Coil electronic component

Abstract

The invention provides a coil electronic component. The coil electronic component includes: a body; a coil embedded in the main body; an insulating layer disposed on one surface of the main body; a first conductive layer covering a portion of the one surface and covering a portion of the insulating layer; a second conductive layer covering another portion of the one surface and covering a portion of the insulating layer; and first and second external electrodes covering the first and second conductive layers, respectively. The coil electronic component has a first length in a first direction. The second length is the sum of a third length of an overlapped area of the insulating layer, the first conductive layer and the first external electrode in the first direction and a fourth length of an overlapped area of the insulating layer, the second conductive layer and the second external electrode in the first direction, L1 is the first length, L2 is the second length, L3 is the third length, and L4 is the second length. And L4 is the fourth length. The ratio L2 / L1 is larger than or equal to 0.3 and smaller than or equal to 0.7.

Description

Technical Field

[0001] The present disclosure relates to a coil electronic assembly. Background Art

[0002] In recent years, as the functions of mobile devices have diversified, power consumption has increased. For this reason, coil electronic components with low loss and high efficiency have been adopted around power management integrated circuits (PMICs) in order to increase the battery life in mobile devices.

[0003] There is a growing demand for thin inductors (power inductors) to make products thinner and increase the freedom of component layout. However, in this case, an increase in current leakage and a decrease in breakdown voltage (BDV) may occur. If the surface of the outer electrode is not flat or sufficient mold underfill (MUF) clearance is not ensured, it may be difficult to achieve mounting stability. Summary of the invention

[0004] The present disclosure seeks to provide a coil electronics assembly having an improved breakdown voltage (BDV).

[0005] Furthermore, the present disclosure seeks to provide a coil electronics assembly with improved electrode flatness and sufficient MUF clearance.

[0006] However, the objects that the present disclosure attempts to achieve are not limited to the above objects, and various extensions may be made without departing from the technical spirit and scope of the present disclosure.

[0007] The coil electronic component according to the embodiment may include: a body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other and connecting the first surface and the second surface in a second direction, and a fifth surface and a sixth surface opposite to each other and connecting the first surface and the second surface in a third direction, and the body includes a magnetic material; a coil, at least a portion of which is embedded in the body; an insulating layer provided on the sixth surface of the body; a first conductive layer covering the sixth surface between the insulating layer and the first surface of the body and covering a portion of the insulating layer; a second conductive layer covering the sixth surface between the insulating layer and the second surface of the body and covering a portion of the insulating layer; a first external electrode covering the first conductive layer; and a second external electrode covering the second conductive layer. The coil electronic component may have a first length L1 in the first direction, and a second length L2 is the sum of a third length L3 of an area where the insulating layer, the first conductive layer, and the first external electrode overlap in the first direction and a fourth length L4 of an area where the insulating layer, the second conductive layer, and the second external electrode overlap in the first direction. The ratio L2 / L1 may be greater than or equal to 0.3 and less than or equal to 0.7.

[0008] In addition, the insulating layer may be spaced apart from the first surface and the second surface of the body, respectively.

[0009] Furthermore, the first conductive layer and the second conductive layer may be spaced apart from each other, the first conductive layer may cover a portion of a surface of the insulating layer close to the first surface, and the second conductive layer may cover a portion of a surface of the insulating layer close to the second surface.

[0010] In addition, the first external electrode may extend onto the first surface of the body and be connected to the coil, and the second external electrode may extend onto the second surface of the body and be connected to the coil.

[0011] Furthermore, the coil may be a wound coil.

[0012] In addition, the coil electronic component may also include: a supporting member, which is arranged inside the main body and has a first supporting surface and a second supporting surface opposite to each other, and the coil may include a first coil pattern on the first supporting surface of the supporting member, a second coil pattern on the second supporting surface of the supporting member, and a via connecting the first coil pattern and the second coil pattern.

[0013] In addition, the body may include a laminated body in which a plurality of sheets are stacked, and the coil may include a plurality of coil patterns provided on each of the plurality of sheets and connected to each other.

[0014] In addition, at least one of the first external electrode and the second external electrode may include: a first metal layer covering a corresponding conductive layer of the first conductive layer and the second conductive layer; a second metal layer covering the first metal layer; and a third metal layer covering the second metal layer.

[0015] Furthermore, the first metal layer may include copper (Cu), the second metal layer may include nickel (Ni), and the third metal layer may include tin (Sn).

[0016] According to an embodiment, a coil electronic component may include: a main body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface and the second surface, and the main body includes a magnetic material; a coil, at least a portion of which is embedded in the main body; an insulating layer, which is arranged on the sixth surface of the main body; a conductive layer, which covers a portion of the insulating layer on the sixth surface and is spaced apart from the first surface and the second surface of the main body; and an external electrode, which covers a portion of the insulating layer and the conductive layer and is connected to the coil.

[0017] The coil electronic component may further include: another insulating layer disposed on the fifth surface of the body.

[0018] The another insulating layer and the insulating layer may be spaced apart from each other.

[0019] Among the first to sixth surfaces of the body, the conductive layer may be provided only on the sixth surface.

[0020] The conductive layer may be in contact with the sixth surface of the body.

[0021] The coil may include a lead-out portion extending to a corresponding surface of the first surface and the second surface, and the external electrode may extend from the sixth surface to the corresponding surface of the first surface and the second surface to contact the lead-out portion.

[0022] The external electrode may contact the lead-out portion, the conductive layer, and the insulating layer.

[0023] The external electrode may include: a first metal layer covering the first conductive layer; a second metal layer covering the first metal layer; and a third metal layer covering the second metal layer.

[0024] The first metal layer may include copper (Cu), the second metal layer may include nickel (Ni), and the third metal layer may include tin (Sn).

[0025] The conductive layer may include a portion disposed between the insulating layer and the external electrode to contact the insulating layer and the external electrode.

[0026] The conductive layer may include at least one of silver (Ag) particles, particles coated with silver (Ag), copper (Cu) particles, and silver (Ag) alloy particles.

[0027] According to the embodiment, a coil electronic component having an improved breakdown voltage (BDV) can be provided.

[0028] Furthermore, according to the embodiments, a coil electronic component having improved electrode flatness and a sufficient MUF gap can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a perspective view schematically showing a coil electronic component according to an embodiment.

[0030] Figure 2 It is along Figure 1 Schematic cross-sectional view taken along line II-II'.

[0031] Figure 3 is a perspective view schematically showing a coil electronic component according to another embodiment.

[0032] Figure 4 It is along Figure 3 Schematic cross-sectional view taken along line IV-IV' in FIG.

[0033] Figure 5 is a cross-sectional view schematically showing a coil electronic component according to still another embodiment. DETAILED DESCRIPTION

[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement them. The accompanying drawings and descriptions are considered to be illustrative and not restrictive in nature. Throughout the specification, the same reference numerals represent the same elements. In addition, some of the constituent elements in the accompanying drawings may be exaggerated, omitted or schematically shown, and the size of each constituent element does not fully reflect the actual size.

[0035] The accompanying drawings are provided to help easily understand the embodiments disclosed in this specification, and the technical spirit disclosed in this specification is not limited by the accompanying drawings, and it should be understood that the present invention includes all modifications, equivalents, and alternatives contained in the technical spirit and scope of the present invention.

[0036] Terms including ordinal numbers such as "first" and "second" are used to explain various constituent elements, but the constituent elements are not limited by the terms. These terms are only used to distinguish one constituent element from another constituent element.

[0037] Furthermore, it should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element, or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements. Furthermore, when an element is "on" a reference portion, the element is located above or below the reference portion, and does not necessarily mean that the element is "above" or "on" the reference portion in a direction opposite to the direction of gravity.

[0038] In the present application, it should be understood that the terms "include" and "have" are intended to specify the existence of the features, quantities, steps, operations, constituent elements, components or combinations thereof described in the specification, and do not exclude the possibility of pre-existing or adding one or more other features, quantities, steps, operations, constituent elements, components or combinations thereof. Therefore, unless explicitly described to the contrary, the word "include" and variations such as "include" or "comprising" will be understood to imply the inclusion of the elements but not the exclusion of any other elements.

[0039] Furthermore, throughout the specification, when referred to as “on a plane”, it means observing a target portion from above, and when referred to as “on a cross section”, it means observing a cross section obtained by vertically cutting the target portion from the side.

[0040] Furthermore, throughout the specification, when referred to as “connected,” this not only means that two or more constituent elements are directly connected, but may also mean that two or more constituent elements are indirectly connected, physically connected, electrically connected, or integrated through another constituent element, even if the two or more constituent elements are referred to by different names according to position and function.

[0041] Figure 1 is a perspective view schematically showing a coil electronic component according to an embodiment, and Figure 2 is along Figure 1 Schematic cross-sectional view taken along line II-II'.

[0042] Reference Figure 1 and Figure 2, the coil electronic component 1000 according to the embodiment includes a body 100 , a coil 200 , a support member 300 , an insulating layer 400 , a conductive layer 500 , a first external electrode 700 , and a second external electrode 800 .

[0043] The main body 100 may have a generally rectangular parallelepiped shape, but the present embodiment is not limited thereto. Due to the shrinkage of the magnetic powder during sintering, the main body 100 may have a generally rectangular parallelepiped shape, although not a perfect rectangular parallelepiped shape. For example, the main body 100 may have a generally rectangular parallelepiped shape, but with rounded edges or vertices.

[0044] In this embodiment, for the convenience of description, the two surfaces of the main body opposite to each other in the length direction (L-axis direction) are respectively defined as the first surface S1 and the second surface S2, the two surfaces of the main body opposite to each other in the width direction (W-axis direction) are respectively defined as the third surface S3 and the fourth surface S4, and the two surfaces of the main body opposite to each other in the thickness direction (T-axis direction) are respectively defined as the fifth surface S5 and the sixth surface S6.

[0045] The length of the coil electronic component 1000 may refer to: in an optical microscope photograph or SEM (scanning electron microscope) photograph of a cross section taken in the length direction (L axis direction) and the thickness direction (T axis direction) at the central portion of the coil electronic component 1000 in the width direction (W axis direction), the maximum value among the lengths of a plurality of line segments each connecting the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the length direction (L axis direction) and are parallel to the length direction (L axis direction). Alternatively, the length of the coil electronic component 1000 may refer to: in the above cross-sectional photograph, the minimum value among the lengths of a plurality of line segments each connecting the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the length direction (L axis direction) and are parallel to the length direction (L axis direction). Alternatively, the length of the coil electronic component 1000 may refer to: in the above-mentioned cross-sectional photograph, the arithmetic mean of the lengths of at least two of the multiple line segments that each connects the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the length direction (L-axis direction) and are parallel to the length direction (L-axis direction).

[0046] The thickness of the coil electronic component 1000 may refer to: in an optical microscope photograph or SEM (scanning electron microscope) photograph of a cross section taken in the length direction (L axis direction) and the thickness direction (T axis direction) at the central portion of the coil electronic component 1000 in the width direction (W axis direction), the maximum value among the lengths of a plurality of line segments each connecting the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the thickness direction (T axis direction) and are parallel to the thickness direction (T axis direction). Alternatively, the thickness of the coil electronic component 1000 may refer to: in the above cross-sectional photograph, the minimum value among the lengths of a plurality of line segments each connecting the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the thickness direction (T axis direction) and are parallel to the thickness direction (T axis direction). Alternatively, the thickness of the coil electronic component 1000 may refer to: in the above-mentioned cross-sectional photograph, the arithmetic mean of the lengths of at least two of the multiple line segments each connecting the two outermost boundary lines of the coil electronic component 1000 opposite to each other in the thickness direction (T-axis direction) and parallel to the thickness direction (T-axis direction).

[0047] The width of the coil electronic component 1000 may refer to: in an optical microscope photograph or SEM (scanning electron microscope) photograph of a cross section taken in the length direction (L axis direction) and the width direction (W axis direction) at the central portion of the coil electronic component 1000 in the thickness direction (T axis direction), the maximum value of the lengths of a plurality of line segments each connecting the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the width direction (W axis direction) and are parallel to the width direction (W axis direction). Alternatively, the width of the coil electronic component 1000 may refer to: in the above cross-sectional photograph, the minimum value of the lengths of a plurality of line segments each connecting the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the width direction (W axis direction) and are parallel to the width direction (W axis direction). Optionally, the width of the coil electronic component 1000 may refer to: in the above-mentioned cross-sectional photograph, the arithmetic mean of the lengths of at least two of the multiple line segments that each connects the two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the width direction (W-axis direction) and are parallel to the width direction (W-axis direction).

[0048] In addition, a micrometer measurement method can be used to measure each of the length, width, and thickness of the coil electronic component 1000. In the micrometer measurement method, a zero point is set with a micrometer that provides metrological repeatability and reproducibility (R&R), the coil electronic component 1000 according to the present embodiment is inserted between the tips of the micrometer, and the measuring rod of the micrometer is rotated for measurement. In addition, when the length of the coil electronic component 1000 is measured by the micrometer measurement method, the length of the coil electronic component 1000 may refer to a value obtained by a single measurement, or may refer to an arithmetic mean of values ​​obtained by multiple measurements. This measurement method may also be applied to measuring the width and thickness of the coil electronic component 1000.

[0049] The body 100 constitutes the appearance of the coil electronic component 1000 and has a space that forms a magnetic circuit that is a path through which magnetic flux induced by the coil 200 passes when current is applied to the coil 200 through the first and second external electrodes 700 and 800 .

[0050] The body 100 surrounds and encloses the coil 200 and the support member 300, and includes a magnetic material. The body 100 includes magnetic particles and an insulating material, wherein the magnetic particles are dispersed in the insulating material.

[0051] The magnetic particles may include first metal magnetic particles, second metal magnetic particles having a particle size larger than that of the first metal magnetic particles, and third metal magnetic particles having a particle size larger than that of the second metal magnetic particles. 50 The average particle size D of the second metal magnetic particles may be in the range of 0.1 μm to 0.2 μm. 50 The average particle size D of the third metal magnetic particles may be in the range of 1 μm to 2 μm. 50 It can be in the range from 25 μm to 30 μm.

[0052] The magnetic particles may be ferrite particles or metal magnetic particles that exhibit magnetism.

[0053] The ferrite particles may include, for example, at least one of spinel ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites and Ni-Zn-based ferrites), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites and Ba-Ni-Co-based ferrites), garnet-type ferrites (such as Y-based ferrites) and Li-based ferrites.

[0054] The metal magnetic particles may include two or more types of metal magnetic particles having different compositions, and may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic particles may be at least one of pure iron, Fe-Si-based alloys, Fe-Si-Al-based alloys, Fe-Ni-based alloys, Fe-Ni-Mo-based alloys, Fe-Ni-Mo-Cu-based alloys, Fe-Co-based alloys, Fe-Ni-Co-based alloys, Fe-Cr-based alloys, Fe-Cr-Si-based alloys, Fe-Si-Cu-Nb-based alloys, Fe-Ni-Cr-based alloys, and Fe-Cr-Al-based alloys. Here, metal magnetic particles of different compositions may also mean that the contents of the contained elements are different.

[0055] The metal magnetic particles may be amorphous or crystalline. For example, the metal magnetic particles may be Fe-Si-B-Cr based amorphous alloy, but the present embodiment is not limited thereto. The metal magnetic particles may have an average particle size of about 0.1 μm to 30 μm, but is not limited thereto. In this specification, the average particle size may be referred to as D 90 , D 50 The particle size distribution is well known to those skilled in the art and is an indicator of the proportion of particles of a certain size (particle diameter) contained in the particle group to be measured. 50 (The particle size corresponding to 50% of the cumulative volume of the particle size distribution) means the average particle size.

[0056] The metal magnetic particles may be two or more types of different metal magnetic particles. Here, different types of metal magnetic particles means that the metal magnetic particles are distinguished from each other in at least one of average particle size, composition, composition ratio, crystallinity and shape.

[0057] The insulating material may include epoxy resin, polyimide, liquid crystal polymer, etc., alone or in combination, but is not limited thereto.

[0058] The method of forming the body 100 is not particularly limited. For example, the body 100 may be formed by placing sheets including a magnetic material on the upper and lower portions of the coil 200 and then pressing and curing the sheets.

[0059] The support member 300 is disposed inside the body 100 , and supports the coil 200 .

[0060] The support member 300 may be made of an insulating material including a thermosetting insulating resin such as epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or may be made of an insulating material formed by impregnating a reinforcing material such as glass fiber or an inorganic filler in the above insulating resin. For example, the support member 300 may be made of an insulating material such as a prepreg, an Ajinomoto Build-up Film (ABF), FR-4, a bismaleimide triazine (BT) film, a photosensitive dielectric (PID) film, etc., but the present embodiment is not limited thereto.

[0061] The inorganic filler may include at least one selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3) and calcium zirconate (CaZrO3).

[0062] The support member 300 has a through hole 310 at the center thereof. The through hole 310 may be filled with a magnetic material included in the body 100 to form a core, thereby improving the performance of the coil electronic component.

[0063] The coil 200 is disposed inside the body 100, thereby exhibiting the characteristics of the coil electronic component 1000. For example, when the coil electronic component 1000 of the present embodiment is used as a power inductor, when current is applied to the coil 200, the coil electronic component can be used to stabilize the power supply of the electronic device by storing energy in the form of a magnetic field and maintaining an output voltage.

[0064] The coil 200 may be disposed on a first support surface 320 and a second support surface 330 of the support member 300 that are opposite to each other in the thickness direction (T-axis direction). The coil 200 may include a first coil pattern 210 and a second coil pattern 220, and the first coil pattern 210 and the second coil pattern 220 may be electrically connected to each other via a via 230.

[0065] The first coil pattern 210 is disposed on the first supporting surface 320 of the supporting member 300, and includes a first lead-out portion 213. The first lead-out portion 213 is exposed from the first surface S1 of the body 100, and is electrically connected to the first external electrode 700.

[0066] The second coil pattern 220 is disposed on the second supporting surface 330 of the supporting member 300, and includes a second lead-out portion 223. The second lead-out portion 223 is exposed from the second surface S2 of the body 100, and is electrically connected to the second external electrode 800.

[0067] In addition, when the first coil pattern 210, the first lead-out portion 213 and the via 230 are plated on the first support surface 320 of the support member 300, the first coil pattern 210, the first lead-out portion 213 and the via 230 may each include a seed layer and an electroplating layer such as an electroless plating layer. Here, the electroplating layer may have a single-layer structure or may have a multi-layer structure. The multi-layer electroplating layer may be formed as a conformal film structure in which one electroplating layer covers another electroplating layer, or may be formed as a stacking structure in which one electroplating layer is only stacked on only one surface of another electroplating layer. The seed layer of the first coil pattern 210, the seed layer of the first lead-out portion 213 and the seed layer of the via 230 may be formed integrally, so there may be no boundary between them, but the present embodiment is not limited thereto. The electroplating layer of the first coil pattern 210, the electroplating layer of the first lead-out portion 213 and the electroplating layer of the via 230 may be formed integrally, so there may be no boundary between them, but the present embodiment is not limited thereto. The above description may be equally applied to the second coil pattern 220 , the second lead-out portion 223 , and the via hole 230 .

[0068] The coil 200 and the via 230 may both be made of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) or alloys thereof, but the present embodiment is not limited thereto.

[0069] The insulating film IF may be disposed between the coil 200 and the main body 100. The insulating film IF may be disposed along the surface of the support member 300 and the coil 200. The insulating film IF does not exist at the position where the support member 300 and the coil 200 are connected to the external electrodes 700 and 800. The insulating film IF is used to insulate the coil 200 from the main body 100, and may include known insulating materials such as polyparaxylene. Any insulating material may be included in the insulating film IF, and there is no particular limitation. For example, the insulating film IF may include a polyurethane resin, a polyester resin, an epoxy resin, or a polyamide-imide resin. The insulating film IF may be formed by a method such as vapor deposition, but is not limited thereto. For example, the insulating film IF may be formed by laminating insulating films on both surfaces of the support member 300.

[0070] The insulating layer 400 may be disposed on the sixth surface S6 of the body 100. The insulating layer 400 may be spaced apart from the first surface S1 and the second surface S2 of the body 100, respectively. In other words, the insulating layer 400 may partially cover the sixth surface S6 of the body 100.

[0071] The insulating layer 400 may include a thermoplastic resin (such as a polystyrene resin, a vinyl acetate resin, a polyester resin, a polyethylene resin, a polypropylene resin, a polyamide resin, a rubber resin, an acrylic resin, etc.), a thermosetting resin (such as a phenol resin, an epoxy resin, a polyurethane resin, a melamine resin, an alkyd resin, etc.), a photosensitive resin, polyparaxylene, SiO x or SiN x .

[0072] The insulating layer 400 may be formed by a process such as screen printing, pad printing, dipping, spray printing, etc. For example, the insulating layer 400 may be formed by applying a liquid insulating resin to the surface of the body 100, by laminating an insulating film such as a dry film on the surface of the body 100, or by a thin film process such as vapor deposition. When the insulating layer 400 is formed using an insulating film, an Ajinomoto Build-up Film (ABF) or a polyimide film that does not contain a photosensitive insulating resin may be used as the insulating film.

[0073] The thickness of the insulating layer 400 may be in the range of 3 μm to 25 μm. If the thickness of the insulating layer 400 is less than 3 μm, the insulation performance may be deteriorated, resulting in a decrease in breakdown voltage. If the thickness of the insulating layer 400 exceeds 25 μm, the increase in breakdown voltage is limited, and the coil electronic component 1000 is too thick, resulting in poor installation or loss of electrical characteristics.

[0074] The conductive layer 500 may cover a portion of the insulating layer 400 , and may include a first conductive layer 510 and a second conductive layer 520 .

[0075] The first conductive layer 510 and the second conductive layer 520 may be spaced apart from each other and may each cover a portion of the insulating layer 400 .

[0076] The first conductive layer 510 may partially cover the sixth surface S6 of the body 100. In other words, the first conductive layer 510 may cover a region between the insulating layer 400 and the first surface S1 on the sixth surface S6 of the body 100.

[0077] The first conductive layer 510 may cover a portion of the outer surface of the insulating layer 400 relatively close to the first surface S1 of the body 100. Here, the outer surface of the insulating layer 400 refers to a surface opposite to the surface of the insulating layer 400 in contact with the body 100 (i.e., the inner surface of the insulating layer 400). The outer surface of the insulating layer 400 may be roughly divided into two parts based on the central portion of the insulating layer 400, i.e., a surface closer to the first surface S1 of the body 100 and a surface closer to the second surface S2 of the body 100. The first conductive layer 510 may partially cover a portion of the surface of the insulating layer 400 closer to the first surface S1.

[0078] The second conductive layer 520 may partially cover the sixth surface S6 of the body 100. In other words, the second conductive layer 520 may cover a region between the insulating layer 400 and the second surface S2 on the sixth surface S6 of the body 100.

[0079] The second conductive layer 520 may cover a portion of the outer surface of the insulating layer 400 relatively close to the second surface S2 of the body 100. In other words, the second conductive layer 520 may partially cover a portion of the surface of the insulating layer 400 closer to the second surface S2.

[0080] As described above, two portions of the insulating layer 400 located at both sides relative to the central portion may be partially covered by the first conductive layer 510 and the second conductive layer 520, respectively. In other words, the central portion of the insulating layer 400 is not covered by the conductive layer 500.

[0081] The two edges of the insulating layer 400 may be in contact with the first conductive layer 510 and the second conductive layer 520, respectively. A region between an edge of the two edges of the insulating layer 400 that is closer to the first surface S1 of the body 100 and the first surface S1 of the body 100 may be covered by the first conductive layer 510. A region between an edge of the two edges of the insulating layer 400 that is closer to the second surface S2 of the body 100 and the second surface S2 of the body 100 may be covered by the second conductive layer 520.

[0082] The first conductive layer 510 and the second conductive layer 520 may be used as seed layers for forming the first external electrode 700 and the second external electrode 800 by plating. In other words, the first external electrode 700 may be formed by directly plating a conductive metal on the first conductive layer 510, and the second external electrode 800 may be formed by directly plating a conductive metal on the second conductive layer 520. As described above, the first external electrode 700 and the second external electrode 800 formed by the direct plating method of growing a conductive metal with the first conductive layer 510 and the second conductive layer 520 as seed layers have high flatness and a corresponding sufficient MUF gap.

[0083] The first conductive layer 510 and the second conductive layer 520 may be formed by processes such as screen printing, pad printing, dipping, spray printing, etc. The composition of the conductive layer may include materials such as silver (Ag) particles, particles coated with silver (Ag), copper (Cu) particles, or silver (Ag) alloy particles.

[0084] The thickness of the first conductive layer 510 and the second conductive layer 520 may each be in the range of 1 μm to 25 μm. If the thickness of the first conductive layer 510 and the second conductive layer 520 is less than 1 μm, the first conductive layer 510 and the second conductive layer 520 may be too thin to be used as a seed layer. In other words, there may be an area where the plating layer is not formed and the external electrode may not be formed with a sufficient thickness. If the thickness of the first conductive layer 510 and the second conductive layer 520 exceeds 25 μm, the coil electronic component 1000 may be too thick, resulting in poor installation or deterioration of electrical characteristics.

[0085] The first and second external electrodes 700 and 800 are disposed outside the body 100 and connected to the coil 200. In other words, the first and second external electrodes 700 and 800 are connected to the first and second lead-out portions 213 and 223 of the coil 200, respectively.

[0086] The first external electrode 700 extends from the sixth surface S6 of the body 100 to a portion of the first surface S1 or the entire first surface S1 , and is connected to the first lead-out portion 213 of the coil 200 .

[0087] For example, the first external electrode 700 may include a first electrode pad 710 and a first connection portion 720 .

[0088] The first electrode pad 710 is disposed on the sixth surface S6 of the body 100, and the first connection portion 720 extends from the first electrode pad 710 to the first surface S1 of the body 100. The first lead-out portion 213 of the coil 200 is exposed from the first surface S1 of the body 100 and is connected to the first connection portion 720. Therefore, the coil 200 is electrically connected to the first external electrode 700.

[0089] The first electrode pad 710 and the first connection portion 720 may be an integral structure. For example, the first electrode pad 710 and the first connection portion 720 may be formed by plating.

[0090] The second external electrode 800 extends from the sixth surface S6 of the body 100 to a portion of or the entire second surface S2 , and is connected to the second lead-out portion 223 of the coil 200 .

[0091] For example, the second external electrode 800 may include a second electrode pad 810 and a second connection portion 820 .

[0092] The second electrode pad 810 is disposed on the sixth surface S6 of the body 100, and the second connection portion 820 extends from the second electrode pad 810 to the second surface S2 of the body 100. The second lead-out portion 223 of the coil 200 is exposed from the second surface S2 of the body 100 and is connected to the second connection portion 820. Therefore, the coil 200 is electrically connected to the second external electrode 800.

[0093] The second electrode pad 810 and the second connection portion 820 may be an integral structure. For example, the second electrode pad 810 and the second connection portion 820 may be formed by plating.

[0094] The first external electrode 700 may include a first metal layer 701 , a second metal layer 702 , and a third metal layer 703 .

[0095] The first metal layer 701 is a plating layer that contacts the first lead-out portion 213 of the coil 200 and the outer surface (i.e., the first surface S1) of the body 100, and may include copper (Cu). In addition, the first metal layer 701 may cover the first conductive layer 510. In addition, the first metal layer 701 may extend beyond the first conductive layer 510 and contact a portion of the insulating layer 400. The first metal layer 701 may be included in the first electrode pad 710 and the first connection portion 720 of the first external electrode 700.

[0096] The second metal layer 702 may be a plated layer covering the first metal layer 701, and may include nickel (Ni). The third metal layer 703 may be a plated layer covering the second metal layer 702, and may include tin (Sn). However, the present embodiment is not limited to such a three-layer structure, and a two-layer structure in which only one metal layer is provided on the first metal layer 701 is also feasible.

[0097] The second external electrode 800 may include a first metal layer 801 , a second metal layer 802 , and a third metal layer 803 .

[0098] The first metal layer 801 may be a plated layer in contact with the second lead-out portion 223 of the coil 200 and the outer surface (i.e., the second surface S2) of the body 100, and may include copper (Cu). In addition, the first metal layer 801 may cover the second conductive layer 520. In addition, the first metal layer 801 may extend beyond the second conductive layer 520 and contact a portion of the insulating layer 400. The first metal layer 801 may be included in the second electrode pad 810 and the second connection portion 820 of the second external electrode 800.

[0099] The second metal layer 802 may be a plated layer covering the first metal layer 801, and may include nickel (Ni). The third metal layer 803 may be a plated layer covering the second metal layer 802, and may include tin (Sn). However, the present embodiment is not limited to such a three-layer structure, and a two-layer structure in which only one metal layer is provided on the first metal layer 801 is also feasible.

[0100] As described above, a portion of the insulating layer 400 is covered by the first conductive layer 510 and the second conductive layer 520, and the first conductive layer 510 is covered by the first external electrode 700, and the second conductive layer 520 is covered by the second external electrode 800. Therefore, the insulating layer 400, the conductive layer 500, and the external electrodes 700 and 800 may form a three-layer structure. That is, there is a first overlapping region A1 where the insulating layer 400, the first conductive layer 510, and the first external electrode 700 are all overlapped, and a second overlapping region A2 where the insulating layer 400, the second conductive layer 520, and the second external electrode 800 are all overlapped. Hereinafter, when the first overlapping region A1 and the second overlapping region A2 are collectively referred to, they will be referred to as "overlapping regions".

[0101] When the coil electronic component 1000 has a first length L1 and the overlapping region has a second length L2, a ratio of the second length L2 to the first length L1 may be within a certain range.

[0102] The first overlapping region A1 has a third length L3, and the second overlapping region A2 has a fourth length L4. Accordingly, the second length L2 of the overlapping region is the sum of the third length L3 of the first overlapping region A1 and the fourth length L4 of the second overlapping region A2.

[0103] A ratio L2 / L1 of the second length L2 of the overlapping area to the first length L1 of the coil electronic component 1000 (hereinafter, referred to as “ratio of the overlapping area”) may be in the range of 0.3 to 0.7.

[0104] If the ratio L2 / L1 of the overlapping areas is less than 0.3, the effect of blocking the leakage current between the coil and the external electrode may not be large, and the effect of increasing the breakdown voltage may not be large.

[0105] If the ratio L2 / L1 of the overlapping area exceeds 0.7, the first external electrode 700 and the second external electrode 800 may become too close to each other, resulting in a high probability of current leakage and a decrease in breakdown voltage.

[0106] Here, L1 may refer to: in an optical microscope photograph or SEM (scanning electron microscope) photograph of a cross section taken in the length direction (L axis direction) and the thickness direction (T axis direction) at the center of the coil electronic component 1000 in the width direction (W axis direction), the maximum value among the lengths of a plurality of line segments each connecting two outermost boundary lines of the coil electronic component 1000 that are opposite to each other in the length direction (L axis direction) and parallel to the length direction (L axis direction). L3 may refer to: in the above cross-sectional photograph, the distance between two straight lines that are perpendicular to the length direction (L axis direction) and pass through two edges of the first overlapping region A1 where the insulating layer 400, the first conductive layer 510, and the first external electrode 700 overlap. L4 may refer to: in the above cross-sectional photograph, the distance between two straight lines that are perpendicular to the length direction (L axis direction) and pass through two edges of the second overlapping region A2 where the insulating layer 400, the second conductive layer 520, and the second external electrode 800 overlap. L2 may refer to the sum of L3 and L4 as described above.

[0107] As described above, the insulating layer 400 may be disposed on the sixth surface S6 of the body 100, but another insulating layer 900 may also be disposed on other portions of the body 100. The another insulating layer 900 may be spaced apart from the insulating layer 400. For example, the another insulating layer 900 may be disposed on the third surface S3, the fourth surface S4, and the fifth surface S5 of the body 100. In addition, when the first external electrode 700 partially covers the first surface S1 of the body 100 and the second external electrode 800 partially covers the second surface S2 of the body 100, the another insulating layer 900 may also be disposed on the remaining portions of the first surface S1 and the remaining portions of the second surface S2.

[0108] As described above, another insulating layer 900 may be disposed on at least portions of the first, second, third, fourth, and fifth surfaces S1, S2, S3, S4, and S5 of the body 100 to prevent electrical shorts between other electronic components and the external electrodes 700 and 800 .

[0109] The other insulating layer 900 may be used as a resist when the external electrodes 700 and 800 are formed by electroplating, but is not limited thereto.

[0110] Figure 3 is a perspective view schematically showing a coil electronic component according to another embodiment, and Figure 4 is along Figure 3 Schematic cross-sectional view taken along line IV-IV'.

[0111] Reference Figure 3 and Figure 4 , the coil electronic component 2000 according to the embodiment includes a body 1100 , a coil 1200 , an insulating layer 400 , a conductive layer 500 , a first external electrode 700 , and a second external electrode 800 .

[0112] The coil 1200 may include at least one turn of conductive wire. For example, the coil 1200 may be in the form of a spirally wound metal (e.g., copper (Cu) or silver (Ag)) wire whose surface is covered with an insulating material. In other words, the coil 1200 may be a wound coil. The coil 1200 is not limited to a single wire, but may be composed of a stranded wire or two or more wires.

[0113] The coil 1200 may be a circular coil (eg, a coil having a circular cross section), but is not limited thereto. For example, the coil 1200 may be various known coils such as a rectangular coil (eg, a coil having a rectangular cross section).

[0114] The cross-section of each wire of the coil 1200 may have various known shapes, such as a square, a circle, an ellipse, a triangle, and the like.

[0115] The coil 1200 may include a plurality of layers. The coil 1200 may include a first coil 1210 and a second coil 1220. The first coil 1210 may be connected to the second coil 1220 and disposed on an upper side of the second coil 1220 (ie, disposed on the fifth surface S5 side of the body 1100) to form a layer.

[0116] The number of turns of the first coil 1210 and the number of turns of the second coil 1220 may be the same as or different from each other.

[0117] The coil 1200 may be formed as a planar spiral and have a plurality of turns. For example, the first coil 1210 may have an innermost turn coil C1, at least one intermediate turn coil C2, and an outermost turn coil C3 in sequence from the inside to the outside of the body 1100. The second coil 1220 may also have an innermost turn coil C1', at least one intermediate turn coil C2', and an outermost turn coil C3' in sequence from the inside to the outside of the body 1100.

[0118] The insulating film IF may be provided along the surface of each of the plurality of turns of the coil 1200. The insulating film IF is used to protect and insulate the plurality of turns of the first coil 1210 and the second coil 1220, and may include a known insulating material such as polyparaxylene. Any insulating material may be included in the insulating film IF, and there is no particular limitation. For example, the insulating film IF may include a polyurethane resin, a polyester resin, an epoxy resin, or a polyamide-imide resin. The insulating film IF may be formed by a method such as vapor deposition, but is not limited thereto.

[0119] The coil 1200 may include a winding portion 1230 , a first lead-out portion 1213 , and a second lead-out portion 1223 .

[0120] The winding portion 1230 is a portion including at least one turn of a metal wire.

[0121] The first lead portion 1213 extends from one end of the winding portion 1230 and is exposed from the first surface S1 of the body 1100. The first lead portion 1213 is connected to the first external electrode 700. The second lead portion 1223 extends from the other end of the winding portion 1230 and is exposed from the second surface S2 of the body 1100. The second lead portion 1223 is connected to the second external electrode 800.

[0122] In addition to the above components, the remaining components are Figure 1 The components of the coil electronic assembly shown in are the same, so a redundant description thereof will be omitted.

[0123] Figure 5 is a cross-sectional view schematically showing a coil electronic component according to still another embodiment.

[0124] Reference Figure 5 The coil electronic component 3000 includes a body 2100 , a coil 2200 , an insulating layer 400 , a conductive layer 500 , a first external electrode 700 , and a second external electrode 800 .

[0125] The body 2100 may be a laminated body in which a plurality of sheets including a magnetic material are stacked in a thickness direction (T-axis direction). The coil 2200 may include a plurality of coil patterns 2210 provided on each sheet and connected to each other.

[0126] At one end of the coil 2200, a first lead portion 2213 is provided, and at the other end of the coil 2200, a second lead portion 2223 is provided. The first lead portion 2213 is exposed from the first surface S1 of the body 2100 and connected to the first external electrode 700. The second lead portion 2223 is exposed from the second surface S2 of the body 2100 and connected to the second external electrode 800.

[0127] In addition to the above components, the remaining components are Figure 1 The components of the coil electronic assembly shown in are the same, so a redundant description thereof will be omitted.

[0128] Hereinafter, specific examples of the present disclosure will be provided. However, the following examples are only intended to illustrate or describe the present disclosure and should not be construed as limiting the scope of the present disclosure.

[0129] [Preparation Example: Production of Coil Electronic Components]

[0130] (Comparative Example 1)

[0131] The coil electronic component was manufactured so that the first length L1 was 2500 μm and the second length L2 of the overlapping area was 0 μm.

[0132] (Comparative Example 2)

[0133] Comparative Example 2 is the same as Comparative Example 1, except that the first length L1 is 2500 μm and the second length L2 of the overlapping region is 250 μm.

[0134] (Comparative Example 3)

[0135] Comparative Example 3 is the same as Comparative Example 1, except that the first length L1 is 2500 μm and the second length L2 of the overlapping region is 500 μm.

[0136] (Example 1)

[0137] The coil electronic component was manufactured so that the first length L1 was 2500 μm and the second length L2 of the overlapping area was 750 μm.

[0138] (Example 2)

[0139] Example 2 is the same as Example 1, except that the first length L1 is 2500 μm and the second length L2 of the overlapping area is 1230 μm.

[0140] (Example 3)

[0141] Example 3 is the same as Example 1, except that the first length L1 is 2500 μm and the second length L2 of the overlapping area is 1700 μm.

[0142] (Comparative Example 4)

[0143] Comparative Example 4 is the same as Comparative Example 1, except that the first length L1 is 2500 μm and the second length L2 of the overlapping region is 1850 μm.

[0144] (Comparative Example 5)

[0145] Comparative Example 5 is the same as Comparative Example 1, except that the first length L1 is 2500 μm and the second length L2 of the overlapping region is 2000 μm.

[0146] [Experimental example: Breakdown voltage stability of coil electronic components]

[0147] After manufacturing 50 coil electronic components for each of Examples 1 to 3 and Comparative Examples 1 to 5, the ratio (L2 / L1) of the second length L2 of the overlapping area to the first length L1 of the coil electronic component and the breakdown voltage were measured, and the minimum breakdown voltage (BDV min ) determines the breakdown voltage stability. In other words, if BDV min less than 200V, the breakdown voltage stability is determined to be “poor”, and if the BDV minThe breakdown voltage stability was determined to be "good" if it was equal to or greater than 200 V. The results are summarized in Table 1.

[0148] (Table 1)

[0149]

[0150]

[0151] Referring to Table 1, in the coil electronic components manufactured according to Examples 1 to 3, the minimum breakdown voltage is 200V or higher, so the breakdown voltage stability is determined to be good. In the coil electronic components manufactured according to Comparative Examples 1 to 5, the minimum breakdown voltage is less than 200V, so the breakdown voltage stability is determined to be poor. This is because the ratio (L2 / L1) of the second length L2 of the overlapping region to the first length L1 of the coil electronic component is less than 0.3 (Comparative Examples 1 and 2) or greater than 0.7 (Comparative Examples 4 and 5).

[0152] [Experimental example: Electrode flatness and MUF gap of coil electronic components]

[0153] After manufacturing 10 sheets of coil electronic components for each of Example 1 and Comparative Example 1, respectively, the ten-point height roughness profile Rz of the outer electrode and the size of the MUF gap were measured, and the results are summarized in Table 2.

[0154] The ten-point height roughness profile of the external electrode is a measure of the flatness of the external electrode, and the smaller the value, the flatter the external electrode. When the external electrode is flat, the contact area with the pad (electrode for mounting) increases, which is beneficial for substrate mounting.

[0155] The MUF gap refers to the size of the gap between the insulating tape portion (the area between the first outer electrode and the second outer electrode) of the coil electronic component and the substrate when the coil electronic component is mounted on the substrate. Under modular conditions such as SiP (system-level package), multiple element components are installed and then encapsulated with encapsulation materials such as EMC (epoxy molding compound), liquid bottom fill, etc. through an encapsulation process. In this case, it is required to ensure sufficient space (20±5μm) between the MUF gaps. For example, if the MUF gap is 5μm or less, the gap between the coil electronic component and the substrate is too small, making it difficult for the encapsulation material to flow and the filling property is reduced, which may cause the formation of voids. The resulting voids may exist in the package as defects and may cause many failures such as poor thermal reliability and mechanical reliability. In addition, if the MUF gap is 0μm or less, when the coil electronic component is mounted on the substrate, there is a possibility that the coil electronic component may be misaligned or lifted, resulting in one outer electrode of the coil electronic component being fixed to the substrate and the other outer electrode standing up from the substrate (Manhattan effect or tombstone defect).

[0156] (Table 2)

[0157]

[0158] Referring to Table 2, the coil electronic component manufactured according to Example 1 exhibits a lower level of ten-point height roughness profile (RZ) than the coil electronic component manufactured according to Comparative Example 1. It can be seen that the flatness of the outer electrode of the coil electronic component manufactured according to Example 1 is improved. It can also be seen that for the coil electronic component manufactured according to Example 1, a sufficient MUF gap is achieved.

[0159] While the present disclosure has been described in conjunction with what are presently considered to be practical embodiments, it is to be understood that the present disclosure is not limited to the disclosed embodiments, but is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A coil electronic assembly, comprising: a body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface and the second surface, and the body comprising a magnetic material; a coil, at least a portion of which is embedded in the body; an insulating layer, disposed on the sixth surface of the main body; a first conductive layer covering the sixth surface between the insulating layer and the first surface of the body and covering a portion of the insulating layer; a second conductive layer covering the sixth surface between the insulating layer and the second surface of the body and covering a portion of the insulating layer; a first external electrode, covering the first conductive layer; as well as a second external electrode, covering the second conductive layer, wherein the coil electronic component has a first length in the first direction, and a second length is a sum of a third length of an area where the insulating layer, the first conductive layer, and the first external electrode overlap in the first direction and a fourth length of an area where the insulating layer, the second conductive layer, and the second external electrode overlap in the first direction, wherein L1 is the first length, L2 is the second length, L3 is the third length, and L4 is the fourth length, and The ratio L2 / L1 is greater than or equal to 0.3 and less than or equal to 0.

7.

2. The coil electronic component according to claim 1, wherein: The insulating layer is spaced apart from the first surface and the second surface of the body, respectively.

3. The coil electronic component according to claim 1, wherein: The first conductive layer and the second conductive layer are spaced apart from each other, The first conductive layer covers a portion of the surface of the insulating layer close to the first surface, and The second conductive layer covers a portion of the surface of the insulating layer close to the second surface.

4. The coil electronic component according to claim 1, wherein: The first outer electrode extends onto the first surface of the body and is connected to the coil, and The second external electrode extends onto the second surface of the body and is connected to the coil.

5. The coil electronic component according to claim 1, wherein: The coil is a wound coil.

6. The coil electronic assembly according to claim 1, further comprising: a supporting member disposed inside the main body and having a first supporting surface and a second supporting surface opposite to each other, The coil includes a first coil pattern on the first supporting surface of the supporting member, a second coil pattern on the second supporting surface of the supporting member, and a via connecting the first coil pattern and the second coil pattern.

7. The coil electronic component according to claim 1, wherein: The main body includes a laminated body in which a plurality of sheets are stacked, and The coil includes a plurality of coil patterns provided on each of the plurality of sheets and connected to one another.

8. The coil electronic component according to claim 1, wherein: At least one of the first external electrode and the second external electrode comprises: a first metal layer, covering a corresponding conductive layer in the first conductive layer and the second conductive layer; a second metal layer covering the first metal layer; and The third metal layer covers the second metal layer.

9. The coil electronic component according to claim 8, wherein: The first metal layer includes Cu, The second metal layer includes Ni, and The third metal layer includes Sn.

10. A coil electronic assembly comprising: a body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connecting the first surface and the second surface, and the body comprising a magnetic material; a coil, at least a portion of which is embedded in the body; an insulating layer, disposed on the sixth surface of the main body; a conductive layer covering a portion of the insulating layer on the sixth surface and spaced apart from the first surface and the second surface of the body; as well as An external electrode covers a portion of the insulating layer and the conductive layer and is connected to the coil.

11. The coil electronic assembly according to claim 10, further comprising: Another insulating layer is disposed on the fifth surface of the main body.

12. The coil electronic component according to claim 11, wherein: The another insulating layer and the insulating layer are spaced apart from each other.

13. The coil electronic component according to claim 10, wherein: Among the first to sixth surfaces of the body, the conductive layer is provided only on the sixth surface.

14. The coil electronic component according to claim 10, wherein: The conductive layer contacts the sixth surface of the body.

15. The coil electronic component according to claim 10, wherein: The coil includes a lead-out portion extending to a corresponding surface of the first surface and the second surface, and The external electrode extends from the sixth surface to the corresponding surface of the first surface and the second surface to contact the lead-out portion.

16. The coil electronic component according to claim 15, wherein: The external electrode contacts the lead-out portion, the conductive layer, and the insulating layer.

17. The coil electronic component according to claim 10, wherein: The outer electrode comprises: A first metal layer covering the conductive layer; a second metal layer covering the first metal layer; and The third metal layer covers the second metal layer.

18. The coil electronic component according to claim 17, wherein: The first metal layer includes Cu, The second metal layer includes Ni, and The third metal layer includes Sn.

19. The coil electronic component according to claim 10, wherein: The conductive layer includes a portion disposed between the insulating layer and the external electrode to contact the insulating layer and the external electrode.

20. The coil electronics assembly according to claim 10, wherein: The conductive layer includes at least one of Ag particles, Ag-coated particles, Cu particles, and Ag alloy particles.

Images