Cleaning device and cleaning method for laser holographic working plate
By combining electrolytic degreasing and spray cleaning methods in the cleaning device of the laser holographic working version, the problem of poor surface cleaning effect of nickel plates in the prior art is solved, and efficient nickel plate cleaning and laser film quality improvement are achieved.
Patent Information
- Application Number
- CN202510152758.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-12
- Publication Date
- 2025-03-14
AI Technical Summary
In the existing cleaning methods of laser holographic working versions, the spraying method has little effect on removing dirt, making it difficult to effectively remove organic and oily substances on the surface of the nickel plate.
A cleaning device for laser holographic working version is designed, including a cleaning box, a circulation mechanism and a fixture. By electrolyzing and degreasing in the first cleaning chamber and using a spray mechanism in the second cleaning chamber, the surface of the nickel plate is efficiently cleaned by combining electrolysis and spraying.
Through the combination of electrolytic degreasing and spray cleaning, the cleanliness of the nickel plate surface is significantly improved, effectively solving the problems of plate back spots and step printing, and improving the quality of the laser film.
Smart Images

Figure CN119608674A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of cleaning devices, and more specifically, to a cleaning device and a cleaning method for a laser holographic working plate. Background Art
[0002] The laser holographic working plate is also called the nickel plate. The nickel plate can be used to produce laser paper with laser effects. Therefore, the quality of the nickel plate directly affects the quality of the laser paper. Currently, one of the factors affecting the quality of the nickel plate is that the surface of the nickel plate will be dirty after use. Currently, the dirt on the surface of the nickel plate is removed by spraying. This method is not very effective in removing stains, so there is an urgent need to improve this. Summary of the invention
[0003] The purpose of the present invention is to overcome the deficiencies of the above-mentioned prior art and provide a cleaning device and a cleaning method for a laser holographic working plate. The nickel plate is electrolytically degreased in a first cleaning chamber and then enters a second cleaning chamber for cleaning. After cleaning, it is taken out and dried in the shade, and the stain removal effect is good.
[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a cleaning device for a laser holographic working plate, used for cleaning a nickel plate, comprising a cleaning box, a circulation mechanism and a clamp, the cleaning box comprising a first cleaning chamber, a second cleaning chamber, a cross bar and an electrode head, the first cleaning chamber and the second cleaning chamber are separately arranged, the cross bar and the electrode head are both conductive, the circulation mechanism comprises a liquid outlet pipe, a first pump body and a liquid inlet pipe, one end of the liquid outlet pipe is connected to the first cleaning chamber and the other end is connected to the first pump body, one end of the liquid inlet pipe is connected to the first cleaning chamber and the other end is connected to the first pump body, the clamp comprises a clamping mechanism, the clamping mechanism comprises a back plate, a conductive plate and a hook, the nickel plate can be fixed on the surface of the back plate, the hook can be hung on the cross bar so that the nickel plate is immersed in the liquid in the first cleaning chamber and the conductive plate is at least partially located in the liquid.
[0005] Furthermore, the back plate is connected to the conductive plate by bolts, the upper part of the nickel plate is located between the back plate and the conductive plate, the lower part of the nickel plate is fixed to the back plate by adhesive tape, the conductive plate is connected to a hook, and the hook is made of metal.
[0006] Furthermore, the clamp includes a support member, which is located on the side of the back plate away from the nickel plate. The support member includes a support plate and a cylinder. A boss is provided on the side of the support plate. The back plate includes a avoidance opening. The cylinder can drive the support plate to rotate so that the boss can be inserted into the avoidance opening and be flush with the side of the back plate facing the nickel plate surface or detached from the avoidance opening.
[0007] Furthermore, two convex plates are provided on the side of the back plate, and the two convex plates are connected by a connecting shaft. The support plate can rotate along the connecting shaft. A first connecting rod is connected to the side of the support plate. The first connecting rod is hinged to the cylinder through a second connecting rod, and the cylinder is hinged to the back plate.
[0008] Furthermore, a filter is connected between the liquid outlet pipe and the first pump body, and the first cleaning tank, the liquid outlet pipe, the filter, the first pump body, and the liquid inlet pipe form a circulating filtration water circuit. The liquid inlet pipe is located at one end of the first cleaning tank and is connected to a plurality of return liquid pipes. The return liquid pipe includes a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is connected to the liquid inlet pipe and the other end is connected to the middle part of the second connecting pipe. The upper part of the second connecting pipe is provided with a plurality of return liquid ports.
[0009] Further, the liquid outlet pipe includes a vertical section located in the first cleaning chamber, the bottom of the vertical section is open, a plurality of through holes are provided on the side of the vertical section, the position of the through holes is lower than the upper part of the partition chamber, a liquid outlet switching mechanism is sleeved on the outer side of the vertical section, the liquid outlet switching mechanism includes a sleeve and a bottom cover, the sleeve is sleeved on the outer side of the vertical section, the bottom cover is located below the vertical section, the sleeve and the bottom cover can be raised and lowered, when the bottom cover covers the bottom of the vertical section, the sleeve and the through hole are misaligned, when the sleeve is sleeved on the outer side of the through hole, the position of the bottom cover is lower than the bottom of the vertical section;
[0010] A floating ball is fixed on the outside of the sleeve, the sleeve and the bottom cover are connected by a connecting rod, a retaining rib is arranged on the outside of the vertical section, the retaining rib is located lower than the through hole, and the lower part of the sleeve can abut against or detach from the retaining rib.
[0011] Furthermore, the liquid inlet pipe includes a first liquid inlet section connected to the first pump body and a second liquid inlet section arranged in the first cleaning bin, the upper portion of the first liquid inlet section is connected to the upper portion of the second liquid inlet section via a water-gas separation mechanism, the water-gas separation mechanism includes an inlet connected to the first liquid inlet section and an outlet connected to the second liquid inlet section, a partition block is provided inside the water-gas separation mechanism, the partition block is located between the inlet and the outlet, two water passages are formed inside the water-gas separation mechanism through the partition block, the partition block is rhombus-shaped and two opposite rhombus corners are respectively opposite to the inlet and the outlet, the water-gas separation mechanism includes an exhaust hole, the exhaust hole is located above the partition block and is connected to the water passage.
[0012] Furthermore, it also includes a spray mechanism, which includes an annular spray pipe, a third connecting pipe, a second pump body and a fourth connecting pipe. The annular spray pipe is located in the second cleaning chamber, and the side wall of the annular spray pipe is provided with multiple spray ports. The annular spray pipe is connected to the second pump body through the third connecting pipe. The bottom of the second cleaning chamber is provided with a groove, and the second pump body is connected to the groove through the fourth connecting pipe.
[0013] A method for cleaning a laser holographic working plate comprises the following steps:
[0014] S1. Add liquid into the cleaning tank:
[0015] Add cleaning liquid into the first cleaning chamber, and the liquid level of the cleaning liquid is H;
[0016] Add pure water into the second cleaning chamber;
[0017] S2, circulating the cleaning liquid in the first cleaning chamber through a circulation mechanism;
[0018] S3, immersing the nickel plate fixed on the fixture in the cleaning liquid in the first cleaning chamber, hanging the hook on the crossbar, and immersing at least part of the conductive plate in the cleaning liquid;
[0019] S4, connect the positive and negative electrodes of the power supply to the crossbar and the electrode head respectively, the electrode head is in contact with the cleaning liquid, and the cleaning liquid is energized for 3min-5min;
[0020] S5, disconnecting the power supply in step S4, taking out the fixture with the nickel plate fixed thereon from the first cleaning chamber and placing it into the second cleaning chamber;
[0021] S6. A spray mechanism is provided at the second cleaning chamber, and the second pump body of the spray mechanism is operated to circulate the pure water in the second cleaning chamber, and the pure water is sprayed from the spray port of the spray mechanism to the front and back surfaces of the nickel plate to clean the nickel plate again;
[0022] S7. Complete the cleaning operation of the nickel plate.
[0023] Furthermore, the cleaning liquid is a degreasing liquid, and the configuration of the degreasing liquid includes the following steps:
[0024] S1. Add a kg of pure water into the first cleaning chamber;
[0025] S2, heating the pure water in the first cleaning chamber to 40°C-45°C;
[0026] S3, pour b kg of degreasing agent and c kg of sodium hydroxide into the first cleaning chamber;
[0027] S4, circulates through the circulation mechanism for 10min-15min;
[0028] S5. Pour d kg of pure water into the first cleaning chamber;
[0029] S6, cycle 1.5h-2h;
[0030] S7, completing the configuration of the degreasing liquid;
[0031] The ratio of pure water, degreaser and sodium hydroxide (a+d):b:c=200:4:1.
[0032] In summary, the present invention has the following beneficial effects:
[0033] 1. The crossbar and the electrode head are both conductive, and one end of the electrode head is in contact with the cleaning liquid in the first cleaning chamber. When cleaning the nickel plate in the first cleaning chamber, the cleaning liquid is energized, and the voltage does not exceed 5V. The positive and negative electrodes of the external power supply are connected to the crossbar and respectively. The nickel plate is cleaned by electroforming, which can remove organic matter and oily matter on the surface of the nickel plate, improve the cleanliness of the surface of the nickel plate, and also solve the problem of back spots and step marks on the nickel plate produced during the production process, which is beneficial to improving the quality of the laser film made by the nickel plate;
[0034] 2. During spray cleaning, the second pump body can realize cyclic spray operation, thereby continuously spraying and cleaning the surface of the nickel plate to improve the cleanliness of the front side of the nickel plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0035] Figure 1 It is a structural schematic diagram of this embodiment;
[0036] Figure 2 is a top view of this embodiment;
[0037] Figure 3 It is a structural schematic diagram of the liquid return pipeline;
[0038] Figure 4 is a cross-sectional view of this embodiment;
[0039] Figure 5 for Figure 4 A partial schematic diagram of
[0040] Figure 6 is a cross-sectional view of a water-gas separation mechanism;
[0041] Figure 7 It is a partial cross-sectional view of the vertical section of the liquid outlet pipe;
[0042] Figure 8 is a schematic diagram of the structure of the fixture in the first perspective;
[0043] Fig. 9 It is a schematic diagram of the structure of the fixture in the second viewing angle.
[0044] Figure numerals: 1, cleaning box; 11, first cleaning chamber; 12, second cleaning chamber; 13, partition chamber; 14, cross bar; 15, electrode head; 16, groove; 2, circulation mechanism; 21, liquid outlet pipe; 211, vertical section; 212, through hole; 213, retaining rib; 22, filter; 23, first pump body; 24, first liquid inlet section; 241, second liquid inlet section; 3, liquid return pipeline; 31, first connecting pipe; 32, second connecting pipe; 33, liquid return port; 4, spray mechanism; 41, annular spray pipe; 42, spray port; 43, third connecting pipe; 44 , second pump body; 45, fourth connecting pipe; 5, clamping mechanism; 51, back plate; 52, conductive plate; 53, hook; 54, avoidance; 55, convex plate; 56, connecting shaft; 6, support member; 61, support plate; 62, boss; 63, first connecting rod; 64, cylinder; 65, second connecting rod; 66, strip hole; 7, water-gas separation mechanism; 71, inlet; 72, outlet; 73, partition block; 74, water passage; 75, exhaust hole; 8, liquid outlet switching mechanism; 81, sleeve; 82, float; 83, bottom cover; 84, connecting rod; 9, nickel plate. DETAILED DESCRIPTION
[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0046] like Figures 1 to 9 As shown, this embodiment discloses a cleaning device for a laser holographic working plate, which is used for cleaning a nickel plate 9, and includes a cleaning box 1, a circulation mechanism 2, a clamp and a spray mechanism 4, wherein the cleaning box 1 includes a first cleaning chamber 11, a second cleaning chamber 12, a cross bar 14 and an electrode head 15, wherein the first cleaning chamber 11 and the second cleaning chamber 12 are separated, and a separation chamber 13 is provided between the first cleaning chamber 11 and the second cleaning chamber 12, wherein a cleaning liquid is provided in the first cleaning chamber 11, and pure water is provided in the second cleaning chamber 12, and a liquid level H of the cleaning liquid is lower than an upper surface of the separation chamber 13, and the first cleaning chamber 11 and the second cleaning chamber 12 are isolated by the separation chamber 13, so that during the cleaning of the nickel plate 9, the cleaning liquid can be effectively prevented from entering the second cleaning chamber 12 or pure water from entering the first cleaning chamber 11.
[0047] The cross bar 14 and the electrode head 15 are both conductive, and one end of the electrode head 15 is in contact with the cleaning liquid in the first cleaning chamber 11. When the nickel plate 9 is cleaned in the first cleaning chamber 11, the cleaning liquid is energized, and the voltage does not exceed 5V. The positive and negative poles of the external power supply are respectively connected to the cross bar 14 and the electrode head 15. The nickel plate 9 is cleaned by electrolysis, which can remove organic matter and oily matter on the surface of the nickel plate 9, improve the cleanliness of the nickel plate surface 9, and also solve the back-plate spots and step marks produced in the production process of the nickel plate 9, which is beneficial to improve the quality of the laser film made of the nickel plate 9.
[0048] like Figure 5 , Figure 8 and Fig. 9 As shown, the clamp includes a clamping mechanism 5, which includes a back plate 51, a conductive plate 52 and a hook 53. The nickel plate 9 can be fixed on the surface of the back plate 51. The back plate 51 and the conductive plate 52 are connected by bolts. The upper part of the nickel plate 9 is located between the back plate 51 and the conductive plate 52. The lower part of the nickel plate 9 is fixed to the back plate 51 by adhesive tape. The conductive plate 52 is connected to the hook 53. The hook 53 is made of metal. The hook 53 can be suspended on the cross bar 14 so that the nickel plate 9 is immersed in the liquid in the first cleaning chamber 11 and the conductive plate 52 is at least partially located in the liquid. The current on the cross bar 14 contacts the cleaning liquid through the hook 53 and the conductive plate 52 to form a current loop. Since the nickel plate is very thin, the upper and lower parts of the nickel plate 9 are fixed to the surface of the back plate 51, which effectively prevents the nickel plate 9 from wrinkling during the immersion process, affecting the quality of the nickel plate 9, and the front side of the nickel plate 9 can be immersed in the cleaning liquid, which effectively ensures the cleaning effect of the front side of the nickel plate.
[0049] The clamp includes a support member 6, which is located on the side of the back plate 51 away from the nickel plate 9. The support member 6 includes a support plate 61 and a cylinder 64. A boss 62 is provided on the side of the support plate 61. The back plate 51 includes an avoidance opening 54. The cylinder 64 can drive the support plate 61 to rotate so that the boss 62 can be inserted into the avoidance opening 54 and be flush with the side of the back plate 51 facing the surface of the nickel plate 9 or detach from the avoidance opening 54. Furthermore, two convex plates 55 are provided on the side of the back plate 51, and the two convex plates 55 are connected by a connecting shaft 56. The support plate 61 can rotate along the connecting shaft 56. A first connecting rod 63 is connected to the side of the support plate 61. The first connecting rod 63 is hinged to the cylinder 64 through a second connecting rod 65, and the cylinder 64 is hinged to the back plate 51.
[0050] When fixing the nickel plate 9, the avoidance opening 54 is blocked by the support plate 61. At this time, the surface of the back plate 51 is flat, which is convenient for fixing the nickel plate 9. When the nickel plate 9 is immersed in the cleaning liquid, the cylinder 64 drives the support plate 61 to rotate, and the support plate 61 is separated from the back plate 51, so that most of the back area of the nickel plate 9 can be directly exposed to the cleaning liquid, thereby facilitating the cleaning operation of the back of the nickel plate 9.
[0051] Among them, a plurality of strip-shaped holes 66 are provided inside the support plate 61 . By providing the strip-shaped holes 66 , the rotation resistance of the support plate 61 can be effectively reduced, and the rotation effect of the support plate 61 can be improved.
[0052] like Figure 1 and Figure 4 As shown, the circulation mechanism 2 includes a liquid outlet pipe 21, a first pump body 23 and a liquid inlet pipe, one end of the liquid outlet pipe 21 is connected to the first cleaning chamber 11 and the other end is connected to the first pump body 23, one end of the liquid inlet pipe is connected to the first cleaning chamber 11 and the other end is connected to the first pump body 23, a filter 22 is connected between the liquid outlet pipe 21 and the first pump body 23, the first cleaning chamber 11, the liquid outlet pipe 21, the filter 22, the first pump body 23, and the liquid inlet pipe form a circulating filtration waterway, the filter 22 is the prior art, the filter element in the filter 22 has a filtration density range of 10μm~20μm, before cleaning the nickel plate 9, the cleaning liquid in the first cleaning chamber 11 can be circulated through the circulation mechanism 2, so that the various components in the cleaning liquid can be mixed more evenly, thereby improving the cleaning effect of the nickel plate 9; during the cleaning process, the circulation mechanism 2 continues to work, which can not only improve the fluidity of the cleaning liquid and improve the cleaning effect of the nickel plate 9, but also filter the impurities in the cleaning liquid through the filter 22, thereby improving the cleaning effect of the nickel plate 9.
[0053] like Figure 2 and Figure 3 As shown, the liquid inlet pipe is located at one end of the first cleaning chamber 11 and is connected to a plurality of liquid return pipes 3, the liquid return pipe 3 includes a first connecting pipe 31 and a second connecting pipe 32, one end of the first connecting pipe 31 is connected to the liquid inlet pipe and the other end is connected to the middle of the second connecting pipe 32, a plurality of liquid return ports 33 are provided on the upper part of the second connecting pipe 32, the liquid return pipe 3 is positioned lower than the clamp, and the liquid return ports 33 of the liquid return pipe 3 are arranged upward, and by arranging the liquid return ports 33 of the liquid return pipe 3, dispersed liquid return of the cleaning liquid can be achieved, which can not only reduce the generation of liquid return bubbles and improve the cleaning effect of the nickel plate 9, but also improve the uniformity of the mixing of the cleaning liquid.
[0054] like Figure 4 and Figure 6As shown, the liquid inlet pipe includes a first liquid inlet section 24 connected to the first pump body 23 and a second liquid inlet section 241 arranged in the first cleaning chamber 11, the second liquid inlet section 241 is connected to the first connecting pipe 31, the upper part of the first liquid inlet section 24 is connected to the upper part of the second liquid inlet section 241 through a water-gas separation mechanism 7, the water-gas separation mechanism 7 is installed on the upper part of the cleaning box 1, the water-gas separation mechanism 7 includes an inlet 71 connected to the first liquid inlet section 24 and an outlet 72 connected to the second liquid inlet section 241, a partition block 73 is provided inside the water-gas separation mechanism 7, the partition block 73 is located between the inlet 71 and the outlet 72, two water passages 74 are formed inside the water-gas separation mechanism 7 by the partition block 73, the partition block 73 is rhombus-shaped and two opposite rhombus angles are respectively opposite to the inlet 71 and the outlet 72;
[0055] When the cleaning liquid enters the water-gas separation mechanism 7 from the inlet 71, it is diverted by the obstruction of the partition block 73 and can flow through the water channels 74 on both sides of the partition block 73. The surface of the water channels 74 is flat, so the cleaning liquid can flow smoothly through the water channels 74. When there are bubbles in the pipeline, the bubbles can be discharged to the outside at the exhaust hole 75, thereby reducing the bubbles entering the first cleaning chamber 11, greatly reducing the influence of the bubbles on the cleaning effect of the nickel plate 9.
[0056] like Figure 4 and Figure 7 As shown, the liquid outlet pipe 21 includes a vertical section 211 located in the first cleaning chamber 11, the bottom of the vertical section 211 is open, and a plurality of through holes 212 are provided on the side of the vertical section 211, and the position of the through holes 212 is lower than the upper part of the partition chamber 13. The outer side of the vertical section 211 is sleeved with a liquid outlet switching mechanism 8, and the liquid outlet switching mechanism 8 includes a sleeve 81 and a bottom cover 83, the sleeve 81 is sleeved on the outer side of the vertical section 211, and the bottom cover 83 is located below the vertical section 211, and the sleeve 81 and the bottom cover 83 can be raised and lowered. When the bottom cover 83 covers the bottom of the vertical section 211, the sleeve 81 is misaligned with the through holes 212, and when the sleeve 81 is sleeved on the outer side of the through holes 212, the position of the bottom cover 83 is lower than the bottom of the vertical section 211;
[0057] A float 82 is fixed to the outside of the sleeve 81, and the sleeve 81 and the bottom cover 83 are connected by a connecting rod 84. A retaining rib 213 is provided on the outside of the vertical section 211, and the retaining rib 213 is located lower than the through hole 212. The lower part of the sleeve 81 can abut against or detach from the retaining rib 213. By setting the retaining rib 213, the liquid outlet switching mechanism 8 can be limited in movement.
[0058] By setting the liquid return pipe 3 and the liquid outlet switching mechanism 8, the first cleaning chamber 11 can achieve liquid return at the bottom and liquid outlet at the top, thereby greatly improving the uniformity of cleaning liquid mixing, which is beneficial to improving the cleaning effect of the nickel plate 9; during cleaning, the liquid level height of the cleaning liquid is H. At this time, the liquid outlet switching mechanism 8 can be suspended through the float 82, the through hole 212 close to the liquid level surface of the cleaning liquid is opened, the bottom of the vertical section 211 is covered by the bottom cover 83, and the cleaning liquid is pumped into the first pump body 23 from the through hole 212 to achieve bottom liquid return and top outlet When the cleaning liquid level is lowered, the through hole 212 will be exposed on the liquid surface of the cleaning liquid, but the float 82 can drive the liquid outlet switching mechanism 8 to descend, and the sleeve 81 can block the part of the through hole 212 exposed on the liquid surface, thereby greatly reducing the air drawn into the first pump body 23. Although the lower end of the vertical section 211 can be opened, since the stroke from the through hole 212 to the first pump body 23 is shorter than the stroke from the lower part of the vertical section 211 to the first pump body 23, most of the cleaning liquid will still be drawn into the first pump body 23 from the through hole 212.
[0059] like Figure 1 and Figure 4 As shown, a cross bar 14 is also provided above the second cleaning chamber 12. After the nickel plate 9 is cleaned in the first cleaning chamber 11, it enters the second cleaning chamber 12 for cleaning. Specifically, the spray mechanism 4 includes an annular spray pipe 41, a third connecting pipe 43, a second pump body 44 and a fourth connecting pipe 45. The annular spray pipe 41 is located in the second cleaning chamber 12. The side wall of the annular spray pipe 41 is provided with a plurality of spray ports 42. The annular spray pipe 41 is connected to the second pump body 44 through the third connecting pipe 43. A groove 16 is provided at the bottom of the second cleaning chamber 12. The second pump body 44 is connected to the groove 16 through the fourth connecting pipe 45. During spray cleaning, a cyclic spray operation can be realized through the second pump body 44, so that the surface of the nickel plate 9 is continuously sprayed and cleaned, thereby improving the cleanliness of the front side of the nickel plate 9.
[0060] A method for cleaning a laser holographic working plate comprises the following steps:
[0061] S1. Add liquid into cleaning tank 1:
[0062] Add cleaning liquid into the first cleaning chamber 11, and the liquid level of the cleaning liquid is H;
[0063] Add pure water into the second cleaning chamber 12;
[0064] S2, circulate the cleaning liquid in the first cleaning chamber 11 through the circulation mechanism 2 for 1.5h-2h;
[0065] S3, immersing the nickel plate 9 fixed on the fixture into the cleaning liquid in the first cleaning chamber 11, the hook 53 is hung on the cross bar 14, and the conductive plate 52 is at least partially immersed in the cleaning liquid. During cleaning, the support plate 61 and the back plate 51 are in a separated state;
[0066] S4, connect the positive and negative electrodes of the power supply to the crossbar 14 and the electrode head 15 respectively, the electrode head 15 is in contact with the cleaning liquid, and the cleaning liquid is energized for 3 minutes to 5 minutes;
[0067] S5, disconnecting the power supply in step S4, taking out the fixture with the nickel plate 9 fixed thereon from the first cleaning chamber 11 and placing it into the second cleaning chamber 12;
[0068] S6, a spray mechanism 4 is provided at the second cleaning chamber 12, and the second pump body 44 of the spray mechanism 4 is operated to circulate the pure water in the second cleaning chamber 12, and the pure water is sprayed from the spray port 42 of the spray mechanism 4 to the front and back surfaces of the nickel plate 9, so as to clean the nickel plate 9 again;
[0069] S7, the cleaning operation of the nickel plate 9 is completed.
[0070] Through the above steps, the surface of the nickel plate 9 , especially the front surface, can be cleaned, which greatly improves the cleanliness of the surface of the nickel plate 9 and is beneficial to improving the quality of the nickel plate 9 .
[0071] Wherein, the cleaning liquid is a degreasing liquid, and the configuration of the degreasing liquid includes the following steps:
[0072] S1, add a kg of pure water into the first cleaning chamber 11;
[0073] S2, heating the pure water in the first cleaning chamber 11 to 40°C-45°C;
[0074] S3, pour b kg of degreasing agent and c kg of sodium hydroxide into the first cleaning chamber 11, the model of the degreasing agent is BEC-30;
[0075] S4, circulates through circulation mechanism 2 for 10min-15min;
[0076] S5, pour d kg of pure water into the first cleaning chamber 11;
[0077] S6, cycle 1.5h-2h;
[0078] S7, completing the configuration of the degreasing liquid;
[0079] The ratio of pure water, degreasing agent and sodium hydroxide (a+d): b:c=200:4:1. In this embodiment, the amounts of a, b, c and d are: a=500, b=20, c=5, d=500.
[0080] The use of the cleaning liquid with the above ratio can effectively remove organic and oily substances on the surface of the nickel plate 9, can achieve the effect of the entire plate surface being free of impurities, and can effectively solve the plate back spots and step marks that occur during the electroforming process.
[0081] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.
Claims
1. A laser holographic plate cleaning device for cleaning a nickel plate (9), characterized in that: The invention comprises a cleaning box (1), a circulation mechanism (2) and a clamp, wherein the cleaning box (1) comprises a first cleaning chamber (11), a second cleaning chamber (12), a cross bar (14) and an electrode head (15), wherein the first cleaning chamber (11) and the second cleaning chamber (12) are arranged separately, and the cross bar (14) and the electrode head (15) are both capable of conducting electricity, and the circulation mechanism (2) comprises a liquid outlet pipe (21), a first pump body (23) and a liquid inlet pipe, wherein one end of the liquid outlet pipe (21) is connected to the first cleaning chamber (11) and the other end is connected to the first pump body (23). The clamp (9) is connected to the first cleaning chamber (11), one end of the liquid inlet pipe is connected to the first cleaning chamber (11) and the other end is connected to the first pump body (23). The clamp (9) comprises a clamping mechanism (5). The clamping mechanism (5) comprises a back plate (51), a conductive plate (52) and a hook (53). The nickel plate (9) can be fixed on the surface of the back plate (51). The hook (53) can be hung on the cross bar (14) so that the nickel plate (9) is immersed in the liquid in the first cleaning chamber (11) and the conductive plate (52) is at least partially located in the liquid.
2. The cleaning device for a laser holographic working plate according to claim 1, characterized in that: The back plate (51) and the conductive plate (52) are connected by bolts, the upper part of the nickel plate (9) is located between the back plate (51) and the conductive plate (52), the lower part of the nickel plate (9) and the back plate (51) are fixed by adhesive tape, the conductive plate (52) is connected to the hook (53), and the hook (53) is made of metal.
3. The cleaning device for a laser holographic working plate according to claim 1, characterized in that: The clamp comprises a support member (6), the support member (6) is located on a side of the back plate (51) away from the nickel plate (9), the support member (6) comprises a support plate (61) and a cylinder (64), a boss (62) is provided on the side of the support plate (61), the back plate (51) comprises an escape opening (54), and the cylinder (64) can drive the support plate (61) to rotate so that the boss (62) can be inserted into the escape opening (54) and flush with the side of the back plate (51) facing the surface of the nickel plate (9) or detach from the escape opening (54).
4. The cleaning device for a laser holographic working plate according to claim 3, characterized in that: Two convex plates (55) are provided on the side of the back plate (51), and the two convex plates (55) are connected by a connecting shaft (56). The support plate (61) can rotate along the connecting shaft (56). The side of the support plate (61) is connected to a first connecting rod (63). The first connecting rod (63) and the cylinder (64) are hinged through a second connecting rod (65), and the cylinder (64) is hinged to the back plate (51).
5. The cleaning device for a laser holographic working plate according to claim 1, characterized in that: A filter (22) is connected between the liquid outlet pipe (21) and the first pump body (23); the first cleaning chamber (11), the liquid outlet pipe (21), the filter (22), the first pump body (23), and the liquid inlet pipe form a circulating filtering water circuit; one end of the liquid inlet pipe located in the first cleaning chamber (11) is connected to a plurality of liquid return pipes (3); the liquid return pipes (3) include a first connecting pipe (31) and a second connecting pipe (32); one end of the first connecting pipe (31) is connected to the liquid inlet pipe and the other end is connected to the middle of the second connecting pipe (32); and a plurality of liquid return ports (33) are provided on the upper part of the second connecting pipe (32).
6. The cleaning device for a laser holographic working plate according to claim 1, characterized in that: The liquid outlet pipe (21) comprises a vertical section (211) located in the first cleaning chamber (11); the bottom of the vertical section (211) is open; a plurality of through holes (212) are provided on the side of the vertical section (211); the through holes (212) are located lower than the upper part of the partition chamber (13); a liquid outlet switching mechanism (8) is sleeved on the outer side of the vertical section (211); the liquid outlet switching mechanism (8) comprises a sleeve (81) and a bottom cover (83); The sleeve (81) is sleeved on the outside of the vertical section (211), and the bottom cover (83) is located below the vertical section (211). The sleeve (81) and the bottom cover (83) can be raised and lowered. When the bottom cover (83) covers the bottom of the vertical section (211), the sleeve (81) and the through hole (212) are misaligned. When the sleeve (81) is sleeved on the outside of the through hole (212), the bottom cover (83) is located lower than the bottom of the vertical section (211). A floating ball (82) is fixed on the outside of the sleeve (81); the sleeve (81) and the bottom cover (83) are connected via a connecting rod (84); a retaining rib (213) is provided on the outside of the vertical section (211); the retaining rib (213) is located lower than the through hole (212); and the lower part of the sleeve (81) can abut against or detach from the retaining rib (213).
7. The cleaning device for a laser holographic working plate according to claim 1, characterized in that: The liquid inlet pipe comprises a first liquid inlet section (24) connected to the first pump body (23) and a second liquid inlet section (241) arranged in the first cleaning chamber (11); the upper part of the first liquid inlet section (24) is connected to the upper part of the second liquid inlet section (241) via a water-gas separation mechanism (7); the water-gas separation mechanism (7) comprises an inlet (71) connected to the first liquid inlet section (24) and an outlet (72) connected to the second liquid inlet section (241); the water-gas separation mechanism (7) is provided with a A partition block (73) is located between the inlet (71) and the outlet (72); two water passages (74) are formed inside the water-gas separation mechanism (7) through the partition block (73); the partition block (73) is rhombus-shaped and two opposite rhombus corners are respectively opposite to the inlet (71) and the outlet (72); the water-gas separation mechanism (7) comprises an exhaust hole (75); the exhaust hole (75) is located above the partition block (73) and is in communication with the water passage (74).
8. The cleaning device for a laser holographic working plate according to claim 1, characterized in that: The invention also comprises a spray mechanism (4), the spray mechanism (4) comprising an annular spray pipe (41), a third connecting pipe (43), a second pump body (44) and a fourth connecting pipe (45), the annular spray pipe (41) being located in the second cleaning chamber (12), a plurality of spray ports (42) being provided on the side wall of the annular spray pipe (41), the annular spray pipe (41) being connected to the second pump body (44) via the third connecting pipe (43), the bottom of the second cleaning chamber (12) being provided with a groove (16), the second pump body (44) being connected to the groove (16) via the fourth connecting pipe (45).
9. A method for cleaning a laser holographic working plate, using a laser holographic working plate cleaning device as claimed in any one of claims 1 to 8, characterized in that: The following steps are involved: S1. Add liquid into the cleaning tank (1): Adding cleaning liquid into the first cleaning chamber (11), wherein the liquid level of the cleaning liquid is H; Adding pure water into the second cleaning chamber (12); S2, circulating the cleaning liquid in the first cleaning chamber (11) through the circulation mechanism (2); S3, immersing the nickel plate (9) fixed on the fixture in the cleaning liquid in the first cleaning chamber (11), hanging the hook (53) on the crossbar (14), and at least partially immersing the conductive plate (52) in the cleaning liquid; S4, connecting the positive and negative electrodes of the power supply to the crossbar (14) and the electrode head (15) respectively, the electrode head (15) is in contact with the cleaning liquid, and the cleaning liquid is energized for 3 minutes to 5 minutes; S5, disconnecting the power supply in step S4, taking out the fixture with the nickel plate (9) fixed thereon from the first cleaning chamber (11) and placing it into the second cleaning chamber (12); S6, a spray mechanism (4) is provided at the second cleaning chamber (12), and a second pump body (44) of the spray mechanism (4) is operated to circulate and transport the pure water in the second cleaning chamber (12), and the pure water is sprayed from the spray port (42) of the spray mechanism (4) onto the front and back surfaces of the nickel plate (9), so as to clean the nickel plate (9) again; S7, complete the cleaning operation of the nickel plate (9).
10. A method for cleaning a laser holographic working plate according to claim 9, characterized in that: The cleaning liquid is a degreasing liquid, and the configuration of the degreasing liquid includes the following steps: S1, adding a kg of pure water into the first cleaning chamber (11); S2, heating the pure water in the first cleaning chamber (11) to 40°C-45°C; S3, pouring b kg of degreasing agent and c kg of sodium hydroxide into the first cleaning chamber (11); S4, circulating through the circulation mechanism (2) for 10 min-15 min; S5, pouring d kg of pure water into the first cleaning chamber (11); S6, cycle 1.5h-2h; S7, completing the configuration of the degreasing liquid; The ratio of pure water, degreaser and sodium hydroxide (a+d):b:c=200:4:1.
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