Semiconductor mica composite material and preparation method thereof

By preparing a semiconductor mica composite material composed of mica, polypropylene and other materials, the problems of high cost and unstable quality of existing mica composite materials are solved, and the effects of high strength, light weight, high hardness and good electrical performance are achieved, which are suitable for multiple engineering application fields.

CN119591979APending Publication Date: 2025-03-11XINJIANG XINYAO LIXIANG NEW MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202510002701.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-02
Publication Date
2025-03-11

AI Technical Summary

Technical Problem

Existing mica composites face high costs and unstable product quality in practical applications, which limit their promotion and application in a wider range of fields.

Method used

A semiconductor mica composite material is used, which consists of mica, polypropylene, chlorinated polyethylene, epoxy resin, carbon black, paraffin and liquid paraffin. High-performance mica composite material is prepared through a specific weight ratio and preparation process, including acid treatment, thermal mixing and intensive refining.

Benefits of technology

It realizes the high strength, light weight, high hardness and good electrical performance of mica composite materials, reduces production costs, improves product quality, and is suitable for multiple engineering application fields.

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Abstract

The invention discloses a semiconductor mica composite material and a preparation method thereof, and belongs to the technical field of composite materials, the semiconductor mica composite material is prepared from the following raw materials by weight: 20-40% of mica, 10-20% of an adhesive, 10-20% of a reinforcing agent and 10-20% of an auxiliary agent. The polypropylene composite material is prepared from 30-50% of polypropylene, 1-3% of chlorinated polyethylene, 1-3% of epoxy resin, 2-4% of epoxidized soybean oil, 4-8% of carbon black, 1-3% of paraffin and 2-4% of liquid The composite material is prepared from the following components in percentage by weight: 10%-20% of polypropylene, 5%-10% of silane coupling agent (KH570), 1%-3% of titanate coupling agent, 4%-8% of compatilizer (107), 2%-4% of curing agent urotropine, 2%-4% of flame retardant (101) and 1%-3% of antioxidant (1010). The mica composite material disclosed by the invention is light in weight, high in strength, high in hardness and good in electrical performance, so that the mica composite material becomes an ideal structural and functional material, the preparation process of the mica composite material is simple, the cost benefit is high, and powerful support is provided for popularization and application of the mica composite material in the market.
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Description

Technical Field

[0001] The invention mainly relates to the technical field of composite materials, in particular to a semiconductor mica composite material and a preparation method thereof. Background Art

[0002] Composite materials are new materials composed of two or more different substances. By combining the advantages of different materials, they can achieve complementary and synergistic performance while maintaining their respective characteristics. Among them, mica, as a natural mineral, is widely used for its unique layered structure and excellent electrical insulation properties. In nature, mica usually exists in the form of flake crystals, with good high temperature resistance, chemical stability and electrical insulation. Combining mica with conductive materials can develop semiconductor mica synthetic materials with excellent performance. This type of material not only inherits the excellent properties of mica, but also introduces the electronic properties of conductor materials, such as good conductivity and thermal stability. These characteristics of semiconductor mica synthetic materials make it have great application potential in electronic devices, energy conversion and storage. In the field of flexible electronics, semiconductor mica synthetic materials can be used as key electronic components to improve the flexibility and durability of devices. In the field of energy, this type of material can be used to develop new solar cells and thermoelectric materials to improve energy utilization efficiency and environmental adaptability.

[0003] However, although mica composites have shown great potential and advantages in many fields with their excellent performance, they still face some challenges and limitations in practical applications. Among them, the relatively high manufacturing cost and product quality are issues that cannot be ignored. The high cost not only increases the economic burden of enterprises, but also limits the promotion and application of mica composites in a wider range of fields. Summary of the invention

[0004] The technical solution of the present invention aims at the technical problem that the existing technical solution is too single, and provides a solution that is significantly different from the existing technology. Specifically, the present invention mainly provides a semiconductor mica composite material and a preparation method thereof to solve the technical problems raised in the above background technology.

[0005] The technical solution adopted by the present invention to solve the above technical problems is: A semiconductor mica composite material is prepared from mica, an adhesive, a reinforcing agent and an auxiliary agent, and includes the following raw materials in parts by weight: Mica 20%~40%; Polypropylene 30%-50%, chlorinated polyethylene 1%-3%, epoxy resin 1%-3%, epoxidized soybean oil 2%-4%, carbon black 4%-8%, paraffin 1%-3%, liquid paraffin 2%-4%; Silane coupling agent (KH570) 5%~10%, titanate coupling agent 1%~3%, compatibilizer (107) 4%~8%, curing agent urotropine 2%~4%, flame retardant (101) 2%~4%, antioxidant (1010) 1%~3%.

[0006] A method for preparing a semiconductor mica composite material, applied to a semiconductor mica composite material, comprises the following steps: S1, select mica with a fineness of 800-2200 mesh, and treat it with acid for later use; S2. Heat the mixer to 90-100°C and add polypropylene. After mixing for 10-15 minutes, add two-fifths of the silane coupling agent and mix for 10-15 minutes. After cooling for 5-10 minutes, when the temperature is below 30°C, take it out for use. S3, keep the mixer at 70-80°C, add the reserved mica powder in S1 and mix for 10-20 minutes, then add carbon black, two-fifths of silane coupling agent and epoxy resin, mix for 4-8 minutes, and then perform material surface treatment; S4, add the spare materials in S2 to the mixer, and then add one fifth of silane coupling agent, titanate coupling agent, compatibilizer, chlorinated polyethylene, epoxy soybean oil, antioxidant, flame retardant, paraffin and liquid paraffin, mix at high speed for 3-5 minutes, and heat to 90-100°C for insulation; S5. Add hexamethylenetetramine to the mixer, mix at high speed for 10-15 minutes, take it out, send it to a low-speed mixer, and cool and stir it at low temperature for 4-8 minutes. Take it out when the material temperature is lower than 30°C; S6, the material taken out from S5 is mixed and plasticized by an internal mixer, and then drawn by a single-screw wire drawing machine, and then granulated by a granulator to prepare a finished product.

[0007] Preferably, the mixer described in the above steps comprises a mixing tank, wherein a top plate, a top ring and a bottom plate are sequentially installed inside the mixing tank from top to bottom, a mixing space is provided between the top ring and the bottom plate, a central shaft and a plurality of auxiliary shafts are provided on the bottom plate, the central shaft is rotatably installed on the axis of the bottom plate, a plurality of the auxiliary shafts are distributed in a circle with the central shaft as the center, a lifting frame is commonly sleeved on the central shaft and the plurality of auxiliary shafts, the central shaft and the lifting frame rotation axis coincide, a stirring paddle is slidably connected to each of the auxiliary shafts, the stirring paddle rotates with the auxiliary shaft, and the stirring paddle is rotatably installed at the lower end of the lifting frame; The top ring is provided with a central gear ring, a plurality of auxiliary gears, an outer gear ring and a gear rack constituting a planetary gear system. The central gear ring is mounted on a central shaft, and the auxiliary gears are mounted on corresponding auxiliary shafts. An adjustment box mounted on the side wall of the mixing tank is provided between the top plate and the top ring. The top plate is provided with a placement groove and a rotating disk rotatably mounted. A reducer is installed on the upper end of the central shaft, and the output end of the reducer drives the rotating disk to rotate through the internal mechanism of the adjustment box. The rotating disk is provided with a sliding groove and a liquid storage cavity inside, a moving block is slidably installed inside the sliding groove, two coaxially connected winding drums and a fixed frame are respectively provided at the front and rear ends of the placement groove, the two winding drums have different inner diameters and are respectively equipped with a pull rope, a pull rod is slidably provided on the fixed frame, the pull rope on the winding drum with a smaller inner diameter is connected to one end of the pull rod, the other end of the pull rod is connected to an oil telescopic rod, the other end of the oil telescopic rod is slidably connected to a guide frame, the moving block slides inside the guide frame, the lifting frame is rotatably connected to a lifting ring outside, and the pull rope on the winding drum with a larger inner diameter is connected to the lifting ring.

[0008] Preferably, the mixing tank is provided with a controller and a stepper motor, and the stepper motor drives the central axis to rotate, the bottom plate is installed on the bottom wall of the mixing tank, and the top plate and the top ring are located at the top of the inside of the mixing tank.

[0009] Preferably, the adjusting box is provided with a short-axis bevel gear and a long-axis bevel gear that mesh with each other, and an inner shaft rod connected to the axis of the long-axis bevel gear. The output end of the reducer and the axis rod of the short-axis bevel gear are connected by a sprocket chain belt transmission. An inclined surface is also provided inside the adjusting box, and a slider rod slides on the inclined surface. The slider rod is installed on the inner shaft rod. An outer shaft rod and a rotating shaft sleeve are rotatably installed on the upper end of the adjusting box. Gears are both mounted on the outer shaft rod and the rotating shaft sleeve, and the two gears mesh with each other. The inner shaft rod and the outer shaft rod are connected by a coupling transmission. The rotating disk is connected to the outer wall of the rotating shaft sleeve through a bracket.

[0010] Preferably, the coupling is composed of a telescopic rod and universal joints arranged at both ends of the telescopic rod, and the internal inclined surface of the adjustment box is parallel to the inclined surface of the side wall of the long-axis bevel gear.

[0011] Preferably, a liquid level sensor is provided inside the mixing tank, a reduction motor is provided inside the regulating box, the output end of the reduction motor is connected to a winding disk, a pull wire is installed on the winding disk, and the other end of the pull wire is connected to the slider rod through a guide wheel installed on the inclined surface inside the regulating box.

[0012] Preferably, a liquid storage box is provided inside the regulating box, a piston push rod is slidably provided inside the liquid storage box, the piston push rod extends outside the liquid storage box and is slidably connected to the slider rod, and the oil telescopic rod has a built-in return spring.

[0013] Preferably, a piston block is slidably installed inside the liquid storage chamber, the moving block and the piston block are connected by a connecting rod, and rotating joints are installed at the upper and lower ends of the rotating disk axis, and the two rotating joints are respectively connected to the front and rear ends of the liquid storage chamber through hoses, and the front and rear sides of the piston block are filled with oil, the oil telescopic rod is connected to one of the rotating joints through a hose, and the lower end of the liquid storage box and the other rotating joint are connected by a hose that passes through the rotating shaft sleeve.

[0014] Compared with the prior art, the present invention has the following beneficial effects: (1) The high strength (33.6 MPa) and high impact strength (4.1 kJ / m²) of the mica composite material ensure its reliability and durability when subjected to mechanical loads and external impacts. The high stiffness of the mica layer is combined with the toughness of the matrix resin, and the structure is strengthened by optimizing the distribution and interface bonding of the mica filler. The lightweight characteristics (density 1.28-1.38 g / cm³) are in line with the trend of lightweight modern engineering materials, especially in fields such as aerospace and automobile manufacturing that have strict requirements for reducing structural weight. The high hardness (48.1 HRC) and good electrical properties, including dielectric constant (7.15) and volume resistivity (4.67×10 14 Ω·cm), which shows great potential in the application of semiconductor manufacturing and high-voltage insulation components. The high breakdown voltage (28.55 kV / mm) further confirms its stable performance under high voltage environment.

[0015] This mica composite material has shown great potential in multiple engineering application fields. Its light weight, high strength, high hardness and good electrical properties make it an ideal structural and functional material. In addition, the preparation process of the mica composite material is simple and cost-effective, which provides strong support for its promotion and application in the market.

[0016] (2) When the material is stirred, the stirring paddle is moved up and down reciprocatingly, that is, the stirring paddle not only moves up and down in the material, but also revolves around the central axis and rotates on its own, which improves the fluidity of the material and reduces the blind area of ​​stirring and mixing, avoiding uneven distribution of materials and stirring agents, thereby affecting the uniformity and efficiency of the stirring polymerization reaction. At the same time, it also avoids adverse phenomena such as local overheating, condensation and even explosion caused by excessive reaction in some areas, and excessive reaction in some areas, affecting the overall production efficiency. A series of problems are avoided, the stirring effect is improved, the production quality of the composite material is guaranteed, and the cost-effectiveness is improved while improving the production quality.

[0017] (3) Different amounts of materials are placed at different heights inside the mixing tank. If the up and down reciprocating range of the stirring paddle remains unchanged, the stirring paddle will rush out of the material liquid surface, seriously reducing the work efficiency, or the stirring paddle will not be able to reach the upper end of the material, so that the mixing blind spot still exists; Therefore, after the material is introduced into the mixing tank, the position of the moving block is changed by detecting the material level height inside the mixing tank. Since the position of the moving block is changed, the forward and backward reciprocating motion range of the pull rod is expanded when the rotating disk rotates, so that the up and down reciprocating motion range of the stirring paddle is expanded. When the piston block moves, the oil inside the liquid storage chamber is squeezed into the oil telescopic rod. When the moving block moves, the oil telescopic rod is extended, so that the position of the pull rod does not change, avoiding changes in the initial position of the up and down reciprocating motion of the stirring paddle, so that the up and down movement range of the stirring paddle is from the bottom to the top of the material, thereby improving the stirring efficiency and stirring effect, ensuring the production quality of the composite material, and also improving the production efficiency and cost-effectiveness.

[0018] (4) When the up and down reciprocating motion range of the stirring paddle is expanded, the time of a single up and down motion of the stirring paddle does not change, which will cause the up and down reciprocating motion rate of the stirring paddle to be too fast, and each area of ​​the material cannot be fully stirred and mixed. Therefore, when the up and down reciprocating motion range of the stirring paddle changes, that is, when the slider rod descends, the slider rod will also drive the inner shaft rod to move. As the inner shaft rod moves downward, the meshing interface between the short-shaft bevel gear and the long-shaft bevel gear changes, causing the short-shaft bevel gear to rotate one circle, and the rotation angle of the long-shaft bevel gear becomes smaller, which reduces the rotation speed of the rotating disk and stabilizes the up and down movement rate of the stirring paddle, ensuring effective stirring and mixing of the material, improving the stirring efficiency and stirring effect, ensuring the production quality of the composite material, and also improving the production efficiency and cost-effectiveness. The present invention will be explained in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The test results and performance indicators of the semiconductor mica composite material of the present invention; Figure 2 It is the technical roadmap of the semiconductor mica composite material of the present invention; Figure 3 It is a schematic diagram of the structure of the mixing tank of the present invention; Figure 4 This is a schematic diagram of the internal structure of the mixing tank of the present invention; Figure 5 It is a schematic diagram of the top ring and bottom plate structure of the present invention; Figure 6 This is a schematic diagram of the top plate structure of the present invention; Figure 7 For the present invention Figure 6Enlarged view of point A in the middle; Figure 8 It is a schematic diagram of the structure of the regulating box and the rotating disk of the present invention.

[0020] In the figure: 1. Mixing tank; 10. Top plate; 101. Placement slot; 102. Rotating disk; 103. Sliding slot; 104. Liquid storage chamber; 105. Moving block; 106. Piston block; 107. Rotating joint; 108. Reel; 109. Fixed frame; 110. Pull rope; 111. Pull rod; 112. Oil telescopic rod; 113. Guide frame; 20, top ring; 201, center gear ring; 202, auxiliary gear; 203, outer gear ring; 204, gear rack; 205, reducer; 30, bottom plate; 301, central axis; 302, auxiliary axis; 303, lifting frame; 304, stirring paddle; 305, lifting ring; 40. Adjustment box; 401. Short-axis bevel gear; 402. Long-axis bevel gear; 403. Outer shaft; 404. Rotating sleeve; 405. Inner shaft; 406. Slider rod; 407. Coupling; 408. Speed ​​reducer motor; 409. Pull wire; 410. Liquid storage box; 411. Piston push rod. DETAILED DESCRIPTION

[0021] To facilitate understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings, but the present invention can be implemented in different forms and is not limited to the embodiments described in the text. On the contrary, these embodiments are provided to make the content disclosed in the present invention more thorough and comprehensive.

[0022] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly connected by technicians in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this article includes any and all combinations of one or more related listed items.

[0024] A semiconductor mica composite material is prepared from mica, an adhesive, a reinforcing agent and an auxiliary agent, and includes the following raw materials in parts by weight: Mica 20%~40%; Polypropylene 30%-50%, chlorinated polyethylene 1%-3%, epoxy resin 1%-3%, epoxidized soybean oil 2%-4%, carbon black 4%-8%, paraffin 1%-3%, liquid paraffin 2%-4%; Silane coupling agent (KH570) 5%~10%, titanate coupling agent 1%~3%, compatibilizer (107) 4%~8%, curing agent urotropine 2%~4%, flame retardant (101) 2%~4%, antioxidant (1010) 1%~3%.

[0025] Please refer to the attached pictures Figure 1 , the semiconductor mica composite material exhibited a tensile strength of 33.6±2.04MPa, a performance index that is essential to ensure the reliability of the material under mechanical load. The high stiffness and excellent mechanical properties of the mica layers, combined with the toughness of the matrix resin, contribute to the strength of the overall structure. The optimization of this structure is achieved by precisely controlling the uniform distribution of the mica filler and enhancing the interface bonding between the mica and the matrix through chemical surface modification. The impact strength of the mica composite material is 4.1±0.16kJ / m². The results show that the mica composite material can effectively absorb and disperse external impact energy. This ability is essential for protecting sensitive electronic components from mechanical shock. The layered structure of the mica layer may play a role in crack deflection and crack bridging during the impact process, thereby improving the toughness and durability of the material. The density of the mica composite material is 1.28-1.38g / cm³, and this lightweight property is of great significance for reducing the weight of the structure. Lightweighting is one of the important trends in the development of modern synthetic materials, especially in the fields of aerospace, automotive manufacturing and wearable devices. The natural layered structure and low density of mica make it an ideal choice for lightweighting. The hardness of the mica composite material is 48.1±1.01HRC, indicating that the mica composite material has good wear resistance. In the semiconductor manufacturing process, the wear resistance of the material is crucial to maintaining the accuracy of the equipment and extending its service life. The uniform distribution of mica flakes and the strong bond with the matrix resin may be the key factors in improving the hardness. The dielectric constant of the material is 7.15, which is attributed to the addition of carbon black in the material and its uniform distribution, indicating that the material can effectively support the transmission of electronic signals while maintaining good insulation properties. Suitable for the design and manufacture of high-frequency circuits and microelectronic devices. The volume resistivity of the material is 4.67×10 14Ω·cm, indicating that as a semiconductor device it can prevent current leakage and electrochemical corrosion, thereby protecting electronic components from damage. The breakdown voltage of the semiconductor mica synthetic material is 28.55±1.95kV / mm, further confirming the high electrical strength of the material. In the semiconductor and electronics industries, materials with high breakdown voltage can be used to manufacture high-voltage insulation components such as capacitors, transformers, and cables to ensure the stable operation of equipment under high voltage. Mica synthetic materials show excellent properties in mechanical properties, electrical properties, and wear resistance. This makes the material very suitable for use in the electronics and semiconductor fields that require high-performance insulation and structural stability. A method for preparing a semiconductor mica composite material, applied to a semiconductor mica composite material, comprises the following steps: S1, select mica with a fineness of 800-2200 mesh, and treat it with acid for later use; S2. Heat the mixer to 90-100°C and add polypropylene. After mixing for 10-15 minutes, add two-fifths of the silane coupling agent and mix for 10-15 minutes. After cooling for 5-10 minutes, when the temperature is below 30°C, take it out for use. S3, keep the mixer at 70-80°C, add the reserved mica powder in S1 and mix for 10-20 minutes, then add carbon black, two-fifths of silane coupling agent and epoxy resin, mix for 4-8 minutes, and then perform material surface treatment; S4, add the spare materials in S2 to the mixer, and then add one fifth of silane coupling agent, titanate coupling agent, compatibilizer, chlorinated polyethylene, epoxy soybean oil, antioxidant, flame retardant, paraffin and liquid paraffin, mix at high speed for 3-5 minutes, and heat to 90-100°C for insulation; S5. Add hexamethylenetetramine to the mixer, mix at high speed for 10-15 minutes, take it out, send it to a low-speed mixer, and cool and stir it at low temperature for 4-8 minutes. Take it out when the material temperature is lower than 30°C; S6, the material taken out from S5 is mixed and plasticized by an internal mixer, and then drawn by a single-screw wire drawing machine, and then granulated by a granulator to prepare a finished product.

[0026] Please refer to the attached pictures Figure 3 - Figure 5As shown, the mixer described in a method for preparing a semiconductor mica composite material includes a mixing tank 1, wherein a top plate 10, a top ring 20 and a bottom plate 30 are sequentially installed inside the mixing tank 1 from top to bottom, and a mixing space is provided between the top ring 20 and the bottom plate 30; a controller is provided on the mixing tank 1, and by setting the controller, it is convenient to control the electrical components inside the device, and the controller control circuit can be realized by simple programming by technicians in the field, which belongs to the common knowledge in the field, and is only used without modification, so the control method and circuit connection are not described in detail. A stepper motor is provided on the mixing tank 1, and the stepper motor drives the central shaft 301 to rotate, the bottom plate 30 is installed on the inner bottom wall of the mixing tank 1, and the top plate 10 and the top ring 20 are located at the top of the mixing tank 1. When stirring the material, the material is first introduced into the mixing tank 1 so that the material is located between the top plate 10 and the top ring 20.

[0027] Please refer to the attached pictures Figure 3 - Figure 5 As shown, a central axis 301 and a plurality of auxiliary axis 302 are provided on the bottom plate 30. The central axis 301 is rotatably mounted on the axis of the bottom plate 30. The plurality of auxiliary axis 302 are distributed in a circle with the central axis 301 as the center. A lifting frame 303 is commonly sleeved on the central axis 301 and the plurality of auxiliary axis 302. The rotation axes of the central axis 301 and the lifting frame 303 coincide. A stirring paddle 304 is slidably connected to each auxiliary axis 302. The stirring paddle 304 rotates with the auxiliary axis 302, and the stirring paddle 304 is rotatably mounted at the lower end of the lifting frame 303. A central gear ring 201, a plurality of auxiliary gears 202, an outer gear ring 203 and a gear frame 204 constituting a planetary gear system are provided inside the top ring 20. The central gear ring 201 is mounted on the central axis 301, and the auxiliary gears 202 are mounted on the corresponding auxiliary axis 302. When the material is stirred, the stepper motor drives the central shaft 301 to rotate. Since the central gear ring 201, several auxiliary gears 202, the outer gear ring 203 and the gear rack 204 constitute a planetary gear system, under the drive of the central shaft 301, several auxiliary shafts 302 rotate around the central shaft 301, and the auxiliary shafts 302 themselves rotate to realize the revolution and rotation of the stirring paddle 304. While stirring the material, the fluidity of the material is improved, and the blind area of ​​stirring and mixing is also reduced.

[0028] Please refer to the attached pictures Figure 3 - Figure 7As shown, an adjusting box 40 installed on the side wall of the mixing tank 1 is provided between the top plate 10 and the top ring 20, the top plate 10 is provided with a placement groove 101 and a rotating disk 102 rotatably installed, a reducer 205 is installed on the upper end of the central shaft 301, and the output end of the reducer 205 drives the rotating disk 102 to rotate through the internal mechanism of the adjusting box 40; a sliding groove 103 and a liquid storage cavity 104 are provided inside the rotating disk 102, a moving block 105 is slidably installed inside the sliding groove 103, and two coaxially connected winding drums 108 and a fixed block 104 are provided at the front and rear ends of the placement groove 101. A fixed frame 109, two cable drums 108 have different inner diameters and are each equipped with a pull rope 110, a pull rod 111 is slidably arranged on the fixed frame 109, the pull rope 110 on the cable drum 108 with a smaller inner diameter is connected to one end of the pull rod 111, the other end of the pull rod 111 is connected to an oil telescopic rod 112, the other end of the oil telescopic rod 112 is slidably connected to a guide frame 113, the moving block 105 slides inside the guide frame 113, the lifting frame 303 is rotatably connected to a lifting ring 305, and the pull rope 110 on the cable drum 108 with a larger inner diameter is connected to the lifting ring 305.

[0029] When the material is stirred, the stepper motor drives the central shaft 301 to rotate, and the central shaft 301 drives the rotating disk 102 to rotate. Since the pull rod 111 is slidably mounted on the fixed frame 109, and the pull rod 111 is slidably connected to the guide frame 113 through the oil telescopic rod 112, as the rotating disk 102 rotates, the pull rod 111 is driven to reciprocate back and forth. When the pull rod 111 pulls the pull rope 110, the lifting ring 305 is driven to move upward. When the pull rod 111 loosens the pull rope 110, the lifting ring 305 moves downward under the influence of its own gravity. Therefore, the pull rod 111 is driven to move upward. The lifting ring 305 is driven by the pull rope 110 to do up and down reciprocating motion, thereby realizing the up and down reciprocating motion of the stirring paddle 304, that is, the stirring paddle 304 not only moves up and down in the material, but also revolves around the central axis 301 and rotates itself, thereby improving the fluidity of the material and reducing the blind area of ​​stirring and mixing, thereby avoiding uneven distribution of materials and stirring agents, thereby affecting the uniformity and efficiency of the stirring polymerization reaction, and at the same time avoiding adverse phenomena such as local overheating, condensation and even explosion caused by excessive reaction in some areas, and excessive slow reaction in some areas, thereby affecting the overall production efficiency and a series of other problems.

[0030] Please refer to the attached pictures Figure 4 - Figure 8As shown, the adjusting box 40 is provided with a short-shaft bevel gear 401 and a long-shaft bevel gear 402 meshing with each other, and an inner shaft rod 405 connected to the axis of the long-shaft bevel gear 402. The output end of the reducer 205 and the axis rod of the short-shaft bevel gear 401 are connected by a sprocket chain transmission. The adjusting box 40 is also provided with an inclined surface, and a slider rod 406 slides on the inclined surface. The slider rod 406 is installed on the inner shaft rod 405. The upper end of the adjusting box 40 is rotatably installed with an outer shaft rod 403 and a rotating sleeve 404. The outer shaft rod 403 and the rotating sleeve 404 are both sleeved with gears, and the two gears mesh with each other. The inner shaft rod 405 and the outer shaft rod 403 are connected by a coupling 407. The rotating disk 102 is connected to the outer wall of the rotating sleeve 404 through a bracket. The coupling 407 is composed of a telescopic rod and a universal joint arranged at both ends of the telescopic rod. The inner inclined surface of the adjusting box 40 is parallel to the inclined surface of the side wall of the long-shaft bevel gear 402. A photoelectric sensor is provided inside the mixing tank 1, and a reduction motor 408 is provided inside the regulating box 40. The output end of the reduction motor 408 is connected to a winding disk, and a pull wire 409 is installed on the winding disk. The other end of the pull wire 409 is connected to the slider rod 406 through a guide wheel installed on the inclined surface inside the regulating box 40.

[0031] Please refer to the attached pictures Figure 4 - Figure 8 As shown, a liquid storage box 410 is provided inside the regulating box 40, and a piston push rod 411 is slidably provided inside the liquid storage box 410, and the piston push rod 411 extends outside the liquid storage box 410 and is slidably connected to the slider rod 406, and a return spring is built into the oil telescopic rod 112. A piston block 106 is slidably installed inside the liquid storage chamber 104, and the moving block 105 and the piston block 106 are connected by a connecting rod. Rotary joints 107 are installed at both ends of the axis of the rotating disk 102, and the two rotary joints 107 are respectively connected to the front and rear ends of the liquid storage chamber 104 through hoses. The front and rear sides of the piston block 106 are filled with oil, and the oil telescopic rod 112 is connected to one of the rotary joints 107 through a hose, and the lower end of the liquid storage box 410 is connected to the other rotary joint 107 through a hose that runs through the rotating shaft sleeve 404.

[0032] When different amounts of material are in the mixing tank 1, the liquid levels thereof are also different. If the up and down reciprocating range of the stirring paddle 304 remains unchanged, the stirring paddle 304 will rush out of the material liquid surface, seriously reducing the working efficiency, or the stirring paddle 304 may fail to reach the upper end of the material, so that the mixing and mixing blind spot still exists; therefore, when the material is introduced into the mixing tank 1, the photoelectric sensor detects the material height inside the mixing tank 1, and then the reduction motor 408 drives the winding drum to rotate and reel in the pull wire 409, that is, the higher the material height, the longer the reduction motor 408 drives the winding drum to rotate, and the more the pull wire 409 is reeled in, causing the slider rod 406 to drop more, and as the slider rod 406 drops, the piston push rod 411 follows and moves downward, so that The oil in the liquid storage chamber 104 is squeezed into the liquid storage chamber 104. As the oil at one end of the liquid storage chamber 104 increases, the piston block 106 moves, and at the same time drives the moving block 105 to move, changing the position of the moving block 105. Since the position of the moving block 105 changes, when the rotating disk 102 rotates, the back-and-forth reciprocating motion range of the pull rod 111 is expanded, so that the up-and-down reciprocating motion range of the stirring paddle 304 is expanded. When the piston block 106 moves, the oil in the liquid storage chamber 104 is squeezed into the oil telescopic rod 112. When the moving block 105 moves, the oil telescopic rod 112 is extended, so that the position of the pull rod 111 does not change, thereby preventing the initial position of the up-and-down reciprocating motion of the stirring paddle 304 from changing. When the up and down reciprocating range of the stirring paddle 304 is expanded, the time of a single up and down movement of the stirring paddle 304 does not change, which will make the up and down reciprocating speed of the stirring paddle 304 too fast, and each area of ​​the material cannot be fully stirred and mixed. Therefore, when the up and down reciprocating range of the stirring paddle 304 changes, that is, when the slider rod 406 descends, the slider rod 406 will also drive the inner shaft rod 405 to move. As the inner shaft rod 405 moves downward, the meshing interface of the short-axis bevel gear 401 and the long-axis bevel gear 402 changes, so that the short-axis bevel gear 401 rotates one circle, and the rotation angle of the long-axis bevel gear 402 becomes smaller, so that the rotation speed of the rotating disk 102 is reduced, and the up and down movement speed of the stirring paddle 304 tends to be stable; Specific operation method: First, introduce the material into the mixing tank 1 so that the material is located between the top plate 10 and the top ring 20; The photoelectric sensor first detects the material height inside the mixing tank 1, and then the reduction motor 408 drives the winding drum to rotate and reel in the pull wire 409. That is, the higher the material height is, the longer the reduction motor 408 drives the winding drum to rotate, and the more the pull wire 409 is reeled in, causing the slider rod 406 to drop more. As the slider rod 406 drops, the piston push rod 411 moves downward, so that the oil inside the liquid storage chamber 104 is squeezed into the liquid storage chamber 104. As the oil at one end of the liquid storage chamber 104 increases, the piston block 106 moves, and at the same time drives the moving block 1 05 moves, changing the position of the moving block 105. Since the position of the moving block 105 changes, when the rotating disk 102 rotates, the back-and-forth reciprocating motion range of the pull rod 111 is expanded, so that the up-and-down reciprocating motion range of the stirring paddle 304 is expanded. When the piston block 106 moves, the oil inside the liquid storage chamber 104 is squeezed into the oil telescopic rod 112. When the moving block 105 moves, the oil telescopic rod 112 is extended, so that the position of the pull rod 111 does not change, thereby preventing the initial position of the up-and-down reciprocating motion of the stirring paddle 304 from changing. When the up and down reciprocating range of the stirring paddle 304 is expanded, the time of a single up and down movement of the stirring paddle 304 does not change, which will make the up and down reciprocating speed of the stirring paddle 304 too fast, and each area of ​​the material cannot be fully stirred and mixed. Therefore, when the up and down reciprocating range of the stirring paddle 304 changes, that is, when the slider rod 406 descends, the slider rod 406 will also drive the inner shaft rod 405 to move. As the inner shaft rod 405 moves downward, the meshing interface of the short-axis bevel gear 401 and the long-axis bevel gear 402 changes, so that the short-axis bevel gear 401 rotates one circle, and the rotation angle of the long-axis bevel gear 402 becomes smaller, so that the rotation speed of the rotating disk 102 is reduced, and the up and down movement speed of the stirring paddle 304 tends to be stable; When the material is stirred, the stepper motor drives the central shaft 301 to rotate. Since the central gear ring 201, the auxiliary gears 202, the outer gear ring 203 and the gear frame 204 constitute a planetary gear system, the central shaft 301 drives the auxiliary shafts 302 to rotate around the central shaft 301, and the auxiliary shafts 302 rotate themselves, so as to realize the revolution and rotation of the stirring paddle 304. At the same time, since the central shaft 301 drives the rotating disk 102 to rotate, the pull rod 111 is slidably installed on the fixed frame 109, and the pull rod 111 is connected to the guide frame 113 through the oil telescopic rod 112. Sliding connection, therefore, as the rotating disk 102 rotates, it will drive the pull rod 111 to do reciprocating motion back and forth. When the pull rod 111 pulls the pull rope 110, it drives the lifting ring 305 to move up. When the pull rod 111 loosens the pull rope 110, the lifting ring 305 moves down under the influence of its own gravity. Therefore, the pull rod 111 drives the lifting ring 305 to do reciprocating motion up and down through the pull rope 110, thereby realizing the up and down reciprocating motion of the stirring paddle 304, that is, the stirring paddle 304 not only moves up and down in the material, but also revolves around the central axis 301 and rotates itself, thereby improving the fluidity of the material and reducing the blind spot of stirring and mixing.

Claims

1. A semiconductor mica composite material, prepared from mica, an adhesive, a reinforcing agent and an auxiliary agent, characterized in that: The invention comprises the following raw materials in parts by weight: Mica 20%~40%; Polypropylene 30%-50%, chlorinated polyethylene 1%-3%, epoxy resin 1%-3%, epoxidized soybean oil 2%-4%, carbon black 4%-8%, paraffin 1%-3%, liquid paraffin 2%-4%; Silane coupling agent (KH570) 5%~10%, titanate coupling agent 1%~3%, compatibilizer (107) 4%~8%, curing agent urotropine 2%~4%, flame retardant (101) 2%~4%, antioxidant (1010) 1%~3%.

2. A method for preparing a semiconductor mica composite material, applied to a semiconductor mica composite material as claimed in claim 1, characterized in that: The following steps are involved: S1, select mica with a fineness of 800-2200 mesh, and treat it with acid for later use; S2. Heat the mixer to 90-100°C and add polypropylene. After mixing for 10-15 minutes, add two-fifths of the silane coupling agent and mix for 10-15 minutes. After cooling for 5-10 minutes, when the temperature is below 30°C, take it out for use. S3, keep the mixer at 70-80°C, add the reserved mica powder in S1 and mix for 10-20 minutes, then add carbon black, two-fifths of silane coupling agent and epoxy resin, mix for 4-8 minutes, and then perform material surface treatment; S4, add the spare materials in S2 to the mixer, and then add one fifth of silane coupling agent, titanate coupling agent, compatibilizer, chlorinated polyethylene, epoxy soybean oil, antioxidant, flame retardant, paraffin and liquid paraffin, mix at high speed for 3-5 minutes, and heat to 90-100°C for insulation; S5. Add hexamethylenetetramine to the mixer, mix at high speed for 10-15 minutes, take it out, send it to a low-speed mixer, and cool and stir it at low temperature for 4-8 minutes. Take it out when the material temperature is lower than 30°C; S6, the material taken out from S5 is mixed and plasticized by an internal mixer, and then drawn by a single-screw wire drawing machine, and then granulated by a granulator to prepare a finished product.

3. The method for preparing a semiconductor mica composite material according to claim 2, characterized in that: The mixer described in the above steps comprises a mixing tank (1), wherein a top plate (10), a top ring (20) and a bottom plate (30) are sequentially installed inside the mixing tank (1) from top to bottom, a mixing space is provided between the top ring (20) and the bottom plate (30), a central axis (301) and a plurality of auxiliary axes (302) are provided on the bottom plate (30), the central axis (301) is rotatably installed on the axis of the bottom plate (30), a plurality of the auxiliary axes (302) are distributed in a circle with the central axis (301) as the center, a lifting frame (303) is commonly sleeved on the central axis (301) and the plurality of auxiliary axes (302), the rotation axes of the central axis (301) and the lifting frame (303) coincide, each of the auxiliary axes (302) is slidably connected with a stirring paddle (304), the stirring paddle (304) rotates following the auxiliary axis (302), and the stirring paddle (304) is rotatably installed at the lower end of the lifting frame (303); The top ring (20) is provided with a central gear ring (201), a plurality of auxiliary gears (202), an outer gear ring (203) and a gear rack (204) constituting a planetary gear system. The central gear ring (201) is mounted on a central shaft (301). The auxiliary gears (202) are mounted on corresponding auxiliary shafts (302). An adjustment box (40) mounted on the side wall of the mixing tank (1) is provided between the top plate (10) and the top ring (20). The top plate (10) is provided with a placement groove (101) and a rotatably mounted rotating disk (102). A reducer (205) is installed at the upper end of the central shaft (301). The output end of the reducer (205) drives the rotating disk (102) to rotate through the internal mechanism of the adjustment box (40). The rotating disk (102) is provided with a sliding groove (103) and a liquid storage chamber (104) inside. A moving block (105) is slidably installed inside the sliding groove (103). Two coaxially connected winding drums (108) and a fixing frame (109) are respectively provided at the front and rear ends inside the placement groove (101). The two winding drums (108) have different inner diameters and are each installed with a pull rope (110). A pull rod (111) is slidably installed on the fixing frame (109). The winding drum with a smaller inner diameter (108) has a smaller inner diameter (108). The pull rope (110) on the pull rod (108) is connected to one end of the pull rod (111), the other end of the pull rod (111) is connected to an oil telescopic rod (112), the other end of the oil telescopic rod (112) is slidably connected to a guide frame (113), the moving block (105) slides inside the guide frame (113), the lifting frame (303) is rotatably connected to a lifting ring (305), and the pull rope (110) on the winding drum (108) with a larger inner diameter is connected to the lifting ring (305).

4. The method for preparing a semiconductor mica composite material according to claim 2, characterized in that: The mixing tank (1) is provided with a controller and a stepper motor, and the stepper motor drives the central shaft (301) to rotate. The bottom plate (30) is mounted on the bottom wall of the mixing tank (1), and the top plate (10) and the top ring (20) are located at the top of the inside of the mixing tank (1).

5. The method for preparing a semiconductor mica composite material according to claim 2, characterized in that: The regulating box (40) is provided with a short-axis bevel gear (401) and a long-axis bevel gear (402) that mesh with each other, and an inner shaft (405) connected to the axis of the long-axis bevel gear (402). The output end of the reducer (205) and the axis of the short-axis bevel gear (401) are connected by a sprocket chain transmission. The regulating box (40) is also provided with an inclined surface, and a slider rod (406) slides on the inclined surface. The slider rod (406) is installed on the inner shaft rod (405). An outer shaft rod (403) and a rotating shaft sleeve (404) are rotatably installed on the upper end of the regulating box (40). Gears are sleeved on the outer shaft rod (403) and the rotating shaft sleeve (404), and the two gears mesh with each other. The inner shaft rod (405) and the outer shaft rod (403) are connected by a coupling (407). The rotating disk (102) is connected to the outer wall of the rotating shaft sleeve (404) through a bracket.

6. The method for preparing a semiconductor mica composite material according to claim 5, characterized in that: The coupling (407) is composed of a telescopic rod and universal joints arranged at both ends of the telescopic rod. The internal inclined surface of the adjustment box (40) is parallel to the side wall inclined surface of the long-axis bevel gear (402).

7. The method for preparing a semiconductor mica composite material according to claim 2, characterized in that: A liquid level sensor is provided inside the mixing tank (1), a reduction motor (408) is provided inside the regulating box (40), an output end of the reduction motor (408) is connected to a winding disk, a pull wire (409) is installed on the winding disk, and the other end of the pull wire (409) is connected to a slider rod (406) via a guide wheel installed on an inclined surface inside the regulating box (40).

8. The method for preparing a semiconductor mica composite material according to claim 5, characterized in that: A liquid storage box (410) is provided inside the regulating box (40), a piston push rod (411) is slidably provided inside the liquid storage box (410), the piston push rod (411) extends outside the liquid storage box (410) and is slidably connected to the slider rod (406), and a return spring is built into the oil telescopic rod (112).

9. The method for preparing a semiconductor mica composite material according to claim 8, characterized in that: A piston block (106) is slidably mounted inside the liquid storage chamber (104); the moving block (105) and the piston block (106) are connected via a connecting rod; rotating joints (107) are mounted at both upper and lower ends of the axis of the rotating disk (102); the two rotating joints (107) are respectively connected to the front and rear ends of the liquid storage chamber (104) via hoses; the front and rear sides of the piston block (106) are filled with oil; the oil telescopic rod (112) is connected to one of the rotating joints (107) via a hose; and the lower end of the liquid storage box (410) and the other rotating joint (107) are connected via a hose that passes through the rotating shaft sleeve (404).