Clamping tool for processing semiconductor device

Abstract

The invention discloses a semiconductor device processing and clamping tool, and relates to the field of semiconductor clamping, and the semiconductor device processing and clamping tool comprises at least three first driving assemblies which are annularly and uniformly distributed; at least two second driving assemblies are arranged on the first driving assembly; a clamping roller is arranged at the end part of the second driving assembly; limiting pieces are arranged at the ends of the clamping rollers, and the limiting pieces can control rotation of the clamping rollers. Through cooperative use of the first driving assembly, the second driving assembly and the limiting piece, the clamping tool for processing the semiconductor device can be suitable for wafers with different diameters, and the clamping roller can rotate along with the wafers when the wafers need to rotate.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor clamping, in particular to a semiconductor device processing clamping tool. Background Art

[0002] In the semiconductor manufacturing process, wafer processing requires multiple high-precision and high-complexity steps, such as lithography, etching, deposition, and polishing. In order to ensure the stability and accuracy of processing, wafer clamping technology is crucial. Wafers usually have a large diameter (such as 200mm, 300mm) and a small thickness, which makes them susceptible to external forces during processing, which may cause deformation or damage. Therefore, a reliable clamping device is needed to fix the wafer while avoiding excessive stress on the surface and edge of the wafer.

[0003] Existing wafer clamping devices mainly include vacuum adsorption clamping and mechanical clamping. Vacuum adsorption clamping achieves fixation by applying negative pressure on the back of the wafer. It has the advantages of large contact area and is not easy to cause local stress concentration, but the effect will be reduced when the vacuum environment is unstable or the wafer surface is rough; mechanical clamping applies mechanical force to the edge of the wafer through clamping claws or fixing rings, which can provide a higher clamping force, but it is easy to cause edge stress concentration, resulting in wafer edge cracking or microcracks. In addition, with the increase in wafer size and the decrease in thickness, higher requirements are placed on the stability and precision of the clamping device. The traditional clamping method can no longer meet the needs of the new generation of semiconductor manufacturing technology. Summary of the invention

[0004] In view of the above-mentioned problems existing in the prior art, the present invention is proposed.

[0005] Therefore, the problem to be solved by the present invention is that mechanical clamping easily causes wafer edge breakage or micro cracks.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: A semiconductor device processing clamping tool, comprising: a first driving assembly, at least three of which are arranged and evenly distributed in a ring shape;

[0007] At least two second driving assemblies are arranged on the first driving assembly; a clamping roller is arranged at the end of the second driving assembly; a limiting member is arranged at the end of the clamping roller, and the limiting member can control the rotation of the clamping roller.

[0008] As a preferred solution of the semiconductor device processing clamping tooling described in the present invention, the first driving component includes a first hydraulic cylinder and a first telescopic column slidably matched therewith, the end of the first telescopic column is fixedly connected to the movable seat through a first connecting sleeve, and the movable seat slidably matches with the base.

[0009] As a preferred solution of the semiconductor device processing clamping tooling described in the present invention, the second driving component includes a second hydraulic cylinder and a second telescopic column slidably matched therewith; the oil inlet of the second hydraulic cylinder is correspondingly installed with a solenoid valve and a pressure sensor.

[0010] As a preferred solution of the semiconductor device processing clamping tool of the present invention, a second connecting sleeve is further provided at the end of the second telescopic column, and the clamping roller is slidably matched with the second connecting sleeve.

[0011] As a preferred solution of the semiconductor device processing clamping tooling of the present invention, the limiting member includes a first limiting plate arranged at the end of the clamping roller and a fixed shaft arranged in the middle of the first limiting plate.

[0012] As a preferred solution of the semiconductor device processing clamping tooling described in the present invention, the limiting member also includes a second limiting plate arranged on the top of the first limiting plate, the second limiting plate is slidably matched with the fixed shaft and a first spring is also arranged therebetween.

[0013] As a preferred solution of the semiconductor device processing clamping tooling of the present invention, a slider is further provided on the top of the second limiting plate, and the slider is a square block.

[0014] As a preferred solution of the semiconductor device processing clamping tooling of the present invention, a limiting groove is further provided inside the second connecting sleeve, and the sliding block is placed in the limiting groove and slidably cooperates with the limiting groove.

[0015] As a preferred solution of the semiconductor device processing clamping tool of the present invention, the depth of the limiting groove gradually decreases from the end away from the second telescopic column to the end close to the second telescopic column.

[0016] As a preferred solution of the semiconductor device processing clamping tooling described in the present invention, a second spring and a stop block are further provided between the first limiting plate and the inner wall of the limiting groove, and one end of the stop block is in contact with the side wall of the first limiting plate.

[0017] The beneficial effects of the present invention are as follows: through the coordinated use of the first drive assembly, the second drive assembly and the limiter, the semiconductor device processing clamping tool can be suitable for wafers of different diameters, and the clamping rod can also rotate when the wafer needs to be rotated. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is an overall schematic diagram of the clamping tooling for semiconductor device processing.

[0020] Figure 2 This is a structural diagram of the clamping tooling for semiconductor device processing.

[0021] Figure 3 A schematic diagram of a second drive unit of a clamping tool for processing semiconductor devices.

[0022] Figure 4 A cross-sectional view of a second drive unit of a semiconductor device processing clamping tool.

[0023] Figure 5 for Figure 4 A is an enlarged view of the middle image.

[0024] Figure 6 Schematic diagram of the limiter for the clamping tooling for semiconductor device processing.

[0025] Figure 7 Schematic diagram of clamping tooling for semiconductor device processing. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it an embodiment that is mutually exclusive with other embodiments, either individually or selectively.

[0029] Example 1

[0030] Reference Figure 1 to Figure 7, which is the first embodiment of the present invention, provides a semiconductor device processing clamping tool, including a first driving component 100, a second driving component 200 and a limiting member 300.

[0031] Specifically, at least three first drive assemblies 100 are provided and evenly distributed in a ring shape; at least two second drive assemblies 200 are provided on the first drive assembly 100; a clamping roller 201 is provided at the end of the second drive assembly 200; a limiter 300 is provided at the end of the clamping roller 201, and the limiter 300 can control the rotation of the clamping roller 201. Several second drive assemblies 200 are evenly provided on one side of the first drive assembly 100 close to the center of the circle. When a wafer is placed in the middle of the second drive assemblies 200, the second drive assembly 200 in the middle will first contact the edge of the wafer, and the second drive assemblies 200 at the left and right ends will also contact the edge of the wafer in turn, and finally several second drive assemblies 200 will press to the corresponding position of the wafer edge for clamping.

[0032] Further, the first drive assembly 100 includes a first hydraulic cylinder 101 and a first telescopic column 102 that slides with the first hydraulic cylinder 101. The end of the first telescopic column 102 is fixedly connected to the moving seat 104 through the first connecting sleeve 103. The moving seat 104 slides with the base 105. Three through slots are evenly arranged in the base 105. The three through slots correspond to the three first drive assemblies 100 one by one. The direction of the through slots is consistent with the extension direction of the first drive assembly 100. A protrusion is fixedly arranged in the middle of the bottom of the moving seat 104. The moving seat 104 slides with the through slot through the protrusion. The sliding direction of the moving seat 104 moves along the diameter direction of the ring. When the wafer is placed in the clamping fixture, the moving seat 104 drives the second drive assembly 200 to move toward the center of the circle to clamp the wafer. The first telescopic column 102 is arranged inside the first hydraulic cylinder 101 and slides with the first hydraulic cylinder 101. When the first hydraulic cylinder 101 pushes the first telescopic column 102 to move forward, the second drive assembly 200 fixedly connected thereto will also move forward.

[0033] The second drive assembly 200 includes a second hydraulic cylinder 206 and a second telescopic column 202 that slides with the second hydraulic cylinder 206; the oil inlet of the second hydraulic cylinder 206 is correspondingly installed with a solenoid valve 203 and a pressure sensor 204. The second drive assembly 200 is fixedly arranged above the moving seat 104, and the pressure sensor 204 is used to monitor the pressure of the second hydraulic cylinder 206. When the pressure in the cylinder reaches a certain value, the solenoid valve 203 is closed. When in use, a number of second drive assemblies 200 correspond to the edge of the wafer. After the second hydraulic cylinder 206 closest to the edge of the wafer is supplied with oil through the oil circuit, the second telescopic column 202 is pushed until the second telescopic column 202 presses against the edge of the wafer and does not move forward. At this time, when the oil pressure in the second hydraulic cylinder 206 reaches the set value, the solenoid valve 203 of the current second drive assembly 200 is closed, the second hydraulic cylinder 206 maintains the pressure, and then the next second drive assembly 200 moves. By analogy, when all the second drive assemblies 200 press the second telescopic column 202 against the edge of the wafer, the clamping action is completed.

[0034] A second connecting sleeve 205 is also provided at the end of the second telescopic column 202, and the clamping roller 201 is slidably matched with the second connecting sleeve 205. The second connecting sleeve 205 is sleeved on one end of the second telescopic column 202 and fixed by four bolts, and the bolts penetrate the second connecting sleeve 205 and the second telescopic column 202 to fix the stopper at the end of the second driving assembly 200. An opening is provided at one end of the second connecting sleeve 205 close to the wafer, and the clamping roller 201 is provided in the opening and slidably matched with the inner wall of the opening.

[0035] The limiting member 300 includes a first limiting plate 301 disposed at the end of the clamping roller 201 and a fixed shaft 302 disposed in the middle of the first limiting plate 301. The limiting member 300 also includes a second limiting plate 303 disposed at the top of the first limiting plate 301, the second limiting plate 303 and the fixed shaft 302 are slidably matched, and a first spring 304 is also disposed between the two. A slider 303a is also disposed at the top of the second limiting plate 303, and the slider 303a is a square block. The depth of the limiting groove 205a gradually decreases from the end away from the second telescopic column 202 to the end close to the second telescopic column 202. A second spring 306 and a stop block 305 are also disposed between the first limiting plate 301 and the inner wall of the limiting groove 205a, and one end of the stop block 305 is in contact with the side wall of the first limiting plate 301. The limiting member 300 is arranged between the clamping roller 201 and the second connecting sleeve 205, the first limiting plate 301 is fixedly arranged on the upper side of the clamping roller 201, the fixed shaft 302 is fixedly arranged in the middle of the upper side of the first limiting plate 301, one end of the first spring 304 is fixedly connected to the fixed shaft 302, and the bottom of the second limiting plate 303 and the sliding block 303a is provided with an empty groove, and the fixed shaft 302 cooperates with the empty groove. The first limiting plate 301 and the second limiting plate 303 are provided with a rough surface on the opposite side. When the second limiting plate 303 is pressed downward by pressure, it will contact and get stuck with the first limiting plate 301, so that no relative sliding will occur between the first limiting plate 301 and the second limiting plate 303.

[0036] Among them, a corner of the slider 303a close to the second telescopic column 202 is set to be inclined, the left side of the limiting groove 205a close to the second telescopic column 202 is a rectangular groove, and the right side is a right-angled trapezoidal groove, the hypotenuse of the limiting groove 205 corresponds to the inclined surface of the slider 303a, and the limiting member 300 is located on the right side of the limiting groove 205 in the initial state. At this time, when the wafer needs to be rotated, since the clamping roller 201 is a cylinder and the fixed shaft 302 rotates with the second limiting plate 303, all the clamping rollers 201 can rotate with the rotation of the wafer, and the second limiting plate 303 and the slider 303a, since the slider 303a is a square, are always It cannot rotate. When the clamping roller 201 is pushed to move in the direction of the second telescopic column 202, the stop block 305 moves to the left and squeezes the second spring 306. The slider 303a will move to the left and downward along the hypotenuse, and the second limit plate 303 will also move to the left and downward. The second limit plate 303 descends and fits tightly with the first limit plate 301 and is stuck to form a whole. Since the second limit plate 303 cannot rotate, the first limit plate 301 fixed thereto cannot rotate at this time, thereby clamping the edge of the wafer. That is, it is ensured that the clamping roller 201 cannot rotate during clamping, which can achieve a better clamping effect.

[0037] When in use, the wafer is placed in the center of the base 105, and the three first drive assemblies 100 are started at the same time. The first hydraulic cylinder 101 pushes the first telescopic column 102 to move toward the center of the circle, and several second drive assemblies 200 also move accordingly. The second hydraulic cylinder 206 of the second drive assembly 200 in the middle position is supplied with oil by the oil pipeline to push the second telescopic rod 202 to move forward until the clamping roller 201 is attached to the edge of the wafer. At this time, the pressure sensor 204 detects that the hydraulic value of the second hydraulic cylinder 206 reaches the upper limit and closes the solenoid valve 203. The oil tank no longer supplies oil to the second hydraulic cylinder 206 of the second drive assembly 200 in the middle position, and then supplies oil to the remaining drive assemblies 200 and repeats the previous process until all the clamping rollers 201 are attached to the edge of the wafer. The second telescopic rods 202 of all second drive assemblies 200 are extended to different lengths, but the terminals are all attached to the edge of the wafer, so that the edge of the wafer can be clamped. No matter how big or small the diameter of the wafer is, a plurality of clamping rollers 201 can, under the action of the second hydraulic cylinder 206, contact the edge of the wafer to clamp the wafer. When the clamping rollers 201 contact the wafer, they will be squeezed by the wafer to move toward the second telescopic rod 202. Since the inclined surface of the slider 303a can descend along one side of the limiting groove 205, the limiting member 300 will eventually be squeezed to the left side of the limiting groove 205. The lower side of the second limiting plate 303 and the upper side of the first limiting plate 301 are squeezed together and no relative sliding occurs. When the bottom of the clamping roller 201 is blocked, the entire clamping roller 201 and the limiting member are fixed and will no longer move. A plurality of annularly distributed clamping rollers 201 clamp the wafer. When the wafer needs to be rotated, the first telescopic column 102 is moved back a little, the second spring 306 rebounds, pushes the limit member 300 back to its original position, and the compressed first spring 304 returns to its original state. The first limit plate 301 and the second limit plate 303 are separated. At this time, the fixed shaft 302 can rotate again, and the clamping roller 201 can rotate.

[0038] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A semiconductor device processing clamping tool, characterized in that: include, First drive components (100), at least three of which are arranged and evenly distributed in a ring shape; At least two second driving components (200) are arranged on the first driving component (100); A clamping roller (201) is provided at the end of the second driving assembly (200); A limiting member (300) is provided at the end of the clamping roller (201), and the limiting member (300) is capable of controlling the rotation of the clamping roller (201).

2. The semiconductor device processing clamping tool as claimed in claim 1, characterized in that: The first driving assembly (100) comprises a first hydraulic cylinder (101) and a first telescopic column (102) slidably matched therewith, the end of the first telescopic column (102) is fixedly connected to a movable seat (104) via a first connecting sleeve (103), and the movable seat (104) is slidably matched with a base (105).

3. The semiconductor device processing clamping tool as claimed in claim 2, characterized in that: The second driving assembly (200) comprises a second hydraulic cylinder (206) and a second telescopic column (202) slidably matched therewith; the oil inlet of the second hydraulic cylinder (206) is correspondingly installed with a solenoid valve (203) and a pressure sensor (204).

4. The semiconductor device processing clamping tool as claimed in claim 3, characterized in that: A second connecting sleeve (205) is also provided at the end of the second telescopic column (202), and the clamping roller (201) is slidably matched with the second connecting sleeve (205).

5. The semiconductor device processing clamping tool as claimed in claim 4, characterized in that: The limiting member (300) comprises a first limiting plate (301) arranged at the end of the clamping roller (201) and a fixed shaft (302) arranged in the middle of the first limiting plate (301).

6. The semiconductor device processing clamping tool as claimed in claim 5, characterized in that: The limiting member (300) further comprises a second limiting plate (303) arranged on the top of the first limiting plate (301); the second limiting plate (303) is slidably matched with the fixed shaft (302) and a first spring (304) is arranged between the two.

7. The semiconductor device processing clamping tool as claimed in claim 6, characterized in that: A slider (303a) is also provided on the top of the second limiting plate (303), and the slider (303a) is a square block.

8. The semiconductor device processing clamping tool as claimed in claim 7, characterized in that: A limiting groove (205a) is also provided inside the second connecting sleeve (205), and the sliding block (303a) is placed in the limiting groove (205a) and slidably cooperates with the limiting groove (205a).

9. The semiconductor device processing clamping tool as claimed in claim 8, characterized in that: The depth of the limiting groove (205a) gradually decreases from an end away from the second telescopic column (202) to an end close to the second telescopic column (202).

10. The semiconductor device processing clamping tool as claimed in claim 9, characterized in that: A second spring (306) and a stopper (305) are also provided between the first limiting plate (301) and the inner wall of the limiting groove (205a), and one end of the stopper (305) is in contact with the side wall of the first limiting plate (301).

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