Flexible circuit fault positioning method

Abstract

The invention provides a flexible circuit fault positioning method. The method comprises the following steps: acquiring a faulted flexible circuit; detecting the flexible circuit to determine the fault type of the flexible circuit; and determining a fault point location of the flexible circuit based on the fault type. The fault positioning process of the flexible circuit is simple, convenient and effective, popularization is facilitated, the process defects of the flexible circuit can be determined conveniently according to the fault type and the fault point location, and the quality of the flexible circuit can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of flexible circuit detection, and in particular to a method for locating a flexible circuit fault. Background Art

[0002] With the expansion of the application field of flexible circuits, it is no longer limited to bending, but can also be stretched and compressed. During use, it is affected by mechanical stress, temperature stress, etc., which affects the stability of the interconnection and may cause abnormal phenomena such as cracks and fractures. Due to the particularity of the flexible circuit production process, the failure location and analysis process is different from that of ordinary circuits. Therefore, a fault location method for flexible circuits is urgently needed. Summary of the invention

[0003] In view of this, the purpose of the present application is to provide a method for locating a flexible circuit fault.

[0004] Based on the above objectives, the present application provides a method for locating a flexible circuit fault, comprising:

[0005] Obtaining a failed flex circuit;

[0006] Testing the flexible circuit to determine the fault type of the flexible circuit;

[0007] Based on the fault type, a fault point of the flexible circuit is determined.

[0008] Further, the fault type includes open circuit;

[0009] The determining of the fault point of the flexible circuit based on the fault type includes:

[0010] In response to determining that the fault type is an open circuit, performing a visual inspection on the flexible circuit to preliminarily determine the open circuit fault point of the flexible circuit;

[0011] Based on the initially determined open circuit fault location, X-ray detection is performed on the flexible circuit to determine the fault location.

[0012] Further, the fault type includes short circuit;

[0013] The determining of the fault point of the flexible circuit based on the fault type includes:

[0014] In response to determining that the fault type is a short circuit, performing an appearance inspection on the flexible circuit to preliminarily determine a short circuit fault point of the flexible circuit;

[0015] Based on the initially determined short-circuit fault location, an X-ray inspection is performed on the flexible circuit to determine the fault location.

[0016] Furthermore, the fault type includes parameter out-of-tolerance;

[0017] The determining of the fault point of the flexible circuit based on the fault type includes:

[0018] In response to determining that the fault type is parameter out-of-tolerance, performing appearance inspection on the flexible circuit to preliminarily determine the parameter out-of-tolerance fault point of the flexible circuit;

[0019] Based on the initially determined parameter out-of-tolerance fault point, X-ray detection is performed on the flexible circuit to determine the fault point.

[0020] Further, after obtaining the faulty flexible circuit, the method further includes:

[0021] Obtain a similar flex circuit with the same specifications as the flex circuit that failed;

[0022] The structural analysis of the same type of flexible circuit is performed to obtain the structural element composition of the flexible circuit.

[0023] Further, after determining the fault point of the flexible circuit based on the fault type, the method further includes:

[0024] Based on the structural elements of the flexible circuit, peeling off the base substrate of the flexible circuit until the fault point is completely exposed to obtain an exposed conductor;

[0025] The conductor is microscopically analyzed to determine the original fault point of the flexible circuit, so as to determine the cause of the fault of the flexible circuit.

[0026] Furthermore, the structural elements of the flexible circuit include the material of the substrate, the connection process and the material of the conductor, etc. Based on the structural elements of the flexible circuit, the substrate of the flexible circuit is peeled off until the fault point is completely exposed to obtain the exposed conductor, including:

[0027] In response to determining that the connection process of the base substrate of the flexible circuit is a strippable process, the base substrate is stripped by a mechanical method until the fault point of the flexible circuit is completely exposed to obtain an exposed conductor;

[0028] In response to determining that the connection process of the base substrate of the flexible circuit is a non-strippable process, the base substrate is decomposed by a chemical method until the fault point of the flexible circuit is completely exposed to obtain an exposed conductor.

[0029] Further, in response to determining that the connection process of the substrate of the flexible circuit is a non-strippable process, the substrate is decomposed by a chemical method until the fault point of the flexible circuit is completely exposed to obtain an exposed conductor, including:

[0030] In response to determining that the connection process of the base substrate of the flexible circuit is a non-strippable process, determining a chemical solution capable of decomposing the base substrate without decomposing the conductor based on the material of the base substrate and the material of the conductor;

[0031] The flexible circuit is placed in the chemical solution, so that the substrate of the flexible circuit reacts chemically with the chemical solution to decompose, until the fault point of the flexible circuit is completely exposed to obtain an exposed conductor.

[0032] Further, the detecting the flexible circuit to determine the fault type of the flexible circuit includes:

[0033] Performing electrical performance testing on the flexible circuit to determine the cause of the abnormality of the flexible circuit;

[0034] A failure type of the flexible circuit is determined based on the abnormal cause.

[0035] From the above, it can be seen that the method for locating a flexible circuit fault provided in the present application detects the faulty flexible circuit to determine the fault type of the flexible circuit, and determines the fault point of the flexible circuit based on the determined fault type, thereby realizing a fault locating process of determining the fault point according to the fault type, making the flexible circuit fault locating process simple and effective, which is conducive to promotion, and is also convenient for determining the process defects of the flexible circuit according to the fault type and fault point, thereby helping to improve the quality of the flexible circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0037] Figure 1 A schematic diagram of a process of locating a flexible circuit fault according to an embodiment of the present application;

[0038] Figure 2 This is a schematic diagram of the appearance inspection structure of the flexible circuit in the embodiment of the present application. Figure 1 ;

[0039] Figure 3This is a schematic diagram of the appearance inspection structure of the flexible circuit in the embodiment of the present application. Figure 2 ;

[0040] Figure 4 This is a schematic diagram of the X-ray detection structure of the flexible circuit in the embodiment of the present application;

[0041] Figure 5 Schematic diagram of the microscopic structure of the conductor exposed in the embodiment of the present application Figure 1 ;

[0042] Figure 6 Schematic diagram of the microscopic structure of the conductor exposed in the embodiment of the present application Figure 2 . DETAILED DESCRIPTION

[0043] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0044] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0045] With the development of the Internet of Things and wearable technology, flexible circuits have gradually become the mainstream trend of future electronic device development. Flexible circuits with flexible polymers as substrates and conductive materials such as metal films and conductive inks as conductors are key components in the development of flexible electronic devices. They are light, thin, flexible and even stretchable. They have broad application prospects in the fields of smart wearables, flexible displays, medical devices, sports monitoring, flexible energy devices, electronic skin, etc., and have received widespread attention in recent years.

[0046] Among them, metal film is the preferred conductor material for flexible circuits. Generally, gold or copper is used and deposited on a flexible substrate by adhesive bonding, printing, sputtering, electron beam evaporation and other methods. Flexible substrates generally use polymer materials such as polyimide plastics, polyetheretherketone or transparent conductive polyester. With the expansion of the application field of flexible circuits, it is no longer limited to bending, but can also be developed into stretchable, compressible, etc. During use, it is affected by mechanical stress, temperature stress, etc., and the stability of the interconnection is affected. Abnormal phenomena such as cracks and fractures may occur. Due to the particularity of the flexible circuit production process, the failure location and analysis process are different from ordinary circuits. A fault location method for flexible circuits is needed to guide the process of flexible circuits and make up for the process defects of flexible circuits.

[0047] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0048] The present application provides a method for locating a flexible circuit fault, such as Figure 1 As shown, including:

[0049] Step S100, obtaining a faulty flexible circuit;

[0050] Specifically, after a flexible circuit fails, it is necessary to locate the fault of the flexible circuit to determine the process defect causing the failure of the flexible circuit. Therefore, obtaining the failed flexible circuit is fundamental to locating the fault.

[0051] Step S200, detecting the flexible circuit to determine the fault type of the flexible circuit;

[0052] Specifically, the flexible circuit is detected to determine the fault type of the flexible circuit, so as to subsequently locate the fault according to the fault type.

[0053] Step S300: determining the fault location of the flexible circuit based on the fault type.

[0054] Specifically, after the fault type of the flexible circuit is determined, a fault point that matches the fault type is determined on the flexible circuit according to the fault type.

[0055] Exemplarily, the fault type is an open circuit, that is, there is a break on the flexible circuit. According to the usage of the flexible circuit, the area where the flexible circuit is repeatedly bent and has wrinkles is determined to determine the fault point.

[0056] In this embodiment, the faulty flexible circuit is detected to determine the fault type of the flexible circuit, and the fault point of the flexible circuit is determined based on the determined fault type, thereby realizing a fault location process of determining the fault point according to the fault type. This makes the fault location process of the flexible circuit simple and effective, which is conducive to promotion. It is also convenient to determine the process defects of the flexible circuit according to the fault type and the fault point, which is beneficial to improving the quality of the flexible circuit.

[0057] In some embodiments, the fault type includes an open circuit;

[0058] Step S300: determining the fault point of the flexible circuit based on the fault type, including:

[0059] Step S301, in response to determining that the fault type is an open circuit, performing appearance inspection on the flexible circuit to preliminarily determine the open circuit fault point of the flexible circuit;

[0060] Specifically, when the fault type of the flexible circuit is an open circuit, it is confirmed that the flexible circuit has cracks or breaks. Based on this, the appearance of the flexible circuit is observed to preliminarily determine the location where the cracks or breaks in the flexible circuit exist, which is the open circuit fault point.

[0061] It should be noted that the locations where cracks or breaks appear on the flexible circuit are usually the locations where folds are repeated, which is manifested in the appearance of the flexible circuit as having many wrinkles. Therefore, by observing the appearance of the flexible circuit, the locations with many wrinkles are preliminarily confirmed as open circuit fault points.

[0062] Step S302: performing X-ray detection on the flexible circuit based on the initially determined open circuit fault location to determine the fault location.

[0063] Specifically, X-ray detection is performed on the initially determined open circuit fault point to obtain the open circuit fault point under X-ray. The flexible circuit structure is obvious under X-ray, and the location of the break or crack can be directly determined. The open circuit fault point confirmed under X-ray is determined as the fault point.

[0064] In this embodiment, the process of determining the fault point when the fault type is an open circuit is explained, the fault point of the flexible circuit is preliminarily determined based on the physical characteristics of the open circuit, and on this basis, X-ray detection is performed on the preliminarily determined fault point to achieve the determination of the fault point. The efficiency of determining the fault point of the flexible circuit can be improved, and the process is simple and conducive to popularization and application.

[0065] In some embodiments, the fault type includes a short circuit;

[0066] Step S300: determining the fault point of the flexible circuit based on the fault type, including:

[0067] Step S303, in response to determining that the fault type is a short circuit, performing an appearance inspection on the flexible circuit to preliminarily determine the short circuit fault point of the flexible circuit;

[0068] Specifically, when the fault type of the flexible circuit is a short circuit, it is confirmed that the flexible circuit has ablation or breakdown, and the ablation or breakdown causes the conductor in the flexible circuit to be connected to the conductor at other positions, causing the flexible circuit to short circuit. Based on this, the appearance of the flexible circuit is observed to preliminarily determine the position where the flexible circuit has ablation or breakdown, that is, the short circuit fault point.

[0069] It should be noted that the location where ablation or breakdown occurs on the flexible circuit has ablation marks, some of which are burnt black, and some of which have shrinkage of the appearance material. Based on this, the short circuit fault point can be preliminarily determined.

[0070] Step S304: performing X-ray detection on the flexible circuit based on the initially determined short-circuit fault point to determine the fault point.

[0071] Specifically, for the short-circuit fault point preliminarily determined, X-ray detection is performed on the flexible circuit to obtain the short-circuit fault point under X-ray. The structure of the flexible circuit under X-ray is obvious, and the location of the short circuit can be directly determined. The short-circuit fault point confirmed under X-ray is determined as the fault point.

[0072] In this embodiment, the process of determining the fault point when the fault type is a short circuit is explained, the fault point of the flexible circuit is preliminarily determined based on the physical characteristics of the short circuit and the corresponding physical manifestations, and on this basis, the preliminarily determined fault point is subjected to X-ray detection to achieve the determination of the fault point. This can improve the efficiency of determining the fault point of the flexible circuit, and the process is simple and conducive to popularization and application.

[0073] In some embodiments, the fault type includes parameter out-of-tolerance;

[0074] Step S300: determining the fault point of the flexible circuit based on the fault type, including:

[0075] Step S305, in response to determining that the fault type is parameter out-of-tolerance, performing appearance inspection on the flexible circuit to preliminarily determine the parameter out-of-tolerance fault point of the flexible circuit;

[0076] Specifically, when the fault type of the flexible circuit is parameter deviation, it is confirmed that the flexible circuit has a poor connection, and the reason for the poor connection is the stress applied to the flexible circuit, that is, the poor connection is a mild open circuit. Based on this, the appearance of the flexible circuit is observed to preliminarily determine the position where the flexible circuit has repeated bending or repeated stress, which is the fixed point of parameter deviation.

[0077] It should be noted that the locations where poor connections occur on the flexible circuit are usually locations that are repeatedly bent, which is manifested in the appearance of the flexible circuit as having many wrinkles. Therefore, the appearance of the flexible circuit is observed, and the locations with more wrinkles are preliminarily confirmed as parameter out-of-tolerance fault points.

[0078] Step S306: performing X-ray inspection on the flexible circuit based on the initially determined parameter out-of-tolerance fault point to determine the fault point.

[0079] Specifically, X-ray detection is performed on the initially determined parameter out-of-tolerance fault point to obtain the parameter out-of-tolerance fault point under X-ray. The flexible circuit structure under X-ray is obvious, and the location where the connection is poor can be directly determined. The parameter out-of-tolerance fault point confirmed under X-ray is determined as the fault point.

[0080] In this embodiment, the process of determining the fault point when the fault type is parameter deviation is explained, the fault point of the flexible circuit is preliminarily determined based on the physical characteristics of the parameter deviation, and on this basis, the preliminarily determined fault point is subjected to X-ray detection to achieve the determination of the fault point. The efficiency of determining the fault point of the flexible circuit can be improved, and the process is simple and conducive to popularization and application.

[0081] It should be noted that if it is determined that the fault type of the flexible circuit includes two or more of open circuit, short circuit and parameter out of tolerance, an appearance inspection is performed according to different fault types to preliminarily determine multiple fault points, and on this basis, an X-ray inspection is performed.

[0082] In some embodiments, after step S100: obtaining the failed flexible circuit, the following steps are included:

[0083] Step S400, obtaining a similar flexible circuit with the same specification as the flexible circuit that has failed;

[0084] Specifically, before locating the fault of a faulty flexible circuit, it is necessary to clarify the structural element composition of the faulty flexible circuit so as to locate the fault based on its structural element composition. Therefore, obtaining a similar flexible circuit with the same specifications as the faulty flexible circuit to determine the structural element composition of the faulty flexible circuit is beneficial to the subsequent fault location of the flexible circuit.

[0085] It should be noted that the same type of flexible circuit is of the same type as the flexible circuit that failed, and accordingly, its structure, composition and process are the same. The structural element composition includes the structural unit of the flexible circuit, and the structural elements, processes and materials corresponding to different structural units.

[0086] Exemplarily, as shown in Table 1, it is a table of structural elements of the flexible circuit.

[0087] Table 1 Structural elements of flexible circuits

[0088]

[0089]

[0090] Step S500: Performing structural analysis on the same type of flexible circuit to obtain the structural element composition of the flexible circuit.

[0091] Specifically, the structure of the same type of flexible circuit is analyzed according to the structural element composition table of the flexible circuit to obtain the structural element composition of the flexible circuit.

[0092] Exemplarily, after performing structural analysis on the flexible circuit, a structural element composition table is obtained as shown in Table 2.

[0093] Table 2 Structural elements of a flexible circuit

[0094] Structural unit Structural elements Technology Material Substrate 10*10、5 Bonding Polymer-based substrates, Components element welding solder Conductor 2*2、1 Coating Conductive ink Connection parts Solder Points welding wire

[0095] In this embodiment, before locating the fault of the faulty flexible circuit, a structural analysis is performed on a similar flexible circuit of the same specification as the faulty flexible circuit to obtain the structural element composition of the faulty flexible circuit, so as to subsequently locate the fault of the faulty flexible circuit based on its structural element composition, which is conducive to improving the applicability and practicality of the method.

[0096] In some embodiments, after step S300: determining the fault point of the flexible circuit based on the fault type, the following steps are included:

[0097] Step S600, based on the structural elements of the flexible circuit, peeling off the base substrate of the flexible circuit until the fault point is completely exposed to obtain an exposed conductor;

[0098] Specifically, according to the structural elements of the flexible circuit, a method of peeling off the base substrate of the flexible circuit is determined to achieve peeling off the base substrate without damaging the conductor of the flexible circuit, so as to subsequently perform microscopic analysis on the exposed conductor and improve the accuracy of the microscopic analysis.

[0099] Step S700: microscopically analyzing the conductor to determine the original fault point of the flexible circuit, so as to determine the cause of the fault of the flexible circuit.

[0100] Specifically, the conductor is exposed so that it is convenient to perform microscopic analysis on it. The appearance of the conductor is microscopically analyzed based on the fault point to obtain the microscopic morphology of the conductor. By observing the microscopic morphology of the conductor, the original fault point of the flexible circuit can be judged according to its morphological characteristics. Based on this, the cause of the fault can be determined. After clarifying the cause of the fault of the flexible circuit, its process defects can be determined, which is conducive to improving its process defects.

[0101] In this embodiment, after determining the fault point of the flexible circuit, the conductor is exposed by peeling off the base substrate of the flexible circuit to further clarify the original fault point corresponding to the fault point, that is, the root cause of the fault, and then determine the cause of the failure of the flexible circuit on this basis, which is conducive to clarifying the process defects of the flexible circuit, and then facilitating subsequent improvements on its process defects, thereby improving the practicality of the method.

[0102] In some embodiments, the structural elements of the flexible circuit include the material of the substrate, the connection process, and the material of the conductor, etc. Step S600: based on the structural elements of the flexible circuit, the substrate of the flexible circuit is peeled off until the fault point is completely exposed to obtain the exposed conductor, including:

[0103] Step S601, in response to determining that the connection process of the base substrate of the flexible circuit is a strippable process, the base substrate is stripped by a mechanical method until the fault point of the flexible circuit is completely exposed to obtain an exposed conductor;

[0104] Specifically, the connection process of the base substrate of the flexible circuit is determined according to the structural elements of the flexible circuit. If the connection process of the base substrate is a peelable process such as bonding, the base substrate is peeled off by a mechanical method according to the bonding points of the base substrate until the fault points on the conductor of the flexible circuit are completely exposed to obtain an exposed conductor.

[0105] Step S602, in response to determining that the connection process of the base substrate of the flexible circuit is a non-strippable process, decomposing the base substrate by a chemical method until the fault point of the flexible circuit is completely exposed to obtain an exposed conductor.

[0106] Specifically, the connection process of the substrate of the flexible circuit is determined according to the structural element composition of the flexible circuit. If the connection process of the substrate is a non-peelable process such as integral connection, the materials of the substrate and the conductor are determined according to the structural element composition of the flexible circuit, and a solution that can decompose the substrate and does not react with the conductor is selected to decompose the substrate so that the conductor is exposed to obtain an exposed conductor.

[0107] In this embodiment, a method for stripping the base substrate of the flexible circuit is described in detail to clarify that different methods are used to strip the base substrate when the base substrate is in different processes, thereby avoiding damaging the conductor and affecting the fault location and fault analysis of the flexible circuit, thereby facilitating improving the accuracy and practicality of the fault location and fault analysis of the flexible circuit.

[0108] In some embodiments, step S602: in response to determining that the connection process of the substrate substrate of the flexible circuit is a non-strippable process, decomposing the substrate substrate by a chemical method until the fault point of the flexible circuit is completely exposed to obtain an exposed conductor, includes:

[0109] Step S602-1, in response to determining that the connection process of the substrate of the flexible circuit is a non-strippable process, determining a chemical solution capable of decomposing the substrate without decomposing the conductor based on the material of the substrate and the material of the conductor;

[0110] Specifically, when the base substrate is a non-strippable process, in order to expose the conductor wrapped by the base substrate without affecting the conductor, a decomposition solution is selected based on the material of the base substrate and the material of the conductor, so that the decomposition solution can decompose the base substrate without reacting with the conductor, thereby achieving the stripping of the base substrate without affecting the conductor.

[0111] Step S602-2, placing the flexible circuit in the chemical solution, so that the base substrate of the flexible circuit reacts chemically with the chemical solution to decompose, until the fault point of the flexible circuit is completely exposed to obtain an exposed conductor.

[0112] Specifically, after the chemical solution is determined, the flexible circuit is placed in the chemical solution, and as the base substrate in the flexible circuit decomposes with the chemical solution, the base substrate is peeled off from the periphery of the conductor, and the conductor is exposed.

[0113] In this embodiment, the process of stripping the substrate by chemical method is explained to make it clear that the chemical method can achieve stripping of the substrate without damaging the conductor, thereby providing a basis for subsequent analysis of the conductor to clarify the cause of the flexible circuit failure, which is beneficial to improving the practicality of the flexible circuit fault locating method.

[0114] In some embodiments, step S200: detecting the flexible circuit to determine the fault type of the flexible circuit includes:

[0115] Step S201, performing electrical performance testing on the flexible circuit to determine the abnormal cause of the flexible circuit;

[0116] Specifically, the cause of the abnormality of the flexible circuit is determined by electrical performance testing, wherein the electrical performance testing is to conduct a power-on test on the flexible circuit through an electrical performance testing system or equipment to clarify the cause of the abnormality of the flexible circuit.

[0117] Exemplarily, when the abnormal reason generated by the electrical performance detection system is that conduction cannot be performed, it is determined that the abnormal reason of the flexible circuit is that there is a disconnection part.

[0118] Step S202: determining the fault type of the flexible circuit based on the abnormal cause.

[0119] Specifically, the fault type of the flexible circuit is determined according to the abnormal cause determined by the electrical performance detection.

[0120] Exemplarily, if the abnormality of the flexible circuit is caused by the presence of a disconnected portion, then the fault type of the flexible circuit is determined to be an open circuit.

[0121] In this embodiment, determining the fault type of the flexible circuit through an electrical performance test is conducive to quickly determining the fault of the flexible circuit, thereby improving the efficiency of the fault location method.

[0122] The flexible circuit fault location method is exemplarily described below:

[0123] The material of the substrate of the flexible circuit is polymer, and the material of the conductor is metal sheet. The electrical performance test was carried out and it was determined that the fault type of the flexible circuit was open circuit. Through visual inspection, the internal metal film of the flexible circuit changed color and turned black at points 1# and 2#, and broke with a flat fracture. The metal sheet at point 3# did not change color, and it was suspected that there was a crack. Figure 2 and Figure 3 As shown in the figure, an X-ray inspection revealed that the metal sheets at points 1# and 2# inside the flexible circuit had been broken and separated, with the fractures flush, and the metal sheet at point 3# had cracks that had not been broken, as shown in the figure. Figure 4 As shown; after mechanically peeling off the substrate of the flexible circuit, the exposed conductor is microscopically analyzed to observe the fracture morphology of the metal fragment inside the flexible circuit. The fracture of the metal fragment is flat, and most of the fracture area shows traces of tensile deformation, which is related to tensile stress. Only the edge has a hot melt morphology, which is the last melting area, as shown in FIG. Figure 5 and Figure 6 As shown in the figure, it is determined that the failure of the flexible circuit is caused by the tensile stress on the metal sheet near the root of the lead-out terminal, which causes cracks. Because the final connection area is very small, it is thermally melted, discolored and broken under the action of electrical stress.

[0124] A person skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0125] In addition, when specific details are set forth to describe exemplary embodiments of the present application, it is apparent to those skilled in the art that the present application embodiments can be implemented without these specific details or when these specific details are varied. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0126] Although the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations of these embodiments will be apparent to those skilled in the art in light of the foregoing description.

[0127] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the present application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the protection scope of the present application.

Claims

1. A method for locating a flexible circuit fault, characterized in that: include: Obtaining a failed flex circuit; Testing the flexible circuit to determine the fault type of the flexible circuit; Based on the fault type, a fault point of the flexible circuit is determined.

2. The method for locating a flexible circuit fault according to claim 1, characterized in that: The fault type includes open circuit; The determining of the fault point of the flexible circuit based on the fault type includes: In response to determining that the fault type is an open circuit, performing a visual inspection on the flexible circuit to preliminarily determine the open circuit fault point of the flexible circuit; Based on the initially determined open circuit fault location, X-ray detection is performed on the flexible circuit to determine the fault location.

3. The method for locating a flexible circuit fault according to claim 2, characterized in that: The fault types include short circuit; The determining of the fault point of the flexible circuit based on the fault type includes: In response to determining that the fault type is a short circuit, performing an appearance inspection on the flexible circuit to preliminarily determine a short circuit fault point of the flexible circuit; Based on the initially determined short-circuit fault location, an X-ray inspection is performed on the flexible circuit to determine the fault location.

4. The method for locating a flexible circuit fault according to claim 2, characterized in that: The fault types include parameter out-of-tolerance; The determining of the fault point of the flexible circuit based on the fault type includes: In response to determining that the fault type is parameter out-of-tolerance, performing appearance inspection on the flexible circuit to preliminarily determine the parameter out-of-tolerance fault point of the flexible circuit; Based on the initially determined parameter out-of-tolerance fault point, X-ray detection is performed on the flexible circuit to determine the fault point.

5. The method for locating a flexible circuit fault according to claim 1, characterized in that: After obtaining the failed flexible circuit, the method further comprises: Obtain a similar flex circuit with the same specifications as the flex circuit that failed; The structural analysis of the same type of flexible circuit is performed to obtain the structural element composition of the flexible circuit.

6. The method for locating a flexible circuit fault according to claim 5, characterized in that: After determining the fault point of the flexible circuit based on the fault type, the method further comprises: Based on the structural elements of the flexible circuit, peeling off the base substrate of the flexible circuit until the fault point is completely exposed to obtain an exposed conductor; The conductor is microscopically analyzed to determine the original fault point of the flexible circuit, so as to determine the cause of the fault of the flexible circuit.

7. The method for locating a flexible circuit fault according to claim 6, characterized in that: The structural elements of the flexible circuit include the material of the substrate, the connection process and the material of the conductor, etc. Based on the structural elements of the flexible circuit, the substrate of the flexible circuit is peeled off until the fault point is completely exposed to obtain the exposed conductor, including: In response to determining that the connection process of the base substrate of the flexible circuit is a strippable process, the base substrate is stripped by a mechanical method until the fault point of the flexible circuit is completely exposed to obtain an exposed conductor; In response to determining that the connection process of the base substrate of the flexible circuit is a non-strippable process, the base substrate is decomposed by a chemical method until the fault point of the flexible circuit is completely exposed to obtain an exposed conductor.

8. The method for locating a flexible circuit fault according to claim 7, characterized in that: In response to determining that the connection process of the substrate of the flexible circuit is a non-strippable process, the substrate is decomposed by a chemical method until the fault point of the flexible circuit is completely exposed to obtain an exposed conductor, including: In response to determining that the connection process of the base substrate of the flexible circuit is a non-strippable process, determining a chemical solution capable of decomposing the base substrate without decomposing the conductor based on the material of the base substrate and the material of the conductor; The flexible circuit is placed in the chemical solution, so that the substrate of the flexible circuit reacts chemically with the chemical solution to decompose, until the fault point of the flexible circuit is completely exposed to obtain an exposed conductor.

9. The method for locating a flexible circuit fault according to claim 1, characterized in that: The detecting the flexible circuit to determine the fault type of the flexible circuit includes: Performing electrical performance testing on the flexible circuit to determine the cause of the abnormality of the flexible circuit; A failure type of the flexible circuit is determined based on the abnormal cause.

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