Alignment apparatus, film forming apparatus, control method, method for manufacturing electronic device, program and storage medium

Abstract

An alignment device is provided with: a substrate supporting member that supports a substrate; a mask support member that supports the mask; a distance adjusting part for adjusting the distance between the substrate supporting part and the mask supporting part in the gravity direction; a measuring means for measuring the amount of positional shift between the substrate and the mask; a position adjusting part for adjusting the relative position of the substrate and the mask; and a control unit that, when the amount of positional shift measured by the measurement unit in a contact state in which the substrate is in contact with the mask is outside an allowable range, controls the measurement of the amount of positional shift by the measurement unit in a state in which the substrate is in contact with the mask before the measurement of the amount of positional shift is performed by the measurement unit in a state in which the substrate is in contact with the mask, and controls the measurement of the amount of positional shift by the measurement unit in a state in which the substrate is in contact with the mask. A separation operation for separating the substrate from the mask is performed by the distance adjustment member.

Description

Technical Field

[0001] The invention relates to a technology for aligning a substrate and a mask. Background Art

[0002] In the manufacture of organic EL displays, etc., a mask is used to form a film of a vapor deposition material on a substrate. As a pre-treatment for film formation, the mask and the substrate are aligned so that the two overlap. In the technology described in Patent Document 1, the final confirmation of the relative position of the mask and the substrate is performed in a state where the mask and the substrate are in contact, especially in a state where the two are in close contact as a whole. In the final confirmation, if the positional deviation is outside the allowable range, the mask and the substrate are partially contacted again to measure the positional deviation, and the mask and the substrate are aligned again.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-007538 Summary of the invention

[0006] Problems to be solved by the invention

[0007] If the relative position of the mask and the substrate is adjusted many times in the re-alignment after the final check, it is disadvantageous in terms of the generation of particles and production efficiency.

[0008] The present invention provides a technology capable of reducing the number of times of adjusting the relative positions of a mask and a substrate.

[0009] Solutions to Solve Problems

[0010] According to the present invention, there is provided an alignment device, comprising:

[0011] a substrate supporting member, the substrate supporting member supporting the substrate;

[0012] a mask supporting member, wherein the mask supporting member supports the mask;

[0013] a distance adjusting component, the distance adjusting component adjusting the distance between the substrate supporting component and the mask supporting component in the direction of gravity;

[0014] A measuring component, the measuring component measures a positional offset between the substrate and the mask;

[0015] a position adjustment component, the position adjustment component adjusting the relative position of the substrate and the mask; and

[0016] Control components,

[0017] It is characterized in that

[0018] When the positional displacement amount measured by the measuring component in a contact state between the substrate and the mask is outside an allowable range, the control component performs a separation action of separating the substrate from the mask by the distance adjustment component before measuring the positional displacement amount by the measuring component in a state where the substrate and the mask are in contact.

[0019] Effects of the Invention

[0020] According to the present invention, it is possible to provide a technique capable of reducing the number of times of adjusting the relative position of a mask and a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of a portion of a production line for electronic devices.

[0022] Figure 2 This is a schematic diagram of a film forming apparatus according to one embodiment of the present invention.

[0023] Figure 3 It is an explanatory diagram of a substrate supporting unit.

[0024] Figure 4 This is an illustration of the adjustment unit.

[0025] Figure 5 This is a diagram for explaining the measurement unit.

[0026] Figure 6 It is a flowchart which shows the control process example.

[0027] Figure 7 It is a flowchart which shows the control process example.

[0028] Figure 8 This is a diagram illustrating the operation of the alignment device.

[0029] Fig. 9 This is a diagram illustrating the operation of the alignment device.

[0030] Fig.10 This is a diagram illustrating the operation of the alignment device.

[0031] Fig.11 This is a diagram illustrating the operation of the alignment device.

[0032] Fig.12 This is a diagram illustrating the operation of the alignment device.

[0033] Fig.13 This is a diagram illustrating the operation of the alignment device.

[0034] Fig.14 This is a diagram illustrating the operation of the alignment device.

[0035] Fig.15A This is an overall diagram of an organic EL display device.

[0036] Fig. 15B This is a diagram showing the cross-sectional structure of one pixel. DETAILED DESCRIPTION

[0037] Hereinafter, the embodiments are described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the invention involved in the claims. Although a plurality of features are described in the embodiments, not all of these features are necessarily required for the invention, and a plurality of features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same or similar structures are marked with the same reference numerals, and repeated descriptions are omitted.

[0038] <Electronic device production line>

[0039] Figure 1 This is a schematic diagram showing a part of the structure of a production line of electronic devices to which the film-forming apparatus of the present invention can be applied. Figure 1 The production line is, for example, a production line for manufacturing display panels of organic EL display devices for smartphones, and the substrates 100 are sequentially transported to the film forming blocks 301 , and organic EL films are formed on the substrates 100 .

[0040] In the film forming block 301, a plurality of film forming chambers 303a to 303d for performing film forming processing on the substrate 100 and a mask storage chamber 305 for storing masks before and after use are arranged around a conveying chamber 302 having an octagonal shape when viewed from above. A conveying robot (conveying component) 302a for conveying the substrate 100 is arranged in the conveying chamber 302. The conveying robot 302a includes a manipulator for holding the substrate 100 and a multi-joint arm for moving the manipulator in the horizontal direction. In other words, the film forming block 301 is a cluster-type film forming unit in which a plurality of film forming chambers 303a to 303d are arranged in a manner surrounding the conveying robot 302a. In addition, when the film forming chambers 303a to 303d are collectively referred to or are not distinguished, they are expressed as film forming chambers 303.

[0041] In the conveying direction (arrow direction) of the substrate 100, a buffer chamber 306, a swirl chamber 307, and a transfer chamber 308 are respectively arranged on the upstream and downstream sides of the film forming block 301. During the manufacturing process, each chamber is maintained in a vacuum state. Figure 1 Only one film forming block 301 is shown in the figure, but the production line of this embodiment has a plurality of film forming blocks 301, and has a structure in which the plurality of film forming blocks 301 are connected by a connecting device consisting of a buffer chamber 306, a swirl chamber 307, and a delivery chamber 308. In addition, the structure of the connecting device is not limited thereto, and for example, it may be composed of only the buffer chamber 306 or the delivery chamber 308.

[0042] The conveying robot 302a delivers the substrate 100 from the upstream transfer chamber 308 to the conveying chamber 302, conveys the substrate 100 between the film forming chambers 303, conveys the mask between the mask storage chamber 305 and the film forming chamber 303, and conveys the substrate 100 from the conveying chamber 302 to the buffer chamber 306 on the downstream side.

[0043] The buffer chamber 306 is a chamber for temporarily storing substrates 100 according to the operation status of the production line. The buffer chamber 306 is provided with a substrate storage rack (also referred to as a box body) having a multi-layer structure. The substrate storage rack can store a plurality of substrates 100 in a horizontal state with the processed surface (film-forming surface) of the substrate 100 facing downward in the direction of gravity, and a lifting mechanism. The substrate storage rack is raised and lowered so as to align the layer of the substrate 100 sent in or out with the conveying position. In this way, a plurality of substrates 100 can be temporarily stored in the buffer chamber 306 and allowed to stay.

[0044] The swirling chamber 307 is provided with a device for changing the orientation of the substrate 100. In the present embodiment, the swirling chamber 307 rotates the orientation of the substrate 100 by 180 degrees by a conveying robot provided in the swirling chamber 307. The conveying robot provided in the swirling chamber 307 rotates 180 degrees while supporting the substrate 100 received in the buffer chamber 306 and transfers it to the delivery chamber 308, thereby exchanging the front end and the rear end of the substrate in the buffer chamber 306 and the delivery chamber 308. Thus, the orientation of the substrate 100 when it is fed into the film forming chamber 303 becomes the same orientation in each film forming block 301, and therefore, the scanning direction of the film forming relative to the substrate S and the orientation of the mask can be made consistent in each film forming block 301. By adopting such a structure, the orientation of the mask set to the mask storage chamber 305 in each film forming block 301 can be made consistent, the management of the mask can be simplified, and the usability can be improved.

[0045] The control system of the production line includes a host device 300 that controls the entire production line as a host computer and control devices 14a to 14d, 309, and 310 that control each structure, and these devices can communicate via a wired or wireless communication line 300a. The control devices 14a to 14d are provided corresponding to the film forming chambers 303a to 303d, and control the film forming device 1 described later. In addition, when the control devices 14a to 14d are collectively referred to or are not distinguished, they are expressed as the control device 14.

[0046] The control device 309 controls the transfer robot 302a. The control device 310 controls the devices of the swirl chamber 307. The host device 300 sends information on the substrate 100 and instructions on the transfer timing to each control device 14, 309, 310, and each control device 14, 309, 310 controls each structure based on the received instructions.

[0047] <Overview of film forming equipment>

[0048] Figure 2 1 is a schematic diagram of a film forming device 1 according to an embodiment of the present invention. The film forming device 1 is a device for forming a film of a vapor deposition material on a substrate 100, and a mask 101 is used to form a thin film of the vapor deposition material in a predetermined pattern. The material of the substrate 100 on which the film is formed by the film forming device 1 can be appropriately selected from materials such as glass, resin, metal, etc., and it is preferred to use a material having a resin layer such as polyimide formed on glass. As the vapor deposition material, there are organic materials, inorganic materials (metals, metal oxides, etc.) and the like. The film forming device 1 can be applied to manufacturing devices for manufacturing electronic devices or optical components such as display devices (flat panel displays, etc.), thin film solar cells, organic photoelectric conversion elements (organic thin film imaging elements), etc., and can be particularly applied to manufacturing devices for manufacturing organic EL panels. In the following description, an example in which the film forming device 1 forms a film on the substrate 100 by vacuum vapor deposition is described, but the present invention is not limited thereto, and various film forming methods such as sputtering and CVD can be applied. In addition, in each figure, the arrow Z represents the up and down direction (gravity direction), and the arrows X and Y represent mutually orthogonal horizontal directions.

[0049] The film forming apparatus 1 has a box-shaped vacuum chamber 3. The internal space 3a of the vacuum chamber 3 is maintained in a vacuum environment or an inert gas environment such as nitrogen. In the present embodiment, the vacuum chamber 3 is connected to a vacuum pump (vacuum exhaust component) not shown. In addition, in this specification, "vacuum" refers to a state filled with a gas with a pressure lower than atmospheric pressure, in other words, a decompression state. A substrate support unit 6 (substrate support component) that supports the substrate 100 in a horizontal posture, a mask stage 5 (mask support component) that supports the mask 101, a film forming unit 4, and a plate unit 9 are arranged in the internal space 3a of the vacuum chamber 3. The mask 101 is a metal mask having an opening pattern corresponding to the thin film pattern to be formed on the substrate 100, and is fixed on the mask stage 5. As the mask 101, a mask having a structure in which a mask foil with a thickness of about several μm to several tens of μm is welded and fixed on a frame-shaped mask frame can be used. The material of the mask 101 is not particularly limited, but it is preferable to use a metal with a small thermal expansion coefficient such as Invar alloy. The film forming process is performed in a state where the substrate 100 is arranged above the mask 101 and the substrate 100 and the mask 101 overlap each other.

[0050] The plate unit 9 includes a cooling plate 10 and a magnet plate 11. The cooling plate 10 is suspended below the magnet plate 11 so as to be displaceable in the Z direction relative to the magnet plate 11. The cooling plate 10 is a plate for contacting the surface (back surface) of the substrate 100 opposite to the film-forming surface during film formation to sandwich the substrate 100 between the mask 101. The cooling plate 10 (cooling member) cools the substrate 100 by contacting the back surface of the substrate 100, and in particular cools the substrate 100 during film formation.

[0051] In addition, the cooling plate 10 is not limited to a structure that actively cools the substrate 100 with a water cooling mechanism, etc., and can also be a plate-shaped member that absorbs the heat of the substrate 100 by contacting the substrate 100 even though a water cooling mechanism is not provided. The cooling plate 10 can also be called a pressing plate. The magnet plate 11 is a plate that attracts the mask 101 by magnetic force, and is placed on the upper surface of the substrate 100 to improve the close contact between the substrate 100 and the mask 101 during film formation. The film forming unit 4 is composed of a heater, a baffle, a driving mechanism for an evaporation source, an evaporation rate monitor, etc., and is an evaporation source that evaporates the evaporation material onto the substrate 100. More specifically, in this embodiment, the film forming unit 4 is a linear evaporation source in which a plurality of nozzles (not shown) are arranged in the X direction and the evaporation material is discharged from each nozzle. The evaporation source 12 reciprocates in the Y direction (the depth direction of the device) by an evaporation source moving mechanism (not shown).

[0052] <Alignment device>

[0053] The film forming apparatus 1 includes an alignment device 2 for aligning a substrate 100 and a mask 101. The alignment device 2 includes a substrate support unit 6 for supporting the peripheral edge of the substrate 100. Figure 2 In addition, refer to Figure 3 Provide explanation. Figure 3 : is an explanatory diagram of the substrate support unit 6, which is a stereoscopic diagram thereof. The substrate support unit 6 includes a rectangular frame-shaped base portion 60 and a plurality of claw-shaped receiving portions 61 and 62 protruding inward from the base portion 60. In addition, the receiving portions 61 and 62 are sometimes also referred to as "receiving claws" or "fingers". The plurality of receiving portions 61 are arranged at intervals on the long side of the base portion 60, and the plurality of receiving portions 62 are arranged at intervals on the short side of the base portion 60. The peripheral portion of the substrate 100 is placed on each of the receiving portions 61 and 62. The base portion 60 is suspended from the beam member 222 via a plurality of pillars 64.

[0054] In addition, Figure 3In the example of FIG. 6 , the base portion 60 is formed into a seamless rectangular frame shape that surrounds the outer periphery of the rectangular substrate 100, but the present invention is not limited thereto and may be formed into a rectangular frame shape having a cutout in part. By providing the cutout in the base portion 60, the conveying robot 302a can be made to avoid the base portion 60 and retreat when the substrate 100 is transferred from the conveying robot 302a to the placing portion 61 of the substrate supporting unit 6, thereby improving the efficiency of conveying and transferring the substrate 100.

[0055] The substrate support unit 6 further includes a clamping unit 63 (clamping unit). The clamping unit 63 includes a plurality of clamping units 66. Each clamping unit 66 is provided corresponding to each placement unit 61, and the peripheral edge of the substrate 100 can be clamped and held by the clamping unit 66 and the placement unit 61. As a supporting method for the substrate 100, in addition to the method of clamping and holding the peripheral edge of the substrate 100 by the clamping unit 66 and the placement unit 61, a method of placing the substrate 100 only on the placement units 61 and 62 without providing the clamping unit 66 can also be adopted.

[0056] The clamping unit 63 further includes a support member 65 that supports a plurality of clamping portions 66. The support member 65 is extended along the long side of the base portion 60. The support member 65 is connected to the actuator 64 via the shaft R3. The shaft R3 extends upward from the support member 65 through an opening formed in the beam member 222 and an opening formed in the upper wall portion 30 of the vacuum chamber 3. The actuator 64 is, for example, an electric cylinder, and clamps and releases the peripheral portion of the substrate 100 by the clamping portion 66 and the mounting portion 61 by lifting and lowering the support member 65. The clamping unit 63 includes two sets of support members 65, shafts R3, and actuators 64.

[0057] The alignment device 2 includes a position adjustment unit 20 (position adjustment means) for adjusting the relative position between the substrate 100 supported by the substrate support unit 6 at the periphery and the mask 101 . Figure 2 In addition, refer to Figure 4 Provide explanation. Figure 4 It is a stereoscopic view (partial perspective view) of the position adjustment unit 20. The position adjustment unit 20 adjusts the relative position of the substrate 100 with respect to the mask 101 by displacing the substrate support unit 6 in the X-Y plane. That is, the position adjustment unit 20 can also be said to be a unit for adjusting the horizontal position of the mask 101 and the substrate 100. The position adjustment unit 20 can displace the substrate support unit 6 in the X direction, the Y direction, and the rotation direction around the axis of the Z direction. In the present embodiment, the position of the mask 101 is fixed, and the substrate 100 is displaced to adjust their relative positions, but the mask 101 can also be displaced to make the adjustment, or both the substrate 100 and the mask 101 can be displaced.

[0058] The position adjustment unit 20 includes a fixed plate 20a, a movable plate 20b, and a plurality of actuators 201 disposed between these plates. The fixed plate 20a and the movable plate 20b are rectangular frame-shaped plates, and the fixed plate 20a is fixed to the upper wall portion 30 of the vacuum chamber 3. In the present embodiment, four actuators 201 are provided, located at the four corners of the fixed plate 20a.

[0059] Each actuator 201 includes a motor 2011 as a driving source, a slider 2013 movable along a guide 2012, a slider 2014 provided on the slider 2013, and a rotating body 2015 provided on the slider 2014. The driving force of the motor 2011 is transmitted to the slider 2013 via a transmission mechanism such as a ball screw mechanism, so that the slider 2013 moves along the linear guide 2012. The rotating body 2015 is supported on the slider 2014 so as to be freely movable in a direction orthogonal to the slider 2013. The rotating body 2015 includes a fixed portion fixed to the slider 2014 and a rotating portion freely rotatable around an axis in the Z direction relative to the fixed portion, and the movable plate 20b is supported on the rotating portion.

[0060] The sliding members 2013 of two actuators 201 located at the diagonal positions of the fixed plate 20a among the four actuators 201 move in the X direction, and the sliding members 2013 of the remaining two actuators 201 move in the Y direction. The movable plate 20b can be displaced in the X direction, the Y direction, and the rotation direction around the axis in the Z direction relative to the fixed plate 20a by combining the movement amounts of the sliding members 2013 of the four actuators 201. The displacement amount can be controlled based on the detection result of a sensor such as a rotary encoder that detects the rotation amount of each motor 2011, for example.

[0061] A frame-shaped stand 21 is mounted on the movable plate 20b, and a distance adjustment unit 22 (first lifting unit) and a second lifting unit 13 as distance adjustment members are supported on the stand 21. When the movable plate 20b is displaced, the stand 21, the distance adjustment unit 22, and the second lifting unit 13 are displaced integrally.

[0062] The distance adjustment unit 22 adjusts the distance between the substrate support unit 6 and the mask stage 5 by raising and lowering the substrate support unit 6, so that the substrate 100 and the mask 101 whose peripheral portions are supported by the substrate support unit 6 approach or move away (separate) in the thickness direction (Z direction) of the substrate 100. In other words, the distance adjustment unit 22 is a contact and separation component that approaches the substrate 100 and the mask 101 in the overlapping direction or moves away in the opposite direction thereof.

[0063] In addition, the "distance" adjusted by the distance adjustment unit 22 is the so-called vertical distance (or plumb distance), and the distance adjustment unit can also be said to be a unit for adjusting the vertical position of the mask 101 and the substrate 100. In this embodiment, the distance adjustment unit 22 is a unit for lifting the substrate 100, and therefore, it is also called a "substrate lifting unit". Figure 2 As shown, the distance adjustment unit 22 includes a first lifting plate 220. A guide rail 21a extending in the Z direction is formed on the side of the platform 21, and the first lifting plate 220 can be raised and lowered in the Z direction along the guide rail 21a.

[0064] The actuator 64 of the clamping unit 63 is supported by the first lifting plate 220. The beam member 222 of the substrate support unit 6 provided inside the vacuum chamber 3 is connected to the first lifting plate 220 provided outside the vacuum chamber 3 via a plurality of shafts R1, and is lifted and lowered integrally with the first lifting plate 220. The shaft R1 is extended upward from the beam member 222, and is connected to the first lifting plate 220 through the opening of the upper wall portion 30. The first lifting plate 220 is a plate that is lifted and lowered integrally with the substrate support unit 6 that supports the substrate 100, and therefore is also referred to as a "substrate lifting plate".

[0065] The distance adjustment unit 22 also includes a driving unit 221 supported on the stand 21 and raising and lowering the first lifting plate 220. The driving unit 221 is a mechanism that uses the motor 221a as a driving source and transmits its driving force to the first lifting plate 220. As a transmission mechanism, in this embodiment, a ball screw mechanism having a ball screw shaft 221b and a ball nut 221c is adopted. The ball screw shaft 221b is extended in the Z direction and rotates around the axis in the Z direction by the driving force of the motor 221a. The ball nut 221c is fixed to the first lifting plate 220 and meshes with the ball screw shaft 221b. By rotating the ball screw shaft 221b and switching its rotation direction, the first lifting plate 220 can be raised and lowered in the Z direction. The lifting amount of the first lifting plate 220 can be controlled, for example, based on the detection result of a sensor such as a rotary encoder that detects the rotation amount of each motor 221a. Thus, the positions of the mounting portions 61 and 62 of the support substrate 100 in the Z direction can be controlled, and the contact and separation between the substrate 100 and the mask 101 can be controlled.

[0066] In addition, in the distance adjustment unit of the present embodiment, the position of the mask stage 5 is fixed, and the substrate support unit 6 is moved to adjust the distance between them in the Z direction, but the present invention is not limited to this. The position of the substrate support unit 6 may be fixed, and the mask stage 5 may be moved to adjust the distance, or both the substrate support unit 6 and the mask stage 5 may be moved to adjust the distance between them.

[0067] The second lifting unit 13 lifts and lowers the second lifting plate 12 disposed outside the vacuum chamber 3, thereby lifting and lowering the plate unit 9 connected to the second lifting plate 12 and disposed inside the vacuum chamber 3. The plate unit 9 is connected to the second lifting plate 12 via a plurality of shafts R2. The shaft R2 is extended upward from the magnet plate 11, and is connected to the lifting plate 12 through the opening of the beam member 222, the opening of the upper wall portion 30, the openings of the fixed plate 20a and the movable plate 20b, and the opening of the lifting plate 220. The second lifting unit 13 is also referred to as a "cooling plate lifting unit" or a "magnet plate lifting unit", and the second lifting plate 12 is also referred to as a "cooling plate lifting plate" or a "magnet plate lifting plate".

[0068] The second lifting plate 12 can be raised and lowered freely in the Z direction along the guide shaft 12a. The second lifting unit 13 is provided with a driving mechanism supported on the stand 21 and lifting and lowering the second lifting plate 12. The driving mechanism provided by the second lifting unit 13 is a mechanism that uses the motor 13a as a driving source and transmits its driving force to the second lifting plate 12. As a transmission mechanism, in this embodiment, a ball screw mechanism having a ball screw shaft 13b and a ball nut 13c is adopted. The ball screw shaft 13b is extended in the Z direction and rotates around the axis in the Z direction by the driving force of the motor 13a. The ball nut 13c is fixed to the second lifting plate 12 and meshes with the ball screw shaft 13b. By rotating the ball screw shaft 13b and switching its rotation direction, the second lifting plate 12 can be raised and lowered in the Z direction. The lifting amount of the second lifting plate 12 can be controlled, for example, based on the detection result of a sensor such as a rotary encoder that detects the rotation amount of each motor 13a. That is, the second lifting plate 12 is a unit (a second position adjusting member) that controls the position of the panel unit 6 including the cooling plate 10 in the Z direction, and can control the contact and separation between the panel unit 6 and the substrate 100 .

[0069] The openings of the upper wall 30 through which the axes R1 to R3 pass are sized to allow displacement of the axes R1 to R3 in the X and Y directions. The openings of the upper wall 30 through which the axes R1 to R3 pass are covered with bellows or the like to maintain airtightness of the vacuum chamber 3 .

[0070] The alignment device 2 includes a measuring unit (a first measuring unit 7 and a second measuring unit 8 (measuring means)) for measuring positional deviation between the substrate 100 supported by the substrate supporting unit 6 at its peripheral edge and the mask 101. Figure 2 In addition, refer to Figure 5 Provide explanation. Figure 51 is an explanatory diagram of the first measuring unit 7 and the second measuring unit 8, and shows a method of measuring the positional deviation between the substrate 100 and the mask 101. The first measuring unit 7 and the second measuring unit 8 of this embodiment are both imaging devices (cameras) for capturing images. The first measuring unit 7 and the second measuring unit 8 are arranged above the upper wall portion 30, and can capture images in the vacuum chamber 3 through a window portion (not shown) formed on the upper wall portion 30.

[0071] A substrate rough alignment mark 100a and a substrate fine alignment mark 100b are formed on the substrate 100, and a mask rough alignment mark 101a and a mask fine mark 101b are formed on the mask 101. Hereinafter, the substrate rough alignment mark 100a is sometimes referred to as a substrate rough mark 100a, and the substrate fine alignment mark 100b is sometimes referred to as a substrate fine mark 100b, and the two are collectively referred to as substrate marks. In addition, the mask rough alignment mark 101a is sometimes referred to as a mask rough mark 101a, and the mask fine alignment mark 101b is sometimes referred to as a mask fine mark 101b, and the two are collectively referred to as mask marks.

[0072] The substrate rough mark 100a is formed at the center of the short side of the substrate 100. The substrate fine mark 100b is formed at the four corners of the substrate 100. The mask rough mark 101a is formed at the center of the short side of the mask 101 corresponding to the substrate rough mark 100a. In addition, the mask fine mark 101b is formed at the four corners of the mask 101 corresponding to the substrate fine mark 101b.

[0073] Four second measurement units 8 (second measurement units 8a to 8d) are provided to capture the corresponding sets of substrate fine marks 100b and mask fine marks 101b (four sets in this embodiment). The second measurement unit 8 is a high-magnification CCD camera (fine camera) with a relatively narrow field of view but high resolution (e.g., several μm level), and measures the positional deviation between the substrate 100 and the mask 101 with high precision. One first measurement unit 7 is provided to capture the corresponding sets of substrate coarse marks 100a and mask coarse marks 101a (two sets in this embodiment).

[0074] The first measurement unit 7 is a low-magnification CCD camera (coarse camera) with a relatively wide field of view but low resolution, and measures the approximate positional deviation between the substrate 100 and the mask 101. Figure 5 In the example of FIG. 1 , a configuration is shown in which two groups of substrate rough marks 100a and mask rough marks 101a are photographed together by one first measurement unit 7, but the present invention is not limited thereto. As with the second measurement unit 8, two first measurement units 7 may be provided at positions corresponding to the respective groups so as to photograph the respective groups of substrate rough marks 100a and mask rough marks 101a.

[0075] In this embodiment, after the position adjustment (first alignment) of the substrate 100 and the mask 101 is performed based on the measurement result of the first measurement unit 7 , the precise position adjustment (second alignment) of the substrate 100 and the mask 101 is performed based on the measurement result of the second measurement unit 8 .

[0076] Here, in order to improve the accuracy of position adjustment based on alignment, it is necessary to improve the detection accuracy of each mark by the measurement unit. Therefore, as the second measurement unit 8 (fine camera) used in the second alignment (fine alignment) requiring high-precision position adjustment, it is preferable to use a camera that can obtain images with high resolution. However, if the resolution of the camera is increased, the depth of field becomes shallower. Therefore, in order to simultaneously capture the mark formed on the substrate 100 and the mark formed on the mask 101 that are the objects of capture, it is necessary to bring the two marks closer in the optical axis direction of the second measurement unit 8.

[0077] Therefore, in this embodiment, when detecting the substrate fine mark 100b and the mask fine mark 101b in the second alignment, the substrate 100 is brought close to the mask 101 until the substrate 100 is partially in contact with the mask 101. Since the peripheral portion of the substrate 100 is supported, the central portion of the substrate 100 is bent due to its own weight, and thus, the central portion of the substrate 100 is typically in contact with the mask 101.

[0078] In addition, in the first alignment (coarse alignment), the substrate coarse mark 100a and the mask coarse mark 101a are detected and the positions of the substrate 100 and the mask 101 are adjusted while the substrate 100 and the mask 101 are separated. In the first alignment, the first measurement unit 7 (coarse camera) having a relatively deep depth of field is used, so that the alignment can be performed while the substrate 100 and the mask 101 are separated. In this embodiment, after the position is roughly adjusted while the substrate 100 and the mask 101 are separated by the first alignment, the second alignment with higher accuracy of position adjustment is performed.

[0079] Thus, when the substrate 100 and the mask 101 are brought close to each other and brought into contact for the detection of the mark in the second alignment, the relative positions of the substrate 100 and the mask 101 have been adjusted to a certain extent, and therefore the substrate 100 and the mask 101 are brought into contact with each other in a state where the pattern of the film formed on the substrate 100 and the opening pattern of the mask 101 are aligned to a certain extent. Therefore, damage to the film formed on the substrate 100 due to the contact between the substrate 100 and the mask 101 can be reduced.

[0080] That is, by performing the first alignment for roughly adjusting the position while keeping the substrate 100 and the mask 101 away from each other as in the present embodiment and the second alignment including the step of bringing the substrate 100 and the mask 101 into partial contact with each other in combination, it is possible to achieve high-precision position adjustment while reducing damage to the film formed on the substrate 100. The details of the first alignment and the second alignment will be described later.

[0081] The control device 14 controls the entire film forming device 1. The control device 14 includes a processing unit (control component) 141, a storage unit 142, an input / output interface (I / O) 143, and a communication unit 144. The processing unit 141 is a processor represented by a CPU, and executes a program stored in the storage unit 142 to control the film forming device 1. The storage unit 142 is a storage device (storage component) such as ROM, RAM, HDD, etc., which stores various control information in addition to the program executed by the processing unit 141. The I / O 143 is an interface for sending and receiving signals between the processing unit 141 and external devices. The communication unit 144 is a communication device that communicates with the host device 300 or other control devices 14, 309, 310, etc. via the communication line 300a. The processing unit 141 receives information from the host device 300 or sends information to the host device 300 via the communication unit 144. In addition, all or part of the control devices 14, 309, 310 and the host device 300 may be constituted by a PLC, an ASIC, or an FPGA.

[0082] <Control Example>

[0083] An example of control of the film forming apparatus 1 executed by the processing unit 141 of the control unit 14 will be described. Figure 6 and Figure 7 is a flowchart showing an example of processing by the processing unit 141. Figure 8 to Figure 14 It is a diagram for explaining the operation of the alignment device 2.

[0084] In step S1, the substrate 100 is transported into the vacuum chamber 3 by the transport robot 302a, and the substrate 100 is supported by the substrate support unit 6. The substrate 100 is supported by the substrate support unit 6 above the mask 101 and is maintained away from the mask 101. In steps S2 and S3, the substrate 100 and the mask 101 are aligned.

[0085] In step S2 , the first alignment is performed. Here, the first measurement unit 7 performs measurement in a state where the substrate 100 and the mask 101 are separated, and the approximate position adjustment of the substrate 100 and the mask 101 is performed based on the measurement result. Figure 8The alignment of step S3 is schematically shown. State ST8A shows the manner in which the substrate rough mark 100a and the mask rough mark 101a are measured by the first measurement unit 7. The peripheral edge of the substrate 100 is placed on the placement parts 61 and 62, and clamped between the placement part 61 and the clamping part 66. The substrate 100 and the mask 101 are separated in the Z direction. The central part of the substrate 100 is bent downward due to its own weight. The plate unit 9 is on standby above the substrate 100.

[0086] The relative positions of the substrate coarse mark 100a and the mask coarse mark 101a are measured by the first measurement unit 7. If the measurement result (positional offset amount between the substrate 100 and the mask 101) is within the allowable range, the first alignment is terminated. If the measurement result is outside the allowable range, a control amount (displacement amount of the substrate 100) is set based on the measurement result to make the positional offset amount fall within the allowable range. In addition, in the following description, the "positional offset amount" is set to include the direction of the positional offset in addition to the amount of the positional offset itself. The amount of positional offset referred to here is the distance between the substrate 100 and the mask 101 in the projection diagram (vertical projection) in which the substrate 100 and the mask 101 are projected onto the same plane in the Z direction, which refers to the so-called horizontal distance. Based on the set control amount, the position adjustment unit 20 operates. As a result, as shown in state ST8B, the substrate support unit 6 is displaced in the X-Y plane to adjust the relative position of the substrate 100 with respect to the mask 101.

[0087] Whether the measurement result is within the allowable range can be determined, for example, by calculating the distance between the corresponding substrate coarse mark 100a and the mask coarse mark 101a, and comparing the average value or the sum of squares of the distances with a preset threshold value. Alternatively, the ideal position (mask coarse mark target position) where each mask coarse mark 101a should be located in order to align the substrate 100 and the mask 101 can be calculated based on the substrate coarse mark 100a corresponding to each mask coarse mark 101a, as in the case of the second alignment described later. Then, the distance between the corresponding mask coarse mark 101a and the mask coarse mark target position can be calculated, and the average value or the sum of squares of the distances can be compared with a preset threshold value for determination.

[0088] After the relative position is adjusted, as shown in state ST8C, the relative position of the substrate coarse mark 100a and the mask coarse mark 101a is measured again by the first measurement unit 7. If the measurement result is within the allowable range, the first alignment is terminated. If the measurement result is outside the allowable range, the relative position of the substrate 100 with respect to the mask 101 is adjusted again. Thereafter, the measurement and relative position adjustment are repeated until the measurement result falls within the allowable range. In the first alignment, the substrate 100 is always away from the mask 101 at the top. Therefore, until the first second alignment (described later) is performed, the substrate 100 is maintained away from the mask 101.

[0089] After the first alignment is completed, Figure 6 In step S3, the second alignment is performed. Here, based on the measurement result of the second measurement unit 8, the precise position adjustment of the substrate 100 and the mask 101 is performed.

[0090] Figure 7 2 is a flowchart showing the processing of the second alignment in step S3. The second alignment is a process of repeating the measurement and position adjustment operation including the measurement operation (steps S11 and S12) and the position adjustment operation (steps S14 and S15) until the measurement result in the measurement operation falls within the allowable range.

[0091] In step S11 , an approaching operation is performed to bring the substrate 100 and the mask 101 closer in the thickness direction (Z direction) of the substrate 100 . Here, the driving unit 221 is driven to lower the substrate support unit 6 , so that the substrate 100 and the mask 101 partially contact each other.

[0092] Fig. 9 State ST9A shows an example of the approaching action. The substrate 100 is lowered until the central portion bent downward contacts the mask 101. In the substrate 100, the portion other than the central portion is away from the mask 101. By bringing the substrate 100 and the mask 101 closer together until the substrate 100 and the mask 101 partially contact each other, the second measurement unit with a shallow depth of field can simultaneously capture the substrate fine mark 100b formed on the substrate 100 and the mask fine mark 101b formed on the mask 101 to measure the positional deviation.

[0093] Furthermore, by making the substrate 100 partially contact the mask 101 rather than the entire substrate 100 during measurement, it is possible to minimize the risk of a thin film formed on the substrate 100 being damaged by contact with the mask 101 .

[0094] exist Figure 7 In step S12 , the positional deviation between the partially contacted substrate 100 and the mask 101 is measured by the second measuring unit 8 . Fig. 9State ST9B shows the manner in which the substrate fine mark 100b and the mask fine mark 101b are measured by the second measurement unit 8. The relative positions of the four sets of substrate fine marks 100b and mask fine marks 101b are measured by the four second measurement units 8. In this embodiment, in step S11, the position of the substrate support unit 6 in the Z direction is adjusted according to the cut-out portion of the substrate 100 cut out from the large substrate MG, thereby adjusting the height of the substrate fine mark 100b of the substrate 100, so that both the substrates 100A and 100B can be measured with higher accuracy.

[0095] In step S12, after the substrate fine mark 100b is measured by the second measurement unit 8, the target positions (mask fine mark target positions) of the four mask fine marks 101b corresponding to the four substrate fine marks 100b are calculated based on the measurement results. Here, the mask fine mark target positions are set as the ideal positions where each mask fine mark 101b should be located in order to align the substrate 100 with the mask 101, and are calculated based on the design dimensions of the positions of each mark.

[0096] In addition, when the substrate fine mark 100b in the image obtained by the second measurement unit 8 in step S12 is not clear, an action (search action) may be performed to search for the height of the substrate support unit 6 that allows the substrate fine mark 100b to enter the depth of field of the second measurement unit 8.

[0097] In the search operation, the substrate support unit 6 is raised and lowered to change the position in the Z direction, and the image is acquired multiple times by the second measurement unit 8. Then, the image is analyzed successively, and the height of the substrate support unit 6 that can obtain a high-definition image is searched and determined based on the tendency of clarity and contrast.

[0098] exist Figure 7 In step S13, it is determined whether the measurement result of step S12 (positional offset between substrate 100 and mask 101) is within the allowable range. Here, for example, for each of the four groups of substrate fine marks 100b and mask fine marks 101b, the distance between the target position of the mask fine marks calculated in step S12 and the position of the mask fine marks 101b is calculated. Then, the average value or the sum of squares of the calculated distances is compared with a preset threshold value. If the distance is below the threshold value, it is determined to be within the allowable range. If the distance exceeds the threshold value, it is determined to be outside the allowable range. The allowable range of the positional offset in the second alignment (S13) is smaller than the allowable range of the positional offset in the first alignment (S2). Through the second alignment, a more precise alignment between the substrate 100 and the mask 101 is performed. If the determination result of step S13 is within the allowable range, the second alignment is terminated. If it is outside the allowable range, step S14 is entered.

[0099] In step S14 , a separation operation is performed to separate the substrate 100 and the mask 101 in the thickness direction (Z direction) of the substrate 100 . Here, the driving unit 221 is driven to raise the substrate support unit 6 , and the substrate 100 is separated from the mask 101 . Fig. 9 The state ST9C shows an example of the separation action. The substrate 100 rises to a height where the central portion bent downward does not contact the mask 101. The substrate 100 is separated from the mask 101, and the substrate 100 is not in contact with the mask 101. By separating the substrate 100 from the mask 101, it is possible to avoid the film formed on the substrate 100 being damaged by friction between the film forming area of ​​the substrate 100 and the mask 101 in the subsequent position adjustment action of step S15.

[0100] exist Figure 7 In step S15, a position adjustment operation is performed to adjust the relative position of the substrate 100 and the mask 101 based on the measurement result of step S12. Here, the displacement amount of the substrate 100 is set based on the measurement result of step S12, and the adjustment unit 20 operates based on the set displacement amount. Fig.10 As shown in the state ST10A, the substrate support unit 6 is displaced on the XY plane to adjust the relative position of the substrate 100 with respect to the mask 101 .

[0101] After the processing of step S15 is completed, the process returns to step S11 and repeats the same processing. Fig.10 After the position adjustment action of state ST10A, as Fig.10 As shown in the state ST10B, the approaching operation is performed again (step S11), and the substrate 100 is lowered until the center of the substrate 100 contacts the mask 101. Fig.10 As shown in the state ST10C, measurement is performed again (step S12 ) to measure the positional deviation of the partially contacting substrate 100 and mask 101 .

[0102] After the second alignment is completed, Figure 6 In step S4, the substrate 100 is placed on the mask 101. Here, the driving unit 221 is driven to lower the substrate support unit 6, as shown in FIG. Fig.11 As shown in the state ST11A, control is performed to overlap the substrate 100 and the mask 101. Specifically, the substrate support unit 6 is lowered so that the height of the upper surface (substrate support surface) of the placement parts 61 and 62 of the substrate support unit 6 coincides with the height of the upper surface of the mask 101. As a result, the substrate 100 is placed on the mask 101 and is supported by the substrate support unit 6 and the mask 101. In this state, in the substrate 100, the entire processed surface of the substrate 100 is in contact with the mask 101.

[0103] Next, the second lifting unit 13 is driven to lower the plate unit 6. Fig.11 As shown in the state ST11B, the cooling plate 10 is brought into contact with the substrate 100. Then, the second lifting unit 13 is driven to lower the magnet plate 11 relative to the cooling plate 10 while maintaining the height of the cooling plate 10 unchanged. Fig.11 As shown in the state ST11C, the magnet plate 11 is brought close to the substrate 100 and the mask 101. By bringing the magnet plate 11 close to the mask 101, the mask 101 can be attracted by the magnetic force generated by the magnet plate 11, so that the mask 101 and the substrate 100 are in close contact as a whole.

[0104] exist Figure 6 In step S5, the clamping of the peripheral portion of the substrate 100 is released, and the second measurement unit 8 performs final measurement (also referred to as "pre-film formation measurement"). During the release of the clamping, the actuator 64 is driven, such as Fig.12 As shown in the state ST12A, the clamping part 66 is raised from the peripheral edge of the substrate 100. After that, the substrate support unit 6 can be further lowered to separate the substrate support unit 6 from the substrate. In this way, the substrate 100 can be brought into a state of contact with only two components, the mask 100 and the cooling plate 10.

[0105] In the final measurement, the positional deviation of the substrate 100 and the mask 101 is measured by the second measurement unit 8 in a contact state in which the substrate 100 and the mask 101 are in contact. Fig.12 State ST12B shows the manner in which the substrate fine mark 100b and the mask fine mark 101b are measured by the second measurement unit 8. The four second measurement units 8 measure the relative positions of four sets of substrate fine marks 100b and mask fine marks 101b. Fig.12 The contact state between the substrate 100 and the mask 101 in the state ST12B is a contact state in which the entire surfaces of the substrate 100 and the mask 101 are in close contact with each other.

[0106] In step S6, it is determined whether the measurement result of the final measurement in step S5 (the positional deviation amount between the substrate 100 and the mask 101) is within the allowable range. If it is within the allowable range, the process proceeds to step S7. If it is outside the allowable range, the process proceeds to step S9 to perform the second alignment again (retry operation). In addition, the determination of whether the measurement result is within the allowable range can be performed in the same manner as in step S2 and step S3. The allowable range in step S6 may be the same range as the allowable range in step S13, or may be a range smaller than the allowable range in step S13.

[0107] In step S9, if Fig.13As shown in the state ST13A, the peripheral edge of the substrate 100 is clamped again by the clamping unit 63. Fig.13 As shown in the state ST13B, the plate unit 6 is raised and separated from the substrate 100. As a result, the cooling plate 10 in contact with the substrate 100 is separated from the substrate 100.

[0108] Afterwards, in Figure 6 In step S10, a separation operation is performed to separate the substrate 100 from the mask 101. Here, the driving unit 221 is driven to raise the substrate support unit 6 so that the substrate 100 is separated from the mask 101. The position where the substrate support unit 6 is raised may also be the same as the position in the second alignment separation operation (S14, Fig. 9 The same as the status ST9C). Fig.14 State ST14A shows an example of the separation operation in step S10. The substrate 100 is raised to a height at which the central portion bent downward does not contact the mask 101. The substrate 100 is separated from the mask 101, and the substrate 100 is not in contact with the mask 101.

[0109] Afterwards, return Figure 6 In step S3, the second alignment is performed again. Fig.14 As shown in the state ST14B, the approach action is performed again (same as step S11, Fig.10 The substrate 100 is lowered until the center of the substrate 100 contacts the mask 101. Fig.14 As shown in the state ST14C, the measurement is performed again (same as step S12, Fig.10 The same as the state ST10C), measuring the positional deviation of the partially contacted substrate 100 and the mask 101, performing Figure 7 The processing following step S13 is performed.

[0110] In this embodiment, in the retry operation, Fig.13 From the state ST13B, the second alignment of step S3 is not immediately performed, but the separation action of step S10 is performed.

[0111] If the separation action of step S10 is not performed, Fig.13 The state in which the substrate 100 and the mask 101 are in contact with each other is changed from the state ST13B to the state ST13B. Fig.10 The state shown in ST10B is a state where the center of the substrate 100 is in contact with the mask 101. Then, the first measurement after the retry operation is performed, and based on the measurement result, a separation operation (S14) and a position adjustment operation (S15) can be performed. Fig.13The substrate 100 rises from the state ST13B) to the state where the substrate 100 and the mask 101 are partially in contact ( Fig.10 During the process of the alignment (in the state ST10B), a positional deviation may occur between the substrate 100 and the mask 101. If the first measurement is performed in a state where a positional deviation occurs, the measurement result may include an error corresponding to the positional deviation, and in the second alignment, it may take time to align the substrate 100 and the mask 101 (the number of measurement and position adjustment operations increases).

[0112] In this embodiment, in the retry operation, before the second alignment, the separation operation of step S10 is performed once. Fig.14 As illustrated in the states ST14A and ST14B, the substrate 100 and the mask 101 are completely separated once by the separation operation of step S10 ( Fig.14 After that, the substrate 100 and the mask 101 are brought closer. By performing such a distance change operation between the substrate 100 and the mask 101, the relative positional relationship between the substrate 100 and the mask 101 is reset once. Fig.14 As shown in state ST14C, the measurement operation is performed, so that the number of times the relative position of the mask 101 and the substrate 100 is adjusted can be reduced in the second alignment.

[0113] return Figure 6 In step S7, a film forming process is performed. Here, a thin film is formed on the lower surface of the substrate 100 by the film forming unit 4 via the mask 101. After the film forming process is completed, the substrate 100 is sent out of the vacuum chamber 3 by the conveying robot 302a in step S8. Through the above steps, the process is completed.

[0114] <Method for manufacturing electronic device>

[0115] Next, an example of a method for manufacturing an electronic device is described. Next, as an example of an electronic device, the structure and manufacturing method of an organic EL display device are illustrated. In this example, Figure 1 The film forming blocks 301 shown as an example are provided at, for example, three locations in the production line.

[0116] First, the organic EL display device to be manufactured will be described. Fig.15A is an overall diagram of an organic EL display device 50, Fig. 15B This is a diagram showing the cross-sectional structure of one pixel.

[0117] like Fig.15A As shown, a plurality of pixels 52 including a plurality of light emitting elements are arranged in a matrix in a display region 51 of an organic EL display device 50. Although the details will be described later, each light emitting element has a structure including an organic layer sandwiched by a pair of electrodes.

[0118] In addition, the pixel mentioned here refers to the smallest unit that can display the desired color in the display area 51. In the case of a color organic EL display device, the pixel 52 is formed by a combination of multiple sub-pixels, namely the first light-emitting element 52R, the second light-emitting element 52G, and the third light-emitting element 52B, which display different light emissions. The pixel 52 is often composed of a combination of three sub-pixels, namely a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited to this. The pixel 52 only needs to include at least one sub-pixel, preferably includes two or more sub-pixels, and more preferably includes three or more sub-pixels. As the sub-pixels constituting the pixel 52, for example, it can also be a combination of four sub-pixels, namely a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element.

[0119] Fig. 15B yes Fig.15A Schematic diagram of partial cross-section along line A-B of . The pixel 52 has a plurality of sub-pixels composed of organic EL elements having a first electrode (anode) 54, a hole transport layer 55, a red layer 56R, a green layer 56G, a blue layer 56B, an electron transport layer 57, and a second electrode (cathode) 58 on a substrate 53. Among them, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 are equivalent to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are formed into patterns corresponding to light-emitting elements (sometimes also described as organic EL elements) that emit red, green, and blue, respectively.

[0120] In addition, the first electrode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed in common over the plurality of light-emitting elements 52R, 52G, and 52B, or may be formed for each light-emitting element. Fig. 15B As shown, after the hole transport layer 55 is formed as a common layer throughout multiple sub-pixel areas, the red layer 56R, the green layer 56G, and the blue layer 56B are formed separately according to each sub-pixel area, and then the electron transport layer 57 and the second electrode 58 are formed as a common layer throughout multiple sub-pixel areas.

[0121] In order to prevent short circuits between adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer is degraded by moisture or oxygen, a protective layer 60 is provided to protect the organic EL element from moisture or oxygen.

[0122] exist Fig. 15BIn the figure, the hole transport layer 55 and the electron transport layer 57 are represented as one layer, but according to the structure of the organic EL display element, they can also be formed by multiple layers having a hole blocking layer and an electron blocking layer. In addition, a hole injection layer having an energy band structure can also be formed between the first electrode 54 and the hole transport layer 55, so that holes can be smoothly injected from the first electrode 54 to the hole transport layer 55. Similarly, an electron injection layer can also be formed between the second electrode 58 and the electron transport layer 57.

[0123] The red layer 56R, the green layer 56G, and the blue layer 56B can be formed by a single light-emitting layer, or by stacking a plurality of layers. For example, the red layer 56R can be composed of two layers, the upper layer is formed by a red light-emitting layer, and the lower layer is formed by a hole transport layer or an electron blocking layer. Alternatively, the lower layer can be formed by a red light-emitting layer, and the upper layer can be formed by an electron transport layer or a hole blocking layer. By arranging a layer on the lower or upper side of the light-emitting layer in this way, the light-emitting position in the light-emitting layer is adjusted, and the optical path length is adjusted, thereby having the effect of improving the color purity of the light-emitting element.

[0124] In addition, although the example of the red layer 56R is shown here, the green layer 56G and the blue layer 56B may also adopt the same structure. In addition, the number of stacked layers may be 2 or more. Furthermore, layers of different materials such as the light-emitting layer and the electron blocking layer may be stacked, and layers of the same material may be stacked, such as stacking 2 or more light-emitting layers.

[0125] Here, it is assumed that the red layer 56R is composed of two layers, the lower layer 56R1 and the upper layer 56R2, and the green layer 56G and the blue layer 56B are composed of a single light-emitting layer.

[0126] First, a substrate 53 is prepared on which a circuit (not shown) for driving the organic EL display device and a first electrode 54 are formed. The material of the substrate 53 is not particularly limited, and can be made of glass, plastic, metal, etc. In this embodiment, as the substrate 53, a substrate in which a polyimide film is laminated on a glass substrate is used.

[0127] On the substrate 53 formed with the first electrode 54, a resin layer such as acrylic acid or polyimide is applied by bar coating or spin coating, and the resin layer is patterned by photolithography so as to form an opening in the portion formed with the first electrode 54, thereby forming an insulating layer 59. The opening corresponds to the light-emitting region where the light-emitting element actually emits light. In addition, in this embodiment, the large substrate is processed until the insulating layer 59 is formed, and after the insulating layer 59 is formed, a dividing step of dividing the substrate 53 is performed.

[0128] The substrate 53 with the patterned insulating layer 59 is introduced into the first film forming chamber 303, and the hole transport layer 55 is formed as a common layer on the first electrode 54 in the display region. The hole transport layer 55 is formed using a mask having an opening formed in accordance with the display region 51 of the panel portion of each organic EL display device.

[0129] Next, the substrate 53 formed up to the hole transport layer 55 is sent to the second film forming chamber 303. The substrate 53 and the mask are aligned, the substrate is placed on the mask, and the red layer 56R is formed on the portion of the substrate 53 above the hole transport layer 55 where the element emitting red is arranged (the region forming the red sub-pixel). Here, the mask used in the second film forming chamber is a high-precision mask having openings formed only in the multiple regions that become red sub-pixels among the multiple regions on the substrate 53 that become the sub-pixels of the organic EL display device. As a result, the red layer 56R including the red light-emitting layer is formed only in the region that becomes the red sub-pixel among the regions that become the multiple sub-pixels on the substrate 53. In other words, the red layer 56R is not formed in the region that becomes the blue sub-pixel and the region that becomes the green sub-pixel among the regions that become the multiple sub-pixels on the substrate 53, and is selectively formed in the region that becomes the red sub-pixel.

[0130] Similar to the formation of the red layer 56R, the green layer 56G is formed in the third film forming chamber 303, and then the blue layer 56B is formed in the fourth film forming chamber 303. After the formation of the red layer 56R, the green layer 56G, and the blue layer 56B is completed, the electron transport layer 57 is formed in the entire display area 51 in the fifth film forming chamber 303. The electron transport layer 57 is formed as a common layer in the three color layers 56R, 56G, and 56B.

[0131] The substrate formed up to the electron transport layer 57 is moved to the sixth film forming chamber 303, and the second electrode 58 is formed. In the present embodiment, the film formation of each layer is performed by vacuum evaporation in the first film forming chamber 303 to the sixth film forming chamber 303. However, the present invention is not limited to this. For example, the film formation of the second electrode 58 in the sixth film forming chamber 303 can also be performed by sputtering. After that, the substrate formed up to the second electrode 68 is moved to the sealing device and the protective layer 60 is formed by plasma CVD (sealing process), and the organic EL display device 50 is completed. In addition, here, it is assumed that the protective layer 60 is formed by the CVD method, but it is not limited to this, and it can also be formed by the ALD method or the inkjet method.

[0132] Here, the film formation in the first film forming chamber 303 to the sixth film forming chamber 303 is performed using a mask having openings corresponding to the patterns of the respective layers to be formed. When forming the film, after the relative positions of the substrate 53 and the mask are adjusted (aligned), the substrate 53 is placed above the mask to form the film. Here, the alignment process performed in each film forming chamber is performed as in the above-mentioned alignment process.

[0133] <Other embodiments>

[0134] In the above embodiment, in the second alignment, the positional deviation is measured by bringing the substrate 100 and the mask 101 into partial contact with each other. However, the positional deviation may be measured in a state where the substrate 100 and the mask 101 are brought into close proximity without contact.

[0135] The present invention can also be implemented by providing a program that implements one or more functions of the above-mentioned embodiments to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. In addition, it can also be implemented by a circuit (such as an ASIC) that implements one or more functions.

[0136] The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the following claims are attached to disclose the scope of the invention.

[0137] Description of Reference Numerals

[0138] 1 film forming device, 2 alignment device, 5 mask stage (mask supporting member), 6 substrate supporting unit (substrate supporting member), 8 second measuring unit (measuring member), 141 processing unit (control member), 20 position adjusting unit (position adjusting member), 22 distance adjusting unit (distance adjusting member), 100 substrate, 101 mask.

Claims

1. An alignment device, comprising: a substrate supporting member, the substrate supporting member supporting the substrate; a mask supporting member, wherein the mask supporting member supports the mask; a distance adjusting component, the distance adjusting component adjusting the distance between the substrate supporting component and the mask supporting component in the direction of gravity; A measuring component, the measuring component measures a positional offset between the substrate and the mask; A position adjustment component, wherein the position adjustment component adjusts the relative position of the substrate and the mask; as well as Control components, It is characterized in that When the positional displacement amount measured by the measuring component in a contact state between the substrate and the mask is outside an allowable range, the control component performs a separation action of separating the substrate from the mask by the distance adjustment component before measuring the positional displacement amount by the measuring component in a state where the substrate and the mask are in contact.

2. The alignment device according to claim 1, characterized in that The control component performs a first alignment and a second alignment, In the first alignment, the relative position is adjusted by the position adjustment member based on the positional deviation amount measured by the measurement member in the first state in which the substrate is separated from the mask, After the first alignment, in the second alignment, the relative position is adjusted by the position adjustment member based on the positional deviation amount measured by the measurement member in the second state in which the substrate is in contact with the mask, After the second alignment, when the positional deviation amount measured by the measuring means in the contact state is outside the allowable range, the separation operation is performed.

3. The alignment device according to claim 2, characterized in that: In the first alignment, the relative position is adjusted until the position offset falls within a first allowable range. In the second alignment, the relative position is adjusted until the positional deviation falls within a second allowable range that is smaller than the first allowable range. It is determined whether the positional deviation amount measured by the measuring unit in a state where the substrate and the mask are in contact with each other after the separation operation is within the second allowable range.

4. The alignment device according to claim 2, characterized in that: The alignment device comprises: a cooling member that cools the substrate; and a second position adjustment component, the second position adjustment component adjusting the position of the cooling component relative to the substrate, After the second alignment, the second position adjustment member brings the cooling member into contact with the substrate, The second position adjusting means moves the cooling means away from the substrate when the positional deviation amount measured by the measuring means in the contact state after the second alignment is outside the allowable range.

5. The alignment device according to claim 2, characterized in that: The control component performs a first alignment and a second alignment, In the first alignment, the relative position is adjusted by the position adjustment member based on the positional deviation amount measured by the measurement member in the first state in which the substrate is separated from the mask, After the first alignment, in the second alignment, the relative position is adjusted by the position adjustment means based on the positional deviation amount measured by the measurement means in the second state in which the substrate is in contact with the mask portion, After the second alignment, the substrate and the mask are brought into close contact as a whole as the contact state. After the second alignment, when the positional deviation amount measured by the measuring means in the contact state is outside the allowable range, the separation operation is performed.

6. The alignment device according to claim 5, characterized in that In the first alignment, the relative position is adjusted until the position offset falls within a first allowable range. In the second alignment, the relative position is adjusted until the positional deviation falls within a second allowable range that is smaller than the first allowable range. In the second alignment, the substrate and the mask are separated by the distance adjustment member while adjusting the relative position. After the second alignment, if the positional deviation amount measured by the measuring means in the contact state is outside the allowable range, the second alignment is performed again through the separation operation.

7. An alignment device, comprising: a substrate supporting member, the substrate supporting member supporting the substrate; a mask supporting member, wherein the mask supporting member supports the mask; a distance adjusting component, the distance adjusting component adjusting the distance between the substrate supporting component and the mask supporting component in the direction of gravity; A measuring component, the measuring component measures a positional offset between the substrate and the mask; A position adjustment component, wherein the position adjustment component adjusts the relative position of the substrate and the mask; as well as Control components, It is characterized in that When the position deviation amount measured by the measuring component in the contact state between the substrate and the mask is outside the allowable range, the control component performs a distance change operation of separating the substrate and the mask and then bringing the substrate and the mask into contact with each other through the distance adjustment component, and then performs measurement through the measuring component.

8. The alignment device according to claim 7, characterized in that The control component performs a first alignment and a second alignment, In the first alignment, the relative position is adjusted by the position adjustment member based on the positional deviation amount measured by the measurement member in the first state in which the substrate is separated from the mask, After the first alignment, in the second alignment, the relative position is adjusted by the position adjustment member based on the positional deviation amount measured by the measurement member in the second state in which the substrate is in contact with the mask, After the second alignment, when the positional deviation amount measured by the measuring unit in the contact state is outside the allowable range, the distance changing operation is performed.

9. The alignment device according to claim 8, characterized in that In the first alignment, the relative position is adjusted until the position offset falls within a first allowable range. In the second alignment, the relative position is adjusted until the positional deviation falls within a second allowable range that is smaller than the first allowable range. It is determined whether the positional deviation amount measured by the measuring means after the distance changing operation is within the second allowable range.

10. The alignment device according to claim 8, characterized in that The alignment device comprises: a cooling member that cools the substrate; and a second position adjustment component, the second position adjustment component adjusting the position of the cooling component relative to the substrate, After the second alignment, the second position adjustment member brings the cooling member into contact with the substrate, The second position adjusting means moves the cooling means away from the substrate when the positional deviation amount measured by the measuring means in the contact state after the second alignment is outside the allowable range.

11. The alignment device according to claim 8, characterized in that The control component performs a first alignment and a second alignment, In the first alignment, the relative position is adjusted by the position adjustment member based on the positional deviation amount measured by the measurement member in the first state in which the substrate is separated from the mask, After the first alignment, in the second alignment, the relative position is adjusted by the position adjustment means based on the positional deviation amount measured by the measurement means in the second state in which the substrate is in contact with the mask portion, After the second alignment, the substrate and the mask are brought into close contact as a whole as the contact state. After the second alignment, when the positional deviation amount measured by the measuring unit in the contact state is outside the allowable range, the distance changing operation is performed.

12. The alignment device according to claim 11, characterized in that In the first alignment, the relative position is adjusted until the position offset falls within a first allowable range. In the second alignment, the relative position is adjusted until the positional deviation falls within a second allowable range that is smaller than the first allowable range. In the second alignment, the substrate and the mask are separated by the distance adjustment member while adjusting the relative position. After the second alignment, if the positional deviation amount measured by the measuring unit in the contact state is outside the allowable range, the second alignment is performed again through the distance changing operation.

13. The alignment device according to claim 1 or 7, characterized in that: The contact state is a state in which the substrate and the mask are in close contact as a whole.

14. A film forming device, characterized in that: The film forming device comprises: The alignment device of claim 1 or claim 7; and A film forming member is provided for forming a film on the substrate via the mask.

15. A method for controlling an alignment device, the alignment device comprising: a substrate supporting member, the substrate supporting member supporting the substrate; a mask supporting member, wherein the mask supporting member supports the mask; a distance adjusting component, the distance adjusting component adjusting the distance between the substrate supporting component and the mask supporting component in the direction of gravity; a measuring component for measuring a positional offset between the substrate and the mask; and a position adjustment component, wherein the position adjustment component adjusts the relative position between the substrate and the mask, It is characterized in that When the positional displacement amount measured by the measuring component in a contact state where the substrate and the mask are in contact is outside an allowable range, the distance adjusting component performs a separation action of separating the substrate and the mask before measuring the positional displacement amount by the measuring component in a state where the substrate and the mask are in contact.

16. A method for controlling an alignment device, the alignment device comprising: a substrate supporting member, the substrate supporting member supporting the substrate; a mask supporting member, wherein the mask supporting member supports the mask; a distance adjusting component, the distance adjusting component adjusting the distance between the substrate supporting component and the mask supporting component in the direction of gravity; a measuring component for measuring a positional offset between the substrate and the mask; and a position adjustment component, wherein the position adjustment component adjusts the relative position between the substrate and the mask, It is characterized in that When the positional deviation amount measured by the measuring component in the contact state where the substrate and the mask are in contact is outside the allowable range, the distance adjusting component performs a distance changing action of separating the substrate and the mask and then bringing the substrate and the mask into contact, and then the measuring component performs measurement.

17. A method for manufacturing an electronic device, characterized in that: The method for manufacturing the electronic device comprises: An alignment step of aligning the substrate and the mask by the control method according to claim 15 or 16; and A film forming step of forming a film on the substrate via the mask whose relative position has been adjusted in the alignment step.

18. A program, characterized in that The program is for causing a computer to execute the control method according to claim 15 or 16.

19. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a program for causing a computer to execute the control method according to claim 15 or 16.

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