A method for processing gold-plated silver and gold-plated silver products

By creating venting holes, heating and leveling, and applying bonding wires during the gold-plated silver processing, the problems of air bubbles and bonding in gold-plated silver products have been solved, achieving the production of high-quality and aesthetically pleasing gold-plated silver products.

CN119609582BActive Publication Date: 2025-12-02SHENZHEN XINDEYUAN JEWELRY CO LTD
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Patent Information

Application Number
CN202510028978.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-01-07
Publication Date
2025-12-02
Estimated Expiration
2045-01-07

AI Technical Summary

Technical Problem

In traditional gold-plated silver processing, the stress concentration at the bonding interface caused by air bubbles and the difference in the coefficient of thermal expansion of the materials affects the adhesion, and the air bubbles also affect the aesthetics and durability.

Method used

By forming multiple vent holes in the gold layer, pressure is applied to expel the interlayer gas, and heating and liquid leveling are used to smooth the surface. Combined with a wire drawing machine for bonding, the bonding strength of gold and silver is enhanced.

Benefits of technology

This process eliminates air bubbles, improves the adhesion between gold and silver, and produces high-quality, bubble-free, and aesthetically pleasing gold-plated silver products.

✦ Generated by Eureka AI based on patent content.

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Abstract

A gold-plated silver processing method and gold-plated silver products are disclosed, relating to the field of metal processing technology. The gold-plated silver processing method includes the following steps: S1, silver blank treatment, polishing the silver blank to remove surface impurities; S3, gold plating, applying a gold layer to the treated silver blank; S4, piercing the gold layer using a cone to create multiple vent holes; S5, pressing, applying pressure from one end of the product to the other to expel residual gas within the interlayer through the vent holes; S6, water leveling, heating and water leveling the surface of the gold layer to eliminate piercing marks; S7, wire drawing and bonding, using a wire drawing machine to draw the product to the desired outer diameter to ensure a tight bond between the gold layer and the silver blank. This technical solution has the advantages of eliminating air bubbles within the interlayer, enhancing the adhesion between gold and silver, and improving product quality.
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Description

Technical Field

[0001] This invention relates to the field of metal processing technology, specifically to a gold-plated silver processing method and gold-plated silver products. Background Technology

[0002] In the metalworking industry, gold-plated silver products are favored by the market due to their unique appearance and value. They are manufactured by coating a silver substrate with a layer of gold to protect the underlying silver from oxidation and to give the product a more luxurious look. However, in traditional gold-plating processes, air bubbles are easily formed between the gold layer and the silver substrate. These bubbles are caused by incomplete air removal during the coating process or by the thermal expansion and contraction during heating and cooling. Furthermore, the different coefficients of thermal expansion of gold and silver can cause stress concentration at the bonding interface, affecting the adhesion between the two materials. These bubbles not only affect the aesthetics of gold-plated silver products but, more importantly, reduce their durability and stability. Over time, these bubbles may enlarge, causing the gold layer to peel off, exposing the underlying silver material, making it more susceptible to oxidation and discoloration. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings and deficiencies of the prior art by providing a gold-plated silver processing method and gold-plated silver products, which have the advantages of eliminating air bubbles in the interlayer, enhancing the adhesion between gold and silver, and improving product quality.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is: a gold-plated silver processing method, comprising the following steps:

[0005] S1. Silver blank processing: Polishing the silver blank to remove surface impurities;

[0006] S3, Gold plating, which involves covering the treated silver blank with a gold lining;

[0007] S4. Piercing the skin: Use the cone to pierce the gold skin layer to create multiple air vents;

[0008] S5. Pressing: Apply pressure from one end of the product to the other end to expel residual gas in the interlayer through the vent.

[0009] S6. Water run-through leveling: Heat and run water to level the surface of the gold skin layer to eliminate burr marks.

[0010] S7. Wire drawing and bonding: The product is drawn to the required outer diameter using a wire drawing machine so that the gold foil layer is tightly bonded to the silver blank.

[0011] In a further embodiment of the present invention, in step S3, the depth of vertebral insertion is greater than the thickness of the gold coating.

[0012] In a further embodiment of the present invention, the heating method in S6 is: heating by induction or infrared.

[0013] The present invention further includes, between S1 and S3, S2: the cleaned silver blank, which is then dried.

[0014] To achieve the above objectives, another technical solution adopted by the present invention is: a gold-plated silver product, which is made by the gold-plated silver processing method described above.

[0015] The present invention further provides that the gold-plated silver product includes: a silver blank, and a gold foil layer covering the outer surface of the silver blank.

[0016] The present invention further includes, in the case of a gold-plated silver product, an adhesive disposed between the silver blank and the gold foil layer.

[0017] After adopting the above technical solution, the beneficial effects of the present invention are as follows: In the present invention, by using a cone to puncture the gold coating layer to form multiple vent holes, pressure is applied from one end of the product to the other end to expel the residual gas in the interlayer through the vent holes, thereby reducing or eliminating air bubbles in the interlayer of the gold-plated silver product; then, the surface of the gold coating layer is heated to make it easier to adhere to the silver blank, and the heated product is placed in a liquid to promote the slight softening and smoothing of the gold coating layer surface, ensuring that the gold coating layer evenly covers the silver blank, improving the adhesion between the gold coating layer and the silver blank, and finally, the adhesion is further enhanced by string bonding, thereby producing high-quality, bubble-free and aesthetically pleasing gold-plated silver products. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart of the gold-plated silver processing method;

[0020] Figure 2 This is a schematic diagram of the cross-sectional structure of a gold-plated silver product.

[0021] Explanation of reference numerals in the attached diagram: 1. Silver blank; 2. Gold patina. Detailed Implementation

[0022] The present invention will be further described in detail below with reference to the accompanying drawings.

[0023] This specific embodiment is merely an explanation of the present invention and is not intended to limit the invention. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive element, but such modifications are protected by patent law as long as they fall within the scope of the claims of the present invention.

[0024] This embodiment relates to a gold-plated silver processing method, referring to... Figure 1 This includes the following steps:

[0025] S1, Silver blank 1 processing: Polishing the silver blank 1 to remove surface impurities;

[0026] S3, Gold plating: Gold plating 2 is applied to the treated silver blank 1;

[0027] S4, Piercing the skin: Use the cone to pierce the gold skin layer 2 to form multiple air vents;

[0028] S5. Pressing: Apply pressure from one end of the product to the other end to expel residual gas in the interlayer through the vent.

[0029] S6. Water run-through leveling: Heat and run water to level the surface of the gold skin layer 2 to eliminate puncture marks.

[0030] S7. Wire drawing and bonding: The product is drawn to the required outer diameter using a wire drawing machine so that the gold layer 2 and the silver blank 1 are tightly bonded together.

[0031] In step S1, a polishing tool is used to polish the surface of the silver blank 1 to remove the oxide layer and impurities, providing a clean and smooth surface to ensure that the subsequent gold layer 2 can adhere tightly and reduce the possibility of air bubbles forming within the layers. The polishing tool can be sandpaper or an electric polisher. In step S3, the prepared gold layer 2 is cut to the dimensions of the silver blank 1 and then tightly wrapped around the silver blank 1 using manual or automatic wrapping equipment to form a protective layer that prevents oxidation of the silver blank 1. It should be noted that the dimensions of the gold layer 2 and the silver blank 1 are not specifically limited here.

[0032] In step S4, a conical tool is used to puncture tiny holes on the surface of the gold layer 2, forming multiple venting holes. The puncture depth is controlled to avoid damaging the silver blank 1. Specifically, in this embodiment, the puncture depth of the conical tool is greater than the thickness of the gold layer 2, allowing it to puncture the gold layer 2 to form venting holes, just enough to pierce the gold layer 2 without damaging the silver blank 1. The conical tool can be a customized needle-like or multi-conical tool, which can be operated manually or installed on automated equipment. In step S5, pressure is applied from one end of the product to the other, causing the gas in the interlayer to escape through the holes formed by the puncture, reducing air bubbles in the inner interlayer and improving the adhesion between the gold layer 2 and the silver blank 1. Specifically, a gradually increasing pressure method is used to avoid unnecessary damage to the gold layer 2 and to ensure that air bubbles are effectively expelled. Specifically, in this embodiment, a fixing device is required to ensure that the product does not move during the pressing process. In some embodiments, an exhaust monitoring device can be used to detect whether the gas has been completely expelled.

[0033] In step S6, the surface of the gold layer 2 is heated to a suitable temperature to slightly soften it, making it easier to adhere to the silver blank 1. Specifically, in this embodiment, the heating method in step S6 is induction or infrared heating, ensuring that it softens appropriately without causing deformation or damage. Both induction heating and infrared heating are non-contact heating methods, which avoids surface damage or contamination caused by direct contact, ensuring a tight bond between the gold layer 2 and the silver blank 1, while also quickly reaching the required temperature and reducing processing time. In other embodiments, the heating in step S6 can also be other heating methods. Immersing the product in warm water or spraying its surface with water helps to smooth it, restoring the smoothness and flatness of the gold layer 2 surface. After surface smoothing, burr marks are eliminated, ensuring that the gold layer evenly covers the silver blank 1, achieving an ideal appearance and bonding effect, and improving the adhesion between the gold layer 2 and the silver blank 1. In S7, a wire drawing machine is used to stretch the product to the required outer diameter, ensuring a tight bond between the gold plating layer 2 and the silver blank 1. The tension is evenly distributed during the wire drawing process to prevent wrinkles or unevenness in the gold plating layer 2. Therefore, wire drawing further enhances the adhesion, resulting in high-quality, bubble-free, and aesthetically pleasing gold-plated silver products.

[0034] In this embodiment, refer to Figure 1 Between S1 and S3, there is also S2, which involves cleaning the silver blank 1 and then drying it. The cleaning process can effectively remove fine particles, oil stains or other impurities that may remain during the polishing process. If these impurities remain on the surface of the silver blank 1, they may affect the bonding quality between the gold layer 2 and the silver blank 1 in subsequent processes.

[0035] In some embodiments, the gold-plated silver processing method can be applied to, but is not limited to, the following fields: jewelry, handicrafts, watchmaking, electronic components, medical devices, automotive accessories, and the gift industry.

[0036] This embodiment also relates to a gold-plated silver product, see reference. Figure 2 This product is manufactured using the gold-plated silver processing method described above. This gold-plated silver product reduces or eliminates air bubbles within the interlayer, enhancing overall adhesion and improving product quality and aesthetics. Specifically, the gold-plated silver product includes: a silver blank 1 and a gold foil layer 2 covering the outer surface of the silver blank 1. The silver blank 1 is mainly composed of pure silver or a silver alloy and can be designed into various shapes as needed, such as strips, sheets, and cylinders. It is polished smooth to remove surface impurities, ensuring good adhesion with the gold foil layer 2. The gold foil layer 2 is composed of pure gold or a gold alloy, providing anti-oxidation protection and decorative functions. Its thickness is typically set relatively thin to control costs while ensuring sufficient protective effect.

[0037] In this embodiment, the gold-plated silver product further includes an adhesive (not shown) disposed between the silver blank 1 and the gold plating layer 2. The adhesive significantly increases the bonding strength between the gold plating layer 2 and the silver blank 1, ensuring a tight fit and reducing the risk of delamination or peeling. Furthermore, for gold-plated silver products with complex shapes or numerous curved surfaces, the adhesive makes it easier to achieve uniform coverage of the gold plating layer, simplifying the coating process and improving production efficiency. In other embodiments, other intermediate layers, such as a nickel layer or other alloy layers, can be added between the gold plating layer 2 and the silver blank 1 to increase wear resistance.

[0038] The above is only used to illustrate the technical solution of the present invention and is not intended to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of the present invention, as long as they do not depart from the spirit and scope of the technical solution of the present invention, should be covered within the scope of the claims of the present invention.

Claims

1. A method for processing gold-plated silver, characterized in that, Includes the following steps: S1. Silver blank (1) processing: polish the silver blank (1) to remove surface impurities; S3, Gold plating, the gold plating (2) is applied to the treated silver blank (1); S4. Piercing the skin: Use the vertebral body to pierce the gold skin layer (2) to form multiple air vents. The depth of the vertebral body piercing is greater than the thickness of the gold skin layer (2). S5. Pressing: Apply pressure from one end of the product to the other end to expel residual gas in the interlayer through the vent. S6. Water run-through leveling: Heat and run-through leveling of the gold skin layer (2) surface to eliminate puncture marks. The heating method is through induction or infrared heating. S7. Wire drawing and bonding: The product is drawn to the required outer diameter by a wire drawing machine so that the gold foil layer (2) and the silver blank (1) are tightly bonded.

2. The gold-plated silver processing method according to claim 1, characterized in that, Between S1 and S3, there is also: S2, the cleaned silver blank (1), which is then dried.

3. A gold-plated silver product, characterized in that, It is made by the gold-plated silver processing method according to any one of claims 1-2.

4. The gold-plated silver product according to claim 3, characterized in that, The gold-plated silver product includes: a silver blank (1) and a gold foil layer (2) covering the outer surface of the silver blank (1).

5. The gold-plated silver product according to claim 4, characterized in that, The gold-plated silver product also includes an adhesive disposed between the silver blank (1) and the gold foil layer (2).

Citation Information

Patent Citations

  • Bracelet manufacturing technology

    CN105146868A

  • Method for wrapping silver through gold and silver kettle

    CN109719467A