Power module and power conversion device

Abstract

The embodiment of the invention provides a power module and a power conversion apparatus having the same. According to the power module provided by the embodiment of the invention, the two first device groups are respectively arranged on the two opposite sides of the first heat dissipation plate in the thickness direction; one second device group and one third device group are respectively arranged on two opposite sides of the second heat dissipation plate in the thickness direction, and the other second device group and the other third device group are respectively arranged on two opposite sides of the third heat dissipation plate in the thickness direction; one first device group is electrically connected with the second device groups and the third device groups on the second heat dissipation plate, the other first device group is electrically connected with the second device groups and the third device groups on the third heat dissipation plate, and the two second device groups and the two third device groups are electrically connected with the busbar. This arrangement can help the power module increase operating power without significantly increasing the number of heat sinks.

Description

[0001] This application is a divisional application. The application number of the original application is 202410956006.X, and the original application date is July 17, 2024. The entire contents of the original application are incorporated into this application by reference. Technical Field

[0002] The embodiments of the present invention relate to the field of power electronics technology, and in particular, to a power module and a power conversion device having the same. Background Art

[0003] Power converters can realize the conversion between direct current and alternating current, and are popular in power application scenarios such as power generation, transmission and consumption. For example, power converters can be used in electric vehicles to play a role between the battery system and the power grid / load. The power module is the core part of the power converter, which consists of multiple device groups. During operation, the device group generates heat. To avoid overheating, the device group is installed on a heat sink.

[0004] It is beneficial to increase the operating power of the power module. Increasing the number of device groups can increase the operating power. However, in order to ensure the heat dissipation effect, it is necessary to increase the heat dissipation plates in proportion to the increase in device groups, which will significantly increase the number of heat dissipation plates, thereby significantly increasing the space occupied and manufacturing cost of the power module. Summary of the invention

[0005] In view of this, an embodiment of the present invention provides a power module and a power conversion device having the same, so as to improve the operating power of the power module without significantly increasing the number of heat sinks.

[0006] On the one hand, an embodiment of the present invention provides a power module, which includes multiple device groups, multiple heat sinks and busbars. Each device group includes multiple IGBT devices in parallel. The multiple device groups include two first device groups, two second device groups and two third devices. The multiple heat sinks include a first heat sink, a second heat sink and a third heat sink. The two first device groups are respectively mounted on opposite sides of the first heat sink in the thickness direction. A second device group and a third device group are respectively mounted on opposite sides of the second heat sink in the thickness direction, and another second device group and another third device group are respectively mounted on opposite sides of the third heat sink in the thickness direction. A first device group is electrically connected to the second device group and the third device group on the second heat sink, and another first device group is electrically connected to the second device group and the third device group on the third heat sink. The two second device groups and the two third device groups are electrically connected to the busbar.

[0007] As a possible implementation manner, the second heat dissipation plate and the third heat dissipation plate are respectively located on two opposite sides of the first heat dissipation plate in the thickness direction.

[0008] As a possible implementation manner, each of the two second device groups and the two third device groups is electrically connected to the busbar, and the second heat sink and the third heat sink are located between the first heat sink and the busbar.

[0009] As a possible implementation manner, the second heat dissipation plate is arranged at an angle to the first heat dissipation plate; and / or the third heat dissipation plate is arranged at an angle to the first heat dissipation plate; and / or the second heat dissipation plate is arranged at an angle to the third heat dissipation plate.

[0010] As a possible implementation manner, the second heat sink is inclined toward the first heat sink along a direction away from the busbar; and / or the third heat sink is inclined toward the first heat sink along a direction away from the busbar.

[0011] As a possible implementation, the second heat sink and the first heat sink have an angle α1, and the angle α1 satisfies: 110°≤α1≤160°; and / or the third heat sink and the first heat sink have an angle α2, and the angle α2 satisfies: 110°≤α2≤160°.

[0012] As a possible implementation manner, the first heat dissipation plate, the second heat dissipation plate and the third heat dissipation plate are parallel to each other.

[0013] As a possible implementation manner, the second heat sink is arranged at an angle to the busbar; and / or the third heat sink is arranged at an angle to the busbar.

[0014] As a possible implementation, the second heat sink and the busbar have an angle β1, and the angle β1 satisfies: 20°≤β1≤70°; and / or the third heat sink and the busbar have an angle β2, and the angle β2 satisfies: 20°≤β2≤70°.

[0015] As a possible implementation manner, the first heat sink, the second heat sink and the third heat sink are arranged in a Y shape, and the busbar, the second heat sink and the third heat sink are arranged in a triangle shape.

[0016] As a possible implementation, the first heat sink, the second heat sink and the third heat sink are arranged in a Y shape, and the busbar includes a first busbar part and a second busbar part, the first busbar part is bent toward the second heat sink, and the second busbar part is bent toward the third heat sink.

[0017] As a possible implementation, the busbar includes a stacked first plate, a second plate, and a third plate. The second plate is located between the first plate and the third plate, and the third heat sink is located on the side of the first heat sink away from the three heat sinks. The two third device groups are located on the inner sides of the second heat sink and the third heat sink, respectively. In the first busbar portion, the first plate is shorter than the second plate; and / or, in the second busbar portion, the first plate is shorter than the second plate.

[0018] As a possible implementation manner, the second heat dissipation plate and the third heat dissipation plate are arranged symmetrically with respect to the first heat dissipation plate.

[0019] On the other hand, the present invention provides a power conversion device, which includes a cabinet and a DC fuse, a DC isolating switch, a power module, a reactor, an AC filter capacitor and an AC circuit breaker which are housed in the cabinet and electrically connected in sequence.

[0020] According to the power module and power conversion device provided by the embodiments of the present invention, under the premise of ensuring that the distance from each first device group to the corresponding second device group and to the corresponding third device group is short and relatively close, the six device groups are arranged on three heat sinks, and both sides of each heat sink are fully utilized, which improves the operating power of the power module without significantly increasing the number of heat sinks. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 FIG. 4 is a schematic structural diagram of a power module according to an embodiment of the present invention.

[0022] Figure 2 for Figure 1 Schematic diagram of the structure of the power module viewed from another direction.

[0023] Figure 3 for Figure 1 Exploded schematic diagram of a portion of the power module.

[0024] Figure 4 for Figure 1 A schematic diagram of the structure of a heat sink with a device group installed in a power module.

[0025] Figure 5 for Figure 2 A partial enlarged view of the power module.

[0026] Figure 6 for Figure 2 Another enlarged view of the power module in Figure 1.

[0027] Figure 7 for Figure 2 Another enlarged view of the power module in Figure 1.

[0028] Figure 8 for Figure 2 Another enlarged view of the power module in Figure 1.

[0029] Fig. 9 FIG. 4 is a schematic structural diagram of a power module according to another embodiment of the present invention.

[0030] Fig.10FIG. 4 is a schematic structural diagram of a power module according to another embodiment of the present invention. DETAILED DESCRIPTION

[0031] Numerous specific details will be listed below to provide an understanding of the structure, function, and use of the embodiments described in the specification and shown in the drawings. It is understood that the embodiments described and shown herein are non-limiting examples, so that it can be recognized that the specific structural and functional details disclosed herein may be representative and exemplary. Modifications and changes may be made to these embodiments without departing from the scope of the claims.

[0032] <Exemplary Power Module>

[0033] The embodiment of the present invention provides a power module 10. For ease of understanding, the overall structure of the power module 10 is first illustrated below. It should be understood that the structure of the power module 10 should not be limited to the following description. For example, one or several elements (components or parts) introduced below can be omitted or replaced, and the layout relationship between them can be replaced.

[0034] refer to Figures 1 to 4 The power module 10 may include a busbar 11 , a plurality of capacitors 12 , a plurality of device groups 13 , a plurality of AC terminals 14 , a plurality of line banks 15 , a plurality of gate plates 16 and a plurality of heat sinks 17 .

[0035] The busbar 11 may provide a plurality of DC terminals. For example, the plurality of DC terminals may include a P terminal, an N terminal, and an O terminal. The P terminal may be electrically connected to the positive pole of a DC power source or a DC load in the energy storage system. The N terminal may be electrically connected to the negative pole of a DC power source or a DC load. The O terminal may be connected to a neutral point in the energy storage system, i.e., the O terminal may be grounded.

[0036] By way of example only, the busbar 11 may include a stacked first plate 11-1, a second plate 11-2, and a third plate 11-3. The second plate 11-2 may be located between the first plate 11-1 and the third plate 11-3. The third plate 11-3 may be located on a side of the first plate 11-1 away from the three heat sinks 17. The first plate 11-1 may provide an N terminal, the second plate 11-2 may provide an O terminal, and the third plate 11-3 may provide a P terminal.

[0037] Multiple capacitors 12 can be electrically connected to the busbar 11. In particular, multiple capacitors 12 can be directly mounted on the busbar 11, located on the side of the busbar 11 away from the multiple heat sinks 17 in the thickness direction. For example, multiple capacitors 12 can help maintain voltage stability when the working current fluctuates, reduce the impact of current on voltage, and avoid faults such as overvoltage or undervoltage. For another example, multiple capacitors 12 can filter out noise and interference signals, smooth the current, and improve working stability and performance.

[0038] The plurality of device groups 13 may include a plurality of first device components 13a, a plurality of second device groups 13b, and a plurality of third device groups 13c. One first device component 13a, one second device group 13b, and one third device group 13c may constitute a phase unit. Each phase unit may be electrically connected to the P end of the busbar 11, the N end of the busbar 11, the O end of the busbar 11, and an AC terminal 14.

[0039] A plurality of device groups 13 can constitute a total of six phase units, which are electrically connected to six AC terminals 14a to 14f, respectively. The six phase units can be divided into three pairs of phase units. Through a corresponding pair of AC terminals 14, each pair of phase units is electrically connected to one of the three phases of the AC power source or AC load in the energy storage system. For example, a pair of AC terminals 14a and 14b can be electrically connected to the U phase of the AC power source or AC load, a pair of AC terminals 14c and 14d can be electrically connected to the V phase of the AC power source or AC load, and a pair of AC terminals 14e and 14f can be electrically connected to the W phase of the AC power source or AC load.

[0040] The gate plate 16 may also be referred to as a drive plate. The plurality of gate plates 16 are used to control the plurality of device groups 13 respectively. During the operation of the power module 10, the plurality of gate plates 16 convert the control signal into a drive signal, and the drive signal acts on the gates of the plurality of device groups 13 to control the on and off of the plurality of device groups 13, thereby realizing power conversion from DC to AC or from AC to DC.

[0041] During operation, the device group 13 generates heat. To avoid overheating, multiple device groups 13 are mounted on multiple heat sinks 17. As a non-limiting example, the air dissipation plate 17 can be implemented as a liquid cooling plate, which can have a flow path for coolant to flow through, so that the heat is removed by the flowing coolant. Of course, other types of heat sinks 17 such as air-cooled heat sinks with heat dissipation fins or gas-liquid phase change plates are foreseeable.

[0042] The plurality of heat dissipation plates 17 may include a first heat dissipation plate 17a, a second heat dissipation plate 17b, and a third heat dissipation plate 17c. The length direction (i.e., perpendicular to the first heat dissipation plate 17a, the second heat dissipation plate 17b, and the third heat dissipation plate 17c) of the first heat dissipation plate 17a, the second heat dissipation plate 17b, and the third heat dissipation plate 17c is Figure 2 The three pairs of phase units can be arranged along the length direction of the heat sink 17.

[0043] Figure 4 The three device groups 13 mounted on one side of the thickness direction of a heat sink 17 are clearly shown. The three device groups 13 are arranged along the length direction of the heat sink 17 and belong to three phase units respectively. Figure 4Each device group 13 may include a plurality of devices 131 connected in parallel, and the plurality of devices 131 may be arranged along the length direction of the heat sink 17. As an example, the device 131 may be an IGBT device. It is understood that the IGBT device mentioned in this article may be the same as the previous IGBT device. For the purpose of brevity, the structure and working principle of the IGBT device will not be described in detail in this article.

[0044] Understandably, although Figure 4 In the embodiment, each device group 13 includes four devices 131, but in other embodiments of the present invention, each device group 13 may include other numbers of devices 131. For example, in some examples, each device group 13 may include two, three, five or more devices 131.

[0045] As discussed above, each pair of phase units includes six device groups 13, namely, two first device groups 13a, two second device groups 13b and two third device groups 13c. Here, the two first device groups 13a are electrically connected to the two AC terminals 14, respectively, and the two AC terminals 14 are connected to the same AC phase of the AC power supply or AC load. For example, the two AC terminals 14 can be electrically connected to the U phase, or, can be connected to the V phase, or, can be connected to the W phase. Each second device group is electrically connected to the P end and the O end, and each third device group is electrically connected to the N end and the O end. The arrangement of the six device groups 13 on the three heat sinks 17 is described below.

[0046] refer to Figure 2 and 3 , two first device groups 13a are respectively mounted on opposite sides of the first heat sink 17a in the thickness direction. One second device group 13b and one third device group 13c are respectively mounted on opposite sides of the second heat sink 17b in the thickness direction. Another second device group 13b and another third device group 13c are respectively mounted on opposite sides of the third heat sink 17c in the thickness direction. One first device group 13a on the first heat sink 17a is electrically connected to the second device group 13b and the third device group 13c on the second heat sink 17b to form a phase unit. Another first device group 13a on the first heat sink 17a is electrically connected to the second device group 13b and the third device group 13c on the third heat sink 17c to form another phase unit.

[0047] According to this arrangement, under the premise of ensuring that the distance from each first device group 13a to the corresponding second device group 13c and the distance to the corresponding third device group 13c are short and relatively close, the six device groups 13 are arranged on three heat sinks 17, and both sides of each heat sink 17 are fully utilized, which improves the operating power of the power module 10 without significantly increasing the number of heat sinks 17.

[0048] Continue to refer Figure 2 , the second heat sink 17b and the third heat sink 17c can be located on opposite sides of the first heat sink 17a in the thickness direction. In this way, the second and third device groups 13b, 13c on the second heat sink 17b and the first device group 13a connected thereto will be located on the same side in the thickness direction of the first heat sink 17a, and the second and third device groups 13b, 13c on the third heat sink 17c and the first device group 13a connected thereto will also be located on the same side in the thickness direction of the first heat sink 17a, which helps to shorten the length of the line row 15 connecting them, thereby helping to reduce stray inductance.

[0049] Continue to refer Figure 2 , the second heat sink 17b and the third heat sink 17c can be located between the first heat sink 17a and the busbar 11. Accordingly, the distance from each second device group 13b to the busbar 11 and the distance to the corresponding first device group 13a are both shorter, and the distance from each third device group 13c to the busbar 11 and the distance to the corresponding first device group 13a are also shorter. Therefore, this arrangement helps to shorten the length of the line 15 connected between the two device groups 13 and the length of the line 15 connected between the busbar 11 and the device group 13, thereby helping to reduce stray inductance.

[0050] Continue to refer Figure 2 The first heat sink 17a and the second heat sink 17b may be arranged at an angle, and / or the first heat sink 17a and the third heat sink 17c may be arranged at an angle, and / or the second heat sink 17b and the third heat sink 17c may be arranged at an angle. By arranging two or three heat sinks 17 at an angle, it can help improve space utilization and reduce stray inductance.

[0051] It should be noted that, in this article, two elements are arranged at an angle means that the two elements are not parallel, that is, the angle between the two elements is greater than 0 degrees and less than 180 degrees.

[0052] Continue to refer Figure 2 , the second heat sink 17b can be tilted toward the first heat sink 17a in a direction away from the busbar 11. Figure 2Observed from the perspective in , the second heat sink 17b is downward and gradually tilted to the left. If the first heat sink 17a and the second heat sink 17b are arranged in parallel, the distance between the second component group 13b on the second heat sink 17b and the corresponding first component group 13a is large, and the distance between the third component group 13c on the second heat sink 17b and the first component group 13a is small, and the difference between the two distances is large, which will cause the length difference between the first line 15a and the second line 15b to be large, increasing the stray inductance. In contrast, in the embodiment of the present invention, since the second heat sink is arranged to be inclined toward the first heat sink 17a in the direction away from the busbar 11, the distance between the second component group 13b on the second heat sink 17b and the corresponding first component group 13a will be shortened, and the distance between the third component group 13c on the second heat sink 17b and the corresponding first component group 13a will increase, and the difference between the two distances is small. Accordingly, the length difference between the first line 15a and the second line 15b will be small, which helps to reduce stray inductance.

[0053] Continue to refer Figure 2 The first heat sink 17a and the second heat sink 17b may have an included angle α1, and the included angle α1 may satisfy 110°≤α1≤160°.

[0054] If the angle α1 is too large, that is, close to 180°, the first heat sink 17a and the second heat sink 17b are arranged nearly in parallel; as discussed above, this will result in a large difference in length between the corresponding first line row 15a and the corresponding second line row 15b, increasing the stray inductance. If the angle α1 is too small, that is, close to 90°, the distance from the second device group 13b on the second heat sink 17b to the corresponding first device group 13a is small, and the distance from the third device group 13c on the second heat sink 17b to the first device group 13a is large, and the difference between the two distances is large, which will result in a large difference in length between the first line row 15a and the second line row 15b, increasing the stray inductance. Setting the angle α1 to meet the above range of the embodiment of the present invention helps to ensure that the length difference between the first line row 15a and the second line row 15b is small, thereby helping to reduce the stray inductance.

[0055] Preferably, the angle α1 may satisfy 120°≤α1≤150°.

[0056] In this way, it is possible to prevent the bending angle of the wire array 15 between the first heat dissipation plate 17 a and the second heat dissipation plate 17 b from being too large, thereby effectively avoiding the risk of the wire array 15 being broken.

[0057] More preferably, the angle α1 may satisfy α1=135°.

[0058] In this way, the distance between the first heat sink 17 a and the second heat sink 17 b can be made closer to each other, so as to further reduce the stray inductance.

[0059] Alternatively, the angle α1 may be any value of 115°, 125°, 130°, 140°, 145°, 155°, 160°, 165°, 170°, or 175°.

[0060] Continue to refer Figure 2 , the third heat sink 17c can be tilted toward the first heat sink 17a in a direction away from the busbar 11. Figure 2 Observed from the perspective in , the third heat sink 17c is downward and gradually tilted to the right. If the first heat sink 17a and the third heat sink 17c are arranged in parallel, the distance from the second device group 13b on the third heat sink 17c to the corresponding first device group 13a is large, and the distance from the third device group 13c on the third heat sink 17c to the first device group 13a is small, and the difference between the two distances is large, which will cause the length difference between the third line row 15c and the fourth line row 15d to be large, increasing the stray inductance. In contrast, in the embodiment of the present invention, since the third heat sink 17c is arranged to be inclined toward the first heat sink 17a in the direction away from the busbar 11, the distance from the second device group 13b on the third heat sink 17c to the corresponding first device group 13a will be shortened, and the distance from the third device group 13c on the third heat sink 17c to the corresponding first device group 13a will increase, and the difference between the two distances is small. Accordingly, the length difference between the third line row 15c and the fourth line row 15d will be small, which helps to reduce stray inductance.

[0061] Continue to refer Figure 2 , the first heat sink 17a and the third heat sink 17c may have an angle α2, and the angle α2 may satisfy 110°≤α2≤160°. If the angle α2 is too large, that is, close to 180°, the first heat sink 17a and the third heat sink 17c are arranged nearly in parallel; as discussed above, this will result in a large difference in length between the third line row 15c and the fourth line row 15d, increasing the stray inductance. If the angle α2 is too small, that is, close to 90°, the distance from the second device group 13b on the third heat sink 17c to the corresponding first device group 13a is small, and the distance from the third device group 13c on the third heat sink 17c to the first device group 13a is large, and the difference between the two distances is large, which will result in a large difference in length between the third line row 15c and the fourth line row 15d, increasing the stray inductance. Setting the angle α2 to meet the above range of the embodiment of the present invention helps to ensure that the distance difference between the third line row 15c and the fourth line row 15d is small, thereby helping to reduce the stray inductance.

[0062] Preferably, the angle α2 may satisfy 120°≤α2≤150°.

[0063] In this way, it is possible to prevent the bending angle of the wire array 15 between the first heat dissipation plate 17 a and the third heat dissipation plate 17 c from being too large, thereby effectively avoiding the risk of the wire array 15 being broken.

[0064] More preferably, the angle α2 may satisfy α2=135°.

[0065] In this way, the distance between the first heat sink 17 a and the third heat sink 17 c can be made closer to each other, so as to further reduce the stray inductance.

[0066] Alternatively, the angle α2 may be any value of 115°, 125°, 130°, 140°, 145°, 155°, 160°, 165°, 170°, or 175°.

[0067] In a preferred embodiment, continue to refer to Figure 2 The second heat sink 17b and the third heat sink 17c can be arranged symmetrically relative to the first heat sink 17a. In this way, the current curves output by the three phase units on the left and the current curves output by the three phase units on the right can be made consistent, which can reduce the mutual interference of the output currents.

[0068] Continue to refer Figure 2 , the second heat sink 17b can be arranged at an angle to the busbar 11. If the second heat sink 17b is arranged in parallel with the busbar 11, the distance from the second device group 13b on the second heat sink 17b to the electrical connection portion 111 (for example, a conductive column) of the busbar 11 is large, and the distance from the third device group 13c on the second heat sink 17b to the electrical connection portion 111 is small, and the difference between the two distances is large, which will cause the length difference between the fifth line row 15e and the sixth line row 15f to be large, increasing the stray inductance. In contrast, in the embodiment of the present invention, since the second heat sink 17b is arranged at an angle to the busbar 11, the distance from the second device group 13b on the second heat sink 17b to the electrical connection portion 111 will be shortened, and the distance from the third device group 13c on the second heat sink 17b to the electrical connection portion 111 will increase, and the difference between the two distances is small. Accordingly, the length difference between the fifth line row 15e and the sixth line row 15f will be small, which helps to reduce the stray inductance.

[0069] Continue to refer Figure 2 The second heat sink 17b and the busbar 11 may have an included angle β1, and the included angle β1 may satisfy 20°≤β1≤70°.

[0070] If the angle β1 is too small, i.e. close to 0°, the second heat sink 17b is arranged nearly parallel to the busbar 11; as discussed above, this will result in a large difference in length between the fifth line row 15e and the sixth line row 15f, increasing the stray inductance. If the angle β1 is too large, i.e. close to 90°, the distance from the second component group 13b on the second heat sink 17b to the electrical connection portion 111 is small, and the distance from the third component group 13c on the second heat sink 17b to the electrical connection portion 111 is large, and the difference between the two distances is large, which will result in a large difference in length between the fifth line row 15e and the sixth line row 15f, increasing the stray inductance. Setting the angle β1 to meet the above range of the embodiment of the present invention helps to ensure that the difference in length between the two is small and reduce the stray inductance.

[0071] Preferably, the angle β1 may satisfy 30°≤β1≤60°.

[0072] In this way, it is possible to prevent the bending angle of the wire bus 15 between the second heat sink 17 b and the busbar 11 from being too large, thereby effectively avoiding the risk of the wire bus 15 being broken.

[0073] More preferably, the angle β1 may satisfy β1=45°.

[0074] In this way, the distance between the second heat sink 17 b and the busbar 11 and the busbar 15 can be made closer to each other, so as to further reduce the stray inductance.

[0075] Alternatively, the angle β1 may be any value among 25°, 35°, 40°, 50°, 55°, and 65°.

[0076] Continue to refer Figure 2 , the third heat sink 17c and the busbar 11 can be arranged at an angle. If the third heat sink 17c is arranged in parallel with the busbar 11, the distance from the second device group 13b on the third heat sink 17c to the electrical connection portion 111 of the busbar 11 is large, and the distance from the third device group 13c of the third heat sink 17c to the electrical connection portion 111 is small, and the difference between the two distances is large, which will cause the length difference between the seventh line 15g and the eighth line 15h to be large, increasing the stray inductance. In contrast, in the embodiment of the present invention, since the third heat sink 17c is arranged at an angle with the busbar 11, the distance from the second device group 13b on the third heat sink 17c to the electrical connection portion 111 will be shortened, and the distance from the third device group 13c on the third heat sink 17c to the electrical connection portion 111 will increase, and the difference between the two distances is small. Accordingly, the length difference between the seventh line 15g and the eighth line 15h will be small, which helps to reduce stray inductance.

[0077] Continue to refer Figure 2 The third heat sink 17c and the busbar 11 may have an included angle β2, and the included angle β2 may satisfy 20°≤β2≤70°.

[0078] If the angle β2 is too small, i.e. close to 0°, the third heat sink 17c is arranged nearly parallel to the busbar 11; as discussed above, this will result in a large difference in length between the seventh line bar 15g and the eighth line bar 15h, increasing the stray inductance. If the angle β2 is too large, i.e. close to 90°, the distance from the second component group 13b on the third heat sink 17c to the electrical connection portion 111 is small, and the distance from the third component group 13c on the third heat sink 17c to the electrical connection portion 111 is large, and the difference between the two distances is large, which will result in a large difference in length between the seventh line bar 15g and the eighth line bar 15h, increasing the stray inductance. Setting the angle β2 to meet the above range of the embodiment of the present invention helps to ensure that the length difference between the seventh line bar 15g and the eighth line bar 15h is small, thereby reducing the stray inductance.

[0079] Preferably, the angle β2 may satisfy 30°≤β2≤60°.

[0080] In this way, it is possible to prevent the bending angle of the wire bus 15 between the third heat sink 17 c and the bus bar 11 from being too large, thereby effectively avoiding the risk of the wire bus 15 being broken.

[0081] More preferably, the angle β2 may satisfy β2=45°.

[0082] In this way, the distance between the third heat sink 17 c and the busbar 11 and the busbar 15 can be made to be consistent, so as to further reduce the stray inductance.

[0083] Alternatively, the angle β2 may be any value among 25°, 35°, 40°, 50°, 55°, and 65°.

[0084] Continue to refer Figure 2In a preferred example, the first heat sink 17a, the second heat sink 17b and the third heat sink 17c can be arranged in a Y shape, and the busbar 11, the second heat sink 17b and the third heat sink 17c can be arranged in a triangular shape. This arrangement of the first heat sink 17a, the second heat sink 17b, the third heat sink 17c and the busbar 11 has multiple advantages. On the one hand, according to this arrangement, the second heat sink 17b and the third heat sink 17c will be located on opposite sides of the first heat sink 17a in the thickness direction, and between the first heat sink 17a and the busbar 11, which helps to shorten the length of the line row 15 connected therebetween, thereby helping to reduce stray inductance. On the other hand, according to this arrangement, the angle α1 between the first heat sink 17a and the second heat sink 17b, the angle α2 between the first heat sink 17a and the third heat sink 17b, the angle β1 between the second heat sink 17b and the busbar 11, and the angle β2 between the third heat sink 17b and the busbar 11 will satisfy the value range mentioned above, so that the length difference of each pair of wires 15 is small, which helps to further reduce the stray inductance. On the other hand, according to this arrangement, any two of the first heat sink 17a, the second heat sink 17b, the third heat sink 17c and the busbar 11 will form a space, and they will not be close together; these spaces help to reduce the mutual influence between them and improve the heat dissipation performance.

[0085] As described above, the plurality of lines 15 may include a first line 15a, a second line 15b, a third line 15c, a fourth line 15d, a fifth line 15e, a sixth line 15f, a seventh line 15g, and an eighth line 15h. The second device group 13b on the second heat sink 17b may be electrically connected to the corresponding first device group 13a through the first line 15a, and the third device group 13c on the second heat sink 17b may be electrically connected to the first device group 13a through the second line 15b. The second device group 13b on the third heat sink 17c may be electrically connected to the corresponding first device group 13a through the third line 15c, and the third device group 13c on the third heat sink 17c may be electrically connected to the first device group 13a through the fourth line 15d. The second device group 13b on the second heat sink 17b can be electrically connected to the P-end and O-end of the busbar 11 through the fifth wire bus 15e, and the third device group 13c on the second heat sink 17b can be electrically connected to the N-end and O-end of the busbar 11 through the sixth wire bus 15f. The second device group 13b on the third heat sink 17c can be electrically connected to the P-end and O-end of the busbar 11 through the seventh wire bus 15g, and the third device group 13c on the third heat sink 17c can be electrically connected to the N-end and O-end of the busbar 11 through the eighth wire bus 15h.

[0086] Reference 2 and Figure 5, the first line row 15a may include a first A bend 151a, a first B bend 152a and a first C bend 153a connected in sequence, and the second line row 15b may include a second A bend 151b and a second B bend 152b connected. The first A bend 151a and the second A bend 151b are both parallel to the first heat sink 17a, and the first C bend 153a and the second B bend 152b may be both parallel to the second heat sink 17b. Along the direction away from the busbar 11, that is, along the downward direction in the figure, the first A bend 151a and the second A bend 151b extend beyond the second heat sink 17b. In this way, the second heat sink 17b will not block the first A bend 151a and the second A bend 151b, so that the first A bend 151a and the second A bend 151b can be connected to the first device group 13a more conveniently, for example, by fasteners.

[0087] Reference 2 and Figure 6 , the third line row 15c may include a third A bend portion 151c, a third B bend portion 152c and a third C bend portion 153c connected in sequence, and the fourth line row 15d may include a fourth A bend portion 151d and a fourth B bend portion 152d connected. The third A bend portion 151c and the fourth A bend portion 151d are both parallel to the first heat sink 17a, and the third C bend portion 153c and the fourth B bend portion 152d are both parallel to the third heat sink 17c. Along the direction away from the busbar 11, that is, along the downward direction in the figure, the third A bend portion 151c and the fourth A bend portion 151d extend beyond the third heat sink 17c. In this way, the third heat sink 17c will not block the third A bent portion 151c and the fourth A bent portion 151d, so that the third A bent portion 151c and the fourth A bent portion 151d can be easily connected to the first device group 13a, for example, by fasteners.

[0088] Reference 2 and Figure 7 , the fifth line row 15e may include a fifth A bend 151e, a fifth B bend 152e and a fifth C bend 153e connected in sequence, and the sixth line row 15f includes a sixth A bend 151f and a sixth B bend 152f connected. The fifth A bend 151e and the sixth A bend 151f are both parallel to the busbar 11, and the fifth C bend 153e and the sixth B bend 152f are both parallel to the second heat sink 17b. Along the direction away from the first heat sink 17a, that is, along the right direction in the figure, the fifth A bend 151e and the sixth A bend 151f extend beyond the second heat sink 17b. In this way, the second heat sink 17b will not block the fifth A bend portion 151e and the sixth A bend portion 151f, so that the fifth A bend portion 151e and the sixth A bend portion 151f can be more conveniently connected to the electrical connection portion 111 of the busbar 11, for example, through fasteners.

[0089] Reference 2 and Figure 8 , the seventh line row 15g may include a seventh A bend 151g, a seventh B bend 152g and a seventh C bend 153g connected in sequence, and the eighth line row 15h includes an eighth A bend 151h and an eighth B bend 152h connected. The seventh A bend 151g and the eighth A bend 151h are both parallel to the busbar 11, and the seventh C bend 153g and the eighth B bend 152h are both parallel to the third heat sink 17c. Along the direction away from the first heat sink 17a, that is, along the left direction in the figure, the seventh A bend 151g and the eighth A bend 151h extend beyond the third heat sink 17c. In this way, the third heat sink 17c will not block the seventh A bend portion 151g and the eighth A bend portion 151h, so that the seventh A bend portion 151g and the eighth A bend portion 151h can be more conveniently connected to the electrical connection portion 111 of the busbar 11, for example, through fasteners.

[0090] Another embodiment of the present invention further provides a power module 10a, which Fig. 9 The power module 10a is substantially the same as the aforementioned power module 10, and the difference mainly lies in the busbar 11.

[0091] refer to Fig. 9 , the busbar 11 includes a first busbar portion 11a and a second busbar portion 11b, the first busbar portion 11a is bent toward the second heat sink 17b, and the second busbar portion 11b is bent toward the third heat sink 17c. In this way, the distance from the busbar 11 to the second heat sink 17b and the third heat sink 17c will be further reduced, which helps to shorten the length of the busbars 15e, 15f, 15g and 15h, thereby helping to reduce stray inductance. Preferably, the first busbar portion 11a can be perpendicular to the second heat sink 17b, and the second busbar portion 11b can be perpendicular to the third heat sink 17c, which helps to reduce the length difference between the busbars 15e and 15f, and shorten the length difference between the busbars 15g and 15h, thereby reducing stray inductance.

[0092] Continue to refer Fig. 9, the fifth busbar 15e may include a fifth A bend 151e and a fifth B bend 152e connected to each other, and the sixth busbar 15f may include a sixth A bend 151f and a sixth B bend 152f connected to each other. The fifth A bend 151e and the sixth A bend 151f are both parallel to the first busbar portion 11a, and the fifth B bend 152e and the sixth B bend 152f are both parallel to the second heat sink 17b. The fifth A bend 151e bends from the fifth B bend 152e in a direction away from the second heat sink 17b, and the sixth A bend 151f bends from the sixth B bend 152f in a direction away from the second heat sink 17b. In this way, the second heat sink 17b will not block the fifth A bent portion 151e and the sixth A bent portion 151f, making it easier to connect the fifth A bent portion 151e and the sixth A bent portion 151f to the busbar 11, for example, through fasteners.

[0093] Continue to refer Fig. 9 , the seventh busbar 15g may include a seventh A bend 151g and a seventh B bend 152g connected to each other, and the eighth busbar 15h may include an eighth A bend 151h and an eighth B bend 152h connected to each other. The seventh A bend 151g and the eighth A bend 151h are both parallel to the second busbar portion 11b, and the seventh B bend 152g and the eighth B bend 152h are both parallel to the third heat sink 17c. The seventh A bend 151g is bent from the seventh B bend 152g in a direction away from the third heat sink 17c, and the eighth A bend 151h is bent from the eighth B bend 152h in a direction away from the third heat sink 17c. In this way, the third heat sink 17c will not block the seventh A bend portion 151g and the eighth A bend portion 151h, so that the seventh A bend portion 151g and the eighth A bend portion 151h can be connected to the busbar 11 more conveniently, for example, through fasteners.

[0094] Preferably, the plane where the first busbar portion 11a is located may be perpendicular to the second heat sink 17b; and / or the second busbar portion 11b may be perpendicular to the third heat sink 17c.

[0095] In this way, the distance between the busbar 11 and the device groups 13 on both sides of any heat sink 17 remains consistent, that is, the current paths of the first busbar portion 11a and the device groups 13 on both sides of the second heat sink 17b are the same, and / or the current paths of the second busbar portion 11b and the device groups on both sides of the third heat sink 17c are the same, which can reduce stray inductance.

[0096] Continue to refer Fig. 9, in the first busbar portion 11b, the first electrode plate 11-1 is shorter than the second electrode plate 11-2. This allows the fifth A bent portion 151e to directly face the second electrode plate 11-2, and the sixth A bent portion 151f to directly face the first electrode plate 11-1. This configuration helps reduce the difficulty of electrically connecting the second device group 13b and the third device group 13c on the second heat sink 17b to the busbar 11.

[0097] Continue to refer Fig. 9 , in the second busbar portion 11b, the first electrode 11-1 is shorter than the second electrode 11-2. This allows the seventh A bend 151g to directly face the second electrode 11-2, and the eighth A bend 151h to directly face the first electrode 11-1. This configuration helps reduce the difficulty of electrically connecting the second device group 13b and the third device group 13c on the third heat sink 17c to the busbar 11.

[0098] The above is an example of a power module according to an embodiment of the present invention. It is understood that the power module according to an embodiment of the present invention is not limited to the above description. For example, in a foreseeable example, Fig.10 As shown, the second heat dissipation plate 17b and the third heat dissipation plate 17c may be arranged in parallel, and the first heat dissipation plate 17a may be arranged perpendicular to the two, so that the three heat dissipation plates 17 are in a T-shaped structure as a whole.

[0099] <Exemplary Power Conversion Device>

[0100] The present invention provides a power conversion device, which includes a cabinet and a DC fuse, a DC isolating switch, a power module, a reactor, an AC filter capacitor and an AC circuit breaker which are housed in the cabinet and electrically connected in sequence.

[0101] In particular, the power conversion device provided by the embodiment of the present invention may include two reactors, one reactor may be electrically connected to the AC terminals 14a, 14c, 14e of three phase units, and the other reactor may be electrically connected to the AC terminals 14b, 14d, 14f of the other three phase units.

[0102] It should be understood that the terms "parallel" and "perpendicular" mentioned herein should be understood as "substantially parallel" and "substantially perpendicular", respectively, and a reasonable error range should be included, for example, the error range may be ±5°.

[0103] It should be understood that the term "including" and its variations used in the embodiments of the present invention are open inclusions, i.e., "including but not limited to". The term "according to" means "at least in part according to". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least another embodiment".

[0104] It should be understood that although the terms "first" or "second" etc. may be used in embodiments of the present invention to describe various elements, such as a first heat sink and a second heat sink, these elements are not defined by these terms, which are only used to distinguish one element from another.

[0105] The protection scope of the present invention is not limited to the above-mentioned embodiments. Any changes or substitutions that can be conceived by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A power module, characterized in that: It includes multiple device groups, multiple heat sinks and busbars, each device group includes multiple IGBT devices connected in parallel, the multiple device groups include two first device groups, two second device groups and two third devices, the multiple heat sinks include a first heat sink, a second heat sink and a third heat sink, the two first device groups are respectively mounted on opposite sides of the first heat sink in the thickness direction, a second device group and a third device group are respectively mounted on opposite sides of the second heat sink in the thickness direction, another second device group and another third device group are respectively mounted on opposite sides of the third heat sink in the thickness direction, one first device group is electrically connected to the second device group and the third device group on the second heat sink, another first device group is electrically connected to the second device group and the third device group on the third heat sink, and the two second device groups and the two third device groups are electrically connected to the busbar.

2. The power module according to claim 1, characterized in that: The second heat sink and the third heat sink are respectively located at two opposite sides of the first heat sink in the thickness direction, and the second heat sink and the third heat sink are located between the first heat sink and the busbar.

3. The power module according to claim 2, characterized in that: The second heat dissipation plate is arranged at an angle to the first heat dissipation plate; and / or the third heat dissipation plate is arranged at an angle to the first heat dissipation plate; and / or the second heat dissipation plate is arranged at an angle to the third heat dissipation plate.

4. The power module according to claim 3, characterized in that: The second heat dissipation plate is inclined toward the first heat dissipation plate along a direction away from the busbar; and / or the third heat dissipation plate is inclined toward the first heat dissipation plate along a direction away from the busbar.

5. The power module according to claim 4, characterized in that: The second heat dissipation plate and the first heat dissipation plate have an angle α1, and the angle α1 satisfies: 110°≤α1≤160°; and / or the third heat dissipation plate and the first heat dissipation plate have an angle α2, and the angle α2 satisfies: 110°≤α2≤160°.

6. The power module according to claim 1 or 2, characterized in that: The first heat dissipation plate, the second heat dissipation plate and the third heat dissipation plate are parallel to each other.

7. The power module according to claim 1 or 2, characterized in that: The second heat sink is arranged at an angle to the busbar; and / or the third heat sink is arranged at an angle to the busbar.

8. The power module according to claim 7, characterized in that: The second heat sink and the busbar have an angle β1, and the angle β1 satisfies: 20°≤β1≤70°; and / or the third heat sink and the busbar have an angle β2, and the angle β2 satisfies: 20°≤β2≤70°.

9. The power module according to claim 1 or 2, characterized in that: The first heat dissipation plate, the second heat dissipation plate and the third heat dissipation plate are arranged in a Y shape, and the busbar, the second heat dissipation plate and the third heat dissipation plate are arranged in a triangle shape.

10. The power module according to claim 1 or 2, characterized in that: The second heat dissipation plate and the third heat dissipation plate are arranged symmetrically with respect to the first heat dissipation plate.

11. A power conversion device, characterized in that: The invention comprises a cabinet body and a DC fuse, a DC isolating switch, a power module, a reactor, an AC filter capacitor and an AC circuit breaker which are accommodated in the cabinet body and electrically connected in sequence. The power module is the power module according to any one of claims 1 to 10.

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