Bonding device

Abstract

A bonding device relates to the technical field of semiconductors. The invention provides a bonding device. The bonding device comprises an adsorption assembly, a bonding assembly and a base station, a suction nozzle of the adsorption assembly is used for adsorbing a chip, and the base station is provided with a bonding station for bearing a wafer; the bonding assembly comprises a turntable and a plurality of bonding heads arranged on the turntable, the turntable is driven to rotate so as to drive the plurality of bonding heads to be sequentially opposite to the position of the suction nozzle, and when the bonding heads are opposite to the position of the suction nozzle, the bonding heads suck the chips on the suction nozzle; and the turntable is driven to continuously rotate so as to drive the bonding heads adsorbed with the chips to be sequentially opposite to the bonding stations of the base station, and when the bonding heads adsorbed with the chips are opposite to the bonding stations, the bonding heads drive the chips to be bonded with wafers in the bonding stations. According to the bonding device, the bonding speed, the bonding precision and the production efficiency can be improved through alternate rotation cooperation of the multiple suction nozzles and the bonding heads.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a bonding device. Background Art

[0002] In semiconductor manufacturing, wafer bonding is the process of connecting different semiconductor materials (such as chips) to wafers so that semiconductor devices can work properly. D2W (Die-to-Wafer) is a commonly used chip bonding technology, which is the process of bonding a single chip to a wafer.

[0003] Currently, the process mostly uses one or two bonding heads to press and connect the chip and wafer together. Only one or two bonding heads means that only one or two chips can be bonded at a time. For a large number of chips, a small number of bonding heads will limit the overall production speed, resulting in low production efficiency. Summary of the invention

[0004] The object of the present invention is to provide a bonding device, which can improve the bonding speed, bonding accuracy and production efficiency through the alternating rotation cooperation of multiple suction nozzles and a bonding head.

[0005] The embodiment of the present invention is achieved as follows:

[0006] According to one aspect of the present invention, a bonding device is provided, comprising an adsorption component, a bonding component and a base; the adsorption nozzle of the adsorption component is used to adsorb chips, and the base has a bonding station for carrying wafers; the bonding component comprises a turntable and a plurality of bonding heads arranged on the turntable, the turntable is driven to rotate to drive the plurality of bonding heads to be opposite to the positions of the adsorption nozzles in sequence, and when the bonding heads are opposite to the positions of the adsorption nozzles, the bonding heads adsorb the chips on the adsorption nozzles; the turntable is driven to continue to rotate to drive the bonding heads with the chips adsorbed to be opposite to the bonding station positions of the base in sequence, and when the bonding heads with the chips adsorbed are opposite to the bonding station positions, the bonding heads drive the chips to bond with the wafers in the bonding station.

[0007] Optionally, the bonding assembly also includes a coarse calibration lens, a light path alignment channel is arranged in the bonding head, the light path alignment channel extends along the bonding direction, and a first opening connected to the light path alignment channel is arranged on the side wall of the bonding head. The coarse calibration lens can be movably arranged in the light path alignment channel through the first opening.

[0008] Optionally, the bonding assembly further comprises a precision calibration lens, and the side wall of the bonding head is provided with a second opening connected to the optical path alignment channel, and the precision calibration lens can be movably arranged in the optical path alignment channel through the second opening.

[0009] Optionally, the bonding assembly further comprises a micro-motor, which is drivingly connected to the bonding head, and is used for driving the bonding head to rotate around its own axis.

[0010] Optionally, the adsorption assembly includes a rotating part and a plurality of suction nozzles arranged on the rotating part, the plurality of suction nozzles are eccentrically arranged relative to the rotation axis of the rotating part, and the plurality of suction nozzles are arranged in sequence and spaced apart along the rotation direction of the rotating part.

[0011] Optionally, the suction nozzle is hinged to the rotating part.

[0012] Optionally, the bonding heads are evenly distributed along the circumference of the turntable.

[0013] Optionally, the bonding head includes a tube body and a main body for adsorbing the chip, the tube body is vertically inserted into the turntable, the main body is movably connected to one end of the tube body, and the main body is telescopically connected to the tube body so that the main body can be telescoped toward or away from the base.

[0014] Optionally, the bonding assembly further includes a pressure regulator, which is connected to the body and is used to adjust the bonding pressure between the chip adsorbed by the body and the wafer.

[0015] Optionally, the bonding assembly further includes a temperature regulator, which is connected to the body and is used to adjust the bonding temperature between the chip adsorbed by the body and the wafer.

[0016] The beneficial effects of the present invention include:

[0017] The present application provides a bonding device, including an adsorption component, a bonding component and a base; the suction nozzle of the adsorption component is used to adsorb chips, and the base has a bonding station for carrying wafers; the bonding component includes a turntable and a plurality of bonding heads arranged on the turntable, the turntable is driven to rotate to drive the plurality of bonding heads to be opposite to the position of the suction nozzle in turn, and when the bonding head and the suction nozzle are opposite, the bonding head absorbs the chip on the suction nozzle; the turntable is driven to continue to rotate to drive the bonding head with the adsorbed chip to be opposite to the bonding station position of the base in turn, and when the bonding head with the adsorbed chip is opposite to the bonding station position, the bonding head drives the chip to bond with the wafer in the bonding station. Through the alternating rotation of the suction nozzle and the bonding head, the uninterrupted adsorption operation is realized, which greatly improves the efficiency of adsorbing and transporting chips; the turntable drives the plurality of bonding heads to rotate in turn, so that the plurality of bonding heads bond the chip with the wafer on the base in turn, which reduces the mechanical motion error and improves the alignment accuracy during bonding. The bonding device can improve the bonding speed, bonding accuracy and production efficiency through the alternating rotation cooperation of multiple suction nozzles and the bonding head. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 One of the structural schematic diagrams of the bonding device provided in the embodiment of the present invention;

[0020] Figure 2 A second structural schematic diagram of a bonding device provided in an embodiment of the present invention;

[0021] Figure 3 A schematic structural diagram of a bonding head of a bonding device provided in an embodiment of the present invention.

[0022] Icons: 100-bonding device; 110-adsorption assembly; 111-rotating part; 1111-first support rod; 1112-second support rod; 112-suction nozzle; 113-rotating motor; 120-bonding assembly; 121-turntable; 122-bonding head; 1221-tube body; 1222-main body; 1223-optical path alignment channel; 123-coarse calibration lens; 124-fine calibration lens; 125-micro motor; 130-base; 200-chip. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0026] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0027] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0028] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] Please refer to Figure 1 The present embodiment provides a bonding device 100, comprising an adsorption component 110, a bonding component 120 and a base 130; the suction nozzle 112 of the adsorption component 110 is used to adsorb the chip 200, and the base 130 has a bonding station for carrying the wafer; the bonding component 120 comprises a turntable 121 and a plurality of bonding heads 122 arranged on the turntable 121, the turntable 121 is driven to rotate to drive the plurality of bonding heads 122 to be opposite to the position of the suction nozzle 112 in turn, and when the bonding heads 122 are opposite to the position of the suction nozzle 112, the bonding heads 122 absorb the chip 200 on the suction nozzle 112; the turntable 121 is driven to continue to rotate to drive the bonding heads 122 with the chip 200 adsorbed to be opposite to the bonding station position of the base 130 in turn, and when the bonding heads 122 with the chip 200 adsorbed are opposite to the bonding station position, the bonding heads 122 drive the chip 200 to bond with the wafer in the bonding station.

[0030] Specifically, the present application provides a bonding device 100, such as Figure 1As shown, it mainly includes three parts: an adsorption component 110, a bonding component 120 and a base 130. Among them, the adsorption component 110 includes a rotating part 111 and a suction nozzle 112. The rotating part 111 can drive the suction nozzle 112 to rotate along the horizontal plane, so that the suction nozzle 112 adsorbs the chip 200 and moves the chip 200 under the bonding component 120. The bonding component 120 can adsorb the chip 200 on the suction nozzle 112. At this time, the suction nozzle 112 rotates again under the action of the rotating part 111 to pick up and adsorb the chip 200.

[0031] The bonding assembly 120 includes a turntable 121 and a plurality of bonding heads 122 disposed on the turntable 121. The bonding heads 122 are used to adsorb the chip 200 on the suction nozzle 112. In order to cooperate with the adsorption assembly 110 to improve the bonding efficiency, the turntable 121 can drive the plurality of bonding heads 122 to rotate relative to the suction nozzle 112. In this process, the suction nozzle 112 adsorbs the chip 200 and moves the chip 200 below the bonding assembly 120. A bonding head 122 located above the suction nozzle 112 adsorbs the chip 200 on the suction nozzle 112. At the same time, the turntable 121 and the rotating part 111 rotate together, so that the suction nozzle 112 adsorbs the chip 200 again and aligns with the bonding head 122. After multiple alternating rotations, each bonding head 122 on the turntable 121 can adsorb the chip 200 in a short time.

[0032] Compared with the existing bonding method using only one or two bonding heads, the present application realizes uninterrupted adsorption operation by alternately rotating the adsorption component 110 and the bonding component 120, greatly improving the efficiency of adsorption and transfer of the chip 200, thereby improving the bonding efficiency.

[0033] The bonding apparatus 100 further includes a base 130 , a table top of which is used to place a wafer. The base 130 can move relative to the bonding assembly 120 to move the wafer to align with the bonding head 122 of the bonding assembly 120 .

[0034] After the bonding head 122 of the bonding assembly 120 is aligned with the wafer, the bonding head 122 can move toward the wafer to bond the chip 200 to the wafer. After the chip 200 on one of the bonding heads 122 is bonded to the wafer, the turntable 121 continues to rotate until the chip 200 on each bonding head 122 is bonded to the wafer in turn. During the whole process, the turntable 121 drives the multiple bonding heads 122 to rotate, and the bonding head 122 itself only moves vertically relative to the wafer, thereby reducing mechanical motion errors and improving alignment accuracy during bonding.

[0035] It should be noted that, in one possible implementation mode of the present application, first, Figure 1As shown, the adsorption assembly 110 includes a rotating portion 111 and a plurality of suction nozzles 112 disposed on the rotating portion 111 . The plurality of suction nozzles 112 are eccentrically disposed relative to the rotation axis of the rotating portion 111 , and the plurality of suction nozzles 112 are sequentially spaced apart along the rotation direction of the rotating portion 111 .

[0036] Specifically, Figure 1 As shown, the rotating part 111 is connected by a first support rod 1111 and a second support rod 1112. The first support rod 1111 and the second support rod 1112 are vertically connected to form a T-shaped structure. In order to further improve the stability of the rotating part 111, the first support rod 1111 can be arranged in the middle of the second support rod 1112 to balance the forces at both ends.

[0037] The first support rod 1111 drives the second support rod 1112 to rotate through the rotating motor 113, and the specific number of the second support rods 1112 can correspond to the specific number of the suction nozzles 112. Figure 1 As shown, the number of the suction nozzles 112 is 2, and the number of the second support rod 1112 is 1, and the two suction nozzles 112 are respectively arranged at opposite ends of the second support rod 1112. Similarly, the number of the suction nozzles 112 can also be 3. In this case, the number of the second support rods 1112 is 3, and the 3 support rods are in a Y-shaped structure, so that the 3 suction nozzles 112 are respectively arranged, so that the 3 suction nozzles 112 are evenly distributed.

[0038] It should be noted that the present application does not impose any restrictions on the specific number of suction nozzles 112 and second support rods 1112. In order to improve the bonding efficiency, multiple suction nozzles 112 can be provided. Similarly, in order to ensure the efficiency and reliability of the bonding process, the specific number of second support rods 1112 also corresponds to the specific number of suction nozzles 112, as long as the multiple suction nozzles 112 can be evenly distributed.

[0039] Second, the suction nozzle 112 is hinged to the rotating portion 111 .

[0040] For details, please refer to Figure 1 and Figure 2 , because the suction nozzle 112 is set downward when sucking the chip 200; and when the suction nozzle 112 is set relative to the bonding head 122, the bonding head 122 is also set upward for subsequent bonding with the wafer. Therefore, in order to facilitate the bonding head 122 to suck the chip 200 on the suction nozzle 112 and realize the transfer of the chip 200, the suction nozzle 112 can rotate relative to the end of the second support rod 1112 when sucking the chip 200 and rotating to the bottom of the bonding head 122, so that the suction nozzle 112 can be set upward, which is convenient for the subsequent bonding head 122 to suck the chip 200. Preferably, the suction nozzle 112 can rotate 180 degrees in the vertical direction around the end of the second support rod 1112.

[0041] Third, the bonding heads 122 are evenly distributed along the periphery of the turntable 121 .

[0042] Specifically, in order to improve the bonding accuracy and reduce the mechanical displacement error, the bonding assembly 120 can only drive the bonding head 122 to rotate through the turntable 121, and cannot move the bonding head 122 horizontally. Therefore, in order to ensure that each bonding head 122 can absorb the chip 200 on the suction nozzle 112, multiple bonding heads 122 are arranged on the periphery of the turntable 121 along the circumferential direction, and the multiple bonding heads 122 are evenly distributed to ensure that the chip 200 can be transported by rotation, thereby improving the efficiency and reliability of the bonding process.

[0043] Fourth, if Figure 2 As shown, the bonding head 122 includes a tube body 1221 and a main body 1222 for adsorbing the chip 200. The tube body 1221 is vertically penetrated through the turntable 121. The main body 1222 is movably connected to one end of the tube body 1221, and the main body 1222 is telescopically connected to the tube body 1221 so that the main body 1222 can be telescoped toward or away from the base 130.

[0044] Specifically, Figure 2 As shown, the bonding head 122 is composed of a tube body 1221 and a body 1222. The tube body 1221 is vertically penetrated in the turntable 121 so that the bonding head 122 is fixedly connected to the turntable 121, thereby improving the connection stability of the bonding assembly 120. The body 1222 is movably connected to the end of the tube body 1221. When the bonding head 122 needs to absorb the chip 200 on the suction nozzle 112, or when the bonding head 122 needs to press the absorbed chip 200 onto the wafer, the body 1222 can be extended from the tube body 1221 to approach the base 130. This arrangement reduces mechanical motion errors and further improves the alignment accuracy during bonding.

[0045] The bonding device 100 provided in the present application includes an adsorption component 110, a bonding component 120 and a base 130; the suction nozzle 112 of the adsorption component 110 is used to adsorb the chip 200, and the base 130 has a bonding station for carrying the wafer; the bonding component 120 includes a turntable 121 and a plurality of bonding heads 122 arranged on the turntable 121, the turntable 121 is driven to rotate to drive the plurality of bonding heads 122 to be opposite to the position of the suction nozzle 112 in sequence, and when the bonding head 122 is opposite to the position of the suction nozzle 112, the bonding head 122 absorbs the chip 200 on the suction nozzle 112; the turntable 121 is driven to continue to rotate to drive the bonding head 122 with the chip 200 adsorbed to be opposite to the bonding station position of the base 130 in sequence, and when the bonding head 122 with the chip 200 adsorbed is opposite to the bonding station position, the bonding head 122 drives the chip 200 to bond with the wafer in the bonding station. By alternately rotating the suction nozzle 112 and the bonding head 122, the suction operation is continuously performed, which greatly improves the efficiency of suction and transfer of the chip 200; the turntable 121 drives the multiple bonding heads 122 to rotate in sequence, so that the multiple bonding heads 122 sequentially bond the chip 200 to the wafer on the base 130, reducing the mechanical motion error and improving the alignment accuracy during bonding. The above bonding device 100 can improve the bonding speed, bonding accuracy and production efficiency by alternately rotating the multiple suction nozzles 112 and the bonding heads 122.

[0046] For example, Figure 3 As shown, the bonding assembly 120 also includes a coarse calibration lens 123, and an optical path alignment channel 1223 is arranged in the bonding head 122, and the optical path alignment channel 1223 extends along the bonding direction. The side wall of the bonding head 122 is provided with a first opening connected to the optical path alignment channel 1223, and the coarse calibration lens 123 can be movably arranged in the optical path alignment channel 1223 through the first opening.

[0047] Specifically, Figure 3 As shown, when the chip 200 adsorbed on the bonding head 122 is bonded to the wafer, in order to improve the bonding accuracy, an optical path alignment channel 1223 is provided in the bonding head 122. The optical path alignment channel 1223 runs through the entire bonding head 122 along the bonding direction, so that the mark on the chip 200 can be aligned with the mark on the wafer by transmission in the optical path alignment channel 1223, thereby ensuring the accuracy of the bonding position between the chip 200 and the wafer.

[0048] A first opening connected to the optical path alignment channel 1223 is provided on the side wall of the bonding head 122. A coarse calibration lens 123 is also provided on the side wall of the bonding head 122. The coarse calibration lens 123 can be movably set in the optical path alignment channel 1223 through the first opening, so that the operator can achieve rough alignment between the mark on the chip 200 and the mark on the wafer through the end of the bonding head 122 through the optical path alignment channel 1223 and the coarse calibration lens 123.

[0049] Alternatively, if Figure 3 As shown, the bonding assembly 120 further includes a precision calibration lens 124 , and a side wall of the bonding head 122 is provided with a second opening connected to the optical path alignment channel 1223 , and the precision calibration lens 124 can be movably disposed in the optical path alignment channel 1223 through the second opening.

[0050] Specifically, in order to further improve the bonding accuracy, a second opening communicating with the optical path alignment channel 1223 is provided on the side wall of the bonding head 122. Figure 3 As shown, the side wall of the bonding head 122 is also provided with a precision calibration lens 124, and the precision calibration lens 124 can be movably set in the optical path alignment channel 1223 through the second opening, so that the operator can realize the precise alignment of the mark on the chip 200 with the mark on the wafer through the optical path alignment channel 1223 through the precision calibration lens 124 through the end of the bonding head 122.

[0051] For example, Figure 3 As shown, the bonding assembly 120 further includes a micro motor 125 , which is drivingly connected to the bonding head 122 , and is used to drive the bonding head 122 to rotate around its own axis.

[0052] Specifically, Figure 3 As shown, during the above-mentioned coarse alignment and fine alignment process, in order to facilitate the adjustment of the chip 200 and the wafer on the bonding head 122 through the alignment results to adjust the relative offset between the two, the bonding head 122 is also driven and connected with a micro motor 125. The micro motor 125 can control the body 1222 of the bonding head 122 to rotate slightly, thereby ensuring the precise alignment of the mark on the chip 200 with the mark on the wafer.

[0053] When aligning the existing chip and wafer, the coarse calibration lens or the fine calibration lens is often removed after alignment through the coarse calibration lens or the fine calibration lens, and then the chip and the wafer are bonded. During the bonding process, the alignment situation can no longer be observed, which easily leads to low bonding accuracy. However, the present application sets an optical path alignment channel 1223 on each bonding head 122, and movably sets a coarse calibration lens 123 or a fine calibration lens 124 on the optical path alignment channel 1223, so that the alignment situation can be observed at any time during the bonding process, which greatly improves the bonding accuracy.

[0054] In one possible implementation of the present application, the bonding assembly 120 further includes a pressure regulator (not shown in the figure), which is connected to the body 1222 and is used to adjust the bonding pressure between the chip 200 adsorbed by the body 1222 and the wafer.

[0055] Specifically, during the bonding process, different chips 200 and wafer materials and sizes may require different bonding pressures, and the bonding device 100 of the present application can flexibly adapt to these diverse requirements through the provision of a pressure regulator.

[0056] The present application sets a pressure regulator on the main body 1222, and the pressure regulator is connected to the controller. The controller can adjust the bonding pressure between the chip 200 adsorbed by the main body and the wafer through the pressure regulator. This direct connection method ensures the effectiveness and timeliness of the pressure regulation, so that the pressure regulator can quickly and accurately transfer the adjusted pressure to the bonding part, avoiding pressure loss, delay or unevenness caused by complex connection structure or indirect connection. Problems such as, thereby being able to more accurately control the actual pressure in the bonding process, and improving the bonding efficiency and reliability.

[0057] In one possible implementation of the present application, the bonding assembly 120 further includes a temperature regulator (not shown in the figure), which is disposed on the body 1222 and is used to adjust the temperature of the body 1222 for bonding the chip 200 to the wafer on the base 130 .

[0058] Specifically, by setting the temperature regulator, the bonding device 100 can actively and accurately control the bonding temperature. Since different chip 200 materials often have specific requirements for temperature, the setting of the temperature regulator makes the bonding device 100 have better applicability and flexibility, and also improves the bonding efficiency and reliability, and improves the product yield.

[0059] The above description is only an optional embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

[0060] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

Claims

1. A bonding device, characterized in that: The invention comprises an adsorption component (110), a bonding component (120) and a base (130); the adsorption nozzle (112) of the adsorption component (110) is used for adsorbing a chip (200); the base (130) has a bonding station for carrying a wafer; the bonding component (120) comprises a turntable (121) and a plurality of bonding heads (122) arranged on the turntable (121); the turntable (121) is driven to rotate so as to drive the plurality of bonding heads (122) to be opposite to the position of the adsorption nozzle (112) in sequence; and the bonding heads (122) are connected to the bonding station (121) and the bonding head ... 2) when the bonding head (122) is positioned opposite to the suction nozzle (112), the bonding head (122) sucks the chip (200) on the suction nozzle (112); the turntable (121) is driven to continue to rotate so as to drive the bonding head (122) with the chip (200) adsorbed thereon to be positioned opposite to the bonding station of the base (130) in sequence, and when the bonding head (122) with the chip (200) adsorbed thereon is positioned opposite to the bonding station, the bonding head (122) drives the chip (200) to be bonded to the wafer in the bonding station.

2. The bonding device according to claim 1, characterized in that The bonding assembly (120) further comprises a coarse calibration lens (123); an optical path alignment channel (1223) is arranged in the bonding head (122); the optical path alignment channel (1223) extends along the bonding direction; a first opening connected to the optical path alignment channel (1223) is arranged on a side wall of the bonding head (122); and the coarse calibration lens (123) can be movably arranged in the optical path alignment channel (1223) through the first opening.

3. The bonding device according to claim 2, characterized in that: The bonding assembly (120) further comprises a precision calibration magnifier (124); a side wall of the bonding head (122) is provided with a second opening connected to the optical path alignment channel (1223); and the precision calibration magnifier (124) can be movably arranged in the optical path alignment channel (1223) through the second opening.

4. The bonding device according to any one of claims 1 to 3, characterized in that: The bonding assembly (120) further comprises a micro-motor (125), wherein the micro-motor (125) is drivingly connected to the bonding head (122), and the micro-motor (125) is used to drive the bonding head (122) to rotate around its own axis.

5. The bonding device according to claim 1, characterized in that: The adsorption component (110) comprises a rotating part (111) and a plurality of suction nozzles (112) arranged on the rotating part (111); the plurality of suction nozzles (112) are eccentrically arranged relative to the rotation axis of the rotating part (111), and the plurality of suction nozzles (112) are arranged in sequence and at intervals along the rotation direction of the rotating part (111).

6. The bonding device according to claim 5, characterized in that: The suction nozzle (112) is hinged to the rotating part (111).

7. The bonding device according to claim 1, characterized in that: The plurality of bonding heads (122) are evenly distributed along the periphery of the turntable (121).

8. The bonding device according to claim 1, characterized in that: The bonding head (122) comprises a tube body (1221) and a main body (1222) for adsorbing the chip (200); the tube body (1221) is vertically inserted into the turntable (121); the main body (1222) is movably connected to one end of the tube body (1221); and the main body (1222) is telescopically connected to the tube body (1221) so that the main body (1222) can be telescopically moved toward or away from the base (130).

9. The bonding device according to claim 8, characterized in that: The bonding component (120) further comprises a pressure regulator, which is connected to the body (1222) and is used to adjust the bonding pressure between the chip (200) adsorbed by the body (1222) and the wafer.

10. The bonding device according to claim 8, characterized in that: The bonding component (120) further comprises a temperature regulator, which is connected to the body (1222) and is used to adjust the bonding temperature between the chip (200) adsorbed by the body (1222) and the wafer.

Images