Detection equipment, wafer position determination method and related product

Abstract

The invention discloses a detection device, a wafer position determination method and a related product, the detection device comprises a first bearing device, the first bearing device comprises a support member and a first rotating member, and the first rotating member is rotatably connected to the support member around a first direction; the imaging device is arranged on one side of the bearing device in the second direction; the second bearing device is arranged on the bearing surface of the first rotating part, the second bearing device is used for placing a wafer, and the second bearing device is movably arranged along the first axis relative to the first rotating part; the first axis is perpendicular to the bearing surface of the first rotating part; the third bearing device is arranged on the side, away from the imaging device, of the supporting piece, the third bearing device is movably arranged relative to the imaging device in the first direction and the third direction, the surface of the wafer can be rapidly adjusted to the optimal focal plane of the imaging device, and the observation efficiency of the wafer is improved.

Description

Technical Field

[0001] The present application belongs to the field of computer technology, and in particular, relates to a detection device, a method for determining a wafer position, and related products. Background Art

[0002] At present, in the production process of semiconductors, the surface of the wafer is often observed through detection equipment. The detection equipment in the prior art mainly controls the horizontal movement of the platform carrying the wafer through a coarse motion stage, and controls the vertical movement of the platform carrying the wafer through an air-floating fine motion stage. However, since the surface of the wafer is usually in a non-horizontal state, it is difficult to make the surface of the wafer be located in the optimal focal plane of the imaging system by only adjusting the platform in the horizontal and vertical directions. Therefore, a lot of time is required to debug the position of the platform, which makes the efficiency of wafer observation low. Summary of the invention

[0003] The embodiments of the present application provide a detection device, a method for determining the position of a wafer, an apparatus, a device, a medium and a product, which can relatively quickly adjust the surface of the wafer to the optimal focal plane of the imaging device, thereby improving the observation efficiency of the wafer.

[0004] In a first aspect, an embodiment of the present application provides a detection device, including:

[0005] A first bearing device, the first bearing device comprises a supporting member and a first rotating member, the first rotating member is connected to the supporting member and is rotatable around a first direction;

[0006] A second carrying device, the second carrying device is arranged on the carrying surface of the first rotating member, the second carrying device is used to place the wafer, and the second carrying device is movably arranged along the first axis relative to the first rotating member; wherein the first axis is perpendicular to the carrying surface of the first rotating member;

[0007] An imaging device is disposed on one side of the first carrying device along a second direction, the first direction intersecting the second direction, and is configured to measure coordinate values ​​of a plurality of points of the wafer in the second direction;

[0008] The third bearing device is arranged on a side of the support member away from the imaging device, and the third bearing device is movably arranged relative to the imaging device in a first direction and a third direction, wherein the first direction, the second direction and the third direction intersect each other.

[0009] In a second aspect, an embodiment of the present application provides a method for determining a wafer position applied to the detection device of the first aspect, comprising:

[0010] When the light source emits a light beam to the wafer, the light intensity of the reflected light beam reflected by multiple points on the surface of the wafer and the coordinate values ​​of the multiple points in the second direction are obtained;

[0011] Based on the light intensity of the reflected light beam reflected from the multiple points, determine the target point where the light intensity is greater than a threshold value;

[0012] A target rotation angle of the first rotating member is determined based on the coordinate value of the target point in the second direction, and the rotation angle of the first rotating member is controlled to reach the target rotation angle.

[0013] In a third aspect, an embodiment of the present application provides a device for determining a wafer position, comprising:

[0014] An acquisition module, configured to acquire a plurality of rotation angles of the first rotating member and the intensity of the reflected light beam on the surface of the wafer corresponding to each rotation angle when the light source emits a light beam to the wafer and the first rotating member in the detection device continuously rotates around a first direction;

[0015] The determination module is used to determine a target rotation angle of the first rotating member corresponding to the maximum light intensity, and control the rotation angle of the first rotating member to the target rotation angle.

[0016] In a fourth aspect, an embodiment of the present application provides an electronic device, the device comprising:

[0017] a processor and a memory storing computer program instructions;

[0018] When the processor executes the computer program instructions, it is used to execute the wafer position determination method of the second aspect mentioned above.

[0019] In a fifth aspect, an embodiment of the present application provides a computer storage medium having computer program instructions stored thereon, and when the computer program instructions are executed by a processor, the method for determining the wafer position of the second aspect described above is implemented.

[0020] In a sixth aspect, an embodiment of the present application provides a computer program product, including a computer program, which, when processed by a processor, implements the method for determining the wafer position of the second aspect described above.

[0021] The detection equipment, wafer position determination method, device, equipment, medium and product of the embodiments of the present application are provided by setting up a detection equipment including a first carrying device, a second carrying device and an imaging device, wherein the first carrying device includes a support member and a first rotating member, the first rotating member can be rotated around a first direction and connected to the support member, the wafer is placed by placing the second carrying device, the second carrying device is movably arranged on a first axis relative to the first rotating member, and a third carrying device is arranged on a side of the support member away from the imaging device, the third carrying device is movably arranged in a first direction and a second direction relative to the imaging device, the position of the wafer carrying platform can be moved in different directions and rotated around the first direction, further realizing multi-degree-of-freedom adjustment of the wafer position, and the surface of the wafer can be adjusted to the optimal focal plane of the imaging device more quickly, thereby improving the observation efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0023] Figure 1 A schematic diagram of an exemplary detection device provided for some embodiments of the present application.

[0024] Figure 2 A schematic diagram of another exemplary detection device provided for some embodiments of the present application.

[0025] Figure 3 A schematic diagram of another exemplary detection device provided for some embodiments of the present application.

[0026] Figure 4 A flowchart of a method for determining a wafer position provided in some embodiments of the present application.

[0027] Figure 5 A flowchart of another method for determining wafer position provided for some embodiments of the present application.

[0028] Figure 6 A schematic diagram of a wafer position determination device provided in some embodiments of the present application.

[0029] Figure 7 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0030] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0032] Before describing the technical solutions provided by the embodiments of the present application, in order to facilitate the understanding of the embodiments of the present application, the present application first specifically describes the problems existing in the related art:

[0033] Currently, if Figure 1 As shown, Figure 1 This is a schematic diagram of an exemplary detection device for observing a wafer 100, wherein the detection device mainly includes a first movable device 101, a second movable device 102, a third movable device 103 and an imaging device 104, wherein the second movable device 102 is movably connected relative to the first movable device 101 along a first direction and / or along a second direction, and the third movable device 103 is movably connected to a carrying surface of the second movable device 102 along a third direction, wherein the third movable device is used to place the wafer 100, and the third movable device 103 is a carrying platform for the wafer 100.

[0034] Based on the above Figure 1The detection device shown in the figure mainly controls the movement of the wafer 100 carrying platform in the horizontal direction, such as along the x-axis direction and along the y-axis direction, through the first moving device 101 and the second moving device 102. The third moving device 103 can control the movement of the wafer 100 carrying platform in the vertical direction, such as along the z-axis direction. When the user observes the wafer 100 based on the imaging system, it is often necessary to move the surface of the wafer 100 to the best imaging focal plane of the imaging system for observation. However, based on the above Figure 1 The inspection device shown has only three degrees of freedom for the movement of the wafer 100 carrying platform, so it takes a lot of time to adjust the position of the carrying platform, which makes the efficiency of observing the wafer 100 low.

[0035] Based on this, the present application embodiment provides a Figure 2 The detection device shown can solve the above-mentioned problems. Below, a detection device provided in an embodiment of the present application is described in detail.

[0036] In some embodiments, Figure 2 As shown, an embodiment of the present application provides a detection device, which may include:

[0037] The first carrying device 201 includes a supporting member 2011 and a first rotating member 2012 . The first rotating member 2012 is connected to the supporting member 2011 and is rotatable around a first direction.

[0038] like Figure 2 As shown, the first bearing device 201 includes a support member 2011 and a first rotating member 2012. The support member 2011 is used to support the first rotating member 2012 to rotate around a first direction. It can be imagined that Figure 2 The shape of the support member 2011 shown is only exemplary, and support members 2011 of other shapes may also be included. In some examples, the first direction may be a direction along the x-axis.

[0039] The imaging device 202 is disposed on one side of the first carrying device 201 along the second direction, where the first direction intersects the second direction, and is configured to measure coordinate values ​​of multiple points of the wafer in the second direction.

[0040] like Figure 2 As shown, the imaging device 202 can be arranged on one side of the first carrier 201 along the second direction, and the first direction can intersect with the second direction. In some examples, the second direction can be a direction along the z-axis. The imaging device 202 can be used to observe the wafer 200, for example, by collecting an image of the wafer to observe the wafer 200. The imaging device 202 can be a scanning electron microscope or an optical microscope.

[0041] The above-mentioned imaging device can be configured to measure the coordinate values ​​of multiple points on the wafer in the second direction. It can be imagined that here, the above-mentioned imaging device can measure the coordinate values ​​of multiple points on the surface of the wafer in the second direction. It can be imagined that the distance from the surface of the wafer to the imaging device can be measured by the above-mentioned imaging device to determine the position of the wafer, so as to facilitate the subsequent adjustment of the optimal focal plane from the surface of the wafer to the imaging device.

[0042] The second carrying device 203 is arranged on the carrying surface of the first rotating member 2012. The second carrying device 203 is used to place the wafer 200. The second carrying device 203 is movably arranged along a first axis relative to the first rotating member 2012, wherein the first axis is perpendicular to the carrying surface of the first rotating member 2012.

[0043] like Figure 2 As shown, the detection equipment may also include a second carrying device 203, which is arranged on the carrying surface of the first rotating member 2012 on the side of the first rotating member 2012 close to the imaging device 202, and the second carrying device 203 can place the wafer 200. The second carrying device 203 can be movably arranged along a first axis relative to the first rotating member 2012, and the above-mentioned first axis is perpendicular to the above-mentioned carrying surface of the first rotating member 2012.

[0044] The third carrying device 204 is arranged on the side of the support 2011 away from the imaging device 202, and the third carrying device 204 is movably arranged relative to the imaging device 202 in the first direction and / or the third direction, wherein the first direction, the second direction and the third direction intersect each other.

[0045] like Figure 2 As shown, the detection equipment may further include a third carrying device 204, and the third carrying device 204 is arranged on a side of the support 2011 away from the imaging device 202. The third carrying device 204 can be movably arranged relative to the imaging device 202 along the first direction and the third direction. It can be imagined that the first direction, the second direction and the third direction intersect with each other, the first direction is the direction along the x-axis, the second direction is the direction along the z-axis, and the third direction is the direction along the y-axis. It can be imagined that the directions along the x-axis, the z-axis and the y-axis are perpendicular to each other.

[0046] In some embodiments, Figure 2 As shown, the x and y axes may be horizontal directions, the z axis may be a vertical direction, the imaging device 202 may be located above the first carrying device 201 along the z axis, and the third carrying device may be located below the first carrying device along the z axis.

[0047] In some examples, the third carrying device 204 can be controlled to move to preset positions along the x-axis and along the y-axis relative to the imaging device 202, and then the first rotating member 2012 can be controlled to rotate to a target angle, and then the distance between the second carrying device 203 and the imaging device 202 can be controlled to achieve adjustment of the rotation angle and movement position of the carrying platform of the wafer 200, thereby achieving multi-degree-of-freedom adjustment of the carrying platform.

[0048] In some embodiments, Figure 2 As shown, the imaging device 202 may include a measurement substrate 205 and a lens 206 . The measurement substrate 205 is used to fix the lens 206 , and the lens 206 is used to observe the wafer 200 .

[0049] In some examples, the lens 206 may be a lens of a scanning electron microscope, a lens of an optical microscope, or a lens of other imaging devices that can observe the wafer.

[0050] The embodiment of the present application is provided with a detection device including a first carrying device 201, a second carrying device 203 and an imaging device 202, wherein the first carrying device 201 includes a support member 2011 and a first rotating member 2012, the first rotating member 2012 can be rotated around a first direction to be connected to the support member 2011, the wafer 200 is placed by the second carrying device 203, the second carrying device 203 is movably arranged on a first axis relative to the first rotating member 2012, and a third carrying device 204 is arranged on a side of the support member 2011 away from the imaging device 202, the third carrying device 204 is movably arranged in a first direction and a second direction relative to the imaging device 202, so that the position of the carrying platform of the wafer 200 can be moved in different directions and rotated around the first direction, further realizing multi-degree-of-freedom adjustment of the position of the wafer 200, and enabling the surface of the wafer to be adjusted to the optimal focal plane of the imaging device 202 more quickly, thereby improving the observation efficiency of the wafer 200.

[0051] In some embodiments, Figure 3 As shown, Figure 3 is a schematic diagram of another exemplary detection device, such as Figure 3 As shown, the detection device further includes a second rotating member 301 , which rotates around the first axis and is connected between the second bearing device 203 and the first rotating member 2012 , and the second bearing device 203 and the second rotating member 301 are arranged to rotate synchronously.

[0052] like Figure 3As shown, a second rotating connection can be set between the second carrying device 203 and the first rotating member 2012. The second rotating member 301 can be rotatably connected between the second carrying device 203 and the first rotating member 2012 around the first axis. The second rotating member 301 can be rotated to a preset angle to adjust the imaging device 202 to observe different areas of the wafer 200.

[0053] In the embodiment of the present application, the second rotating member 301 is arranged to rotate around the first axis and is connected between the second carrying device 203 and the first rotating member 2012 . Different observation areas of the wafer 200 can be quickly adjusted by rotating the second rotating member 301 , thereby improving the observation efficiency of the wafer 200 .

[0054] In some embodiments, Figure 3 As shown, the third carrying device 204 includes a first component 302 and a second component 303, wherein the first component 302 is movably arranged relative to the second component 303 along a first direction, the first component 302 is fixedly connected to the support member, and the second component 303 is movably arranged relative to the imaging device along a third direction.

[0055] like Figure 3 As described, the third carrying device 204 may include a first component 302 and a second component 303, the first component 302 may be fixedly connected to the support member 2011, the first component 302 may be movably arranged along a first direction relative to the second component 303, and the second component 303 may be movably arranged along a third direction relative to the imaging device. It can be imagined that a first distance of the first component 302 relative to the second component 303 along the first direction, i.e., along the x-axis direction, and a second distance of the second component 302 relative to the imaging device along the third direction, i.e., along the y-axis direction, may be controlled in advance to adjust the distance of the carrying platform in the horizontal plane.

[0056] In the embodiment of the present application, a third supporting device 204 is provided including a first component 302 and a second component 303. The first component 302 is provided to be movable along a first direction relative to the second component 303, and the second component 303 is provided to be movable along a third direction relative to the imaging device. This can control the movement of the position of the supporting platform in the horizontal plane, facilitate the movement of the position of the wafer 200, and enable the imaging system to observe different areas of the wafer.

[0057] In some embodiments, the imaging device includes an imaging system composed of a collection device 304 and a light source 305, the light source 305 is used to emit a light beam to the wafer, the light source 305 and the collection device 304 can be arranged on the side of the measurement substrate 205 close to the second carrier 203, and the lens 206 can be arranged on the side of the collection device, and the collection device can collect the light intensity of the reflected light beam on the surface of the wafer, collect the image of the wafer surface, and collect the coordinate values ​​of multiple points of the wafer 200 in the second direction. Here, the rotation angle of the first rotating member 2012 can be adjusted based on the light intensity of the reflected light beam collected by the first collection device 304.

[0058] The embodiment of the present application sets up the imaging device 202 including the acquisition device 304, and can adjust the rotation angle of the first rotating member 2012 based on the intensity of the light beam reflected from the surface of the wafer collected by the imaging device 202. There is no need to determine the rotation angle of the first rotating member 2012 based on the imaging quality of the light beam reflected from the wafer 200, and the rotation angle can be determined only by the intensity of the light beam reflected. The surface of the wafer can be quickly adjusted to the optimal focal plane, thereby improving the observation efficiency of the wafer 200.

[0059] It can be imagined that when the above-mentioned lens 206 includes a scanning electron microscope lens or an optical microscope lens, the above-mentioned acquisition device 304 can collect the light intensity reflected from the wafer surface and the image and coordinate value of the wafer surface to determine the rotation angle and position of the wafer.

[0060] In some embodiments, a vibration isolation device may be provided on a side of the measurement substrate 205 close to the second carrier 203 , and the vibration isolation device may maintain the stability of the imaging device 202 , so that the wafer 200 may be observed more accurately based on the imaging system.

[0061] In some embodiments, Figure 4 As shown, the embodiment of the present application provides a method for determining the wafer position based on the above detection device, and the method may include the following steps S410-S420:

[0062] S410: When a light source emits a light beam to the wafer, light intensities of reflected light beams reflected from a plurality of points on the surface of the wafer and coordinate values ​​of the plurality of points in a second direction are acquired.

[0063] Here, a light source can be used to emit a light beam to the wafer. When the above-mentioned detection device starts path scanning, the second carrying device can be moved continuously in the first direction and the third direction to enable the above-mentioned acquisition device 304 to collect the light intensity of the reflected light beam reflected by multiple points on the wafer surface and the coordinate values ​​of the multiple points in the second direction. Here, when the above-mentioned acquisition device collects the light intensity of the reflected light beam, it can simultaneously collect the light intensity of the reflected light beam at multiple reflection points on the wafer surface and the coordinate value of each reflection point in the second direction.

[0064] S420: Based on the light intensities of the reflected light beams reflected from the multiple points, determine the target points where the light intensities are greater than a threshold.

[0065] Based on the light intensity of the reflected light beam reflected from multiple points, the target point with light intensity greater than a threshold can be determined. Here, the above-mentioned target point can include at least three target points. The target surface is determined based on the above-mentioned three target points. In order to improve the accuracy of wafer observation, the wafer surface needs to be adjusted to the above-mentioned target surface.

[0066] In some examples, after determining the light intensities of reflected light beams reflected from multiple points, the light intensities of the reflected light beams can be sorted from large to small, and the first n points with larger light intensities of the reflected light beams can be selected as the above-mentioned target points.

[0067] S430: Determine a target rotation angle of the first rotating member based on the coordinate value of the target point in the second direction, and control the rotation angle of the first rotating member to the target rotation angle.

[0068] Here, the current surface of the wafer surface can be determined based on the coordinate values ​​of multiple points in the second direction collected by the acquisition device 304, the target rotation angle of the first rotating member can be determined by the deviation between the current surface and the target surface, and the rotation angle of the first rotating member can be controlled to the target rotation angle.

[0069] The embodiment of the present application obtains the light intensity of the reflected light beam at multiple points on the surface of the wafer and the coordinate values ​​of the multiple points in the second direction, and determines the target point whose light intensity is greater than a threshold based on the light intensity of the reflected light beam at the multiple points. The target rotation angle of the first rotating member can be determined through the coordinate value of the target point in the second direction, and based on the maximum conceivable value, the rotation angle of the above-mentioned first rotating member 2012 is adjusted to the target rotation angle, so that the surface of the wafer can be adjusted to the optimal focal plane, thereby improving the observation efficiency of the wafer.

[0070] It can be imagined that after the surface of the wafer is adjusted to be parallel to the optimal focal plane, the distance between the second carrier device 203 and the imaging device 202 can be controlled to adjust the surface of the wafer to the optimal focal plane for easy observation.

[0071] In some embodiments, Figure 5As shown, after determining the target rotation angle of the rotating member corresponding to the maximum light intensity and controlling the rotation angle of the rotating member to the target rotation angle, the above determination method may further include the following steps S510-S520:

[0072] S510: When the light source emits a light beam to the wafer and the distance between the second carrying device 203 and the imaging device 202 on the first axis continuously changes, a plurality of distances and a reflected image formed by the reflected light beam on the surface of the wafer corresponding to each distance are acquired.

[0073] Here, when a light source is used to emit a light beam to the wafer, after completing the above-mentioned adjustment of the rotation angle of the first rotating member 2012, the distance between the second supporting device 203 and the imaging device 202 can be continuously changed along the first axis, and the reflected image formed by the surface reflected light beam of the wafer corresponding to different distances can be collected. It can be imagined that the above-mentioned reflected image can be collected based on the image collection device set in the above-mentioned detection equipment.

[0074] S520: Determine the target distance corresponding to the reflected image with the maximum definition, and control the distance between the second carrying device 203 and the imaging device 202 on the first axis to the target distance.

[0075] After acquiring multiple reflected images, the clarity of each image can be calculated based on an image clarity algorithm, the target distance corresponding to the reflected image with maximum clarity can be determined, and the distance between the second supporting device 203 and the imaging device 202 on the first axis can be controlled to the target distance. Here, the above-mentioned target distance can be the distance between the supporting surface of the second supporting device 203 and the optical lens 206 in the above-mentioned imaging device 202.

[0076] The embodiment of the present application controls the distance of the second carrier 203 from the imaging device 202 on the second axis to a target distance corresponding to an image of maximum clarity based on the clarity of the image of the reflected light beam acquired at each distance when the distance of the second carrier 203 from the imaging device 202 on the first axis continuously changes, thereby achieving rapid adjustment of the surface of the wafer to the optimal focal plane and improving observation efficiency.

[0077] In some embodiments, in the above step S410: when the light source emits a light beam to the wafer and the first rotating member 2012 in the detection device continuously rotates around the first direction, before obtaining multiple rotation angles of the first rotating member 2012 and the intensity of the reflected light beam on the surface of the wafer corresponding to each rotation angle, the method further includes:

[0078] The distance of the third carrying device 204 relative to the imaging device 202 in the first direction is controlled to be a first preset distance, and the distance of the third carrying device relative to the imaging device 202 in the third direction is controlled to be a second preset distance.

[0079] Here, the target area of ​​the wafer that needs to be observed can be determined by controlling the distance of the third carrier 204 relative to the imaging device 202 in the first direction and the third direction. Here, the distance of the third carrier 204 relative to the imaging device 202 in the first direction can be controlled to a first preset distance, and the distance of the third carrier 204 relative to the imaging device 202 in the third direction can be controlled to a second preset distance.

[0080] In some examples, when the third carrier device 204 includes a first component and a second component, the distance of the first component relative to the imaging device along the x-axis direction can be controlled to the first preset distance, or the distance of the first component relative to the second component along the x-axis direction can be controlled to the preset distance, and the distance of the second component relative to the imaging device along the y-axis direction can be controlled to the second preset distance, so as to adjust the observation position of the wafer.

[0081] Here, the target area of ​​the wafer to be observed may be predetermined. For example, the rotation angle of the second rotating member 301 of the detection device around the first axis may be controlled to a preset angle first, and then the positions of the first component and the second component may be adjusted.

[0082] The embodiment of the present application can adjust the observation position of the wafer by controlling the distance of the third supporting device relative to the imaging device along the first direction and the third direction, thereby improving the accuracy of wafer position determination, and facilitating subsequent adjustment of the wafer surface to the optimal focal plane to improve wafer observation efficiency.

[0083] Based on the same inventive concept, an embodiment of the present application also provides a device for determining a wafer position.

[0084] In some embodiments, Figure 6 As shown, an embodiment of the present application provides a device for determining the wafer position of a detection device, characterized in that it includes:

[0085] An acquisition module 601 is used to acquire the light intensity of the reflected light beam reflected by multiple points on the surface of the wafer and the coordinate values ​​of the multiple points in the second direction when the light source emits a light beam to the wafer;

[0086] A determination module 602 is used to determine a target point position whose light intensity is greater than a threshold value based on the light intensity of the reflected light beam reflected by the multiple points;

[0087] The determination module 602 is further configured to determine a target rotation angle of the first rotating member based on the coordinate value of the target point in the second direction, and control the rotation angle of the first rotating member to the target rotation angle.

[0088] The embodiment of the present application obtains the light intensity of the reflected light beam reflected by multiple points on the surface of the wafer and the coordinate values ​​of the multiple points in the second direction through an acquisition module, and determines the target point whose light intensity is greater than the threshold based on the determination module, and determines the target rotation angle of the first rotating part based on the coordinate value of the target point in the second direction. The position of the surface of the wafer can be quickly adjusted to the position of the optimal focal plane, thereby improving the observation efficiency of the wafer.

[0089] In some embodiments, the determination module may also be used to:

[0090] When the light source emits a light beam to the wafer and the distance between the second carrying device and the imaging device in the second direction continuously changes, a plurality of distances and a reflected image formed by the reflected light beam on the surface of the wafer corresponding to each distance are acquired;

[0091] The target distance corresponding to the reflected image with the maximum definition is determined, and the distance between the second carrying device and the imaging device on the first axis is controlled to the target distance.

[0092] In some embodiments, the wafer position determination device further includes a control device, which can be used to:

[0093] The distance of the third bearing device relative to the imaging device in the first direction is controlled to be a first preset distance, and the distance of the third bearing device relative to the imaging device in the third direction is controlled to be a second preset distance.

[0094] The device of the above embodiment is used to implement the corresponding wafer position determination method in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0095] Figure 7 A schematic diagram of the hardware structure of an electronic device provided in an application embodiment.

[0096] The electronic device 700 may include a processor 701 and a memory 702 storing computer program instructions.

[0097] Specifically, the processor 701 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0098] The memory 702 may include a large capacity memory for data or instructions. By way of example and not limitation, the memory 702 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive or a combination of two or more of these. In appropriate cases, the memory 702 may include a removable or non-removable (or fixed) medium. In appropriate cases, the memory 702 may be inside or outside the integrated gateway disaster recovery device. In a specific embodiment, the memory 702 is a non-volatile solid-state memory.

[0099] In certain embodiments, memory 702 includes a read-only memory (ROM). The ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically alterable ROM (EAROM), or flash memory, or a combination of two or more of the above, where appropriate.

[0100] The memory may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk storage medium device, an optical storage medium device, a flash memory device, an electrical, optical or other physical / tangible memory storage device. Thus, typically, the memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., a memory device) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the method according to the first aspect of the present application.

[0101] The processor 701 implements any one of the wafer position determination methods in the above embodiments by reading and executing computer program instructions stored in the memory 702 .

[0102] In one example, the electronic device may further include a communication interface 703 and a bus 704. Figure 7 The processor 701, the memory 702, and the communication interface 703 are connected via a bus 704 and communicate with each other.

[0103] The communication interface 703 is mainly used to implement communication between various modules, devices, units and / or equipment in the embodiments of the present application.

[0104] Bus 704 includes hardware, software or both, and the parts of online data flow billing equipment are coupled to each other. For example, but not limitation, bus may include accelerated graphics port (AGP) or other graphics bus, enhanced industrial standard architecture (EISA) bus, front-end bus (FSB), hypertransport (HT) interconnection, industrial standard architecture (ISA) bus, infinite bandwidth interconnection, low pin count (LPC) bus, memory bus, micro channel architecture (MCA) bus, peripheral component interconnection (PCI) bus, PCI-Express (PCI-X) bus, serial advanced technology attachment (SATA) bus, video electronics standard association local (VLB) bus or other suitable bus or two or more of these combinations. In appropriate cases, bus 704 may include one or more buses. Although the present application embodiment describes and shows a specific bus, the present application considers any suitable bus or interconnection.

[0105] The electronic device of the above-mentioned embodiment is used to implement the corresponding wafer position determination method in any of the above-mentioned embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.

[0106] In addition, in combination with the wafer position determination method in the above embodiments, the present application embodiment may provide a computer storage medium for implementation. The computer storage medium stores computer program instructions; when the computer program instructions are executed by a processor, any one of the wafer position determination methods in the above embodiments is implemented.

[0107] In addition, in combination with the wafer position determination method in the above embodiments, the present application embodiment can provide a computer program product for implementation. When the computer program product instructions are executed by a processor of an electronic device, any wafer position determination method in the above embodiments is implemented.

[0108] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0109] The functional blocks shown in the above-described block diagram can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present application are programs or code segments that are used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0110] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or devices based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

[0111] The above reference is according to the method of the embodiment of the present application, the flow chart of the device (device) and the computer program product and / or the block diagram described various aspects of the present application.It should be understood that each square box in the flow chart and / or the block diagram and the combination of each square box in the flow chart and / or the block diagram can be realized by computer program instructions.These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer or other programmable data processing device to produce a machine so that these instructions executed by the processor of the computer or other programmable data processing device enable the realization of the function / action specified in one or more square boxes of the flow chart and / or the block diagram.Such a processor can be but is not limited to a general-purpose processor, a special-purpose processor, a special application processor or a field programmable logic circuit.It can also be understood that each square box in the block diagram and / or the flow chart and the combination of the square boxes in the block diagram and / or the flow chart can also be realized by the dedicated hardware that performs the specified function or action, or can be realized by the combination of dedicated hardware and computer instructions.

[0112] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the above-described devices, modules and units can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application.

Claims

1. A detection device, characterized in that: include: A first bearing device, the first bearing device comprising a support member and a first rotating member, the first rotating member being rotatably connected to the support member around a first direction; a second carrying device, the second carrying device being arranged on the carrying surface of the first rotating member, the second carrying device being used to carry the wafer, and the second carrying device being movably arranged along a first axis relative to the first rotating member; wherein the first axis is perpendicular to the carrying surface of the first rotating member; An imaging device, disposed on one side of the first carrying device along a second direction, the first direction intersecting the second direction, and configured to measure coordinate values ​​of a plurality of points on the wafer in the second direction; A third carrying device is arranged on a side of the support member away from the imaging device, and the third carrying device is movably arranged relative to the imaging device in the first direction and the third direction, wherein the first direction, the second direction and the third direction intersect each other.

2. The detection device according to claim 1, characterized in that: The detection device further comprises a second rotating member, which is rotatable around the first axis and connected between the second bearing device and the first rotating member, and the second bearing device and the second rotating member are arranged to rotate synchronously.

3. The detection device according to claim 1, characterized in that: The third carrying device includes a first component and a second component, wherein the first component is movably arranged relative to the second component along the first direction, the first component is fixedly connected to the support member, and the second component is movably arranged relative to the imaging device along the third direction.

4. The detection device according to claim 1, characterized in that: The imaging device includes a collection device, which is used to collect the light intensity of the reflected light beam on the surface of the wafer, collect the image of the wafer surface, and collect the coordinate values ​​of multiple points on the wafer in the second direction.

5. The detection device according to claim 4, characterized in that: The imaging device further comprises an optical lens, which is arranged on one side of the acquisition device and is used to observe the wafer.

6. A method for determining the wafer position based on the detection device according to any one of claims 1 to 5, characterized in that: include: When a light source emits a light beam to the wafer, obtaining the light intensity of the reflected light beam reflected by a plurality of points on the surface of the wafer and the coordinate values ​​of the plurality of points in a second direction; Based on the light intensities of the reflected light beams reflected by the plurality of points, determining the target points where the light intensities are greater than a threshold value; A target rotation angle of the first rotating member is determined based on the coordinate value of the target point in the second direction, and the rotation angle of the first rotating member is controlled to reach the target rotation angle.

7. The method for determining the wafer position according to claim 6, characterized in that: After determining the target rotation angle of the rotating member corresponding to the maximum light intensity and controlling the rotation angle of the rotating member to the target rotation angle, the determination method further includes: When a light source emits a light beam to the wafer and the distance between the second carrying device and the imaging device in the second direction continuously changes, a plurality of distances and a reflected image formed by the reflected light beam on the surface of the wafer corresponding to each of the distances are acquired; Determine a target distance corresponding to a reflected image with maximum clarity, and control the distance between the second carrying device and the imaging device on the first axis to the target distance.

8. The method for determining the wafer position according to claim 6 or 7, characterized in that: Before obtaining a plurality of rotation angles of the first rotating member and the intensity of the reflected light beam on the surface of the wafer corresponding to each rotation angle when the light source emits a light beam to the wafer and the first rotating member in the detection device continuously rotates around the first direction, the method further includes: The distance of the third carrying device relative to the imaging device in the first direction is controlled to be a first preset distance, and the distance of the third carrying device relative to the imaging device in the third direction is controlled to be a second preset distance.

9. An electronic device, characterized in that: The device comprises: a processor, and a memory storing computer program instructions; The processor reads and executes the computer program instructions to implement the method for determining the wafer position as described in any one of claims 5 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer program instructions, and when the computer program instructions are executed by a processor, the method for determining the wafer position as described in any one of claims 6 to 8 is implemented.

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