Package substrate and package substrate manufacturing method

Abstract

The invention discloses a packaging substrate and a manufacturing method of the packaging substrate. The packaging substrate comprises a plurality of dielectric layers, the dielectric layers are sequentially arranged in a stacked mode, conductive patterns are arranged on the surfaces of the same sides of the dielectric layers, each dielectric layer further comprises a first through hole formed in a penetrating mode, a connecting circuit is arranged in the first through hole, and the connecting circuit is electrically connected with the conductive patterns on the two adjacent sides; one end of each conductive pattern is connected with the conductive pattern of the upper layer through a connecting line, the other end of each conductive pattern is connected with the conductive pattern of the lower layer through a connecting line, and the conductive patterns are sequentially connected to form a coil winding; the packaging substrate further comprises a first mounting hole penetrating through the dielectric layers, the first mounting hole is filled with magnetic paste to form a magnetic core, and the coil winding is wound around the magnetic core. The magnetic core and the coil winding are integrated in the packaging substrate in the manufacturing and forming process of the packaging substrate, so that the surface space of the packaging substrate does not need to be occupied, and miniaturization and centralization of the inductance element are achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging, and in particular to a packaging substrate and a method for manufacturing the packaging substrate. Background Art

[0002] Inductors are essential components in electronic circuits. They can block current, transform voltage, couple, and work with capacitors for tuning, filtering, and frequency division. Traditional inductor designs are mainly divided into two types: plug-in and SMD. Plug-in inductors have the advantages of simple structure and easy manufacturing because their winding coils are directly wound on a hollow or magnetic core, but they occupy a large space and are not conducive to the miniaturization and integration of the system. Although SMD inductors reduce the volume to a certain extent, they still need to be attached to the surface of the packaging substrate, occupying the surface space of the packaging substrate, and it is difficult to meet the current pursuit of high integration and miniaturization. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a packaging substrate, which can integrate the magnetic core and the coil winding in the packaging substrate, thereby realizing the miniaturization and centralization of the inductor element.

[0004] The present invention also provides another packaging substrate;

[0005] The present invention also provides a method for manufacturing a packaging substrate;

[0006] The present invention also provides another method for manufacturing a packaging substrate.

[0007] A packaging substrate according to an embodiment of the first aspect of the present invention includes:

[0008] A plurality of dielectric layers, each of which is stacked in sequence, and each of which is provided with a conductive pattern on the same side surface, and each of which further comprises a first through hole provided therethrough, and a connecting line is provided in the first through hole, and the connecting line is electrically connected to the conductive patterns on two adjacent sides; one end of each of the conductive patterns is connected to the conductive pattern of the previous layer through the connecting line, and the other end is connected to the conductive pattern of the next layer through the connecting line, and each of the conductive patterns is connected in sequence to form a coil winding;

[0009] The packaging substrate further comprises a first mounting hole penetrating through each of the dielectric layers, the first mounting hole is filled with magnetic paste to form a magnetic core, and the coil winding is wound around the magnetic core.

[0010] The packaging substrate according to the embodiment of the present invention has at least the following beneficial effects:

[0011] Compared with the prior art in which the coil winding and magnetic core of the inductor need to be arranged on the surface of the packaging substrate, in the embodiment of the present application, the magnetic core and coil winding are integrated into the packaging substrate during the manufacturing process of the packaging substrate, so there is no need to occupy the surface space of the packaging substrate, thereby realizing the miniaturization and centralization of the inductor element. At the same time, the use of low-difficulty manufacturing processes and efficient processing equipment reduces production costs and improves production efficiency. These advantages make the one-piece molded inductor packaging substrate of the present invention have important application value in the miniaturization and high performance of electronic products.

[0012] A packaging substrate according to an embodiment of a second aspect of the present invention includes:

[0013] A plurality of dielectric layers, each of the dielectric layers comprises a magnetic part and a dielectric part, the dielectric part is arranged around the magnetic part, the same side surface of the magnetic part is provided with a conductive pattern, each of the magnetic parts further comprises a first through hole arranged therethrough, a connecting line is arranged in the first through hole, and the connecting line is electrically connected to the conductive patterns on two adjacent sides; each of the conductive patterns is connected in sequence to form a coil winding;

[0014] The magnetic parts are stacked correspondingly to form a magnetic core, and the coil winding is located inside the magnetic core.

[0015] According to some embodiments of the present invention, the conductive patterns on adjacent dielectric layers extend in different directions.

[0016] According to some embodiments of the present invention, projections of two conductive patterns of adjacent dielectric layers along a stacking direction of the dielectric layers form a closed annular structure.

[0017] According to some embodiments of the present invention, along the projection of the stacking direction, positions of the first through holes overlap.

[0018] According to a third aspect of the present invention, a method for manufacturing a packaging substrate includes the following steps:

[0019] S100, manufacturing a first conductive pattern on a surface of a first dielectric layer;

[0020] S200, forming a second dielectric layer covering the first conductive pattern on a surface of the first dielectric layer;

[0021] S300, forming a first through hole in the second dielectric layer to expose the first conductive pattern, and forming a connection line electrically connected to the first conductive pattern in the first through hole;

[0022] S400, manufacturing a second conductive pattern electrically connected to the connecting line on the surface of the second dielectric layer;

[0023] S500, using the second dielectric layer as a new first dielectric layer, and using the second conductive pattern as a new first conductive pattern, repeating dielectric layer adding, punching, and conductive pattern generation operations until the number of layers of the dielectric layer reaches a preset number of layers;

[0024] S600, the conductive patterns are connected to form a coil winding, a first mounting hole extending along the axial direction of the coil winding is provided in the coil winding, and the coil winding is wound in the first mounting hole;

[0025] S700: Fill the first mounting hole with magnetic paste to form a magnetic core.

[0026] According to some embodiments of the present invention, two opposite sides of the substrate are used as surfaces of the first dielectric layer, and the operations of step S100 to step S500 are performed simultaneously;

[0027] The substrate has a second through hole passing through two sides, a conducting circuit is formed in the second through hole, and the conducting circuit is used to electrically connect the conductive patterns on two sides of the substrate;

[0028] Furthermore, in step S600, the first mounting hole penetrates the substrate and the dielectric layers on both sides of the substrate.

[0029] According to a fourth aspect of the present invention, a method for manufacturing a package substrate comprises the following steps:

[0030] S100, manufacturing a first conductive pattern on the surface of the substrate;

[0031] S200, forming a first magnetic portion covering the first conductive pattern on the surface of the substrate;

[0032] S300, forming a first through hole in the first magnetic portion to expose the first conductive pattern, and forming a connection line in the first through hole to be electrically connected to the first conductive pattern;

[0033] S400, manufacturing a second conductive pattern electrically connected to the connecting line on the surface of the first magnetic portion;

[0034] S500, forming a second magnetic portion covering the second conductive pattern on a surface of the first magnetic portion;

[0035] S600, using the second magnetic part as a new first magnetic part, and using the second conductive pattern as a new first conductive pattern to repeat the punching and conductive pattern generation operations until the punching and conductive pattern generation operations reach a preset number of repetitions; wherein the magnetic parts are stacked to form a magnetic core, the conductive patterns are connected to form a coil winding, and the coil winding is located in the magnetic core.

[0036] According to some embodiments of the present invention, in step S200, the following is further included:

[0037] A first dielectric portion covering the first magnetic portion is formed on the surface of the substrate, and the first dielectric portion is ground flat until the first magnetic portion is exposed;

[0038] And / or, the step S500 further includes:

[0039] A second dielectric portion covering the second magnetic portion is formed on a surface of the first dielectric portion, and the second dielectric portion is ground flat until the second magnetic portion is exposed.

[0040] According to some embodiments of the present invention, the operations of step S100 to step S600 are performed simultaneously on two opposite sides of the substrate;

[0041] The substrate has second through holes penetrating at two sides, and a conducting circuit is formed in the second through hole. The conducting circuit is used to electrically connect the conductive patterns at two sides of the substrate.

[0042] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0044] Figure 1 Schematic cross-sectional view of a package substrate according to an embodiment of the first aspect of the present invention (from Figure 2 diagonal section shown);

[0045] Figure 2 A schematic diagram of a coil winding and a magnetic core according to an embodiment of the first aspect of the present invention;

[0046] Figure 3 Schematic cross-sectional view of a packaging substrate according to an embodiment of the second aspect of the present invention (from Figure 4 diagonal section shown);

[0047] Figure 4 A schematic diagram of a coil winding and a magnetic core according to an embodiment of the second aspect of the present invention;

[0048] Figure 5 A schematic diagram of the steps of a method for manufacturing a packaging substrate according to an embodiment of the third aspect of the present invention;

[0049] Figure 6 A schematic structural diagram of a packaging substrate according to an embodiment of the third aspect of the present invention;

[0050] Figure 7A schematic diagram of the steps of a method for manufacturing a packaging substrate according to a fourth aspect of an embodiment of the present invention;

[0051] Figure 8 It is a schematic structural diagram of a packaging substrate according to an embodiment of the fourth aspect of the present invention.

[0052] Reference numerals:

[0053] Dielectric layer 100; first dielectric layer 101; second dielectric layer 102; conductive pattern 110; first conductive pattern 111; second conductive pattern 112; first through hole 120; connecting line 130; first magnetic part 140; first dielectric part 145; second magnetic part 150;

[0054] Base 200; first mounting hole 210; second through hole 220; conducting circuit 230;

[0055] Magnetic core 300; magnetic paste 310; magnetic film 320; DETAILED DESCRIPTION

[0056] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0057] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0058] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0059] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0060] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0061] Inductors are essential components in electronic circuits. They can block current, transform voltage, couple, and work with capacitors for tuning, filtering, and frequency division. Traditional inductor designs are mainly divided into two types: plug-in and SMD. Plug-in inductors have the advantages of simple structure and easy manufacturing because their winding coils are directly wound on a hollow or magnetic core, but they occupy a large space and are not conducive to the miniaturization and integration of the system. Although SMD inductors reduce the volume to a certain extent, they still need to be attached to the surface of the packaging substrate, occupying the surface space of the packaging substrate, and it is difficult to meet the current pursuit of high integration and miniaturization.

[0062] In order to solve the above problems, the first embodiment of the present application proposes a packaging substrate, which includes a plurality of dielectric layers 100, and each dielectric layer 100 is stacked in sequence. It should be noted that the dielectric layer 100 is usually made of insulating materials (such as resin, glass fiber, etc.). These materials not only have excellent insulation properties, but also have good mechanical strength and heat resistance, and can play the role of electrical insulation and physical support. The same side surface of each dielectric layer 100 is provided with a conductive pattern 110. For example, in Figure 1 In the illustrated embodiment, the top surface of each dielectric layer 100 is provided with a conductive pattern 110, which is usually formed by etching on a metal plating layer. The conductive pattern 110 has good conductivity and can play a role in signal transmission or energy transfer. The conductive pattern 110 can be a straight line, an arc line or other set shapes.

[0063] Each dielectric layer 100 is stacked by lamination technology, and adjacent dielectric layers 100 are connected to each other to form an overall circuit board structure. Figure 1 As shown, for the convenience of distinction, each dielectric layer 100 is named as the first dielectric layer 101, the second dielectric layer 102, the third dielectric layer, etc. along the direction away from the substrate 200. It can be found that the first dielectric layer 101 covers the conductive pattern 110 of the substrate 200, the second dielectric layer 102 covers the conductive pattern 110 of the first dielectric layer 101, and so on.

[0064] Corresponding to the position of the conductive pattern 110, each dielectric layer 100 includes a first through hole 120, and the first through hole 120 penetrates the dielectric layer 100 to expose the conductive pattern 110. A connecting line 130 is provided in the first through hole 120, and the connecting line 130 is electrically connected to the conductive patterns 110 on the adjacent two sides. It should be noted that the connecting line 130 can be formed by a process such as electroplating copper, or the connecting line 130 can also be formed by filling the first through hole 120 with a conductive material. The two ends of the connecting line 130 extend to the two sides of the dielectric layer 100, respectively, and are electrically connected to the conductive patterns 110 on both sides of the same dielectric layer 100. For example: in the case of Figure 1 In the illustrated embodiment, the lower end of the first through hole 120 on the first dielectric layer 101 is connected to the conductive pattern 110 on the substrate 200 , and the upper end of the first through hole 120 is connected to the conductive pattern 110 on the first dielectric layer 101 .

[0065] It should be noted that if Figure 2 As shown, by designing the circuit of the conductive pattern 110 and setting the position of the connecting line 130, the end of each conductive pattern 110 can be electrically connected to the beginning of the next conductive pattern 110, so that each conductive pattern 110 is connected end to end in sequence to form a coil winding similar to a spiral structure. When current passes through the winding, a magnetic field is generated around it. When the current increases, the magnetic field in the winding increases, converting electrical energy into magnetic energy for storage; when the current decreases, the magnetic field decreases, and the magnetic energy is converted into electrical energy for release. This process of energy storage and release is the basis for the inductor to filter, smooth and stabilize the current in the circuit.

[0066] In addition, the package substrate also includes a first mounting hole 210 that runs through each dielectric layer 100. It should be noted that the first mounting hole 210 needs to be arranged in the coil winding arrangement, and the first mounting hole 210 is filled with a magnetic paste 310, that is, the coil winding is wound around the magnetic paste 310 arrangement. It should be explained that the magnetic paste 310 is a composite material made of a variety of materials such as magnetic powder, viscosity modifier and antioxidant, and has good filling, adhesion and plasticity. When filled in the first mounting hole 210, a stable columnar structure can be formed, thereby playing a role similar to the magnetic core 300 in the prior art. The setting of the magnetic paste 310 can concentrate and guide the magnetic field lines generated by the coil winding, so that the magnetic field is more concentrated and intense inside the magnetic paste 310, so as to increase the inductance value, so that the inductor has a stronger filtering, energy storage and regulation effect in the circuit.

[0067] The magnetic paste 310 fits tightly against the hole wall of the first mounting hole 210 to prevent the magnetic core 300 structure formed by the magnetic paste 310 from shaking or falling off in the first mounting hole 210. It is understandable that due to the plasticity of the magnetic paste 310, the first mounting hole 210 can be a square hole, a circular hole or a hole structure of other shapes. Figure 2 In the illustrated embodiment, along the projection of the stacking direction of each dielectric layer 100, each conductive pattern 110 forms a square closed ring. For this reason, the first mounting hole 210 is set as a square hole, so that the distance from each point on the conductive pattern 110 to the magnetic paste 310 is equal, thereby ensuring the stability of the inductor operation. It is understandable that in other embodiments, the conductive pattern 110 can also be set to other set shapes, such as a straight line, an arc, a circular ring, etc.

[0068] The second embodiment of the present application also proposes another packaging substrate, such as Figure 3 and Figure 4 As shown, the packaging substrate also includes multiple dielectric layers 100. What is different from the first embodiment is that the dielectric layer 100 of the packaging substrate is divided into a magnetic part and a dielectric part. The magnetic part is formed of a magnetic material, and the dielectric part is formed of an insulating material. The dielectric part is arranged around the magnetic part to play a supporting, insulating and bonding role. A conductive pattern 110 is arranged on the same side surface of each magnetic part. Each magnetic part also includes a first through hole 120 that is arranged through, and a connecting line 130 is arranged in the first through hole 120. The connecting line 130 is electrically connected to the conductive patterns 110 on the adjacent two sides. Each conductive pattern 110 is connected in sequence to form a conductive pattern 110 as shown in FIG. Figure 4 When each dielectric layer 100 is added on the substrate, each magnetic part is stacked to form a magnetic core 300, and the coil winding is located inside the magnetic core 300, so that the filtering, energy storage and regulation effects of the inductor are achieved through the cooperation of the coil and the magnetic core 300.

[0069] It is understandable that the conductive pattern 110, the connecting line 130, etc. in the second embodiment have the same functions as those in the first embodiment, and will not be described in detail here.

[0070] It should be noted that in the first aspect of the embodiment, the coil winding is formed on the outside of the magnetic core 300, and the manufacturing process is relatively simple. It is possible to add drilling, filling magnetic paste 310 and other workstations based on the original packaging substrate production line, so that it can be suitable for the production of packaging substrates of integrated inductors. In addition, there is less magnetic material, which can better control costs.

[0071] In the second embodiment, the coil winding is formed inside the magnetic core 300, and the coil and the magnetic core 300 are better fitted, effectively avoiding the vibration of the coil, thereby significantly reducing the inductor whistling sound. In addition, the closure of the magnetic circuit is also achieved, effectively reducing the magnetic field leakage, thereby enhancing the anti-electromagnetic interference ability of the inductor element.

[0072] Further, for the package substrates of the first embodiment and the second embodiment, the conductive patterns 110 on adjacent dielectric layers 100 extend in different directions. It should be noted that, in some embodiments, Figure 2 and Figure 4 As shown, the conductive pattern 110 is two intersecting straight-line conductors, and the conductive patterns 110 of two adjacent dielectric layers 100 are symmetrically arranged, and the projection along the stacking direction of the dielectric layer 100, the conductive patterns 110 of two adjacent dielectric layers 100 just form a closed ring structure. In other embodiments, the conductive pattern 110 can also be a semicircular shape, and the projection of the two conductive patterns 110 of two adjacent dielectric layers 100 can form a closed circular ring structure. Alternatively, the conductive pattern 110 can also be a unidirectional straight-line structure or a quarter-circular arc structure, so that the projection of the conductive patterns 110 of four adjacent dielectric layers 100 can form a closed circular ring structure. It can be understood that the conductive patterns 110 on each dielectric layer 100 can be adjusted according to the circuit design on the packaging substrate.

[0073] In such Figure 2 and Figure 4 In the embodiment shown, the conductive patterns 110 of the dielectric layers 100 of odd-numbered layers are the same, and the conductive patterns 110 of the conductive layers of even-numbered layers are the same, so that the etching process of the conductive patterns 110 of each layer can use the same mask (or exposure pattern) and the same processing parameters to reduce the manufacturing difficulty and manufacturing cost of the conductive patterns 110. In other embodiments, the conductive patterns 110 of each layer can also be different. It should be noted that the positions of the first through holes 120 overlap in the projection along the stacking direction. Figure 2 In the illustrated embodiment, the connecting lines 130 are located at the upper left corner and the lower right corner of the diagram, so that when performing laser drilling or mechanical drilling operations, if the thickness of the dielectric layer 100 is consistent, the drilling point and the drilling depth are the same, and only the height position of the laser head or the drill bit for starting drilling needs to be adjusted, thereby greatly reducing the processing difficulty during the dielectric layer 100 layer increase process and improving the processing efficiency.

[0074] A third aspect of the present application provides a method for manufacturing a packaging substrate, which is used to produce the packaging substrate of the first aspect of the present application. The method comprises the following steps:

[0075] S100, manufacturing a first conductive pattern 111 on the surface of the first dielectric layer 101;

[0076] like Figure 5As shown, the substrate 200 is an insulating material, and the substrate 200 is used as the first dielectric layer 101. Copper coating, exposure, development, etching and other operations are simultaneously performed on both sides of the substrate 200 to form a first conductive pattern 111. It can be understood that in other embodiments, the first conductive pattern 111 can also be manufactured by semi-additive method, laser direct imaging technology, inkjet printing technology, nano-imprinting technology, etc.

[0077] S200, forming a second dielectric layer 102 covering the first conductive pattern 111 on the surface of the first dielectric layer 101;

[0078] Specifically, the dielectric layer 100 is built up by ABF (Ajinomoto Build-up Film) material lamination technology. It should be noted that the build-up material does not only include ABF material, and the present application only uses ABF material as an example, which is not a limitation on the build-up material.

[0079] S300, forming a first through hole 120 exposing the first conductive pattern 111 in the second dielectric layer 102, and forming a connecting line 130 electrically connected to the first conductive pattern 111 in the first through hole 120;

[0080] Specifically, a blind hole laser drilling technology is used to perform a drilling operation on the ABF material, and the first through hole 120 is processed by a debonding, metal deposition or electroplating process, so as to form a connecting circuit 130 in the first through hole 120 .

[0081] S400, manufacturing a second conductive pattern 112 electrically connected to the connection line 130 on the surface of the second dielectric layer 102;

[0082] Specifically, processes such as resist removal, copper deposition, film lamination, exposure, development, electroplating, film stripping, and etching are performed to achieve a generation operation of the second conductive pattern 112 on the surface of the second dielectric layer 102 .

[0083] S500, using the second dielectric layer 102 as a new first dielectric layer 101, and using the second conductive pattern 112 as a new first conductive pattern 111, repeatedly performing dielectric layer 100 layer addition, hole punching, and conductive pattern generation operations until the number of dielectric layers 100 reaches a preset number of layers;

[0084] It should be explained that the dielectric layer 100 layer addition operation corresponds to step S200, the hole punching operation corresponds to step S300, and the conductive pattern generation operation corresponds to step S400. After repeating steps S200 to S500 for multiple times, the following can be obtained: Figure 1 The structure of the multiple build-up circuits is shown (only one side of the substrate 200 is shown as an example).

[0085] S600, the conductive patterns are connected to form a coil winding, a first mounting hole 210 extending along the axial direction of the coil winding is opened in the coil winding, and the coil winding is wound in the first mounting hole 210;

[0086] Specifically, the first mounting hole 210 can be processed by mechanical drilling or laser grooving.

[0087] S700 , filling the first mounting hole 210 with the magnetic paste 310 to form the magnetic core 300 .

[0088] Finally, an insulating protection layer may be added on the outermost dielectric layer 100 to prevent the magnetic core 300 from being exposed to the air.

[0089] It should be explained that, in some embodiments, Figure 5 and Figure 6 As shown, two opposite sides of the substrate 200 can be used as the surface of the first dielectric layer 101, so that the operations of step S100 to step S500 are performed simultaneously to form a multi-layer build-up structure on both sides of the substrate 200. In this structure, before step S100, the substrate 200 has a second through hole 220 penetrating on both sides, and a conductive line 230 is formed in the second through hole 220. The conductive line 230 can be formed by metal deposition, electroplating, etc. The conductive line 230 is used to electrically connect the conductive patterns on both sides of the substrate 200.

[0090] Correspondingly, for the structure of double-sided build-up of the substrate 200, in step S600, the first mounting hole 210 needs to penetrate the substrate 200 and the dielectric layer 100 on both sides of the substrate 200, so as to form an integrated battery cell in the packaging substrate.

[0091] It is understandable that, compared with adding layers on one side of the substrate 200 , adding layers on both sides of the substrate 200 has higher processing efficiency, and, compared with drilling blind holes on one side of the substrate 200 , the processing difficulty is lower when the first mounting hole 210 is a through hole.

[0092] The fourth aspect of the present application provides another packaging substrate manufacturing method, which is used to manufacture and process the packaging substrate of the second aspect of the present application. Figure 7 As shown, the production method comprises the following steps:

[0093] S100, manufacturing a first conductive pattern 111 on the surface of the substrate 200;

[0094] S200, forming a first magnetic portion 140 covering the first conductive pattern 111 on the surface of the substrate 200;

[0095] It should be noted that the first magnetic portion 140 is a magnetic film 320. In this step, a magnetic film 320 of a suitable area size is selected and pressed on the substrate 200 to cover the first conductive pattern 111. In other embodiments, the magnetic film 320 can also be directly prepared on the substrate 200 by combining physical and chemical methods. It should be explained that the magnetic film 320 is also called a magnetic film material, which is a ferromagnetic material layer with a thickness of more than ten microns to several hundred microns, generally a planar structure, suitable for direct pressing / covering on the line.

[0096] Furthermore, step S200 also includes the following steps:

[0097] S250, forming a first dielectric portion 145 covering the first magnetic portion 140 on the surface of the substrate 200, grinding the first dielectric portion 145 until the first magnetic portion 140 is exposed, the first dielectric portion 145 is made of insulating material, and plays a supporting and insulating role.

[0098] S300, forming a first through hole 120 exposing the first conductive pattern 111 in the first magnetic portion 140, and forming a connecting line 130 electrically connected to the first conductive pattern 111 in the first through hole 120;

[0099] S400, manufacturing a second conductive pattern 112 electrically connected to the connection line 130 on the surface of the first magnetic portion 140;

[0100] S500, forming a second magnetic portion 150 covering the second conductive pattern 112 on the surface of the first magnetic portion 140;

[0101] Furthermore, step S500 also includes the following steps:

[0102] S550 , forming a second dielectric portion covering the second magnetic portion 150 on the surface of the first dielectric portion 145 , and grinding the second dielectric portion until the second magnetic portion 150 is exposed.

[0103] S600, using the second magnetic portion 150 as a new first magnetic portion 140, and using the second conductive pattern 112 as a new first conductive pattern 111 to repeatedly perform punching and conductive pattern generation operations until the punching and conductive pattern generation operations reach a preset number of repetitions;

[0104] The magnetic parts are stacked to form magnetism, the conductive patterns are connected to form coil windings, and the coil windings are located in the magnetic core 300 .

[0105] It can be understood that the coil winding of the packaging substrate manufactured by this method is located in the magnetic core 300 , which can achieve close fitting between the coil winding and the magnetic core 300 .

[0106] Further, such as Figure 8As shown, the operations of step S100 to step S600 are performed simultaneously on two opposite sides of the substrate 200, wherein, before step S100, the substrate 200 has a second through hole 220 passing through both sides, and a conductive line 230 is formed in the second through hole 220, and the conductive line 230 is used to electrically connect the conductive patterns on both sides of the substrate 200.

[0107] In summary, compared to the prior art in which the coil winding and the magnetic core 300 of the inductor need to be arranged on the surface of the packaging substrate, in the embodiment of the present application, the magnetic core 300 and the coil winding are integrated into the packaging substrate during the manufacturing process of the packaging substrate, so there is no need to occupy the surface space of the packaging substrate, thereby realizing the miniaturization and centralization of the inductor element. At the same time, the use of low-difficulty manufacturing processes and efficient processing equipment reduces production costs and improves production efficiency. These advantages make the one-piece molded inductor packaging substrate of the present invention have important application value in the miniaturization and high performance of electronic products, and can achieve the following effects:

[0108] 1. Magnetic shielding structure, closed magnetic circuit, strong anti-electromagnetic interference, good EMI (electromagnetic interference) suppression effect;

[0109] The present invention optimizes the layout and packaging structure of magnetic materials, buries the coil structure in the magnetic material, and achieves the closure of the magnetic circuit through one-piece molding, effectively reducing magnetic field leakage, thereby enhancing the anti-electromagnetic interference ability of the inductor component. At the same time, this design also significantly improves the EMI suppression effect, protects the surrounding electronic components from electromagnetic noise interference, and improves the stability and reliability of the entire system.

[0110] 2. No lead terminals, small parasitic inductance;

[0111] Compared with traditional inductors, the one-piece molding design adopted by the present invention eliminates the lead ends and reduces the parasitic inductance introduced by the leads. The reduction of parasitic inductance means the reduction of energy loss during signal transmission and the improvement of signal integrity. This is especially important for high-frequency and high-speed signal transmission.

[0112] 3. Strong current carrying capacity, can work continuously for a long time in a high current environment with low power consumption;

[0113] The inductor design of the present invention fully considers heat dissipation and current carrying capacity. By selecting high thermal conductivity packaging materials and optimizing the internal structure layout, it achieves continuous and stable operation under high current environment. At the same time, the low power consumption characteristics ensure that even under long-term high-load operation, the inductor component can maintain a low temperature and extend its service life.

[0114] 4. Small size, low side, saving PCB (printed circuit board) space;

[0115] By directly embedding the magnetic material into the package substrate and combining it with advanced manufacturing technology, the present invention successfully achieves the miniaturization and micro-miniaturization of the inductor element. This design greatly saves space on the PCB and provides strong support for the miniaturization and integration of electronic devices.

[0116] 5. The inductor whistles little (the coil and magnetic powder are tightly combined, and the structure avoids coil vibration);

[0117] Howling sound is the noise generated by the inductor component due to the vibration of the coil at a specific frequency. The inductor design of the present invention effectively avoids the vibration of the coil by ensuring the close combination of the coil and the magnetic material and optimizing the structural layout, thereby significantly reducing the inductor howling sound.

[0118] 6. The DC resistance (DCR) is the lowest among the same size.

[0119] DCR is one of the important indicators for measuring the performance of inductor components. The inductor design of the present invention achieves the lowest DC impedance under the same size by finely controlling the coil winding process and the filling density of the magnetic material. Low DCR means that energy loss can be reduced in DC applications and system efficiency can be improved.

[0120] The one-piece molded inductor of the present invention performs well in magnetic shielding, anti-electromagnetic interference, parasitic inductance, current carrying capacity, volume, howling sound and DC impedance, etc. It reduces the magnetic shielding characteristics of the leakage magnetic flux of the magnetic inductor and realizes the one-piece molded magnetic paste 310 / magnetic film 320 inductor structure design, and is an indispensable high-performance component in modern electronic devices.

[0121] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A packaging substrate, characterized in that: include: A plurality of dielectric layers, each of which is stacked in sequence, and each of which is provided with a conductive pattern on the same side surface, and each of which further comprises a first through hole provided therethrough, and a connecting line is provided in the first through hole, and the connecting line is electrically connected to the conductive patterns on two adjacent sides; one end of each of the conductive patterns is connected to the conductive pattern of the previous layer through the connecting line, and the other end is connected to the conductive pattern of the next layer through the connecting line, and each of the conductive patterns is connected in sequence to form a coil winding; The packaging substrate further comprises a first mounting hole penetrating through each of the dielectric layers, the first mounting hole is filled with magnetic paste to form a magnetic core, and the coil winding is wound around the magnetic core.

2. A packaging substrate, characterized in that: include: A plurality of dielectric layers, each of the dielectric layers comprises a magnetic part and a dielectric part, the dielectric part is arranged around the magnetic part, the same side surface of the magnetic part is provided with a conductive pattern, each of the magnetic parts further comprises a first through hole arranged therethrough, a connecting line is arranged in the first through hole, and the connecting line is electrically connected to the conductive patterns on two adjacent sides; each of the conductive patterns is connected in sequence to form a coil winding; The magnetic parts are stacked correspondingly to form a magnetic core, and the coil winding is located inside the magnetic core.

3. The packaging substrate according to claim 1 or 2, characterized in that: The conductive patterns on adjacent dielectric layers extend in different directions.

4. The packaging substrate according to claim 3, characterized in that: The projections of the two conductive patterns of the adjacent dielectric layers along the stacking direction of the dielectric layers form a closed ring structure.

5. The packaging substrate according to claim 4, characterized in that: In the projection along the stacking direction, positions of the first through holes overlap.

6. A method for manufacturing a packaging substrate, for forming the packaging substrate according to claim 1, characterized in that: The following steps are involved: S100, manufacturing a first conductive pattern on a surface of a first dielectric layer; S200, forming a second dielectric layer covering the first conductive pattern on a surface of the first dielectric layer; S300, forming a first through hole in the second dielectric layer to expose the first conductive pattern, and forming a connection line electrically connected to the first conductive pattern in the first through hole; S400, manufacturing a second conductive pattern electrically connected to the connecting line on the surface of the second dielectric layer; S500, using the second dielectric layer as a new first dielectric layer, and using the second conductive pattern as a new first conductive pattern, repeating dielectric layer adding, punching, and conductive pattern generation operations until the number of layers of the dielectric layer reaches a preset number of layers; S600, the conductive patterns are connected to form a coil winding, a first mounting hole extending along the axial direction of the coil winding is provided in the coil winding, and the coil winding is wound in the first mounting hole; S700: Fill the first mounting hole with magnetic paste to form a magnetic core.

7. The method for manufacturing a packaging substrate according to claim 6, characterized in that: Using two opposite sides of the substrate as surfaces of the first dielectric layer respectively, and simultaneously performing operations from step S100 to step S500; The substrate has a second through hole passing through two sides, a conducting circuit is formed in the second through hole, and the conducting circuit is used to electrically connect the conductive patterns on two sides of the substrate; Furthermore, in step S600, the first mounting hole penetrates the substrate and the dielectric layers on both sides of the substrate.

8. A method for manufacturing a packaging substrate, for forming the packaging substrate according to claim 2, characterized in that: The following steps are involved: S100, manufacturing a first conductive pattern on the surface of the substrate; S200, forming a first magnetic portion covering the first conductive pattern on the surface of the substrate; S300, forming a first through hole in the first magnetic portion to expose the first conductive pattern, and forming a connection line in the first through hole to be electrically connected to the first conductive pattern; S400, manufacturing a second conductive pattern electrically connected to the connecting line on the surface of the first magnetic portion; S500, forming a second magnetic portion covering the second conductive pattern on a surface of the first magnetic portion; S600, using the second magnetic part as a new first magnetic part, and using the second conductive pattern as a new first conductive pattern to repeat the punching and conductive pattern generation operations until the punching and conductive pattern generation operations reach a preset number of repetitions; wherein the magnetic parts are stacked to form a magnetic core, the conductive patterns are connected to form a coil winding, and the coil winding is located in the magnetic core.

9. The method for manufacturing a packaging substrate according to claim 8, characterized in that: In the step S200, it also includes: A first dielectric portion covering the first magnetic portion is formed on the surface of the substrate, and the first dielectric portion is ground flat until the first magnetic portion is exposed; And / or, the step S500 further includes: A second dielectric portion covering the second magnetic portion is formed on a surface of the first dielectric portion, and the second dielectric portion is ground flat until the second magnetic portion is exposed.

10. The method for manufacturing a packaging substrate according to claim 8, characterized in that: Performing the operations of step S100 to step S600 simultaneously on two opposite sides of the substrate; The substrate has second through holes penetrating at two sides, and a conducting circuit is formed in the second through hole. The conducting circuit is used to electrically connect the conductive patterns at two sides of the substrate.

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