Semiconductor finish machining equipment for precise part production

Abstract

The invention discloses semiconductor finish machining equipment for precise part production, and relates to the technical field of semiconductor machining, and the semiconductor finish machining equipment comprises a protection unit which comprises a transmission rod clamped on the side wall of the tail end of a driving rod, an adjusting assembly arranged on the outer wall of the transmission rod in a sleeving manner, a grinding disc arranged at the bottom of the transmission rod, and a spring arranged between the adjusting assembly and the grinding disc. The device has the beneficial effects that through double guarantee of adjustment of the prepressing amount of the spring and mechanical protection, the technical problems that in the prior art, pressure control is not stable, the process switching efficiency is low, and safety protection is not reliable are effectively solved while the machining quality is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, in particular to semiconductor finishing equipment for producing precision parts. Background Art

[0002] In the semiconductor manufacturing process, grinding and polishing of the wafer substrate is a basic process step to achieve wafer surface flatness, and is mainly used in wafer back thinning, rough polishing and other processing links. Traditional grinding and polishing equipment usually uses a direct hydraulically controlled grinding wheel pressure system to control the processing pressure through pressure feedback. With the development of the wafer manufacturing industry, the grinding and polishing process has also put forward higher requirements for the safety and stability of pressure control. At present, the pressure control solutions commonly used in the industry mainly include hydraulic direct drive systems, pneumatic control systems, and mechanical transmission systems. In actual applications, these systems use various sensors and control devices to ensure the pressure stability of the processing process.

[0003] However, the existing technical solutions have many technical bottlenecks in practical applications: First, due to the response characteristics of the control system, instantaneous impact is easily generated during the initial contact stage between the grinding disc and the wafer, which easily exceeds the maximum pressure that the wafer can withstand, affecting the processing quality and wafer integrity. Secondly, in different process stages such as rough grinding and fine grinding, traditional equipment needs to be shut down for adjustment or switch equipment, and cannot dynamically adjust the pressure, which seriously affects production efficiency. Thirdly, during the operation of the equipment, due to various reasons such as PLC program abnormalities, sensor failure, hydraulic system failure (such as oil pipe rupture, sealing ring damage, valve jamming, etc.), electrical system failure (such as solenoid valve failure, driver short circuit, etc.) and human operation errors, the pressure system may fail, causing the wafer to be damaged due to excessive pressure. As the basic material for semiconductor manufacturing, the integrity and processing quality of the wafer will directly affect the subsequent processes. Summary of the invention

[0004] In view of the above problems or problems existing in the prior art, the present invention is proposed.

[0005] Therefore, an object of the present invention is to provide a semiconductor finishing equipment for producing precision parts, which can solve the problems mentioned in the background art.

[0006] To solve the above technical problems, the present invention provides the following technical solutions: A semiconductor finishing equipment for producing precision parts, comprising a driving unit, a mounting frame, and a driving rod penetrating and fixed to the surface of the mounting frame; The protection unit includes a transmission rod engaged with the side wall of the end of the driving rod, an adjustment component sleeved on the outer wall of the transmission rod, a grinding disc arranged at the bottom of the transmission rod, and a spring arranged between the adjustment component and the grinding disc.

[0007] As a preferred solution of the semiconductor finishing equipment for producing precision parts described in the present invention, the transmission rod includes a sleeve arranged at its end, an external thread arranged on the outer wall of the transmission rod, and a plurality of limit blocks arranged at the other end of the transmission rod.

[0008] As a preferred solution of the semiconductor finishing equipment for producing precision parts described in the present invention, the adjustment component includes a dynamic disk sleeved on the outer wall of the transmission rod, an engaging part penetrating the side wall of the dynamic disk, a trigger block sleeved on the rod end of the engaging part, and a pin block arranged at the upper end of the engaging part.

[0009] As a preferred solution of the semiconductor finishing equipment for producing precision parts described in the present invention, the dynamic disk includes a plurality of first channels opened on its side wall, a second channel arranged on one side of the first channel, a third channel arranged at the upper end of the first channel, and a first inclined surface arranged on the lower edge of the side wall of the dynamic disk.

[0010] As a preferred solution of the semiconductor finishing equipment for producing precision parts described in the present invention, the engaging part includes a threaded block, a pressure rod fixed to the end of the threaded block, a pressure block fixed to the end of the pressure rod, and a spring fixed to one side of the top of the pressure block.

[0011] As a preferred solution of the semiconductor finishing equipment for producing precision parts of the present invention, the trigger block includes an arc surface arranged at the lower edge of the end.

[0012] As a preferred solution of the semiconductor finishing equipment for producing precision parts of the present invention, the pin block includes a second inclined surface arranged at the lower edge of its side wall.

[0013] As a preferred solution of the semiconductor finishing equipment for producing precision parts described in the present invention, the grinding disc includes a connecting sleeve fixed on the top thereof, a plurality of limiting grooves opened on the inner wall of the connecting sleeve, and a trigger sleeve fixed on the outside of the connecting sleeve.

[0014] As a preferred solution of the semiconductor finishing equipment for producing precision parts of the present invention, the mounting frame includes a pair of panels and a plurality of support rods fixed between the pair of panels.

[0015] Beneficial effects of the present invention: The present invention can buffer through the spring, realize the "soft landing" contact process between the grinding disc and the wafer, effectively avoid the instantaneous impact at the initial contact, reduce the risk of wafer damage, and compensate for the pressure fluctuation of the hydraulic system during processing, so that the processing pressure is more stable; the preload of the spring can be adjusted by the threaded pair, and the processing pressure required by different processes can be quickly switched when the feed amount of the driving rod remains unchanged, without stopping for adjustment, thereby improving production efficiency; when the system has abnormal pressure, the dynamic disc and the transmission rod are automatically separated, the pressure transmission link is cut off, so that the wafer will not be damaged by excessive pressure, and reliable mechanical safety protection is provided. The height of the trigger sleeve can determine the pressure protection threshold set for different processes; the dynamic disc can be quickly reset manually after being separated, reducing the fault recovery time; the protection unit does not rely on electrical control and sensors, has a simple and reliable structure, and is not affected by the power supply and control system. Through the dual guarantee of adjusting the spring preload and mechanical protection, while ensuring the processing quality, the technical problems of unstable pressure control, low process switching efficiency, and unreliable safety protection in the prior art are effectively solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is an overall three-dimensional schematic diagram of the present invention.

[0018] Figure 2 It is an overall three-dimensional exploded view of the present invention.

[0019] Figure 3 It is an overall partial cross-sectional view of the present invention.

[0020] Figure 4 For the present invention Figure 3 A is a partial enlarged view of the

[0021] Figure 5 It is a partial cross-sectional view of the protection unit of the present invention.

[0022] Figure 6 It is a structural view of the protection unit of the present invention.

[0023] In the figure: 1, driving unit; 11, mounting frame; 12, driving rod; 2, protection unit; 21, transmission rod; 22, adjustment assembly; 23, grinding disc; 24, spring; 211, sleeve; 212, external thread; 213, limit block; 221, dynamic disk; 222, engagement member; 223, trigger block; 224, pin block; 2211, first channel; 2212, second channel; 2213, third channel; 2214, first inclined surface; 2221, threaded block; 2222, pressure rod; 2223, pressure block; 2224, spring piece; 2231, arc surface; 2241, second inclined surface; 231, connecting sleeve; 232, limit groove; 233, trigger sleeve; 111, panel; 112, support rod. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0025] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0026] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments. Example 1

[0027] Reference Figure 1 to Figure 6 , which is the first embodiment of the present invention, provides a semiconductor finishing equipment for producing precision parts, which includes a driving unit 1, including a mounting frame 11, and a driving rod 12 that penetrates and is fixed to the surface of the mounting frame 11; The protection unit 2 includes a transmission rod 21 engaged with the side wall of the end of the driving rod 12, an adjustment component 22 sleeved on the outer wall of the transmission rod 21, a grinding disc 23 arranged at the bottom of the transmission rod 21, and a spring 24 arranged between the adjustment component 22 and the grinding disc 23.

[0028] Furthermore, the transmission rod 21 includes a sleeve 211 disposed at an end thereof, an external thread 212 disposed on an outer wall of the transmission rod 21 , and a plurality of limit blocks 213 disposed at the other end of the transmission rod 21 .

[0029] Furthermore, the adjustment component 22 includes a dynamic disk 221 sleeved on the outer wall of the transmission rod 21, an engaging member 222 penetrating the side wall of the dynamic disk 221, a trigger block 223 sleeved on the rod end of the engaging member 222, and a pin block 224 arranged on the upper end of the engaging member 222.

[0030] Furthermore, the dynamic disk 221 includes a plurality of first channels 2211 opened on its side wall, a second channel 2212 arranged on one side of the first channel 2211 , a third channel 2213 arranged on the upper end of the first channel 2211 , and a first inclined surface 2214 arranged on the lower edge of the side wall of the dynamic disk 221 .

[0031] Furthermore, the engaging member 222 includes a threaded block 2221 , a pressure rod 2222 fixed to the end of the threaded block 2221 , a pressure block 2223 fixed to the end of the pressure rod 2222 , and a spring piece 2224 fixed to one side of the top of the pressure block 2223 .

[0032] Furthermore, the trigger block 223 includes an arc surface 2231 disposed at the lower edge of the end portion.

[0033] Furthermore, the pin block 224 includes a second inclined surface 2241 disposed at the lower edge of the side wall thereof.

[0034] Furthermore, the grinding disc 23 includes a connecting sleeve 231 fixed on the top thereof, a plurality of limiting grooves 232 formed on the inner wall of the connecting sleeve 231 , and a trigger sleeve 233 fixed on the outside of the connecting sleeve 231 .

[0035] Furthermore, the mounting frame 11 includes a pair of panels 111 and a plurality of support rods 112 fixed between the pair of panels 111 .

[0036] It should be noted that the mounting frame 11 is composed of two panels 111 and four support rods 112. The support rods 112 are fixed at the four corners between the two panels 111. Circular holes are opened in the middle of the two panels 111. A driving rod 12 is connected to the top panel 111 by bolts. The telescopic rod end of the driving rod 12 faces downward and can pass through the circular holes in the center of the two panels 111.

[0037] Preferably, the driving rod 12 can be an electric push rod or a hydraulic rod.

[0038] Preferably, an annular circular groove is provided on the outer wall of the end of the telescopic rod at the execution end of the driving rod 12. A sleeve 211 is fixed to one end of the transmission rod 21, and a circular ring is provided on the inner wall of the sleeve 211 near the opening, which can cooperate with the circular groove of the telescopic rod on the driving rod 12. When the sleeve 211 is sleeved on the end of the telescopic rod on the driving rod 12, the two are engaged with each other, so that the transmission rod 21 can only rotate circumferentially but cannot move axially. An external thread 212 is also provided on the rod body of the transmission rod 21, and a pair of axially extending limit blocks 213 are fixed on the outer wall at the other end, and the limit blocks 213 are evenly distributed circumferentially. It should be noted that the number of the limit blocks 213 is at least one.

[0039] Preferably, a connecting sleeve 231 is fixed on the top of the grinding disc 23, and the inner wall of the connecting sleeve 231 is provided with limiting grooves 232 of the same number as the limiting blocks 213, and the limiting grooves 232 do not penetrate the top of the connecting sleeve 231 to the outside. The limiting blocks 213 cooperate with the limiting grooves 232, and the connecting sleeve 231 is sleeved on the end of the driving rod 12, so that the grinding disc 23 can move axially without being separated from the driving rod 21.

[0040] Preferably, a pulley can be fixed on the smooth part of the transmission rod 21, and the grinding disc 23 can be driven to rotate by belt transmission. Similar rotation drive devices are usually used in the prior art.

[0041] Preferably, the dynamic disk 221 is sleeved on the area of ​​the driving rod 12 with the external thread 212. It should be noted that the inner wall of the dynamic disk 221 is a smooth surface, so the dynamic disk 221 can move axially and circumferentially on the external thread 212. A plurality of first channels 2211 evenly distributed around the circumference are provided on the side wall of the dynamic disk 221. In this embodiment, two are used, and the actual number is at least two evenly distributed first channels 2211. The first channel 2211 points to the direction of the axis of the dynamic disk 221 and a through second channel 2212 is provided, and the two are connected. A third channel 2213 connected to the outside is provided at the top of the first channel 2211. The cross-sectional area of ​​the second channel 2212 is larger than that of the first channel 2211. In addition, blocks are provided on both sides of the opening of the first channel 2211 away from the axis to prevent the trigger block 223 from falling off. An annular first inclined surface 2214 is provided at the lower edge of the outer wall of the dynamic disk 221, and the first inclined surface 2214 passes through the first channel 2211.

[0042] The first channel 2211 has a rectangular cross-section, and can accommodate a trigger block 223 with the same cross-section shape and prevent the trigger block 223 from circumferentially shifting. The second channel 2212 also has a rectangular cross-section, and can accommodate the threaded block 2221 and prevent the threaded block 2221 from circumferentially shifting. The third channel 2213 is used to accommodate the pin block 224, and also has a rectangular cross-section and can prevent the pin block 224 from circumferentially shifting.

[0043] Preferably, the engaging member 222 is arranged in the channel inside the dynamic disk 221 and extends out of the dynamic disk 221 to the outer end, and the number is consistent with the first channel 2211, wherein the threaded block 2221 and the pressure block 2223 are fixedly connected by a pressure rod 2222, and the side wall of the threaded block 2221 on the side facing the axis of the dynamic disk 221 is arc-shaped and has an internal thread, so that it can engage with the external thread 212 on the outer wall of the transmission rod 21.

[0044] The pressure rod 2222 extends to the outside through the first channel 2211. A spring piece 2224 is fixed on the side wall of the top of the pressure block 2223 facing the axis. The spring piece 2224 can resist the upper edge of the opening of the first channel 2211 and prevent the trigger block 223 from falling off.

[0045] Preferably, the trigger block 223 is sleeved on the outer wall of the pressure rod 2222 , and an arc surface 2231 is provided on the lower edge of one end away from the axis of the dynamic disk 221 . The arc surface 2231 protrudes from the interface between the first channel 2211 and the first inclined surface 2214 .

[0046] Preferably, the lower edge of the side wall of the pin block 224 away from the axis of the dynamic disk 221 is provided with a second inclined surface 2241, the second inclined surface 2241 is adjacent to the trigger block 223 toward the axis end, and the vertical surface is in contact with the vertical surface of the threaded block 2221, which can prevent the engagement member 222 from falling off and ensure the engagement effect.

[0047] Preferably, a spring 24 is further provided between the bottom of the dynamic disk 221 and the connecting sleeve 231 for transmitting the pressure from the driving rod 12 and applying it to the grinding disk 23, thereby grinding the wafer substrate.

[0048] Before the wafer grinding and polishing process, the pulley is installed on the outer wall of the transmission rod 21 close to the sleeve 211, and then the two are fastened to drive the transmission rod 21 to rotate through the belt transmission.

[0049] The driving rod 12 drives the transmission rod 21 and the grinding wheel 23 downward. When the grinding wheel 23 contacts the surface of the wafer, the spring 24 buffers the instantaneous impact and realizes a "soft landing" contact process. This can prevent the wafer from being damaged or scrapped, and it is also easier to adjust the pressure of the grinding wheel 23 to the appropriate pressure range for wafer processing under the current process. At this time, the spring 24 is deformed under pressure.

[0050] When the process needs to be switched, under the premise that the feed amount of the drive rod 12 remains unchanged, the preload of the spring 24 can be controlled by rotating the dynamic disk 221 to adapt to the pressure standards of different processes. It has high accuracy and ensures smoother pressure contact, compensates for fluctuations in the hydraulic system, and eliminates downtime adjustment time for process switching.

[0051] When the driving rod 12 fails, such as when the hydraulic rod pressure suddenly changes or overshoots, or when the electric push rod motor output is abnormal, the spring 24 can prevent the wafer from being subjected to excessive pressure, thereby further buffering. At this time, the bottom of the dynamic disk 221 will contact the trigger sleeve 233, and the trigger sleeve 233 will press against the arc surface 2231, forcing the trigger block 223 to move toward the axis of the dynamic disk 221. Then the trigger block 223 presses against the second inclined surface 2241, causing the pin block 224 to move upward and lose the limiting effect on the threaded block 2221. At this time, the spring piece 2224 presses against the first pass The open end of the channel 2211 is in a deformed state. After the thread block 2221 is disengaged from the limit, the spring piece 2224 pulls the thread block 2221 together with the trigger block 223 in a direction away from the axis of the dynamic disk 221 through the reaction force. At this time, the trigger block 223 is reset, and the thread block 2221 is also disengaged from the engagement with the external thread 212. The dynamic disk 221 is pushed out of the area of ​​the external thread 212 by the spring 24. Therefore, the pressure transmission from the drive rod 12 to the dynamic disk 221, and then to the spring 24 and the grinding disk 23 is interrupted, so that the failure of the drive rod 12 will not affect the wafer itself.

[0052] It should be noted that when the parameters of the spring 24 remain unchanged and are not replaced, the height of the trigger sleeve 233 represents the maximum threshold value of the pressure on the wafer, that is, the higher the trigger sleeve 233 is, the less the movement is, and the lower the threshold is. No matter what the pre-compression amount of the spring 24 is currently, the trigger sleeve 233 always presses against the trigger block 223 when it reaches the pressure threshold.

[0053] When resetting is required, the personnel overcome the deformation force of the spring piece 2224 and press the pressure block 2223 toward the center, so that the pin block 224 can be reinserted into the third channel 2213 and against the thread block 2221, and then push the dynamic disk 221 to the position of the external thread 212, overcome the force of the spring 24, and make the dynamic disk 221 re-engage with the transmission rod 21.

[0054] In summary, the present invention can buffer through the spring 24, realize the "soft landing" contact process between the grinding disc 23 and the wafer, effectively avoid the instantaneous impact during the initial contact, and reduce the risk of wafer damage; the preload of the spring 24 is adjusted by the threaded pair, and the processing pressure required for different processes can be quickly switched when the feed amount of the driving rod 12 remains unchanged, without stopping for adjustment, thereby improving production efficiency; when the system has abnormal pressure, the dynamic disk 221 and the transmission rod 21 are automatically disengaged, the pressure transmission link is cut off, and the wafer will not be damaged by excessive pressure, providing reliable mechanical safety protection; the protection unit 2 does not rely on electrical control and sensors, has a simple and reliable structure, and has low maintenance costs. Through the dual protection of adjusting the spring preload and mechanical protection, while ensuring the processing quality, the technical problems of unstable pressure control, low process switching efficiency, and unreliable safety protection in the prior art are effectively solved.

[0055] It is important to note that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A semiconductor finishing equipment for the production of precision parts, characterized in that: include, A driving unit (1) comprises a mounting frame (11) and a driving rod (12) penetrating and fixed to a surface of the mounting frame (11); The protection unit (2) comprises a transmission rod (21) engaged with a side wall at the end of the driving rod (12), an adjustment component (22) sleeved on an outer wall of the transmission rod (21), a grinding disc (23) arranged at the bottom of the transmission rod (21), and a spring (24) arranged between the adjustment component (22) and the grinding disc (23).

2. The semiconductor finishing equipment for producing precision parts according to claim 1, characterized in that: The transmission rod (21) comprises a sleeve (211) arranged at an end thereof, an external thread (212) arranged on an outer wall of the transmission rod (21), and a plurality of limit blocks (213) arranged at the other end of the transmission rod (21).

3. The semiconductor finishing equipment for producing precision parts according to claim 2, characterized in that: The adjustment component (22) comprises a dynamic disk (221) sleeved on the outer wall of the transmission rod (21), an engagement member (222) penetrating the side wall of the dynamic disk (221), a trigger block (223) sleeved on the rod end of the engagement member (222), and a pin block (224) disposed on the upper end of the engagement member (222).

4. The semiconductor finishing equipment for producing precision parts according to claim 3, characterized in that: The dynamic disk (221) comprises a plurality of first channels (2211) opened on its side wall, a second channel (2212) arranged on one side of the first channel (2211), a third channel (2213) arranged at the upper end of the first channel (2211), and a first inclined surface (2214) arranged at the lower edge of the side wall of the dynamic disk (221).

5. The semiconductor finishing equipment for producing precision parts according to claim 4, characterized in that: The engaging member (222) comprises a threaded block (2221), a pressure rod (2222) fixed to the end of the threaded block (2221), a pressure block (2223) fixed to the end of the pressure rod (2222), and a spring sheet (2224) fixed to one side of the top of the pressure block (2223).

6. The semiconductor finishing equipment for producing precision parts according to claim 5, characterized in that: The trigger block (223) comprises an arc-shaped surface (2231) arranged at the lower edge of the end portion.

7. The semiconductor finishing equipment for producing precision parts according to claim 6, characterized in that: The pin block (224) comprises a second inclined surface (2241) arranged at the lower edge of its side wall.

8. The semiconductor finishing equipment for producing precision parts according to claim 7, characterized in that: The grinding disc (23) comprises a connecting sleeve (231) fixed to the top thereof, a plurality of limiting grooves (232) formed on the inner wall of the connecting sleeve (231), and a trigger sleeve (233) fixed to the outside of the connecting sleeve (231).

9. The semiconductor finishing equipment for producing precision parts according to claim 8, characterized in that: The mounting frame (11) comprises a pair of panels (111) and a plurality of support rods (112) fixed between the pair of panels (111).

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