Wafer lifting device

Abstract

The invention relates to a wafer lifting device, and belongs to the technical field of wafer cleaning equipment. According to the wafer lifting device, the fixed teeth are used for bearing the uncleaned wafer, before a mechanical arm grabs the wafer and places the wafer on the fixed teeth, the lifting teeth with the corresponding height firstly descend to be lower than the fixed teeth with the corresponding height, the fixed teeth support the wafer firstly, then the vertical moving seat drives the wafer to enter the cleaning equipment for air injection cleaning, and after cleaning is completed, the lifting teeth with the corresponding height descend to be lower than the fixed teeth with the corresponding height. When the wafer is cleaned, the lifting teeth ascend to jack up the wafer, so that the wafer is separated from the fixed teeth, the wafer can be blown again after the wafer is separated from the fixed teeth, namely, the lifting teeth are used for bearing the cleaned wafer, then the vertical moving seat descends, and the cleaned wafer is moved to the next station through the horizontal displacement mechanism. Therefore, the wafer lifting device can prevent dirt from polluting the cleaned wafer through the supporting teeth before cleaning and after cleaning respectively, and the cleanliness of the wafer is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer cleaning equipment, and in particular, relates to a wafer lifting device. Background Art

[0002] Korean invention patent document KR1020240115066A discloses a dryer with a lifting device for uniformly drying wafers. The wafers are blow-dried by the dryer. Before blow-drying, the wafers need to be placed on a support seat, and the wafers are sent into a drying tank by lifting the support seat. Blow-drying can achieve the drying of the wafers on the one hand, and the particles can also be blown away by blowing to clean the wafers.

[0003] However, the drying lifting device of the prior art always supports the wafer by a set of support seats, and the contact position remains unchanged. The wafer before cleaning contacts the support seats and contaminates the support seats. If the support seats continue to support the cleaned wafer, the wafer will be contaminated, resulting in incomplete wafer cleaning. Summary of the invention

[0004] The technical problem to be solved by the present invention is: to solve the deficiencies in the prior art, thereby providing a wafer lifting device that improves the cleanliness of the wafer.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A wafer lifting device, comprising:

[0007] Horizontal displacement mechanism;

[0008] The vertical displacement mechanism is arranged on the horizontal displacement mechanism and can be horizontally displaced by the action of the horizontal displacement mechanism;

[0009] A vertical moving seat is arranged on the vertical displacement mechanism and can be vertically displaced by the vertical displacement mechanism;

[0010] A rotating seat, arranged on the vertical moving seat;

[0011] A rotating mechanism, arranged on the vertical moving seat, for driving the rotating seat to rotate;

[0012] The fixed teeth are arranged on the top of the rotating seat;

[0013] Lifting teeth;

[0014] The lifting mechanism is arranged on the rotating seat and is used for driving the lifting teeth to move between a position higher than the fixed teeth and a position lower than the fixed teeth.

[0015] Preferably, in the wafer lifting device of the present invention, the fixed teeth include a first fixed tooth, a second fixed tooth and a third fixed tooth whose heights successively decrease to form a three-point support for the wafer; the lifting teeth include a first lifting tooth, a second lifting tooth and a third lifting tooth whose heights successively decrease to form a three-point support for the wafer; and they are arranged from one side to the other side of the rotating seat according to the first lifting tooth, the second fixed tooth, the third lifting tooth, the third lifting tooth, the third fixed tooth, the second lifting tooth and the first fixed tooth respectively.

[0016] Preferably, in the wafer lifting device of the present invention, the rotating mechanism includes a motor, a driving wheel arranged on the output shaft of the motor, a driven wheel connected to the driving wheel through a belt, and the driven wheel is connected to the rotating shaft of the rotating seat. When the motor is working, it drives the rotating seat to rotate.

[0017] Preferably, in the wafer lifting device of the present invention, the rotating seat comprises a base plate, a guide rod and a lifting seat, the lifting seat is slidably arranged on the guide rod, the lifting teeth are arranged on the lifting seat, and the lifting mechanism can drive the lifting seat to rise and fall along the guide rod.

[0018] Preferably, in the wafer lifting device of the present invention, the rotating seat is installed on the vertical moving seat through a bearing, the rotating shaft of the rotating seat is a hollow structure, and the driven wheel is also a hollow structure;

[0019] The lifting mechanism comprises: a cylinder and an air supply pipeline for supplying air to the cylinder, wherein the air supply pipeline passes through the hollow of the rotating shaft and the driven wheel and extends downward.

[0020] Preferably, in the wafer lifting device of the present invention, the cylinder is arranged on the bottom plate and located between the bottom plate and the lifting seat.

[0021] Preferably, in the wafer lifting device of the present invention, the first fixed tooth, the second fixed tooth and the third fixed tooth are arranged on a fixed tooth seat.

[0022] Preferably, in the wafer lifting device of the present invention, the fixed gear seat has a hollow, and the second lifting teeth and the third lifting teeth pass through the hollow and are connected to the lifting seat.

[0023] The beneficial effects of the present invention are:

[0024] The wafer lifting device of the present invention has fixed teeth for receiving uncleaned wafers. Before the robot grabs the wafer and places it on the fixed teeth, the lifting teeth of the corresponding height first descend to a level lower than the fixed teeth of the corresponding height, and the wafer is first supported by the fixed teeth, and then the vertical moving seat drives the wafer into the cleaning equipment for jet cleaning. After the cleaning is completed, the lifting teeth rise, lift up the wafer, and make the wafer break away from the contact with the fixed teeth. After falling out of contact, it can be sprayed again, that is, the lifting teeth are used to receive the wafer that has been cleaned, and then the vertical moving seat descends, and the cleaned wafer is moved to the next station through the horizontal displacement mechanism. Therefore, the wafer lifting device of the present invention can prevent the cleaned wafer from being contaminated by the supporting teeth by supporting it before and after cleaning respectively, thereby improving the cleanliness of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The technical solution of the present application is further described below in conjunction with the accompanying drawings and embodiments.

[0026] Figure 1 is a schematic structural diagram of a wafer lifting device according to an embodiment of the present application;

[0027] Figure 2 It is a structural schematic diagram of a rotating seat of an embodiment of the present application;

[0028] Figure 3 is a cross-sectional view of the rotating seat of an embodiment of the present application;

[0029] Figure 4 Schematic diagram of the structure of the fixed teeth and the lifting teeth of the embodiment of the present application; the reference numerals in the figure are:

[0030] 1 Horizontal displacement mechanism;

[0031] 2 vertical displacement mechanism;

[0032] 3 vertical moving seat;

[0033] 4 swivel seat;

[0034] 5. Rotating mechanism;

[0035] 6 fixed teeth;

[0036] 7 lifting teeth;

[0037] 8. Lifting mechanism;

[0038] 41 base plate;

[0039] 42 guide rod;

[0040] 43 Lifting seat;

[0041] 51 Motor

[0042] 52 Driving wheel

[0043] 53 Drive wheel

[0044] 61 First fixed tooth

[0045] 62 second fixed tooth;

[0046] 63 third fixed tooth;

[0047] 64 fixed gear seat;

[0048] 71 first lifting tooth;

[0049] 72 second lifting tooth;

[0050] 73 third lifting gear;

[0051] 81 cylinders;

[0052] 82 Gas supply duct. DETAILED DESCRIPTION

[0053] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0054] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention, unless otherwise specified, "multiple" means two or more.

[0055] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0056] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0057] Example

[0058] This embodiment provides a wafer lifting device, such as Figure 1 As shown, including:

[0059] Horizontal displacement mechanism 1;

[0060] The vertical displacement mechanism 2 is arranged on the horizontal displacement mechanism 1 and can be horizontally displaced by the action of the horizontal displacement mechanism 1;

[0061] The vertical moving seat 3 is arranged on the vertical displacement mechanism 2 and can be vertically displaced by the vertical displacement mechanism 2;

[0062] A rotating seat 4 is arranged on the vertical moving seat 3;

[0063] The rotating mechanism 5 is arranged on the vertical moving seat 3 and is used to drive the rotating seat 4 to rotate;

[0064] The fixed teeth 6 are arranged on the top of the rotating seat 4;

[0065] Lifting teeth 7;

[0066] The lifting mechanism 8 is disposed on the rotating seat 4 and is used to drive the lifting teeth 7 to move between a position higher than the fixed teeth 6 and a position lower than the fixed teeth 6 .

[0067] In the wafer lifting device of this embodiment, the fixed teeth 6 are used to receive the uncleaned wafers. Before the robot grabs the wafer and places it on the fixed teeth 6, the lifting teeth 7 of the corresponding height first descend to a level lower than the fixed teeth 6 of the corresponding height, and the wafer is first supported by the fixed teeth 6, and then the vertical moving seat 3 drives the wafer into the cleaning equipment for jet cleaning. After the cleaning is completed, the lifting teeth 7 rises, lifts the wafer, and makes the wafer break away from the contact with the fixed teeth 6. After the contact falls off, it can also be sprayed again, that is, the lifting teeth 7 are used to receive the wafers that have been cleaned, and then the vertical moving seat 3 descends, and the cleaned wafer is moved to the next station through the horizontal displacement mechanism 1. Therefore, the wafer lifting device of this embodiment can improve the cleanliness of the wafer by supporting before and after cleaning respectively, preventing the dirt from contaminating the cleaned wafer through the supporting teeth. At the same time, the contact position with the wafer is changed, and the phenomenon of incomplete cleaning caused by the contact position when the fixed teeth 6 contact the wafer can also be prevented.

[0068] Further, the fixed teeth 6 include a first fixed tooth 61, a second fixed tooth 62 and a third fixed tooth 63 whose heights are successively reduced to form a three-point support for the wafer; the lifting teeth 7 include a first lifting tooth 71, a second lifting tooth 72 and a third lifting tooth 73 whose heights are successively reduced to form a three-point support for the wafer; wherein, from one side to the other side of the rotating seat 4, the first lifting tooth 71, the second fixed tooth 62, the third lifting tooth 73, the third lifting tooth 73, the third fixed tooth 63, the second lifting tooth 72 and the first fixed tooth 61 are arranged respectively. The staggered fixed teeth 6 and lifting teeth 7 can stably provide three-point support for the wafer.

[0069] Furthermore, if Figure 3 As shown, the rotating mechanism 5 includes a motor 51, a driving wheel 52 arranged on the output shaft of the motor 51, a driven wheel 53 connected to the driving wheel 52 through a belt, and the driven wheel 53 is connected to the rotating shaft of the rotating seat 4. When the motor 51 is working, it drives the rotating seat 4 to rotate.

[0070] Furthermore, if Figure 2 The rotating seat 4 includes a bottom plate 41 , a guide rod 42 and a lifting seat 43 . The lifting seat 43 is slidably arranged on the guide rod 42 . The lifting teeth 7 are arranged on the lifting seat 43 . The lifting mechanism 8 can drive the lifting seat 43 to rise and fall along the guide rod 42 .

[0071] Furthermore, the rotating seat 4 is installed on the vertical moving seat 3 through a bearing, the rotating shaft of the rotating seat 4 is a hollow structure, and the driven wheel 53 is also a hollow structure, such as Figure 3 As shown, the lifting mechanism 8 includes: a cylinder 81 and an air supply pipe 82 for supplying air to the cylinder 81. The air supply pipe 82 extends downward through the hollow of the rotating shaft and the driven wheel 53 to facilitate the connection of the air supply pipe.

[0072] Furthermore, the cylinder 81 is disposed on the bottom plate 41 and is located between the bottom plate 41 and the lifting seat 43 .

[0073] Furthermore, the first fixed tooth 61 , the second fixed tooth 62 and the third fixed tooth 63 are arranged on the fixed tooth seat 64 ; the fixed tooth seat 64 has a hollow portion, and the second lifting tooth 72 and the third lifting tooth 73 pass through the hollow portion and are connected to the lifting seat 43 .

[0074] Based on the above ideal embodiments of this application, the relevant staff can make various changes and modifications without departing from the technical concept of this application through the above description. The technical scope of this application is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer lifting device, characterized in that: include: Horizontal displacement mechanism (1); A vertical displacement mechanism (2) is arranged on the horizontal displacement mechanism (1) and can be horizontally displaced by the action of the horizontal displacement mechanism (1); A vertical moving seat (3) is arranged on the vertical displacement mechanism (2) and can be vertically displaced by the vertical displacement mechanism (2); A rotating seat (4) is arranged on the vertical movable seat (3); A rotating mechanism (5) is arranged on the vertical movable seat (3) and is used to drive the rotating seat (4) to rotate; A fixed tooth (6) is arranged on the top of the rotating seat (4); Lifting teeth (7); The lifting mechanism (8) is arranged on the rotating seat (4) and is used to drive the lifting teeth (7) to move between a position higher than the fixed teeth (6) and a position lower than the fixed teeth (6).

2. The wafer lifting device according to claim 1, characterized in that: The fixed teeth (6) include a first fixed tooth (61), a second fixed tooth (62) and a third fixed tooth (63) whose heights are successively reduced to form a three-point support for the wafer; the lifting teeth (7) include a first lifting tooth (71), a second lifting tooth (72) and a third lifting tooth (73) whose heights are successively reduced to form a three-point support for the wafer; and the first lifting teeth (71), the second fixed teeth (62), the third lifting teeth (73), the third lifting teeth (73), the third fixed teeth (63), the second lifting teeth (72) and the first fixed teeth (61) are arranged from one side to the other side of the rotating seat (4).

3. The wafer lifting device according to claim 1, characterized in that: The rotating mechanism (5) comprises a motor (51), a driving wheel (52) arranged on the output shaft of the motor (51), a driven wheel (53) connected to the driving wheel (52) via a belt, and the driven wheel (53) is connected to the rotating shaft of the rotating seat (4). When the motor (51) is working, the rotating seat (4) is driven to rotate.

4. The wafer lifting device according to claim 2, characterized in that: The rotating seat (4) comprises a bottom plate (41), a guide rod (42) and a lifting seat (43); the lifting seat (43) is slidably arranged on the guide rod (42); the lifting teeth (7) are arranged on the lifting seat (43); and the lifting mechanism (8) can drive the lifting seat (43) to rise and fall along the guide rod (42).

5. The wafer lifting device according to claim 4, characterized in that: The rotating seat (4) is installed on the vertical moving seat (3) through a bearing, the rotating shaft of the rotating seat (4) is a hollow structure, and the driven wheel (53) is also a hollow structure; The lifting mechanism (8) comprises: a cylinder (81) and an air supply pipe (82) for supplying air to the cylinder (81); the air supply pipe (82) passes through the hollow space of the rotating shaft and the driven wheel (53) and extends downward.

6. The wafer lifting device according to claim 5, characterized in that: The cylinder (81) is arranged on the bottom plate (41) and is located between the bottom plate (41) and the lifting seat (43).

7. The wafer lifting device according to claim 4, characterized in that: The first fixed tooth (61), the second fixed tooth (62) and the third fixed tooth (63) are arranged on a fixed tooth seat (64).

8. The wafer lifting device according to claim 7, characterized in that: The fixed tooth seat (64) has a hollow portion, and the second lifting tooth (72) and the third lifting tooth (73) pass through the hollow portion and are connected to the lifting seat (43).

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