Two-circulation infiltration type heat dissipation system and heat dissipation assembly
By adopting two-circulation immersive design and heat dissipation components in the immersive heat dissipation system, efficient heat exchange between air and liquid is achieved, solving the problems of low heat dissipation efficiency and environmental pollution in the prior art, and improving the reliability and efficiency of the system.
Patent Information
- Application Number
- CN202311236541.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-04
- Filing Date
- 2023-09-25
- Publication Date
- 2025-03-04
AI Technical Summary
The existing immersive cooling system has limited heat dissipation efficiency, and the fluorine-based coolant used has environmental pollution problems. The dual-phase coolant requires high airtight space, resulting in high cost, and the single-phase non-conductive synthetic oil has high flash fire point, resulting in limited heat conduction efficiency.
A two-circulation immersive heat dissipation system is adopted, including a first circulation module and a second circulation module. The heat exchange between air and liquid is achieved through the circulation paths on the inner and outer sides of the box, and the heat dissipation efficiency is improved. The heat dissipation assembly includes a liquid heat exchanger, a gas heat exchanger and a circulation fitting. The working fluid flows in an independent circulation space to reduce the risk of leakage.
Improves heat dissipation efficiency, reduces the risk of working fluid leakage, improves system reliability, and reduces the possibility of equipment damage.
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Figure CN119562486A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a heat dissipation system, in particular to a two-circulation immersion heat dissipation system and a heat dissipation component. Background Art
[0002] Since the server generates a lot of heat when it is running, the server will be equipped with an immersion cooling system to take away the heat, but it has the problem of limited cooling efficiency. In addition, the immersion cooling system can use a two-phase heat-absorbing fluorine coolant, but the global warming potential (GWP) value of fluorine coolants is not 0, which has environmental pollution problems. In addition, since the two-phase coolant usually requires a higher airtight space to achieve good heat exchange efficiency, the cost of the equipment is high. On the other hand, the immersion cooling system can also use a single-phase heat-absorbing non-conductive synthetic oil. In order to comply with safety regulations, the flash point of the non-conductive synthetic oil cannot be too low, but the non-conductive synthetic oil with a high flash point is prone to limited thermal conductivity efficiency. Summary of the invention
[0003] In view of the above problems, some embodiments of the present invention provide a two-circulation immersion heat dissipation system and a heat dissipation component.
[0004] According to one embodiment, a two-circulation immersion heat dissipation system is suitable for accommodating electronic equipment, which includes a box, a first circulation module, and a second circulation module, wherein the box includes a accommodating structure, the first circulation module includes a first circulation pipe located outside the box, and the first circulation pipe is connected to the accommodating structure. The second circulation module is located outside the box and is configured to perform heat exchange with air outside the box, the second circulation module is connected to the accommodating structure, and the first circulation module and the second circulation module perform heat exchange with liquid in the accommodating structure.
[0005] According to one embodiment, a heat dissipation component is suitable for accommodating a working fluid, and the heat dissipation component includes a liquid heat exchanger, a gas heat exchanger, and a circulation pipe, wherein the liquid heat exchanger is configured to perform heat exchange on a liquid, the gas heat exchanger is configured to perform heat exchange on air, the circulation pipe is suitable for accommodating the working fluid, and the circulation pipe connects the liquid heat exchanger and the gas heat exchanger.
[0006] In summary, according to some embodiments, the first circulation module and the second circulation module achieve heat exchange between air and liquid through the circulation paths inside and outside the box to improve heat dissipation efficiency. In addition, according to some embodiments, the heat dissipation component can exchange heat between air and liquid, and has good heat exchange efficiency. In addition, the working fluid of the heat dissipation component can flow in an independent circulation space, reducing the risk of equipment damage caused by leakage of the working fluid from the circulation space, and having good reliability. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Figure 1 Schematic diagram of the appearance of a two-circulation immersion heat dissipation system of some embodiments, wherein the housing is represented by a dotted line, the upper cover is represented by a solid line and is shown in a closed position, a circle is formed by a dotted imaginary line to represent a local first working fluid in the housing, and a circle is formed by a two-point chain imaginary line to represent a local second working fluid in the liquid heat exchanger;
[0008] Figure 2 Schematic diagram of the appearance of the box body of some embodiments, the box body is represented by a dotted line, the upper cover is in an open position, and the first working fluid and the second working fluid are not shown;
[0009] Figure 3 It is a schematic diagram of the appearance of a liquid heat exchanger in some embodiments;
[0010] Figure 4 for Figure 2 A partial cross-sectional schematic diagram of the embodiment of the invention in the direction of the +X axis, without showing the first circulation pipe and the first fluid driving member;
[0011] Figure 5 For Figure 4 The enlarged schematic diagram of the area marked C in the middle;
[0012] Figure 6 Schematic diagrams of the appearance of a housing in some embodiments, wherein the housing is represented by a dotted line, a circle is formed by a dotted imaginary line to represent a local first working fluid in the housing, and an arrow is used to show the flow direction of the first working fluid in the first circulation path;
[0013] Figure 7 Schematic diagram of the appearance of a two-circulation immersion heat dissipation system of some embodiments, wherein the housing is represented by a dotted line, the upper cover is represented by a solid line, and a circle is formed by a dotted imaginary line to represent a local first working fluid that is visible inside the housing, and the second working fluid is not shown;
[0014] Figure 8 Schematic diagrams of the appearance of a liquid heat exchanger, a gas heat exchanger, a second circulation pipe, a second fluid driving member, and a gas conveying device in some embodiments;
[0015] Fig. 9 Schematic diagram of the appearance of a gas heat exchanger according to some embodiments;
[0016] Fig.10 Schematic diagram of the appearance of a two-circulation immersion heat dissipation system of some embodiments, wherein the housing is represented by a dotted line, the upper cover is represented by a solid line, a circle is formed by an imaginary line of a two-point chain line to represent a local second working fluid in the liquid heat exchanger, and an arrow is used to show the flow direction of the second working fluid in the second circulation path, and the first working fluid and the electronic device are not shown;
[0017] Fig.11 Schematic diagrams of the appearance of a two-circulation immersion heat dissipation system of some embodiments, showing that an upper cover and a plurality of gas heat exchangers form a chamber portion, a gas delivery device is located on the side of the gas heat exchanger, and arrows are used to indicate the flow direction of air outside the box; and
[0018] Fig.12 It is a partial exploded schematic diagram of a two-circulation immersion cooling system of some embodiments, showing a plurality of gas heat exchangers arranged around the upper side of the upper cover, a gas delivery device being located above the gas heat exchanger, arrows indicating the flow direction of air outside the box, and dotted lines indicating the opening of the chamber.
[0019] Explanation of symbols
[0020] 1: First cycle module
[0021] 2: Second loop module
[0022] 10: Electronic devices
[0023] 11: Side wall exterior
[0024] 12: Slit channel
[0025] 13: Bottom of the tank
[0026] 15: Chamber
[0027] 16: Opening
[0028] 20: Cabinet
[0029] 21: Accommodation structure
[0030] 22: Extension
[0031] 23: Bottom
[0032] 24: Heat source
[0033] 25: Upper cover
[0034] 221: Extension wall
[0035] 222,241,231: Side wall
[0036] 223: Upper opening
[0037] 230: Bottom opening
[0038] 232: Bottom plate
[0039] 30:Liquid heat exchanger
[0040] 32: Heat sink
[0041] 33: Heat dissipation pipe fittings
[0042] 33a: Entrance
[0043] 33b: Export Department
[0044] 34: Heat dissipation
[0045] 35: Diversion channel
[0046] 40,40a,40b,40c: Gas heat exchanger
[0047] 41a: Cooling section
[0048] 41b: High temperature part
[0049] 42: Condensation section
[0050] 43: Fins
[0051] 44: Condenser
[0052] 50: Gas delivery device
[0053] 60: first fluid driving member
[0054] 70: First circulation pipe
[0055] 71: Upper part
[0056] 72: Lower part
[0057] 80: Second fluid driving member
[0058] 81: Entrance
[0059] 82:Export
[0060] 90: Second circulation pipe
[0061] 91: Turning Point
[0062] 91a: First turning point
[0063] 91b: Second turning point
[0064] 92: Soaking part
[0065] 92a: first immersion part
[0066] 92b: Second immersion section
[0067] 100A: First working fluid
[0068] 100B: Second working fluid DETAILED DESCRIPTION
[0069] See also Figure 1 and Figure 2 , Figure 1 A schematic diagram of the appearance of a two-circulation immersion cooling system according to some embodiments is shown, wherein the housing 20 is represented by a dotted line, the upper cover 25 is represented by a solid line and shows that the upper cover 25 is in a closed position, a circle is formed by a dotted imaginary line to represent a local first working fluid 100A that is visible inside the housing 20, and a circle is formed by a two-dot chain imaginary line to represent a local second working fluid 100B that is visible inside the liquid heat exchanger 30; Figure 2 The appearance of the housing 20 according to some embodiments is shown in dashed lines, the housing 20 is shown, the upper cover 25 is in an open position, and the first working fluid 100A and the second working fluid 100B are not shown. The terms related to connection described in the following embodiments may be physical connection, or refer to direct or indirect connection between physical elements.
[0070] At Figure 1 The two-circulation immersion heat dissipation system is suitable for accommodating an electronic device 10, and includes a box 20, a first circulation module 1, and a second circulation module 2, wherein the box 20 includes a containing structure 21, and the first circulation module 1 includes a first circulation pipe 70 located outside the box 20, and the first circulation pipe 70 is connected to the containing structure 21. The second circulation module 2 is located outside the box 20 and is configured to perform heat exchange with the air outside the box 20, and the second circulation module 2 is connected to the containing structure 21, and the first circulation module 1 and the second circulation module 2 perform heat exchange with the liquid in the containing structure 21. In this way, the first circulation module 1 and the second circulation module 2 achieve heat exchange between air and liquid in the circulation paths inside and outside the box 20 to improve the heat dissipation efficiency.
[0071] In some embodiments, the containing structure 21 can be an immersion tank of an immersion heat dissipation system, and the liquid in the containing structure 21 can be a coolant. In some embodiments, the first circulation module 1 is connected to the containing structure 21, which means that the liquid in the containing structure 21 can flow to the first circulation pipe 70, which means that part of the liquid is located in the box 20 and part of the liquid is located outside the box 20. This configuration can improve the heat dissipation efficiency of the liquid. In some embodiments, the first circulation module 1 is partially outside the box 20 and partially inside the box 20, and the part outside the box 20 is connected to the containing structure 21. In some embodiments, the part of the first circulation module 1 outside the box 20 includes Figure 1 The first circulation pipe 70 in the first circulation module 1 is a portion of the housing 20 where the accommodating structure 21 is filled with liquid (e.g. Figure 1 In some embodiments, the second circulation module 2 may be Figure 1 The gas heat exchanger 40 in the second circulation module 2 is connected to the gas heat exchanger 40 in the second circulation module 2 through the pipe (for example Figure 1The second circulation pipe 90 is connected to the containing structure 21. In some embodiments, the second circulation module 2 can absorb the heat of the liquid in the first circulation module 1 located at the containing structure 21, and dissipate the absorbed heat into the air, so as to achieve the effect of heat exchange between the first circulation module 1 and the second circulation module 2 in the liquid of the containing structure 21.
[0072] On the other hand, Figure 1 , the heat dissipation component is suitable for accommodating the working fluid, which includes a liquid heat exchanger 30, a gas heat exchanger 40, and a second circulation pipe 90. Among them, the liquid heat exchanger 30 is configured to perform heat exchange on the liquid, the gas heat exchanger 40 is configured to perform heat exchange on the air, and the second circulation pipe 90 is suitable for accommodating the working fluid and connecting the liquid heat exchanger 30 and the gas heat exchanger 40. That is to say, the working fluid is located in the liquid heat exchanger 30 and the gas heat exchanger 40, and the working fluid can flow in an independent circulation space. In this way, the heat dissipation component can perform heat exchange between air and liquid, and has good heat exchange efficiency. In addition, according to the inventor's knowledge, the immersion heat dissipation system can be equipped with a chiller, a cooling water pipeline, and a cooling water monitoring host (cooling distribution unit, CDU), but it occupies a large plane space, has a high space cost, and has the problem of easy leakage of the coolant, which in turn causes the problem of short circuit of electronic equipment. Because the heat dissipation component is suitable for an immersion heat dissipation system, and the working fluid in the heat dissipation component can flow in an independent circulation space, the heat dissipation component can reduce the risk of equipment damage caused by leakage of the working fluid from the circulation space, and has good reliability.
[0073] In some embodiments, the two-circulation immersion heat dissipation system achieves heat exchange between air and liquid through a heat dissipation component to improve heat dissipation efficiency.
[0074] Specifically, see Figure 1In some embodiments, the two-circulation immersion heat dissipation system further includes a second circulation pipe 90 and a liquid heat exchanger 30, and the liquid heat exchanger 30 is located in the containing structure 21. In addition, the second circulation module 2 includes a gas heat exchanger 40, and the gas heat exchanger 40 is configured to perform heat exchange with the air outside the box 20. The second circulation pipe 90 connects the liquid heat exchanger 30 and the gas heat exchanger 40, and the first circulation module 1 and the second circulation module 2 perform heat exchange in the containing structure 21 through the liquid heat exchanger 30. In other words, the liquid heat exchanger 30 is immersed in the liquid in the containing structure 21, and the liquid heat exchanger 30 absorbs the heat of the liquid, and the heat absorbed by the liquid heat exchanger 30 is dissipated into the air through the gas heat exchanger 40. In some embodiments, the liquid heat exchanger 30 is located in the containing structure 21, and the liquid heat exchanger 30 is configured to perform heat exchange with the liquid in the containing structure 21, that is, the liquid heat exchanger 30 is immersed in the liquid in the containing structure 21, and the liquid heat exchanger 30 can absorb the heat of the liquid. In some embodiments, the liquid heat exchanger 30 may be, but is not limited to, a fin-tube heat exchanger, or an aluminum heat exchanger.
[0075] In some embodiments, see Figure 1 The two-circulation immersion cooling system further includes an electronic device 10, which is located in the housing structure 21. The electronic device 10 can be, but is not limited to, a server, a circuit board, a central processing unit, or a component that generates heat when performing a computing function. In some embodiments, the electronic device 10 is immersed in the liquid in the housing structure 21.
[0076] See also Figure 2 In some embodiments, the housing 20 is configured to contain a coolant (e.g. Figure 1 The first working fluid 100A in the box body 20 includes a containing structure 21 and an upper cover 25. The containing structure 21 is located on the inner side of the box body 20. The upper cover 25 is pivotally connected to the side wall 222 of the containing structure 21 to have an open position and a closed position. When the upper cover 25 is in the open position, the interior of the containing structure 21 is exposed. Figure 2 When the upper cover 25 is in the closed position, the interior of the accommodating structure 21 is sealed, such as Figure 1 In this way, the box body 20 has an upper cover 25 that is easy to open and close, which is convenient for maintenance. In addition, the two-circulation immersion heat dissipation system is also suitable for single-phase coolants, which have lower requirements on the airtightness of the containing structure 21. In this way, the two-circulation immersion heat dissipation system is not limited to a specific type of coolant to achieve good heat exchange efficiency.
[0077] See also Figure 2In some embodiments, the accommodating structure 21 includes an extension portion 22, a bottom portion 23, and a heat source portion 24. The bottom portion 23 is connected to the extension portion 22 through the heat source portion 24, and the heat source portion 24 is located between the bottom portion 23 and the extension portion 22. The extension portion 22 has an extension wall 221, a side wall 222, and an upper opening 223. The upper opening 223 is located on the extension wall 221. The side wall 222 is pivotally connected to the upper cover 25. The bottom portion 23 includes a side wall 231, a bottom plate 232, and a lower opening 230. The lower opening 230 is located on the side wall 231 of the bottom portion 23. The side wall 241 of the heat source portion 24 connects the extension wall 221 and the side wall 231 of the bottom portion 23 to form the side wall outer portion 11, which means that the side wall outer portion 11 is located on the outside of the box body 20.
[0078] See also Figure 2 In some embodiments, the first circulation pipe 70 is located outside the side wall 11, and the first circulation pipe 70 is connected to the accommodating structure 21 to form a first circulation path. The first circulation pipe 70 includes an upper portion 71 and a lower portion 72. The upper portion 71 is connected to the upper opening 223 of the accommodating structure 21, and the lower portion 72 is connected to the lower opening 230 of the accommodating structure 21. In some embodiments, the first circulation module 1 includes the first circulation pipe 70 and the first fluid driving member 60. The first circulation pipe 70 and the first fluid driving member 60 are located outside the side wall 11. The first fluid driving member 60 is connected to the first circulation pipe 70. The first fluid driving member 60 is configured to drive the liquid (e.g. Figure 2 The first working fluid 100A) flows to the liquid heat exchanger 30. In some embodiments, the two ends of the upper portion 71 of the first circulation pipe 70 are respectively connected to the upper opening 223 and the water inlet of the first fluid driving member 60, and the two ends of the lower portion 72 of the first circulation pipe 70 are respectively connected to the outlet of the first fluid driving member 60 and the lower opening 230, and the first circulation pipe 70 and the first fluid driving member 60 are located outside the side wall 11. In this way, the overall pipeline configuration is simplified, and the amount of liquid used in the accommodating structure 21 can be minimized, which can save space and cost. In addition, since the first circulation pipe 70 and the first fluid driving member 60 are located outside the box 20, the heat dissipation efficiency can be improved.
[0079] See also Figure 3 , Figure 4 ,and Figure 5 , Figure 3 A schematic diagram showing the appearance of a liquid heat exchanger 30 according to some embodiments is shown; Figure 4 Drawing basis Figure 2 A partial cross-sectional schematic diagram of the embodiment of the present invention taken from the perspective of the +X axis direction, without showing the first circulation pipe 70 and the first fluid driving member 60; Figure 5 Drawn on Figure 4 The enlarged schematic diagram of the region marked C is shown in the figure.
[0080] See also Figure 3 In some embodiments, the liquid heat exchanger 30 is suitable for accommodating a coolant. The liquid heat exchanger 30 includes a heat dissipation pipe 33 and a heat sink 32. The number of the heat sink 32 is multiple. The heat dissipation pipe 33 includes a heat dissipation portion 34, an inlet portion 33a, and an outlet portion 33b. The heat dissipation portion 34 of the heat dissipation pipe 33 is penetrated in the layered structure formed by the heat dissipation fins 32. In this way, the coolant in the liquid heat exchanger 30 enters the heat dissipation portion 34 through the inlet portion 33a of the heat dissipation pipe 33. In the heat dissipation portion 34, the coolant exchanges heat with the liquid in the containing structure 21, and the coolant in the heat dissipation portion 34 absorbs the heat of the liquid. In some embodiments, the aforementioned coolant is the second working fluid 100B, and the liquid in the containing structure 21 is the first working fluid 100A. Figure 1 shown.
[0081] See also Figure 4 , Figure 5 and Figure 7 , Figure 7 A schematic diagram of the appearance of a two-circulation immersion cooling system according to some embodiments is shown, wherein the housing 20 is represented by a dotted line, the upper cover 25 is represented by a solid line, and a circle formed by dotted imaginary lines represents a local first working fluid 100A that is visible inside the housing, and the second working fluid 100B is not shown.
[0082] See also Figure 4 and Figure 5 In some embodiments, the liquid heat exchanger 30 is disposed at the bottom 23, and the number of electronic devices 10 is multiple, and the electronic devices 10 are disposed in parallel to the heat source portion 24, such as Figure 4 Specifically, Figure 5 In the embodiment, two adjacent electronic devices 10 form a slit channel 12, and two adjacent heat sinks 32 form a diversion channel 35. The slit channel 12 is connected to the diversion channel 35, so that the liquid in the accommodating structure 21 can flow through the slit channel 12 and the diversion channel 35. In some embodiments, the liquid in the accommodating structure 21 flows from the diversion channel 35 to the slit channel 12, that is, the flow direction of the liquid is Figure 5 In the +Y axis direction, the heat sink 32 of the liquid heat exchanger 30 can evenly distribute the flow to the electronic device 10 so that the flow field of the electronic device 10 tends to be uniform.
[0083] See also Figure 2 In some embodiments, the liquid heat exchanger 30 is installed at the bottom 23 of the accommodating structure 21, and the liquid heat exchanger 30 and the bottom plate 232 of the bottom 23 form a tank bottom 13, and the lower opening 230 faces the tank bottom 13, such as Figure 2 See Figure 7In some embodiments, the liquid heat exchanger 30 is installed in the extension portion 22 of the accommodating structure 21, and the plurality of heat sinks 32 of the liquid heat exchanger 30 are arranged along Figure 7 The middle Y-axes are arranged in parallel, so that the liquid heat exchanger 30 is close to the upper cover 25 of the box body 20, which is convenient for installation and maintenance.
[0084] In some embodiments, there are multiple liquid heat exchangers 30, and the liquid heat exchangers 30 are respectively installed in the extension portion 22 (such as Figure 7 As shown) and the bottom 23 (as shown Figure 2 As shown, since the number of the heat sinks 32 of the liquid heat exchanger 30 increases, the contact area between the liquid heat exchanger 30 and the liquid in the containing structure 21 increases, and the heat exchange efficiency of the liquid in the containing structure 21 is improved, so that the temperature in the tank can be stably maintained at a low temperature.
[0085] See also Figure 1 In some embodiments, the two-circulation immersion heat dissipation system further includes a first working fluid 100A, the first working fluid 100A is located in the accommodating structure 21, the first circulation pipe 70 and the first fluid driving member 60, the first fluid driving member 60 is configured to drive the first working fluid 100A to flow to the liquid heat exchanger 30, and the liquid heat exchanger 30 is configured to perform heat exchange on the first working fluid 100A. In some embodiments, the first working fluid 100A can be a non-conductive working fluid, such as a non-conductive synthetic oil, a polyalphaolefin (Poly Alpha Olefins, PAO) type coolant, a natural gas synthetic oil (Gasto Liquid Base Oil, GTL) type coolant, a synthetic ester type coolant, or a fluorocarbon coolant (fluorocarbon), etc. In some embodiments, the first working fluid 100A can be a single-phase coolant or a two-phase coolant. In some embodiments, the first working fluid 100A is a single-phase coolant.
[0086] See also Figure 6 , Figure 6 A schematic diagram of the appearance of the housing 20 according to some embodiments is shown, wherein the housing 20 is represented by a dotted line, a circle is formed by a dotted imaginary line to represent a local first working fluid 100A seen through the housing, and an arrow is used to show the flow direction of the first working fluid 100A in the first circulation path.
[0087] See also Figure 6In some embodiments, the first working fluid 100A is located in the first circulation path, which means that the first working fluid 100A is driven by the first fluid driving member 60 to flow in the containing structure 21, the first circulation pipe 70, and the first fluid driving member 60. The electronic device 10 is immersed in the first working fluid 100A. The first working fluid 100A is a single-phase coolant and absorbs the heat of the electronic device 10 in a phased manner. The liquid level of the first working fluid 100A is higher than the extension wall 221 so that the first working fluid 100A can flow into the first circulation pipe 70 through the upper opening 223. Specifically, since the first fluid driving member 60 drives the first working fluid 100A to flow, a negative pressure is generated in the upper part 71 of the first circulation pipe 70. The first working fluid 100A is sucked into the first circulation pipe 70 from the upper opening 223 of the containing structure 21, and then flows back to the containing structure 21 from the lower opening 230 and flows to the liquid heat exchanger 30. The flow direction of the first working fluid 100A is as follows: Figure 6 In the direction of the arrow, an active heat dissipation cycle is formed. For example, the first working fluid 100A located in the heat source portion 24 of the accommodating structure 21 has a temperature T due to absorbing the heat generated by the electronic device 10. a1 That is, the temperature of the first working fluid 100A located at the top of the electronic device 10 (ie, the portion close to the extension portion 22) is T a1 , with temperature T a1 The first working fluid 100A is driven by the first fluid driving member 60 along Figure 6 The first circulation pipe 70 is entered in the direction of the arrow shown, and then flows into the bottom 13 of the tank in the bottom 23 through the lower opening 230, and then flows along Figure 6 The +Y axis direction sequentially flows through the liquid heat exchanger 30 and the electronic device 10, which means that the first working fluid 100A absorbs the heat generated by the electronic device 10 at the heat source portion 24, and is driven by the first fluid driving member 60 to flow to the liquid heat exchanger 30. The liquid heat exchanger 30 absorbs the heat of the first working fluid 100A, and the temperature of the first working fluid 100A is cooled down. The temperature of the first working fluid 100A on the side of the liquid heat exchanger 30 close to the electronic device 10 is temperature T a2 Less than temperature T a1 , with temperature T a2 The first working fluid 100A then flows along Figure 6 The +Y axis direction flows toward the electronic device 10 to absorb the heat generated by the electronic device 10 and proceed to the next cycle. Figure 7 In some embodiments, the liquid heat exchanger 30 is installed in the extension portion 22 of the accommodating structure 21, and the first working fluid 100A flows from the liquid heat exchanger 30 close to the electronic device 10. Figure 7The liquid flows out of the liquid heat exchanger 30 in the +X axis direction and flows into the first circulation pipe 70. As in the above embodiment, the first working fluid 100A absorbs the heat generated by the electronic device 10 and has a temperature T a1 , by passing through the liquid heat exchanger 30, the temperature T of the first working fluid 100A a1 Drop to temperature T a2 In this way, the first working fluid 100A performs an active heat dissipation cycle in the first circulation path. According to the inventors' knowledge, compared with the first working fluid 100A performing a passive heat dissipation cycle (i.e., utilizing the physical properties of the first working fluid 100A to dissipate heat from the electronic device 10), the first working fluid 100A performing an active heat dissipation cycle can better maintain the temperature in the housing structure 21.
[0088] For further information, see Figure 6 In some embodiments, the first fluid driving member 60 is configured to drive the first working fluid 100A to have a liquid mass flow rate in response to the temperature of the first working fluid 100A, that is, the liquid mass flow rate provided by the first fluid driving member 60 for the first working fluid 100A can be adjusted according to the temperature of the first working fluid 100A. The relationship between the liquid mass flow rate provided by the first fluid driving member 60 and the temperature in the accommodating structure 21 is expressed by formula (1). In some embodiments, the liquid mass flow rate is the volume of the first working fluid 100A flowing through the liquid heat exchanger 30 per unit time.
[0089]
[0090] In formula (1), The mass flow rate of liquid provided to the first fluid driving member 60, T f1 is the average temperature of the first working fluid 100A, T e is the average temperature of the electronic device 10, C p,f1 is the specific heat capacity of the first working fluid 100A, Q in The heat generated by the electronic device 10 can be measured by the monitoring module of the electronic device 10, or calculated using the heat calculation formula recorded by Chin-Chi Cheng et al. in "Design of a single-phase immersion cooling system through experimental and numerical analysis" in International Journal of Heat and Mass Transfer 160 (2020) (see Formula (1.1) and Formula (1.2)).
[0091]
[0092]
[0093] In formula (1.1) and formula (1.2), Q is the heat of the heat source (heat, unit: watt (W)), C p is the heat capacity, T is the temperature, q is the heat flux, and k is the heat transfer coefficient.
[0094] For example, Figure 6 The first working fluid 100A has a temperature T due to absorbing the heat generated by the electronic device 10. a1 , when the temperature T a1 When the temperature exceeds an upper limit, the first fluid driving member 60 increases the liquid mass flow rate accordingly. becomes larger, because Q in formula (1) in and C p,f1 is a fixed value, The temperature difference (T f1 -T e ) becomes smaller, the electronic device 10 and the first working fluid 100A reach thermal equilibrium, that is, After the lifting, the smaller the difference between the average temperature of the first working fluid 100A and the average temperature of the electronic device 10, the increased liquid mass flow rate can reduce the thermal equilibrium temperature of the electronic device 10 and the first working fluid 100A, thereby maintaining the temperature of the electronic device 10 at a low temperature. In some embodiments, the first fluid driving member 60 can reduce the liquid mass flow rate in response to the average temperature of the first working fluid 100A reaching a lower temperature limit. In some embodiments, the first fluid driving member 60 can adjust the liquid mass flow rate according to the temperature of the first working fluid 100A located at different positions in the first circulation path. For example, when the difference between the temperature of the first working fluid 100A located at the extension portion 22 and the temperature of the first working fluid 100A located at the bottom 23 exceeds a set value, it means that the electronic device 10 and the first working fluid 100A have not reached thermal equilibrium. At this time, the first fluid driving member 60 increases the liquid mass flow rate of the first working fluid 100A to help the electronic device 10 and the first working fluid 100A reach thermal equilibrium. In some embodiments, the temperature of the first working fluid 100A to which the first fluid driving member 60 responds may be the temperature at a specific location within the accommodating structure 21, the temperature difference at different locations within the accommodating structure 21, the average temperature of the first working fluid 100A, or any combination thereof. Since the first fluid driving member 60 can adjust the liquid mass flow rate according to the temperature of the first working fluid 100A, the heat exchange efficiency of the first working fluid 100A can be improved by increasing the liquid mass flow rate, and energy-saving operation can be performed by reducing the liquid mass flow rate.
[0095] See also Figure 1 , Figure 8 , Fig. 9 and Fig.10 , Figure 8 Schematic diagrams showing the appearance of a liquid heat exchanger 30, a gas heat exchanger 40, a second circulation pipe 90, a second fluid driving member 80, and a gas delivery device 50 according to some embodiments; Fig. 9 A schematic diagram showing the appearance of a gas heat exchanger 40 according to some embodiments is shown; Fig.10 A schematic diagram of the appearance of a two-circulation immersion cooling system according to some embodiments is shown, in which the housing 20 is represented by a dotted line, the upper cover 25 is represented by a solid line, and a circle is formed by an imaginary line of a two-point chain line to represent a local second working fluid 100B that is visible in the liquid heat exchanger 30, and an arrow is used to show the flow direction of the second working fluid 100B in the second circulation path. The first working fluid 100A and the electronic device 10 are not shown.
[0096] See also Figure 1In some embodiments, the gas heat exchanger 40 is located outside the box 20. The gas heat exchanger 40 is configured to perform heat exchange on the air outside the box 20, that is, the air outside the box 20 absorbs heat from the gas heat exchanger 40. The gas heat exchanger 40 may be, but is not limited to, a fin-tube heat exchanger or an aluminum heat exchanger.
[0097] See also Fig. 9 In some embodiments, the gas heat exchanger 40 includes a cooling portion 41a, a high temperature portion 41b, and a condensing portion 42. The condensing portion 42 connects the cooling portion 41a and the high temperature portion 41b. The condensing portion 42 has a condensing tube 44 and fins 43. The number of fins 43 is multiple. In some embodiments, the condensing tube 44 is arranged in a layered structure formed by the fins 43. Two adjacent fins 43 are arranged in parallel to form an air flow channel. In this way, the air outside the box 20 can be driven to flow along the air flow channel. In addition, please refer to Fig. 9 In some embodiments, the fins 43 are arranged horizontally, that is, Fig. 9 The horizontal direction of the Z axis is set and along Fig. 9 The fins 43 extend in the X-axis direction and are parallel to each other. In some embodiments, the fins 43 are arranged vertically, such as Fig. 9 The fin 43 is rotated 90 degrees, that is, Fig. 9 The Y axis is set in the vertical direction and along Fig. 9 The fins 43 extend in the X-axis direction and are parallel to each other.
[0098] See also Figure 8 In some embodiments, the second circulation pipe 90 connects the liquid heat exchanger 30 and the gas heat exchanger 40 to form a second circulation path. Fig.10 In some embodiments, the second circulation pipe 90 includes a soaking portion 92 and a turning portion 91 , the turning portion 91 is located outside the box 20 , the soaking portion 92 is located in the accommodating structure 21 , and the second fluid driving component 80 is located outside the box 20 and connected to the second circulation pipe 90 .
[0099] Specifically, see Figure 8 The immersion portion 92 includes a first immersion portion 92a and a second immersion portion 92b, and the transition portion 91 includes a first transition portion 91a and a second transition portion 91b. The two ends of the first immersion portion 92a are respectively connected to the inlet portion 33a of the liquid heat exchanger 30 and the outlet 82 of the second fluid driving component 80, the two ends of the first transition portion 91a are respectively connected to the inlet 81 of the second fluid driving component 80 and the cooling portion 41a of the gas heat exchanger 40, the two ends of the second immersion portion 92b are respectively connected to the outlet portion 33b of the liquid heat exchanger 30 and the second transition portion 91b, and the two ends of the second transition portion 91b are respectively connected to the second immersion portion 92b and the high-temperature portion 41b of the gas heat exchanger 40.
[0100] See also Figure 1 and Fig.10 In some embodiments, the two-circulation immersion heat dissipation system further includes a second working fluid 100B, which is located in the second circulation pipe 90 and can flow between the liquid heat exchanger 30 and the gas heat exchanger 40. In some embodiments, the second working fluid 100B can be a non-conductive working fluid, such as a non-conductive synthetic oil, a polyalphaolefin (PolyAlpha Olefins, PAO) type coolant, a natural gas synthetic oil (Gas to Liquid Base Oil, GTL) type coolant, a synthetic ester type coolant, or a fluorocarbon coolant (fluorocarbon), etc. In some embodiments, the second working fluid 100B can be a single-phase coolant or a two-phase coolant. In some embodiments, the second working fluid 100B is a two-phase coolant. In some embodiments, the second working fluid 100B absorbs the heat of the first working fluid 100A in a phase-changed manner, for example, in Figure 1 The liquid second working fluid 100B absorbs the heat of the first working fluid 100A in the liquid heat exchanger 30 and becomes gaseous. The gaseous second working fluid 100B enters the gas heat exchanger 40 along the second circulation pipe 90. In the gas heat exchanger 40, the gaseous second working fluid 100B condenses into liquid. After condensation, the liquid second working fluid 100B is driven by the second fluid driving component 80 to flow from the gas heat exchanger 40 to the liquid heat exchanger 30.
[0101] See also Figure 1 In some embodiments, the two-circulation immersion heat dissipation system is suitable for a first working fluid 100A and a second working fluid 100B. The first working fluid 100A is located in the containing structure 21 of the box 20 and can flow to the first circulation pipe 70. The second working fluid 100B is located in the liquid heat exchanger 30 and flows to the gas heat exchanger 40 through the second circulation pipe 90. The two working fluids flow in their own independent circulation spaces. In some embodiments, the first working fluid 100A and the second working fluid 100B are both non-conductive synthetic oils, wherein the flash point of the first working fluid 100A is greater than or equal to the flash point of the second working fluid 100B. In some embodiments, the first working fluid 100A or the second working fluid 100B can be a single-phase coolant or a two-phase coolant. In some embodiments, the first working fluid 100A is a single-phase coolant and the second working fluid 100B is a two-phase coolant.
[0102] See also Fig.10 In some embodiments, the second working fluid 100B is located in the second circulation path, and the second fluid driving member 80 is configured to drive the second working fluid 100B to flow to the liquid heat exchanger 30. Specifically, Fig.10Since the second fluid driving member 80 drives the second working fluid 100B to flow, the first turning portion 91a of the second circulation pipe 90 generates a negative pressure, and the second working fluid 100B is sucked into the first turning portion 91a of the second circulation pipe 90 from the cooling portion 41a of the gas heat exchanger 40, and then enters the heat dissipation portion 34 of the liquid heat exchanger 30 from the inlet portion 33a of the liquid heat exchanger 30 (see Figure 3 ), the second working fluid 100B in the liquid heat exchanger 30 absorbs the heat of the first working fluid 100A (see Figure 1 ), then enters the high temperature portion 41b of the gas heat exchanger 40 from the outlet portion 33b of the liquid heat exchanger 30 along the second soaking portion 92b, and enters the condensation pipe 44 in the gas heat exchanger 40 (see Fig. 9 ) dissipates the heat of the second working fluid 100B into the air, thus forming an active heat dissipation cycle. The flow direction of the second working fluid 100B in the second circulation path is approximately as follows: Fig.10 As shown by the arrows. In this way, the two-circulation immersion cooling system is suitable for two working fluids, and the two working fluids are in the first and second independent circulation paths, and have good reliability. In addition, the two active cooling cycles composed of the gas heat exchanger 40 and the liquid heat exchanger 30 can effectively utilize the heat dissipation capacity per unit area, have good space utilization, and the overall pipeline configuration can be suitable for a variety of cooling systems. Users do not need to spend extra costs to re-lay the pipelines, which is economical.
[0103] See also Fig.10 In some embodiments, the second fluid driving member 80 is configured to drive the second working fluid 100B to have a flow rate in response to the temperature of the second working fluid 100B. For example, the second working fluid 100B has a temperature T due to absorbing heat from the first working fluid 100A. b1 , when the temperature T b1When the temperature exceeds an upper temperature limit, the second fluid driving member 80 increases the flow rate of the second working fluid 100B, that is, in a unit time, a larger volume of the second working fluid 100B flows through the liquid heat exchanger 30 and absorbs the heat of the first working fluid 100A, and the heat exchange efficiency of the liquid heat exchanger 30 is increased, so that the first working fluid 100A is maintained in a stable low temperature state. In some embodiments, the second fluid driving member 80 can reduce the flow rate in response to the average temperature of the second working fluid 100B reaching a lower temperature limit. In some embodiments, the second fluid driving member 80 can adjust the flow rate according to the temperature of the second working fluid 100B at different positions in the second circulation path. For example, when the difference between the average temperature of the second working fluid 100B at the liquid heat exchanger 30 and the average temperature of the second working fluid 100B at the gas heat exchanger 40 exceeds a set value, it means that the heat exchange efficiency of the liquid heat exchanger 30 needs to be improved. At this time, the second fluid driving member 80 increases the flow rate of the second working fluid 100B to exchange heat with the liquid heat exchanger 30. In some embodiments, the temperature of the second working fluid 100B to which the second fluid driving member 80 responds may be the temperature of a specific position in the second circulation path (e.g., the liquid heat exchanger 30, the gas heat exchanger 40, or the second circulation pipe 90), the average temperature in the second circulation path, the temperature difference of the second working fluid 100B at different positions in the second circulation path, or any combination thereof. Since the second fluid driving member 80 can adjust the flow rate according to the temperature of the second working fluid 100B, the heat exchange efficiency of the liquid heat exchanger 30 can be improved by increasing the flow rate, and energy-saving operation can be performed by reducing the flow rate.
[0104] See also Figure 1 In some embodiments, the second circulation module 2 further includes a gas delivery device 50, which is located outside the box 20, and the gas heat exchanger 40 is installed on the air inlet side of the gas delivery device 50. In some embodiments, the gas delivery device 50 is configured to drive the air flow outside the box 20, and the air outside the box 20 is driven by the gas delivery device 50 to flow toward the gas heat exchanger 40, that is, the air flow direction is Figure 1 In this way, the gas delivery device 50 can increase the heat exchange efficiency of the gas heat exchanger 40 .
[0105] See also Figure 1 In some embodiments, the gas delivery device 50 drives the air to have an air mass flow rate in response to the temperature of the liquid heat exchanger 30. The air mass flow rate is the volume of air entering the air inlet side of the gas delivery device 50 per unit time. That is, the air mass flow rate of the air provided by the gas delivery device 50 can be adjusted according to the temperature of the liquid heat exchanger 30. The relationship between the air mass flow rate provided by the gas delivery device 50 and the temperature in the containing structure 21 is expressed by formula (2).
[0106]
[0107] In formula (2), The air mass flow rate provided to the gas delivery device 50, T air is the average temperature of the air, T f2 is the average temperature of the second working fluid 100B, C p,air is the specific heat capacity of air, Q out is the heat dissipation (unit: watt (W)) of the gas heat exchanger 40, Q out It can be measured by the monitoring module of the two-circulation immersion cooling system, or calculated using the heat calculation formula (see formula (2.1)) recorded by Wu Shaowen et al. in "Research on the Application of Heat Pipe Heat Exchanger in Immersed Server Cooling" in the Journal of Solar Energy and New Energy, Volume 23, Issue 2.
[0108]
[0109] In formula (2.1), is the heat dissipation of the heat pipe heat exchanger (W), is the average wind speed in the condensation zone of the heat exchanger (m / s), ρ air is the density of air, T air,in is the air inlet temperature (°C), T air,out is the air outlet temperature (°C).
[0110] For example, Figure 1 The liquid heat exchanger 30 has a temperature T3 because it absorbs the heat of the liquid in the accommodating structure 21. When the temperature T3 exceeds an upper temperature limit, the gas delivery device 50 increases the air mass flow rate. In formula (2), Get bigger, Q out In other words, the gas heat exchanger 40 dissipates more heat into the air, and the average temperature of the second working fluid 100B decreases accordingly, thereby increasing the heat exchange efficiency of the liquid heat exchanger 30, so as to help maintain the temperature in the accommodating structure 21 (or the average temperature of the first working fluid 100A) at a stable low temperature state. In some embodiments, the gas delivery device 50 can reduce the air mass flow rate in response to the temperature of the liquid heat exchanger 30 reaching a lower temperature limit. In some embodiments, the temperature of the liquid heat exchanger 30 may be an average temperature at a specific location of the liquid heat exchanger 30, an average temperature of the liquid heat exchanger 30, a temperature difference at different locations of the liquid heat exchanger 30, or any combination thereof. In some embodiments, the temperature of the liquid heat exchanger 30 may be substantially the same as the temperature of the second working fluid 100B in the liquid heat exchanger 30. Since the gas delivery device 50 may adjust the air mass flow rate according to the temperature of the liquid heat exchanger 30, the heat exchange efficiency of the liquid heat exchanger 30 may be improved by increasing the air mass flow rate, and energy-saving operation may be performed by reducing the air mass flow rate.
[0111] In some embodiments, the two-cycle immersion cooling system has a first active cooling cycle and a second active cooling cycle, wherein in the first active cooling cycle, the first fluid driving member 60 can adjust the liquid mass flow rate of the first working fluid 100A, and in the second active cooling cycle, the gas delivery device 50 can adjust the air mass flow rate of the air outside the box 20. The two-cycle immersion cooling system with these two active cooling cycles can have a power usage effectiveness (PUE) less than 1.2.
[0112] See also Fig.11 and Fig.12 , Fig.11 A schematic diagram of the appearance of a two-circulation immersion cooling system according to some embodiments is shown, showing that the upper cover 25 and a plurality of gas heat exchangers 40 form a chamber portion 15, the gas delivery device 50 is located on the side of the gas heat exchanger 40, and the arrow indicates the flow direction of the air outside the box 20; Fig.12 A partial exploded schematic diagram of a two-circulation immersion cooling system according to some embodiments is shown, showing that a plurality of gas heat exchangers 40 are arranged around the upper side of the upper cover 25, and the gas delivery device 50 is located above the gas heat exchanger 40. The flow direction of the air outside the box body 20 is indicated by an arrow, and the opening 16 of the chamber portion 15 is indicated by a dotted line.
[0113] See also Fig.11 In some embodiments, there are multiple gas heat exchangers 40, and the upper cover 25 and the gas heat exchanger 40 form a chamber 15. Fig.11The gas heat exchangers 40a, 40b, and 40c are respectively arranged on the upper side of the upper cover 25 and are located on the air inlet side of the gas delivery device 50. The air outside the box body 20 is driven by the gas delivery device 50 to flow, and its flow direction flows from the outside of the chamber portion 15 through the gas heat exchangers 40a, 40b, and 40c to the gas delivery device 50. For example, the air passes through the gas heat exchanger 40a along the arrow in the -Z axis direction and enters the chamber portion 15, and then passes through the gas heat exchanger 40c along the arrow in the +X axis direction and flows to the gas delivery device 50. Fig.12 In the embodiment, a plurality of gas heat exchangers 40 are arranged around the upper side of the upper cover 25 to form a chamber portion 15, which has an opening 16 facing the +Y axis direction, and a gas delivery device 50 is arranged at the opening 16, so that the air outside the box body 20 is driven by the gas delivery device 50 to flow along Fig.12 The direction of the middle arrow flows through the gas heat exchanger 40 and enters the chamber 15, and then flows out from the air outlet side of the gas delivery device 50. In this way, the heat exchange area of the gas heat exchanger 40 is increased, thereby improving the heat exchange efficiency of the first working fluid 100A in the accommodating structure 21.
[0114] In summary, according to some embodiments, the first circulation module and the second circulation module achieve heat exchange between air and liquid through the circulation paths inside and outside the box to improve the heat dissipation efficiency. In addition, according to some embodiments, the heat dissipation component can exchange heat between air and liquid, with good heat exchange efficiency. In addition, the working fluid suitable for the heat dissipation component can flow in an independent circulation space, reducing the risk of equipment damage caused by leakage of the working fluid from the circulation space, and having good reliability.
Claims
1. A two-circulation immersion heat dissipation system, suitable for accommodating electronic equipment, the two-circulation immersion heat dissipation system comprising: A box body, including a containing structure; A first circulation module, comprising a first circulation pipe, located outside the box, the first circulation pipe being in communication with the accommodating structure; and The second circulation module is located outside the box and is configured to perform heat exchange with the air outside the box. The second circulation module is connected to the containing structure. The first circulation module and the second circulation module perform heat exchange with the liquid in the containing structure.
2. The two-circulation immersion heat dissipation system as claimed in claim 1, further comprising a second circulation pipe and a liquid heat exchanger, wherein the liquid heat exchanger is located in the accommodating structure; and The second circulation module comprises a gas heat exchanger, and the gas heat exchanger is configured to perform heat exchange with the air outside the box; The second circulation pipe connects the liquid heat exchanger and the gas heat exchanger, and the first circulation module and the second circulation module perform heat exchange in the accommodating structure through the liquid heat exchanger.
3. A two-circulation immersion cooling system as described in claim 2, wherein the second circulation module further includes a gas delivery device, the gas heat exchanger is located on the air inlet side of the gas delivery device, and the gas delivery device is configured to respond to the temperature of the liquid heat exchanger to drive the air to have an air mass flow rate.
4. The two-circulation immersion cooling system as claimed in claim 2, wherein the gas heat exchanger comprises a plurality of fins, the fins are parallel to each other and form an air flow channel, and the air flows along the air flow channel.
5. The two-circulation immersion cooling system as described in claim 2, wherein the box body further includes an upper cover pivotally connected to the accommodating structure, the number of the gas heat exchangers is multiple, and the upper cover and the multiple gas heat exchangers form a chamber portion.
6. The two-circulation immersion heat dissipation system as described in claim 2 further includes a first working fluid located in the accommodating structure; the first circulation module further includes a first fluid driving component connected to the first circulation pipe, the first fluid driving component is immersed in the first working fluid, and the first fluid driving component is configured to drive the first working fluid to flow to the liquid heat exchanger; the liquid heat exchanger is configured to perform heat exchange on the first working fluid. 7 . The dual-circulation immersion cooling system of claim 6 , wherein the first fluid driving element is configured to drive the first working fluid to have a liquid mass flow rate in response to a temperature of the first working fluid.
8. The two-circulation immersion heat dissipation system as claimed in claim 6, wherein the accommodating structure comprises: An extension portion, comprising an extension wall and an upper opening, wherein the upper opening is located on the extension wall; A bottom portion, connected to the extension portion, the bottom portion having a lower opening, the lower opening being located on a side wall of the bottom portion, the accommodating structure being connected to the first circulation pipe member through the upper opening and the lower opening; and The heat source part, the bottom and the extension part are communicated through the heat source part, the side wall of the heat source part connects the side wall of the bottom and the extension wall to form the outside of the side wall, and the first circulation pipe and the first fluid driving member are located outside the side wall.
9. The two-circulation immersion heat dissipation system as described in claim 8, wherein the liquid heat exchanger is installed on the bottom, the liquid heat exchanger and the bottom plate of the bottom form a tank bottom, and the lower opening faces the tank bottom.
10. The two-circulation immersion heat dissipation system as claimed in claim 8, wherein the liquid heat exchanger is installed on the extension portion. 11 . The two-circulation immersion heat dissipation system as claimed in claim 6 , wherein the first working fluid absorbs heat from the electronic device in a phased manner.
12. The two-circulation immersion heat dissipation system as claimed in claim 2 further comprises a second working fluid, the second circulation module further comprises a second fluid driving member connected to the second circulation pipe, the second fluid driving member is configured to drive the second working fluid to flow toward the liquid heat exchanger. 13 . The two-circulation immersion cooling system as claimed in claim 12 , wherein the second fluid driving element is configured to drive the second working fluid to have a flow rate in response to a temperature of the second working fluid.
14. The two-circulation immersion heat dissipation system as claimed in claim 12, wherein the second circulation pipe comprises: A first immersion portion connecting the outlet of the second fluid driving member and the inlet of the liquid heat exchanger; A first turning portion connecting the inlet of the second fluid driving member and the cooling portion of the gas heat exchanger; a second soaking portion connected to an outlet of the liquid heat exchanger; and The second turning portion connects the second immersion portion and the high-temperature portion of the gas heat exchanger.
15. The two-circulation immersion cooling system as claimed in claim 2, wherein the liquid heat exchanger comprises: a heat dissipation pipe connected to the second circulation pipe; and A plurality of heat sinks are provided, the heat sink pipe is passed through the heat sinks, and two adjacent heat sinks are substantially parallel to form a flow diversion channel.
16. The two-circulation immersion heat dissipation system according to claim 1 further comprises a second circulation pipe, a liquid heat exchanger, a first working fluid and a second working fluid, wherein: The liquid heat exchanger and the first working fluid are located in the accommodating structure, and the first circulation module and the second circulation module perform heat exchange in the accommodating structure through the liquid heat exchanger; The first circulation module further comprises a first fluid driving member connected to the first circulation pipe member, the first fluid driving member being configured to drive the first working fluid to flow toward the liquid heat exchanger; the liquid heat exchanger being configured to perform heat exchange on the first working fluid; The first working fluid absorbs heat from the electronic device in a phased manner; The first fluid driving member is configured to drive the first working fluid to have a liquid mass flow rate in response to a temperature of the first working fluid; The second circulation module comprises a gas heat exchanger, a second fluid driving member and a gas conveying device, wherein the gas heat exchanger is configured to perform heat exchange with the air outside the box, the second fluid driving member is connected to the second circulation pipe, the second fluid driving member is configured to drive the second working fluid to flow to the liquid heat exchanger, and the second fluid driving member is configured to drive the second working fluid to have a flow rate in response to the temperature of the second working fluid; the gas heat exchanger is located at the air inlet side of the gas conveying device, and the gas conveying device is configured to drive the air to have an air mass flow rate in response to the temperature of the liquid heat exchanger; The second circulation pipe connects the liquid heat exchanger and the gas heat exchanger, and the second working fluid is located in the liquid heat exchanger, the gas heat exchanger, and the second circulation pipe.
17. The two-circulation immersion heat dissipation system according to claim 1 further comprises: a second circulation pipe, a liquid heat exchanger, wherein: The liquid heat exchanger is located in the accommodating structure, and the first circulation module and the second circulation module perform heat exchange in the accommodating structure through the liquid heat exchanger; The first circulation module further comprises a first fluid driving member connected to the first circulation pipe member; The second circulation module comprises a gas heat exchanger, a second fluid driving member and a gas delivery device, the gas heat exchanger is configured to perform heat exchange with the air outside the box, the gas heat exchanger is located at the air inlet side of the gas delivery device, the gas heat exchanger comprises a plurality of fins, the fins are parallel and form an air flow channel, the air flows along the air flow channel; The second circulation pipe comprises: A first immersion portion connecting the inlet of the liquid heat exchanger and the outlet of the second fluid driving member; A first turning portion connecting the inlet of the second fluid driving member and the cooling portion of the gas heat exchanger; a second soaking portion connected to an outlet of the liquid heat exchanger; and The second turning portion connects the second immersion portion and the high-temperature portion of the gas heat exchanger.
18. The two-circulation immersion heat dissipation system according to claim 1 further comprises: a second circulation pipe and a liquid heat exchanger, wherein: The liquid heat exchanger is located in the accommodating structure, and the first circulation module and the second circulation module perform heat exchange in the accommodating structure through the liquid heat exchanger; The liquid heat exchanger comprises: A heat dissipation pipe connected to the second circulation pipe; as well as A plurality of heat sinks, the heat sink pipe is disposed through the heat sinks, and two adjacent heat sinks are substantially parallel to form a flow diversion channel; The first circulation module further comprises a first fluid driving member connected to the first circulation pipe member; The second circulation module comprises a gas heat exchanger, the gas heat exchanger is configured to perform heat exchange with the air outside the box, and the second circulation pipe connects the liquid heat exchanger and the gas heat exchanger; The accommodating structure comprises: An extension portion, comprising an extension wall and an upper opening, wherein the upper opening is located on the extension wall; A bottom portion, connected to the extension portion, the bottom portion having a lower opening, the lower opening being located on a side wall of the bottom portion, the accommodating structure being connected to the first circulation pipe member through the upper opening and the lower opening; and A heat source part, the bottom and the extension part are communicated through the heat source part, the side wall of the heat source part connects the side wall of the bottom and the extension wall to form the side wall outside, the first circulation pipe and the first fluid driving member are located outside the side wall; The liquid heat exchanger is installed on the bottom. The liquid heat exchanger and the bottom plate of the bottom form a tank bottom. The lower opening faces the tank bottom.
19. A heat dissipation assembly, suitable for containing a working fluid, comprising: a liquid heat exchanger configured to exchange heat with a liquid; a gas heat exchanger configured to exchange heat with air; as well as The circulation pipe is suitable for accommodating the working fluid, and the circulation pipe connects the liquid heat exchanger and the gas heat exchanger. 20 . The heat dissipation assembly as claimed in claim 19 , further comprising a fluid driving member connected to the circulation pipe, wherein the fluid driving member is configured to drive the liquid to flow toward the liquid heat exchanger.
21. The heat dissipation assembly as claimed in claim 20, wherein the circulation pipe comprises: A first immersion portion, connecting the inlet of the liquid heat exchanger and the outlet of the fluid driving member; A first turning portion connecting the inlet of the fluid driving member and the cooling portion of the gas heat exchanger; a second soaking portion connected to an outlet of the liquid heat exchanger; and The second turning portion connects the second immersion portion and the high-temperature portion of the gas heat exchanger.
22. The heat dissipation assembly of claim 19, further comprising a gas delivery device, the gas heat exchanger being located on an air inlet side of the gas delivery device, the gas delivery device being configured to drive the air to have an air mass flow rate in response to a temperature of the liquid heat exchanger.