Wafer aging test device

Abstract

A wafer aging test device relates to the technical field of wafer test equipment and comprises a wafer aging test fixture and a wafer aging test bench, and the wafer aging test fixture comprises a fixture probe board card assembly, a fixture chuck assembly and a heating sucker assembly. The clamp probe board card assembly comprises a board card supporting plate, a board card adapter plate, a probe fixing plate and a bolt assembly, the clamp chuck assembly comprises a chuck base, and the heating suction cup assembly sequentially comprises a heating suction cup, a heating suction cup gasket, a heating piece and a heating piece supporting plate from top to bottom. The wafer aging test bench comprises a test driving plate module, a lifting module, a translation module and a bearing bench, the test driving plate module comprises a driving plate bottom plate, a driving plate assembly and a driving switching probe plate, and the bearing bench comprises a clamp carrier plate and a clamp base plate. The device is small in size and small in occupied space, in addition, the device structure is designed in a modular mode, operation of testers is facilitated, the testing efficiency is improved, and large-scale testing is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing equipment, and in particular to a wafer aging testing device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. After the photolithography, etching and other processes, the wafer needs to be tested, one of which is the aging test.

[0003] The problems with existing wafer aging test devices are: 1. The equipment is large and occupies a large space; 2. The equipment structure is complex, which makes it inconvenient for testers to operate and has low test efficiency, making it unsuitable for mass testing; 3. The equipment reliability is low and wafer devices are easily damaged during the aging test. Summary of the invention

[0004] The purpose of the present invention is to solve the deficiencies of the above-mentioned prior art and to provide a wafer aging test device with a small size, which occupies a small space. In addition, the modular design of the device structure is convenient for testers to operate, improves test efficiency, and realizes large-scale testing.

[0005] To achieve the above object, the technical solution adopted by the present invention is as follows: A wafer aging test device comprises a wafer aging test fixture and a wafer aging test table. The wafer aging test fixture comprises a fixture probe card assembly, a fixture chuck assembly and a heating suction cup assembly.

[0006] The fixture probe card assembly includes a card support plate, a card adapter plate fixed on the top surface of the card support plate, a probe fixing plate fixed on the bottom surface of the card adapter plate, and a certain number of bolt assemblies. A circular hole is provided in the middle of the card support plate. The probe fixing plate is located in the circular hole and is provided with a gate / electrode probe area. The gate / electrode probe area is provided with gate / electrode probes distributed in an array. A common-pole probe is provided on the side of the gate / electrode probe area. A transfer area is provided on the top surface of the card adapter plate. The transfer area is provided with transfer contacts distributed in an array. The probe distribution of the probe fixing plate corresponds to the wafer. During the aging test, the probe and the wafer are abutted, and the test signal is transmitted outward through the probe and the transfer contacts of the transfer area.

[0007] Among them, the clamp chuck assembly includes a chuck base, a cavity is provided on the top surface of the chuck base, and an inflation joint, an exhaust joint seat and an inner wire adapter plate are provided on the side. The inflation joint is connected with the cavity, and an exhaust channel A is provided on the chuck base. The outer end of the exhaust channel A is connected to the exhaust joint seat, and the inner end is located in the middle of the bottom of the cavity and is provided with an insulating sealing pad. An inner wire connected to the inner wire adapter plate is provided in the cavity.

[0008] The heating chuck assembly includes a heating chuck, a heating chuck gasket, a heating plate and a heating plate support plate from top to bottom. A certain number of exhaust channels B extending from the middle to the surroundings are provided in the heating chuck. A certain number of exhaust holes connected to the exhaust channels B are provided on the top surface. An exhaust connector A connected to the exhaust channel B is provided in the middle of the bottom surface. The exhaust connector A passes through the heating chuck gasket, the heating plate and the heating plate support plate and abuts against the insulating sealing pad. The upper and lower surfaces of the insulating sealing pad are provided with sealing rings. A common-pole conductive column is provided on the side of the top surface of the heating chuck. The common-pole conductive column corresponds to the common-pole probe of the probe fixing plate. The gate / element probe is connected to the surface of the wafer to form an aging test loop.

[0009] The heating chuck is made of tungsten copper alloy with good thermal conductivity. The heating chuck gasket is a ceramic sheet with good thermal conductivity and insulation. The heating plate is a mica heating plate with uniform heat per unit area and a central leak hole, which is conducive to uniform heating of the whole. The heating plate support has the functions of heat insulation and reinforcement. The stacked structure of the heating chuck assembly can effectively reduce heat loss.

[0010] The outer periphery of the heating chuck is provided with a certain number of fixing bolts and is fixed in the cavity of the chuck base by fixing bolts. The bottom surface of the board adapter plate abuts against the top surface of the outer periphery of the chuck base and is fixed by a bolt assembly. Before the aging test, remove the fixture probe board assembly, place the wafer to be tested on the heating chuck, and the air flows out through the exhaust equipment. The exhaust channel A, the exhaust channel B and the exhaust hole form a negative pressure to firmly adsorb the wafer to the heating chuck. During the aging test, the board adapter plate and the chuck base abut against the cavity to form a sealing structure, and inert gas is transported into the cavity through the inflation joint, which plays a role in protecting the wafer and heat-insulating and stabilizing the temperature. The inner line adapter plate and the inner line are used to transmit the current and signal required for the operation of the heating plate of the heating chuck assembly.

[0011] Preferably, the wafer aging test bench includes a test drive board module, a lifting module, a translation module and a carrier. The test drive board module includes a drive board bottom plate, a drive board assembly fixed on the top surface of the drive board bottom plate and a drive transfer probe board fixed on the bottom surface of the drive board assembly. A circular hole is provided in the middle of the drive board bottom plate, and the drive transfer probe board is located in the circular hole and is provided with probes distributed in an array. The drive board assembly includes a drive board and a relay board module thereon. The probes of the drive transfer probe board correspond to the transfer contacts of the transfer area on the top surface of the board adapter board. During the aging test, the two offset each other to transmit the test signal.

[0012] The lifting module includes a test bench bottom plate and lifting cylinder assemblies on both sides thereof, a lifting mounting plate is provided at the movable end of the lifting cylinder assembly, and the two sides of the driving board bottom plate are fixed to the lifting mounting plate. The lifting cylinder assembly includes a lifting cylinder and guide column structures on both sides thereof, and the lifting module is used to test the rise and fall of the driving board module. When descending, the probe of the driving transfer probe board is abutted against the transfer contact point of the transfer area on the top surface of the board card transfer board, and the aging test can be performed.

[0013] The translation module includes a translation base plate and a translation cylinder assembly at its bottom. The inner end of the translation base plate is fixed in the middle of the test bench base plate, and the two form a T-shape. The support platform includes a fixture carrier plate and a fixture pad fixed on its top surface. The bottom surface of the fixture carrier plate is fixed to the movable end of the translation cylinder assembly. A plurality of fixture front blocks are provided on the fixture carrier plate on the front side of the fixture pad, and a plurality of fixture rear blocks are provided on the fixture carrier plate on the rear side. The wafer aging test fixture is placed on the fixture pad of the support platform. The fixture front block and the fixture rear block are located on the periphery of the chuck base and are limited in the horizontal direction. The translation cylinder assembly can drive the support platform and the wafer aging test fixture thereon to move horizontally inward or outward.

[0014] Preferably, a certain number of board pallet support columns are arranged at the bottom of the outer periphery of the board pallet, and the lower ends of the board pallet support columns exceed the lower end surface of the chuck base, so that when the fixture probe board assembly or the wafer aging test fixture is placed on other objects, only the bottom surface of the board pallet support columns is in contact with the surface of the object, and other structures are suspended in the air.

[0015] Preferably, clamping hooks are provided on both sides of the circular hole at the bottom of the board tray to cooperate with the clamping structure of the wafer loading and unloading equipment.

[0016] Preferably, the board and card support plate is provided with wing plates on both sides, and the wing plates are provided with strip holes A. The structure of the wing plates on both sides is used to cooperate with the manipulator of the loading and unloading equipment and manual gripping.

[0017] Preferably, positioning grooves are provided at the front and rear of the wing plate to cooperate with the limiting positioning structure of the wafer loading and unloading equipment.

[0018] Preferably, a strip hole B is provided at the front end of the clamp carrier plate to facilitate manual gripping.

[0019] Preferably, a board fixing plate is fixed in the middle of the top surface of the board adapter plate, and the bolt assembly includes a positioning bolt sleeve and a positioning bolt therein, the positioning bolt sleeve is fixed to the outer periphery of the top surface of the board fixing plate, a bolt bearing is provided on the top of the positioning bolt, and a compression spring A is provided between the positioning bolt and the positioning bolt sleeve. The lower end of the compression spring A abuts against the board fixing plate, and the upper end abuts against the bolt bearing (outer ring). The holes of the board adapter plate and the board fixing plate through which the positioning bolt passes are provided with bolt inner sleeves, and the outer periphery top surface of the chuck base is provided with corresponding screw holes / nuts. The connection and separation of the fixture probe board assembly and the fixture chuck assembly can be achieved by a bolt tightening device. When connected and fixed, the positioning bolt is tightened downward. Under the positioning and guiding action of the positioning bolt sleeve, the bolt bearing, the bolt inner sleeve and other structures, the positioning bolt can be accurately screwed into the screw hole / nut. At this time, the compression spring A is in a compressed state. When separation is required, the positioning bolt is loosened, and the positioning bolt is separated from the screw hole / nut, and it will return to the top of the positioning bolt sleeve under the action of the compression spring A, and remain in a vertical state without shaking.

[0020] Preferably, the top surface of the board support plate is provided with an avoidance groove A corresponding to the transfer area of ​​the board adapter plate, and the bottom surface of the board fixing plate is provided with an avoidance groove B corresponding to the probe fixing plate to avoid interference.

[0021] Preferably, the transfer area is distributed in a ring shape on the outer periphery of the board adapter plate, and the corresponding drive transfer probe board is distributed in a ring shape.

[0022] Preferably, the bottom surface of the probe fixing plate is embedded with a plurality of board visual recognition components, and the top surface of the outer periphery of the chuck base is embedded with a plurality of loading and unloading visual recognition components. The visual recognition components cooperate with the automatic loading and unloading equipment to accurately position the wafer when it is placed in the middle of the top surface of the heating chuck assembly, and to accurately position the board adapter plate and the chuck base when the fixture probe board assembly and the fixture chuck assembly are installed.

[0023] Preferably, a raised clamp limiting strip is provided in the middle of the clamp pad, and a corresponding clamp limiting groove is provided on the bottom surface of the chuck base, and circumferential limiting prevents the chuck base, i.e., the wafer aging test fixture, from rotating.

[0024] Preferably, an O-ring is provided on the top surface of the outer periphery of the chuck base, and after installation, the O-ring abuts against the board-card adapter plate to achieve a sealing effect.

[0025] Preferably, a chuck heat insulation sheet is provided at the bottom of the cavity, and an annular heat insulation sheet may also be provided on the side wall of the cavity to play the role of heat insulation and temperature stabilization.

[0026] Preferably, a heating chuck insulating block corresponding to the fixing bolt is embedded on the outer periphery of the heating chuck, the fixing bolt passes through the heating chuck insulating block, and a heating chuck supporting column is sleeved on the lower end. The heating chuck insulating block and the heating chuck supporting column are poor conductors of heat, and the heating chuck supporting column supports the heating chuck assembly to be suspended in the air, thereby achieving a heat insulation effect.

[0027] Preferably, a certain number of sensor channels are provided on the periphery of the heating chuck, and the sensor channels extend toward the middle. Thermocouple sensors are provided in the sensor channels, and the thermocouple sensors are evenly spaced, for example, the number may be 3, for collecting the temperature of the heating chuck. The thermocouple sensor is installed by drilling and potting inside the heating chuck to improve the accuracy of temperature collection, and the signal is transmitted to the outside through the inner line and the inner line adapter plate.

[0028] Preferably, the outer periphery of the heating chuck is provided with an opening connected to the exhaust channel B, and a plug is provided in the opening for processing the exhaust channel B. After the processing is completed, the plug is installed for sealing.

[0029] Preferably, a through hole is provided in the middle of the driving board assembly to dissipate heat and prevent heat accumulation. A plurality of heat dissipation holes may also be provided on the bottom plate of the driving board.

[0030] Preferably, a reinforcing plate is provided on the top surface of the outer periphery of the driving plate bottom plate, which has the function of improving the structural strength and protecting the driving plate assembly.

[0031] Preferably, the bottom plate of the test bench is provided with a station protection gas circuit control component and a temperature control component. The station protection gas circuit control component includes a mounting plate and an air switch, a pressure transmitter, a power supply, etc. thereon, and the temperature control component includes a mounting plate and a control board, a power supply, etc. thereon.

[0032] Preferably, two linear slide rails are provided on the top surface of the translation base plate, and a linear slider fixed to the bottom surface of the fixture carrier plate is provided on the linear slide rails.

[0033] Preferably, a buffer limit assembly is provided on the top surface of the rear end of the translation base plate, and the buffer limit assembly includes a limit pin and oil pressure buffers on both sides thereof, which are used for limiting and buffering the inward movement of the bearing platform driven by the translation module.

[0034] Preferably, a fixture adapter assembly is provided on the top surface of the rear end of the translation base plate, and the fixture adapter assembly includes a fixture adapter mounting plate fixed to the translation base plate, and the fixture adapter mounting plate is provided with an inflation valve corresponding to the inflation joint, an exhaust joint B corresponding to the exhaust joint seat, and a probe board module corresponding to the inner line adapter plate. The channel formed by connecting the inflation joint and the inflation valve can transport inert gas into the cavity, the channel formed by connecting the exhaust joint seat and the exhaust joint B can exhaust gas to form a negative pressure to adsorb the wafer, and the channel formed by connecting the inner line adapter plate and the probe board module can transmit power and signals.

[0035] Preferably, the number of the inflation valve and the inflation connector is two respectively, and a structural distribution of the fixture adapter assembly is: the air extraction connector B is located in the middle of the probe board module, the inflation valve is located on both sides of the probe board module, and the inflation connector, the air extraction connector seat and the inner line adapter plate structure distribution correspond to it. When working, one of the inflation valves delivers inert gas into the cavity, and the gas in the cavity is discharged from the other inflation valve. After the inert gas fills the cavity, one channel is closed, and the other channel is used to maintain pressure.

[0036] Preferably, the inflation valve comprises a guide limit joint fixed on the fixture adapter mounting plate and a movable inflation joint passing through the guide limit joint, a plurality of pin holes are arranged on the outer periphery of the front end of the movable inflation joint, a guide positioning pin is arranged in the pin hole, the inner end of the guide positioning pin is connected to the guide limit joint, and a compression spring B is arranged on the outer sleeve of the guide positioning pin between the guide limit joint and the front end of the movable inflation joint. The movable inflation joint of the inflation valve can move within a certain range to avoid hard contact between the inflation valve and the inflation joint, and the compression spring B ensures sealing.

[0037] Preferably, the device further comprises a housing and a bracket therein, wherein the number of the wafer aging test stations is multiple and is mounted in an array on the bracket, and the number of the wafer aging test fixtures is greater than or equal to the number of the wafer aging test stations. When the wafer aging test station is working, wafers to be tested for aging can be loaded into other wafer aging test fixtures, and replaced in time after the test is completed, thereby improving the test efficiency.

[0038] The advantages of the present invention are: 1. The device is small in size, so it occupies a small space; 2. The modular design of the device structure is convenient for testers to operate, improves test efficiency, and realizes large-scale testing; 3. The reliability of the equipment is improved, ensuring the protection of wafer devices during the aging test process. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 A perspective view of the present invention; Figure 2 is a side view of the present invention; Figure 3 A top view of the present invention; Figure 4 The three-dimensional wafer aging test fixture of the present invention is Figure 1 ; Figure 5 The three-dimensional wafer aging test fixture of the present invention is Figure 2 ; Figure 6 It is a rear view of the wafer aging test fixture of the present invention; Figure 7 for Figure 6 Sectional view along AA direction; Figure 8 is a three-dimensional diagram of a fixture probe card assembly in the present invention; Fig. 9 An exploded view of the fixture probe card assembly of the present invention; Fig.10 A top view of the fixture probe card assembly of the present invention; Fig.11 for Fig.10 Cross-sectional view along the BB direction; Fig.12 is a three-dimensional diagram of the clamp chuck assembly of the present invention; Fig.13 A top view of the clamp chuck assembly of the present invention; Fig.14 for Fig.13 Sectional view along CC direction; Fig.15 The three-dimensional heating suction cup assembly of the present invention Figure 1 ; Fig.16 The three-dimensional heating suction cup assembly of the present invention Figure 2 ; Fig.17 An exploded view of the heating chuck assembly of the present invention; Fig.18 A top view of the heating chuck assembly of the present invention; Fig.19 for Fig.18 Cross-sectional view along the DD direction; Fig. 20 for Fig.19 Sectional view along EE direction; Fig.21 A side view of the heating chuck of the present invention; Fig. 22 for Fig.21 Sectional view along the FF axis; Fig.23 The three-dimensional structure of the test drive board module in the present invention Figure 1 ; Fig.24 The three-dimensional structure of the test drive board module in the present invention Figure 2 ; Fig.25 It is a three-dimensional diagram of the lifting module in the present invention; Fig.26 This is a front view of the lifting module in the present invention; Fig. 27 The three-dimensional translation module of the present invention Figure 1 ; Fig.28 The three-dimensional translation module of the present invention Figure 2 ; Fig.29 It is a side view of the translation module of the present invention; Fig.30 is a three-dimensional diagram of the clamp adapter assembly of the present invention; Fig.31 It is a front view of the clamp adapter assembly of the present invention; Fig.32 for Fig.31 Cross-sectional view along the GG axis.

[0040] Description of the main component symbols in the figure: 100. Wafer aging test fixture; 110. Fixture probe board assembly; 111. Board support plate; 111.1. Board support plate support column; 111.2. Pressing hook; 111.3. Wing plate; 111.4. Strip hole A; 111.5. Positioning groove; 111.6. Avoidance groove A; 112. Board adapter plate; 112.1. Transfer area; 113. Probe fixing plate; 113.1. Gate / electrode probe area; 113.2. Common pole probe; 113.3. Board visual identification assembly; 114. Bolt assembly; 114.1. Positioning bolt sleeve; 114.2. Positioning bolt; 114.3. Bolt bearing; 114.4. Compression spring A; 115. Board fixing plate; 115.1. Avoidance groove B; 120, fixture chuck assembly; 121, chuck base; 121.1, cavity; 121.2, air extraction channel A; 121.3, loading and unloading visual identification assembly; 121.4, fixture limit groove; 122, inflation connector; 123, air extraction connector seat; 124, inner line adapter plate; 125, insulating sealing pad; 126, inner line; 127, O-ring; 128, chuck heat insulation sheet; 130, heating chuck assembly; 131, heating chuck; 131.1, exhaust channel B; 131.2, exhaust hole; 131.3, common-pole conductive column; 131.4, sensor channel; 131.5, plug; 132, heating chuck gasket; 133, heating plate; 134, heating plate support plate; 135, exhaust connector A; 136, fixing bolt; 137, heating chuck insulation block; 138, heating chuck support column; 139, thermocouple sensor; 200. Wafer aging test bench; 210, test drive board module; 211, drive board bottom plate; 212, drive board assembly; 213, drive transfer probe board; 214, through hole; 215, reinforcement board; 220, lifting module; 221, test bench bottom plate; 222, lifting cylinder assembly; 223, lifting mounting plate; 224, station protection gas circuit control assembly; 225, temperature control assembly; 230, translation module; 231, translation base plate; 232, translation cylinder assembly; 233, linear guide rail; 234, linear slide block; 235, buffer limit assembly; 235.1, limit pin; 235.2, hydraulic buffer; 240, bearing platform; 241, fixture carrier plate; 241.1, strip hole B; 242, fixture pad; 243, fixture front stopper; 244, fixture rear stopper; 245, fixture limit strip; 250. Clamp adapter assembly; 251. Clamp adapter mounting plate; 252. Inflating valve; 252.1. Guide limit joint; 252.2. Movable inflation joint; 252.3. Guide positioning pin; 252.4. Compression spring B; 253. Vacuum joint B; 254. Probe board module. DETAILED DESCRIPTION

[0041] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with the accompanying drawings.

[0042] Embodiment 1: Figure 1-3 As shown, a wafer aging test device includes a wafer aging test fixture 100 and a wafer aging test table 200 .

[0043] Combination Figure 4-7 As shown, the wafer aging test fixture 100 includes a fixture probe card assembly 110 , a fixture chuck assembly 120 and a heating chuck assembly 130 .

[0044] Combination Figure 8-11As shown, the fixture probe board assembly 110 includes a board support plate 111, a board adapter plate 112 fixed on the top surface of the board support plate 111, a probe fixing plate 113 fixed on the bottom surface of the board adapter plate 112, and a certain number of bolt assemblies 114. A circular hole is provided in the middle of the board support plate 111, the probe fixing plate 113 is located in the circular hole and a gate / electrode probe area 113.1 is provided thereon, the gate / electrode probe area 113.1 is provided with gate / electrode probes distributed in an array, a common pole probe 113.2 is provided on the side of the gate / electrode probe area 113.1, and a transfer area 112.1 is provided on the top surface of the board adapter plate 112, and the transfer area 112.1 is provided with transfer contacts distributed in an array.

[0045] Combination Figure 12-14 As shown, the clamp chuck assembly 120 includes a chuck base 121, a cavity 121.1 is provided on the top surface of the chuck base 121, an inflation joint 122, an exhaust joint seat 123 and an inner line adapter plate 124 are provided on the side, the inflation joint 122 is connected with the cavity 121.1, and an exhaust channel A121.2 is provided on the chuck base 121, the outer end of the exhaust channel A121.2 is connected to the exhaust joint seat 123, the inner end is located in the middle of the bottom of the cavity 121.1 and is provided with an insulating sealing pad 125, and an inner line 126 connected to the inner line adapter plate 124 is provided in the cavity 121.1.

[0046] Combination Figure 15-22 As shown, the heating suction cup assembly 130 includes a heating suction cup 131, a heating suction cup gasket 132, a heating plate 133 and a heating plate support plate 134 from top to bottom. A certain number of exhaust channels B131.1 extending from the middle to the surrounding areas are provided in the heating suction cup 131, a certain number of exhaust holes 131.2 connected to the exhaust channels B131.1 are provided on the top surface, and an exhaust connector A135 connected to the exhaust channel B131.1 is provided in the middle of the bottom surface. The exhaust connector A135 passes through the heating suction cup gasket 132, the heating plate 133 and the heating plate support plate 134 and abuts against the insulating sealing pad 125. A common-pole conductive column 131.3 is provided on the side of the top surface of the heating suction cup 131.

[0047] Among them, a certain number of fixing bolts 136 are provided on the outer periphery of the heating suction cup 131 and are fixed in the cavity 121.1 of the chuck base 121 by the fixing bolts 136. The bottom surface of the board adapter plate 112 is against the top surface of the outer periphery of the chuck base 121 and is fixed by the bolt assembly 114.

[0048] Combination Figure 1-3 As shown, the wafer aging test bench 200 includes a test drive board module 210 , a lifting module 220 , a translation module 230 and a carrier platform 240 .

[0049] Combination Figure 23-24As shown, the test drive board module 210 includes a drive board base plate 211, a drive board assembly 212 fixed on the top surface of the drive board base plate 211, and a drive adapter probe board 213 fixed on the bottom surface of the drive board assembly 212. A circular hole is provided in the middle of the drive board base plate 211, and the drive adapter probe board 213 is located in the circular hole and is provided with probes distributed in an array.

[0050] Combination Figure 25-26 As shown, the lifting module 220 includes a test bench bottom plate 221 and lifting cylinder assemblies 222 on both sides thereof. A lifting mounting plate 223 is provided at the movable end of the lifting cylinder assembly 222 , and both sides of the driving plate bottom plate 211 are fixed to the lifting mounting plate 223 .

[0051] Combination Figure 27-29 As shown, the translation module 230 includes a translation base plate 231 and a translation cylinder assembly 232 at the bottom thereof, and the inner end of the translation base plate 231 is fixed in the middle of the test bench base plate 221 .

[0052] Combination Figure 27-29 As shown, the support platform 240 includes a fixture carrier plate 241 and a fixture pad 242 fixed on the top surface thereof, the bottom surface of the fixture carrier plate 241 is fixed to the movable end of the translation cylinder assembly 232, a plurality of fixture front stoppers 243 are provided on the fixture carrier plate 241 on the front side of the fixture pad 242, and a plurality of fixture rear stoppers 244 are provided on the fixture carrier plate 241 on the rear side.

[0053] Embodiment 2: Combination Figure 8 and Figure 10-11 As shown, on the basis of the first embodiment, a certain number of board tray support columns 111.1 are arranged at the bottom of the outer periphery of the board tray 111, and clamping hooks 111.2 are arranged on both sides of the circular hole at the bottom.

[0054] Wherein, wing plates 111.3 are provided on both sides of the board and card support plate 111, strip holes A111.4 are provided on the wing plates 111.3, and positioning grooves 111.5 are provided at the front and rear of the wing plates 111.3.

[0055] Combination Figure 27-28 As shown, a strip hole B241.1 is provided at the front end of the fixture carrier plate 241.

[0056] Example 3: Combination Figure 4 , Figure 7 , Figure 9-11As shown, on the basis of Example 1 or Example 2, a board fixing plate 115 is fixed in the middle of the top surface of the board adapter plate 112, and the bolt assembly 114 includes a positioning bolt sleeve 114.1 and a positioning bolt 114.2 therein, the positioning bolt sleeve 114.1 is fixed to the outer periphery of the top surface of the board fixing plate 115, a bolt bearing 114.3 is provided on the top of the positioning bolt 114.2, and a compression spring A114.4 is provided between the positioning bolt 114.2 and the positioning bolt sleeve 114.1.

[0057] The top surface of the board support plate 111 is provided with an avoidance groove A111.6 corresponding to the transfer area 112.1 of the board transfer plate 112, and the bottom surface of the board fixing plate 115 is provided with an avoidance groove B115.1 corresponding to the probe fixing plate 113.

[0058] The transfer area 112.1 is distributed in a ring shape on the periphery of the card transfer plate 112, and the corresponding drive transfer probe plate 213 is distributed in a ring shape. Fig.24 .

[0059] Embodiment 4: Combination Figure 8 , Figure 12-13 As shown, based on the first, second or third embodiment, the bottom surface of the probe fixing plate 113 is embedded with a plurality of board visual identification components 113.3, and the top surface of the outer periphery of the chuck base 121 is embedded with a plurality of loading and unloading visual identification components 121.3.

[0060] Embodiment 5: Combination Figure 5 , Fig.14 , Fig. 27 and Fig.29 As shown, based on the first, second, third or fourth embodiments, a protruding clamp limiting strip 245 is provided in the middle of the clamp pad 242, and a corresponding clamp limiting groove 121.4 is provided on the bottom surface of the chuck base 121.

[0061] Example 6: Combination Figure 12-14 As shown, based on the above embodiment, an O-ring 127 is provided on the top surface of the outer periphery of the chuck base 121, and a chuck heat insulation sheet 128 is provided on the bottom of the cavity 121.1.

[0062] Embodiment 7: Combination Figure 12-16 , Fig.18 , Figure 20-22 As shown, based on the above embodiment, a heating chuck insulating block 137 corresponding to the fixing bolt 136 is embedded in the outer periphery of the heating chuck 131, and the fixing bolt 136 passes through the heating chuck insulating block 137, and a heating chuck support column 138 is sleeved at the lower end.

[0063] Embodiment 8: Combination Figure 21-22As shown, based on the above embodiment, a certain number of sensor channels 131.4 are provided on the periphery of the heating chuck 131, and thermocouple sensors 139 are provided in the sensor channels 131.4.

[0064] Combination Figure 19-20 As shown, the outer periphery of the heating suction cup 131 is provided with an opening connected to the exhaust channel B131.1, and a plug 131.5 is provided in the opening.

[0065] Embodiment 9: Combination Figure 23-24 As shown, based on the above embodiment, a through hole 214 is provided in the middle of the driving plate assembly 212 , and a reinforcing plate 215 is provided on the top surface of the outer periphery of the driving plate bottom plate 211 .

[0066] Embodiment 10: Combination Fig.25 As shown, based on the above embodiment, a station protection gas circuit control component 224 and a temperature control component 225 are provided on the test bench bottom plate 221 .

[0067] Example 11: Combination Figure 27-29 As shown, based on the above embodiment, two linear slide rails 233 are provided on the top surface of the translation base plate 231 , and a linear slider 234 fixed to the bottom surface of the fixture carrier plate 241 is provided on the linear slide rails 233 .

[0068] A buffer limiter assembly 235 is disposed on the top surface of the rear end of the translation base plate 231. The buffer limiter assembly 235 includes a limiter pin 235.1 and oil pressure buffers 235.2 on both sides thereof.

[0069] Example 12: Combination Fig. 27 , Figure 29-32 As shown, on the basis of the above embodiment, a clamp adapter assembly 250 is provided on the top surface of the rear end of the translation base plate 231, and the clamp adapter assembly 250 includes a clamp adapter mounting plate 251 fixed to the translation base plate 231, and the clamp adapter mounting plate 251 is provided with an inflation valve 252 corresponding to the inflation connector 122, an exhaust connector B253 corresponding to the exhaust connector seat 123, and a probe board module 254 corresponding to the inner line adapter plate 124.

[0070] Example 13: Combination Figure 12-13 , Figure 30-32As shown, on the basis of Example 12, the number of the inflation valve 252 and the inflation connector 122 are two respectively, the inflation valve 252 includes a guide limit connector 252.1 fixed on the clamp adapter mounting plate 251 and a movable inflation connector 252.2 passing through the guide limit connector 252.1, a plurality of pin holes are provided on the outer periphery of the front end of the movable inflation connector 252.2, a guide positioning pin 252.3 is provided in the pin hole, the inner end of the guide positioning pin 252.3 is connected to the guide limit connector 252.1, and the guide positioning pin 252.3 between the guide limit connector 252.1 and the front end of the movable inflation connector 252.2 is covered with a compression spring B252.4.

[0071] Embodiment 14: Based on the above embodiments, the testing device of the present invention further includes an equipment housing and a bracket therein, the number of the wafer aging test stations 200 is multiple and is installed in an array on the bracket, and the number of the wafer aging test fixtures 100 is greater than or equal to the number of the wafer aging test stations 200.

[0072] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. The present invention can be used on similar products. Any changes or modifications made by any technician in the field of the present invention are covered by the patent scope of the present invention.

Claims

1. A wafer aging test device, characterized in that: It comprises a wafer aging test fixture (100) and a wafer aging test bench (200); The wafer aging test fixture (100) comprises a fixture probe card assembly (110), a fixture chuck assembly (120) and a heating suction cup assembly (130); The fixture probe card assembly (110) comprises a card support plate (111), a card adapter plate (112) fixed on the top surface of the card support plate (111), a probe fixing plate (113) fixed on the bottom surface of the card adapter plate (112), and a certain number of bolt assemblies (114); a circular hole is provided in the middle of the card support plate (111); the probe fixing plate (113) is located in the circular hole and is provided with a gate / electrode probe area (113.1); the gate / electrode probe area (113.1) is provided with gate / electrode probes distributed in an array; a common pole probe (113.2) is provided on the side of the gate / electrode probe area (113.1); a transfer area (112.1) is provided on the top surface of the card adapter plate (112); and the transfer area (112.1) is provided with transfer contacts distributed in an array; The fixture chuck assembly (120) comprises a chuck base (121); a cavity (121.1) is provided on the top surface of the chuck base (121); an inflation joint (122), an exhaust joint seat (123) and an inner line adapter plate (124) are provided on the side surface; the inflation joint (122) is connected to the cavity (121.1); an exhaust channel A (121.2) is provided on the chuck base (121); the outer end of the exhaust channel A (121.2) is connected to the exhaust joint seat (123); the inner end is located in the middle of the bottom of the cavity (121.1) and is provided with an insulating sealing pad (125); an inner line (126) connected to the inner line adapter plate (124) is provided in the cavity (121.1); The heating suction cup assembly (130) comprises, from top to bottom, a heating suction cup (131), a heating suction cup gasket (132), a heating plate (133) and a heating plate support plate (134); a certain number of exhaust channels B (131.1) extending from the middle to the surroundings are provided in the heating suction cup (131); a certain number of exhaust holes (131.2) connected to the exhaust channels B (131.1) are provided on the top surface; an exhaust connector A (135) connected to the exhaust channels B (131.1) is provided in the middle of the bottom surface; the exhaust connector A (135) passes through the heating suction cup gasket (132), the heating plate (133) and the heating plate support plate (134) and abuts against the insulating sealing gasket (125); and a common-pole conductive column (131.3) is provided on the side of the top surface of the heating suction cup (131); The heating suction cup (131) is provided with a certain number of fixing bolts (136) on its periphery and is fixed in the cavity (121.1) of the chuck base (121) via the fixing bolts (136); the bottom surface of the board-to-card adapter plate (112) abuts against the top surface of the periphery of the chuck base (121) and is fixed via a bolt assembly (114); The wafer aging test bench (200) comprises a test drive board module (210), a lifting module (220), a translation module (230) and a bearing platform (240); The test drive board module (210) comprises a drive board base plate (211), a drive board assembly (212) fixed on the top surface of the drive board base plate (211), and a drive adapter probe board (213) fixed on the bottom surface of the drive board assembly (212); a circular hole is provided in the middle of the drive board base plate (211); the drive adapter probe board (213) is located in the circular hole and has probes distributed in an array thereon; The lifting module (220) comprises a test bench bottom plate (221) and lifting cylinder assemblies (222) on both sides thereof; a lifting installation plate (223) is provided at the movable end of the lifting cylinder assembly (222); and both sides of the driving plate bottom plate (211) are fixed to the lifting installation plate (223); The translation module (230) comprises a translation base plate (231) and a translation cylinder assembly (232) at the bottom thereof, wherein the inner end of the translation base plate (231) is fixed in the middle of the test bench base plate (221); The support platform (240) comprises a fixture carrier plate (241) and a fixture pad (242) fixed to its top surface; the bottom surface of the fixture carrier plate (241) is fixed to the movable end of the translation cylinder assembly (232); a plurality of fixture front stoppers (243) are provided on the fixture carrier plate (241) on the front side of the fixture pad (242); and a plurality of fixture rear stoppers (244) are provided on the fixture carrier plate (241) on the rear side.

2. A wafer aging test device according to claim 1, characterized in that: A certain number of board support column support columns (111.1) are arranged at the bottom of the outer periphery of the board support plate (111), and clamping hooks (111.2) are arranged on both sides of the circular hole at the bottom; The board and card support plate (111) is provided with wing plates (111.3) on both sides, the wing plates (111.3) are provided with strip holes A (111.4), and the wing plates (111.3) are provided with positioning grooves (111.5) at the front and rear. The front end of the clamp carrier plate (241) is provided with a strip-shaped hole B (241.1); A board card fixing plate (115) is fixed in the middle of the top surface of the board card adapter plate (112); the bolt assembly (114) comprises a positioning bolt sleeve (114.1) and a positioning bolt (114.2) therein; the positioning bolt sleeve (114.1) is fixed to the outer periphery of the top surface of the board card fixing plate (115); a bolt bearing (114.3) is provided at the top of the positioning bolt (114.2); and a compression spring A (114.4) is provided between the positioning bolt (114.2) and the positioning bolt sleeve (114.1).

3. A wafer aging test device according to claim 2, characterized in that: The top surface of the board support plate (111) is provided with an avoidance groove A (111.6) corresponding to the transfer area (112.1) of the board transfer plate (112), and the bottom surface of the board fixing plate (115) is provided with an avoidance groove B (115.1) corresponding to the probe fixing plate (113); The transfer area (112.1) is distributed in a ring shape on the outer periphery of the card transfer plate (112), and the corresponding drive transfer probe plate (213) is distributed in a ring shape; A plurality of board and card visual identification components (113.3) are embedded in the bottom surface of the probe fixing plate (113), and a plurality of loading and unloading visual identification components (121.3) are embedded in the outer peripheral top surface of the chuck base (121).

4. The wafer aging test device according to claim 1, characterized in that: A protruding clamp limiting strip (245) is provided in the middle of the clamp pad (242), and a corresponding clamp limiting groove (121.4) is provided on the bottom surface of the chuck base (121); An O-ring (127) is provided on the top surface of the outer periphery of the chuck base (121), and a chuck heat insulation sheet (128) is provided on the bottom of the cavity (121.1).

5. The wafer aging test device according to claim 1, characterized in that: A heating chuck insulating block (137) corresponding to the fixing bolt (136) is embedded on the outer periphery of the heating chuck (131); the fixing bolt (136) passes through the heating chuck insulating block (137) and a heating chuck supporting column (138) is sleeved on the lower end; A certain number of sensor channels (131.4) are provided on the periphery of the heating suction cup (131), thermocouple sensors (139) are provided in the sensor channels (131.4), and an opening communicating with the air extraction channel B (131.1) is provided on the periphery of the heating suction cup (131), a plug (131.5) is provided in the opening.

6. The wafer aging test device according to claim 1, characterized in that: A through hole (214) is provided in the middle of the driving plate assembly (212), and a reinforcing plate (215) is provided on the top surface of the outer periphery of the driving plate bottom plate (211). A station protection gas circuit control component (224) and a temperature control component (225) are provided on the test bench bottom plate (221).

7. The wafer aging test device according to claim 1, characterized in that: Two linear slide rails (233) are provided on the top surface of the translation base plate (231), and a linear slide block (234) is provided on the linear slide rails (233) and is fixed to the bottom surface of the fixture carrier plate (241); A buffer limit assembly (235) is provided on the top surface of the rear end of the translation base plate (231), and the buffer limit assembly (235) comprises a limit pin (235.1) and oil pressure buffers (235.2) on both sides thereof.

8. The wafer aging test device according to claim 1, characterized in that: The top surface of the rear end of the translation base plate (231) is provided with a fixture adapter assembly (250), and the fixture adapter assembly (250) includes a fixture adapter mounting plate (251) fixed to the translation base plate (231), and the fixture adapter mounting plate (251) is provided with an inflation valve (252) corresponding to the inflation connector (122), an exhaust connector B (253) corresponding to the exhaust connector seat (123), and a probe board module (254) corresponding to the inner line adapter plate (124).

9. The wafer aging test device according to claim 1, characterized in that: The number of the inflation valve (252) and the number of the inflation joint (122) are two respectively. The inflation valve (252) comprises a guide limit joint (252.1) fixed on the fixture transfer mounting plate (251) and a movable inflation joint (252.2) passing through the guide limit joint (252.1). The outer periphery of the front end of the movable inflation joint (252.2) is provided with a plurality of pin holes, and the pin holes are provided with guide positioning pins (252.3). The inner ends of the guide positioning pins (252.3) are connected to the guide limit joint (252.1), and the guide positioning pins (252.3) between the guide limit joint (252.1) and the front ends of the movable inflation joint (252.2) are covered with a compression spring B (252.4).

10. A wafer aging test device according to any one of claims 1 to 9, characterized in that: It also includes an equipment housing and a bracket therein, the wafer aging test benches (200) are multiple in number and are mounted on the bracket in an array, and the number of the wafer aging test fixtures (100) is greater than or equal to the number of the wafer aging test benches (200).

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