Application of directly-heated printed circuit board in incubation module, oscillation incubation module and automatic sample processing system

Abstract

The invention discloses an application of a directly-heated printed circuit board in an incubation module, an oscillation incubation module and an automatic sample processing system.The directly-heated printed circuit board comprises a base layer, the base layer is provided with a heating surface and a printing surface, the heating surface and the printing surface are oppositely arranged, the heating surface can make thermal contact with an incubation cup in a constant-temperature incubation reaction, and the printing surface can make thermal contact with the incubation cup in the constant-temperature incubation reaction. The printing surface is connected with an insulating surface, a metal heating layer is printed on the insulating surface, and when the metal heating layer is in electric heating operation, heat is uniformly transferred to the incubation cup in thermal contact with the heating surface through the base body layer. According to the direct-heating printed circuit board provided by the invention, the average power density of the central area of the heating layer of the printing surface is configured to be lower than the average power of the edge area, so that the average power density difference between the central area and the edge area is adjusted at the heat source end, and the uniformity of the output temperature of the heating layer of the printing surface of the direct-heating printed circuit board is ensured; differential power of different areas is controlled through the width of a printed copper wire, and the processing technology is simple and reliable.

Description

Technical Field

[0001] The invention relates to the technical field of biological sample detection with incubation heating, and in particular to an application of a direct-heated printed circuit board in an incubation module, an oscillating incubation module and an automatic sample processing system. Background Art

[0002] In vitro diagnostic technology uses blood, body fluids, tissue fluids and other samples as analysis objects, and has the basic characteristics of in vitro operation. It is often used in the process of disease prevention, diagnosis, treatment detection, post-diagnosis observation, health assessment, precise medication guidance, etc. With the advancement of technology, many branch technologies have been developed. According to the detection principle or detection method, it can be divided into six basic branch directions: biochemical diagnosis, immunodiagnosis, molecular diagnosis, microbial diagnosis, and blood and body fluid diagnosis. In these detailed branches, thermal design is very important for multiple branches. For example, in molecular diagnosis, the thermal module is designed as a constant temperature or variable temperature type, which corresponds to different detection methods. In immunodiagnosis and microbial diagnosis, pathogenic pathogens and antigens as well as enzymes that promote reactions require relatively strict reaction temperatures. This requires a more accurate thermal module to perform more precise reaction heating to ensure that the corresponding in vitro diagnostic technology can complete accurate and efficient reactions and detection.

[0003] Immunodiagnosis is widely used in the detection of various active molecules. During the immunodiagnosis experiment, a heating module is required to construct an incubation environment similar to human body temperature for reaction. Therefore, the heating and incubation link has an important influence on the results of immunodiagnosis. In the earlier design, the two operations of oscillation and incubation of the ELISA plate need to be completed by a single-function device. This design makes the flow process of the enzyme-labeled reaction longer, the risk of contamination is high and the detection accuracy is worse. Therefore, many manufacturers subsequently explored the integrated design of oscillation and incubation. Chinese utility model patent CN201637743U discloses a collective design scheme of oscillation incubation, which uses an eccentric wheel and a motor to drive its movement to make the incubation part as a whole vibrate, and a heating plate is arranged in the incubation part, which contacts and connects the heat sink, and the hot plate is fixedly arranged on the heat sink. Finally, the hot plate can transfer heat to the incubation reaction container placed thereon. In this scheme, the heating plate can transfer the highly concentrated heat to the reaction container more evenly through the heat sink and the hot plate multi-transfer medium, but the thermal resistance is larger and the heat loss is higher in the process. In order to improve the uniformity of heat transfer of the incubation module, the scheme disclosed in Chinese invention patent CN106922567B is designed to be assembled into multiple parts, including three heating sub-units of the main heating film, the auxiliary heating film and the heating film frame, and the film heating element is used for design so that the configuration of the heating module does not basically increase the thickness of the incubation device, and the structure is more compact. The heating module can ultimately achieve a more uniform incubation and heating effect through the uniform heating effect of the heat sink. In the scheme disclosed in Chinese utility model CN211652316U, the oscillation module is divided and designed. The oscillation module includes three parts: an upper platform, a middle platform and a lower platform. The heating element and the vibration device are both arranged on the upper platform. The middle platform and the upper and lower platforms are fixedly connected by flexible elements, so that the upper platform can have a larger oscillation amplitude, and the multi-layer design can minimize the vibration energy transmission. The scheme disclosed in Chinese invention CN114184778A is also to arrange a heating film under the heating plate, and to clamp and fix the heating film together with the partition. In all of the above-mentioned schemes, the two functional units of oscillation and incubation are designed as a whole. However, in this design, the heating units are independent units configured in the oscillating incubation module. On the one hand, it is necessary to consider the design of the heating unit and the problem of heat balance configuration. On the other hand, as the oscillation operation time of the heating unit in the incubation module accumulates, the gap between the fixing parts of the heating unit may change, which may worsen the heat transfer conditions. This makes the assembly processing requirements of the existing design relatively weak in reliability.

[0004] Therefore, designing a heat source that can be adapted to the oscillating incubation module is very necessary and challenging for immunoassays or other similar in vitro diagnostic tests. Summary of the invention

[0005] In order to solve the above problems existing in the prior art, the present invention is implemented by the following technical solutions:

[0006] In a first aspect of the present invention, there is provided an application of a direct heating printed circuit board in an incubation module, wherein the direct heating printed circuit board comprises a base layer of metal material, a heating surface and a printing surface are arranged on the base layer, the heating surface and the printing surface are arranged opposite to each other, the heating surface can be in thermal contact with an incubation cup in a constant temperature incubation reaction, the printing surface is connected to an insulating surface, and the insulating surface is printed with a metal heating layer, and when the metal heating layer is electrically heated, the heat is evenly transferred through the base layer to the incubation cup in thermal contact with the heating surface.

[0007] In one embodiment of the present invention, the heating layer is divided into a plurality of heating areas with different average power densities, and the heating layer is configured in such a way that the average power density in the central area is lower than the average power density in the edge area.

[0008] In one embodiment of the present invention, the average power density of the central area is configured to be within the range of 0.54-0.83 of the average power density of the edge area.

[0009] In one embodiment of the present invention, the edge region includes a first edge region and a second edge region, and when the heat dissipation rate of the first edge region is higher than that of the second edge region, the first edge region is configured to have an average power density greater than that of the second edge region.

[0010] In one embodiment of the present invention, the central area has the same line width as the metal heating line printed on the second edge area where the average power density is smaller, and the central area is wider than the metal heating line printed on the first edge area.

[0011] In one embodiment of the present invention, the material of the metal heating layer is copper, and the insulating surface is a glass fiber cloth type insulating surface.

[0012] In a second aspect of the present invention, an oscillating incubation module is provided, comprising an incubation portion and an oscillation portion, wherein the incubation portion comprises a reagent kit receiver and the direct-heated printed circuit board, the bottom of the reagent kit receiver is detachably connected to the direct-heated printed circuit board, the reagent kit receiver can be removably configured with a plurality of incubation cups arranged in an array, the bottoms of the plurality of incubation cups are in thermal contact with the heating surface of the direct-heated printed circuit board, the reagent kit receiver is also connected to an oscillation connector, the oscillation connector is connected to an oscillation motor of the oscillation portion, and the output of the oscillation motor is connected to an eccentric cam.

[0013] In one embodiment of the present invention, the oscillation incubation module also includes an incubation configuration base and an elastic buffer. The reagent box receiving piece or the oscillation connecting piece is connected to the incubation configuration base by means of the elastic buffer. The elastic buffer is a hollow silicone column or a rubber column with grooves. The elastic buffer is configured so as to attenuate the vibration energy of the oscillation part by no less than 80%.

[0014] In the third aspect of the present invention, there is provided a sample automation processing system, comprising a plurality of the oscillation incubation modules arranged in an array, and an incubation cover storage portion, wherein the incubation cover storage portion is capable of receiving a plurality of incubation covers, and after a plurality of incubation cups are configured into the reagent box receiving member, the plurality of incubation covers can be snap-fittedly connected to the top opening side of the reagent box receiving member to complete the oscillation and constant temperature incubation operations.

[0015] In a fourth aspect of the present invention, there is provided a method for manufacturing the direct-heated printed circuit board, comprising the following steps:

[0016] The first step is to glue and crimp a glass fiber cloth type insulation surface on one of the two opposite surfaces of the metal base layer;

[0017] The second step is to print a copper heating layer on the insulating surface, which can directly transfer heat to the heating surface of the base layer, and the copper heating layer is configured in a way that the average power density in the central area is lower than the average power in the edge area.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The application of the direct-heated printed circuit board provided by the present invention in the incubation module configures the heating layer in a manner that the average power density in the central area is lower than the average power in the edge area, so that the heating layer on the printed surface of the direct-heated printed circuit board presents a distribution trend in which the average power density increases from the center to the edge, thereby ensuring the uniformity of the output temperature of the heating layer on the printed surface of the direct-heated printed circuit board, and configuring the average power density in the central area to be within the range of 0.54-0.83 of the average power density in the edge area, so as to adjust the average power density difference between the central area and the edge area at the heat source end, and further, the average power density of the copper heating layer in the edge area is also divided into several different areas, so that the overall temperature is more uniform and consistent, and a more uniform heating temperature can be output even if the heat transfer plate is omitted, so that the heat transfer characteristics of the metal base layer can be fully utilized to ensure the consistency of the output temperature of the heating surface, and the goal of differentiated output power of the same copper wire length can be achieved by controlling the width of the printed copper wire when printing the circuit board, and the processing technology is simple and reliable.

[0020] 2. The oscillating incubation module provided by the present invention has an oscillating connection block and an eccentric wheel, which enable the reaction liquid in the incubation cup to be oscillated and mixed. An elastic buffer is configured in the oscillating incubation module, and the elastic buffer is a hollow silicone column or a rubber column with annular grooves. The elastic buffer is configured to attenuate the vibration energy of the oscillating part by not less than 80% and act on the oscillating part, thereby ensuring the reliability of oscillating incubation. In addition, the direct-heated printed circuit board is in contact with multiple incubation cups arranged in an array, and the copper heating layer can output heating heat to ensure the heat preservation of the reaction liquid in the incubation cup, so that the reaction detection in the incubation cup can be efficiently performed, thereby ensuring the processing efficiency of the oscillating incubation module.

[0021] 3. The sample automation processing system provided by the present invention comprises a plurality of oscillation incubation modules arranged in an array, all of which can automatically perform constant temperature oscillation incubation operations, thereby realizing automated and efficient batch immune response detection and processing, and the system has higher reliability.

[0022] 4. The manufacturing method of the direct-heated printed circuit board provided in this embodiment is to print a copper heating layer on the insulating surface. The copper heating layer can directly transfer heat to the heating surface of the base layer, and then can quickly transfer heat to the heating object configured on the heating surface. The heating layer and the base layer are directly integrated with each other using a printing process, thereby realizing the collective design of the heating element and the heat transfer element. The integrated printed heat source solution is also more suitable for the moving incubation module, making the overall manufacturing method simpler and more suitable for the long-term reliable application of oscillating incubation.

[0023] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the heating layer structure of the printed surface of a direct-heated printed circuit board provided in Example 1;

[0025] Figure 2 It is a schematic diagram of the heating layer structure of another direct-heat printed circuit board printing surface provided in the first embodiment;

[0026] Figure 3 This is a schematic diagram of the layout structure of a heating layer on the printed surface of a direct-heated printed circuit board provided in Example 1;

[0027] Figure 4 This is a schematic diagram of the overall explosion structure of an oscillating incubation module provided in Example 2;

[0028] Figure 5 It is a partial structural schematic diagram of an oscillating incubation module provided in Example 2;

[0029] Figure 6 It is a schematic diagram of the assembly structure of an oscillating incubation module provided in Example 2;

[0030] Figure 7 yes Figure 6 A schematic longitudinal cross-sectional view of an oscillating incubation module;

[0031] Figure 8 It is a partial structural diagram of a sample automatic processing system provided in Example 3;

[0032] Fig. 9 is a partial structural schematic diagram of another sample automated processing system provided in the third embodiment;

[0033] Fig.10 This is a simulation diagram of the effect of the metal-based direct-heated printed circuit board provided in an embodiment of the present invention heating the incubation cup thereon.

[0034] Description of reference numerals:

[0035] 10-heat source plate; 11-reactor receiving member; 111-clip; 12-oscillation connecting member; 13-elastic buffer member; 14-oscillation motor; 141-oscillation connecting block; 15-eccentric cam; 161-sensor; 162-sensor sheet;

[0036] 2-Incubation cover;

[0037] 31-self-test unit; 32-incubation cover storage unit;

[0038] 100-Incubation cups. DETAILED DESCRIPTION

[0039] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the scheme according to the present invention is described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0040] The above and other technical contents, features and effects of the present invention are clearly presented in the following detailed description of the specific implementation modes in conjunction with the accompanying drawings. Through the description of the specific implementation modes, the technical means and effects adopted by the present invention to achieve the predetermined purpose can be more deeply and specifically understood. However, the attached drawings are only for reference and explanation purposes and are not used to limit the technical solutions of the present invention.

[0041] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants are intended to cover non-exclusive inclusion, so that an article or device including a series of elements includes not only those elements, but also other elements that are not explicitly listed. In the absence of more restrictions, the elements defined by the statement "including one..." do not exclude the existence of other identical elements in the article or device including the elements.

[0042] Embodiment 1

[0043] Printed circuit boards are one of the symbols of the information age and are also the product of the rapid development of integrated circuits. Printed circuit boards can realize copper wire wiring with different line widths, and the processing technology is very reliable. Currently, the most commonly used integrated circuit boards are non-metallic substrate layers. With the use of high-power components in special scenarios, metal substrate integrated circuit boards have appeared in recent years. Because of their better heat dissipation than non-metallic materials, they are usually used in the circuits of high-power components such as LED lights to achieve the goal of rapid heat dissipation in areas with high heat flux density.

[0044] In immunodiagnosis and microbiological diagnosis, in order to perform more accurate reaction heating to ensure that the corresponding in vitro diagnostic technology completes accurate and efficient reaction and detection, this embodiment proposes an application of a direct heating printed circuit board in an incubation module, and uses a metal-based direct heating printed circuit board as a heat source for heating a reaction container. The reaction container refers to an incubation cup, that is, the metal-based direct heating printed circuit board is used as a heat source plate in the immunodiagnosis experiment. Of course, it can also be used as a heat source for other similar low target temperature constant temperature incubation reactions such as bacterial culture. The metal-based direct heating printed circuit board is hereinafter referred to as the direct heating printed circuit board. The direct heating printed circuit board includes a base layer of metal material, and a base layer is provided on the base layer. A heating surface and a printing surface are provided, and the heating surface and the printing surface are arranged opposite to each other. The heating surface can be in thermal contact with an incubation cup in a constant temperature incubation reaction. The printing surface is connected to an insulating surface, and the insulating surface is printed with a metal heating layer, hereinafter referred to as the heating layer. When the metal heating layer is electrically heated, the heat is evenly transferred through the substrate layer to the incubation cup in thermal contact with the heating surface. In the application scenario of the present invention, the incubation module has a lower constant temperature heating requirement, which also eliminates the obstacle that the relevant circuit elements may be affected by heat transfer and cannot work stably and for a long time in the application of the metal matrix printed circuit board in this scenario. At the same time, it can solve the technical problem that the heat transfer characteristics of the heat source are changed due to the general need to cooperate with movements such as oscillation in incubation.

[0045] In this embodiment, the direct-heated printed circuit board includes a base layer of metal material, which can be an aluminum substrate, a copper substrate or a steel substrate, etc. Preferably, the heating surface and the printing surface are respectively arranged on two opposite surfaces in the thickness direction of the base layer. The heating surface can be formed by general mechanical processing, the insulating surface is a glass fiber cloth type insulating surface, the printed surface is connected to the glass fiber cloth type insulating surface, the glass fiber cloth type insulating surface can be connected to the printed surface of the substrate by a reliable bonding method of gluing and crimping, and the insulating surface is printed with a metal heating layer, so that the direct heating printed circuit board can be produced in batches at low cost and high efficiency through mature printed circuit board production processes and procedures. The metal heating layer is referred to as the heating layer below. Here, the heating layer is a copper heating layer, and the metal heating pipeline of the copper heating layer is preferably a copper wire. The heating layer is made of copper material, which can save production costs while improving the heat transfer efficiency of the heating layer. The copper heating layer can be obtained through mature conventional printed circuit production processes. The copper heating layer can directly transfer heat to the heating surface of the substrate layer to quickly transfer heat to the heating object configured on the heating surface. In the design, there is no need to use relay plates such as uniform heat plates to achieve the effect of the heat source directly outputting heat to the incubation cup through the substrate layer. The heat transfer path is simple, the heat loss is smaller, and the temperature control method can also be simpler.

[0046] The heating layer is divided into a plurality of heating areas with different average power densities, and the heating layer is configured in such a way that the average power density in the center area is lower than the average power in the edge area. Specifically, compared with the center position, the edge position is more likely to lose heat, thereby causing uneven heating. In order to optimize the uniformity of the heating temperature of the direct-heated printed circuit board, the heating layer is configured in such a way that the average power density distribution trend increases from the center area to the edge area of ​​the heating layer, and the heating layer is divided into a plurality of heating areas with different average power densities. The average power density of each heating area is directly proportional to the power of the metal heating pipeline distributed in each heating area, and inversely proportional to the area of ​​each heating area. The heating layer is configured in such a way that the average power density in the center area is lower than the average power in the edge area, so that the heating layer on the printed surface of the direct-heated printed circuit board shows a distribution trend in which the average power density increases from the center to the edge, thereby ensuring the uniformity of the output temperature of the heating layer on the printed surface of the direct-heated printed circuit board. Furthermore, in order to achieve a more uniform heating temperature output, the copper heating layer on the printed surface can be configured as follows: Figure 1 In the mode shown, the central region C1 has a smaller average power density, and the periphery of the central region C1 is an edge region E1 with a larger average power density.

[0047] Preferably, in order to ensure the uniformity of the output temperature, the average power density of the central area C1 is configured to be within the range of 0.54-0.83 of the average power density of the edge area E1. Too small a power density difference will make the temperature of the central area higher, thereby affecting the incubation reaction conditions, while too large a power density difference will cause excessive heat loss at the edge and a lower temperature in the central area, which will also make it difficult to achieve incubation conditions.

[0048] Furthermore, the edge region includes a first edge region and a second edge region. When the heat dissipation rate of the first edge region is higher than that of the second edge region, the first edge region is configured to have an average power density greater than the average power density of the second edge region. Dividing the edge region of the copper heating layer into a plurality of different regions according to the average power density can make the overall temperature more uniform. Please refer to Figure 2 , Figure 2 1 is a schematic diagram of another heating layer structure of a printed surface of a direct-heated printed circuit board provided in Example 1, where the edge area E1 is divided into two or more edge areas with different average power densities, including a first edge area E11, a second edge area E12, and a third edge area E13. Figure 3 As shown, in order to ensure the uniformity of the output heating temperature, copper heating layers with different power densities are differentially configured in the central area C1 and its edge areas. The average power density of the copper heating layer in the first edge area E11 is greater than the average power density in the second edge area E12, and the third edge area E13 with a larger average power density is configured in the corner area of ​​the heating layer, so as to better compensate for the larger heat loss at the corner positions. That is to say, all areas are arranged according to the size of the average power density: third edge area E13>first edge area E11>second edge area E12>central area C1.

[0049] The production process using printed circuits can achieve differentiated arrangement of heating power by arranging different copper wires in different areas. Preferably, the central area has the same line width as the metal heating line printed on the second edge area with a smaller average power density in the edge area, and the central area is wider than the line width of the metal heating line printed on the first edge area. In this embodiment, according to the relationship between the area and the printed copper line width and the average power density in the process technology, the printed copper line width of the copper heating layer in the central area C1 is set to be the same as the printed copper line width of the copper heating layer in the second edge area E12 with a smaller average power density in the edge area, and the printed copper line width of the central area C1 is set to be wider than the printed copper line width of the copper heating layer in the first edge area E11, and the printed copper line width of the copper heating layer in the first edge area E11 is the same as the printed copper line width of the copper heating layer in the third edge area E13. Such a setting makes the differentiated power configuration of the copper heating layer simpler, thereby making the overall processing technology simpler.

[0050] The following is a calculation process for the power distribution calculation and printed copper wiring layer design of the direct-heated printed circuit board provided in this embodiment. When the power supply voltage is U0, the rated heating power can be determined according to the heat corresponding to the target temperature of the incubation reaction container under standard conditions. The total rated heating power can be P0. In order to ensure the heating power difference in different areas, the power of all areas can be configured as shown in Table 1. Table 1 is a regional heating power configuration table.

[0051] Table 1:

[0052] area power C1 <![CDATA[P1]]> E11 <![CDATA[P 21 ]]> E12 <![CDATA[P 22 ]]> E13 <![CDATA[P 23 ]]>

[0053] The wiring length and width of the copper heating layer are calculated by the formula R=ρ*(L / A). Here, the resistivity ρ of the printed copper is uniformly 1.70E-08 ohms / meter. The thickness of the printed copper wiring layer is set to be the same, all 35 microns, that is, the thickness of 1 ounce of copper foil. However, due to process errors, the actual thickness is generally 1.2 ounces, and the actual thickness T=1.2×35=42 microns. The third edge area E13, the first edge area E11, the second edge area E12 and the center area C1 in the heating layer are respectively regarded as a resistor element, and the cross-sectional area A of the resistor is equal to the thickness T×the wiring width W. The resistance length L is equal to the occupied area ÷ the spacing W' between adjacent copper wires (wiring width). From the above analysis, it can be seen that the size of the resistance can be changed by changing the wiring width and the spacing between adjacent copper wires, and the printing process is also relatively simple to implement. In this scheme, the line width of some areas is configured to be the same line width, which further simplifies the production process. The final design is as follows Figure 3 Here, the average power density of the central area C1 is the power P1 / the area of ​​the central area C1, and the total power P2 of the edge area is P 21 +P 22 +P 23 , the average power density of the edge area is P2 / total edge area, the total edge area refers to the sum of the areas of the first edge area E11, the second edge area E12 and the third edge area E13, and the average power density of the area division using other layout structures can also be calculated and obtained using a similar method. In other embodiments, the heating layer is divided into other numbers of areas with different average power densities, so as to achieve the effect of uniform output of the heating temperature of the printed surface of the direct-heated printed circuit board.

[0054] The direct-heated printed circuit board provided in this embodiment sets the heating layer of the printed surface of the direct-heated printed circuit board to have a distribution trend in which the average power density increases from the center to the edge, thereby ensuring the uniformity of the output temperature of the heating layer of the printed surface of the direct-heated printed circuit board, and configuring the average power density of the central area to be less than the average power density of the edge area, and the average power density of the central area is in the range of 0.54-0.83 of the average power density of the edge area, so as to achieve the effect of adjusting the difference in average power density between the central area and the edge area at the heat source end, and more preferably, the copper heating layer in the edge area is also divided into a plurality of different areas according to the average power density, and the overall temperature is more uniform and consistent, and a more uniform heating temperature can be output even if the heat transfer plate is omitted, so that the heat transfer characteristics of the metal base layer can be fully utilized to ensure the consistency of the output temperature of the heating surface, and the goal of differentiated output power of the same copper wire length can be achieved by controlling the route width and / or wiring width of the printed copper wire when printing the circuit board, and the processing technology is simple and reliable.

[0055] Embodiment 2

[0056] Please refer to Figure 4 and Figure 5 , Figure 4 is a schematic diagram of the overall exploded structure of an oscillating incubation module provided in Example 2, Figure 5 It is a partial structural schematic diagram of an oscillating incubation module provided in Example 2. This embodiment provides an oscillating incubation module capable of loading and firmly limiting a plurality of incubation cups so as to oscillate, mix and uniformly heat the plurality of incubation cups during an immune reaction. The oscillating incubation module comprises an incubation portion and an oscillation portion. The incubation portion comprises a reagent kit receiver 11 and the direct heating printed circuit board provided in Example 1. The bottom of the reagent kit receiver 11 is detachably connected to the direct heating printed circuit board. The reagent kit receiver 11 can be removably configured with a plurality of incubation cups arranged in an array. The bottoms of the plurality of incubation cups are in thermal contact with the heating surface of the direct heating printed circuit board. The reagent kit receiver 11 is also connected to an oscillation connector 12, which is connected to an oscillation motor 14 of the oscillation portion. The output of the oscillation motor 14 is connected to an eccentric cam 15.

[0057] In this embodiment, the incubation part includes a reagent box receiver 11, which is configured as a frame structure with a predetermined depth. The frame structure can be a bottom open or closed configuration, which is formed by injection molding or machining, etc. In order to ensure the structural strength, metal materials such as steel, aluminum, copper, etc. can be used. A plurality of clip assembly parts are arranged on the side wall of the reagent box receiver 11, and a plurality of clips 111 can be plugged and connected in the plurality of clip assembly parts. Specifically, the clip 111 includes a clamping end with a spring sheet, and the clip 111 can clamp and limit the incubation cup received in the reagent box receiver 11, ensuring that the incubation cup can be reliably limited during the oscillation mixing operation to avoid the risk of splashing contamination, and also enabling the incubation cup to have better thermal contact with the heat source. The bottom of the reagent kit receiving member 11 is detachably connected to the heat source plate 10, which is the direct heating printed circuit board provided in the first embodiment. The direct heating printed circuit board is provided with a heating surface and a printing surface. The heating surface is directly formed on one side of the thickness direction of the heat source plate 10 by mechanical processing to a set accuracy, and the other side of the thickness direction of the heat source plate 10 is directly the printing surface, and a heating layer is printed on the printing surface, and the heat generated by the heating layer is transferred to the incubation cup in thermal contact with the heating surface through the base layer. The reagent kit receiving part 11 can be removably provided with a plurality of incubation cups arranged in an array, and the bottoms of the plurality of incubation cups are in thermal contact with the heat transfer surface of the heat source plate 10. The heat transfer surface of the heat source plate 10 is the heat transfer surface of the metal substrate layer, that is, the heating surface of the direct-heated printed circuit board. The heat transfer surface and the printing surface of the metal substrate can be processed according to conventional precision requirements, and the surface roughness can be limited to 0.2-1.6 μm. The bottom of the reagent kit receiving part 11 is also connected to an oscillating connector 12, which can be configured as a ︺-shaped structure, and a through configuration hole is configured in the middle thereof. The oscillation connecting member 12 is fixedly connected to the oscillation motor 14 of the oscillation part, and the output of the oscillation motor 14 is connected to the eccentric cam 15. The oscillation motor 14 can be reliably fixedly connected to the oscillation connecting member 12 through the oscillation connecting block 141. In order to enable the oscillation motor 14 to be accurately motion controlled, a sensor plate 162 is also fixedly connected to the eccentric cam 15, and the sensor 161 is correspondingly fixed to the oscillation connecting member 12, so that during the rotation of the eccentric cam 15, the cooperation between the sensor plate 162 and the sensor 161 can realize functions such as rotation speed control and eccentric cam 15 position determination.

[0058] Preferably, the oscillation incubation module also includes an incubation configuration base and an elastic buffer 13. The reagent kit receiving component 11 or the oscillation connecting component 12 is connected to the incubation configuration base by an elastic buffer. The elastic buffer 13 is a hollow silicone column or a rubber column with grooves. The elastic buffer is configured to attenuate the vibration energy of the oscillation part by no less than 80%. Specifically, the elastic buffer 13 is a hollow silicone column or a rubber column with annular grooves. The hollow silicone column can be a hollow tube with a predetermined length, and its two ends are respectively sleeved on the oscillation connector 12 and the incubation configuration base. The rubber column with annular grooves can make the two ends threadedly connected to the oscillation connector 12 and the incubation configuration base, and the elastic buffer 13 is configured to attenuate the vibration energy of the oscillation part by not less than 80%. Of course, the elastic buffer 13 can also be connected to the reagent kit receiving piece 11 and the incubation configuration base, thereby ensuring the reliability of the oscillation incubation. In order to ensure the reduction of contamination risk and the effect of rapid incubation during the incubation process, the incubation module is also configured with a covering incubation cover 2.

[0059] In immunodiagnosis, the incubation module usually needs to maintain a low and constant temperature. The oscillating incubation module can be directly used as a heating module in the immunodiagnosis experiment to construct an incubation environment similar to human body temperature for reaction. The oscillating incubation module provided in this embodiment combines the heating element, the heat transfer element and the reaction container carrier plate for design, introduces the printed circuit board technology, and directly configures the heating unit on one side of the thickness direction of the metal substrate layer through the insulating surface, and the other side is used as the heating surface. Compared with the traditional non-metallic substrate printed circuit board, it has superior thermal conductivity. No heat transfer plate is required in the incubation module for uniform heating, and independent heating elements or independent The configuration scheme of the independent heating film makes the heat source design simpler. By applying a direct heating printed circuit board to heat the incubation cup, the heating source does not need to be processed separately, avoiding the need for high-precision assembly of the heating unit and functional units such as the heat transfer plate in the traditional process, and avoiding the problem that the independent assembly of the heating unit may damage at least part of the heating unit. At the same time, there is no need to configure the assembly process of the heating element or the heating film, and the overall control is simpler. It can avoid the difference in heat transfer efficiency caused by the difference in assembly accuracy and assembly gap between different assembly operators, and can also avoid the problem of poor system reliability caused by the independent heating unit being configured in the oscillation module for long-term operation.

[0060] Please refer to Figure 6 and Figure 7 , Figure 6 is a schematic diagram of the assembly structure of an oscillating incubation module provided in Example 2, Figure 7 yes Figure 6The longitudinal cross-sectional schematic diagram of the oscillating incubation module is shown in the figure. In the oscillating incubation module provided in the present embodiment, a copper heating layer is printed on one side of the thickness direction of the heat source plate 10, and the other side of the thickness direction of the heat source plate 10 directly serves as a heating surface to transfer heat to the reaction container supported thereon. The bottom of the reagent box receiving part 11 is also connected to an oscillation module. The oscillation motor 14 can rotate clockwise or counterclockwise to drive the eccentric cam 15 to rotate and generate centrifugal force. Under the action of the centrifugal force, the eccentric movement of the eccentric cam 15 can drive the reagent box receiving part 11 to shake, so that the reaction liquid in the incubation cup therein can be oscillated and mixed, and the copper heating layer can output heating heat to ensure that the reaction liquid in the incubation cup can be synchronously mixed and kept warm. In this process, the cooperation of the sensor sheet 162 and the sensor 161 can control the oscillation speed and accurately know the position of the eccentric cam 15, so that the direct heating printed circuit board acts as the heat source plate 10 in an integral state, so that the substantially same target temperature can be maintained for a long time and reliably. In long-term operation, there is no need to worry about the problem that the assembly gap of a single heat source changes due to oscillation, thereby causing the heat transfer efficiency to deteriorate.

[0061] The oscillating incubation module provided in this embodiment has an oscillating connection block and an eccentric wheel to enable the reaction liquid in the incubation cup to be oscillated and mixed. An elastic buffer is configured in the oscillating incubation module, and the elastic buffer is a hollow silicone column or a rubber column with an annular groove. The elastic buffer is configured to attenuate the vibration energy of the oscillating part by not less than 80% and act on the oscillating part, thereby ensuring the reliability of oscillating incubation. In addition, the direct-heated printed circuit board is in contact with multiple incubation cups arranged in an array, and the copper heating layer can output heating heat to ensure the heat preservation of the reaction liquid in the incubation cup, so that the reaction detection in the incubation cup can be efficiently performed, thereby ensuring the processing efficiency of the oscillating incubation module.

[0062] Embodiment 3

[0063] Please refer to Figure 8 and Fig. 9 , Figure 8 is a partial structural diagram of a sample automatic processing system provided in Example 3, Fig. 9It is a partial structural schematic diagram of another sample automation processing system provided in the third embodiment. The biological sample automation processing system includes multiple oscillation incubation modules in the second embodiment arranged in an array. The biological sample automation processing system also includes an incubation cover storage unit 32. The incubation cover storage unit can accommodate multiple incubation covers 2. After multiple incubation cups are configured in the reagent box receiving unit 11, the multiple incubation covers 2 can be snap-fittedly connected to the top opening side of the reagent box receiving unit to complete the oscillation and constant temperature incubation operations. In this embodiment, the sample automation processing system is arrayed with 3*4 12 oscillation incubation modules, so that oscillation incubation of multiple immune detections can be performed simultaneously, making the operation efficiency of the automation processing system higher. Of course, in actual use, the 12 oscillation incubation modules are not all operated simultaneously in the same time period, but are operated sequentially, which also ensures that other functional units of the entire system have sufficient and efficient coordination time. A plurality of incubation cups 100 can be configured in the reagent box receiver 11 of each oscillation incubation module. The incubation cups can be configured in the form of multiple cups. The incubation cups in the form of multiple cups can increase the number of detection items or expand the number of detection objects. The configured incubation modules can be snap-fittedly connected by the incubation cover 2 to close the top opening side of the reagent box receiver 11 and then complete the oscillation and constant temperature incubation operations. In order to ensure the reliable operation of the system, the biological sample automation processing system is also provided with a self-checking unit 31. The self-checking unit 31 is used to check whether the plate washer that cooperates with the cleaning step has a needle blockage problem after starting up or running for a period of time, and then complete the cleaning and final luminescence detection.

[0064] The sample automated processing system provided in this embodiment comprises a plurality of oscillating incubation modules arranged in an array, all of which can automatically perform constant temperature oscillating incubation operations, thereby enabling automated and efficient batch immune response detection processing, and providing a higher system reliability.

[0065] Embodiment 4

[0066] This embodiment provides a method for manufacturing a direct-heat printed circuit board, which specifically includes the following steps:

[0067] The first step is to glue and crimp a glass fiber cloth type insulation surface on one of the two opposite surfaces of the metal base layer;

[0068] Preferably, the two opposite surfaces of the base layer of the metal material are two opposite surfaces in the thickness direction of the base layer of the metal material.

[0069] The second step is to print a copper heating layer on the insulating surface. The copper heating layer can directly transfer heat to the heating surface of the substrate layer, and the copper heating layer is configured in such a way that the average power density in the central area is lower than the average power in the edge area.

[0070] Specifically, a copper heating layer is printed on the insulating surface, which can directly transfer heat to the heating surface of the substrate layer. The copper heating layer is configured so that the average power density in the central area is lower than the average power in the edge area, thereby ensuring the uniformity of the output temperature of the heating layer on the printed surface of the direct-heated printed circuit board.

[0071] The manufacturing method of the direct-heated printed circuit board provided in this embodiment is to print and configure a copper heating layer on the insulating surface. The copper heating layer can directly transfer heat to the heating surface of the base layer, and then can quickly transfer heat to the heating object configured on the heating surface. The heating layer and the base layer are directly integrated using a printing process, realizing the collective design of the heating element and the heat transfer element. The integrated printed heat source solution is also more suitable for the moving incubation module, making the overall manufacturing method simpler and more suitable for the long-term reliable application of oscillating incubation.

[0072] Please refer to Fig.10 , Fig.10 This is a simulation diagram of the effect of the metal-based direct-heating printed circuit board provided by an embodiment of the present invention on heating the incubation cups thereon. The present invention is based on the optimal target temperature of the enzyme-immune reaction, and simulates the heating simulation results of the metal-based direct-heating printed circuit board for the reaction liquid in the arrayed incubation cups carried thereon (simulating water as the filling medium of the incubation cups). It can be seen from the simulation results that the direct-heating printed circuit board of the present invention as a heat source plate 10 can output a highly uniform heating temperature. At the target temperature of the optimal target reaction temperature of 37°C, the reaction liquid in the reaction cups at different positions can have a temperature difference of less than 0.5°C. Of course, in special cases, the heating temperature difference of the heat source plate 10 can be greater than 0.5°C, but not more than 2°C, to meet the requirements of fast and accurate incubation of multiple incubation cups at a constant temperature.

[0073] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. An application of a direct-heat printed circuit board in an incubation module, characterized in that: The direct-heated printed circuit board includes a base layer of metal material, on which a heating surface and a printing surface are arranged, and the heating surface and the printing surface are arranged opposite to each other. The heating surface can be in thermal contact with an incubation cup in a constant temperature incubation reaction, and the printing surface is connected to an insulating surface, and the insulating surface is printed with a metal heating layer. When the metal heating layer is electrically heated, the heat is evenly transferred through the base layer to the incubation cup in thermal contact with the heating surface.

2. The application of the direct-heat printed circuit board in the incubation module according to claim 1 is characterized in that: The heating layer is divided into a plurality of heating areas with different average power densities, and the heating layer is configured in such a way that the average power density in the central area is lower than the average power in the edge area.

3. The use of the direct-heated printed circuit board in an incubation module according to claim 2, characterized in that: The average power density of the central area is configured to be within the range of 0.54-0.83 of the average power density of the edge area.

4. The use of the direct-heated printed circuit board in the incubation module according to claim 3, characterized in that: The edge region includes a first edge region and a second edge region. When the heat dissipation rate of the first edge region is higher than that of the second edge region, the first edge region is configured to have an average power density greater than an average power density of the second edge region.

5. The use of the direct-heated printed circuit board in an incubation module according to claim 4, characterized in that: The central region has the same line width as the metal heating line printed on the second edge region where the average power density is smaller in the edge region, and the central region has a wider line width than the metal heating line printed on the first edge region.

6. The use of the direct-heat printed circuit board in an incubation module according to claim 1, characterized in that: The material of the metal heating layer is copper, and the insulating surface is a glass fiber cloth type insulating surface.

7. An oscillating incubation module, characterized in that: The invention comprises an incubation part and an oscillation part, wherein the incubation part comprises a reagent box receiving part (11) and a direct heating printed circuit board according to any one of claims 1 to 6, wherein the bottom of the reagent box receiving part (11) is detachably connected to the direct heating printed circuit board, and the reagent box receiving part (11) can be removably configured with a plurality of incubation cups arranged in an array, wherein the bottoms of the plurality of incubation cups are in thermal contact with the heating surface of the direct heating printed circuit board, and the reagent box receiving part (11) is also connected to an oscillation connection part (12), wherein the oscillation connection part (12) is connected to an oscillation motor (14) of the oscillation part, and an eccentric cam (15) is connected to the output of the oscillation motor (14).

8. The oscillating incubation module according to claim 7, characterized in that: It also includes an incubation configuration base and an elastic buffer (13), wherein the reagent kit receiving member (11) or the oscillation connecting member (12) is connected to the incubation configuration base by means of the elastic buffer (13), wherein the elastic buffer (13) is a hollow silica gel column or a rubber column with grooves, and wherein the elastic buffer (13) is configured so as to attenuate the vibration energy of the oscillating part by not less than 80%.

9. A sample automated processing system, characterized in that: The invention comprises a plurality of oscillating incubation modules according to any one of claims 7 or 8 arranged in an array, and an incubation cover storage portion, wherein: The incubation cover storage portion can receive a plurality of incubation covers (2). After a plurality of incubation cups are arranged in the reagent box receiving part (11), the plurality of incubation covers (2) can be snap-fittedly connected to the top opening side of the reagent box receiving part to complete the oscillation and constant temperature incubation operations.

10. A method for manufacturing a direct-heated printed circuit board according to any one of claims 1 to 5, characterized in that: The following steps are involved: The first step is to glue and crimp a glass fiber cloth type insulation surface on one of the two opposite surfaces of the metal base layer; The second step is to print a copper heating layer on the insulating surface, which can directly transfer heat to the heating surface of the base layer, and the copper heating layer is configured in a way that the average power density in the central area is lower than the average power in the edge area.

Images