Silicon wafer pre-cleaning device of heterojunction cell

Abstract

The silicon wafer pre-cleaning device comprises a cleaning tank and a cleaning basket, a feeding port of the cleaning tank is connected with a feeding hopper so that a cleaning agent can be introduced into the cleaning tank, a plurality of air-blowing ports are evenly distributed in the side wall of the interior of the cleaning tank, and the air-blowing ports are connected with an air-blowing device so that air-blowing cleaning can be conducted on silicon wafers; a plurality of grid holes are uniformly formed in the side wall and the bottom of the cleaning basket, a silicon wafer to be cleaned is suitable for being placed in the cleaning basket, and a lifting point is arranged at the top of the cleaning basket, so that the cleaning basket is lifted into the cleaning tank for cleaning through a lifting device, and the cleaning basket is lifted out of the cleaning tank after cleaning is completed. According to the silicon wafer cleaning device, pressurized air-blowing cleaning can be carried out on silicon wafers, the stacked silicon wafers roll over in the cleaning tank to be separated, impurities on the surfaces of the silicon wafers are thoroughly cleaned away, and stubborn impurities on the surfaces of the silicon wafers can also be cleaned away through impact of pressurized air bubbles.

Description

Technical Field

[0001] The invention relates to the technical field of battery production, and in particular to a silicon wafer pre-cleaning device for a heterojunction battery. Background Art

[0002] Heterojunction cells are a type of solar cell that consists of p-type semiconductors and n-type semiconductors. Heterojunction cells have the characteristic of converting solar energy into electrical energy, so they are widely used in solar equipment such as solar panels, solar chargers, and solar street lights. In addition, heterojunction cells can also be used in electronic products such as wireless communications, computers, and smartphones.

[0003] In the manufacturing process of heterojunction cells, the pre-cleaning process is the first step, which is to remove impurities on the surface of silicon wafers during the manufacturing process, in preparation for the next texturing process. In the conventional cleaning method, a pile of silicon wafers are stacked in a cleaning basket and placed in a cleaning tank for soaking. Although this operation is more efficient, it is difficult to completely clean the impurities on the surface of the silicon wafers because the silicon wafers are stacked and bonded together, which further affects the texturing effect. Summary of the invention

[0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, an embodiment of the present invention provides a silicon wafer pre-cleaning device for a heterojunction battery, which can completely clean impurities on the surface of the silicon wafer.

[0005] An embodiment of the present invention proposes a silicon wafer pre-cleaning device for a heterojunction battery, comprising: a cleaning tank and a cleaning basket, wherein the cleaning tank has an upper opening, a feed port, a liquid discharge port and an air blow port, the feed port of the cleaning tank is connected to a feed hopper to pass a cleaning agent into the cleaning tank, a plurality of air blow ports are provided and are evenly arranged on the inner side wall of the cleaning tank, the air blow ports are connected to an air blow device to perform air blow cleaning on the silicon wafers; the side wall and the bottom of the cleaning basket have a plurality of evenly arranged grille holes, the cleaning basket is suitable for placing silicon wafers to be cleaned, the top of the cleaning basket has a hanging point, so that the cleaning basket can be hung into the cleaning tank for cleaning by a lifting device, and the cleaning basket can be hung out of the cleaning tank after the cleaning is completed.

[0006] In some embodiments, a plurality of placement racks are stacked in the cleaning basket, and each placement rack is suitable for placing a plurality of silicon wafers to be cleaned at intervals.

[0007] In some embodiments, the placement rack includes four mounting plates connected end to end to form a rectangular structure with openings at both ends. The interior of the placement rack has a placement cavity for placing silicon wafers. The inner wall of the placement rack has several groups of slots for temporarily fixing silicon wafers. The silicon wafers are inserted and removed from the openings at both ends of the placement rack.

[0008] In some embodiments, a silicone pad is fixedly connected to the bottom of the card slot.

[0009] In some embodiments, an ultrasonic transmitting mechanism is disposed in the cleaning tank, the ultrasonic transmitting mechanism is connected to an ultrasonic cleaning device, and the ultrasonic cleaning device is disposed outside the cleaning tank.

[0010] In some embodiments, the bottom of the cleaning tank is a conical bottom, and the drain port of the cleaning tank is arranged at the center of the conical bottom.

[0011] In some embodiments, the ultrasonic emitting mechanism is disposed on the inner side of the conical bottom.

[0012] In some embodiments, the discharge port of the cleaning tank is connected to the collecting tank via a discharge pipe, the discharge pipe is connected to a control valve, the collecting tank has a liquid outlet, and the liquid outlet of the collecting tank is connected to the feed port of the cleaning tank via a circulation pipeline.

[0013] In some embodiments, a filtering device is connected to the liquid outlet of the collecting tank.

[0014] In some embodiments, the circulation pipeline is connected to a pump body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings.

[0016] in:

[0017] Figure 1 It is a schematic structural diagram of a silicon wafer pre-cleaning device for a heterojunction battery in an embodiment of the present invention;

[0018] Figure 2 for Figure 1 A schematic diagram of the structure of the placement rack in FIG.

[0019] Figure 3 for Figure 2 A schematic diagram of the structure when no silicon wafer is inserted;

[0020] Reference numerals:

[0021] 1. Feed hopper; 2. Air blowing device; 3. Circulation pipeline; 4. High-pressure nozzle; 5. Ultrasonic cleaning device; 6. Ultrasonic emitting mechanism; 7. Pump body; 8. Filter device; 9. Hanging point; 10. Cleaning tank; 11. Placement rack; 111. Mounting plate; 112. Silicone pad; 113. Card slot; 12. Cleaning basket; 13. Collection tank; 14. Silicon wafer. DETAILED DESCRIPTION

[0022] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0023] The silicon wafer pre-cleaning device for a heterojunction battery according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0024] like Figure 1-3 As shown, an embodiment of the present invention proposes a silicon wafer pre-cleaning device for a heterojunction battery, comprising: a cleaning tank 10 and a cleaning basket 12, the cleaning tank 10 having an upper opening, a feed port, a liquid discharge port and an air blow port, the feed port of the cleaning tank 10 is connected to a feed hopper 1 to pass a cleaning agent into the cleaning tank 10, a plurality of air blow ports are provided and are evenly arranged on the inner side wall of the cleaning tank 10, the air blow ports are connected to an air blow device 2 to perform air blow cleaning on silicon wafers 14; the side wall and the bottom of the cleaning basket 12 have a plurality of evenly arranged grille holes, the cleaning basket 12 is suitable for placing silicon wafers 14 to be cleaned, the top of the cleaning basket 12 has a hanging point 9, so that the cleaning basket 12 can be lifted into the cleaning tank 10 for cleaning by a lifting device, and the cleaning basket 12 can be lifted out of the cleaning tank 10 after the cleaning is completed.

[0025] The embodiment of the present invention can perform pressurized air cleaning on the silicon wafers 14 by providing the air blowing device 2, so that the stacked silicon wafers 14 are rolled and separated in the cleaning tank 10, and the impurities on the surface of the silicon wafers 14 are completely cleaned, and the stubborn impurities on the surface of the silicon wafers 14 can also be cleaned by the impact of pressurized bubbles. By providing the cleaning basket 12 with grid holes, pressurized bubbles can be easily entered into the cleaning basket 12 to perform pressurized cleaning on the silicon wafers 14.

[0026] It should be noted that a check valve is provided at the air blowing port to prevent the cleaning agent in the cleaning tank 10 from flowing back into the air blowing device 2 from the air blowing port.

[0027] Furthermore, the air blowing port is connected to a high-pressure nozzle 4.

[0028] In some embodiments, Figure 1 As shown, a plurality of racks 11 are stacked in the cleaning basket 12, and each rack 11 is suitable for placing a plurality of silicon wafers 14 to be cleaned at intervals. The silicon wafers 14 can be spaced apart for easier cleaning, and the racks 11 can be used to facilitate the placement and removal of the silicon wafers 14 in the cleaning basket 12, thereby preventing the silicon wafers 14 from wearing each other.

[0029] In some embodiments, Figure 2 , 3As shown, the placement rack 11 includes four mounting plates 111 connected end to end to form a rectangular structure with openings at both ends. The interior of the placement rack 11 has a placement cavity for placing silicon wafers 14. The inner wall of the placement rack 11 has several groups of card slots 113 for temporarily fixing the silicon wafers 14. The silicon wafers 14 are inserted and removed from the openings at both ends of the placement rack 11.

[0030] Furthermore, the silicon wafers 14 in a single placement rack 11 are arranged parallel to each other.

[0031] In some embodiments, Figure 2 , 3 As shown, the bottom of the slot 113 is fixedly connected with a silicone pad 112. The two opposite sides of the silicon wafer 14 are clamped in the placement rack 11 to prevent the silicon wafer 14 from falling off from the placement rack 11 during the cleaning process.

[0032] It should be noted that the width of the card slot 113 is slightly larger than the thickness of the silicon wafer 14 , so that the edge of the silicon wafer 14 can also be cleaned.

[0033] In some embodiments, Figure 1 As shown, an ultrasonic emitting mechanism 6 is arranged in the cleaning tank 10, and the ultrasonic emitting mechanism 6 is connected to an ultrasonic cleaning device 5, and the ultrasonic cleaning device 5 is arranged outside the cleaning tank 10. The cleaning effect can be further improved.

[0034] In some embodiments, Figure 1 As shown, the bottom of the cleaning tank 10 is a conical bottom, and the drain port of the cleaning tank 10 is arranged at the center of the conical bottom, so as to facilitate the discharge of the cleaning agent and the cleaned impurities.

[0035] In some embodiments, Figure 1 As shown, the ultrasonic emitting mechanism 6 is arranged on the inner side of the conical bottom, so that the ultrasonic wave can be used for cleaning from the bottom of the cleaning basket 12, and can cooperate with the air blowing ports arranged around to clean the silicon wafers 14 in the cleaning basket 12 from different directions, so as to prevent the mounting plate 111 of the placement rack 11 from blocking the air blowing ports and causing the silicon wafers 14 to be not cleaned properly.

[0036] Furthermore, at least two ultrasonic emitting mechanisms 6 are provided, which are respectively arranged at opposite positions of the conical bottom.

[0037] In some embodiments, Figure 1 As shown, the discharge port of the cleaning tank 10 is connected to the collecting tank 13 through a discharge pipe, the discharge pipe is connected to a control valve, the collecting tank 13 has a liquid outlet, and the liquid outlet of the collecting tank 13 is connected to the feed port of the cleaning tank 10 through a circulation pipeline 3. The cleaning agent can be recycled.

[0038] In some embodiments, Figure 1As shown, a filter device 8 is connected to the liquid outlet of the collecting tank 13. Impurities in the recovered cleaning agent can be filtered out and then recycled.

[0039] In some embodiments, Figure 1 As shown, the circulation pipeline 3 is connected to a pump body 7 to provide a power source for the recycled cleaning agent to be introduced into the feed hopper 1.

[0040] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0042] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0044] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0045] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A silicon wafer pre-cleaning device for a heterojunction battery, characterized in that: include: A cleaning tank, the cleaning tank having an upper opening, a feed port, a liquid discharge port and an air blowing port, the feed port of the cleaning tank being connected to a feed hopper to pass a cleaning agent into the cleaning tank, a plurality of air blowing ports being provided and all arranged on the inner side wall of the cleaning tank, the air blowing ports being connected to an air blowing device to perform air blowing cleaning on the silicon wafer; A cleaning basket, wherein the side wall and the bottom of the cleaning basket are provided with a plurality of grille holes evenly distributed, the cleaning basket is suitable for placing silicon wafers to be cleaned, and the top of the cleaning basket is provided with a hanging point, so that the cleaning basket can be lifted into the cleaning tank for cleaning by a lifting device, and the cleaning basket can be lifted out of the cleaning tank after the cleaning is completed.

2. The silicon wafer pre-cleaning device for heterojunction cells according to claim 1, characterized in that: A plurality of placement racks are stacked in the cleaning basket, and each of the placement racks is suitable for placing a plurality of silicon wafers to be cleaned at intervals.

3. The silicon wafer pre-cleaning device for heterojunction cells according to claim 2, characterized in that: The placement rack includes four mounting plates connected end to end to form a rectangular structure with openings at both ends. The interior of the placement rack has a placement cavity for placing silicon wafers. The inner wall of the placement rack has several groups of card slots for temporarily fixing silicon wafers. Silicon wafers are inserted and removed from the openings at both ends of the placement rack.

4. The silicon wafer pre-cleaning device for heterojunction cells according to claim 3, characterized in that: A silicone pad is fixedly connected to the bottom of the card slot.

5. The silicon wafer pre-cleaning device for heterojunction cells according to claim 1, characterized in that: An ultrasonic emitting mechanism is arranged in the cleaning tank, and the ultrasonic emitting mechanism is connected to an ultrasonic cleaning device, and the ultrasonic cleaning device is arranged outside the cleaning tank.

6. The silicon wafer pre-cleaning device for heterojunction cells according to claim 5, characterized in that: The bottom of the cleaning tank is a conical bottom, and the drainage port of the cleaning tank is arranged at the center of the conical bottom.

7. The silicon wafer pre-cleaning device for heterojunction cells according to claim 6, characterized in that: The ultrasonic wave transmitting mechanism is arranged on the inner side of the conical bottom.

8. The silicon wafer pre-cleaning device for heterojunction cells according to claim 1, characterized in that: The liquid discharge port of the cleaning tank is connected to the collecting tank through a liquid discharge pipe, the liquid discharge pipe is connected to a control valve, the collecting tank has a liquid outlet, and the liquid outlet of the collecting tank is connected to the feed port of the cleaning tank through a circulation pipeline.

9. The silicon wafer pre-cleaning device for heterojunction cells according to claim 8, characterized in that: The liquid outlet of the collecting tank is connected with a filtering device.

10. The silicon wafer pre-cleaning device for heterojunction cells according to claim 8, characterized in that: The circulation pipeline is connected with a pump body.

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