Chip solder processing mold

Abstract

The invention belongs to the technical field of semiconductor chip processing, and discloses a chip solder processing mold which comprises a workbench, an upper mold assembly, a lower mold assembly and a water circulation assembly, supporting legs are arranged at the bottom of the workbench, an upper support is arranged at the upper end of the workbench, and the upper mold assembly is connected with the upper support through a lifting assembly. The lifting assembly controls the upper die assembly to longitudinally reciprocate, the lower die assembly is arranged under the upper die assembly and matched with the upper die assembly, and the water circulation assembly is arranged on the workbench and communicated with the upper die assembly and the lower die assembly to cool the interiors of the upper die assembly and the lower die assembly. The mold cavity can be effectively and continuously cooled, the cooling effect is good, the efficiency is high, automatic discharging can be achieved, and the problem that time and labor are wasted due to manual discharging is solved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip processing, and in particular to a chip solder processing mold. Background Art

[0002] Chip solder is the material used to connect chips and substrates, and it plays a vital role in the semiconductor manufacturing process.

[0003] Chip solder processing molds are one of the indispensable tools in semiconductor processing. Chip welding molds are widely used in the production process of integrated circuits, microprocessors, memory chips and other microelectronic devices. They ensure the accuracy and reliability of chip welding, which is of great significance to improving product performance and quality.

[0004] For this purpose, for example, the Chinese patent, authorization announcement number CN218873692U, a mold for processing silicon carbide chip welding solder, relates to the field of mold technology, in order to solve the problem that the existing mold needs to be slowly cooled with the room temperature during use, and the cooling time period is relatively long, which affects the efficiency of mold processing. It includes a cooling pool, a hydraulic cylinder is arranged below the cooling pool, an extended outer frame is arranged on one side of the outer wall of the cooling pool, an end face groove and a water pump are arranged on one side of the outer wall of the extended outer frame, and the end face groove and the extended outer frame are integrally formed; it also includes: a cylinder piston rod, which is arranged in the cooling pool, the cylinder piston rod is integrally formed with the hydraulic cylinder, the cylinder piston rod is mechanically sealed with the bottom of the cooling pool, and a bearing support is installed on the top of the cylinder piston rod, and a mold placement seat is arranged at the upper end of the bearing support, and the mold placement seat and the bearing support are integrally formed.

[0005] But it has the following problems:

[0006] (1) The processing template is removed by arranging a lifting handle, and the molded lead-free solder in each corresponding mold groove is taken out. This requires manual operation, which is cumbersome and affects the processing efficiency.

[0007] (2) Cooling water can only be used to lower the water temperature when the water temperature is too high. Lowering the water temperature takes time. It is not possible to lower the water temperature by just one circulation of the cold water pipe. It takes multiple circulations to achieve a cooling effect. Therefore, there is a problem of affecting the cooling efficiency. Summary of the invention

[0008] In view of the above-mentioned technical deficiencies, the purpose of the present invention is to provide a chip solder processing mold, which can effectively and continuously cool the mold cavity, has good cooling effect and high efficiency, and can automatically unload, thus solving the time-consuming and labor-intensive problems caused by manual unloading.

[0009] In order to solve the above technical problems, the present invention adopts the following technical solution: The present invention provides a chip solder processing mold, comprising:

[0010] A workbench, the bottom of which is provided with supporting legs;

[0011] An upper bracket is arranged at the upper end of the workbench;

[0012] The upper mold assembly is connected to the upper bracket via a lifting assembly, and the lifting assembly controls the longitudinal reciprocating movement of the upper mold assembly;

[0013] A lower die assembly is arranged directly below the upper die assembly and matches the upper die assembly;

[0014] A water circulation component is arranged on the workbench and communicated with the upper mold component and the lower mold component to cool the interior of the upper mold component and the lower mold component;

[0015] Wherein, a material ejecting mechanism is arranged inside the lower mold assembly to facilitate unloading.

[0016] Preferably, the upper mold assembly comprises:

[0017] Upper template;

[0018] An upper cavity plate, arranged at the bottom of the upper mold plate;

[0019] The upper cavity plate is detachably connected to the upper mold plate, and the upper mold plate is also provided with a plurality of feed channels connected to the upper cavity plate.

[0020] Preferably, the lower mold assembly comprises:

[0021] Next template;

[0022] A lower cavity plate, arranged on the lower template;

[0023] Wherein, an automatic pop-up mechanism capable of controlling the longitudinal movement of the lower cavity plate on the lower template is arranged at the bottom of the lower cavity plate.

[0024] Preferably, the automatic pop-up mechanism comprises:

[0025] A top plate is arranged below the lower cavity plate and parallel to the lower cavity plate;

[0026] The elastic component is arranged below the ejector plate, and absorbs energy and stores force when the ejector plate moves downward to prepare for resetting the ejector plate;

[0027] Wherein, an adjustment mechanism capable of adjusting the descending distance of the lower cavity plate is also arranged below the ejection plate.

[0028] Preferably, the adjustment mechanism comprises:

[0029] An adjusting plate, the upper end of which is movably connected to the ejecting plate, the cross section of which is a type, and the adjusting plate slides longitudinally in the lower die assembly;

[0030] The adjusting rod is arranged on the workbench to control the adjusting plate to slide longitudinally in the lower die assembly. The adjusting rod is threadedly connected to the workbench, and the adjusting rod is rotationally connected to the adjusting plate.

[0031] Preferably, the ejecting mechanism comprises:

[0032] Ejector rods, wherein a plurality of ejector rods are arranged, and all of the ejector rods are arranged in the lower cavity plate and perpendicular to the lowest surface of the cavity inner wall;

[0033] An ejector plate, which is arranged at the bottom of all ejector rods and is slidably arranged in the ejector plate;

[0034] An ejection cylinder is arranged on the workbench, and the telescopic end of the ejection cylinder is fixedly connected to the ejection plate;

[0035] The ejector cylinder drives all ejector rods to move back and forth longitudinally by controlling the ejector plate, thereby ejecting the formed solder from the lower cavity plate.

[0036] Preferably, the water circulation component comprises:

[0037] Water tank;

[0038] A cold water tank is arranged inside the water tank, the cold water tank is provided with a plurality of water inlets communicating with the water tank, and the cold water tank and the water tank share the front and rear side walls;

[0039] There are two groups of cooling pipes, and the two groups of cooling pipes are arranged around the upper cavity plate and the lower cavity plate respectively;

[0040] A water pipe assembly, wherein the water pipe assembly connects the two groups of cooling pipes with the cold water tank to form a water circulation;

[0041] Wherein, a water pump connected with the water pipe assembly to form a water circulation is arranged in the water tank, and the water inlet end of the water pump is connected with the cold water tank.

[0042] Preferably, semiconductor cooling plates are arranged on the wall of the water tank at the position of the cold water tank.

[0043] Preferably, the cooling pipeline includes a water inlet pipe 1 and a water outlet pipe 1 connected to the upper cavity plate, and the cooling pipeline also includes a water inlet pipe 2 and a water outlet pipe 2 connected to the lower cavity plate;

[0044] Wherein, the water inlet pipe 1 and the water inlet pipe 2 are connected to the water outlet end of the water pump;

[0045] The water outlet pipe 1 and the water outlet pipe 2 are connected to the water tank.

[0046] The beneficial effects of the present invention are:

[0047] The present invention arranges an automatic pop-up mechanism at the bottom of the lower cavity plate that can control the longitudinal movement of the lower cavity plate on the lower mold plate. The automatic pop-up mechanism is a ejection plate arranged below the lower cavity plate and parallel to the lower cavity plate, and an elastic component such as a spring or rubber arranged below the ejection plate. When the ejection plate moves downward, it absorbs energy and stores force to prepare for resetting the ejection plate, so that the lower cavity plate sinks and compresses the elastic component when the mold is closed. When the injection is completed, the welding material solidifies, and the upper mold rises, the lower cavity plate moves up and pops out under the action of the elastic component, thereby facilitating unloading.

[0048] In addition to the above-mentioned beneficial effect technology, the present invention arranges an ejection mechanism inside the lower mold assembly to facilitate unloading. After injection molding, the ejection cylinder pushes the ejection rod up to eject the formed welding material from the cavity, thereby facilitating picking up.

[0049] The present invention arranges a water circulation component, arranges a cold water tank to lower the water temperature, and then uses a water pump and a cooling pipe to circulate water to cool the upper cavity plate and the lower cavity plate, effectively continuously cooling the mold cavity after the injection is completed, assisting the welding material to solidify and form as soon as possible, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0051] Figure 1 A schematic structural diagram of a chip solder processing mold provided by an embodiment of the present invention.

[0052] Figure 2 A schematic diagram of the internal structure of a chip solder processing mold provided in an embodiment of the present invention.

[0053] Figure 3 for Figure 2 Enlarged view of point A in .

[0054] Figure 4 A schematic diagram of the internal structure of a chip solder processing mold top plate provided in an embodiment of the present invention.

[0055] Description of reference numerals:

[0056] 1-workbench, 101-upper bracket, 2-lifting assembly, 3-upper template, 4-upper cavity plate, 5-feeding channel, 6-lower template, 7-lower cavity plate, 8-ejector plate, 9-adjusting plate, 10-adjusting rod, 11-ejector rod, 12-ejector plate, 13-ejector cylinder, 14-water tank, 15-cold water tank, 16-water pump, 17-semiconductor refrigeration plate, 18-water inlet pipe one, 19-water outlet pipe one, 20-water inlet pipe two, 21-water outlet pipe two. DETAILED DESCRIPTION

[0057] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0058] Embodiment 1:

[0059] like Figures 1 to 4 As shown, the present invention provides a chip solder processing mold, comprising a workbench 1, a support leg is arranged at the bottom of the workbench 1, and an upper bracket 101 is arranged at the upper end of the workbench 1;

[0060] The chip solder processing mold also includes an upper mold assembly, a lower mold assembly and a water circulation assembly. The upper mold assembly is connected to the upper bracket 101 through a lifting assembly 2, and the lifting assembly 2 controls the longitudinal reciprocating movement of the upper mold assembly. The lower mold assembly is arranged directly below the upper mold assembly and matches the upper mold assembly. The water circulation assembly is arranged on the workbench 1 and communicates with the upper mold assembly and the lower mold assembly to cool the interior of the upper mold assembly and the lower mold assembly.

[0061] Specifically, the upper mold assembly includes an upper mold plate 3 and an upper cavity plate 4 arranged at the bottom of the upper mold plate 3, wherein the upper cavity plate 4 is detachably connected to the upper mold plate 3, and a plurality of feed channels 5 connected to the upper cavity plate 4 are arranged on the upper mold plate 3. During processing, molten solder is injected through the feed channels 5. The reason why a plurality of feed channels 5 are arranged is that different upper cavity plates 4 can be replaced at will, and they can all be injected, thereby realizing the processing of chip solders of various specifications and models.

[0062] Specifically, the lower mold assembly includes a lower mold plate 6 arranged on a lower cavity plate 7 on the lower mold plate 6 , wherein an automatic pop-up mechanism capable of controlling the longitudinal movement of the lower mold plate 7 on the lower mold plate 6 is arranged at the bottom of the lower mold plate 7 .

[0063] The automatic pop-up mechanism includes a ejector plate 8 arranged below the lower cavity plate 7 and parallel to the lower cavity plate 7, and an elastic component arranged below the ejector plate 8. When the mold is closed, the lower cavity plate 7 sinks and compresses the elastic component. The elastic component absorbs energy and stores force to prepare for resetting the ejector plate 8. The elastic component is selected from a spring or rubber. After the processing is completed, the upper mold is lifted and the lower cavity plate 7 is reset by the elastic component, thereby facilitating unloading.

[0064] Embodiment 2:

[0065] On the basis of the first embodiment, in order to replace manual unloading, an ejection mechanism for facilitating unloading is arranged inside the lower mold assembly. Specifically, the ejection mechanism includes a plurality of ejector rods 11, an ejector plate 12 arranged at the bottom of all ejector rods 11, and an ejector cylinder 13 arranged on the workbench 1. The ejector rods 11 are all arranged in the lower cavity plate 7 and are arranged vertically to the lowest surface of the inner wall of the cavity. The ejector plate 12 is slidably arranged in the ejector plate 8, and the telescopic end of the ejector cylinder 13 is fixedly connected to the ejector plate 12.

[0066] The ejection cylinder 13 drives all the ejection rods 11 to move back and forth longitudinally by controlling the ejection plate 12, thereby ejecting the formed solder from the lower cavity plate.

[0067] After replacing lower cavity plate 7, the thickness of lower cavity plate 7 becomes different due to the difference in cavity size. In order to eliminate the problem of size difference caused by replacing lower cavity plate 7, an adjustment mechanism capable of adjusting the descending distance of lower cavity plate 7 is arranged under top plate 8. If the thickness of lower cavity plate 7 becomes larger, the adjustment plate 9 is moved downward.

[0068] Among them, the adjustment mechanism includes an adjustment plate 9 and an adjustment rod 10 arranged on the workbench 1 to control the longitudinal sliding of the adjustment plate 9 in the lower mold assembly. The upper end of the adjustment plate 9 is movably connected to the ejection plate 8. The cross-section of the adjustment plate 9 is U-shaped. The adjustment plate 9 slides longitudinally in the lower mold assembly. The adjustment rod 10 is threadedly connected to the workbench 1, and the adjustment rod 10 is rotatably connected to the adjustment plate 9.

[0069] By controlling the adjustment rod 10 to rotate and push the adjustment plate 9 up and down, the downward movement space of the top plate 8 is increased or reduced, so that it can still be used normally after replacing the cavity of different sizes, that is, it can match the processing of chip solder materials of various specifications and types.

[0070] Embodiment three:

[0071] On the basis of the second embodiment, in order to quickly cool down the mold cavity during processing to improve the mold processing efficiency, a water circulation is arranged on the upper cavity plate 4 and the lower cavity plate 7 to cool the molded solder in the cavity; specifically, the water circulation component includes a water tank 14, a cold water tank 15 arranged in the water tank 14, and a water pipe component connecting the cold water tank 15 with the upper cavity plate 4 and the lower cavity plate 7 to form a water circulation, the volume of the cold water tank 15 is smaller than the volume of the water tank 14, and a plurality of water inlets communicating with the water tank 14 are arranged on the cold water tank 15, and the cold water tank 15 and the water tank 14 share the box walls on the front and rear sides;

[0072] There are two groups of water pipe assemblies, and the two groups of cooling pipes are arranged around the upper cavity plate 4 and the lower cavity plate 7 respectively;

[0073] Among them, a water pump 16 connected with the water pipe assembly to form a water circulation is arranged in the water tank 14, the water inlet end of the water pump 16 is connected with the cold water tank 15, and a semiconductor refrigeration plate 17 is arranged on the wall of the water tank 14 at the position of the cold water tank 15. The cold end of the semiconductor refrigeration plate 17 is in contact with the wall of the water tank 14, and a cooling fan is arranged at the hot end of the semiconductor refrigeration plate 17. The use of semiconductor refrigeration plates 17 for cooling is an existing technology, so the overall structure of the specific semiconductor refrigeration plate 17 is not introduced in detail, and the water pump 16 is started after the mold closing and injection are completed.

[0074] The cooling pipeline includes an inlet pipe 18 and an outlet pipe 19 connected to the upper cavity plate 4, and the cooling pipeline also includes an inlet pipe 20 and an outlet pipe 21 connected to the lower cavity plate 7. The inlet pipe 18, the outlet pipe 19, the inlet pipe 20 and the outlet pipe 21 are all spring-type water pipes, so that the replacement of the upper cavity plate 4 and the lower cavity plate 7 is not affected, and the movement of the upper cavity plate 4 is not affected;

[0075] Among them, the water inlet pipe 1 18 and the water inlet pipe 2 20 are connected to the water outlet end of the water pump 16 , and the water outlet pipe 1 19 and the water outlet pipe 2 21 are connected to the water tank 14 .

[0076] After the cavity is filled with solder, start the water pump 16 to transport the water in the cold water tank 15 to the water inlet pipe 18 and the water inlet pipe 20, and input the cold water into the upper cavity plate 4 and the lower cavity plate 7 to cool the cavity and accelerate the solidification of the solder, thereby improving production efficiency.

[0077] Working principle:

[0078] When in use, the chip soldering material cavity to be processed is loaded on the upper template 3 and the lower template 6, and the upper cavity plate 4 and the lower cavity plate 7 are respectively loaded into the upper template 3 and the lower template 6. It is worth noting that when installing the cavity plate 4, attention should be paid to the position of the feed channel 5 so that the feed channel 5 can be accurately found when injecting the material;

[0079] During production, the lifting component 2 is started to control the upper template 3 to descend so that the upper cavity plate 4 is fitted with the lower cavity plate 7, the lower cavity plate 7 descends, and the lower cavity plate 7 is pressed downward to cause the ejector plate 8 to descend and compress the elastic component, and then the solder is injected from the feed channel 5. After the solder fills the mold cavity, the water pump 16 is started to allow the cold water in the cold water tank 15 to enter the upper cavity plate 4 and the lower cavity plate 7 through the water inlet pipe 1 18 and the water inlet pipe 2 20. By cooling the cavity, the solidification of the solder is accelerated. After the solder solidifies, the lifting component 2 is used to control the upper template 3 to rise, the lower cavity plate 7 and the ejector plate 8 are reset under the control of the elastic component, and the lower cavity plate 7 extends out of the lower template 6, and then the ejection cylinder 13 is controlled to control the ejector plate 12 to drive the ejector rod 11 to eject the solder in the cavity of the lower cavity plate 7, thereby completing automatic unloading for easy picking.

[0080] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A chip solder processing mold, characterized in that: include: A workbench (1), wherein the bottom of the workbench (1) is provided with supporting legs; An upper bracket (101) is arranged at the upper end of the workbench (1); The upper mold assembly is connected to the upper bracket (101) via a lifting assembly (2), and the lifting assembly (2) controls the longitudinal reciprocating movement of the upper mold assembly; A lower die assembly is arranged directly below the upper die assembly and matches the upper die assembly; A water circulation component is arranged on the workbench (1) and is connected to the upper mold component and the lower mold component to cool the interior of the upper mold component and the lower mold component; Wherein, a material ejecting mechanism is arranged inside the lower mold assembly to facilitate unloading.

2. A chip solder processing mold as claimed in claim 1, characterized in that: The upper mold assembly comprises: Upper template (3); An upper cavity plate (4) is arranged at the bottom of the upper mold plate (3); The upper cavity plate (4) is detachably connected to the upper mold plate (3), and a plurality of feed channels (5) connected to the upper cavity plate (4) are arranged on the upper mold plate (3).

3. A chip solder processing mold as claimed in claim 2, characterized in that: The lower mold assembly comprises: Lower template (6); A lower cavity plate (7) is arranged on the lower mold plate (6); Wherein, an automatic pop-up mechanism capable of controlling the longitudinal movement of the lower cavity plate (7) on the lower mold plate (6) is arranged at the bottom of the lower cavity plate (7).

4. A chip solder processing mold as claimed in claim 3, characterized in that: The automatic pop-up mechanism comprises: A ejector plate (8) is arranged below the lower cavity plate (7) and parallel to the lower cavity plate (7); An elastic component is arranged below the ejector plate (8) and absorbs energy and stores force when the ejector plate (8) moves downward to prepare for resetting the ejector plate (8); Wherein, an adjustment mechanism capable of adjusting the descending distance of the lower cavity plate (7) is also arranged below the ejector plate (8).

5. A chip solder processing mold as claimed in claim 4, characterized in that: The regulating mechanism comprises: An adjusting plate (9), the upper end of which is movably connected to the ejecting plate (8), the cross section of which is U-shaped, and the adjusting plate (9) slides longitudinally in the lower die assembly; An adjusting rod (10) is arranged on the workbench (1) to control the adjusting plate (9) to slide longitudinally in the lower die assembly. The adjusting rod (10) is threadedly connected to the workbench (1), and the adjusting rod (10) is rotationally connected to the adjusting plate (9).

6. A chip solder processing mold as claimed in claim 1, characterized in that: The ejection mechanism comprises: Ejector rods (11), wherein a plurality of ejector rods (11) are arranged, and all of the ejector rods (11) are arranged in the lower cavity plate (7) and are arranged perpendicular to the lowest surface of the cavity inner wall; An ejector plate (12), the ejector plate (12) being arranged at the bottom of all the ejector rods (11), and the ejector plate (12) being slidably arranged in the ejector plate (8); An ejection cylinder (13) is arranged on the workbench (1), and the telescopic end of the ejection cylinder (13) is fixedly connected to the ejection plate (12); The ejection cylinder (13) drives all the ejection rods (11) to move back and forth longitudinally by controlling the ejection plate (12), thereby ejecting the formed solder from the lower cavity plate.

7. A chip solder processing mold as claimed in claim 1, characterized in that: The water circulation component comprises: Water tank (14); A cold water tank (15) is arranged inside the water tank (14); the cold water tank (15) is provided with a plurality of water inlets communicating with the water tank (14); the cold water tank (15) and the water tank (14) share the front and rear side walls; Two groups of cooling pipes are arranged, and the two groups of cooling pipes are arranged around the upper cavity plate (4) and the lower cavity plate (7) respectively; A water pipe assembly, wherein the water pipe assembly connects the two groups of cooling pipes with a cold water tank (15) to form a water circulation; A water pump (16) is arranged in the water tank (14) and is connected to the water pipe assembly to form a water circulation. The water inlet end of the water pump (16) is connected to the cold water tank (15).

8. A chip solder processing mold as claimed in claim 7, characterized in that: A semiconductor cooling sheet (17) is arranged on the wall of the water tank (14) at the position of the cold water tank (15).

9. A chip solder processing mold as claimed in claim 8, characterized in that: The cooling pipeline includes a water inlet pipe (18) and a water outlet pipe (19) connected to the upper cavity plate (4), and the cooling pipeline also includes a water inlet pipe (20) and a water outlet pipe (21) connected to the lower cavity plate (7); Wherein, the water inlet pipe 1 (18) and the water inlet pipe 2 (20) are connected to the water outlet end of the water pump (16); The water outlet pipe 1 (19) and the water outlet pipe 2 (21) are connected to the water tank (14).

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