Glass substrate, manufacturing method and packaging method of glass substrate and electronic device

Abstract

The invention provides a glass substrate, a manufacturing method of the glass substrate, a packaging method of the glass substrate and an electronic device, and relates to the technical field of semiconductor manufacturing. The glass substrate comprises a substrate main body and a protection frame, the substrate main body comprises a wiring through hole penetrating through the substrate main body, the protection frame at least partially surrounds the peripheral side of the substrate main body, and the structural strength of the protection frame is larger than that of the substrate main body. According to the structure, the protective frame is arranged on the peripheral side of the substrate main body, so that the structural strength and rigidity of the trepanning area of the glass substrate can be enhanced, the fragment risk caused by strength reduction due to trepanning of the glass substrate in the subsequent manufacturing process is reduced, the production yield and reliability are improved, and the production loss cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and more specifically, to a glass substrate, a method for manufacturing a glass substrate, a packaging method, and an electronic device. Background Art

[0002] With the continuous development of semiconductor manufacturing technology, through glass via (TGV) technology is widely used in integrated circuit and microsystem packaging. Through TGV technology, tiny through holes can be made on glass substrates to achieve high-density interconnected packaging structures. However, glass substrates in the prior art often face a high risk of damage during post-processing operations, and the production cost is high. Summary of the invention

[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a glass substrate, a method for manufacturing a glass substrate, a packaging method and an electronic device.

[0004] In a first aspect, an embodiment of the present application provides a glass substrate, wherein the glass substrate comprises a substrate body, a protection frame, a wiring layer and a filling layer;

[0005] The substrate body comprises a wiring through hole penetrating the substrate body, and the wiring layer is located on the surface of the substrate body and the inner wall of the wiring through hole;

[0006] The protection frame at least partially surrounds the circumference of the substrate body, and the structural strength of the protection frame is greater than the structural strength of the substrate body;

[0007] The filling layer is located on the inner wall of the wiring through hole and the surface of the substrate body and the protection frame.

[0008] In a possible implementation, in a direction perpendicular to the plane where the substrate body is located, the height of the substrate body is consistent with the height of the protection frame, and the surface of the substrate body is flush with the surface of the protection frame.

[0009] In a possible implementation, the routing layer includes a seed layer and a metal layer;

[0010] The seed layer is located on the surface of the substrate body and the inner wall of the wiring through hole, and the metal layer is located on a side of the seed layer away from the substrate body.

[0011] In a possible implementation, the protection frame includes a steel plate frame and a copper clad plate frame.

[0012] In a second aspect, the present invention further provides a method for manufacturing a glass substrate, the method comprising:

[0013] Providing a substrate body, and patterning the substrate body to obtain a wiring through hole penetrating the substrate body;

[0014] Making a wiring layer on the inner wall of the wiring through hole and the surface of the substrate body;

[0015] Providing a protection frame matching the shape of the substrate body, and placing the substrate body in the corresponding protection frame, wherein the structural strength of the protection frame is greater than the structural strength of the substrate body;

[0016] A filling layer for fixing the substrate body and the protection frame is manufactured so that the filling layer fills the wiring through hole and covers the surface of the substrate body and the protection frame.

[0017] In a possible implementation, the step of manufacturing a wiring layer on the inner wall of the wiring through hole and the surface of the substrate body includes:

[0018] A seed layer is formed on the surface of the substrate body and the inner wall of the wiring through hole, and a wiring layer is formed on the surface of the seed layer.

[0019] In a possible implementation, before the step of providing a protective frame matching the shape of the substrate body and placing the substrate body in the corresponding protective frame, the method further includes:

[0020] Providing a protective steel plate;

[0021] The protective steel plate is laser-perforated based on the shape of the substrate body, and a groove matching the shape of the substrate body is formed on the protective steel plate to obtain the protective frame.

[0022] In a possible implementation, the step of manufacturing a filling layer for fixing the substrate body and the protection frame so that the filling layer fills the wiring through hole and covers the surface of the substrate body and the protection frame includes:

[0023] Transferring the protective frame on which the substrate body is placed to a carrying plate, wherein the substrate body and a first side of the protective frame are in contact with the carrying plate;

[0024] Making a filling layer that fills the wiring through hole and covers the substrate body and the second side of the protection frame;

[0025] The carrier plate is removed, and a filling layer is formed on the first side of the substrate body and the protection frame.

[0026] In a third aspect, an embodiment of the present application further provides a packaging method, the method comprising:

[0027] Providing the glass substrate according to any one of the first aspects above;

[0028] Manufacturing communication layers on two opposite sides of the glass substrate, and performing plastic sealing on the glass substrate to obtain a packaging structure, wherein the communication layer includes a chip layer and a redistribution layer;

[0029] The packaging structure is cut and the protection frame is removed to obtain a packaging structure including the substrate body.

[0030] In a fourth aspect, an embodiment of the present application further provides an electronic device, comprising a glass substrate as described in any one of the first aspects, or a glass substrate manufactured according to the method for manufacturing a glass substrate as described in any one of the second aspects.

[0031] Based on any of the above aspects, the glass substrate, the manufacturing method of the glass substrate, the packaging method and the electronic device provided in the embodiments of the present application include a substrate body and a protective frame, the substrate body includes a wiring through hole penetrating the substrate body, the protective frame at least partially surrounds the peripheral side of the substrate body, and the structural strength of the protective frame is greater than the structural strength of the substrate body. In the above structure, the protective frame is provided on the peripheral side of the substrate body, which can enhance the structural strength and rigidity of the opening area of ​​the glass substrate, reduce the risk of glass substrate breakage caused by the reduction of strength due to the opening in the subsequent process, improve production yield and reliability, and reduce production loss costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 A structural diagram of a glass substrate provided in an embodiment of the present application Figure 1 ;

[0034] Figure 2 A top view of the glass substrate provided in the embodiment of the present application Figure 1 ;

[0035] Figure 3 A top view of the glass substrate provided in the embodiment of the present application Figure 2 ;

[0036] Figure 4 A schematic diagram of a process for manufacturing a glass substrate provided in an embodiment of the present application;

[0037] Figure 5 for Figure 4 The corresponding process diagram;

[0038] Figure 6 for Figure 4 A schematic flow chart of a sub-step of step S140;

[0039] Figure 7 for Figure 6 The corresponding process diagram;

[0040] Figure 8 A schematic diagram of a process flow of a packaging method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0042] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0043] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0044] In the description of this application, it should be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0045] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "disposed", "connected", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0046] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0047] The inventors analyzed and found that after the glass substrate was punched, the overall strength of the glass substrate decreased, especially the strength of the punched area was not high. In the subsequent process, the hole wall of the wiring through hole was easily affected by factors such as vibration and thermal stress, resulting in excessive local stress, thereby causing damage to the glass substrate, i.e., fragmentation.

[0048] To solve the problems in the prior art, please refer to Figure 1 The embodiment of the present application provides a glass substrate 10 , which includes a substrate body 110 , a wiring layer 120 , a protection frame 130 and a filling layer 140 .

[0049] The substrate body 110 includes a wiring through hole 111 that penetrates the substrate body 110, and the wiring layer 120 is located on the surface of the substrate body 110 and the inner wall of the wiring through hole 111, that is, the wiring layer 120 can realize electrical connection on both sides of the substrate body 110 via the wiring through hole 111. Specifically, the wiring layer 120 may include a seed layer 121 and a metal layer 122, the seed layer 121 may be located on the surface of the substrate body 110 and the inner wall of the wiring through hole 111, and the metal layer 122 is located on the side of the seed layer 121 away from the substrate body 110, wherein the seed layer 121 can improve the adhesion between the metal layer 122 and the substrate body 110, and the material of the seed layer 121 and the metal layer 122 may include conductive metals such as silver, copper, and nickel.

[0050] The protection frame 130 at least partially surrounds the circumference of the substrate body 110, that is, the protection frame 130 includes an accommodating through hole that matches the shape of the substrate body 110, and the structural strength of the protection frame 130 is greater than the structural strength of the substrate body 110. Exemplarily, the protection frame 130 may include but is not limited to a steel plate frame and a copper clad plate frame.

[0051] In addition, in a direction perpendicular to the plane where the substrate body 110 is located, the height of the substrate body 110 is consistent with the height of the protective frame 130, that is, the surface of the substrate body 110 is flush with the surface of the protective frame 130, so as to improve the surface flatness of the glass substrate 10, prevent excessive local surface stress, and improve the overall structural stability of the glass substrate 10.

[0052] The filling layer 140 can be located on the inner wall of the wiring through hole 111 and the surface of the substrate body 110 and the protection frame 130, wherein the filling layer 140 covering the surface of the substrate body 110 and the protection frame 130 can improve the surface flatness of the substrate body 110 and the protection frame 130, and the filling layer 140 filled in the wiring through hole 111 can not only protect the hole wall from damage and contamination in subsequent processes, but also enhance the mechanical strength of the hole wall, ensuring the structural stability and reliability of the wiring through hole 111 in subsequent processes. Exemplarily, the material of the filling layer 140 includes but is not limited to ABF (Ajinomoto Build-up Film) material.

[0053] It should be noted that the substrate body 110 may be a whole board including a plurality of independent substrates, or may be an independent substrate. Figure 2 When the substrate body 110 in the glass substrate 10 is a whole plate, the protection frame 130 is arranged around the periphery of the whole plate. When the substrate body 110 in the glass substrate 10 is a plurality of independent substrates, please refer to Figure 3 , multiple independent substrates can be arranged in an array, and at least part of the protection frame 130 is located between any two adjacent independent substrates.

[0054] In this embodiment, a protective frame 130 is provided on the peripheral side of the substrate body 110, which can enhance the structural strength and rigidity of the opening area of ​​the glass substrate 10, reduce the risk of breakage of the glass substrate 10 due to reduced strength of the opening in subsequent processes, improve production yield and reliability, and reduce production loss costs.

[0055] Based on the same inventive concept, the present application also provides a method for manufacturing a glass substrate. Figure 4 and Figure 5 , Figure 4 is a schematic diagram of a process for manufacturing a glass substrate, Figure 5 for Figure 4 The corresponding process diagram. Figure 4 and Figure 5 Each step of the method for manufacturing a glass substrate is described in detail.

[0056] Step S110: providing a substrate body, and performing patterning on the substrate body to obtain wiring through holes penetrating the substrate body.

[0057] In this step, the wiring through hole 111 may be made by mechanical drilling, laser cutting, water jet cutting, chemical etching or other hole making methods, wherein the extension line of the wiring through hole 111 is perpendicular to the plane where the substrate body 110 is located.

[0058] Step S120: manufacturing a wiring layer on the inner wall of the wiring through hole and the surface of the substrate body.

[0059] In this step, a seed layer 121 is formed on the surface of the substrate body 110 and the inner wall of the wiring through hole 111, and a wiring layer 120 is formed on the surface of the seed layer 121. Specifically, metal deposition can be performed on the substrate body 110 first, and a thin layer of metal or semiconductor material, namely the seed layer 121, is formed on the inner wall of the wiring through hole 111. The seed layer 121 can be used as a catalyst layer for forming a metal layer 122 to help the metal layer 122 be uniformly deposited on the inner wall of the wiring through hole 111. Then, the seed layer 121 can be photolithographically processed to form the desired wiring pattern. Finally, the substrate body 111 on which the seed layer 121 is formed can be electroplated or metal deposited to form a metal layer 122 on the surface of the seed layer 121 to achieve electrical connection on both sides of the substrate body 110.

[0060] Step S130: providing a protection frame matching the shape of the substrate body, and placing the substrate body in the corresponding protection frame.

[0061] Before this step, a protective steel plate may be provided, and then laser holes may be made on the protective steel plate based on the shape of the substrate body 110, and a receiving through hole matching the shape of the substrate body 110 may be formed on the protective steel plate to obtain a protective frame 130. The structural strength of the protective frame 130 is greater than that of the substrate body 110. For example, the protective frame 130 may include but is not limited to a steel plate frame and a copper clad plate frame.

[0062] In addition, in the direction perpendicular to the plane where the substrate body 110 is located, the height of the substrate body 110 can be consistent with the height of the protective frame 130, that is, the surface of the substrate body 110 is flush with the surface of the protective frame 130, reducing stress concentration caused by surface unevenness and improving the overall structural stability of the glass substrate 10.

[0063] Step S140: making a filling layer for fixing the substrate body and the protection frame, so that the filling layer fills the wiring through hole and covers the surface of the substrate body and the protection frame.

[0064] In this step, ABF (Ajinomoto Build-up Film) material can be used to make a filling layer 140. Filling the routing through hole 111 with the filling layer 140 can not only enhance the local strength of the through hole area, but also prevent metal or other materials in subsequent processes from penetrating into the routing through hole 111, thereby ensuring that there are no defects inside the routing through hole 111.

[0065] For further information, please refer to Figure 6 and Figure 7 , Figure 6 is a schematic diagram of a process for manufacturing a glass substrate, Figure 6 for Figure 7 The corresponding process diagram will be combined with Figure 6 and Figure 7 Step S140 is described in detail.

[0066] Step S141: Transfer the protection frame with the substrate body placed thereon to a carrying carrier.

[0067] In this step, an adhesive layer can be first made on one side of the carrying carrier 150, and the protective frame with the substrate body placed thereon can be transferred onto the adhesive layer, that is, the first side of the substrate body 110 and the protective frame 130 are in contact with the side of the adhesive layer away from the carrying carrier 150, wherein the adhesive layer can be made of a photodegradable bonding material or a laser debonding material, and the carrying carrier 150 includes a resin carrier, a steel plate, etc.

[0068] Step S142: making a filling layer that fills the wiring through hole and covers the substrate body and the second side of the protection frame.

[0069] In this step, a filling layer 140 that fills the wiring through hole 111 and covers the second side of the substrate body 110 and the protection frame 130 can be made with ABF material. Then, the filling layer 140 that covers the second side of the substrate body and the protection frame can be ground to ensure the surface flatness of the glass substrate 10 and the thickness of the glass substrate 10.

[0070] Step S143: removing the carrier plate, and making a filling layer on the first side of the substrate body and the protection frame.

[0071] In this step, the carrier plate 150 can be removed by removing the adhesive layer. Specifically, a suitable debonding method can be selected according to the material of the adhesive layer. For example, when the adhesive layer is made of a photodegradable bonding material, the adhesive layer can be removed by photolysis. Next, the filling layer 140 is made on the first side of the substrate body 110 and the protective frame 130 using ABF material. Finally, the filling layer 140 on the first side of the substrate body 110 and the protective frame 130 is ground according to specific actual needs to ensure the surface flatness of the glass substrate 10 and the thickness of the glass substrate 10.

[0072] In the above steps, the filling layer 140 covering the surface of the substrate body 110 and the protection frame 130 can improve the surface flatness of the substrate body 110 and the protection frame 130. The filling layer 140 filled in the wiring through hole 111 can not only protect the hole wall from damage and contamination in subsequent processes, but also enhance the mechanical strength of the hole wall, thereby ensuring the structural stability and reliability of the wiring through hole 111 in subsequent processes.

[0073] Please refer to Figure 8 , an embodiment of the present application also provides a packaging method, which may include the following steps.

[0074] Step S210: providing a glass substrate according to any one of the above embodiments.

[0075] It should be noted that the substrate body 110 in the glass substrate 10 in this step can be a whole plate including multiple independent substrates, or it can be an independent substrate. Figure 3 and Figure 4 When the substrate body 110 in the glass substrate 10 is a whole plate, the protection frame 130 is disposed around the circumference of the whole plate. When the substrate body 110 in the glass substrate 10 is a plurality of independent substrates, the plurality of independent substrates can be arranged in an array, and at least part of the protection frame 130 is located between any two adjacent independent substrates. Specifically, a suitable glass substrate can be selected according to actual processing requirements.

[0076] Step S220: manufacturing a communication layer on two opposite sides of the glass substrate, and performing a plastic sealing process on the glass substrate to obtain a packaging structure.

[0077] In this step, a communication layer, a plastic sealing layer or a conductive ball can be made on both sides of the glass substrate 10 according to actual needs, wherein the communication layer includes but is not limited to a chip layer and a redistribution layer, etc. The communication layers on both sides of the glass substrate can be electrically connected through a routing layer located on the surface of the routing through hole.

[0078] Step S230: cutting the packaging structure and removing the protection frame to obtain a packaging structure including a substrate body.

[0079] In this step, after the glass substrate 10 provided by the present application is packaged, it is cut and the protection frame 130 is removed, which can effectively control the size of the packaging structure and improve the integration of the packaging structure.

[0080] It should be noted that when the substrate body 110 in the glass substrate 10 is composed of multiple independent substrates and the multiple independent substrates are arranged in an array, after cutting and removing the protective frame 130, the packaging structure including the multiple independent substrates can also be cut to obtain a packaging structure including at least one independent substrate.

[0081] In the above process, the protective frame 130 in the glass substrate 10 can disperse the mechanical stress on the substrate body 110, improve the overall structural strength of the glass substrate 10, and effectively reduce the risk of the glass substrate 10 being broken due to low local strength. At the same time, the protective frame 130 can also be removed by cutting to reduce the size of the packaging structure.

[0082] In addition, the present application also provides an electronic device, which may include the glass substrate 10 of any one of the above embodiments, or a glass substrate 10 manufactured according to the manufacturing method of the glass substrate in the above embodiments.

[0083] In summary, the present application provides a glass substrate, a method for manufacturing a glass substrate, a packaging method, and an electronic device. The glass substrate includes a substrate body and a protective frame. The substrate body includes a wiring through hole that penetrates the substrate body. The protective frame at least partially surrounds the periphery of the substrate body, and the structural strength of the protective frame is greater than the structural strength of the substrate body. In the above structure, the protective frame is provided on the periphery of the substrate body, which can enhance the structural strength and rigidity of the opening area of ​​the glass substrate, reduce the risk of glass substrate breakage caused by the reduction of strength due to the opening in subsequent processes, improve production yield and reliability, and reduce production loss costs.

[0084] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A glass substrate, characterized in that: The glass substrate comprises a substrate body, a protection frame, a wiring layer and a filling layer; The substrate body comprises a wiring through hole penetrating the substrate body, and the wiring layer is located on the surface of the substrate body and the inner wall of the wiring through hole; The protection frame at least partially surrounds the circumference of the substrate body, and the structural strength of the protection frame is greater than the structural strength of the substrate body; The filling layer is located on the inner wall of the wiring through hole and the surface of the substrate body and the protection frame.

2. The glass substrate according to claim 1, wherein: In a direction perpendicular to the plane where the substrate body is located, the height of the substrate body is consistent with the height of the protection frame, and the surface of the substrate body is flush with the surface of the protection frame.

3. The glass substrate according to claim 1, wherein: The routing layer includes a seed layer and a metal layer; The seed layer is located on the surface of the substrate body and the inner wall of the wiring through hole, and the metal layer is located on a side of the seed layer away from the substrate body.

4. The glass substrate according to claim 1, wherein: The protection frame includes a steel plate frame and a copper clad plate frame.

5. A method for manufacturing a glass substrate, characterized in that: The method comprises: Providing a substrate body, and patterning the substrate body to obtain a wiring through hole penetrating the substrate body; Making a wiring layer on the inner wall of the wiring through hole and the surface of the substrate body; Providing a protection frame matching the shape of the substrate body, and placing the substrate body in the corresponding protection frame, wherein the structural strength of the protection frame is greater than the structural strength of the substrate body; A filling layer for fixing the substrate body and the protection frame is manufactured so that the filling layer fills the wiring through hole and covers the surface of the substrate body and the protection frame.

6. The method for manufacturing a glass substrate according to claim 5, characterized in that: The step of manufacturing a wiring layer on the inner wall of the wiring through hole and the surface of the substrate body includes: A seed layer is formed on the surface of the substrate body and the inner wall of the wiring through hole, and a wiring layer is formed on the surface of the seed layer.

7. The method for manufacturing a glass substrate according to claim 5, characterized in that: Before the step of providing a protective frame matching the shape of the substrate body and placing the substrate body in the corresponding protective frame, the method further includes: Providing a protective steel plate; The protective steel plate is laser-perforated based on the shape of the substrate body, and a groove matching the shape of the substrate body is formed on the protective steel plate to obtain the protective frame.

8. The method for manufacturing a glass substrate according to claim 5, characterized in that: The step of making a filling layer for fixing the substrate body and the protection frame so that the filling layer fills the wiring through hole and covers the surface of the substrate body and the protection frame includes: Transferring the protective frame on which the substrate body is placed to a carrying plate, wherein the substrate body and a first side of the protective frame are in contact with the carrying plate; Making a filling layer that fills the wiring through hole and covers the substrate body and the second side of the protection frame; The carrier plate is removed, and a filling layer is formed on the first side of the substrate body and the protection frame.

9. A packaging method, characterized in that: The method comprises: Providing the glass substrate according to any one of claims 1 to 4; Manufacturing communication layers on two opposite sides of the glass substrate, and performing plastic sealing on the glass substrate to obtain a packaging structure, wherein the communication layer includes a chip layer and a redistribution layer; The packaging structure is cut and the protection frame is removed to obtain a packaging structure including the substrate body.

10. An electronic device, characterized in that: A glass substrate comprising the glass substrate according to any one of claims 1 to 4, or a glass substrate made according to the method for making a glass substrate according to any one of claims 5 to 8.

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