Multi-process precise connection type surface-mounted diode packaging equipment and packaging process

Abstract

The invention relates to the field of semiconductor components, in particular to a multi-process precise connection type chip diode packaging device and packaging technology.The multi-process precise connection type chip diode packaging device comprises a first conveying mechanism and a second conveying mechanism, a chip mounting mechanism is arranged between the first conveying mechanism and the second conveying mechanism, and the chip mounting mechanism comprises a chip bonding assembly and an adsorption assembly; the core sticking device comprises a core sticking assembly, an adsorption assembly and a displacement assembly, the core sticking assembly and the adsorption assembly are both provided with pressure applying pieces, the first conveying mechanism and the second conveying mechanism are both provided with pressed pieces capable of being matched with the pressure applying pieces, and a rotating frame body is arranged between the core sticking assembly and the adsorption assembly. The chip sticking assembly and the adsorption assembly are alternately located above the lead frame, sticking of the chip and placement of the jump piece are completed respectively, it is ensured that the chip and the jump piece can be accurately attached to the lead frame through accurate butt joint of the pressure applying piece and the pressed piece, the production efficiency is high, and the yield is high.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor components, and in particular to a multi-process precision connection type chip diode packaging device and a packaging process. Background Art

[0002] The packaging process of ultra-thin chip diodes includes steps such as core mounting, jumper mounting, welding, heating and curing. Generally, in order to meet the requirements of mass production and high efficiency, a lead frame is used as a carrier. The lead frame array has multiple rows and columns of functional units, and each unit is used to form an ultra-thin diode in the package. In order to improve production efficiency, a conveying mechanism is required to transport the lead frame as a carrier so that each process point can be connected in series. However, the existing methods are not ideal, and most of them still have relatively independent modes between processes. Especially in the core mounting link, it is necessary to perform multiple continuous operations such as gluing and core gluing. At present, they are all processed separately, the efficiency is not ideal, and it is impossible to connect with the next lead frame or the next process.

[0003] The currently disclosed Chinese patent CN112366162B is an integrated packaging device for chip diodes, including a conveying mechanism for conveying a lead frame; a glue groove, which is arranged on one side of the length direction of the conveying mechanism and is used to provide glue; a chip carrying mechanism, which is located outside the glue groove and includes a first bracket, two groups of first four-way limit plates formed on the first bracket, and a chip template is installed between each group of first four-way limit plates, and the chip template is used to carry the chip; a first travel mechanism, which is located at one end of the glue groove, includes a first lifting mechanism, a first horizontal straight mechanism arranged on the first lifting mechanism, and a core adhesive plate arranged on the first horizontal straight mechanism, the first horizontal straight mechanism is perpendicular to the conveying mechanism, the conveying mechanism, the glue groove, and the chip carrying mechanism are arranged in sequence along the length direction of the first horizontal straight mechanism, and the first horizontal straight mechanism is used to drive The core bonding plate moves so that the core bonding plate can be located above the conveying mechanism, the glue groove, and the chip carrying mechanism respectively; the jump sheet carrying mechanism is arranged on one side of the length direction of the conveying mechanism and along the conveying direction of the conveying mechanism, at the front end of the chip carrying mechanism, including a second bracket, two groups of second four-way limit plates formed on the second bracket, a jump sheet template is installed between each group of second four-way limit plates, and the jump sheet template is used to carry the jump sheet; and a second stroke mechanism is located at one end of the glue groove, including a second lifting mechanism, a second horizontal straight mechanism arranged on the second lifting mechanism, and a pneumatic suction cup arranged on the second horizontal straight mechanism, the second horizontal straight mechanism is perpendicular to the conveying mechanism, and the second horizontal straight mechanism is used to drive the pneumatic suction cup to move, so that the pneumatic suction cup can be located above the conveying mechanism and the jump sheet carrying mechanism respectively, and the pneumatic suction cup is used to suck the jump sheet.

[0004] According to the above patent, the above patent can complete the gluing, core gluing and core loading rhythmically in sequence through the first stroke mechanism, and then the conveying mechanism will convey the cored lead frame to the next link, and at the same time send a lead frame to be loaded, and the first stroke mechanism can immediately perform the next core loading action. The jump chip pasting action is completed well by the second stroke mechanism, which absorbs the jump chip and places the jump chip on the lead frame. Between the core loading action and the jump chip pasting action, the lead frame is conveyed in steps by the conveying mechanism to complete the connection. However, the conveying mechanism of the above patent does not have high-precision positioning capability, which can easily lead to errors in the position of the patch, and each time the core is glued, gluing is required. This process requires waiting time, resulting in reduced patch efficiency. Therefore, there is an urgent need for a connection-type patch diode packaging device that can effectively reduce the patch time and ensure the accuracy of the patch. Summary of the invention

[0005] In view of the problems existing in the prior art, a multi-process precision connection type chip diode packaging equipment is provided. The present invention enables the core bonding component and the adsorption component to be alternately located above the lead frame through the coordinated work of a displacement component and a rotating frame, thereby completing the pasting of the chip and the placement of the jumper chip respectively, and ensures that the chip and the jumper chip can be accurately attached to the lead frame through the precise docking of the pressure-applying part and the pressure-receiving part, thereby achieving high production efficiency and high yield rate.

[0006] To solve the problems of the prior art, the present invention provides a multi-process precision connection type patch diode packaging equipment, which is used to package chips and jump chips into lead frames, including a first conveying mechanism for conveying lead frames coated with adhesive, and a second conveying mechanism for conveying chips and jump chips, the second conveying mechanism is provided with a first template and a second template for carrying chips and jump chips at intervals, a patch mechanism is provided between the first conveying mechanism and the second conveying mechanism, the patch mechanism includes a core adhesive component for pasting chips and an adsorption component for adsorbing jump chips, and a displacement component for synchronously driving the core adhesive component and the adsorption component to move, the adhesive component Both the core component and the adsorption component are provided with a pressure-applying member, and both the first conveying mechanism and the second conveying mechanism are provided with a pressure-receiving member that can cooperate with the pressure-applying member. When the pressure-applying member acts on the pressure-receiving member, the chip or jump chip is in a precise patch state. A rotating frame body connected to the displacement component is provided between the core-bonding component and the adsorption component. When the core-bonding component is rotated by the rotating frame to a position directly above the lead frame, the adsorption component is simultaneously located directly above the second template, and when the adsorption component is rotated by the rotating frame to a position directly above the lead frame, the core-bonding component is simultaneously located directly above the first template.

[0007] Preferably, the adhesive core assembly and the adsorption assembly both include a fixed plate fixedly connected to the rotating frame, and a movable plate arranged relative to the fixed plate, the movable plate is located directly below the fixed plate, and a buffer connecting piece is provided between the fixed plate and the movable plate, the adhesive core assembly also includes a glue injection bin fixedly arranged on the corresponding movable plate and having a glue spraying function, and the adsorption assembly also includes suction cups arranged in a matrix on the corresponding movable plate.

[0008] Preferably, a plurality of glue outlets are provided at the bottom of the glue injection bin, and the bottom of the glue injection bin is a glue surface that can contact the chip. The glue injection bin is provided with a glue outlet. When the glue injection bin is filled with colloid, as the glue injection bin is continuously pressurized, all the glue outlets are in a state of glue overflowing at the same time. When the glue injection bin is pressed down on the chip, the colloid gradually diffuses between the chip and the glue injection bin, so that the chip is more stably adhered to the bottom of the glue injection bin.

[0009] Preferably, a through hole is coaxially opened at the top of the glue injection chamber corresponding to each glue outlet, and each through hole is provided with a pin for pushing the chip down. When the chip is attached to the lead frame, while the glue injection chamber is moving away from the chip, the pin is in a state of pressing the chip against the lead frame, so that the chip will not move away from the lead frame with the glue injection chamber.

[0010] Preferably, the upper end of the ejector pin is fixedly connected to the through hole of the glue injection chamber, the lower end of the ejector pin extends to the glue outlet of the glue injection chamber and the lower end of the ejector pin is flush with the bottom of the glue injection chamber, the ejector pin is provided with an air passage with two ends passing therethrough along its axial direction, a pressurizing chamber connected to the air passages of all the ejector pins is fixedly provided on the movable plate of the core bonding assembly, and a pressurizing port is provided on the pressurizing chamber, when the pressurizing chamber ventilates the air passages of all the ejector pins, all the chips are in a stable state of being pressed by the airflow and attached to the lead frame.

[0011] Preferably, a guide column is fixedly provided on all four sides of the fixed plate in the direction relative to the movable plate, and guide openings are opened on all four sides of the movable plate and are sleeved on the guide column. The lower end of the guide column has an anti-detachment portion to prevent the movable plate from detaching from the guide column, and each guide column is provided with a buffer connector, which is specifically a buffer spring sleeved on the guide column and located between the fixed plate and the movable plate.

[0012] Preferably, a pressure member is provided at the lower end of each guide column, a limit plate is provided on both sides of the first conveying mechanism and the second conveying mechanism, and each limit plate is provided with a pressure member capable of docking with the pressure member.

[0013] Preferably, the pressure-applying member and the pressure-receiving member are both rod-shaped structures, the upper end of the pressure-receiving member is provided with a slot for the lower end of the pressure-applying member to be inserted therein, a sleeve is fixedly provided on the limiting plate for sleeve-mounting the pressure-receiving member therein, a pressure sensor is fixedly provided at the lower end of the sleeve, and a compression spring is fixedly provided between the pressure-receiving member and the pressure sensor.

[0014] Preferably, the first conveying mechanism and the second conveying mechanism are both belt conveyors, and the belts of the first conveying mechanism and the second conveying mechanism are provided with spacers for limiting the movement of the lead frame and for limiting the movement of the first template and the second template, respectively.

[0015] The present invention also provides a multi-step precision connection type chip diode packaging process, comprising the following steps: S1, the first conveying mechanism conveys the lead frame coated with adhesive to the patch station, and the second conveying mechanism conveys the chip and jumper to the patch station in sequence; S2, start the displacement component to drive the core bonding component to attach the chip to the lead frame, and at the same time, the adsorption component adsorbs the jump chip; S3, start the rotating frame to rotate 180°, then start the displacement component to press weld the jumper onto the chip to complete the patch operation.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention realizes efficient switching between the core sticking component and the adsorption component between different stations through the coordinated work of the displacement component and the rotating frame. The first conveying mechanism conveys the lead frame coated with adhesive to the patch station, and the second conveying mechanism is responsible for conveying the chip and the jumper. As the rotating frame rotates 180° each time, the core sticking component and the adsorption component are alternately located above the lead frame to complete the chip sticking and the adsorption and placement of the jumper, respectively. In this process, the precise docking of the pressure-applying part and the pressure-receiving part ensures that the chip and the jumper can be accurately attached to the lead frame. Not only does it improve the patch accuracy, it also significantly improves the production efficiency, reduces the defective rate, and realizes continuous and efficient patch operations; 2. The core-bonding component and adsorption component of the present invention cooperate through a fixed plate, a movable plate and a buffer connector. The buffer connector buffers the pressure on the chip and the jumper caused by the downward movement of the fixed plate, thereby achieving high-precision extraction and attachment of the chip and the jumper. The core-bonding component uses a glue injection chamber to spray adhesive, and uses a buffer connector to ensure damage-free extraction and attachment of the chip. The adsorption component uses a suction cup and a buffer connector to achieve stable adsorption and precise placement of the jumper. With the coordinated work of the core-bonding component and the adsorption component, not only the accuracy and reliability of the patch are improved, but also the efficiency and consistency of the entire packaging process are significantly improved; 3. The present invention can evenly apply the colloid to the chip surface through the glue injection chamber, and under the action of pressure, the colloid can fully fill the tiny bumps and grooves of the chip to form a good adhesion interface. After the chip is attached to the lead frame, the glue injection chamber gradually moves away from the lead frame, and under the pressure of the ejector pin, the chip is firmly pressed on the lead frame to ensure that the chip will not be lifted up with the glue injection chamber. Compared with the operation of gluing and then gluing the core, it not only improves the patch efficiency, but also improves the stability and firmness of chip adhesion, achieving a joint patch effect; 4. The present invention sets a pressure sensor in conjunction with the pressure-applying part and the pressure-receiving part, thereby performing real-time monitoring in the project and achieving effective control of the yield rate. Once a problem occurs, the machine can be shut down for repair immediately to prevent batch defective products from occurring. The pressure sensor combined with the guide column can make the structure simple and stable, which not only has high detection accuracy but also has a reliable structure. After the chip is attached to the lead frame, the rotating frame is rotated so that the jump chip is immediately attached to the chip, reducing the overall patch operation time. After the pressure-applying part exerts pressure on the pressure-receiving part and the pressure sensor senses a specified pressure value, it indicates that the patch position is accurate, preventing deviations. There is no need to increase the operation time of rework caused by position deviations, thus achieving the precise connection effect of multiple patch steps and ensuring that the chip and jump chip mounting processes can be carried out accurately. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural diagram of a multi-process precision connection type SMD diode packaging equipment; Figure 2 This is a left view of a multi-process precision connection type SMD diode packaging equipment; Figure 3 It is a partial three-dimensional structural cross-sectional view of a multi-process precision connection type SMD diode packaging equipment; Figure 4 It is a three-dimensional structural diagram of a multi-process precision connection type SMD diode packaging equipment without displacement components; Figure 5 It is a schematic diagram of the three-dimensional structure of the SMD diode of a multi-process precision connection type SMD diode packaging equipment; Figure 6 It is a three-dimensional structural diagram of a core bonding component, an adsorption component and a rotating frame of a multi-process precision connection type SMD diode packaging equipment; Figure 7 It is a planar cross-sectional view of a core-bonding component of a multi-process precision connection type SMD diode packaging equipment; Figure 8 It is a partial three-dimensional structural cross-sectional view of the core bonding component of a multi-process precision connection type SMD diode packaging equipment; Fig. 9 yes Figure 7A magnified schematic diagram of point A; Fig.10 It is a partial three-dimensional structural cross-sectional view of an adsorption component of a multi-process precision connection type SMD diode packaging equipment.

[0018] The numbers in the figure are: 1. lead frame; 11. chip; 12. jump chip; 2. first conveying mechanism; 21. pressure-applying member; 22. pressure-bearing member; 23. limit plate; 231. sleeve; 232. pressure sensor; 233. compression spring; 24. spacer; 3. second conveying mechanism; 31. first template; 32. second template; 4. core adhesive assembly; 41. fixed plate; 42. movable plate; 43. buffer connector; 431. guide column; 432. anti-slip part; 44. glue injection chamber; 441. glue outlet; 442. glue injection port; 45. ejector pin; 451. airway; 452. pressurized chamber; 5. adsorption assembly; 51. suction cup; 52. negative pressure chamber; 521. negative pressure port; 6. displacement assembly; 61. rotating frame. DETAILED DESCRIPTION

[0019] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0020] See also Figure 1-Figure 8 As shown, a multi-process precision connection type chip diode packaging equipment is used to package a chip 11 and a jumper 12 into a lead frame 1, including a first conveying mechanism 2 for conveying the lead frame 1 coated with an adhesive, and a second conveying mechanism 3 for conveying the chip 11 and the jumper 12, the second conveying mechanism 3 is provided with a first template 31 and a second template 32 for carrying the chip 11 and the jumper 12, a chip mechanism is provided between the first conveying mechanism 2 and the second conveying mechanism 3, the chip mechanism includes a core adhesive component 4 for pasting the chip 11 and an adsorption component 5 for adsorbing the jumper 12, and a displacement component 6 for synchronously driving the core adhesive component 4 and the adsorption component 5 to move, the core adhesive component 4 and the adsorption component 5 5 are both provided with a pressure piece 21, and the first conveying mechanism 2 and the second conveying mechanism 3 are both provided with a pressure piece 22 that can cooperate with the pressure piece 21. When the pressure piece 21 acts on the pressure piece 22, the chip 11 or the jump chip 12 is in a precise patch state. A rotating frame 61 is provided between the core sticking component 4 and the adsorption component 5, which is transmission-connected to the displacement component 6. When the core sticking component 4 is rotated by the rotating frame 61 to a position directly above the lead frame 1, the adsorption component 5 is simultaneously located directly above the second template 32, and when the adsorption component 5 is rotated by the rotating frame 61 to a position directly above the lead frame 1, the core sticking component 4 is simultaneously located directly above the first template 31.

[0021] When encapsulating the chip diode, first, the positions of the core adhesive component 4 and the adsorption component 5 are adjusted by the displacement component 6 so that the core adhesive component 4 and the adsorption component 5 are located at the position of the patch station. Next, the first conveying mechanism 2 is responsible for conveying the lead frame 1 coated with adhesive to the patch station, and the second conveying mechanism 3 is responsible for conveying the chip 11 and the jumper 12 to the patch station. When the core adhesive component 4 is rotated by the rotating frame 61 to a position directly above the lead frame 1, the adsorption component 5 is simultaneously located directly above the second template 32. At this time, the core adhesive component 4 can stick the chip 11 on the lead frame 1, and the adsorption component 5 is ready to absorb the jumper 12 from the second template 32. When the adsorption component 5 is rotated 180° by the rotating frame 61 to a position directly above the lead frame 1, the core adhesive component 4 is simultaneously located directly above the first template 31. At this time, the adsorption component 5 can place the jump sheet 12 on the chip 11, and the core sticking component 4 is ready to remove the new chip 11 from the first template 31, and wait for the subsequent chip 11 attachment operation to the new lead frame 1. The core sticking component 4 extracts the chip 11 by sticking, mainly to achieve high-precision positioning, stability and damage-free extraction, and can adapt to chips 11 of different sizes and shapes. The adsorption component 5 extracts the jump sheet 12 by negative pressure, mainly to achieve fast picking and releasing actions. Since the surface of the jump sheet 12 is smooth, it is suitable for adsorption by negative pressure. With the intermittent rotation of the rotating frame 61, the core sticking component 4 and the adsorption component 5 are constantly coming to the top of the lead frame 1. In the process of driving the core sticking component 4 and the adsorption component 5 to move down at the same time by the displacement component 6, when the pressure member 21 acts on the pressure member 22, if the two are accurately docked, the chip 11 will be accurately attached to the lead frame 1, and the jump sheet 12 can be accurately attached to the chip 11. Otherwise, the position of the chip 11 or the jumper 12 will deviate. Whenever the chip 11 is ready to be attached to the lead frame 1, the second conveying mechanism 3 conveys the jumper 12 to the station to be adsorbed, so that the adsorption component 5 can absorb the jumper 12 while attaching the chip 11 to the lead frame 1. Whenever the jumper 12 is ready to be attached to the chip 11, the second conveying mechanism 3 conveys the chip 11 to the station to be adsorbed, so that the core adhesive component 4 can attach the jumper 12 to the chip 11 and pick up the chip 11. The rotating frame 61 will continuously switch the position of the core adhesive component 4 and the adsorption component 5, rotating 180° each time to ensure continuous and efficient patch operation and effectively perform connected patch work.

[0022] See also Figure 3-Figure 10As shown, the adhesive core component 4 and the adsorption component 5 both include a fixed plate 41 fixedly connected to the rotating frame 61, and a movable plate 42 arranged relative to the fixed plate 41, the movable plate 42 is located directly below the fixed plate 41, and a buffer connecting member 43 is provided between the fixed plate 41 and the movable plate 42. The adhesive core component 4 also includes a glue injection bin 44 with a glue spraying function fixedly arranged on the corresponding movable plate 42, and the adsorption component 5 also includes suction cups 51 arranged in a matrix on the corresponding movable plate 42.

[0023] When the core adhesive component 4 and the adsorption component 5 extract or attach the chip 11 and the jumper 12, the buffer connector 43 can effectively absorb and disperse the pressure applied to the chip 11 or the jumper 12, thereby avoiding damage to the chip 11 or the jumper 12 due to excessive impact force. For the core adhesive component 4, when the chip 11 needs to be extracted, the glue injection chamber 44 will spray a suitable amount of colloid on its bottom. Subsequently, the fixed plate 41 slowly descends under the drive of the displacement component 6 until the bottom of the glue injection chamber 44 contacts the chip 11. The displacement component 6 continues to move the fixed plate 41 downward. Due to the presence of the buffer connector 43, the glue injection chamber 44 will not generate excessive impact force when contacting the chip 11, and the chip 11 can be fully in contact with the colloid, preventing the occurrence of part of the chip 11 not being extracted during the upward movement of the fixed plate 41. Next, the rotating frame 61 rotates the core adhesive component 4 180° to move it above the lead frame 1. In the process of driving the core sticking component 4 downward through the displacement component 6, the buffer connector 43 plays a role again to ensure that the chip 11 can be smoothly and accurately attached to the lead frame 1. For the adsorption component 5, when it is necessary to absorb the jump piece 12, the adsorption component 5 is also moved downward through the displacement component 6. At this time, the suction cup 51 adsorbs the jump piece 12 through negative pressure, so that the suction cup 51 is in close contact with the jump piece 12. The buffer connector 43 on the adsorption component 5 also plays a role, ensuring good sealing between the suction cup 51 and the jump piece 12, so that the jump piece 12 is firmly adsorbed on the suction cup 51. Then, the rotating frame 61 rotates the adsorption component 5 180° to move it above the lead frame 1. In the process of driving the adsorption component 5 downward through the displacement component 6, the buffer connector 43 plays a role again to ensure that the jump piece 12 can be smoothly and accurately placed on the chip 11.

[0024] See also Figure 6-Figure 9As shown, a plurality of glue outlets 441 are provided at the bottom of the glue injection chamber 44, and the bottom of the glue injection chamber 44 is a glue surface that can contact the chip 11, and a glue injection port 442 is provided on the glue injection chamber 44. When the glue injection chamber 44 is filled with colloid, as the glue injection chamber 44 is continuously pressurized, all the glue outlets 441 are in a state of glue overflowing at the same time, and when the glue injection chamber 44 is pressed down on the chip 11, the colloid gradually diffuses between the chip 11 and the glue injection chamber 44, so that the chip 11 is more stably adhered to the bottom of the glue injection chamber 44.

[0025] The glue injection chamber 44 is filled with colloid through the glue injection port 442. Once the glue injection chamber 44 is filled with colloid, the inside of the glue injection chamber 44 continues to be pressurized. As the pressure inside the glue injection chamber 44 increases, the colloid will overflow from several glue outlets 441 at the bottom of the glue injection chamber 44 at the same time. Each glue outlet 441 corresponds to a chip 11 to be bonded. The colloid in the overflow state forms a uniform glue film, covering the glue surface of the glue injection chamber 44. Driven by the displacement component 6, the fixed plate 41 slowly descends, so that the glue surface of the glue injection chamber 44 gradually approaches and finally contacts the chip 11. Due to the presence of the buffer connector 43, the glue injection chamber 44 will not generate excessive impact force when contacting the chip 11, ensuring a smooth contact process. When the glue injection chamber 44 is pressed down on the chip 11, the overflowed colloid begins to diffuse between the chip 11 and the glue injection chamber 44. Under the action of pressure, the colloid fills the tiny uneven places on the surface of the chip 11, forming a good adhesion interface and enhancing the stability and firmness of adhesion. The viscosity of the colloid in the glue injection chamber 44 is lower than that of the adhesive on the lead frame 1. After the chip 11 is attached to the lead frame 1, as the glue injection chamber 44 gradually moves away, the chip 11 is separated from the glue injection chamber 44 to complete the attachment operation.

[0026] See also Figure 6-Figure 9 As shown, a through hole is coaxially opened at the top of the glue injection chamber 44 corresponding to each glue outlet 441, and each through hole is provided with a push pin 45 for pushing down the chip 11. When the chip 11 is attached to the lead frame 1, in the process of the glue injection chamber 44 moving away from the chip 11, the push pin 45 is in a pressure state of pressing the chip 11 against the lead frame 1, so that the chip 11 will not follow the glue injection chamber 44 away from the lead frame 1.

[0027] When the glue injection chamber 44 is pressed down on the chip 11, the ejector pin 45 will also contact the chip 11. As the glue injection chamber 44 gradually moves away from the chip 11, the ejector pin 45 continues to maintain pressure on the chip 11, pressing the chip 11 against the lead frame 1, ensuring that the chip 11 will not move away from the lead frame 1 along with the glue injection chamber 44. In the process of the glue injection chamber 44 moving away, the chip 11 can be firmly attached to the lead frame 1, preventing the chip 11 from being lifted along with the glue injection chamber 44.

[0028] See also Figure 6-Figure 9 As shown, the upper end of the ejector pin 45 is fixedly connected to the through hole of the glue injection chamber 44, the lower end of the ejector pin 45 extends to the glue outlet 441 of the glue injection chamber 44 and the lower end of the ejector pin 45 is flush with the bottom of the glue injection chamber 44, the ejector pin 45 is provided with an air passage 451 with two ends passing through along its axial direction, and a pressurizing chamber 452 connected to the air passages 451 of all the ejector pins 45 is fixedly provided on the movable plate 42 of the core bonding component 4, and a pressurizing port is provided on the pressurizing chamber 452. When the pressurizing chamber 452 ventilates the air passages 451 of all the ejector pins 45, all the chips 11 are in a stable state of being pressed by the airflow and attached to the lead frame 1.

[0029] A negative pressure chamber 52 connected to the suction ports of all suction cups 51 is fixedly provided on the movable plate 42 of the adsorption assembly 5, and a negative pressure port 521 is provided on the negative pressure chamber 52. When the pressurized chamber 452 vents the air passages 451 of all ejector pins 45, the gas flows downward through the air passages 451 of the ejector pins 45. The gas flows out from the air passages 451 of the ejector pins 45, exerting a downward punching force on the chip 11. Due to the punching effect of the airflow, all chips 11 are firmly attached to the lead frame 1. The airflow punching method ensures that the chip 11 is not damaged and is stably positioned on the lead frame 1 after attachment, thereby improving the accuracy and stability of the patch.

[0030] See also Figure 6-Figure 8 As shown, a guide column 431 is fixedly provided on all four sides of the fixed plate 41 in the direction relative to the movable plate 42, and a guide opening is opened on all four sides of the movable plate 42 and is sleeved on the guide column 431. The lower end of the guide column 431 has an anti-detachment portion 432 for preventing the movable plate 42 from detaching from the guide column 431, and each guide column 431 is provided with a buffer connector 43, which is specifically a buffer spring sleeved on the guide column 431 and located between the fixed plate 41 and the movable plate 42.

[0031] The cooperation between the guide post 431 and the guide opening ensures that the movable plate 42 can maintain a stable direction when moving up and down without deviation or tilt. The anti-slip portion 432 at the lower end of the guide post 431 effectively prevents the movable plate 42 from falling off the guide post 431 during movement. As the movable plate 42 is pressed on the chip 11 or the patch, the fixed plate 41 continues to press down, and the movable plate 42 is in a stationary state relative to the fixed plate 41. The buffer spring is continuously compressed, providing an elastic buffer between the fixed plate 41 and the movable plate 42, reducing the risk of damage to the chip 11 or the jumper 12.

[0032] See also Figure 3-Figure 8 As shown, a pressure member 21 is provided at the lower end of each guide column 431 , a limit plate 23 is provided on both sides of the first conveying mechanism 2 and the second conveying mechanism 3 , and each limit plate 23 is provided with a pressure member 22 that can dock with the pressure member 21 .

[0033] During the operation of the core bonding component 4 and the adsorption component 5, the precision of the chip 11 and the jump chip 12 during the patch process can be ensured by the docking of the pressure-applying member 21 and the pressure-receiving member 22. Through the cooperation of multiple groups of pressure-applying members 21 and pressure-receiving members 22, precise alignment can be achieved at multiple points, ensuring the alignment precision of the entire patch process and enhancing the reliability and control precision of the core bonding component 4 and the adsorption component 5.

[0034] See also Figure 4-Figure 8 As shown, the pressure-applying member 21 and the pressure-receiving member 22 are both rod-shaped structures, and the upper end of the pressure-receiving member 22 is provided with a slot for the lower end of the pressure-applying member 21 to be inserted therein, and a sleeve 231 is fixedly provided on the limiting plate 23 for sleeve-mounting the pressure-receiving member 22 therein, and a pressure sensor 232 is fixedly provided at the lower end of the sleeve 231, and a compression spring 233 is fixedly provided between the pressure-receiving member 22 and the pressure sensor 232.

[0035] When the pressure-applying member 21 and the pressure-receiving member 22 are both in a non-contact state, the compression spring 233 is in a naturally stretched state, and the pressure sensor 232 does not detect pressure. When the lower end of the pressure-applying member 21 is inserted into the slot of the pressure-receiving member 22, the displacement assembly 6 drives the fixed plate 41 to move downward, and the pressure-applying member 21 begins to apply downward pressure to the pressure-receiving member 22. After the pressure-receiving member 22 is subjected to pressure, it moves downward and squeezes the compression spring 233. The compression spring 233 is compressed under the pressure of the pressure-receiving member 22, and the pressure is transmitted to the pressure sensor 232. The pressure sensor 232 senses the pressure from the compression spring 233 and converts it into an electrical signal. The pressure sensor 232 transmits the detected pressure signal to the control system through the circuit. The control system determines whether the patch is accurate based on the received pressure signal. If the patch has deviations, the displacement assembly 6 is controlled to adjust the patch position to improve the patch accuracy.

[0036] Through real-time monitoring during the patch process, effective control of the yield rate can be achieved. Once a problem occurs, the machine can be stopped immediately for repair to prevent batch defective products from occurring. The pressure sensor 232 combined with the guide column 431 can make the structure simple and stable, which not only has high detection accuracy but also has a reliable structure.

[0037] See also Figure 1-Figure 4 As shown, the first conveying mechanism 2 and the second conveying mechanism 3 are both belt conveyors, and the belts of the first conveying mechanism 2 and the second conveying mechanism 3 are provided with spacers 24 for limiting the movement of the lead frame 1 and the movement of the first template 31 and the second template 32 respectively.

[0038] The function of providing the spacer 24 and the limit plate 23 on the belt of the first conveying mechanism 2 can effectively limit the lateral movement of the lead frame 1 during the conveying process. It is ensured that the lead frame 1 maintains a stable position during the conveying process and will not be offset. The function of providing the spacer 24 and the limit plate 23 on the belt of the second conveying mechanism 3 can also limit the lateral movement of the first template 31 and the second template 32. It is ensured that the first template 31 and the second template 32 maintain a stable position during the conveying process and will not be offset. The alignment accuracy is improved, the failure and scrap rate caused by position offset are reduced, and the continuity and stability of production are improved.

[0039] A multi-process precision connection type chip diode packaging process, applied to a multi-process precision connection type chip diode packaging equipment, includes the following steps: S1, the first conveying mechanism 2 conveys the lead frame 1 coated with adhesive to the patch station, and the second conveying mechanism 3 conveys the chip 11 and the jumper chip 12 to the patch station in sequence; S2, start the displacement component 6 to drive the core bonding component 4 to attach the chip 11 to the lead frame 1, and at the same time, the adsorption component 5 adsorbs the jumper 12; S3, start the rotating frame 61 to rotate 180 degrees, then start the displacement component 6 to press weld the jumper 12 onto the chip 11, and complete the patch operation.

[0040] The present invention realizes efficient switching of the core bonding component 4 and the adsorption component 5 between different workstations through the coordinated work of the displacement component 6 and the rotating frame 61, which significantly improves the patch accuracy, production efficiency and consistency. Specifically, the first conveying mechanism 2 conveys the lead frame 1 coated with adhesive to the patch station, and the second conveying mechanism 3 is responsible for conveying the chip 11 and the jump chip 12. The rotating frame 61 rotates 180° each time, so that the core bonding component 4 and the adsorption component 5 are alternately located above the lead frame 1, respectively completing the pasting of the chip 11 and the adsorption and placement of the jump chip 12. In this process, the precise docking of the pressure-applying member 21 and the pressure-receiving member 22 ensures that the chip 11 and the jump chip 12 can be accurately attached to the lead frame 1, which significantly improves the efficiency and consistency of the entire packaging process, reduces the defective rate, and realizes continuous and efficient patch operation.

[0041] The above embodiments only express one or several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the protection scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A multi-process precision connection type surface mount diode packaging equipment, used for packaging a chip (11) and a jumper (12) into a lead frame (1), comprising a first conveying mechanism (2) for conveying a lead frame (1) coated with an adhesive, and a second conveying mechanism (3) for conveying the chip (11) and the jumper (12), wherein a first template (31) and a second template (32) for carrying the chip (11) and the jumper (12) are arranged on the second conveying mechanism (3); characterized in that: A chip bonding mechanism is provided between the first conveying mechanism (2) and the second conveying mechanism (3), the chip bonding mechanism comprising a core bonding component (4) for bonding the chip (11) and a suction component (5) for adsorbing the jump chip (12), and a displacement component (6) for synchronously driving the core bonding component (4) and the suction component (5) to move, the core bonding component (4) and the suction component (5) are both provided with a pressure-applying member (21), and the first conveying mechanism (2) and the second conveying mechanism (3) are both provided with a pressure-receiving member (22) capable of cooperating with the pressure-applying member (21), when the pressure-applying member (21) acts on the pressure-receiving member (22), , at this time, the chip (11) or the jump chip (12) is in a precise patch state; a rotating frame (61) is provided between the adhesive core component (4) and the adsorption component (5) and is transmission-connected to the displacement component (6); when the adhesive core component (4) is rotated by the rotating frame (61) to a position directly above the lead frame (1), the adsorption component (5) is simultaneously located at a position directly above the second template (32); and when the adsorption component (5) is rotated by the rotating frame (61) to a position directly above the lead frame (1), the adhesive core component (4) is simultaneously located at a position directly above the first template (31).

2. The multi-process precision connection type SMD diode packaging equipment according to claim 1 is characterized in that: The core adhesive component (4) and the adsorption component (5) both include a fixed plate (41) fixedly connected to the rotating frame (61), and a movable plate (42) arranged relative to the fixed plate (41), wherein the movable plate (42) is located directly below the fixed plate (41), and a buffer connection member (43) is provided between the fixed plate (41) and the movable plate (42). The core adhesive component (4) also includes a glue injection chamber (44) having a glue spraying function and fixedly arranged on the corresponding movable plate (42), and the adsorption component (5) also includes suction cups (51) arranged in a matrix on the corresponding movable plate (42).

3. The multi-process precision connection type SMD diode packaging equipment according to claim 2 is characterized in that: A plurality of glue outlets (441) are provided at the bottom of the glue injection chamber (44); the bottom of the glue injection chamber (44) is a glue surface capable of contacting the chip (11); and a glue injection port (442) is provided on the glue injection chamber (44); when the glue injection chamber (44) is filled with glue, as the glue injection chamber (44) is continuously pressurized, all the glue outlets (441) are in a glue overflow state at the same time; and when the glue injection chamber (44) is pressed down on the chip (11), the glue gradually diffuses between the chip (11) and the glue injection chamber (44), so that the chip (11) is more stably adhered to the bottom of the glue injection chamber (44).

4. The multi-process precision connection type SMD diode packaging equipment according to claim 3 is characterized in that: A through hole is coaxially opened at the top of the glue injection chamber (44) corresponding to each glue outlet (441), and a push pin (45) is provided in each through hole for pushing down the chip (11). When the chip (11) is attached to the lead frame (1), during the process of the glue injection chamber (44) moving away from the chip (11), the push pin (45) is in a pressure state of pressing the chip (11) against the lead frame (1), so that the chip (11) will not move away from the lead frame (1) along with the glue injection chamber (44).

5. The multi-process precision connection type SMD diode packaging equipment according to claim 4 is characterized in that: The upper end of the ejector pin (45) is fixedly connected to the through hole of the glue injection chamber (44), the lower end of the ejector pin (45) extends to the glue outlet (441) of the glue injection chamber (44) and the lower end of the ejector pin (45) is flush with the bottom of the glue injection chamber (44), the ejector pin (45) is provided with an air passage (451) with two ends passing through along its axial direction, and a pressurizing chamber (452) connected to the air passages (451) of all the ejector pins (45) is fixedly provided on the movable plate (42) of the core bonding component (4), and a pressurizing port is provided on the pressurizing chamber (452), and when the pressurizing chamber (452) ventilates the air passages (451) of all the ejector pins (45), all the chips (11) are in a stable state of being pressed by airflow and attached to the lead frame (1).

6. The multi-process precision connection type SMD diode packaging equipment according to claim 2, characterized in that: A guide column (431) is fixedly provided on all four sides of the fixed plate (41) in a direction relative to the movable plate (42); a guide opening is provided on all four sides of the movable plate (42) and is sleeved on the guide column (431); the lower end of the guide column (431) has an anti-detachment portion (432) for preventing the movable plate (42) from detaching from the guide column (431); each guide column (431) is provided with a buffer connection member (43); the buffer connection member (43) is specifically a buffer spring sleeved on the guide column (431) and located between the fixed plate (41) and the movable plate (42).

7. The multi-process precision connection type SMD diode packaging equipment according to claim 6, characterized in that: A pressure member (21) is provided at the lower end of each guide column (431), a limit plate (23) is provided on both sides of the first conveying mechanism (2) and the second conveying mechanism (3), and each limit plate (23) is provided with a pressure receiving member (22) capable of docking with the pressure member (21).

8. The multi-process precision connection type SMD diode packaging equipment according to claim 7, characterized in that: The pressure-applying member (21) and the pressure-receiving member (22) are both rod-shaped structures; the upper end of the pressure-receiving member (22) is provided with a slot into which the lower end of the pressure-applying member (21) can be inserted; a sleeve (231) in which the pressure-receiving member (22) is sleeved is fixedly provided on the limiting plate (23); a pressure sensor (232) is fixedly provided at the lower end of the sleeve (231); and a compression spring (233) is fixedly provided between the pressure-receiving member (22) and the pressure sensor (232).

9. The multi-process precision connection type SMD diode packaging equipment according to claim 7, characterized in that: The first conveying mechanism (2) and the second conveying mechanism (3) are both belt conveyors, and the belts of the first conveying mechanism (2) and the second conveying mechanism (3) are respectively provided with spacers (24) for limiting the movement of the lead frame (1) and for limiting the movement of the first template (31) and the second template (32).

10. A multi-step precision connection type chip diode packaging process, applied to a multi-step precision connection type chip diode packaging equipment as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: S1, the first conveying mechanism (2) conveys the lead frame (1) coated with adhesive to the patch station, and the second conveying mechanism (3) conveys the chip (11) and the jump chip (12) to the patch station in sequence; S2, starting the displacement component (6) to drive the core bonding component (4) to attach the chip (11) to the lead frame (1), while the adsorption component (5) adsorbs the jump chip (12); S3, start the rotating frame (61) to rotate 180 degrees, then start the displacement component (6) to press weld the jumper (12) onto the chip (11), and complete the patch operation.

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