Wafer lifting mechanism, processing device, wafer leveling method and storage medium

Abstract

The invention provides a wafer lifting mechanism, a processing device of a semiconductor device, a leveling method and a storage medium. The wafer lifting mechanism comprises a supporting seat, at least three ejector rods and a controller. The supporting seat is arranged below the heating disc, and at least three sensors are arranged on the supporting seat. The first ends of the at least three ejector rods upwards penetrate through the ejector rod through holes of the heating disc and are limited above the heating disc by the lug bosses positioned at the first ends, and the second ends of the at least three ejector rods are positioned below the heating disc and are in contact with the corresponding sensors when the supporting seat ascends, so that the at least three ejector rods are driven by the supporting seat to move towards the corresponding sensors. And the wafer is supported and driven by the first end to ascend. The controller is configured to record the time when the sensors make contact with the corresponding ejector rods in the rising process of the supporting base, and the heights of the sensors are determined by combining the rising speed of the supporting base. And leveling the wafer and the heating disc according to the height of each sensor.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, and in particular to a wafer lifting mechanism, a semiconductor device processing device, a wafer leveling method, and a computer-readable storage medium. Background Art

[0002] In the semiconductor manufacturing process, wafer handling and processing is one of the most important steps, especially in processes such as physical vapor deposition and chemical vapor deposition. The flatness of the wafer and the contact state with the heating plate directly affect the effect of the process and the quality of the product. Traditional wafer lifting technology uses fixed lifting pins to support and lift silicon wafers. However, existing wafer lifting technology mainly adjusts the height of the lifting pins through mechanical devices or electric drives, but these methods often cannot monitor whether the wafer is uneven in real time and accurately, or adjust the height of the ejector pins in time to achieve precise wafer leveling when unevenness is found. As a result, under certain process conditions, the accuracy of the wafer cannot be guaranteed, which may affect the performance and manufacturing efficiency of semiconductor devices.

[0003] In order to overcome the above-mentioned defects of the prior art, the art is in urgent need of an improved wafer lifting mechanism for real-time and accurate wafer leveling during the process of controlling wafer lifting, so as to improve the efficiency and accuracy of semiconductor device processing technology. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a wafer lifting mechanism, a semiconductor device processing device, a wafer leveling method and a computer-readable storage medium. The mechanism can record the time when each sensor contacts the corresponding push rod and combine the rising speed of the support base to control the wafer lifting and lowering. The method can level the wafer in real time and accurately, so as to improve the efficiency and accuracy of the semiconductor device processing technology.

[0006] Specifically, the wafer lifting mechanism provided according to the first aspect of the present invention includes a support seat, at least three push rods and a controller. The support seat is arranged below the heating plate, and at least three sensors are arranged on it. The first ends of the at least three push rods pass upward through the push rod through holes of the heating plate, and are limited by the raised portion located at the first end to be located above the heating plate, while the second ends thereof are located below the heating plate, and contact the corresponding sensors when the support seat rises, so as to support and drive the wafer to rise via the first end under the drive of the support seat. The controller is configured to: during the rising process of the support seat, record the time when each of the sensors contacts the corresponding push rod, and determine the height of each of the sensors in combination with the rising speed of the support seat; and level the wafer and the heating plate according to the height of each of the sensors.

[0007] Furthermore, in some embodiments of the present invention, during the process of the support base rising, the step of recording the time when each of the sensors contacts the corresponding push rod, and combining the rising speed of the support base to determine the height of each of the sensors includes: recording the first moment T1 when the support base starts to rise from an initial position where it does not contact the push rods; driving the support base to rise at a uniform speed v; in response to any of the sensors contacting the corresponding push rod, recording the corresponding second moment T2, and determining the time t when the sensor i contacts the corresponding push rod i = T2-T1; and according to the time t of each sensor i contacting the corresponding ejector rod i , and the speed v of the support seat rising, determine the height z of each sensor i i =H–v×t i . H is the distance from the initial position to the second end of each of the push rods.

[0008] Furthermore, in some embodiments of the present invention, the at least three sensors are respectively provided on the support base via corresponding vertical voltage-controlled drivers. The step of leveling the support base and the heating plate according to the height of each of the sensors comprises: determining a reference height from the height of each of the sensors, and defining the corresponding sensor as a first sensor; determining corresponding voltage adjustment amounts according to the difference between the second height of each of the remaining second sensors and the reference height; and adjusting the driving voltage of the second vertical voltage-controlled driver corresponding to each of the second sensors according to each of the voltage adjustment amounts to perform leveling height compensation.

[0009] Further, in some embodiments of the present invention, the last sensor that contacts the corresponding push rod is defined as the first sensor, the time when the sensor contacts the corresponding push rod is defined as the reference time t0, and the difference between the remaining second sensors and the reference height is represented by Δz i=v×(t0-t i ).

[0010] Furthermore, in some embodiments of the present invention, a pipeline extending in the vertical direction is provided inside the vertical pressure-controlled driver. The data line of the sensor reaches the bottom of the support seat through the pipeline, and is led out of the process chamber together with the control line of the vertical pressure-controlled driver to connect to the controller.

[0011] Furthermore, in some embodiments of the present invention, a leveling unit for driving the support base to tilt in multiple directions is provided on the support base. The step of leveling the wafer and the heating plate according to the height of each sensor comprises: determining the spatial coordinates of each sensor according to the height of each sensor and its installation position on the support base; fitting the plane equation of the plane where each sensor is located according to the spatial coordinates of each sensor; determining the inclination angle of the plane relative to the plane where the heating plate is located according to the plane equation; and driving the leveling unit according to the inclination angle to perform angle compensation for leveling the support base.

[0012] Further, in some embodiments of the present invention, the wafer lifting mechanism includes three push rods. The support seat is provided with three sensors correspondingly. Each push rod and each sensor is arranged around the center of the heating plate and the support seat at an angle interval of 120°. The spatial coordinates of each sensor are expressed as The plane equation of the plane where each of the sensors is located is expressed as Ax+By+Cz+D=0. The inclination angle between the plane where each sensor is located and the horizontal plane where the heating plate is located is expressed as

[0013] Furthermore, in some embodiments of the present invention, the sensor is a pressure sensor, which transmits a sensing signal of contact with the corresponding ejector pin to the controller in response to the pressure received being greater than a preset threshold.

[0014] In addition, the processing device of the semiconductor device provided according to the second aspect of the present invention comprises a process chamber and a wafer lifting mechanism as provided in the first aspect of the present invention. The process chamber is provided with a heating plate for carrying and heating a wafer to perform a processing process on it. The wafer lifting mechanism is used to lift the wafer and level the wafer and the heating plate.

[0015] In addition, the wafer leveling method provided according to the third aspect of the present invention includes the following steps: during the rising process of the support base of the wafer lifting mechanism provided by the first aspect of the present invention, recording the time when at least three sensors thereon contact the corresponding push rods; determining the height of each of the sensors according to the time when each of the sensors contacts the corresponding push rods and the rising speed of the support base; and leveling the wafer and the heating plate according to the height of each of the sensors.

[0016] Furthermore, in some embodiments of the present invention, the at least three sensors are respectively provided on the support seat via corresponding vertical voltage-controlled drivers. The support seat is provided with a leveling unit for driving the support seat to tilt in multiple directions. The step of leveling the wafer and the heating plate according to the height of each of the sensors comprises: in response to the operation of replacing the heating plate, the support seat is leveled with angle compensation according to the height of each of the sensors via the leveling unit; and in response to each time the heating plate obtains a wafer to be processed, the wafer is leveled with height compensation according to the height of each of the sensors via the vertical voltage-controlled drivers corresponding to each of the sensors.

[0017] In addition, the computer-readable storage medium provided in the fourth aspect of the present invention stores computer instructions, which, when executed by a processor, implement the wafer leveling method provided in the third aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0019] Figure 1 A schematic structural diagram of a wafer lifting mechanism provided according to some embodiments of the present invention is shown.

[0020] Figure 2 A cross-sectional schematic diagram of a wafer lifting mechanism provided according to some embodiments of the present invention is shown.

[0021] Figure 3 A schematic structural diagram of a sensor on a support base provided according to some embodiments of the present invention is shown.

[0022] Figure 4 A schematic cross-sectional view of a support rod provided according to some embodiments of the present invention is shown.

[0023] Figure 5 A schematic structural diagram of a lateral voltage-controlled driver provided according to some embodiments of the present invention is shown.

[0024] Figure 6 A schematic cross-sectional view of a support rod provided according to some embodiments of the present invention is shown.

[0025] Figure 7 A schematic flow chart of a wafer leveling method provided according to some embodiments of the present invention is shown.

[0026] Figure 8 A schematic diagram showing the spatial coordinates of a wafer lifting structure provided according to some embodiments of the present invention is shown.

[0027] Fig. 9 A schematic diagram of the plane coordinates of a wafer lifting structure provided according to some embodiments of the present invention is shown.

[0028] Fig.10 A schematic diagram of wafer leveling according to some embodiments of the present invention is shown.

[0029] Fig.11 A schematic flow chart of a method for processing a semiconductor device according to some embodiments of the present invention is shown.

[0030] Fig.12 A schematic diagram showing the offset between a wafer and a heating plate provided according to some embodiments of the present invention is shown.

[0031] Fig.13 A schematic diagram showing the lateral offset between the center of a wafer and the center of a heating plate provided according to some embodiments of the present invention is shown. DETAILED DESCRIPTION

[0032] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0035] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0036] As mentioned above, the existing wafer lifting technology mainly adjusts the height of the lifting pins through mechanical devices or electric drives, but these methods are often unable to monitor in real time and accurately whether the wafer is uneven, or to adjust the height of the ejector pins in time to achieve precise leveling of the wafer when unevenness is found. As a result, under certain process conditions, the accuracy of the wafer cannot be guaranteed, which may affect the performance and manufacturing efficiency of semiconductor devices.

[0037] In order to overcome the above-mentioned defects of the prior art, the present invention provides a wafer lifting mechanism, a semiconductor device processing device, a wafer leveling method and a computer-readable storage medium. The mechanism can record the time when each sensor contacts the corresponding push rod and combine the rising speed of the support base to control the wafer lifting and lowering. The method can level the wafer in real time and accurately, so as to improve the efficiency and accuracy of the semiconductor device processing technology.

[0038] In some non-limiting embodiments, the wafer lifting mechanism provided in the first aspect of the present invention can be configured in the processing device of the semiconductor device provided in the second aspect of the present invention for implementation. Specifically, the processing device of the semiconductor device provided in the second aspect of the present invention includes a process chamber and the wafer lifting mechanism provided in the first aspect of the present invention. Here, a heating plate is configured in the process chamber for carrying and heating the wafer to perform a processing process on it. The wafer lifting mechanism is used to lift the wafer and level the wafer and the heating plate.

[0039] Please refer to the reference for details Figure 1 to Figure 3 . Figure 1 A schematic structural diagram of a wafer lifting mechanism provided according to some embodiments of the present invention is shown. Figure 2 A cross-sectional schematic diagram of a wafer lifting mechanism provided according to some embodiments of the present invention is shown. Figure 3 A schematic structural diagram of a sensor on a support base provided according to some embodiments of the present invention is shown.

[0040] exist Figure 1 and Figure 2 In the illustrated embodiment, the wafer lifting mechanism provided by the first aspect of the present invention includes a support seat 11 and at least three ejector pins 12. Here, the support seat 11 is arranged below the heating plate 13, and at least three sensors 111 are arranged thereon. The first ends of the at least three ejector pins 12 pass upward through the ejector pin holes of the heating plate 13, and are limited to the upper part of the heating plate 13 by the protrusions located at the first ends, while the second ends thereof are located below the heating plate 13, and contact the corresponding sensors 111 when the support seat 11 rises, so as to support and drive the wafer 14 to rise via the first ends under the drive of the support seat 11.

[0041] In addition, in some preferred embodiments, a plurality of support members are provided on the support seat 11, and a transverse pressure-controlled driver is provided in the support member along multiple horizontal directions. The first ends of the plurality of push rods 12 pass upward through the push rod through holes of the heating plate 13, and are limited by the protrusions at the first ends to be located above the heating plate 13, while the second ends thereof are located below the heating plate 13 and aligned with the corresponding support members.

[0042] Please refer to the following for further reference Figure 4 and Figure 5 . Figure 4 A schematic cross-sectional view of a support rod provided according to some embodiments of the present invention is shown. Figure 5 A schematic structural diagram of a lateral voltage-controlled driver provided according to some embodiments of the present invention is shown.

[0043] exist Figure 4 and Figure 5In the embodiment shown, the lateral voltage-controlled driver includes a first deformation layer 51, a second deformation layer 52 and an insulating layer 53. Here, the first deformation layer 51 is arranged along a preset X direction, and is used to deform along the X direction according to the first driving voltage received. The second deformation layer 52 is arranged along a preset Y direction, and is used to deform along the Y direction according to the second driving voltage received. The insulating layer 53 is arranged between the first deformation layer 51 and the second deformation layer 52 to isolate the first driving voltage from the second driving voltage.

[0044] Those skilled in the art will understand that Figure 5 The embodiments shown in which the first deformation layer 51 and the second deformation layer 52 are respectively arranged along the preset X direction and the preset Y direction are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, but are not intended to limit the scope of protection of the present invention.

[0045] Optionally, in other embodiments, those skilled in the art may further provide deformation layers along three directions with an angle of 120° in the lateral pressure-controlled actuator, so that the lateral pressure-controlled actuator is deformed along three directions with an angle of 120°.

[0046] Please continue to refer to Figure 2 , Figure 3 and Figure 6 . Figure 6 A schematic cross-sectional view of a support rod provided according to some embodiments of the present invention is shown.

[0047] exist Figure 2 , Figure 3 and Figure 6 In the embodiment shown, the support member further includes a support rod and a support head. The support rod is connected to the support seat 11 and lifts the lateral pressure-controlled driver to a preset height. The support head is installed on the support rod via the lateral pressure-controlled driver to contact and support the corresponding ejector rod. Here, a limit hole is provided on the support head for inserting the second end of the ejector rod 12 to prevent the ejector rod 12 from lateral displacement relative to the support head.

[0048] Further, in Figure 6 In the illustrated embodiment, the inner wall of each ejector pin through hole maintains an adjustment gap with the corresponding ejector pin 12. Here, the upper end of each ejector pin through hole is configured as an inwardly concave slope structure, and / or the lower end of each protrusion is configured as an inwardly protruding slope structure, so as to achieve automatic centering between each ejector pin and the corresponding ejector pin through hole after each ejector pin falls back.

[0049] In this way, the wafer lifting mechanism provided in the first aspect of the present invention can achieve a wide range of wafer centering adjustment while avoiding radial shaking of the push rod caused by excessive gaps by setting an automatically returning push rod and a lateral pressure-controlled driver for step-by-step adjustment of the position of the wafer 14.

[0050] In addition, in some non-limiting embodiments, the wafer lifting mechanism provided in the first aspect of the present invention includes a memory and a controller 10. Here, the memory includes but is not limited to the computer-readable storage medium provided in the fourth aspect, on which computer instructions are stored. The controller 10 is connected to the memory and is configured to execute the computer instructions stored in the memory to implement the wafer leveling method provided in the third aspect of the present invention.

[0051] The working principle of the above-mentioned wafer lifting mechanism will be described below in conjunction with some embodiments of the wafer leveling method. Those skilled in the art will understand that these embodiments of the wafer leveling method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than limiting all functions or all working modes of the wafer lifting mechanism. Similarly, the wafer lifting mechanism is also only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the execution subject and execution order of each step in these wafer leveling methods.

[0052] Please refer to Figure 7 . Figure 7 A schematic flow chart of a wafer leveling method provided according to some embodiments of the present invention is shown.

[0053] like Figure 7 As shown, during the rising process of the support base 11 of the wafer lifting mechanism provided by the first aspect of the present invention, the controller 10 can record the time when at least three sensors 111 thereon contact the corresponding ejector pins 12. Afterwards, the controller 10 can determine the height of each sensor 111 according to the time when each sensor 111 contacts the corresponding ejector pin 12 and the rising speed of the support base 11.

[0054] Specifically, the controller 10 may first record the first moment T1 when the support base 11 starts to rise from an initial position where it does not contact the push rods 12 .

[0055] Afterwards, the controller 10 can drive the support base 11 to rise at a constant speed v.

[0056] Afterwards, in response to any sensor 111 contacting the corresponding ejector rod 12, the controller 10 may record the corresponding second moment T2 and determine the time t2 at which the sensor 111 contacts the corresponding ejector rod 12. i =T2-T1.

[0057] Then, the controller 10 can determine the time t of each sensor i contacting the corresponding push rod. i , and the speed v of the support base 11 rising, determine the height z of each sensor i i =H–v×t i Here, H is the distance from the initial position to the second end of each push rod 12.

[0058] Thereafter, the controller 10 may level the wafer 14 and the heating plate 13 according to the heights of the sensors 111 .

[0059] Specifically, in Figure 1 In the illustrated embodiment, the at least three sensors are disposed on the support base 11 via corresponding vertical pressure-controlled drivers 112 (e.g., PZT drivers disposed in the vertical direction). In response to the heating plate 13 acquiring the wafer 14 to be processed each time, the controller 10 can perform leveling height compensation on the wafer 14 according to the height of each sensor 111 via the vertical pressure-controlled drivers 112 corresponding to each sensor 111.

[0060] Furthermore, in the process of leveling the wafer 14 and the heating plate 13, the controller 10 may first determine a reference height from the heights of the sensors 111, and define the corresponding sensor as the first sensor. Afterwards, the controller 10 may respectively determine the corresponding voltage adjustment amount according to the difference between the second heights of the remaining second sensors and the reference height. Afterwards, the controller 10 may adjust the driving voltage of the second vertical voltage-controlled driver corresponding to each second sensor according to each voltage adjustment amount to compensate for the leveling height.

[0061] In this way, the wafer lifting mechanism provided in the first aspect of the present invention does not need to adjust the support base 11 itself, but only needs to adjust the height of the sensor 111 to achieve the leveling of the heating plate 11. Therefore, it has higher real-time performance and is more suitable for online adjustment during the lifting process.

[0062] Those skilled in the art can understand that Figure 3 The embodiments shown in which the vertical pressure-controlled driver 112 is set on the support base 11 are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit the scope of protection of the present invention.

[0063] Optionally, in other embodiments, those skilled in the art may also dispose the vertical pressure-controlled driver 112 on each push rod 12 .

[0064] Further, in some embodiments, the controller 10 may use the minimum height as the reference height of the sensor 111. Specifically, the controller 10 may define the last sensor that contacts the corresponding push rod as the first sensor, the time when the sensor contacts the corresponding push rod as the reference time t0, and the difference between the remaining second sensors and the reference height is represented by Δz i =v×(t0-t i ).

[0065] Those skilled in the art will appreciate that the above-mentioned embodiments using the minimum height as the reference height of the sensor 111 are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concepts of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit the scope of protection of the present invention.

[0066] Optionally, in other embodiments, those skilled in the art may also select the maximum height, or any intermediate height as the reference height of the sensor 111 .

[0067] In addition, Figure 2 In the illustrated embodiment, a pipeline extending in the vertical direction is provided inside the vertical voltage-controlled driver 112 . The data line of the sensor 111 reaches the bottom of the support seat 11 through the pipeline and is led out of the process chamber together with the control line of the vertical voltage-controlled driver 112 to connect to the controller 10 .

[0068] In addition, in some preferred embodiments, the above-mentioned wafer lifting mechanism provided in the first aspect of the present invention can also use a leveling unit to perform offline leveling after replacing the heating plate, and use the vertical voltage-controlled driver 112 to perform online fine-tuning after each wafer 14 is obtained, so as to compensate for the slight tilt of the heating plate 13 caused by factors such as the wafer 14 being not placed in the center and the uneven weight of the wafer 14, thereby further improving the processing accuracy of the wafer 14.

[0069] Specifically, a leveling unit for driving the support base 11 to tilt in multiple directions is provided on the support base 11. In response to the operation of replacing the heating plate, the controller 10 can compensate the angle of leveling the support base 11 according to the height of each sensor 111 through the leveling unit.

[0070] Furthermore, in the process of leveling the wafer 14 and the heating plate 13, the controller 10 can first determine the spatial coordinates of each sensor 111 according to the height of each sensor 111 and its installation position on the support base 11. Afterwards, the controller 10 can fit the plane equation of the plane where each sensor is located according to the spatial coordinates of each sensor, and determine the inclination angle of the plane relative to the plane where the heating plate 13 is located according to the plane equation. Afterwards, the controller 10 can drive the leveling unit according to the inclination angle to perform angle compensation for leveling the support base 11.

[0071] Please refer to the following for further reference Figure 8 to Figure 10 . Figure 8 A schematic diagram showing the spatial coordinates of a wafer lifting structure provided according to some embodiments of the present invention is shown. Fig. 9 A schematic diagram of the plane coordinates of a wafer lifting structure provided according to some embodiments of the present invention is shown. Fig.10 A schematic diagram of wafer leveling according to some embodiments of the present invention is shown.

[0072] like Figure 8 to Figure 10 As shown, the wafer lifting mechanism provided by the first aspect of the present invention includes three push rods 12, and three sensors 111 are correspondingly arranged on the support seat 11. Each push rod 12 and each sensor 111 are arranged at an angle of 120° around the center of the heating plate 13 and the support seat 11. Here, the spatial coordinates of each sensor 111 are expressed as P1(0,-r,z1),

[0073] like Figure 8 As shown, the plane equation of the plane where each sensor 111 is located is expressed as Ax+By+Cz+D=0, where: The inclination angle between the plane where each sensor 111 is located and the horizontal plane where the heating plate 13 is located is expressed as

[0074] In addition, in some optional embodiments, the sensor 111 is a pressure sensor, which transmits a sensing signal of contacting the corresponding push rod to the controller 10 in response to the pressure being greater than a preset threshold.

[0075] In addition, in some preferred embodiments, the above-mentioned wafer lifting mechanism provided in the first aspect of the present invention can be used to adjust the centering of the wafer 14 and the heating plate 13 by setting an automatic return pin 12 and a lateral pressure-controlled driver for step-by-step adjustment of the wafer position, so as to improve the efficiency and accuracy of the semiconductor device processing technology.

[0076] Please refer to Figure 11 to Figure 13 . Fig.11 A schematic flow chart of a method for processing a semiconductor device according to some embodiments of the present invention is shown. Fig.12 A schematic diagram showing the offset between a wafer and a heating plate provided according to some embodiments of the present invention is shown. Fig.13 A schematic diagram showing the lateral offset between the center of a wafer and the center of a heating plate provided according to some embodiments of the present invention is shown.

[0077] like Fig.11As shown, the controller 10 can first lift the support base 11 of the above-mentioned wafer lifting mechanism provided in the first aspect of the present invention, and contact and support the second ends of the multiple ejector rods 12 through its multiple support members to obtain the wafer 14 to be processed through the first ends of the multiple ejector rods 12.

[0078] Afterwards, if Fig.12 and Fig.13 As shown, the controller 10 can determine the lateral offset between the wafer 14 and the heating plate 13 .

[0079] Thereafter, the controller 10 may adjust the driving voltage of the lateral voltage-controlled drivers of the plurality of support members in the corresponding direction according to the lateral offset, so as to adjust the centering of the wafer 14 and the heating plate 13 .

[0080] Specifically, the controller 10 may first compare the lateral offset with the size of the adjustment gap between the inner wall of each push rod through hole and the corresponding push rod. Then, in response to the lateral offset being smaller than the adjustment gap, the controller 10 may determine the driving voltage of the lateral voltage-controlled driver in the corresponding direction according to the lateral offset.

[0081] In this way, the wafer lifting mechanism provided in the first aspect of the present invention can complete the centering adjustment of the wafer 14 and the heating plate 13 through a single lateral offset when the lateral offset is small.

[0082] Thereafter, in response to the lateral offset being greater than or equal to the adjustment gap, the controller 10 may determine the driving voltage of the lateral voltage-controlled driver in the corresponding direction according to the adjustment gap to perform the first step of centering adjustment between the wafer and the heating plate.

[0083] Afterwards, in response to completing the first step of centering adjustment, the controller 10 can lower the support seat to disengage each support member from the second end of the corresponding push rod, and make each push rod fall back to place the wafer back on the upper surface of the heating plate, and realize automatic centering of each push rod and the corresponding push rod through hole through the ramp structure.

[0084] Thereafter, in response to the lowering of the support base, the controller 10 may again determine the lateral offset between the wafer and the heating plate.

[0085] Thereafter, in response to the lateral offset being greater than a preset error threshold, the controller 10 may lift the support base again and adjust the driving voltage of the lateral voltage-controlled driver in the corresponding direction to perform a second step of centering adjustment between the wafer and the heating plate.

[0086] This cycle is repeated until the lateral offset is less than or equal to the error threshold specified by the processing technology. In this way, the wafer lifting mechanism provided by the first aspect of the present invention can complete the centering adjustment of the wafer 14 and the heating plate 13 through multiple lateral offsets when the lateral offset is large.

[0087] Thereafter, in response to the completion of the centering adjustment, the controller 10 may lower the support seat 11 to disengage each support member from the second end of the corresponding ejector pin 12 , and to make each ejector pin 12 fall back to place the wafer 14 back onto the upper surface of the heating plate 13 .

[0088] Thereafter, the controller 10 may heat the wafer 14 via the heating plate 13 to process the wafer 14 .

[0089] In summary, the wafer lifting mechanism, semiconductor device processing device, wafer leveling method and computer-readable storage medium provided by the present invention can record the time when each sensor contacts the corresponding ejector pin, and combined with the rising speed of the support base, can be used to control the wafer lifting process, and level the wafer in real time and accurately, so as to improve the efficiency and accuracy of the semiconductor device processing technology. In addition, it is also possible to set an ejector pin that automatically returns and a lateral pressure-controlled driver that step-by-step adjusts the wafer position, so as to adjust the centering of the wafer and the heating plate, so as to improve the efficiency and accuracy of the semiconductor device processing technology.

[0090] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0091] Although the controller described in the above embodiments can be implemented by a combination of software and hardware. However, it is understood that the controller can also be implemented in software and hardware. For hardware implementation, the controller can be implemented in one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection combination of the above devices. For software implementation, the controller can be implemented by independent software modules such as procedures and functions running on a general-purpose chip, each of which performs one or more functions and operations described herein.

[0092] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0093] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0094] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer lifting mechanism, characterized in that: include: A support base is arranged below the heating plate and has at least three sensors arranged thereon; At least three push rods, the first ends of which pass upward through the push rod through holes of the heating plate and are limited by the protrusions located at the first ends to be located above the heating plate, and the second ends of which are located below the heating plate and contact the corresponding sensors when the support seat rises, so as to support and drive the wafer to rise via the first ends under the drive of the support seat; as well as The controller is configured to: during the rising process of the support base, record the time when each sensor contacts the corresponding push rod, and determine the height of each sensor in combination with the rising speed of the support base; and level the wafer and the heating plate according to the height of each sensor.

2. The wafer lifting mechanism according to claim 1, characterized in that: The step of recording the time when each sensor contacts the corresponding push rod during the process of the support base rising, and combining the rising speed of the support base to determine the height of each sensor comprises: Recording the first moment T1 when the support seat starts to rise from the initial position where it does not contact the push rods; Driving the support seat to rise at a constant speed v; In response to any of the sensors contacting the corresponding ejector rod, the corresponding second moment T2 is recorded, and the time t at which the sensor i contacts the corresponding ejector rod is determined. i = T2 - T1; and According to the time t of each sensor i contacting the corresponding push rod i , and the speed v of the support seat rising, determine the height z of each sensor i i =H–v×t i , wherein H is the distance from the initial position to the second end of each of the push rods.

3. The wafer lifting mechanism according to claim 2, characterized in that: The at least three sensors are respectively arranged on the support base via corresponding vertical pressure-controlled drivers, and the step of leveling the support base and the heating plate according to the height of each of the sensors comprises: Determine a reference height from the heights of the sensors, and define the corresponding sensor as a first sensor; determining corresponding voltage adjustment amounts respectively according to differences between the second heights of the remaining second sensors and the reference height; and According to each of the voltage adjustment amounts, the driving voltage of the second vertical voltage-controlled driver corresponding to each of the second sensors is adjusted to perform leveling height compensation therefor.

4. The wafer lifting mechanism according to claim 3, characterized in that: The last sensor that contacts the corresponding push rod is defined as the first sensor, and the time when the sensor contacts the corresponding push rod is defined as the reference time t0. The difference between the remaining second sensors and the reference height is represented by Δz i =v×(t0-t i ).

5. The wafer lifting mechanism according to claim 3, characterized in that: A pipeline extending in the vertical direction is provided inside the vertical pressure-controlled driver. The data line of the sensor reaches the bottom of the support seat through the pipeline and is led out of the process chamber together with the control line of the vertical pressure-controlled driver to connect to the controller.

6. The wafer lifting mechanism according to claim 2 or 3, characterized in that: The support base is provided with a leveling unit for driving the support base to tilt in multiple directions. The step of leveling the wafer and the heating plate according to the height of each sensor includes: Determine the spatial coordinates of each sensor according to the height of each sensor and its installation position on the support base; According to the spatial coordinates of each sensor, a plane equation of the plane on which the sensor is located is fitted; According to the plane equation, determining its inclination angle relative to the plane where the heating plate is located; and The leveling unit is driven according to the tilt angle to perform angle compensation for leveling the support base.

7. The wafer lifting mechanism according to claim 6, characterized in that: The wafer lifting mechanism includes three push rods, and three sensors are correspondingly arranged on the support seat. Each push rod and each sensor are arranged at an angle of 120° around the center of the heating plate and the support seat. The spatial coordinates of each sensor are represented as P1(0,-r,z1), The plane equation of the plane where each of the sensors is located is expressed as Ax+By+Cz+D=0, where: The inclination angle between the plane where each sensor is located and the horizontal plane where the heating plate is located is expressed as 8. The wafer lifting mechanism according to claim 7, characterized in that: The sensor is a pressure sensor, which transmits a sensing signal of contacting the corresponding ejector pin to the controller in response to the pressure being greater than a preset threshold.

9. A semiconductor device processing device, characterized in that: include: A process chamber is provided with a heating plate for carrying and heating the wafer to perform a processing process on it; as well as The wafer lifting mechanism according to any one of claims 1 to 8 is used to lift the wafer and level the wafer and the heating plate.

10. A wafer leveling method, characterized in that: The following steps are involved: During the rising process of the support base of the wafer lifting mechanism according to any one of claims 1 to 8, recording the time when at least three sensors thereon contact the corresponding ejector pins; Determining the height of each sensor according to the time when each sensor contacts the corresponding push rod and the rising speed of the support base; and The wafer and the heating plate are leveled according to the height of each of the sensors.

11. The leveling method according to claim 10, characterized in that: The at least three sensors are respectively arranged on the support seat via corresponding vertical pressure-controlled drivers, and the support seat is provided with a leveling unit for driving the support seat to tilt in multiple directions. The step of leveling the wafer and the heating plate according to the height of each of the sensors includes: In response to the operation of replacing the heating plate, the support base is leveled by the leveling unit according to the height of each sensor to compensate for the angle; and In response to the heating plate acquiring a wafer to be processed each time, the vertical voltage-controlled driver corresponding to each sensor performs height compensation for leveling the wafer according to the height of each sensor.

12. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the wafer leveling method according to claim 10 or 11 is implemented.

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