5, characterized in that: The drive assembly comprises: A first driving member, the first driving member is connected and installed with the stage, and the processing module is electrically connected with the first driving member, and is used to adjust the position state of the stage; And / or, a second driving member, at least the light source member and the modulation device are connected and installed with the second driving member, and the processing module is electrically connected with the second driving member, for adjusting the position state of the light source member and the modulation device.

7. The laser scanning processing system according to any one of claims 1 to 4, characterized in that: The modulation device comprises: A galvanometer assembly, used for adjusting the deflection direction and deflection angle of the laser beam; A lens assembly, used to adjust the focus position of the laser beam; and an aperture member, wherein the aperture member is used to adjust the size of the laser beam.

8. The laser scanning processing system according to any one of claims 1 to 4, characterized in that: When the laser scanning processing system is in the detection state, the scanning trajectory of the detection light beam within a preset time is a preset stripe pattern or a preset grid pattern.

9. The laser scanning processing system according to claim 8, characterized in that: During the preset time, the optical collector continuously collects the imaging pattern at the preset object.

10. A control method for a laser scanning processing system, used to control the laser scanning processing system according to any one of claims 1 to 9, characterized in that: The control method comprises: Controlling the light source to emit the detection light beam, and causing the modulation device to control the detection light beam to gradually scan the surface of a preset object; During the scanning process of the detection light beam, controlling the optical collector to synchronously collect an imaging pattern of the detection light beam on the surface of the preset object; Calculating the three-dimensional contour shape and size of the preset object; The light source is controlled to emit the processing light beam, and the processing light beam is controlled by a modulation device to process the preset object according to the three-dimensional contour shape and size of the preset object.

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