Wafer non-destructive cutting equipment and cutting process for eliminating edge chipping and warping

Abstract

The present invention relates to the field of wafer cutting processing technology, and more specifically, to a non-destructive wafer cutting device and cutting process that eliminates edge cracking and warping, comprising a base, a cutting machine, and a receiving seat; a clamping unit for clamping the wafer is arranged around the receiving seat, the clamping unit comprising a plurality of clamping seats evenly distributed around the receiving seat, the receiving seat being a circular structure, the clamping seat being arranged on one side of the receiving seat so as to move along the radial direction of the receiving seat, two clamping rollers being arranged vertically on the clamping seat with a gap therebetween, the clamping rollers extending along the radial direction of the receiving seat and pointing towards the receiving seat, the clamping rollers being rotatably arranged on the clamping seat, the two clamping rollers rotating in opposite directions, the two clamping rollers containing air cavities, and an air pump connected to the air cavities being arranged on one side of the clamping rollers. The present invention can still drive the wafer to rotate while maintaining the clamping state, thereby improving cutting efficiency and reducing the working space of the cutting equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cutting and processing, and in particular to a non-destructive wafer cutting device and a cutting process for eliminating edge cracking and warping. Background Art

[0002] During the processing of the wafer, the wafer needs to be fixed. If the fixing effect is not ideal, the wafer is likely to move, causing the cutting position to deviate, resulting in the wafer shaking during the cutting process, causing the wafer edge to break, reducing the processing quality of the wafer, and causing waste of wafer production during processing.

[0003] Chinese patent application CN115519687A discloses an anti-chipping wafer dicing and cutting device, comprising a base, the base having a fixed base, and a movable base installed on the top of the base, the top of the movable base being slidably connected to a lifting adjustment frame, and the position of the base near the movable base being fixedly connected to a placement rack; a load-bearing arm, the load-bearing arm having a mounting end, and a flushing pipe installed on the outer surface of the load-bearing arm, the position of the flushing pipe away from the load-bearing arm being slidably connected to the lifting adjustment frame, the position of the load-bearing arm away from the lifting adjustment frame being rotatably connected to a cutting wheel, and the load-bearing arm being away from the lifting adjustment frame The position of the cutting wheel is fixedly connected to the lifting and adjusting frame, and the placing frame includes: a rotating rod, the rotating rod has a motor, and a displacement plate installed on the outer surface of the rotating rod, the bottom of the displacement plate is located on both sides of the rotating rod and is rotatably connected to a guide frame, the top of the displacement plate is fixedly connected to a protective frame, and the top of the protective frame is connected to a mounting tube; a rotating end, the rotating end has a rotating column, and an assembly frame installed at the rotating end near the load-bearing arm, the assembly frame extends to the outside of the lifting and adjusting frame away from the rotating end, and the rotating end is rotatably connected to the lifting and adjusting frame at a position away from the assembly frame.

[0004] Although the above solution can clamp the wafer, the fixed wafer cannot be moved, and the efficiency of cutting is low. That is, the cutting machine needs to be stopped frequently, and then the wafer is rotated and cut again. This process needs to be repeated many times to complete the cutting of the wafer. After cutting, the wafer needs to be transferred and the periphery of the wafer needs to be polished, which is inefficient. If a mechanism is provided for the cutter to rotate around the wafer, the space occupied by the entire device will increase. Summary of the Invention

[0005] In response to the above problems, a non-destructive wafer cutting device and cutting process are provided to eliminate edge cracking and warping. By arranging multiple clamping seats around the receiving seat and arranging two vertically arranged clamping rollers on the clamping seats, the wafer can rotate around the axis of the receiving seat after being clamped by the clamping rollers, thereby reducing the working space of the cutting machine. At the same time, the requirement that the wafer can still rotate normally in the clamped state is achieved, thereby improving the cutting efficiency.

[0006] In order to solve the problems of the prior art, the present invention provides a non-destructive wafer cutting device for eliminating edge cracking and warping, comprising a base and a cutting machine arranged above the base, a receiving seat for receiving the wafer is arranged on the upper part of the base; a clamping unit for clamping the wafer is arranged around the receiving seat, the clamping unit comprising a plurality of clamping seats evenly distributed around the receiving seat, the receiving seat being a circular structure, the clamping seat being movable along the radial direction of the receiving seat and being arranged on one side of the receiving seat, two clamping rollers being arranged in a vertical direction on the clamping seat, and a gap being present between the two clamping rollers, the clamping roller extending along the radial direction of the receiving seat and pointing to the receiving seat, the clamping roller being rotatably arranged on the clamping seat, the two clamping rollers having opposite rotation directions, an air cavity being present in the two clamping rollers, an air pump connected to the air cavity being provided on one side of the clamping roller, when the clamping unit clamps the wafer on the receiving seat, the air pump inflates the air cavity, and the wafer is located in the gap between the two clamping rollers and contacts the outer peripheral walls of the two clamping rollers.

[0007] Preferably, the side wall of the clamping seat facing the receiving seat is an arc-shaped structure, the axis of the arc-shaped structure is colinear with the axis of the receiving seat, and limiting rollers are provided on both sides of the arc-shaped structure for vertical rotation. The peripheral wall of the limiting roller protrudes from one side of the clamping seat, and the clamping seat contacts the edge of the chip through the limiting roller, and the limiting roller rolls with the edge of the chip.

[0008] Preferably, a grinding unit is also provided on the clamping seat, and a telescopic slot is horizontally provided on the side of the clamping seat facing the receiving seat, the extension direction of the telescopic slot is parallel to the moving direction of the clamping seat, and a grinding rod is provided in the telescopic slot for movement along the extension direction of the telescopic slot, and the grinding rod can rotate around its own vertical direction, and the rotation direction of the grinding rod is opposite to the rotation direction of the chip.

[0009] Preferably, a driving unit for driving the clamping roller to rotate is provided on the clamping seat, and the driving unit includes a first gear and a second gear respectively provided at the ends of two clamping rollers on the same clamping seat, the first gear and the second gear are engaged with each other, a third gear is provided on the upper part of the first gear, the third gear is engaged with the first gear, and a rotation driver for driving the third gear to rotate is provided at the end of the third gear.

[0010] Preferably, a transmission unit is provided between the third gear and the polishing rod, and the third gear drives the polishing rod to rotate through the transmission unit.

[0011] Preferably, the transmission unit includes a synchronous belt, and a tensioning unit for tensioning the synchronous belt is provided in the inner ring of the synchronous belt, and the tensioning unit includes a tensioning wheel that rolls with the side wall of the inner ring of the synchronous belt.

[0012] Preferably, a pushing unit for driving the clamping seat to move is provided on the clamping seat, and the pushing unit includes a pushing groove arranged on the periphery of the clamping seat, the extension direction of the pushing groove is parallel to the movement direction of the clamping seat, the clamping seat is arranged to move in the pushing groove, and a corrugated sleeve is provided between the clamping seat and the end of the pushing groove along the extension direction of the pushing groove.

[0013] Preferably, a lower pressure plate is provided on the receiving seat and moves along the axis of the receiving seat, and a receiving sleeve is provided at the lower part of the lower pressure plate. The lower pressure plate extends into the receiving sleeve and slides with the receiving sleeve to form an extrusion chamber. When the lower pressure plate descends, the air in the extrusion chamber is discharged. An elastic tank is provided on one side of the receiving sleeve, and a one-way valve is provided between the elastic tank and the receiving sleeve to connect the two. The one-way valve allows the air in the extrusion chamber to flow into the elastic tank. A first switch valve is also provided on the side of the elastic tank, and the elastic tank is connected to the corrugated sleeve through the first switch valve.

[0014] Preferably, a third spring is vertically arranged in the receiving sleeve, and the two ends of the third spring are fixedly connected to the lower end of the lower pressure plate and the bottom of the receiving sleeve respectively. A return pipe is arranged at the end of the corrugated sleeve away from the clamping seat, and a second switch valve is arranged on the return pipe. A third switch valve is arranged at the bottom of the receiving sleeve, and a second electromagnet that can adsorb the clamping seat is arranged at the end of the pushing groove away from the receiving seat.

[0015] The present invention also relates to a non-destructive wafer cutting process for eliminating edge chipping and warping, which uses a non-destructive wafer cutting device for eliminating edge chipping and warping, and the specific steps are as follows:

[0016] S1. The clamping seat has a first stop position and a second stop position when moving along the radial direction of the receiving seat. When the clamping seat is at the first stop position, the clamping seat arranged around the receiving seat is in an open state, and the wafer is placed on the receiving seat from the top;

[0017] S2. After the wafer is placed on the receiving seat, all the clamping seats arranged around the receiving seat move synchronously. The clamping seats move from the first stop position to the second stop position. The clamping seats arranged around the receiving seat gradually shrink. When the clamping seats shrink, the two clamping rollers arranged on the clamping seats pass over the upper and lower parts of the wafer respectively, so that the wafer is located in the gap between the two clamping rollers.

[0018] S3. Then the air pump inflates the air cavity of the clamping roller. After the two clamping rollers contact the upper and lower parts of the wafer respectively, the cutting machine descends to contact the edge of the wafer and starts. Then the two clamping rollers rotate and the wafer begins to rotate around the axis of the receiving seat.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. When cutting the wafer, the two clamping rollers on the clamping seat can contact the upper and lower parts of the wafer respectively, and the two clamping rollers start to rotate synchronously in opposite directions, and the wafer rotates around the axis of the receiving seat. This makes it unnecessary for the cutting machine to rotate around the wafer, reducing the space occupied by the cutting equipment. At the same time, the wafer is clamped by the clamping unit and driven to rotate after clamping, eliminating the need for manual rotation of the wafer, thereby improving cutting efficiency.

[0021] 2. By arranging a limiting roller on the clamping seat, the clamping seat arranged around the receiving seat can stably clamp the wafer through the limiting roller, and one side of the clamping seat with the limiting roller is an arc-shaped structure, so that the clamping seat can better fit the edge of the wafer when clamping the edge of the wafer through the limiting roller. At the same time, an air cavity is set on the limiting roller and the clamping roller made of rubber material, so that the wafer will not be damaged after contact with the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. A three-dimensional schematic diagram of a wafer is provided;

[0023] Figure 2 A side view of a non-destructive wafer cutting device that eliminates edge chipping and warping;

[0024] Figure 3 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. Figure 2 Schematic cross-sectional view at AA in the middle;

[0025] Figure 4 A schematic cross-sectional perspective view of a non-destructive wafer cutting device that eliminates edge chipping and warping;

[0026] Figure 5 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. Figure 4 A partial enlarged schematic diagram of point B in the middle;

[0027] Figure 6 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. Figure 4 A partial enlarged schematic diagram of point C in the middle;

[0028] Figure 7 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. Figure 4 A partial enlarged schematic diagram of point D in the middle;

[0029] Figure 8 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. Figure 4A partial enlarged schematic diagram of point E in the middle;

[0030] Figure 9 A three-dimensional schematic diagram of a non-destructive wafer cutting device that eliminates edge chipping and warping;

[0031] Figure 10 A schematic diagram of a non-destructive wafer cutting device that eliminates edge chipping and warping, with the base removed;

[0032] Figure 11 It is a non-destructive wafer cutting device that eliminates edge chipping and warping. Figure 10 A partial enlarged schematic diagram of point F in the middle;

[0033] Figure 12 The present invention is a three-dimensional schematic diagram of a wafer non-destructive cutting device for eliminating edge chipping and warping, which is provided with a clamping seat of a pushing unit.

[0034] The numbers in the figure are:

[0035] 1. Base; 2. Cutting machine; 3. Wafer; 4. Clamping unit; 41. Clamping seat; 42. Clamping roller; 43. Air pump; 44. Limiting roller; 45. Grinding unit; 451. Telescopic slot; 452. Grinding rod; 46. Driving unit; 461. Rotary drive; 462. First gear; 463. Second gear; 464. Third gear; 47. Transmission unit; 471. First bevel gear; 472. Second bevel gear; 473. First synchronous gear; 474. Second synchronous gear; 475. Synchronous belt; 476. First electromagnet; 477. First electromagnet Spring; 478, first translation block; 479, tensioning unit; 4791, tensioning wheel; 4792, second translation block; 4793, second spring; 48, pushing unit; 481, pushing groove; 4811, second electromagnet; 482, corrugated sleeve; 483, lower pressure plate; 4831, second receiving wheel; 484, receiving sleeve; 485, one-way valve; 486, elastic tank; 487, first switch valve; 488, third spring; 489, return pipe; 4891, second switch valve; 4892, third switch valve; 5, receiving seat; 51, first receiving wheel. DETAILED DESCRIPTION

[0036] In order to further understand the features, technical means, specific objectives and functions achieved by the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] Reference Figure 1-Figure 4 、 Figure 6-Figure 9: A non-destructive wafer cutting device that eliminates edge cracking and warping, including a base 1 and a cutting machine 2 arranged above the base 1, a receiving seat 5 for receiving a wafer 3 is arranged on the upper part of the base 1; a clamping unit 4 for clamping the wafer 3 is arranged around the receiving seat 5, and the clamping unit 4 includes a plurality of clamping seats 41 evenly distributed around the receiving seat 5, the receiving seat 5 is a circular structure, and the clamping seat 41 is arranged on one side of the receiving seat 5 in a radial direction. Two clamping rollers are arranged on the clamping seat 41 in a vertical direction. 42, and there is a gap between the two clamping rollers 42, the clamping rollers 42 extend along the radial direction of the receiving seat 5 and point to the receiving seat 5, the clamping rollers 42 are rotatably set on the clamping seat 41, and the rotation directions of the two clamping rollers 42 are opposite. There are air cavities in the two clamping rollers 42, and an air pump 43 connected to the air cavity is provided on one side of the clamping rollers 42. When the clamping unit 4 clamps the chip 3 on the receiving seat 5, the air pump 43 inflates the air cavity, and the chip 3 is located in the gap between the two clamping rollers 42 and contacts the outer peripheral walls of the two clamping rollers 42.

[0038] In the existing chip 3 cutting equipment, when cutting the edge of the chip 3, the cutting is usually completed by rotating the cutting machine 2 around the chip 3. The rotation of the cutting machine 2 around the chip 3 causes the cutting equipment to occupy a large space. At the same time, in order to ensure that the working area of the cutting machine 2 is not obstructed, the chip 3 being cut cannot be stably fixed. During cutting, the chip 3 is prone to shaking, which in turn causes the edge of the chip 3 to crack and warp. If the position of the cutting machine 2 is fixed and the clamping stability is to be ensured, the chip 3 needs to be manually adjusted and rotated at regular intervals during cutting, which is less efficient.

[0039] In order to avoid the above situation, the position of the cutting machine 2 is fixed so that the cutting machine 2 no longer rotates around the wafer 3, and the clamping unit 4 is further optimized so that the wafer 3 itself rotates. A plurality of first receiving wheels 51 are provided on the upper part of the receiving seat 5. The first receiving wheels 51 are arranged on the receiving seat 5 in a radial direction and rotate on the receiving seat 5. The plurality of first receiving wheels 51 are evenly arranged around the axis of the receiving seat 5. The wafer 3 placed on the receiving seat 5 is received by the first receiving wheels 51. In this way, when the wafer 3 rotates, the lower part of the wafer 3 will not directly rub against the upper part of the receiving seat 5. Instead, the first receiving wheels 51 and the lower part of the wafer 3 roll together to reduce the friction coefficient and avoid the wafer 3 from being damaged due to a large friction coefficient. The clamping seat 41 has a first stop position and a second stop position when moving along the radial direction of the receiving seat 5. The first stop position is farther away from the receiving seat 5 than the second stop position. When the wafer 3 is cut, the clamping seat 41 is located at the first stop position. At this time, all the clamping seats 41 arranged around the receiving seat 5 are in an open state. When the wafer 3 is placed on the receiving seat 5, the two clamping rollers 42 arranged on the clamping seat 41 will not hinder the wafer 3. After the wafer 3 is placed on the receiving seat 5, all the clamping seats 41 arranged around the receiving seat 5 begin to shrink, that is, at this time the clamping seat 41 moves from the first stop position to the second stop position. During the movement of the clamping seat 41, the two clamping rollers 42 on the clamping seat 41 pass through the upper and lower parts of the wafer 3 respectively. When the clamping seat 41 moves to the second stop position, the clamping seat 41 stops moving, and at this time the wafer 3 is located in the gap between the two clamping rollers 42. The outer periphery of the two clamping rollers 42 does not contact the upper and lower parts of the wafer 3. The air pump 43 then begins to inflate the air cavity. After the air cavity is inflated, the outer walls of the two clamping rollers 42 can contact the upper and lower parts of the wafer 3 respectively, and the two clamping rollers 42 begin to rotate synchronously in opposite directions. In this way, driven by the two clamping rollers 42, the wafer 3 begins to rotate around the axis of the receiving seat 5. Before the clamping rollers 42 begin to rotate, the cutting machine 2 first descends and contacts the edge of the wafer 3. At the same time, the cutting machine 2 starts running before the clamping rollers 42, and then the clamping rollers 42 begin to rotate. In this way, the cutting machine 2 no longer needs to rotate around the wafer 3, reducing the space occupied by the cutting equipment. At the same time, the wafer 3 is clamped by the clamping unit 4, and the wafer 3 is driven to rotate after clamping, without the need for manual rotation of the wafer 3, thereby improving cutting efficiency.

[0040] Reference Figure 6 : The side wall of the clamping seat 41 facing the receiving seat 5 is an arc-shaped structure, the axis of the arc-shaped structure is collinear with the axis of the receiving seat 5, and limiting rollers 44 are provided on both sides of the arc-shaped structure for vertical rotation. The peripheral wall of the limiting roller 44 protrudes from one side of the clamping seat 41, and the clamping seat 41 contacts the edge of the chip 3 through the limiting roller 44, and the limiting roller 44 rolls with the edge of the chip 3.

[0041] The limiting roller 44 is preferably made of rubber material, which ensures that when the limiting roller 44 contacts the edge of the chip 3, the edge of the chip 3 will not be crushed by the limiting roller 44. By arranging two limiting rollers 44 on the side wall of the clamping seat 41, the chip 3 is prevented from shaking after being clamped, thereby avoiding the edge cracking and warping of the chip 3 due to shaking during cutting.

[0042] Reference Figure 6 and Figure 12 : A grinding unit 45 is also provided on the clamping seat 41, and a telescopic groove 451 is horizontally opened on the side of the clamping seat 41 facing the receiving seat 5. The extension direction of the telescopic groove 451 is parallel to the moving direction of the clamping seat 41. A grinding rod 452 is provided in the telescopic groove 451 and moves along the extension direction of the telescopic groove 451. The grinding rod 452 can rotate around its own vertical direction, and the rotation direction of the grinding rod 452 is opposite to the rotation direction of the chip 3.

[0043] When the chip 3 is placed on the receiving seat 5, the grinding rod 452 is retracted into the telescopic groove 451. At this time, the grinding rod 452 will not contact the edge of the chip 3. When the chip 3 is placed on the receiving seat 5 and the clamping roller 42 starts to drive the chip 3 to rotate, the grinding rod 452 located in the telescopic groove 451 begins to extend. The grinding rod 452 can rotate around its own axis, and the rotation direction of the grinding rod 452 is opposite to the rotation direction of the chip 3. This improves the grinding efficiency of the grinding rod 452 for the edge of the chip 3, avoids burrs on the edge of the chip 3 after cutting, and ensures the smoothness of the edge of the chip 3.

[0044] Reference Figure 5 、 Figure 6 and Figure 10 : A driving unit 46 for driving the clamping roller 42 to rotate is provided on the clamping seat 41. The driving unit 46 includes a first gear 462 and a second gear 463 respectively provided at the ends of the two clamping rollers 42 on the same clamping seat 41. The first gear 462 and the second gear 463 are engaged with each other. A third gear 464 is provided on the upper part of the first gear 462. The third gear 464 is engaged with the first gear 462. A rotation driver 461 for driving the third gear 464 to rotate is provided at the end of the third gear 464.

[0045] The rotary driver 461 is preferably a servo motor. When the rotary driver 461 is started, the rotary driver 461 drives the third gear 464 to rotate, thereby causing the second gear 463 and the first gear 462 to rotate synchronously. Driven by the first gear 462 and the second gear 463, the two clamping rollers 42 arranged on the same clamping seat 41 rotate synchronously, and the rotation directions are opposite, so that the chip 3 located between the two clamping rollers 42 can rotate around the axis of the receiving seat 5.

[0046] Reference Figure 5 、 Figure 10 、 Figure 11 and Figure 12 : A transmission unit 47 is provided between the third gear 464 and the polishing rod 452, and the third gear 464 drives the polishing rod 452 to rotate through the transmission unit 47.

[0047] The transmission unit 47 includes a first bevel gear 471 fixedly arranged at the end of the third gear 464, and a second bevel gear 472 is rotatably arranged on one side of the first bevel gear 471. The axis of the second bevel gear 472 is in a vertical state. A first synchronous wheel 473 and a second synchronous wheel 474 are fixedly arranged at the end of the second bevel gear 472 and the upper end of the grinding rod 452, respectively. A synchronous belt 475 is sleeved on the first synchronous wheel 473 and the second synchronous wheel 474. The synchronous belt 475 is respectively connected to the first synchronous wheel 473 and the second synchronous wheel 474. 74 transmission cooperation, a first translation groove is opened on the upper part of the clamping seat 41 along the moving direction of the clamping seat 41, and a first translation block 478 is arranged in the first translation groove for movement along the extension direction of the first translation groove. There is a first gap between the side of the first translation block 478 away from the receiving seat 5 and the end of the first translation groove, and a first spring 477 is arranged in the first gap. The two ends of the first spring 477 are fixedly connected to the first translation block 478 and the end of the first translation groove respectively, and the polishing rod 452 moves synchronously with the first translation block 478.

[0048] Reference Figure 11 and Figure 12 : The transmission unit 47 includes a synchronous belt 475, and a tensioning unit 479 is provided on the inner ring side of the synchronous belt 475 to tension the synchronous belt 475. The tensioning unit 479 includes a tensioning wheel 4791 rotatably provided on the inner ring side of the synchronous belt 475.

[0049] A second translation slot is also defined in the upper portion of the clamping seat 41. A second translation block 4792 is positioned within the second translation slot for movement along its extension direction. A tensioning wheel 4791 is rotatably positioned above the second translation block 4792. A second gap is defined between the second translation block 4792 and the end of the second translation slot. A second spring 4793 is positioned in the second gap along the movement direction of the second translation block 4792. The ends of the second spring 4793 are fixedly connected to the second translation block 4792 and the end of the second translation slot, respectively. The first translation slot communicates with the telescopic slot 451. When the second synchronous wheel 474 rotates, the grinding rod 452 rotates synchronously with the second synchronous wheel 474. When the wafer 3 needs to be placed on the receiving seat 5, the clamping seat 41 is at the first stop position, and the first electromagnet 476 is energized. The first electromagnet 476 attracts the first translation block 478, and the first spring 477 is compressed. Since the grinding rod 452 moves synchronously with the first translation block 478, when the first translation block 478 is adsorbed by the first electromagnet 476, the grinding rod 452 retracts into the telescopic groove 451. When the wafer 3 is placed on the receiving seat 5, the edge of the wafer 3 will not be scratched by the grinding rod 452. After the wafer 3 is placed, the clamping seat 41 retracts. , and the limiting roller 44 contacts the edge of the wafer 3. After the air chamber in the clamping roller 42 is inflated, the rotary driver 461 is activated. The rotary driver 461 not only drives the two clamping rollers 42 to rotate, but also drives the first synchronous wheel 473 to rotate via the first bevel gear 471 and the second bevel gear 472. Under the action of the synchronous belt 475, the second synchronous wheel 474 is also driven to rotate. The tensioning unit 479 provided on the inner ring of the synchronous belt 475 is to ensure that the synchronous belt 475 can stably cooperate with the first and second synchronous wheels 473 and 474. After the clamping roller 42 begins to rotate, that is, after the rotary driver 461 is activated, the power to the first electromagnet 476 gradually decreases until it is de-energized. This prevents the first spring 477 from rapidly pushing out the first translation block 478 during the reset process, thereby preventing the grinding rod 452 from quickly striking the edge of the wafer 3, thereby ensuring that the edge of the wafer 3 is not damaged by contact with the grinding rod 452.

[0050] Reference Figure 7 、 Figure 10 and Figure 12 : A pushing unit 48 for driving the clamping seat 41 to move is provided on the clamping seat 41. The pushing unit 48 includes a pushing groove 481 arranged on the periphery of the clamping seat 41. The extension direction of the pushing groove 481 is parallel to the moving direction of the clamping seat 41. The clamping seat 41 is moved in the pushing groove 481. A corrugated sleeve 482 is provided between the clamping seat 41 and the end of the pushing groove 481 along the extension direction of the pushing groove 481.

[0051] When the bellows sleeve 482 is inflated, the clamping seat 41 moves toward the receiving seat 5 . When the air in the bellows sleeve 482 is discharged, the clamping seat 41 moves in a direction away from the receiving seat 5 .

[0052] Reference Figure 7 and Figure 8 : A lower pressure plate 483 is provided on the receiving seat 5 so as to move along the axis of the receiving seat 5, and a receiving sleeve 484 is provided at the lower part of the lower pressure plate 483. The lower pressure plate 483 extends into the receiving sleeve 484 and slides with the receiving sleeve 484 to form an extrusion chamber. When the lower pressure plate 483 descends, the air in the extrusion chamber is discharged, and an elastic tank 486 is provided on one side of the receiving sleeve 484. A one-way valve 485 is provided between the elastic tank 486 and the receiving sleeve 484 to connect the two. The one-way valve 485 allows the air in the extrusion chamber to flow into the elastic tank 486, and a first switch valve 487 is also provided on the side of the elastic tank 486. The elastic tank 486 is connected to the corrugated sleeve 482 through the first switch valve 487.

[0053] A plurality of second receiving wheels 4831 are evenly arranged on the upper portion of the lower pressure plate 483 around the axis of the lower pressure plate 483 , and the second receiving wheels 4831 are rotatably arranged on the lower pressure plate 483 .

[0054] Reference Figure 7 、 Figure 8 and Figure 12 : A third spring 488 is vertically arranged in the receiving sleeve 484, and the two ends of the third spring 488 are fixedly connected to the lower end of the lower pressure plate 483 and the bottom of the receiving sleeve 484 respectively. A return pipe 489 is arranged at the end of the corrugated sleeve 482 away from the clamping seat 41, and a second switch valve 4891 is arranged on the return pipe 489. A third switch valve 4892 is arranged at the bottom of the receiving sleeve 484, and a second electromagnet 4811 that can adsorb the clamping seat 41 is arranged at the end of the pushing groove 481 away from the receiving seat 5.

[0055] When placing the wafer 3, the lower pressure plate 483 is pressed downward by the wafer 3, and the lower pressure plate 483 squeezes the extrusion chamber in the receiving sleeve 484, and the third spring 488 in the extrusion chamber is also squeezed. At this time, the first switch valve 487, the second switch valve 4891, and the third switch valve 4892 are all in the closed state. At this time, the air in the extrusion chamber flows into the elastic tank 486 through the one-way valve 485. Due to the one-way action of the one-way valve 485, the third spring 488 cannot lift the lower pressure plate 483, thereby preventing the lower pressure plate 483 from being lifted again after being pressed down by the wafer 3. Subsequently, the first switch valve 487 is opened, and the air stored in the elastic tank 486 flows into the bellows and pushes the clamping seat 41. In order to prevent the limiting roller 44 on the clamping seat 41 from directly colliding with the edge of the wafer 3, a damper is provided at the end of the pushing groove 481 near the receiving seat 5. The damper has the effect of slowing down the movement speed of the clamping seat 41. When the processing of the chip 3 is completed, the second switch valve 4891 is opened, the first switch valve 487 is closed, and the second electromagnet 4811 is energized to attract the clamping seat 41, so that the clamping seat 41 can move from the second stop position to the first stop position, and the clamping roller 42 on the clamping seat 41 is withdrawn from the chip 3, and the chip 3 can be smoothly taken out from the receiving seat 5. Then the third switch valve 4892 is opened, and the third spring 488 drives the lower pressure plate 483 to rise, and the outside air enters the extrusion chamber through the third switch valve 4892.

[0056] Reference Figures 1-12 The present invention also relates to a non-destructive wafer cutting process for eliminating edge chipping and warping, which uses a non-destructive wafer cutting device for eliminating edge chipping and warping, and the specific steps are as follows:

[0057] S1. The clamping seat 41 has a first stop position and a second stop position when moving along the radial direction of the receiving seat 5. When the clamping seat 41 is at the first stop position, the clamping seat 41 arranged around the receiving seat 5 is in an open state, and the wafer 3 is placed on the receiving seat 5 from the top;

[0058] S2. After the wafer 3 is placed on the receiving seat 5, all the clamping seats 41 arranged around the receiving seat 5 move synchronously. The clamping seats 41 move from the first stop position to the second stop position. The clamping seats 41 arranged around the receiving seat 5 gradually shrink. When the clamping seats 41 shrink, the two clamping rollers 42 arranged on the clamping seats 41 pass over the upper and lower parts of the wafer 3 respectively, so that the wafer 3 is located in the gap between the two clamping rollers 42.

[0059] S3. Then the air pump 43 inflates the air cavity of the clamping roller 42. After the two clamping rollers 42 contact the upper and lower parts of the wafer 3 respectively, the cutting machine 2 descends to contact the edge of the wafer 3 and starts. Then the two clamping rollers 42 rotate, and the wafer 3 begins to rotate around the axis of the receiving seat 5.

[0060] Working principle: When cutting the wafer 3, the clamping seat 41 is located at the first stop position. At this time, all the clamping seats 41 arranged around the receiving seat 5 are in an open state. When the wafer 3 is placed on the receiving seat 5, the two clamping rollers 42 arranged on the clamping seat 41 will not hinder the wafer 3. After the wafer 3 is placed on the receiving seat 5, all the clamping seats 41 arranged around the receiving seat 5 begin to shrink, that is, at this time the clamping seat 41 moves from the first stop position to the second stop position. During the movement of the clamping seat 41, the two clamping rollers 42 on the clamping seat 41 pass by the upper and lower parts of the wafer 3 respectively. When the clamping seat 41 moves to the second stop position, the clamping seat 41 stops moving, and at this time the wafer 3 is located in the gap between the two clamping rollers 42. The outer periphery of the two clamping rollers 42 does not contact the upper and lower parts of the wafer 3. The air pump 43 then begins to inflate the air chamber. Once the chamber is inflated, the outer walls of the two clamping rollers 42 contact the upper and lower portions of the wafer 3, respectively, and the two clamping rollers 42 begin to rotate synchronously in opposite directions. Driven by the two clamping rollers 42, the wafer 3 begins to rotate about the axis of the receiving seat 5. Before the clamping rollers 42 begin rotating, the cutter 2 descends and contacts the edge of the wafer 3. Simultaneously, the cutter 2 starts operating before the clamping rollers 42, which then begin rotating. This eliminates the need for the cutter 2 to rotate around the wafer 3.

[0061] The above embodiments merely represent one or more embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of protection of the present invention. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present invention, and such modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the appended claims.

Claims

1. A non-destructive wafer cutting device for eliminating edge cracking and warping, comprising a base (1) and a cutting machine (2) arranged above the base (1), wherein a receiving seat (5) for receiving a wafer (3) is arranged on the upper part of the base (1); It is characterized by: A clamping unit (4) for clamping the wafer (3) is provided around the receiving seat (5), and the clamping unit (4) includes a plurality of clamping seats (41) uniformly distributed around the receiving seat (5). The receiving seat (5) is a circular structure, and the clamping seat (41) is arranged on one side of the receiving seat (5) along the radial direction of the receiving seat (5). Two clamping rollers (42) are arranged on the clamping seat (41) along the vertical direction, and there is a gap between the two clamping rollers (42). The clamping rollers (42) are arranged along the radial direction of the receiving seat (5). The two clamping rollers (42) are rotatably arranged on the clamping seat (41), and the rotation directions of the two clamping rollers (42) are opposite. There are air cavities in the two clamping rollers (42), and an air pump (43) connected to the air cavity is provided on one side of the clamping rollers (42). When the clamping unit (4) clamps the wafer (3) on the receiving seat (5), the air pump (43) inflates the air cavity, and the wafer (3) is located in the gap between the two clamping rollers (42) and contacts the outer peripheral walls of the two clamping rollers (42); A grinding unit (45) is also provided on the clamping seat (41), and a telescopic groove (451) is horizontally provided on one side of the clamping seat (41) facing the receiving seat (5), and the extension direction of the telescopic groove (451) is parallel to the movement direction of the clamping seat (41), and a grinding rod (452) is provided in the telescopic groove (451) and moves along the extension direction of the telescopic groove (451), and the grinding rod (452) can rotate around its own vertical direction, and the rotation direction of the grinding rod (452) is opposite to the rotation direction of the wafer (3); A driving unit (46) for driving the clamping roller (42) to rotate is provided on the clamping seat (41). The driving unit (46) includes a first gear (462) and a second gear (463) respectively provided at the ends of two clamping rollers (42) on the same clamping seat (41). The first gear (462) and the second gear (463) are meshed with each other. A third gear (464) is provided above the first gear (462). The third gear (464) and the first gear (462) are meshed with each other. A rotation driver (461) for driving the third gear (464) to rotate is provided at the end of the third gear (464). A transmission unit (47) is provided between the third gear (464) and the grinding rod (452), and the third gear (464) drives the grinding rod (452) to rotate via the transmission unit (47).

2. The non-destructive wafer cutting device for eliminating edge chipping and warping according to claim 1, characterized in that: The side wall of the clamping seat (41) facing the receiving seat (5) is an arc-shaped structure, the axis of the arc-shaped structure is colinear with the axis of the receiving seat (5), and limiting rollers (44) are respectively provided on both sides of the arc-shaped structure for vertical rotation. Part of the peripheral wall of the limiting roller (44) protrudes outward from one side of the clamping seat (41), and the clamping seat (41) contacts the edge of the chip (3) through the limiting roller (44), and the limiting roller (44) and the edge of the chip (3) are in rolling cooperation.

3. The non-destructive wafer cutting device for eliminating edge chipping and warping according to claim 1, characterized in that: The transmission unit (47) includes a synchronous belt (475), and a tensioning unit (479) for tensioning the synchronous belt (475) is provided in the inner ring of the synchronous belt (475). The tensioning unit (479) includes a tensioning wheel (4791) that rolls with the side wall of the inner ring of the synchronous belt (475).

4. The non-destructive wafer cutting device for eliminating edge chipping and warping according to claim 1, characterized in that: A pushing unit (48) for driving the clamping seat (41) to move is provided on the clamping seat (41). The pushing unit (48) includes a pushing groove (481) provided on the periphery of the clamping seat (41). The extension direction of the pushing groove (481) is parallel to the movement direction of the clamping seat (41). The clamping seat (41) is moved in the pushing groove (481). A corrugated sleeve (482) is provided between the clamping seat (41) and the end of the pushing groove (481) along the extension direction of the pushing groove (481).

5. The non-destructive wafer cutting device for eliminating edge chipping and warping according to claim 4, characterized in that: A lower pressure plate (483) is provided on the receiving seat (5) so as to move along the axis of the receiving seat (5), and a receiving sleeve (484) is provided at the lower part of the lower pressure plate (483). The lower pressure plate (483) extends into the receiving sleeve (484) and slides with the receiving sleeve (484). An extrusion chamber is formed in the receiving sleeve (484). When the lower pressure plate (483) descends, the air in the extrusion chamber is discharged. An elastic tank (486) is provided on one side of the receiving sleeve (484). A one-way valve (485) is provided between the elastic tank (486) and the receiving sleeve (484) to connect the two. The one-way valve (485) allows the air in the extrusion chamber to flow into the elastic tank (486). A first switch valve (487) is also provided on the side of the elastic tank (486). The elastic tank (486) is connected to the corrugated sleeve (482) through the first switch valve (487).

6. The non-destructive wafer cutting device for eliminating edge chipping and warping according to claim 5, characterized in that: A third spring (488) is vertically arranged in the receiving sleeve (484), and the two ends of the third spring (488) are fixedly connected to the lower end of the lower pressure plate (483) and the bottom of the receiving sleeve (484), respectively. A return pipe (489) is provided at the end of the corrugated sleeve (482) away from the clamping seat (41), and a second switch valve (4891) is provided on the return pipe (489). A third switch valve (4892) is provided at the bottom of the receiving sleeve (484), and a second electromagnet (4811) capable of adsorbing the clamping seat (41) is provided at the end of the pushing groove (481) away from the receiving seat (5).

7. A non-destructive wafer cutting process for eliminating edge chipping and warping, using the non-destructive wafer cutting device for eliminating edge chipping and warping according to any one of claims 1 to 6, characterized in that: The specific steps are as follows: S1, the clamping seat (41) has a first stop position and a second stop position when moving along the radial direction of the receiving seat (5), when the clamping seat (41) is located at the first stop position, the clamping seat (41) arranged around the receiving seat (5) is in an open state, and the wafer (3) is placed on the receiving seat (5) from the top; S2. After the wafer (3) is placed on the receiving seat (5), all the clamping seats (41) arranged around the receiving seat (5) move synchronously, the clamping seat (41) moves from the first stop position to the second stop position, the clamping seat (41) arranged around the receiving seat (5) gradually shrinks, and the two clamping rollers (42) arranged on the clamping seat (41) pass through the upper and lower parts of the wafer (3) respectively when the clamping seat (41) shrinks, so that the wafer (3) is located in the gap between the two clamping rollers (42); S3. Then the air pump (43) inflates the air cavity of the clamping roller (42). After the two clamping rollers (42) respectively contact the upper and lower parts of the wafer (3), the cutting machine (2) descends to contact the edge of the wafer (3) and starts. Then the two clamping rollers (42) rotate, and the wafer (3) begins to rotate around the axis of the receiving seat (5).

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