Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device, and the display panel comprises a substrate with a non-display area and a display area, and the display area comprises a light-emitting layer; the non-display area comprises at least one bonding pad and an electrostatic discharge circuit, and an electrostatic transmission path is arranged between the electrostatic discharge circuit and the at least one bonding pad; partial or all electrostatic charges on the bonding pad are prevented from being transmitted to the electrostatic discharge circuit in the evaporation stage of the light-emitting layer through the electrostatic transmission path; or one side, deviating from the substrate, of the bonding pad is provided with an insulating layer so as to prevent the electrostatic charge from being transmitted to the bonding pad. According to the display panel provided by the invention, in the evaporation stage of the light-emitting layer, the insulating layer is used for fundamentally preventing the bonding pad and the evaporation mask plate of the light-emitting layer from generating static electricity, or the static electricity transmission path is used for preventing partial or all static charges on the bonding pad from being transmitted to the static electricity release circuit, and the static electricity release circuit is protected.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] Electrostatic Discharge (ESD) refers to the phenomenon that when two objects with different electrostatic potentials are in direct contact or electrostatic field induction, the electrostatic charge between the two objects is transferred. When the electrostatic field energy reaches a certain level, it breaks through the medium between them and discharges. ESD circuits are designed to protect electronic equipment from damage caused by electrostatic discharge, mainly to protect the electronic components inside the display panel from damage caused by ESD events. With the current trend of miniaturization of circuits, the components used in them also tend to be miniaturized, their withstand voltage is reduced, and their ability to withstand electrostatic shock is weakened. Therefore, if the electrostatic field and electrostatic current generated by electrostatic discharge are too large, they will damage the ESD circuit, causing the ESD circuit to fail, thereby causing damage to the circuit components in the display device, such as transistors, integrated circuits, etc., which may cause the device to malfunction or fail completely. Therefore, electrostatic discharge protection design technology is a necessary technology for any electronic product. Summary of the invention

[0003] The present application discloses a display panel, a method for preparing the display panel, and a display device, so as to solve the problem that the electrostatic current of the display panel is too large during the evaporation stage, which may damage the ESD circuit and cause the ESD circuit to fail.

[0004] In a first aspect, the present application discloses a display panel, the display panel comprising:

[0005] A substrate having a non-display area and a display area, wherein the display area includes a light-emitting layer;

[0006] At least one pad is located in the non-display area;

[0007] An electrostatic discharge circuit, located in the non-display area;

[0008] An electrostatic transmission path is provided between the electrostatic discharge circuit and at least one of the pads; the electrostatic transmission path is used to block part or all of the electrostatic charge on the pad from being transmitted to the electrostatic discharge circuit during the evaporation stage of the light-emitting layer; the electrostatic discharge circuit is used to absorb and / or disperse the energy of electrostatic charge for electrostatic discharge;

[0009] Alternatively, an insulating layer is provided on the side of at least one of the pads facing away from the substrate, and the insulating layer is used to block the static charge on the evaporation mask plate of the light-emitting layer from being transmitted to the pad during the evaporation stage of the light-emitting layer, so as to block the static charge from being transmitted to the electrostatic discharge circuit.

[0010] In some exemplary embodiments, the insulating layer is used to isolate the pad from an evaporation mask of the light-emitting layer during an evaporation stage of the light-emitting layer.

[0011] In some exemplary embodiments, the electrostatic transmission path includes a first transmission path, a second transmission path and an electrostatic release protection structure, one end of the first transmission path is connected to the pad, the other end of the first transmission path is connected to one end of the electrostatic release protection structure, the other end of the electrostatic release protection structure is connected to one end of the second transmission path, and the other end of the second transmission path is connected to the electrostatic release circuit; the impedance of the electrostatic release protection structure is greater than the impedance of the first transmission path and / or the second transmission path.

[0012] In some exemplary embodiments, the electrostatic discharge protection structure includes a semiconductor material layer.

[0013] In some exemplary embodiments, the display panel further includes a conductive connection layer, and the conductive connection layer is used to connect the electrostatic discharge circuit and the pad.

[0014] In some exemplary embodiments, the display panel further includes a touch electrode, and the conductive connection layer is disposed in the same layer as the touch electrode.

[0015] In some exemplary embodiments, the pad includes a test pad, the display panel further includes a detection circuit, the detection circuit is located in the non-display area, the detection circuit is electrically connected to the test pad, and the detection circuit is used to detect the display panel; the electrostatic transmission path is also used to transmit part or all of the electrostatic charge on the test pad to the electrostatic discharge circuit during the detection stage;

[0016] In some exemplary embodiments, the detection circuit includes a crack detection circuit.

[0017] In a second aspect, the present application discloses a method for preparing a display panel, the method comprising:

[0018] Providing a substrate, wherein the substrate has a non-display area and a display area;

[0019] forming at least one pad in the non-display area;

[0020] forming an electrostatic discharge circuit in the non-display area, wherein the electrostatic discharge circuit is insulated from the pad;

[0021] The evaporation stage of the light emitting layer is performed, and the light emitting layer is formed in the display area.

[0022] In some exemplary embodiments, after the evaporation stage of the light-emitting layer, the preparation method further comprises:

[0023] A conductive connection layer is formed, and the electrostatic discharge circuit is electrically connected to the pad through the conductive connection layer.

[0024] In some exemplary embodiments, after the evaporation stage of the light-emitting layer, the preparation method further includes: forming a touch electrode, and the conductive connection layer and the touch electrode are disposed in the same layer.

[0025] In a third aspect, the present application discloses a display device, which includes the display panel as described in the first aspect.

[0026] In the display panel, the method for preparing the display panel and the display device provided by the present application, an electrostatic transmission path is arranged between the pad and the electrostatic release circuit in the display panel, so that during the evaporation stage of the light-emitting layer, the electrostatic transmission path can be used to block part or all of the static charge on the pad from being transmitted to the electrostatic release circuit; or, an insulating layer is arranged on the surface of the pad located away from the substrate, so that during the evaporation stage of the light-emitting layer, the insulating layer can be used to isolate the pad from the evaporation mask plate of the light-emitting layer to avoid the accumulation of static charge on the pad due to friction between the two, so as to prevent the generation of excessive static electricity and the breakdown of the ESD circuit from the root, thereby protecting the electrostatic release circuit, thereby protecting the electrostatic release circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0028] Figure 1 The figure is a schematic diagram of the structure of a display panel exemplarily shown in the present application.

[0029] Figure 2 A schematic structural diagram of a solder pad in a display panel is shown for the purpose of exemplifying the present application.

[0030] Figure 3 A schematic diagram of the structure of a solder pad in another display panel is shown for the purpose of exemplifying the present application.

[0031] Figure 4 The figure is a schematic diagram of the structure of a display panel exemplarily shown in the present application.

[0032] Figure 5 This is a schematic structural diagram of another electrostatic transmission path in a display panel exemplarily shown in the present application.

[0033] Figure 6 for Figure 4Schematic diagram of the cross section of the electrostatic transmission path along line AA'.

[0034] Figure 7 This is a schematic diagram of the structure of another display panel exemplified in the present application.

[0035] Figure 8 for Figure 7 Schematic diagram of the cross section BB' of the electrostatic transmission path.

[0036] Fig. 9 This is a schematic structural diagram of another electrostatic transmission path in a display panel exemplarily shown in the present application.

[0037] Fig.10 for Fig. 9 Schematic diagram of the cross section of the electrostatic transmission path C-C'.

[0038] Fig.11 The present invention is a flowchart of a method for manufacturing a display panel exemplarily shown in the present application. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0040] Organic light emitting display (OLED) has many advantages such as self-luminescence, fast response time, wide viewing angle, low cost, simple manufacturing process, good resolution and high brightness, and is considered to be an emerging application technology for the next generation of flat panel displays. In the manufacturing process of OLED display panels, vacuum evaporation process is a very important and key technology. This process usually uses a mask plate as a mold. After the organic material evaporates at high temperature, it is deposited on the substrate substrate in a material molecular state through the hollow mask pattern on the mask plate to form a desired pattern, which is used as an organic light-emitting layer to achieve light emission. However, in the prior art, the evaporation mask plate and the pad are prone to produce a film layer during the evaporation process, which gradually increases the static electricity on the pad, and it is easy to accumulate static electricity on the pad. The accumulated static electricity is too large and may break through the ESD circuit in the panel, causing the ESD circuit to fail, which may cause the display panel to fail to work properly or completely fail. The principle of excessive static electricity breaking through the ESD circuit is that the energy of electrostatic discharge exceeds the tolerance of the ESD circuit, causing the protection element to fail and the charge to pass through the circuit, and finally damaging the sensitive components of the device. Therefore, it is very important to design and select appropriate ESD protection measures to ensure effective protection and avoid breakdown when facing electrostatic discharge during the preparation of display panels.

[0041] As an optional implementation of the content disclosed in this application, the embodiment of this application discloses a display panel, such as Figure 1 As shown, Figure 1 It is a schematic diagram of the structure of a display panel disclosed in an embodiment of the present application. The display panel includes: a substrate 100, at least one pad 200 and an electrostatic discharge circuit 300.

[0042] like Figure 1 As shown, the substrate 100 has a non-display area NAA and a display area AA. The display area AA of the display panel refers to the area on the screen used to display images, text or video content. In the process of display panel preparation, the display area AA is a key part of the entire panel because it directly affects the quality and clarity of the content that the user ultimately sees.

[0043] Among them, a pixel unit array (not shown in the figure) arranged in a matrix can also be set on the substrate 100, and the pixel unit array constitutes a light-emitting area. The light-emitting area has a light-emitting layer 110, and the light-emitting layer 110 is formed by an evaporation process. This process is the evaporation stage of the light-emitting layer. Among them, the evaporation process usually uses an evaporation mask plate as a mold. After the organic material volatilizes at high temperature, it is deposited on the substrate 100 in a material molecular state through the hollow mask pattern on the evaporation mask plate to form a desired pattern, which serves as the light-emitting layer 110 for realizing light emission. Organic light-emitting layers of sub-pixels of different colors can be formed on the substrate 100 respectively.

[0044] like Figure 1 As shown, a non-display area NAA is arranged around the display area AA. In this embodiment, the non-display area NAA located on one side of the display area AA is exemplarily shown. At least one pad 200 and an electrostatic discharge circuit 300 are arranged in the non-display area NAA, wherein an electrostatic transmission path 400 is arranged between the electrostatic discharge circuit 300 and the at least one pad 200. Figure 1 As shown, the non-display area NAA also includes an array segment metal layer 120 , and the static electricity transmission path 400 can be connected to each array segment metal layer 120 and transmit the static electricity on the pad 200 to the static electricity release circuit 300 .

[0045] like Figure 1 As shown in FIG. 1 , a pad 200 located in the non-display area NAA is exemplarily shown. Figure 1 and Figure 2As shown, the pad 200 includes metal layers stacked from bottom to top in a direction away from the substrate 100, and an insulating layer 500 is provided on the surface of the pad 200 located away from the substrate 100. The insulating layer 500 is used to isolate the pad 200 from the evaporation mask of the light-emitting layer 110 during the evaporation stage of the light-emitting layer 110, so as to block the evaporation mask and the pad 200, thereby preventing the static charge generated by friction between the two from accumulating on the pad 200. Therefore, the insulating layer 500 can prevent the generation of static electricity between the pad 200 and the evaporation mask of the light-emitting layer 110, so as to prevent the generation of excessive static electricity from breaking through the ESD circuit from the source, so as to block the transmission of static charge to the electrostatic discharge circuit 300, thereby protecting the electrostatic discharge circuit 300.

[0046] For example, Figure 2 As shown, the metal layer located on the uppermost layer of the pad 200 can be used as the anode electrode layer 210, and the anode electrode layer 210 located on the pad 200 can be formed directly on the insulating layer 500 without removing the anode electrode layer 210. Figure 3 As shown, the anode electrode layer 210 may also be removed to expose the first metal layer 220 under the anode electrode layer 210 , and then at least one insulating layer 500 may be formed on the first metal layer 220 , and the insulating layer 500 may be an organic film layer.

[0047] In this embodiment, an insulating layer can be added on the pad before the evaporation stage of the light-emitting layer to block the electrostatic transmission path between the evaporation mask plate of the light-emitting layer (also called OLED mask) and the pad during the evaporation stage of the light-emitting layer, thereby effectively preventing static electricity from being transmitted to the pad.

[0048] In other exemplary embodiments, an insulating layer may be formed on the evaporation mask of the light-emitting layer at a position corresponding to the pad, so as to also isolate the electrostatic transmission path between the evaporation mask of the light-emitting layer and the pad during the evaporation stage of the light-emitting layer.

[0049] like Figure 1 and Figure 2 As shown, after the evaporation stage of the light-emitting layer 110 is completed, the subsequent process steps are entered, and the step of detecting the display panel can be entered. The detection probe can penetrate the insulating layer 500 to contact the pad 200 for detection. During the detection process, part or all of the static electricity generated on the pad 200 is transmitted to the static electricity release circuit 300 through the static electricity transmission path 400, so that the static electricity release circuit 300 can absorb the static charge and / or disperse the energy of the static electricity discharge, so as to protect the electronic components inside the display panel from damage caused by ESD events.

[0050] As an optional implementation of the content disclosed in this application, the embodiment of this application discloses a display panel, such as Figure 4 As shown, Figure 4 The structure diagram of a display panel is shown as an example. The structure of the display panel is basically the same as that of the display panel provided in the above embodiment, and the main difference is that in this embodiment, during the evaporation stage of the light-emitting layer 110, the static electricity transmission path 400 can be used to block part or all of the static electricity on the pad 200 from being transmitted to the static electricity discharge circuit 300, thereby protecting the static electricity discharge circuit 300.

[0051] Specifically, Figure 4 As shown, an electrostatic discharge protection structure 410 is provided in the electrostatic transmission path 400, and the conductivity of the electrostatic discharge protection structure 410 is less than the conductivity of the electrostatic transmission path 400. Exemplarily, the pad 200 is, for example, a test pad 200. During the evaporation stage of the light-emitting layer 110, when the evaporation template of the light-emitting layer 110 contacts the pad 200, the generated static electricity will be transmitted to the electrostatic discharge circuit 300 through the electrostatic transmission path 400. In this embodiment, an electrostatic discharge protection structure 410 is provided on the electrostatic transmission path 400, and the electrostatic discharge protection structure 410 can block part or all of the static charge in the electrostatic transmission path 400 from being transmitted to the electrostatic discharge circuit 300.

[0052] Specifically, Figure 5 As shown, the electrostatic transmission path 400 includes a first transmission path 401, an electrostatic discharge protection structure 410 and a second transmission path 402, one end of the first transmission path 401 is connected to the pad 200, the other end of the first transmission path 401 is connected to one end of the electrostatic discharge protection structure 410, the other end of the electrostatic discharge protection structure 410 is connected to one end of the second transmission path 402, and the other end of the second transmission path 402 is connected to the electrostatic discharge circuit 300. The impedance of the electrostatic discharge protection structure 410 is greater than the impedance of the first transmission path 401 and / or the second transmission path 402.

[0053] like Figure 6 As shown, the connection relationship between the electrostatic transmission path 400 and the array segment metal layer 120 is exemplarily shown. The position of the line layer where the electrostatic transmission path 400 is connected to the array segment metal layer 120 can be called the overlap area. Exemplarily, the electrostatic release protection structure 410 is, for example, a semiconductor material layer, which is formed in the overlap area, and the conductivity of the semiconductor material layer is at least less than the conductivity of the first transmission path. Since the conductivity of the semiconductor material layer is poorer than that of the first transmission path, it can play an anti-static role to block part or all of the static charge on the pad 200 from being transmitted to the electrostatic release circuit 300, thereby reducing the static electricity transmitted to the electrostatic release circuit 300, so as to reduce the static energy to avoid damaging the electrostatic release circuit 300, and play a protective role on the electrostatic release circuit 300.

[0054] like Figure 6 As shown, by way of example, the material of the first transmission path 401 may be the same as the material of the second transmission path 402. One end of the first transmission path 401 may be connected to any metal layer in the pad 200.

[0055] The display panel also includes a detection circuit (not shown in the figure), and the pad 200 in this embodiment is, for example, a test pad, and the detection circuit is connected to the test pad, and the detection circuit is, for example, a crack detection circuit (PCD circuit) to detect the display panel. After the evaporation stage of the light-emitting layer 110 is completed, the static electricity on the test pad can be transmitted to the static electricity release circuit 300 for release during the detection stage by using the static electricity transmission path 400, so as to prevent the accumulated static electricity from damaging the test pad during the detection stage.

[0056] As an optional implementation of the content disclosed in this application, the embodiment of this application discloses a display panel, such as Figure 7 As shown, Figure 7 A structural schematic diagram of another display panel is shown by way of example. The structure of the display panel is basically the same as that of the display panel provided in the above embodiment, with the main difference being that the electrostatic transmission path 400 is open during the evaporation stage of the light-emitting layer 110, so that the electrostatic transmission path 400 blocks all static charges on the pad 200 from being transmitted to the electrostatic release circuit 300 during the evaporation stage of the light-emitting layer 110.

[0057] like Figure 7 As shown, in order to prevent excessive static electricity from being transmitted to the static electricity release circuit 300 through the static electricity transmission path 400 during the evaporation stage of the light-emitting layer, the static electricity transmission path 400 is disconnected before the evaporation stage of the light-emitting layer to completely isolate the static electricity transmission between the pad 200 and the static electricity release circuit 300. Then, the light-emitting layer is evaporated.

[0058] Specifically, Figure 8 As shown, a hollow structure 420 is provided in the electrostatic transmission path 400, and the hollow structure 420 disconnects the electrostatic transmission path 400. The hollow structure 420 can also be formed at the position of the switching layer between the electrostatic transmission path 400 and the array segment metal layer 120, or at any position of the electrostatic transmission path 400. For example, Figure 8As shown, the hollow structure 420 can divide the static electricity transmission path 400 into two independent sections, namely the first transmission path 401 and the second transmission path 402. In this embodiment, in order to prevent the static electricity generated between the pad 200 and the evaporation mask of the light-emitting layer from damaging the static electricity release circuit 300 or the pad 200 during the evaporation stage of the light-emitting layer, the static electricity transmission path 400 is disconnected before the evaporation stage, thereby completely isolating the static electricity on the evaporation mask from being transmitted to the static electricity release circuit 300 during the evaporation stage, thereby protecting the static electricity release circuit 300.

[0059] In some embodiments of the present invention, Fig. 9 As shown, the display panel further includes: a conductive connection layer 430 , through which the electrostatic discharge circuit 300 is electrically connected to the pad 200 , so that the electrostatic transmission path 400 transmits all static charges on the pad 200 to the electrostatic discharge circuit 300 .

[0060] For example, Fig.10 As shown, the electrostatic transmission path 400 includes a first transmission path 401 and a second transmission path 402. One end of the first transmission path 401 is connected to one end of a conductive connection layer 430 located on the array segment metal layer 120, and the other end of the conductive connection layer 430 is connected to the second transmission path 402, so that the electrostatic transmission path 400 is connected. The conductive connection layer 430 is, for example, a touch electrode layer (TP film layer). The material of the conductive connection layer 430 is, for example, a metal or a metal oxide, which is not specifically limited here. In this embodiment, after the evaporation stage of the light-emitting layer, the electrostatic transmission path is connected to transfer the static charge on the pad to the electrostatic discharge circuit for release in the subsequent process.

[0061] In this embodiment, appropriate ESD circuit protection measures are taken before the evaporation stage of the light-emitting layer so that the electrostatic transmission path is in a disconnected state to completely isolate the electrostatic transmission. In order to achieve normal testing without affecting the test effect, the electrostatic transmission path is connected after the evaporation stage of the light-emitting layer, thereby ensuring that the static electricity generated by the subsequent process is normally transmitted to the electrostatic release circuit for release, thereby ensuring that the subsequent PCD test is read normally, and at the same time ensuring that the PCD test pad 200 can be tested normally.

[0062] As an optional implementation of the content disclosed in this application, the embodiment of this application discloses a method for preparing a display panel, such as Fig.11 As shown, Fig.11 This is a flow chart of a method for preparing a display panel disclosed in an embodiment of the present application. The method for preparing a display panel includes:

[0063] Step S110: providing a substrate, wherein the substrate has a non-display area and a display area.

[0064] Step S120: forming at least one pad in the non-display area.

[0065] Step S130: forming an electrostatic discharge circuit in the non-display area, wherein the electrostatic discharge circuit is insulated from at least one pad.

[0066] Step S140: performing an evaporation stage of a light-emitting layer, and forming the light-emitting layer in the display area.

[0067] In some embodiments, Figures 8 to 9 As shown, during and before the evaporation stage of the light-emitting layer 110, any one of the wiring layers in the electrostatic transmission path 400 has a hollow structure 420, and the hollow structure 420 can divide the electrostatic transmission path 400 into two independent sections, so that the electrostatic transmission path 400 is in a disconnected state when the light-emitting layer 110 is evaporated, thereby blocking all static charges on the pad 200 from being transmitted to the electrostatic release circuit 300 during the evaporation stage of the light-emitting layer 110.

[0068] In this embodiment, after the evaporation stage of the light emitting layer 110, as Fig. 9 As shown, the preparation method of the display panel also includes: forming a conductive connection layer 430, the electrostatic discharge circuit 300 is electrically connected to the pad 200 through the conductive connection layer 130, so as to transfer the static charge on the pad 200 to the electrostatic discharge circuit 300, so that in the subsequent process, the static electricity generated on the pad 200 is transmitted to the electrostatic release circuit 300 through the electrostatic transmission path 400, so as to utilize the electrostatic discharge circuit 300 to absorb the static charge and / or disperse the energy of electrostatic discharge, so as to protect the electronic components inside the display panel from damage caused by ESD events.

[0069] On this basis, in some embodiments, after the evaporation stage of the light-emitting layer 110, the process further includes: forming a touch electrode, and providing the conductive connection layer 430 and the touch electrode in the same layer. Of course, the present invention is not limited thereto, and in other embodiments, the conductive connection layer 430 may also be provided in the same layer as other conductive layers formed after the evaporation stage.

[0070] In some other embodiments, step S150 is also included before step S104. Step S150: forming an insulating layer on a side of at least one pad facing away from the substrate, wherein the insulating layer is used to block the static charge on the evaporation mask plate of the light-emitting layer from being transmitted to the pad during the evaporation stage of the light-emitting layer, so as to block the static charge from being transmitted to the electrostatic discharge circuit.

[0071] refer to Figure 1As shown, the display panel includes a substrate 100, which may be a flexible substrate and may include plastic. A pixel unit array arranged in a matrix may also be provided on the substrate 100, and under the control of the driving chip, a light-emitting display may be realized. Each pixel unit includes a light-emitting layer 110, the display area AA is located at the center of the entire display panel, and the non-display area NAA is located around the display area AA, surrounding the display area AA domain. The pad 200 and the electrostatic discharge circuit 300 may be preferentially formed in the non-display area NAA, and an electrostatic transmission path 400 may be formed between the electrostatic discharge circuit 300 and the pad 200.

[0072] In order to prevent the ESD circuit in the panel from being broken down due to excessive static electricity accumulated between the pad 200 and the evaporation mask during the evaporation process of the light-emitting layer, an insulating layer 500 is provided on the surface of the pad 200 located away from the substrate 100, so as to isolate the pad 200 from the evaporation mask of the light-emitting layer 110 by the insulating layer 500, so as to avoid direct contact between the evaporation mask and the pad 200, thereby preventing static electricity generated by friction between the two from accumulating on the pad 200, thereby preventing excessive static electricity from being transmitted to the electrostatic discharge circuit 300 through the pad 200. In this embodiment, the insulating layer 500 is used to block the generation of static electricity between the pad 200 and the evaporation mask of the light-emitting layer 110, so as to prevent the problem of excessive static electricity breaking down the ESD circuit from occurring at the source, thereby protecting the electrostatic discharge circuit 300. After the evaporation stage of the light-emitting layer 110 is completed, the subsequent process steps are entered, and the step of detecting the display panel can be entered. The detection probe can penetrate the insulating layer 500 to contact the pad 200 for detection. During the detection process, the static electricity generated on the pad 200 can be transmitted to the static electricity discharge circuit 300 through the static electricity transmission path 400, so that the static electricity discharge circuit 300 can be used to absorb the static charge and / or disperse the energy of static electricity discharge to protect the electronic components inside the display panel from damage caused by ESD events. As an optional implementation of the content disclosed in the present application, the embodiment of the present application discloses a method for preparing a display panel, and the method for preparing a display panel includes:

[0073] Step S210: providing a substrate, wherein the substrate has a non-display area and a display area.

[0074] Step S220: forming at least one pad in the non-display area.

[0075] Step S230: forming an electrostatic discharge circuit in the non-display area, and forming an electrostatic transmission path between the electrostatic discharge circuit and at least one pad; the electrostatic transmission path is used to block part or all of the electrostatic charge on the pad from being transmitted to the electrostatic discharge circuit during the evaporation stage of the light-emitting layer, and to transmit part or all of the electrostatic charge on the pad to the electrostatic discharge circuit in other stages after the evaporation stage;

[0076] Step S240: performing an evaporation stage of a light-emitting layer, and forming the light-emitting layer in the display area.

[0077] The preparation method of this embodiment is the same as the preparation method substrate provided in the above-mentioned embodiment. The main difference is that in this embodiment, during the evaporation stage of the light-emitting layer 110, the electrostatic transmission path 400 is used to block part or all of the static charge on the pad 200 from being transmitted to the electrostatic release circuit 300, thereby reducing the static electricity transmitted to the electrostatic release circuit 300, reducing the electrostatic energy to avoid damaging the electrostatic release circuit 300, and protecting the electrostatic release circuit 300.

[0078] Specifically, Figure 4 As shown, before the evaporation stage of the light-emitting layer, an electrostatic discharge protection structure 410 is formed in the electrostatic transmission path 400, and the electrostatic discharge protection structure 410 can block part or all of the static charge in the electrostatic transmission path 400 from being transmitted to the electrostatic discharge circuit 300. For example, Figure 6 As shown, the electrostatic transmission path 400 includes a first transmission path 401 and a second transmission path 402, one end of the first transmission path 401 is connected to the pad 200, and a semiconductor material layer is formed between the first transmission path 401 and the second transmission path 402, and the conductivity of the semiconductor material layer is at least less than the conductivity of the first transmission path. Since the conductivity of the semiconductor material layer is poorer than that of the first transmission path, it can play an anti-static role, so as to block part or all of the static charge on the pad 200 from being transmitted to the electrostatic discharge circuit 300 during the evaporation stage of the light-emitting layer, and protect the electrostatic discharge circuit 300.

[0079] As an optional implementation of the content disclosed in the present application, the embodiment of the present application discloses a display device, which includes the display panel provided by the above embodiment, such as Figure 1 As shown, an insulating layer 500 is provided on the surface of the pad 200 located away from the substrate 100, so that the insulating layer 500 is used to isolate the pad 200 from the evaporation mask of the light-emitting layer 110 during the evaporation stage of the light-emitting layer 110, so as to avoid the accumulation of static electricity generated by friction between the two on the pad 200, so as to prevent excessive static electricity from being generated and breaking through the ESD circuit from the source, thereby protecting the electrostatic discharge circuit 300. Alternatively, during the evaporation stage of the light-emitting layer 110, the electrostatic transmission path 400 can be used to block part or all of the static electricity on the pad 200 from being transmitted to the electrostatic discharge circuit 300, thereby protecting the electrostatic discharge circuit 300.

[0080] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The above embodiments only express several implementation methods of this specification, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of this specification, which all belong to the protection scope of this specification. Therefore, the protection scope of the patent of this specification shall be based on the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: A substrate having a non-display area and a display area, wherein the display area includes a light-emitting layer; At least one pad is located in the non-display area; An electrostatic discharge circuit, located in the non-display area; An electrostatic transmission path is provided between the electrostatic discharge circuit and at least one of the pads; the electrostatic transmission path is used to block part or all of the electrostatic charge on the pad from being transmitted to the electrostatic discharge circuit during the evaporation stage of the light-emitting layer; the electrostatic discharge circuit is used to absorb and / or disperse the energy of electrostatic charge for electrostatic discharge; Alternatively, an insulating layer is provided on the side of at least one of the pads facing away from the substrate, and the insulating layer is used to block the static charge on the evaporation mask plate of the light-emitting layer from being transmitted to the pad during the evaporation stage of the light-emitting layer, so as to block the static charge from being transmitted to the electrostatic discharge circuit.

2. The display panel according to claim 1, characterized in that: The insulating layer is used to isolate the pad from the evaporation mask plate of the light-emitting layer during the evaporation stage of the light-emitting layer.

3. The display panel according to claim 1, characterized in that: The electrostatic transmission path includes a first transmission path, a second transmission path and an electrostatic release protection structure, one end of the first transmission path is connected to the pad, the other end of the first transmission path is connected to one end of the electrostatic release protection structure, the other end of the electrostatic release protection structure is connected to one end of the second transmission path, and the other end of the second transmission path is connected to the electrostatic release circuit; The impedance of the electrostatic discharge protection structure is greater than the impedance of the first transmission path and / or the second transmission path.

4. The display panel according to claim 3, characterized in that: The electrostatic discharge protection structure includes a semiconductor material layer.

5. The display panel according to claim 1, characterized in that: The display panel further comprises a conductive connection layer, wherein the conductive connection layer is used to connect the electrostatic discharge circuit and the pad; Optionally, the display panel further includes a touch electrode, and the conductive connection layer and the touch electrode are arranged in the same layer.

6. The display panel according to claim 1, characterized in that: The pad includes a test pad, and the display panel also includes a detection circuit, which is located in the non-display area and electrically connected to the test pad. The detection circuit is used to detect the display panel; the electrostatic transmission path is also used to transfer part or all of the static charge on the test pad to the electrostatic release circuit during the detection stage.

7. The display panel according to claim 6, characterized in that: The detection circuit includes a crack detection circuit.

8. A method for preparing a display panel, characterized in that: The preparation method comprises: Providing a substrate, wherein the substrate has a non-display area and a display area; At least one pad is formed in the non-display area; an electrostatic discharge circuit is formed in the non-display area, and the electrostatic discharge circuit is insulated from the pad; The evaporation stage of the light emitting layer is performed, and the light emitting layer is formed in the display area.

9. The method for preparing a display panel according to claim 8, characterized in that: After the evaporation stage of the light-emitting layer, the preparation method further comprises: forming a conductive connection layer, wherein the electrostatic discharge circuit is electrically connected to the pad through the conductive connection layer; Optionally, after the evaporation stage of the light-emitting layer, the preparation method further comprises: forming a touch electrode, and the conductive connection layer and the touch electrode are arranged in the same layer.

10. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 7.

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