Recycling system and method of photovoltaic module

Abstract

The invention relates to a photovoltaic module recycling system and method, and relates to the technical field of photovoltaic module recycling, and the method comprises the steps: S1, disassembly: firstly, disassembling a photovoltaic module, and separating out an aluminum frame, a junction box and a glass-silicon wafer composite board; s2, cutting: cutting the two surfaces of the glass-silicon wafer composite board at the same time; s3, separation: dissolving the eva layer in the middle of the glass-silicon wafer composite board obtained in the S2 through a chemical solvent, and separating the glass and the silicon wafer at the same time to obtain a glass sheet and a silicon wafer which are consistent in size; and S4, carrying out light transmittance detection on the silicon wafers, classifying the silicon wafers with better light transmittance into one class for recovery, classifying the silicon wafers with poor light transmittance into one class for recovery, classifying the silicon wafers with better light transmittance into glass and physically worn silicon wafers, and classifying the silicon wafers with poor light transmittance into silicon wafers capable of being directly recovered as circuit substrates. According to the invention, the recycling efficiency of the photovoltaic module is improved, the cost of intermediate recycling treatment is saved, and the silicon wafer can be conveniently and directly recycled.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic module recycling, and in particular to a photovoltaic module recycling system and method. Background Art

[0002] At present, photovoltaic modules refer to multiple single-crystal silicon / polycrystalline silicon connected in series and parallel through packaging and internal connection to form an integrated device that can convert solar energy into DC power. It is one of the most critical components in the photovoltaic power generation system, responsible for converting light energy into electrical energy. With the rapid development and growth of my country's photovoltaic power generation technology and business, photovoltaic panels have been widely used across the country. In recent years, my country's new and cumulative installed capacity have maintained a leading position for many consecutive years. However, when photovoltaic panels exceed their practical life, the discarded photovoltaic modules will generate corresponding solid waste. Due to the advantages of photovoltaic power generation to the environment, photovoltaics will enter a new round of rapid development, and the resulting waste will also increase.

[0003] Common photovoltaic modules include solar cells, photovoltaic backplanes, photovoltaic frames, photovoltaic welding ribbons, glass sheets, EVA and junction boxes. Photovoltaic modules may be damaged due to factors such as calcification of the glass surface, degradation of packaging performance, internal desoldering, strong sunlight exposure, etc., and thus need to be replaced. Discarded photovoltaic modules contain many recyclable materials, such as glass, plastic panels, solar panels, aluminum frames and some precious metals.

[0004] A publication number CN118950220A discloses a photovoltaic cell assembly recycling system and recycling method, including a crushing device and a feeding device, the feeding device is arranged at the feed port of the crushing device, the feeding device is suitable for pushing the photovoltaic cell assembly into the crushing device to crush the photovoltaic cell assembly through the crushing device, wherein the feeding device includes a first driving shaft, at least one row of pushing blocks and a plurality of pushing mechanisms, the first driving shaft is rotatably connected to the crushing device, the same row of pushing blocks are equidistantly arranged on the outer wall of the first driving shaft along the axial direction of the first driving shaft, and the pushing mechanism corresponds to the pushing block, the pushing structure is rotatably arranged at the section of the pushing block away from the first driving shaft, when the first driving shaft rotates, the pushing mechanism contacts the inner wall of the feed port of the crushing device, and the inner wall of the feed port blocks the rotating block so that the rotation direction of the pushing mechanism is opposite to the rotation direction of the first driving shaft, and then the photovoltaic cell assembly stuck on the pushing block is disengaged when the pushing mechanism is reset.

[0005] With regard to the above-mentioned related technologies, when photovoltaic modules are recycled by the above-mentioned equipment, the photovoltaic panels and glass panels are completely crushed by breaking the components to obtain granular waste, which is then recycled as circuit substrates and optical components through melt molding and slicing. Conventional photovoltaic modules have high purity silicon wafers. When they are recycled as circuit substrates and optical components, only the silicon wafers that are not physically and chemically damaged need to be recycled, and then the surface is cleaned and cut into suitable sizes for recycling. If they are crushed again and recycled again, the intermediate processing efficiency is relatively low and the cost of intermediate recycling processing is increased. Summary of the invention

[0006] In order to improve the recycling efficiency of photovoltaic modules, save the cost of intermediate recycling and processing, and facilitate the direct recycling of silicon wafers, the present application provides a photovoltaic module recycling system and method.

[0007] The present application provides a photovoltaic module recycling system and method using the following technical solutions: A photovoltaic module recycling system and method, comprising the following steps: S1, disassembly, first disassemble the photovoltaic module, separate the aluminum frame, junction box, glass-silicon composite board, and directly recycle the aluminum frame and junction box; S2, cutting, cutting both sides of the glass-silicon wafer composite plate simultaneously into sheets of fixed size; S3, separation, dissolving the EVA layer in the middle of the glass-silicon wafer composite plate obtained in S2 by chemical solvent, and separating the glass and silicon wafer at the same time, to obtain glass wafers and silicon wafers of the same size; S4, through the transmittance test of silicon wafers, those with better transmittance are divided into one category for recycling, and those with poor transmittance are divided into another category for recycling. Those with better transmittance are glass and silicon wafers after physical wear, and those with poor transmittance are silicon wafers that can be directly recycled as circuit substrates.

[0008] By adopting the above technical solution, the solar panel is first disassembled, and the aluminum frame and junction box that can be directly recycled are separated, leaving the glass-silicon wafer composite board for recycling. When recycling the glass-silicon wafer, the composite board is separated after cutting, so as to improve the efficiency of subsequent dissolution of the EVA layer, thereby improving the efficiency of subsequent glass-silicon wafer separation. At the same time, after the composite board is cut into a fixed size, the subsequent cutting process is reduced when it is subsequently recycled as a circuit substrate, thereby improving the recycling efficiency when it is subsequently recycled as a circuit substrate.

[0009] At the same time, after the composite board is cut into a fixed size, it is convenient for subsequent chemical agents to penetrate and dissolve the EVA layer in the middle of the composite board, thereby improving the dissolution efficiency of the EVA layer and reducing the subsequent glass-silicon wafer separation time.

[0010] The present application also provides a photovoltaic component recycling system, including a frame, a workbench arranged on the frame, a cutting component, a separation component and a detection component arranged on the frame and extending along the length direction of the frame; the cutting component is used to cut the glass-silicon wafer composite plate, and the cutting component includes a first adsorption member arranged on the frame to adsorb the glass, a second adsorption member to adsorb the silicon wafer, a scribing knife for scribing and cutting the glass, and a cutting member for cutting the silicon wafer; the first adsorption member and the second adsorption member are both provided with adsorption holes, the first adsorption member and the second adsorption member are both provided with negative pressure members, the negative pressure members provide negative pressure toward the adsorption holes, the first adsorption member includes four first adsorption blocks spliced ​​in sequence, and a space for the scribing knife to pass through is left between adjacent adsorption blocks. Cutting groove, the first cutting groove surrounded by the four first adsorption blocks is in the shape of a "cross"; the second adsorption member also includes four second adsorption blocks spliced ​​in sequence, and an abutment groove for abutting and cutting the silicon wafer is left between adjacent second adsorption blocks, and an abutment block is lifted and arranged in the abutment groove, the first adsorption block is movably fitted with the glass surface, the second adsorption block is movably fitted with the silicon wafer surface, and the first adsorption block and the second adsorption block are both lifted and arranged on the frame, and the frame is also provided with a driving member for synchronously driving the first adsorption block, the second adsorption block and the scribing knife; when the first adsorption block is pressed against the second adsorption block and descends, the driving member drives the scribing knife to slide along the sliding direction of the cutting groove to scribing and cutting the glass surface, and the pressing block is pressed against the silicon wafer surface.

[0011] By adopting the above technical solution, when recycling the composite plate, firstly, the composite plate is placed on the workbench, and the first adsorption block is controlled to descend by the driving member until the first adsorption block is pressed against the glass side, and the silicon wafer side of the composite plate is pressed against the second adsorption block.

[0012] Then, the glass side and the silicon wafer side of the composite plate are adsorbed respectively by the first adsorption block and the second adsorption block. Under the action of the negative pressure member, the first adsorption block and the second adsorption block both generate negative pressure to stably adsorb the composite plate. In the process of the driving member driving the first adsorption block to slide downward, the sliding drive of the scoring knife is realized, so that the scoring knife slides against the glass surface to score and cut the glass surface.

[0013] The second adsorption block gradually approaches the abutment block during its downward sliding process under the pressing action of the first adsorption block until the abutment block protrudes from the abutment groove. Since the surface of the glass has been scribed, the composite board is divided along the cutting groove and the abutment groove under the pressing action of the abutment block, thereby cutting the composite board.

[0014] And because the size of common photovoltaic modules is 2000mm×1000mm, and the size of silicon wafers in common circuit substrates is 4 inches (100mm), 6 inches (150mm), 8 inches (200mm) and 12 inches (300mm), it is convenient to recycle the silicon wafers in photovoltaic modules according to the different sizes of circuit substrate silicon wafers after cutting the photovoltaic modules, reducing the steps of reforming silicon wafers of corresponding sizes after thermal cracking, thereby improving the recycling efficiency of photovoltaic modules.

[0015] Optionally, the separation component includes a water washing tank provided on the frame and a liquid storage tank connected to the water washing tank, the liquid storage tank stores a chemical solvent for dissolving EVA, the second adsorption block is movably located in the water washing tank, and when the second adsorption block descends into the water washing tank, the liquid storage tank pumps the chemical solvent into the water washing tank; A lifting plate is slidably provided on the water washing tank, a flow hole is opened on the inner wall of the water washing tank, a piston plate is slidably provided in the liquid storage tank, and a flow pipe corresponding to the flow hole is connected to the liquid storage tank, the piston plate is in contact with the inner wall of the liquid storage tank, and the lifting plate is in contact with the inner wall of the water washing tank; When the lifting plate slides toward the bottom wall of the water washing tank, the piston plate moves toward a direction close to the flow hole; When the lifting plate slides away from the bottom wall of the water washing tank, the piston plate moves in a direction away from the flow hole.

[0016] By adopting the above technical scheme, since the chemical solvents for dissolving the EVA layer are usually organic solvents, such solvents often have high volatility and therefore cannot be continuously exposed to the air. When the first adsorption block is attached to the second adsorption block and descends, the second adsorption block is pressed against the lifting plate and descends, so that the piston plate moves toward the direction close to the flow hole, and then the chemical solvent in the liquid storage tank is pumped into the water washing tank, so that the composite plate cut in the water washing tank is washed with water and the EVA layer is dissolved.

[0017] After the dissolution is completed, the second adsorption block rises. During the rising process of the lifting plate, the piston plate is driven to move in the direction away from the flow hole, so that the chemical solvent in the washing tank is recovered and absorbed into the liquid storage tank for reuse, so as to facilitate the reuse in the next washing. At this time, after the washing is completed, if the chemical agent continues to remain in the washing tank, it is easy to cause the volatilization waste of the chemical agent. The above-mentioned setting reduces the volatilization of the chemical agent, thereby saving the chemical agent. At the same time, after the EVA layer is dissolved, the silicon wafer and the glass need to be separated. After the separation, the silicon wafer and the glass need to be removed from the first adsorption block and the second adsorption block. At this time, the continuously volatilized chemical agent is easy to affect the health of the technician. By recovering the chemical agent, it is achieved not only to save the agent but also to improve the health of the technician's working environment.

[0018] Optionally, a fixed frame is provided on the frame in a lifting manner, and the fixed frame is fixedly connected to the four first adsorption blocks. A first rotating screw and a second rotating screw are rotatably provided on the fixed frame, and the first rotating screw and the second rotating screw are vertically arranged, and four scribing knives are provided, and the four scribing knives correspond to the four cutting grooves one by one, and two scribing knives in the same extension direction are threadedly assembled on the first rotating screw, and the other two scribing knives are threadedly assembled on the second rotating screw, and the first rotating screw and the second rotating screw are symmetrically provided with external threads with opposite threads and the same pitch, and the fixed frame is also provided with a synchronization part for synchronously rotating the first rotating screw and the second rotating screw when the first adsorption block is lifted and lowered.

[0019] By adopting the above technical solution, when the first adsorption block descends to fit with the surface of the glass plate, in the process of the first adsorption block pressing against the second adsorption block to descend, the first rotating screw and the second rotating screw rotate synchronously under the action of the synchronization member; since the first rotating screw and the second rotating screw are both provided with external threads with opposite threads and the same pitch, when the first rotating screw rotates, the two scoring knives on the first rotating screw move in opposite directions, so that the scoring knives slide along the cutting groove on the surface of the glass plate, thereby facilitating the subsequent cutting of the glass plate.

[0020] The cross-shaped cutting groove and the abutting groove are provided to facilitate cutting and separation of the composite board.

[0021] Optionally, the synchronizing member includes a first worm coaxially arranged on the first rotating screw and a first worm wheel coaxially arranged on the second rotating screw, a fixed rack is provided on the frame, a fixed gear is provided on the end side of the first rotating screw, and the fixed rack is meshed with the fixed gear.

[0022] By adopting the above technical solution, when the first adsorption block descends, the fixed rack on the first adsorption block descends to a position meshing with the fixed rack. At this time, the fixed rack is set to drive the fixed gear to rotate. When the fixed gear rotates, it drives the first rotating screw to rotate, thereby driving the first worm and the first worm wheel to rotate, so that the first rotating screw and the second rotating screw rotate synchronously, thereby realizing the sliding adjustment of the two sets of marking knives.

[0023] Optionally, the negative pressure member includes an adsorption plate arranged at the adsorption hole, a negative pressure block is slidably arranged at the center of the adsorption plate, the adsorption plate is in contact with the surface of the silicon wafer / glass, the negative pressure block is movably in contact with the inner surface of the adsorption plate, and the frame is also provided with a linkage member for sliding adjustment of the negative pressure block.

[0024] By adopting the above technical solution, when the first adsorption block is in contact with the surface of the glass and the second adsorption block is in contact with the surface of the silicon wafer, the linkage part is set to make the negative pressure block on the first adsorption block move toward the surface away from the first adsorption block, and the negative pressure block on the second adsorption block moves toward the surface away from the second adsorption block, so that the adsorption plate can stably adsorb the surface of the glass, which is convenient for the subsequent adsorption of the glass and the silicon wafer.

[0025] Optionally, the linkage part includes a linkage gear arranged on the first adsorption block, a first linkage rack is slidably arranged on the first adsorption block, a second linkage rack is slidably arranged on the second adsorption block, the first linkage rack and the second linkage rack are both meshed with the linkage gear, a power gear is coaxially arranged on the linkage gear, a power rack is arranged on the frame, the power rack is meshed with the power gear, and a limit member for limiting the second adsorption block is also arranged on the frame.

[0026] By adopting the above technical solution, when the first adsorption block is pressed against the second adsorption block and descends, at this time, the power rack on the frame engages with the power gear to rotate, thereby driving the power gear to rotate. The power gear is coaxial with the linkage gear, thereby driving the linkage gear to rotate. During the rotation of the linkage gear, the first linkage rack and the second linkage rack are driven to slide, thereby realizing the sliding of the negative pressure blocks on the first adsorption block and the second adsorption block, realizing negative pressure in the adsorption disk, and realizing stable adsorption of the adsorption disk and the surface of the glass plate, and the adsorption disk and the surface of the silicon wafer.

[0027] During the subsequent rising process of the first adsorption block, the limiter is set to limit the second adsorption block to restrict the rising of the second adsorption block. At this time, the first adsorption block is adsorbed on the glass, and the second adsorption block is adsorbed on the silicon wafer. Therefore, during the rising process of the first adsorption block, the glass and silicon wafer of the washed composite plate are separated.

[0028] Optionally, the limiting member includes a limiting block elastically slidably arranged on the frame, a limiting groove is provided on the side wall of the first adsorption block, the limiting block is movably engaged with the limiting groove, and the side wall of the limiting block is inclined, the inclined side of the limiting block is movably fitted and pressed against the side wall of the first adsorption block, and when the first adsorption block slides to a height higher than the water washing pool, an unlocking member for unlocking the limiting block is provided on the frame.

[0029] By adopting the above technical solution, during the descending process of the second adsorption block, the inclined side of the second adsorption block that fits the limit block descends, so that the limit block is immersed in the frame until the second adsorption block descends to the position corresponding to the limit groove and the limit block. At this time, the limit block is automatically inserted into the limit groove under the action of the elastic restoring force, and the position of the first adsorption block is limited by the clamping action of the limit block, thereby realizing the separation of the first adsorption block and the second adsorption block.

[0030] At the same time, through the unlocking piece, when the first adsorption block slides to a height higher than the water washing tank, the unlocking piece unlocks the limit block, so that the limit block is immersed in the frame. At this time, the limit block releases the limit on the second adsorption block. Since the second adsorption block is elastically slidably arranged in the water washing tank, under the action of the elastic restoring force, the second adsorption block slides toward the outside of the water washing tank, and transmits the cut and separated silicon wafers upward. At the same time, in the process of the second adsorption block moving upward, the power gear rises to a position meshing with the power rack, thereby driving the power gear and the linkage gear to rotate, and slidingly adjusting the negative pressure block, thereby realizing the pressure relief operation of the adsorption plate on the second adsorption block. After the second adsorption block lifts the silicon wafer out of the water washing tank, it is convenient for relevant technicians to take out the silicon wafer, which is convenient for subsequent light transmission detection operations.

[0031] Optionally, the linkage gear is in the form of a half gear, and the linkage gear is movably meshed with either the first linkage rack or the second linkage rack; When the second adsorption block descends to the position where the power gear is meshed with the power rack, the linkage gear is meshed with the first linkage rack.

[0032] By adopting the above technical solution, during the process of the first adsorption block pressing against the second adsorption block and descending, when the power gear steel descends to the position meshing with the power rack, since the linkage gear is in the form of a half gear, the linkage gear is meshed with the first linkage rack at this time, and when the power rack drives the power gear to rotate, the first linkage rack slides, thereby maintaining a negative pressure on the adsorption disk on the first adsorption block, thereby stably adsorbing the glass plate. During the process of the second adsorption block continuing to descend, the linkage gear rotates to the position meshing with the second linkage rack. At this time, the rotation of the linkage gear drives the second linkage rack to slide, thereby realizing the negative pressure in the adsorption disk on the second adsorption block, realizing stable adsorption of the silicon wafer, and realizing the separation of the silicon wafer and the glass wafer after the subsequent dissolution of the EVA layer.

[0033] Since the linkage gear is arranged on the second adsorption block at this time, during the rising process of the first adsorption block, the second adsorption block does not rise under the action of the limit member, and the power gear does not rise to the position where the power rack is meshed, and thus the power gear does not rotate. Therefore, the negative pressure in the adsorption plates on the second adsorption block and the first adsorption block does not cause pressure relief, thereby generating stable adsorption, thereby achieving stable separation of the glass and silicon wafers.

[0034] In summary, the present application includes at least one of the following beneficial technical effects: 1. By disassembling the photovoltaic modules and then cutting them, it is convenient to recycle the silicon wafers according to the size required for different circuit substrates, reducing the steps of re-thermal cracking and molding of silicon wafers, thereby improving the recycling efficiency; 2. Through the lifting first adsorption block, the second adsorption block, the scoring knife slidably arranged relative to the first adsorption block, and the abutment block slidably arranged relative to the second adsorption block, different cutting methods are adopted according to the different characteristics of glass and silicon wafers. After the glass is scored, the abutment block presses against the silicon wafer to achieve the cutting of the glass-silicon wafer composite plate. Since the abutment block cuts the composite plate in the chemical agent, the surface tension of the glass changes in the liquid, which is convenient for cutting and not easy to break, thereby improving the cutting accuracy and cutting integrity; 3. By setting up an adsorption plate and a negative pressure block slidably arranged on the adsorption plate, before the cut composite board is placed in the water washing tank to dissolve the EVA layer, the negative pressure block is adjusted so that the first adsorption block and the second adsorption block adsorb the glass and the silicon wafer respectively, so as to facilitate the subsequent separation of the glass and the silicon wafer after the EVA layer is dissolved. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a schematic diagram of the overall structure of a photovoltaic module recycling system in an initial state according to an embodiment of the present application; Figure 2 It is a schematic diagram of the connection structure of the separation component and the cutting component; Figure 3 yes Figure 2 A magnified schematic diagram of part A; Figure 4 yes Figure 2 A magnified schematic diagram of part B; Figure 5 is a schematic diagram of the connection structure of the first adsorption block; Figure 6 is a schematic diagram of the connection structure of the second adsorption block; Figure 7 is a schematic diagram of the connection structure in which the first adsorption block and the second adsorption block are clamping the composite plate; Figure 8 It is a schematic diagram of the overall structure of a photovoltaic module recycling system in an initial state from another perspective; Fig. 9 It is a schematic diagram of the connection structure of the scribing knife.

[0036] Figure numerals: 1, frame; 11, workbench; 12, glass; 13, silicon wafer; 2, cutting assembly; 21, first adsorption block; 22, second adsorption block; 23, scribing knife; 24, cutting member; 241, abutment block; 25, cutting groove; 26, abutment groove; 27, driving member; 271, first rotating screw rod; 272, second rotating screw rod; 28, synchronous member; 281, first worm; 282, first worm wheel; 283, fixed gear; 284, fixed rack; 29, fixed frame; 3, separation assembly; 31, washing tank; 32, liquid storage Pool; 33, lifting plate; 34, piston plate; 35, circulation hole; 4, negative pressure member; 41, adsorption hole; 42, adsorption plate; 43, negative pressure block; 44, linkage member; 441, linkage gear; 442, first linkage rack; 443, second linkage rack; 444, power gear; 445, power rack; 45, limit member; 451, limit block; 452, limit groove; 453, limit spring; 46, unlocking member; 461, unlocking block; 462, adjusting block; 5, mounting block; 51, mounting hole; 52, mounting spring; 53, mounting rod. DETAILED DESCRIPTION

[0037] The following is combined with Figure 1-9 This application is described in further detail.

[0038] The embodiment of the present application first discloses a method for recycling photovoltaic modules, comprising the following steps: S1, disassembly, first disassembling the photovoltaic module to separate the aluminum frame, the junction box, and the glass 12-silicon wafer 13 composite board, and directly recycling the aluminum frame and the junction box; S2, cutting, cutting both sides of the glass 12-silicon wafer 13 composite plate simultaneously into sheets of fixed size; S3, separation, dissolving the EVA layer in the middle of the glass 12-silicon wafer 13 composite plate obtained in S2 by chemical solvent, and separating the glass 12 and the silicon wafer 13 at the same time, to obtain glass 12 and silicon wafer 13 of the same size; S4, by testing the transmittance of the silicon wafers 13, the ones with better transmittance are classified into one category for recycling, and the ones with poor transmittance are classified into another category for recycling. The ones with better transmittance are the glass 12 and the silicon wafers 13 after physical wear, and the ones with poor transmittance are the silicon wafers 13 that can be directly recycled as circuit substrates.

[0039] At the same time, the present application also provides a photovoltaic module recycling system for recycling photovoltaic modules. Figure 1 A photovoltaic component recycling system includes a vertically fixed frame 1, a workbench 11 is fixedly connected to the middle of the frame 1, and a cutting component 2 for cutting a glass 12-silicon wafer 13 composite board and a separation component 3 for separating the composite board are arranged on the frame 1 along the height direction of the frame 1.

[0040] Reference Figure 1-Figure 5 The cutting component 2 includes a first adsorption member and a second adsorption member which are lifted and arranged on the frame 1. The first adsorption member and the second adsorption member are arranged opposite to each other, and the sliding directions of the first adsorption member and the second adsorption member are consistent with the height direction of the frame 1. The first adsorption member includes four first adsorption blocks 21 spliced ​​into a square, and cutting grooves 25 are left between adjacent first adsorption blocks 21, and the cutting grooves 25 between the four first adsorption blocks 21 are enclosed in a "cross" shape. A fixed frame 29 is lifted and arranged on the frame 1. The fixed frame 29 is fixedly connected to the four first adsorption blocks 21, and a lifting cylinder is actively provided on the fixed frame 29 for lifting and lowering the fixed frame 29. At the same time, a scoring knife 23 is slidably arranged on the fixed frame 29. Four scoring knives 23 are provided, and the four scoring knives 23 correspond to the four cutting grooves 25, and the end sides of the four scoring knives 23 are in contact with the surface of the glass 12.

[0041] The second adsorption member includes a second adsorption block 22 slidably arranged on the workbench 11. There are four second adsorption blocks 22. The four second adsorption blocks 22 are enclosed in a square shape. A cutting groove 25 is left between the four second adsorption blocks 22. The cutting groove 25 is in a "cross" shape. The workbench 11 is also provided with a cutting member 24 for cutting the silicon wafer 13. The cutting member 24 is an abutment block 241 arranged on the workbench 11. The abutment block 241 corresponds to the cutting groove 25. When the second adsorption block 22 descends, the abutment block 241 moves and protrudes from the cutting groove 25. The frame 1 is also provided with a driving member 27 for synchronously driving the first adsorption block 21, the second adsorption block 22 and the scribing knife 23.

[0042] Reference Figure 1 and Figure 2 The driving member 27 includes a first rotating screw rod 271 and a second rotating screw rod 272 which are rotatably arranged on the fixed frame 29. The first rotating screw rod 271 is consistent with the lateral extension direction of the cutting groove 25, and the second rotating screw rod 272 is consistent with the longitudinal extension direction of the cutting groove 25. The first rotating screw rod 271 and the second rotating screw rod 272 are arranged vertically, and the four scoring knives 23 are divided into two groups along the lateral extension direction and the longitudinal extension direction of the cutting groove 25. The first rotating screw rod 271 and the second rotating screw rod 272 are symmetrically provided with external threads with the same pitch and opposite threads. Two scoring knives 23 in one group are symmetrically threaded on the first rotating screw rod 271, and two scoring knives 23 in the other group are symmetrically threaded on the second rotating screw rod 272. The frame 1 is also provided with a synchronous member 28 for synchronously rotating and driving the first rotating screw rod 271 and the second rotating screw rod 272 when the first adsorption block 21 descends.

[0043] The synchronizer 28 includes a first worm 281 coaxially arranged with the first rotating screw 271 and a first worm wheel 282 coaxially arranged with the second rotating screw 272. The first worm 281 is meshed with the first worm wheel 282. A fixed rack 284 is fixedly connected to the frame 1. A fixed gear 283 is coaxially fixed to the first rotating screw 271, and the fixed rack 284 is meshed with the fixed gear 283.

[0044] Reference Figure 2 A receiving tank is provided in the middle of the workbench 11, and the separation component 3 is embedded in a water washing tank 31 in the receiving tank and a liquid storage tank 32 fixed in the workbench 11. The liquid storage tank 32 contains a chemical agent for dissolving EVA. The chemical agent in this application is acetone. In other embodiments, the chemical agent can be one of ethanol, tetrahydrofuran, dichloromethane, dimethylformamide, etc.

[0045] At the same time, a lifting plate 33 is slidably provided in the water washing tank 31, the lifting plate 33 is located on the bottom side of the first adsorption block 21, and the lifting plate 33 is movably fitted with the inner wall of the water washing tank 31, and a circulation hole 35 is opened in the side wall of the water washing tank 31, the lifting plate 33 is slidably provided on the water washing tank 31, a piston plate 34 is slidably provided in the liquid storage tank 32, and a circulation pipe corresponding to the circulation hole 35 is connected to the liquid storage tank 32, the piston plate 34 is fitted with the inner wall of the liquid storage tank 32, and the lifting plate 33 is fitted with the inner wall of the water washing tank 31; when the lifting plate 33 slides toward the bottom wall of the water washing tank 31, the piston plate 34 moves toward the direction close to the circulation hole 35; when the lifting plate 33 slides away from the bottom wall of the water washing tank 31, the piston plate 34 moves away from the circulation hole 35.

[0046] Since the chemical solvents for dissolving the EVA layer are usually organic solvents, such solvents often have high volatility and therefore cannot be continuously exposed to the air. When the first adsorption block 21 is attached to the second adsorption block 22 and descends, the second adsorption block 22 is pressed against the lifting plate 33 and descends, so that the piston plate 34 moves toward the direction close to the flow hole 35, and then the chemical solvent in the liquid storage tank 32 is pumped into the water washing tank 31, so that the composite plate cut in the water washing tank 31 is washed with water to dissolve the EVA layer.

[0047] After the dissolution is completed, the second adsorption block 22 rises. During the rising process of the lifting plate 33, the piston plate 34 is driven to move in a direction away from the flow hole 35, thereby recovering the chemical solvent in the washing tank 31 and absorbing it into the liquid storage tank 32 for repeated use.

[0048] Reference Figure 4 , Figure 5 and Figure 6 In order to separate the silicon wafer 13 and the glass 12 plate after dissolving the EVA layer in the washing tank 31, adsorption holes 41 are provided on the first adsorption block 21 and the second adsorption block 22, and negative pressure parts 4 are provided on the first adsorption block 21 and the second adsorption block 22 for generating negative pressure in the adsorption hole 41. The negative pressure part 4 includes an adsorption disk 42 fixed on the first adsorption block 21 and the second adsorption block 22. The adsorption disk 42 on the first adsorption block 21 is in contact with the surface of the glass 12, and the adsorption disk 42 on the second adsorption block 22 is in contact with the surface of the silicon wafer 13. The adsorption hole 41 is located at the center of the adsorption disk 42. The adsorption disk 42 is disc-shaped, and in the present application, the adsorption disk 42 is a soft material that cannot be dissolved by organic solvents. The material of the adsorption disk 42 can be one or more of polytetrafluoroethylene, polyvinyl chloride, silicone, etc.

[0049] A negative pressure block 43 is also slidably provided at the adsorption hole 41 of the adsorption plate 42. The sliding direction of the negative pressure block 43 is consistent with the height direction of the frame 1. The negative pressure block 43 is movably fitted with the inner wall of the adsorption plate 42. The frame 1 is also provided with a linkage part 44 for synchronously sliding and adjusting the negative pressure blocks 43 on the first adsorption block 21 and the second adsorption block 22.

[0050] The linkage member 44 includes a linkage gear 441 rotatably arranged on the second adsorption block 22, a first linkage rack 442 is slidably arranged on the first adsorption block 21, and a second linkage rack 443 is slidably arranged on the second adsorption block 22, the first linkage rack 442 is connected to the negative pressure block 43 on the first adsorption block 21, the second linkage rack 443 is connected to the negative pressure block 43 on the second adsorption block 22, and the first linkage rack 442 and the second linkage rack 443 are both meshed with the linkage gear 441.

[0051] At the same time, a power gear 444 is coaxially provided on the first adsorption block 21 and the linkage gear 441, and a power rack 445 is provided on the frame 1, and the power rack 445 is meshed with the power gear 444. At the same time, the linkage gear 441 is in the form of a half gear, and the linkage gear 441 is movably meshed with the first linkage rack 442 and the second linkage rack 443. When the first adsorption block 21 descends to the point where the power gear 444 is meshed with the power rack 445, the linkage gear 441 rotates to a position meshed with the first linkage rack 442. When the linkage gear 441 rotates to a position disengaged from the first linkage rack 442, the linkage gear 441 is meshed with the second linkage rack 443.

[0052] Therefore, when the first adsorption block 21 is pressed against the second adsorption block 22 and descends, at this time, the power rack 445 on the frame 1 engages with the power gear 444 to rotate, thereby driving the power gear 444 to rotate, and the power gear 444 is coaxial with the linkage gear 441, thereby driving the linkage gear 441 to rotate. During the rotation of the linkage gear 441, the first linkage rack 442 and the second linkage rack 443 are driven to slide, thereby realizing the sliding of the negative pressure block 43 on the first adsorption block 21 and the second adsorption block 22, realizing the negative pressure in the adsorption plate 42, and realizing the stable adsorption of the adsorption plate 42 and the surface of the glass 12 plate, and the surface of the adsorption plate 42 and the silicon wafer 13.

[0053] Reference Figure 7 and Figure 8 At the same time, in order to facilitate the subsequent separation operation of the silicon wafer 13 and the glass 12, a limiter 45 for limiting the second adsorption block 22 is also provided in the water washing tank 31. During the rising process of the first adsorption block 21, the limiter 45 is set to limit the second adsorption block 22 to limit the rise of the second adsorption block 22. At this time, the first adsorption block 21 is adsorbed on the glass 12, and the second adsorption block 22 is adsorbed on the silicon wafer 13. Therefore, during the rising process of the first adsorption block 21, the glass 12 and the silicon wafer 13 are separated from the composite plate after water washing.

[0054] An embedding groove is provided on the lifting plate 33, and the second adsorption block 22 is movably located in the embedding groove. The limiting member 45 includes a limiting block 451 slidably set on the inner side wall of the embedding groove, and a limiting groove 452 is provided on the outer side wall of the second adsorption block 22. The limiting block 451 is movably plugged and movably engaged with the limiting groove 452, and a limiting spring 453 is fixedly connected to the limiting block 451, and one end of the limiting spring 453 is fixedly connected to the inner wall of the embedding groove. The top side of the limiting block 451 is inclined, and the inclined side of the limiting block 451 is movably fitted and pressed against the side wall of the first adsorption block 21. At the same time, an unlocking member 46 for unlocking the limiting block 451 is also provided on the frame 1.

[0055] Reference Figure 7The unlocking member 46 includes an unlocking block 461 slidably arranged in the frame 1, the unlocking block 461 is elastically slidably arranged in the side wall of the water washing tank 31, the sliding direction of the unlocking block 461 is consistent with the width direction of the water washing tank 31, the limit block 451 is slidably arranged on the unlocking block 461, the sliding direction of the limit block 451 is consistent with the height direction of the unlocking block 461, and an adjusting block 462 is also provided on the unlocking block 461, one end of the adjusting block 462 is movably located in the water washing tank 31, the end side of the adjusting block 462 located in the water washing tank 31 is spherical, and the spherical side of the adjusting block 462 is tightly fitted against the side wall of the first adsorption block 21.

[0056] When the first adsorption block 21 slides to a height higher than the water washing tank 31, the first adsorption block 21 presses against the adjusting block 462 to make the adjusting block 462 slide toward the inner side wall of the water washing tank 31, and the adjusting block 462 drives the limit block 451 to slide, thereby unlocking the limit block 451, so that the limit block 451 is immersed in the lifting plate 33. At this time, the limit block 451 releases the limit on the second adsorption block 22. Since the second adsorption block 22 is elastically slidably arranged in the water washing tank 31, the second adsorption block 22 moves toward the outside of the water washing tank 31 under the action of the elastic restoring force. , and slides in the direction to transfer the cut and separated silicon wafer 13 upward. At the same time, during the upward movement of the second adsorption block 22, the power gear 444 rises to a position meshing with the power rack 445, thereby driving the power gear 444 and the linkage gear 441 to rotate, and slidingly adjusting the negative pressure block 43, thereby realizing the pressure relief operation of the adsorption plate 42 on the second adsorption block 22. After the second adsorption block 22 lifts the silicon wafer 13 out of the water washing tank 31, it is convenient for relevant technicians to take out the silicon wafer 13, thereby facilitating subsequent light transmission detection operations.

[0057] At the same time, it should be considered that when the abutment block 241 is required to abut against the silicon wafer 13 for cutting, in order to avoid the abutment block 241 abutting against the scribing knife 23 and affecting the cutting accuracy of the scribing knife 23, refer to Fig. 9 The first rotating screw rod 271 and the second rotating screw rod 272 are both threadedly assembled with a mounting block 5, and the scoring knife 23 is elastically arranged in the mounting block 5. The side of the scoring knife 23 away from the surface of the glass 12 is fixedly connected with a mounting spring 52. A mounting hole 51 is opened in the scoring knife 23, and a mounting rod 53 is provided on the fixing frame 29. The mounting rod 53 is movably arranged through the mounting hole 51, and the length of the mounting rod 53 is shorter than the stroke of the scoring knife 23. When the first adsorption block 21 descends to the abutment block 241 and is located in the abutment groove 26, the scoring knife 23 slides to the sidemost position under the sliding of the mounting block 5. At this time, the scoring knife 23 is not limited by the mounting rod 53 and can slide relative to the mounting block 5, thereby reducing the collision and wear with the scoring knife 23 during subsequent abutment cutting.

[0058] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method for recycling photovoltaic modules, characterized in that: The following steps are included: S1, disassembly, first disassembling the photovoltaic module to separate the aluminum frame, the junction box, and the glass (12)-silicon wafer (13) composite board, and directly recycling the aluminum frame and the junction box; S2, cutting, cutting both sides of the glass (12)-silicon wafer (13) composite plate simultaneously into sheets of fixed size; S3, separation, dissolving the EVA layer in the middle of the glass (12)-silicon wafer (13) composite plate obtained in S2 by using a chemical solvent, and separating the glass (12) and the silicon wafer (13) at the same time, to obtain glass (12) sheets and silicon wafer (13) of the same size; S4, by testing the transmittance of the silicon wafer (13), the ones with better transmittance are classified into one category for recycling, and the ones with poor transmittance are classified into another category for recycling. The ones with better transmittance are glass (12) and silicon wafers (13) after physical wear, and the ones with poor transmittance are silicon wafers (13) that can be directly recycled as circuit substrates.

2. A photovoltaic module recycling system, applied to a photovoltaic module recycling method as claimed in claim 1, characterized in that: It comprises a frame (1), a workbench (11) arranged on the frame (1), a cutting component (2) arranged on the frame (1) and extending along the length direction of the frame (1), a separation component (3) and a detection component; The cutting component (2) is used to cut a glass (12)-silicon wafer (13) composite plate, and comprises a first adsorption member arranged on the frame (1) for adsorbing the glass (12), a second adsorption member for adsorbing the silicon wafer (13), a scribing knife (23) for scribing and cutting the glass (12), and a cutting member (24) for cutting the silicon wafer (13); The first adsorption member and the second adsorption member are both provided with adsorption holes (41), and the first adsorption member and the second adsorption member are both provided with negative pressure members (4), and the negative pressure members (4) provide negative pressure toward the adsorption hole (41). The first adsorption member comprises four first adsorption blocks (21) which are spliced ​​in sequence, and cutting grooves (25) for the scribing knife (23) to pass through are left between adjacent adsorption blocks, and the first cutting grooves (25) surrounded by the four first adsorption blocks (21) are in the shape of a "cross"; The second adsorption component also comprises four second adsorption blocks (22) which are spliced ​​in sequence, and an abutment groove (26) for abutting and cutting the silicon wafer (13) is left between adjacent second adsorption blocks (22), and an abutment block (241) is arranged in a lifting manner in the abutment groove (26); the first adsorption block (21) is movably attached to the surface of the glass (12), and the second adsorption block (22) is movably attached to the surface of the silicon wafer (13), and the first adsorption block (21) and the second adsorption block (22) are both arranged in a lifting manner on the frame (1), and the frame (1) is also provided with a driving component (27) for synchronously driving the first adsorption block (21), the second adsorption block (22) and the scribing knife (23); When the first adsorption block (21) is pressed against the second adsorption block (22) and descends, the driving member (27) drives the scribing knife (23) to slide along the sliding direction of the cutting groove (25) to scribing and cutting the surface of the glass (12), and the pressing block is pressed against the surface of the silicon wafer (13).

3. A photovoltaic module recycling system according to claim 2, characterized in that: The separation component (3) comprises a water washing tank (31) arranged on the frame (1) and a liquid storage tank (32) connected to the water washing tank (31); a chemical solvent for dissolving EVA is stored in the liquid storage tank (32); the second adsorption block (22) is movably located in the water washing tank (31); when the second adsorption block (22) descends into the water washing tank (31), the liquid storage tank (32) pumps the chemical solvent into the water washing tank (31); A lifting plate (33) is slidably provided on the water washing tank (31), a circulation hole (35) is provided on the inner wall of the water washing tank (31), a piston plate (34) is slidably provided in the liquid storage tank (32), and a circulation pipe corresponding to the circulation hole (35) is provided on the liquid storage tank (32), the piston plate (34) is in contact with the inner wall of the liquid storage tank (32), and the lifting plate (33) is in contact with the inner wall of the water washing tank (31); When the lifting plate (33) slides toward the bottom wall of the water washing tank (31), the piston plate (34) moves toward a direction close to the circulation hole (35); When the lifting plate (33) slides away from the bottom wall of the water washing tank (31), the piston plate (34) moves in a direction away from the circulation hole (35).

4. A photovoltaic module recycling system according to claim 3, characterized in that: The frame (1) is provided with a fixed frame (29) in a lifting manner, the fixed frame (29) is fixedly connected to the four first adsorption blocks (21), the fixed frame (29) is rotatably provided with a first rotating screw rod (271) and a second rotating screw rod (272), the first rotating screw rod (271) and the second rotating screw rod (272) are arranged vertically, and four scribing knives (23) are provided, the four scribing knives (23) correspond to the four cutting grooves (25) one by one, and two scribing knives (23) in the same extension direction are arranged on the same cutting groove (25). 23) is threadedly assembled on the first rotating screw (271), and the other two scribing knives (23) are threadedly assembled on the second rotating screw (272), the first rotating screw (271) and the second rotating screw (272) are symmetrically provided with external threads with opposite threads and the same pitch, and the fixed frame (29) is also provided with a synchronization member (28) for synchronously rotating the first rotating screw (271) and the second rotating screw (272) when the first adsorption block (21) is raised and lowered.

5. A photovoltaic module recycling system according to claim 4, characterized in that: The synchronous member (28) comprises a first bevel gear coaxially arranged on the first rotating screw (271) and a second bevel gear coaxially arranged on the second rotating screw (272); a fixed rack (284) is provided on the frame (1); a fixed gear (283) is provided on the end side of the first rotating screw (271); and the fixed rack (284) is meshed with the fixed gear (283).

6. A photovoltaic module recycling system according to claim 5, characterized in that: The negative pressure member (4) comprises a suction plate arranged at the suction hole (41), a negative pressure block (43) being slidably arranged at the center of the suction plate, the suction plate being in contact with the surface of the silicon wafer (13) / glass (12), the negative pressure block (43) being movably in contact with the inner surface of the suction plate, and a linkage member (44) for slidingly adjusting the negative pressure block (43) is also provided on the frame (1).

7. A photovoltaic module recycling system according to claim 6, characterized in that: The linkage member (44) comprises a linkage gear (441) provided on the second adsorption block (22); a first linkage rack (442) is slidably provided on the first adsorption block (21); a second linkage rack (443) is slidably provided on the second adsorption block (22); the first linkage rack (442) and the second linkage rack (443) are both meshed with the linkage gear (441); a power gear (444) is coaxially provided on the linkage gear (441); a power rack (445) is provided on the frame (1); the power rack (445) is meshed with the power gear (444); and a limiting member (45) for limiting the second adsorption block (22) is also provided on the frame (1).

8. A photovoltaic module recycling system according to claim 7, characterized in that: The limiting member (45) comprises a limiting block (451) elastically slidably arranged on the frame (1); a limiting groove (452) is provided on the side wall of the first adsorption block (21); the limiting block (451) is movably engaged with the limiting groove (452); the side wall of the limiting block (451) is inclined; the inclined side of the limiting block (451) is movably fitted and tightly pressed against the side wall of the first adsorption block (21); and when the first adsorption block (21) slides to a height higher than the washing tank (31), an unlocking member (46) for unlocking the limiting block (451) is provided on the frame (1).

9. A photovoltaic module recycling system according to claim 8, characterized in that: The linkage gear (441) is in the form of a half gear, and the linkage gear (441) is movably meshed with either the first linkage rack (442) or the second linkage rack (443); When the second adsorption block (22) descends to a position where the power gear (444) meshes with the power rack (445), the linkage gear (441) meshes with the first linkage rack (442).

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