Image generation device and head-up display

Abstract

The embodiment of the invention provides an image generation device and a head-up display. The image generating device comprises an image processing module which comprises a heat dissipation module and an image modulation module, and the image modulation module is fixedly connected with the heat dissipation module; the image processing module is located on one side of the main body part, a first limiting part is formed on the main body part, a second limiting part is formed on the heat dissipation module, and the first limiting part and the second limiting part are matched so that a limiting space can be formed between the heat dissipation module and the main body part. At least part of the image modulation module is located in the defined space.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of display technology, and more specifically, to an image generating device and a head-up display. Background Art

[0002] As an advanced vehicle-mounted visual assistance system, HUD is mainly composed of three major components: the image generating unit (PGU), the free-form surface reflector system and the windshield.

[0003] The image generator is assembled from a series of optical structural parts. However, in the complex assembly process, the processing accuracy deviation of each part and the positioning error during assembly will continue to accumulate, forming a significant tolerance chain. This cumulative effect directly has a significant impact on the optical performance of the PGU.

[0004] In view of this, it is necessary to provide a new technical solution to solve the above technical problems. Summary of the invention

[0005] The purpose of this application is to provide a new technical solution for an image generating device and a head-up display.

[0006] In a first aspect, the present application provides an image generating device. The image generating device comprises:

[0007] An image processing module, comprising a heat dissipation module and an image modulation module, wherein the image modulation module is tightly connected to the heat dissipation module;

[0008] The main body, the image processing module is located on one side of the main body, the main body is formed with a first limiting component, the heat dissipation module is formed with a second limiting component, the first limiting component and the second limiting component cooperate to form a limited space between the heat dissipation module and the main body, and at least a part of the image modulation module is located in the limited space.

[0009] Optionally, the first limiting portion includes an extension portion extending from the main body toward the heat dissipation module, and a limiting groove is provided on a surface of the extension portion opposite to the heat dissipation module;

[0010] The second limiting portion is a protruding portion extending from the heat dissipation module toward the main body, and the protruding portion is embedded in the limiting groove.

[0011] Optionally, the image modulation module includes a circuit board, the circuit board is located in the limited space, and the circuit board is connected to the heat dissipation module via a fastener;

[0012] At least a portion of the end of the circuit board is recessed to form a relief portion, and at least a portion of the extension portion is located in the relief portion.

[0013] Optionally, the image modulation module includes a circuit board, the circuit board is located in the limited space, the circuit board is connected to the heat dissipation module via a fastener, and an elastic component is provided between the circuit board and the heat dissipation module.

[0014] Optionally, a receiving hole is formed on a surface of the heat dissipation module facing the circuit board, and at least a portion of the elastic component is located in the receiving hole; and the circuit board abuts against the elastic component.

[0015] Optionally, the image modulation module further comprises an image processing chip, at least part of which is located in the limited space, and the image processing chip is arranged on the circuit board and electrically connected to the circuit board;

[0016] The circuit board is provided with a through hole, and at least a portion of the image processing chip corresponds to the through hole; the image modulation module also includes a heat-conducting component, one side of the heat-conducting component is in contact with the image processing chip corresponding to the through hole, and the other side is in contact with the heat dissipation module.

[0017] Optionally, a heat-conducting protrusion is formed on a surface of the heat dissipation module facing the circuit board, at least a portion of the heat-conducting protrusion is located in the through hole, and the other side of the heat-conducting component is in contact with the heat-conducting protrusion.

[0018] Optionally, the image modulation module further includes a first elastic sealing portion, wherein the first elastic sealing portion is sleeved outside the heat-conducting protrusion, and at least a portion of the circuit board abuts against the first elastic sealing portion.

[0019] Optionally, the image modulation module further includes a second elastic sealing portion, and the second elastic sealing portion is located between the circuit board and the image processing chip.

[0020] Optionally, the image generating device further comprises an illumination module, and the illumination module comprises at least one illumination module;

[0021] The lighting module includes a fixed bracket, and a light source, a collimating lens group and a beam splitting reflector arranged in sequence along the light transmission direction;

[0022] The light source, the collimating lens group and the beam splitting reflector are all arranged on the fixing bracket.

[0023] Optionally, the fixing bracket includes:

[0024] A mounting panel, wherein the light source is arranged on the mounting panel;

[0025] Two mounting brackets, the two mounting brackets are spaced apart along a first direction and are both connected to the mounting panel, each mounting bracket is formed with a step surface, and the collimating lens group is arranged on the step surface;

[0026] Each of the mounting brackets is formed with a bearing inclined surface, and the beam splitting reflector is arranged on the bearing inclined surface; the first direction is a direction perpendicular to the light transmission direction.

[0027] Optionally, the lighting module includes at least two lighting modules, at least two lighting modules are arranged along the first direction, and mounting panels of at least two lighting modules are in the same plane.

[0028] In a second aspect, an embodiment of the present application further provides a head-up display, wherein the head-up display comprises the image generating device as described in the first aspect.

[0029] According to the embodiments of the present application, limiting components are formed on the heat dissipation module and the main body, and a limited space of a fixed area is defined by the cooperation of the two limiting components. When assembling other components of the image generating device (especially the image modulation module), the other components of the image generating device are all confined within the limited space, which can limit the movement or deflection of other components (especially the image modulation module) during the installation process, thereby improving the installation accuracy, reducing the cumulative error, and improving the display quality of the image generating device.

[0030] Other features and advantages of the present specification will become apparent from the following detailed description of exemplary embodiments of the present specification with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the specification and, together with the description, serve to explain the principles of the specification.

[0032] Figure 1 Shown is a structural diagram of an image generating device provided in an embodiment of the present application.

[0033] Figure 2 The figure shows the decomposition of part of the structure of the image generating device provided in the embodiment of the present application. Figure 1 .

[0034] Figure 3 Shown is a schematic diagram of the connection structure between the heat dissipation module and the main body provided in an embodiment of the present application.

[0035] Figure 4 The figure shows the decomposition of part of the structure of the image generating device provided in the example of the present application. Figure 2 .

[0036] Figure 5Shown is a structural diagram of a lighting module provided in an embodiment of the present application.

[0037] Description of reference numerals:

[0038] 1. Image processing module; 11. Heat dissipation module; 111. Heat-conducting protrusion; 112. Accommodating hole; 113. Second limiting component; 12. Image modulation module; 121. Circuit board; 1210. Through hole; 122. Image processing chip; 13. Elastic component; 14. Heat-conducting component; 15. First elastic sealing part; 16. Second elastic sealing part;

[0039] 2. Main body; 21. First limiting component;

[0040] 3. Lighting module; 31. Lighting module; 311. Light source; 312. Collimating lens group; 313. Beam splitting reflector; 30. Fixing bracket; 301. Mounting panel; 302. Mounting bracket;

[0041] 4. Projection lens;

[0042] 5. Lighting modulation module. DETAILED DESCRIPTION

[0043] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0044] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0045] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0046] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0047] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0048] The present application embodiment provides an image generating device. The image generating device may adopt one of the DLP solution, the LCOS solution or the LBS solution. Taking the image generating device as the DLP solution as an example, refer to Figure 1The image generating device is mainly composed of an illumination module 3, an illumination modulation module 5 (a light homogenizing element, a reflective element, a lens group and a color combining prism), a DLP image processing module 1, a projection lens 4 and a main body 2. The illumination modulation module 5 is located in the main body 2. The light homogenizing element, the reflective element, the lens group and the color combining prism are used to homogenize and combine the collimated light emitted by the illumination module 3. The DLP image processing module 1 is used to receive the light after color combination for display. The projection lens 4 is used to project the light emitted by the DLP image processing module 1 onto a display surface to form a projection picture.

[0049] Exemplarily, the light homogenizing element may be a fly-eye lens or a light rod.

[0050] For example, the prism may be an RTIR / TIR prism, and the image generating device may adopt a DLP solution, or the prism may be a PBS prism, and the image generating device may adopt an LCOS solution.

[0051] In the existing DLP image generation device structure, the various components in the DLP image processing module are assembled together only by fasteners such as screws, without avoiding the processing errors of the various components and the cumulative errors of the installation. This will cause problems such as skewed installation of the DMD or poor contact.

[0052] Based on the above technical problems, an embodiment of the present application provides an image generating device, in which the heat dissipation module 11 in the image processing module 1 and the main body 2 of the image generating device are installed together through a limiting structure, so that the heat dissipation module 11 and the main body 2 cooperate with each other through the limiting structure to jointly construct a limited space. Within this defined limited space, each component of the image generating device is constrained. Such a layout not only optimizes the dimensional chain management during the installation process, but also effectively reduces the installation error, thereby significantly improving the overall installation accuracy and stability of the image generating device.

[0053] Reference Figure 2 and Figure 3 The image generating device comprises: an image processing module 1 and a main body 2. The image processing module 1 comprises a heat dissipation module 11 and an image modulation module 12, and the image modulation module 12 is fastened to the heat dissipation module 11. The image processing module 1 is located at one side of the main body 2, the main body 2 is formed with a first limiting component 21, and the heat dissipation module 11 is formed with a second limiting component 113, the first limiting component 21 and the second limiting component 113 cooperate to form a limited space between the heat dissipation module 11 and the main body 2, and at least part of the image modulation module 12 is located in the limited space.

[0054] In the embodiments of this application, refer to Figure 2The image generating device includes an image processing module 1, and the image processing module 1 includes a heat dissipation module 11 and an image modulation module 12, and the image modulation module 12 is tightly connected to the heat dissipation module 11. The main function of the heat dissipation module 11 is to ensure that the heat in the image processing process is effectively dissipated to prevent overheating from damaging the performance of the device. The image modulation module 12 is responsible for modulating the corresponding image signal according to the processed image data for subsequent display. Based on the function of the image modulation module 12, the embodiment of the present application particularly emphasizes that during the installation process of the image generating device, it is necessary to confine the image modulation module 12 within the limited space to ensure the installation accuracy of the image modulation module 12.

[0055] Exemplarily, the image modulation module 12 and the heat dissipation module 11 may be connected by a fastener, such as a screw.

[0056] Reference Figure 1 , the image processing module 1 is located on one side of the main body 2 so as to receive the light after color combination for display. Exemplarily, the illumination modulation module 5 (light homogenizing element, reflective element, lens group and color combination prism) can be arranged inside the main body 2, and the illumination modulation module 5 receives the collimated light emitted by the illumination module 3 and modulates the collimated light. The illumination modulation module 5 is located inside the main body 2 and the image processing module 1 is located on one side of the main body 2, so that the image processing module 1 can receive light.

[0057] In the embodiments of this application, refer to Figure 3 In order to ensure the installation accuracy of each component inside the image generating device, especially the precise assembly of the image modulation module 12 in the image processing module 1, a first limiting component 21 is designed on the main body 2, and a second limiting component 113 is correspondingly configured on the heat dissipation module 11. These two sets of limiting components cooperate to jointly define a limited space of a fixed area between the heat dissipation module 11 and the main body 2. When other key components of the image generating device (excluding the heat dissipation module 11 itself) are firmly connected to the heat dissipation module 11 through fasteners, these components, especially at least part of the image modulation module 12, will be constrained in the limited space of this fixed area, thereby ensuring high-precision assembly and stable operation of the entire device.

[0058] Specifically, the limited space provides a clear installation position and range for the image modulation module 12, limiting its movement and deflection during installation. By designing the limiting components, it can be ensured that the image modulation module 12 can be quickly and accurately positioned to the predetermined position during installation, reducing errors caused by installation or adjustment.

[0059] In a complex assembly process, the installation errors of each component may accumulate, resulting in a decrease in the overall accuracy of the final device. When other key components of the image generating device (excluding the heat dissipation module 11 itself) are confined within a limited space, the accumulated errors caused by improper installation can be effectively reduced, thereby improving the accuracy and stability of the entire image generating device.

[0060] In a specific example of installing the image generating device, a pre-tightening step is first taken to preliminarily fix the various components in the device together. Subsequently, the heat dissipation module 11 and the main body 2 are assembled together by using two limiting components between the heat dissipation module 11 and the main body 2, namely the first limiting component 21 and the second limiting component 113, so as to construct a precise defined space. In this defined space, all key components of the image generating device except the heat dissipation module 11 are firmly accommodated and defined.

[0061] Next, fasteners are used to further strengthen the stability of the entire device, firmly fastening all components together. This step not only enhances the overall structural strength of the device, but also significantly reduces the cumulative error that may occur during the installation process through the dual constraints of fasteners and limited space. Such a design not only improves the accuracy of installation, but also ensures the stability and reliability of the image generating device in long-term use.

[0062] Therefore, in the embodiment of the present application, a limiting component is formed on the heat dissipation module 11 and the main body 2, and a limited space of a fixed area is defined by the cooperation of the two limiting components. When assembling other components of the image generating device (especially the image modulation module 12), the other components of the image generating device are all confined within the limited space, which can limit the movement or deflection of other components (especially the image modulation module 12) during the installation process, thereby improving the installation accuracy, reducing the cumulative error, and improving the display quality of the image generating device.

[0063] In a specific embodiment, referring to Figure 3 The first limiting portion includes an extension portion extending from the main body 2 toward the heat dissipation module 11, and a limiting groove is provided on the surface of the extension portion opposite to the heat dissipation module 11; the second limiting portion is a protrusion extending from the heat dissipation module 11 toward the main body 2, and the protrusion is embedded in the limiting groove.

[0064] In this embodiment, when the heat dissipation module 11 is assembled with the main body 2, the protrusion will naturally slide into the limiting groove to form a tight and stable connection. This connection not only ensures the relative position accuracy between the heat dissipation module 11 and the main body 2, but also effectively prevents looseness or displacement that may occur during use.

[0065] In a specific example of installing the image generating device, firstly, the various components of the device are preliminarily fastened by fasteners to ensure that the relative positions between them are initially stable. Then, the main body 2 is operated to move it toward the heat dissipation module 11. In this process, the extension portion designed on the main body 2 gradually approaches the heat dissipation module 11 until the limiting groove on it perfectly matches the protruding portion protruding from the heat dissipation module 11, that is, the protruding portion is embedded in the limiting groove.

[0066] At this time, the main body 2 and the heat dissipation module 11 have been installed in place and together form a structure with a limited space. In this limited space, other key components of the image generating device (except the heat dissipation module 11) are all accommodated and fixed.

[0067] Finally, we once again use fasteners to finally fasten the various components of the image generating device to ensure that the connection between them is both firm and stable.

[0068] It should be noted that the structures of the first limiting component 21 and the second limiting component 113 include but are not limited to the structures defined above. Those skilled in the art can adjust the structures of the first limiting component 21 and the second limiting component 113 according to the specific structures and setting positions of the heat dissipation module 11 and the main body 2.

[0069] In one embodiment, referring to Figure 1 and Figure 2 , the image modulation module 12 includes a circuit board 121, the circuit board 121 is located in the limited space, and the circuit board 121 is connected to the heat dissipation module 11 through a fastener;

[0070] At least a portion of the end of the circuit board 121 is recessed to form a relief portion, and at least a portion of the extension portion is located in the relief portion.

[0071] In this embodiment, the image modulation module 12 includes a circuit board 121, and the circuit board 121 and the heat dissipation module 11 are connected together by fasteners. For example, the fasteners may be screws or the like.

[0072] During the assembly of the image generating device, the circuit board 121 is located within the limited space defined by the heat dissipation module 11 and the main body 2, which not only optimizes the internal layout of the device, but also effectively controls and limits the processing error of the circuit board 121, thereby ensuring its reliability during the assembly process.

[0073] In addition, in order to ensure that the two limiting components on the main body 2 and the heat dissipation module 11 can be smoothly matched, at least a portion of the end of the circuit board 121 is designed to be concave, forming an escape portion. In this way, at least a portion of the extension portion can be embedded in the escape portion, thereby ensuring the matching accuracy of the limiting components and avoiding interference between the circuit board 121 and the limiting components, thereby ensuring the compactness of the structure of the entire image generating device and the reliability of its functions.

[0074] In one embodiment, referring to Figure 1 and Figure 2 The image modulation module 12 includes a circuit board 121, which is located in the limited space. The circuit board 121 is connected to the heat dissipation module 11 through a fastener, and an elastic component 13 is arranged between the circuit board 121 and the heat dissipation module 11.

[0075] In this embodiment, the circuit board 121 is not only tightly connected to the heat dissipation module 11 through fasteners, but also an elastic component 13 is arranged between them. In this way, the buffering effect of the elastic component 13 is utilized to effectively reduce the installation error, thereby ensuring the installation stability and use reliability of the image modulation module 12.

[0076] Specifically, during the installation process, due to various factors (such as processing accuracy, assembly process, etc.), there will be certain installation errors or stress concentration between the circuit board 121 and the heat dissipation module 11. The elastic component 13 can effectively buffer and absorb these stresses, thereby reducing the installation errors caused by stress concentration.

[0077] In addition, the circuit board 121 is confined within a limited space in a fixed area, and the elastic component 13 is also confined within the limited space. For example, the compression amount of the elastic component 13 can press the circuit board 121 to reduce problems such as poor display of the image generating device.

[0078] Exemplarily, the elastic component 13 includes but is not limited to a spring, an elastic rubber block or a metal spring.

[0079] In a specific embodiment, referring to Figure 2 A receiving hole 112 is formed on a surface of the heat dissipation module 11 facing the circuit board 121 , and at least a portion of the elastic component 13 is located in the receiving hole 112 ; the circuit board 121 abuts against the elastic component 13 .

[0080] In this embodiment, the heat dissipation module 11 has a receiving hole 112 on its surface facing the circuit board 121, and the receiving hole 112 can be a countersunk hole. The shape and size of these receiving holes 112 match the elastic component 13 to ensure that the receiving hole 112 and the elastic component 13 can cooperate. In actual installation, at least a part of the elastic component 13 will be embedded in the receiving hole 112 to form a stable and elastic connection structure. Exemplarily, one end of the elastic component 13 can be fixed in the receiving hole 112.

[0081] During the assembly process of the circuit board 121, the circuit board 121 is tightly abutted against the elastic components 13. Through the buffering effect of the elastic components 13, the installation error of the circuit board 121 can be adjusted, the installation error is effectively reduced, and the display effect of the image generating device is improved.

[0082] In a further embodiment, referring to Figure 2 , the image modulation module 12 further includes an image processing chip 122, at least part of the image processing chip 122 is located in the limited space, and the image processing chip 122 is arranged on the circuit board 121 and electrically connected to the circuit board 121;

[0083] The circuit board 121 is provided with a through hole 1210, and at least a portion of the image processing chip 122 corresponds to the through hole 1210; the image modulation module 12 also includes a heat-conducting component 14, one side of the heat-conducting component 14 is in contact with the image processing chip 122 corresponding to the through hole 1210, and the other side is in contact with the heat dissipation module 11.

[0084] In this embodiment, the image modulation module 12 not only includes a circuit board 121, but also further integrates an image processing chip 122. The image processing chip 122 is disposed on the circuit board 121 and electrically connected to the circuit board 121, so as to be able to process image data efficiently.

[0085] In order to further optimize the thermal management performance of the image modulation module 12, through holes 1210 are specially provided on the circuit board 121. The positions of these through holes 1210 correspond to a part of the area of ​​the image processing chip 122, which facilitates the subsequent heat dissipation design.

[0086] On this basis, a heat conducting component 14 is introduced. One side of the heat conducting component 14 is in close contact with the portions of the image processing chip 122 corresponding to the through holes 1210, ensuring efficient heat conduction. The other side forms a stable contact with the heat dissipation module 11, quickly dissipating the heat generated by the image processing chip 122.

[0087] In this embodiment, not only the heat conduction efficiency of the image modulation module 12 is significantly improved, but also the operating temperature of the image processing chip 122 is effectively reduced, thereby extending its service life and improving the performance and stability of the overall image processing.

[0088] Exemplarily, the heat-conducting component 14 is a heat-conducting silicone rubber. The heat-conducting silicone rubber serves as a connecting bridge between the image processing chip 122 and the heat dissipation module 11, and the heat-conducting silicone rubber is also confined within a limited space, so that the image processing chip 122 can press the heat-conducting silicone rubber, while reducing the installation error between the image modulation module 12 and the heat dissipation module 11, and can also improve the heat conduction efficiency.

[0089] For example, refer to Figure 3 At least a portion of the image processing chip 122 is located in the limited space, and an avoidance hole is opened at a position corresponding to the main body and the image processing chip 122, and another portion of the image processing chip 122 is located in the avoidance hole. In this way, while reducing installation errors, stress concentration on the image processing chip 122 is avoided to damage the chip. In addition, a portion of the image processing chip 122 is located in the avoidance hole, which facilitates the image processing chip 122 to transmit light to the projection lens 4.

[0090] In another specific embodiment, referring to Figure 2 In order to facilitate the contact between the other side of the heat-conducting component 14 and the heat dissipation module 11, a heat-conducting protrusion 111 is formed on the surface of the heat-conducting module 11 facing the circuit board 121, and at least a portion of the heat-conducting protrusion 111 is located in the through hole 1210, and the other side of the heat-conducting component 14 is in contact with the heat-conducting protrusion 111.

[0091] In this embodiment, the heat conduction path of the image modulation module 12 is further optimized. To ensure that the other side of the heat conduction component 14 can achieve closer and more effective contact with the heat dissipation module 11, a heat conduction protrusion 111 is provided on the surface of the heat dissipation module 11 facing the circuit board 121.

[0092] Exemplarily, the shape and size of the heat-conducting protrusion 111 match the through hole 1210 provided on the circuit board 121, so as to ensure that the heat-conducting protrusion 111 can be embedded in the corresponding through hole 1210 on the circuit board 121. In addition, the material of the heat-conducting protrusion 111 can also be selected from materials with high thermal conductivity, thereby maximizing the heat conduction efficiency.

[0093] During the actual installation process, one side of the heat-conducting component 14 is in close contact with the image processing chip 122, while the other side forms a stable contact with the heat-conducting protrusion 111 on the heat-dissipating module 11. This design not only ensures that the heat can be quickly transferred from the image processing chip 122 to the heat-dissipating module 11 through the heat-conducting component 14, but also guides the heat-conducting protrusion 111 so that the heat can be more evenly distributed on the surface of the heat-dissipating module 11, thereby improving the overall heat dissipation effect.

[0094] In addition, during the installation process of the image modulation module 12, the heat-conducting protrusion 111 is embedded in the through hole 1210, which can ensure the installation accuracy of both the image modulation module 12 and the heat dissipation module 11 to a certain extent and reduce the installation error. In addition, the heat-conducting protrusion 111 is embedded in the through hole 1210, which increases the structural stability of the image modulation module 12 to a certain extent and reduces the risk of loose connection or damage caused by factors such as vibration or impact.

[0095] In one embodiment, referring to Figure 2 The image modulation module 12 further includes a first elastic sealing portion 15 , which is sleeved outside the heat-conducting protrusion 111 , and at least a portion of the circuit board 121 abuts against the first elastic sealing portion 15 .

[0096] In this embodiment, the first elastic sealing part 15 is sleeved outside the heat conductive protrusion 111 and is located between the heat dissipation module 11 and the circuit board 121. The first elastic sealing part 15 seals the heat dissipation module 11 and the circuit board 121. Exemplarily, the first elastic sealing part 15 is a sealing foam.

[0097] During the installation of the image generating device, the circuit board 121 and the first elastic sealing portion 15 are both placed in the limited space formed by the heat dissipation module 11 and the main body 2. This not only ensures that the circuit board 121 can be closely attached to and appropriately compress the first elastic sealing portion 15, but also utilizes the compression and rebound characteristics of the first elastic sealing portion 15, thereby effectively compensating for and optimizing the possible installation deviation and processing accuracy error between the circuit board 121 and the heat dissipation module 11.

[0098] In one embodiment, referring to Figure 2 The image modulation module 12 further includes a second elastic sealing portion 16 , and the second elastic sealing portion 16 is located between the circuit board 121 and the image processing chip 122 .

[0099] In this embodiment, a second elastic sealing portion 16 is provided between the circuit board 121 and the image processing chip 122, and the second elastic sealing portion 16 seals the circuit board 121 and the image processing chip 122. For example, the second elastic sealing portion 16 is a sealing foam.

[0100] During the installation of the image generating device, the circuit board 121 and the image processing chip 122 are both placed in the limited space formed by the heat dissipation module 11 and the main body 2. This not only ensures that the image processing chip 122 can be closely attached to and appropriately compress the second elastic sealing portion 16, but also utilizes the compression and rebound characteristics of the second elastic sealing portion 16, thereby effectively compensating for and optimizing the possible installation deviation and processing accuracy error between the circuit board 121 and the image processing chip 122.

[0101] In one embodiment, referring to Figure 4 and Figure 5 , the image generating device further comprises an illumination module 3, the illumination module 3 comprises at least one illumination module 31;

[0102] The lighting module 31 includes a fixing bracket 30, and a light source 311, a collimating lens group 312 and a beam splitting reflector 313 arranged in sequence along the light transmission direction;

[0103] The light source 311 , the collimating lens group 312 and the beam splitting reflector 313 are all disposed on the fixing bracket 30 .

[0104] In this embodiment, the image generating device includes at least one lighting module 3, for example, the image generating device may include one lighting module 31, or two lighting modules 31, or three lighting modules 31. The lighting modules 31 in the image generating device are all split modules.

[0105] Each lighting module 31 integrates three major components: a light source 311, a collimator lens group 312, and a beam splitter reflector 313, all of which are mounted on the same fixed bracket 30. Specifically, by controlling the machining accuracy of the fixed bracket 30, we can achieve precise positioning of the light source 311, the collimator lens group 312, and the beam splitter reflector 313 on the same bracket, thereby ensuring that they can be coaxially arranged. This not only improves the convenience of assembly, but also effectively reduces the tolerance accumulation problem that may arise between multiple independent components by unifying them in one fixed bracket 30, thereby optimizing the overall optical performance and assembly accuracy.

[0106] In addition, by controlling the processing accuracy of the single fixed bracket 30, the light source 311, the collimating lens group 312 and the beam splitting reflector 313 are integrated on the bracket, so that the coaxial arrangement of the three is achieved. This ensures that the light emitted by the lighting module 3 can enter the light homogenization system with the highest efficiency, thereby significantly improving the light homogenization effect and optimizing the distribution and uniformity of the light.

[0107] Exemplarily, the light source 311 may be a red light source 311 , a blue light source 311 , or a green light source 311 .

[0108] Exemplarily, the light source 311 may be an LED light source 311 or an LCD light source 311 .

[0109] Exemplarily, the collimating lens assembly 312 includes a first collimating lens and a second collimating lens.

[0110] In one embodiment, referring to Figure 5 The fixed bracket 30 includes: a mounting panel 301, the light source 311 is arranged on the mounting panel 301; two mounting brackets 302, the two mounting brackets 302 are arranged at intervals along the first direction and are both connected to the mounting panel 301, each of the mounting brackets 302 is formed with a step surface, the collimating lens group 312 is arranged on the step surface; each of the mounting brackets 302 is formed with a bearing inclined surface, the splitter reflector 313 is arranged on the bearing inclined surface; the first direction is a direction perpendicular to the light transmission direction.

[0111] In this embodiment, the fixing bracket 30 is mainly composed of a mounting panel 301 and two mounting brackets 302. The mounting panel 301 is used to fix and install the light source 311, ensuring that the light source 311 can be stably installed and emit light. The two mounting brackets 302 are spaced apart along a first direction perpendicular to the light transmission direction, and they are both reliably connected to the mounting panel 301. This not only ensures the stability of the structure, but also facilitates the installation and positioning of subsequent components.

[0112] A step surface is designed on each mounting bracket 302. The step surface is specifically used to install the collimating lens group 312, ensuring that the collimating lens group 312 can be accurately placed at a predetermined position, thereby achieving effective collimation of light.

[0113] In addition, each mounting bracket 302 is also provided with a bearing inclined surface. This bearing inclined surface is specially designed for mounting the beam splitting reflector 313. The beam splitting reflector 313 can be stably placed on the bearing inclined surface and the angle can be adjusted as needed to achieve the reflection and beam splitting functions of the light.

[0114] Through such a structural design, it is ensured that the light source 311, the collimating lens group 312 and the beam splitting reflector 313 can be stably and accurately mounted on the fixed bracket 30, and the relative position relationship between them is effectively controlled, avoiding the image projected by the image generating device from having insufficient brightness and dark corners.

[0115] In one embodiment, referring to Figure 5The lighting module 3 includes at least two lighting modules 31, at least two lighting modules 31 are arranged along the first direction, and the mounting panels 301 of at least two lighting modules 31 are in the same plane.

[0116] In this embodiment, each lighting module 31 includes a mounting panel 301, and the mounting panels 301 of all these lighting modules 31 are on the same plane. This ensures that the light emitted by each lighting module 31 can be superimposed and mixed on the same horizontal plane, thereby further improving the lighting effect and light uniformity of the entire lighting module 3.

[0117] The embodiment of the present application also provides a head-up display. The head-up display includes the image generating device as described above. The image generating device provided in the embodiment of the present application is used in the head-up display, which can improve the installation accuracy of the head-up display and ensure the picture quality of the image projected by the head-up display.

[0118] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0119] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. An image generating device, characterized in that: include: An image processing module (1) comprises a heat dissipation module (11) and an image modulation module (12), wherein the image modulation module (12) is firmly connected to the heat dissipation module (11); A main body (2), the image processing module (1) is located on one side of the main body (2), the main body (2) is formed with a first limiting component (21), the heat dissipation module (11) is formed with a second limiting component (113), the first limiting component (21) and the second limiting component (113) cooperate to form a limited space between the heat dissipation module (11) and the main body (2), and at least a part of the image modulation module (12) is located in the limited space.

2. The image generating device according to claim 1, characterized in that: The first limiting portion comprises an extension portion extending from the main body (2) towards the heat dissipation module (11), and a limiting groove is provided on a surface of the extension portion opposite to the heat dissipation module (11); The second limiting portion is a protruding portion extending from the heat dissipation module (11) toward the main body (2), and the protruding portion is embedded in the limiting groove.

3. The image generating device according to claim 2, characterized in that: The image modulation module (12) comprises a circuit board (121), the circuit board (121) is located in the limited space, and the circuit board (121) is connected to the heat dissipation module (11) via a fastener; At least a portion of the end of the circuit board (121) is recessed to form an escape portion, and at least a portion of the extension portion is located in the escape portion.

4. The image generating device according to claim 1, characterized in that: The image modulation module (12) comprises a circuit board (121), the circuit board (121) is located in the limited space, the circuit board (121) is connected to the heat dissipation module (11) via a fastener, and an elastic component (13) is provided between the circuit board (121) and the heat dissipation module (11).

5. The image generating device according to claim 4, characterized in that: A receiving hole (112) is formed on the surface of the heat dissipation module (11) facing the circuit board (121); at least a portion of the elastic component (13) is located in the receiving hole (112); and the circuit board (121) abuts against the elastic component (13).

6. The image generating device according to claim 4, characterized in that: The image modulation module (12) further comprises an image processing chip (122), at least a portion of the image processing chip (122) is located within the limited space, and the image processing chip (122) is arranged on the circuit board (121) and is electrically connected to the circuit board (121); The circuit board (121) is provided with a through hole (1210), and at least a portion of the image processing chip (122) corresponds to the through hole (1210); the image modulation module (12) further comprises a heat-conducting component (14), one side of the heat-conducting component (14) is in contact with the image processing chip (122) corresponding to the through hole (1210), and the other side is in contact with the heat dissipation module (11).

7. The image generating device according to claim 6, characterized in that: A heat-conducting protrusion (111) is formed on the surface of the heat dissipation module (11) facing the circuit board (121), at least a portion of the heat-conducting protrusion (111) is located in the through hole (1210), and the other side of the heat-conducting component (14) is in contact with the heat-conducting protrusion (111).

8. The image generating device according to claim 7, characterized in that: The image modulation module (12) further comprises a first elastic sealing portion (15), wherein the first elastic sealing portion (15) is sleeved outside the heat-conducting protrusion (111), and at least a portion of the circuit board (121) abuts against the first elastic sealing portion (15).

9. The image generating device according to claim 6, characterized in that: The image modulation module (12) further comprises a second elastic sealing portion (16), wherein the second elastic sealing portion (16) is located between the circuit board (121) and the image processing chip (122).

10. The image generating device according to any one of claims 1 to 9, characterized in that: The image generating device further comprises an illumination module (3), wherein the illumination module (3) comprises at least one illumination module (31); The lighting module (31) comprises a fixed bracket (30), and a light source (311), a collimating lens group (312) and a beam splitting reflector (313) arranged in sequence along the light transmission direction; The light source (311), the collimating lens group (312) and the beam splitting reflector (313) are all arranged on the fixed bracket (30).

11. The image generating device according to claim 10, characterized in that: The fixing bracket (30) comprises: A mounting panel (301), wherein the light source (311) is arranged on the mounting panel (301); Two mounting brackets (302), the two mounting brackets (302) are arranged at intervals along a first direction and are both connected to the mounting panel (301), each mounting bracket (302) is formed with a step surface, and the collimating lens group (312) is arranged on the step surface; Each of the mounting brackets (302) is formed with a bearing inclined surface, and the beam splitting reflector (313) is arranged on the bearing inclined surface; the first direction is a direction perpendicular to the light transmission direction.

12. The image generating device according to claim 11, characterized in that: The lighting module (3) comprises at least two lighting modules (31), the at least two lighting modules (31) are arranged along the first direction, and the mounting panels (301) of the at least two lighting modules (31) are located in the same plane.

13. A head-up display, characterized in that: The head-up display comprises an image generating device as claimed in any one of claims 1-12.

Images