High-vacuum ultralow-temperature semiconductor wafer rapid cooling platform

Abstract

A high-vacuum ultralow-temperature semiconductor wafer rapid cooling platform disclosed by the present invention comprises a cooling platform, an adjustable bearing ring, a pneumatic sealing assembly and a nitrogen cooling mechanism, the cooling platform comprises a platform body, a gas storage tank, a pump body, a gas delivery pipe and a control console, the top of the platform body is provided with a cooling cavity, and the bottom of the platform body is connected with the gas storage tank; the pump body is installed on one side of the gas storage tank, the gas extraction end of the pump body is connected with the gas storage tank through a pipeline, the gas outlet end of the pump body is connected with the nitrogen cooling mechanism through a gas conveying pipe, the control table is located on one side of the table body, and the adjustable bearing ring is installed in a cooling cavity and comprises a ring body and two sets of adjusting supports symmetrically arranged in the ring body. The pneumatic sealing assembly is installed above the adjustable bearing ring and comprises a deformation airtight ring and an air pump connected with the deformation airtight ring through a pipeline. The semiconductor wafer vacuum low-temperature cooling platform designed by the invention can realize sealed vacuum and efficient cooling treatment on semiconductor wafers with different sizes.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor wafer cooling, in particular to a high-vacuum ultra-low temperature semiconductor wafer rapid cooling platform. Background Art

[0002] Semiconductor wafers are the basic materials used to manufacture semiconductor devices. They usually use single crystal silicon or other semiconductor materials such as gallium arsenide or silicon carbide. The wafer has a disc-shaped morphology, usually with a diameter of 4 inches to 12 inches and a thickness of about hundreds of microns to several millimeters. In the semiconductor manufacturing process, the wafer plays an important role. As the substrate of semiconductor devices, it provides a stable platform to build electronic components and circuits on its surface. The preparation process of the wafer includes multiple steps, such as crystal growth, cutting, polishing and cleaning. The preparation of the wafer usually starts with single crystal growth. Through the process of melting and solidification, the semiconductor material is formed into a large-sized single crystal. Then, the single crystal material is cut and polished to form a circular wafer. The polishing process makes the surface of the wafer very flat and smooth for subsequent process steps. Various semiconductor process steps can be carried out on the prepared wafer, such as cleaning, doping, thin film deposition, photolithography, etching, etc. These process steps gradually form electronic components and circuit structures on the surface of the wafer, thereby constructing various semiconductor devices such as transistors, diodes, integrated circuits, etc. Semiconductor wafers need to be cooled during the manufacturing process. In order to control the temperature and ensure the quality and performance of the wafer, gas phase reactions, deposition or annealing steps are involved. By cooling the wafer, the reaction rate can be reduced, making the reaction more controllable and uniform, which helps to improve the quality of the wafer and device performance and reduce the occurrence of adverse reactions.

[0003] However, the existing cooling methods for semiconductor wafers have the following problems: Since the sizes of semiconductor wafers vary and the surface is not completely flat, the cooling medium (such as air flow or liquid flow) may not be able to evenly cover the entire wafer, resulting in a higher temperature in one area and a lower temperature in another area, which may have a negative impact on the performance and consistency of the device; the existing cooling methods may have impurities and particles in the liquid or gas, which may introduce contamination to the wafer surface, thereby affecting the quality and reliability of the device. Therefore, it is necessary to design corresponding technical solutions to solve the existing technical problems. Summary of the invention

[0004] The purpose of the present invention is to provide a high-vacuum ultra-low temperature semiconductor wafer rapid cooling platform, which solves the technical problem that due to the different sizes of semiconductor wafers and the non-completely flat surface, the cooling medium (such as air flow or liquid flow) may not be able to evenly cover the entire wafer, resulting in a higher temperature in one area and a lower temperature in another area, which may have a negative impact on the performance and consistency of the device; the existing cooling method may have impurities and particles in the liquid or gas, which may introduce contamination to the wafer surface, thereby affecting the quality and reliability of the device.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-vacuum ultra-low temperature semiconductor wafer rapid cooling platform, comprising a cooling platform, an adjustable carrying ring, a pneumatic sealing assembly and a nitrogen cooling mechanism, the cooling platform comprising a platform body, a gas storage tank, a pump body, a gas pipe and a control console, the top of the platform body is provided with a cooling cavity and the bottom is connected to the gas storage tank, the pump body is installed on one side of the gas storage tank, the air extraction end of the pump body is connected to the gas storage tank through a pipeline and the air outlet end is connected to the nitrogen cooling mechanism through the gas pipe, the control console is located on one side of the platform body, the adjustable carrying ring is installed in the cooling cavity and comprises a ring body and two groups of adjusting supports symmetrically arranged in the ring body, the gas The dynamic sealing assembly is installed above the adjustable carrying ring, the pneumatic sealing assembly includes a deformable airtight ring and an air pump connected to the deformable airtight ring through a pipeline, the nitrogen cooling mechanism is located below the adjustable carrying ring and includes a guide plate, a tractor, a movable plate and a cooling nozzle, the two ends of the guide plate are fixed on the inner wall of the cooling chamber and a slide groove is opened in the middle, the tractor is divided into two groups and is symmetrically installed at the two ends of the guide plate, the tractor is connected to a slider, the slider is slidably set in the slide groove and the upper end is connected to the movable plate, the two groups of the movable plates are symmetrically set and connected by a plurality of groups of cooling nozzles, and the plurality of groups of cooling nozzles are evenly distributed directly below the semiconductor wafer.

[0006] As a preferred embodiment of the present invention, an annular inner cavity is formed inside the ring body, a driving motor is arranged in the annular inner cavity, a driving gear is installed at the power output end of the driving motor, a driven ring is arranged on one side of the driving gear, and a plurality of groups of latch teeth are formed on the periphery of the driven ring, and the latch teeth are meshed with the driving gear.

[0007] As a preferred embodiment of the present invention, the adjustment support includes a carrying plate, a suction cup and a sliding rod, an insertion rod is inserted at the corner of the carrying plate, the lower end of the insertion rod is connected to a torsion spring, the torsion spring is fixed to the bottom of the annular inner cavity, the suction cup is fixed to the outer end of the carrying plate, and the sliding rod is fixed to the inner side of the driven ring and contacts with the carrying plate.

[0008] As a preferred embodiment of the present invention, the inner end of the carrier plate is in an arc-shaped structure and the outer end is processed to have a planar structure, and the end of the slide rod is in contact with the outer end of the carrier plate.

[0009] As a preferred embodiment of the present invention, the deformable airtight ring is made of rubber material and has a plurality of groups of annular extrusion grooves formed on its surface, the plurality of groups of annular extrusion grooves are distributed in a stacked manner, an air inlet is provided on one side of the ring body and an exhaust port is provided on the other side, and the air inlet is connected to the air pipe through a pipeline.

[0010] As a preferred embodiment of the present invention, the traction device includes a motor and a rotating wheel installed at the power output end of the motor, a convex plate is fixed to one side of the rotating wheel, the convex plate is connected to a traction rope, and the end of the traction rope is connected to a slider.

[0011] As a preferred embodiment of the present invention, a suction chamber is provided on the top of the movable plate on the left side and is connected to a guide pipe on one side, an induced draft fan is connected to the outer end of the guide pipe, and the movable plate on the right side is connected to an air supply pipe.

[0012] As a preferred embodiment of the present invention, the cooling nozzle comprises an air guide hose and a plurality of nozzles evenly mounted on the air guide hose, the surface of the air guide hose is processed into a laminated structure, and the air outlet end of the nozzle faces upward.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The present invention designs a platform for vacuum low-temperature cooling of semiconductor wafers. The semiconductor wafer vacuum low-temperature cooling platform includes a cooling platform, an adjustable carrying ring, a pneumatic sealing component and a nitrogen cooling mechanism. When the semiconductor wafer needs to be cooled, the semiconductor wafer can be placed in a cooling cavity on the top of the cooling platform and the adjustable carrying ring can be adjusted according to the diameter of the semiconductor wafer, so that the adjustable carrying ring can support the bottom of the semiconductor wafer, and then the air-tight sealing component is inflated to perform contact sealing on the edge of the semiconductor wafer to prevent the nitrogen below from cooling the wafer and causing the gas to enter the cooling cavity, thereby preventing the problem of contaminants entering the wafer. Finally, the length of the nitrogen cooling mechanism is adjusted according to the diameter of the semiconductor wafer, so that the nitrogen can be evenly sprayed on the bottom of the semiconductor wafer, thereby achieving vacuum low-temperature cooling of the semiconductor wafer.

[0015] 2. The semiconductor wafer vacuum low-temperature cooling platform designed by the present invention can achieve sealed vacuum and efficient cooling treatment for semiconductor wafers of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is the overall structure diagram of the present invention;

[0017] Figure 2 This is a structural diagram of the adjustable bearing ring of the present invention;

[0018] Figure 3 This is a structural diagram of the pneumatic sealing assembly of the present invention;

[0019] Figure 4 This is a structural diagram of the nitrogen cooling mechanism of the present invention;

[0020] Figure 5 This is a structural diagram of the guide plate described in the present invention.

[0021] In the figure: 1. platform body; 2. gas storage tank; 3. pump body; 4. gas pipe; 5. control console; 6. cooling chamber; 7. ring body; 8. adjustment support; 9. deformation airtight ring; 10. air pump; 11. guide plate; 12. tractor; 13. moving plate; 14. cooling nozzle; 15. slide groove; 16. slider; 17. annular cavity; 18. driving motor; 19. driving gear; 20. driven ring; 21. latching gear; 22. bearing plate; 23. suction cup; 24. sliding rod; 25. plug rod; 26. torsion spring; 27. annular extrusion groove; 28. air inlet; 29. ​​exhaust port; 30. motor; 31. rotating wheel; 32. convex plate; 33. traction rope; 34. suction chamber; 35. guide pipe; 36. induced draft fan; 37. air guide hose; 38. nozzle. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] See also Figure 1-5The present invention provides a technical solution: a high-vacuum ultra-low temperature semiconductor wafer rapid cooling platform, comprising a cooling platform, an adjustable carrying ring, a pneumatic sealing component and a nitrogen cooling mechanism, the cooling platform comprising a platform body 1, a gas storage tank 2, a pump body 3, a gas delivery pipe 4 and a control console 5, a cooling cavity 6 is provided on the top of the platform body 1 and the bottom is connected to the gas storage tank 2, a top cover is also provided on the top of the platform body 1, a vacuum pump is provided on the cover body to extract and vacuum the gas in the cover body, the pump body 3 is installed on one side of the gas storage tank 2, the suction end of the pump body 3 is connected to the gas storage tank 2 through a pipeline and the gas outlet end is connected to the nitrogen cooling mechanism through the gas delivery pipe 4, the control console 5 is located on one side of the platform body 1, the adjustable carrying ring is installed in the cooling cavity 6 and comprises a ring body 7 and two groups of symmetrically arranged in the ring body 7 The support 8 is adjusted, and the pneumatic sealing assembly is installed above the adjustable carrying ring. The pneumatic sealing assembly includes a deformable airtight ring 9 and an air pump 10 connected to the deformable airtight ring 9 through a pipeline. The nitrogen cooling mechanism is located below the adjustable carrying ring and includes a guide plate 11, a tractor 12, a movable plate 13 and a cooling nozzle 14. The two ends of the guide plate 11 are fixed on the inner wall of the cooling chamber 6 and a slide groove 15 is opened in the middle. The tractor 12 is divided into two groups and is symmetrically installed at the two ends of the guide plate 11. The tractor 12 is connected to a slider 16. The slider 16 is slidably set in the slide groove 15 and the upper end is connected to the movable plate 13. The two groups of movable plates 13 are symmetrically set and connected by a plurality of cooling nozzles 14. The plurality of cooling nozzles 14 are evenly distributed directly below the semiconductor wafer.

[0024] Further improvement, such as Figure 1 As shown: an annular inner cavity 17 is formed inside the ring body 7, a driving motor 18 is arranged in the annular inner cavity 17, a driving gear 19 is installed at the power output end of the driving motor 18, a driven ring 20 is arranged on one side of the driving gear 19, and a plurality of groups of latch teeth 21 are formed on the periphery of the driven ring 20, which mesh with the driving gear 19.

[0025] Further improvement, such as Figure 2 As shown: the adjustment support 8 includes a carrying plate 22, a suction cup 23 and a sliding rod 24. An insertion rod 25 is inserted at the corner of the carrying plate 22. The lower end of the insertion rod 25 is connected to a torsion spring 26. The torsion spring 26 is fixed to the bottom of the annular inner cavity 17. The suction cup 23 is fixed to the outer end of the carrying plate 22. The sliding rod 24 is fixed to the inner side of the driven ring 20 and contacts with the carrying plate 22. The driving motor 18 drives the driving gear 19 to rotate. The driving gear 19 drives the driven ring 20 to rotate during the rotation. The driven ring 20 drives the sliding rod 24 to move synchronously and act on the carrying plate 22 during the rotation, so that the carrying plate 22 rotates and adjusts, and the extended area is adjusted.

[0026] Further improvement, such as Figure 2As shown: the inner end of the carrier plate 22 is an arc-shaped structure and the outer end is processed to have a flat structure, the end of the slide rod 24 is in contact with the outer end of the carrier plate 22, and the extended area of ​​the carrier plate 22 can be adjusted by moving the slide rod 24.

[0027] Further improvement, such as Figure 3 As shown: the deformable airtight ring 9 is made of rubber material and has a plurality of groups of annular extrusion grooves 27 formed on the surface. The plurality of annular extrusion grooves 27 are distributed in a stacked manner. An air inlet 28 is provided on one side of the ring body 7 and an exhaust port 29 is provided on the other side. The air inlet 28 is connected to the gas pipe 4 through a pipeline. The deformable airtight ring 9 can be deformed and adjusted in an inflated state to achieve edge sealing of the wafer and prevent the low-temperature nitrogen from flowing upward.

[0028] Further improvement, such as Figure 4 As shown: the traction device 12 includes a motor 30 and a rotating wheel 31 installed at the power output end of the motor 30, a convex plate 32 is fixed to one side of the rotating wheel 31, the convex plate 32 is connected to a traction rope 33, the end of the traction rope 33 is connected to the slider 16, and the rotating wheel 31 is driven to rotate by the rotation of the motor 30. During the rotation process, the rotating wheel 31 uses the convex plate 32 to pull the slider 16 to move horizontally, thereby achieving the purpose of adjusting the position of the movable plate 13.

[0029] Further improvement, such as Figure 4 As shown: a suction chamber 34 is provided on the top of the movable plate 13 on the left side and a guide pipe 35 is connected to one side, an induced draft fan 36 is connected to the outer end of the guide pipe 35, and the movable plate 13 on the right side is connected to the gas pipe 4, so that the low-temperature nitrogen after absorbing heat can be sucked out for external treatment.

[0030] Specifically, the cooling nozzle 14 includes an air hose 37 and a plurality of nozzles 38 evenly mounted on the air hose 37. The surface of the air hose 37 is processed into a stacked structure, and the air outlet of the nozzle 38 faces upward. This design can adjust the length of the cooling nozzle 14 during the traction movement of the movable plate 13, according to the diameter of the semiconductor wafer.

[0031] When in use: When the semiconductor wafer needs to be cooled, the adjustable carrying ring is adjusted according to the diameter of the semiconductor wafer, and the driving motor 18 drives the driving gear 19 to rotate. The driving gear 19 drives the driven ring 20 to rotate during the rotation. The driven ring 20 drives the slide bar 24 to move synchronously and act on the carrying plate 22 during the rotation, so that the carrying plate 22 is rotated and adjusted, and the extended area is adjusted so that the inner end spacing of the two groups of carrying plates 22 is smaller than the diameter of the semiconductor wafer, and then the semiconductor wafer is adsorbed and fixed by the suction cup 23, and then part of the nitrogen is introduced into the deformable airtight ring 9, and the deformable airtight ring 9 can be deformed and adjusted in the inflated state to achieve the wafer. The edge of the circle is sealed to prevent the low-temperature nitrogen from flowing upward, and finally the top cover is closed. The rotation of the motor 30 drives the rotating wheel 31 to rotate. During the rotation, the rotating wheel 31 uses the convex plate 32 to pull the slider 16 to move horizontally, thereby achieving the purpose of adjusting the position of the movable plate 13, so that the cooling nozzle 14 can fully spray the bottom of the semiconductor wafer, and the gas storage tank 2 is pumped out through the pump body 3 and the low-temperature nitrogen is introduced into the right movable plate 13. The low-temperature nitrogen is drained through the cooling nozzle 14 and can be sprayed on the bottom of the semiconductor wafer, so as to achieve the purpose of cooling the semiconductor wafer. The movable plate 13 on the left can suck and conduct the low-temperature nitrogen after absorbing heat.

[0032] In the description of the present invention, it is necessary to understand that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "both ends" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] In addition, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include at least one of such features.

[0034] In the present invention, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high vacuum ultra-low temperature semiconductor wafer rapid cooling platform, characterized in that: The invention comprises a cooling platform, an adjustable bearing ring, a pneumatic sealing assembly and a nitrogen cooling mechanism. The cooling platform comprises a platform body (1), a gas storage tank (2), a pump body (3), an air pipe (4) and a control console (5). The top of the platform body (1) is provided with a cooling cavity (6) and the bottom is connected to the gas storage tank (2). The pump body (3) is installed on one side of the gas storage tank (2). The air suction end of the pump body (3) is connected to the gas storage tank (2) through a pipeline and the air outlet end is connected to the nitrogen cooling mechanism through the air pipe (4). The control console (5) is located on one side of the platform body (1). The adjustable bearing ring is installed in the cooling cavity (6) and comprises a ring body (7) and two groups of adjustable supports (8) symmetrically arranged in the ring body (7). The pneumatic sealing assembly is installed above the adjustable bearing ring. The pneumatic sealing assembly comprises A deformable airtight ring (9) and an air pump (10) connected to the deformable airtight ring (9) through a pipeline. The nitrogen cooling mechanism is located below the adjustable carrying ring and includes a guide plate (11), a tractor (12), a movable plate (13) and a cooling nozzle (14). The two ends of the guide plate (11) are fixed on the inner wall of the cooling chamber (6) and a slide groove (15) is opened in the middle. The tractor (12) is divided into two groups and is symmetrically installed at the two ends of the guide plate (11). The tractor (12) is connected to a slider (16). The slider (16) is slidably arranged in the slide groove (15) and the upper end is connected to the movable plate (13). The two groups of movable plates (13) are symmetrically arranged and connected by a plurality of groups of cooling nozzles (14). The plurality of groups of cooling nozzles (14) are evenly distributed directly below the semiconductor wafer.

2. A high vacuum ultra-low temperature semiconductor wafer rapid cooling platform according to claim 1, characterized in that: An annular inner cavity (17) is formed inside the ring body (7), a driving motor (18) is arranged inside the annular inner cavity (17), a driving gear (19) is installed at the power output end of the driving motor (18), a driven ring (20) is arranged on one side of the driving gear (19), and a plurality of groups of latching teeth (21) are formed on the periphery of the driven ring (20), and the latching teeth (21) are meshed with the driving gear (19).

3. A high vacuum ultra-low temperature semiconductor wafer rapid cooling platform according to claim 2, characterized in that: The adjustment support (8) comprises a carrying plate (22), a suction cup (23) and a sliding rod (24); an insertion rod (25) is inserted at the corner of the carrying plate (22); the lower end of the insertion rod (25) is connected to a torsion spring (26); the torsion spring (26) is fixed to the bottom of the annular inner cavity (17); the suction cup (23) is fixed to the outer end of the carrying plate (22); and the sliding rod (24) is fixed to the inner side of the driven ring (20) and is in contact with the carrying plate (22).

4. A high vacuum ultra-low temperature semiconductor wafer rapid cooling platform according to claim 3, characterized in that: The inner end of the carrier plate (22) is in an arc-shaped structure and the outer end is processed to have a planar structure, and the end of the slide rod (24) is in contact with the outer end of the carrier plate (22).

5. The high vacuum ultra-low temperature semiconductor wafer rapid cooling platform according to claim 2, characterized in that: The deformable airtight ring (9) is made of rubber material and has a plurality of groups of annular extrusion grooves (27) formed on its surface. The plurality of groups of annular extrusion grooves (27) are distributed in a stacked manner. An air inlet (28) is provided on one side of the ring body (7) and an air outlet (29) is provided on the other side. The air inlet (28) is connected to the air delivery pipe (4) through a pipeline.

6. The high vacuum ultra-low temperature semiconductor wafer rapid cooling platform according to claim 1, characterized in that: The traction device (12) comprises a motor (30) and a rotating wheel (31) mounted on the power output end of the motor (30); a convex plate (32) is fixed to one side of the rotating wheel (31); the convex plate (32) is connected to a traction rope (33); and the end of the traction rope (33) is connected to a slider (16).

7. The high vacuum ultra-low temperature semiconductor wafer rapid cooling platform according to claim 5, characterized in that: The movable plate (13) located on the left side has a suction chamber (34) on its top and is connected to a guide pipe (35) on one side, and an induced draft fan (36) is connected to the outer end of the guide pipe (35). The movable plate (13) located on the right side is connected to an air supply pipe (4).

8. The high vacuum ultra-low temperature semiconductor wafer rapid cooling platform according to claim 1, characterized in that: The cooling nozzle (14) comprises an air guide hose (37) and a plurality of groups of nozzles (38) uniformly mounted on the air guide hose (37); the surface of the air guide hose (37) is machined into a laminated structure; and the air outlet ends of the nozzles (38) face upward.

Images