Patternable automatic coating and film scraping device for preparing polishing pad

By designing an automatic coating scraping device including a stirring device, a feeding device, a magnetic suction wheel device, a roller scraper device and a waste collection device, the problem of uneven coating and difficult patterning of the abrasive layer of the polishing pad is solved, and efficient and uniform abrasive coating and patterning design is achieved.

CN119609961AActive Publication Date: 2025-03-14HUAQIAO UNIVERSITY
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Patent Information

Application Number
CN202510153341.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-12
Publication Date
2025-03-14
Estimated Expiration
2045-02-12

AI Technical Summary

Technical Problem

During the production of existing polishing pads, the coating of the abrasive layer is uneven, making it difficult to achieve patterned design, and the manual film scraping efficiency is low.

Method used

A patternable automatic coating scraping device is designed, including a stirring device, a feeding device, a magnetic suction wheel device, a roller scraper device and a waste collection device. Through the patterning design of automatic feeding and roller scraper, uniform coating and patterning effect of abrasives is achieved.

Benefits of technology

The efficiency and uniformity of abrasive coating are improved, the patterned design of the polishing pad is realized, and the efficiency and quality of the polishing pad production are improved.

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Abstract

The invention provides a patterning automatic coating and film scraping device for preparing a polishing pad, and relates to the technical field of polishing pad equipment. Comprising a stirring device, a feeding device, a supporting device, a magnetic suction rotating disc device, a rolling shaft scraper device and a waste collecting device. According to the polishing pad abrasive coating device capable of carrying out patterning design, while quantitative and constant-speed dropwise adding of abrasive coating is guaranteed, patterning, uniformity and smoothness of an abrasive layer can be guaranteed, and therefore the manufacturing efficiency of a polishing pad is improved, the manufacturing types are enriched, and the application field of the polishing pad is expanded.
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Description

Technical Field

[0001] The invention relates to the technical field of polishing pad production equipment, and in particular to a patternable automatic coating scraper device for preparing a polishing pad. Background Art

[0002] Polishing is a traditional precision machining technology that aims to achieve extremely high flatness, finish and shape accuracy of the workpiece surface. It is usually used in fields with extremely high surface requirements such as optical components, semiconductor devices, and precision mechanical parts. The bonded abrasive polishing pad is the core of polishing technology. This type of polishing pad firmly combines the abrasive on the polishing pad substrate. The movement trajectory of the abrasive is semi-deterministic. Only the more protruding abrasive on the polishing pad can contact the workpiece, thereby achieving accurate material removal and improving polishing efficiency.

[0003] As an important tool for polishing, the quality of the fixed abrasive polishing pad directly affects the polishing effect. It plays a key role in the polishing of various materials such as metals, semiconductors, and ceramics. Fixed abrasive polishing pads are mainly composed of three parts: an abrasive layer, a rigid layer, and an elastic layer. The addition of the rigid layer is conducive to improving the ability to maintain the surface shape of the polishing pad, while the elastic layer and the abrasive layer are related to the uniformity of the surface quality of the polished workpiece. Appropriate elasticity can effectively avoid scratches on the workpiece surface. In the process of making the polishing pad, the abrasive and the binder are made into a slurry and then coated on the surface of the substrate. The different pattern designs on the surface of the polishing pad and the coating effect directly affect the subsequent polishing quality.

[0004] Conventional abrasive layer production is generally done by adding abrasives to the surface of the substrate, and then manually scraping the slurry to flatten it and apply it. The slurry dripping on the substrate is mostly done manually, and the amount added is greatly affected by human factors. The scraper used in the slurry coating process is a metal plate or a resin plate. For some uneven substrates, there are problems such as the scraping process is not smooth, or the thickness of the abrasive layer on the surface after scraping is uneven. In addition, the surface of the polishing pad after scraping is flat and cannot be patterned. The entire coating and scraping process is time-consuming and labor-intensive, and the efficiency is low. Summary of the invention

[0005] The invention discloses a patternable automatic coating scraper device for preparing a polishing pad, which has a simple structure and is easy to operate, and is intended to solve the above-mentioned problems.

[0006] The present invention adopts the following scheme: A patternable automatic coating scraping device for preparing a polishing pad comprises: a stirring device, a feeding device, a magnetic turntable device, a roller scraper device, and a waste collecting device; wherein the magnetic turntable device is suitable for placing a polishing pad base and driving the polishing pad base to rotate; the feeding device is arranged above the magnetic turntable device, and is suitable for continuously conveying abrasive to the polishing pad base; the stirring device is arranged in the feeding device, and is suitable for stirring the abrasive particles in the feeding device; the roller scraper device is arranged above the magnetic turntable device, and comprises a roller scraper with a pattern, and the roller scraper is suitable for rolling on the rotating polishing pad base so that the abrasive is evenly coated on the polishing pad base and forms a preset pattern; the waste collecting device is arranged on the peripheral side of the magnetic turntable device to collect excess material in the scraping process.

[0007] Furthermore, it also includes a supporting device, which is used to install the feeding device and the stirring device.

[0008] Furthermore, the roller scraper device includes a roller scraper, which is configured to be cylindrical, with both ends of the roller scraper respectively fixed to the outer edge of the magnetic turntable device, and a diameter of 5 mm to 30 mm.

[0009] Furthermore, the outer surface of the roller scraper is provided with a patterned concave-convex structure, and the pattern includes one or more of a straight line type, a folded line type, a grid type, a circle type, and a dot matrix type.

[0010] Furthermore, the polishing pad base is suitable for being connected to a stainless steel plate, and an intermediate layer is provided between the stainless steel plate and the polishing pad base.

[0011] Furthermore, the middle layer is made of fiber material, non-woven fabric or polyurethane.

[0012] Furthermore, the abrasive is diamond slurry, or aluminum oxide slurry, or silicon carbide slurry, or cerium oxide slurry, the liquid part of the slurry is a viscous resin, or flour, or starch, or chitosan, or sodium alginate liquid, and the concentration of the abrasive is adjustable, which is 0.01wt%~90wt%.

[0013] Furthermore, the height of the roller scraper from the magnetic turntable is suitable for being adjusted between 2 mm and 20 mm.

[0014] Furthermore, a peristaltic pump is provided at the feeding port of the feeding device, and the peristaltic pump is suitable for controlling the opening and flow rate of the feeding port.

[0015] Furthermore, the magnetic turntable device includes a turntable and a magnetic suction cup arranged on the turntable, a heating device is arranged on the lower surface of the magnetic suction cup, and a cooling circulation system is arranged at the bottom of the heating device.

[0016] Beneficial effects: This solution places the polishing disc base on the magnetic turntable device in a magnetic way, and the fixing method is simple and easy to disassemble; the length of the roller scraper is adjustable, and the length of the roller can be adjusted according to the size of the polishing pad; the liquid containing the abrasive is added to the feeding device, and the stirring device is used to continuously stir, and the slurry is added to the polishing pad base through the feeding device. After the abrasive drips onto the polishing pad base, the turntable on the magnetic turntable device will pass through the roller scraper during the rotation process, and after being flattened and squeezed by the roller scraper, a polishing disc with a uniform surface thickness is finally obtained. After the polishing point base is evenly spread, the feeding device is turned off, and the excess slurry during the scraping process is collected by the waste collection device of the turntable. The automatic feeding device is used, and the automatic stirring feeding device can ensure the uniformity of the abrasive and the quantitative nature of the dripping abrasive. The coating efficiency and uniformity of the abrasive can be improved by spin coating and scraping the film at the same time. At the same time, the scraper used is a metal roller scraper with a concave-convex pattern on the surface. It has a certain weight itself. During the coating and scraping process, its own weight can ensure that the slurry is well infiltrated into the substrate, maintaining the flatness of the polishing pad and the uniformity of the abrasive. At the same time, pattern design can be performed when the roller scraper is scraping the film, which plays a key role in improving the production efficiency and pattern design of the polishing pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of a patternable automatic coating scraper device for preparing a polishing pad according to an embodiment of the present invention; Figure 2 It is a structural schematic diagram of a magnetic turntable device and a waste material collection device of a patternable automatic coating scraper device for preparing a polishing pad according to an embodiment of the present invention; Figure 3 1 is a schematic structural diagram of a roller scraper device of a patternable automatic coating scraper device for preparing a polishing pad according to an embodiment of the present invention; Figure 4 It is a schematic diagram of the exploded structure of a feeding device and a stirring device of a roller scraper device of a patternable automatic coating scraper device for preparing a polishing pad according to an embodiment of the present invention; Figure 5 It is a structural schematic diagram of a magnetic turntable device of a patternable automatic coating scraper device for preparing a polishing pad according to an embodiment of the present invention; Figure numerals: stirring device 1, supporting device 2, feeding device 3, peristaltic pump 4, magnetic turntable device 5, heating device 51, cooling circulation system 52, magnetic suction cup 53, turntable 54, roller scraper device 6, roller scraper 61, mounting frame 62, connecting rod 63, waste collecting device 7. DETAILED DESCRIPTION

[0018] Example 1 Combination Figures 1 to 5 As shown, this embodiment provides a patternable automatic coating scraping device for preparing a polishing pad, comprising: a stirring device 1, a feeding device 3, a magnetic turntable device 5, a roller scraper device 6, and a waste collection device 7; wherein the magnetic turntable device 5 is suitable for placing a polishing pad base and driving the polishing pad base to rotate; the feeding device 3 is arranged above the magnetic turntable device 5, and is suitable for continuously conveying abrasive to the polishing pad base; the stirring device 1 is arranged in the feeding device 3, and is suitable for stirring the abrasive particles in the feeding device 3; the roller scraper device 6 is arranged above the magnetic turntable device 5, and comprises a roller scraper 61 with a pattern (not shown), and the roller scraper 61 is suitable for rolling on the rotating polishing pad base so that the abrasive is evenly coated on the polishing pad base and forms a preset pattern; the waste collection device 7 is arranged on the peripheral side of the magnetic turntable device 5 to collect excess material during the scraping process.

[0019] Combination Figure 1 to Figure 2 As shown, in this embodiment, the magnetic turntable device 5 includes a driving motor, a turntable and a magnetic device arranged on the turntable, the driving motor is suitable for driving the turntable to rotate, and the magnetic device is arranged on the turntable to absorb the polishing pad substrate with a stainless steel plate. The turntable is connected to the spindle base, and the rotation speed of the turntable can be adjusted, the speed is 10r / min~100r / min, and the diameter of the turntable is ≤300mm.

[0020] Combination Figures 1 to 3As shown, the roller scraper device 6 includes a roller scraper 61 and a mounting frame 62. The mounting frame 62 is arranged on both sides of the turntable. The mounting frame has a scale display to facilitate the adjustment of the height of the roller scraper, and a connecting rod is provided for connecting the roller scraper 61. The roller scraper 61 can be replaced on the connecting rod 63. In this embodiment, the roller scraper is set to be cylindrical, and the material can be copper or aluminum and other metals, and the roller diameter is 5mm to 30mm; the two ends of the roller scraper are respectively fixed to the outer edge of the magnetic turntable device 5, and the diameter is 5mm to 30mm. The height of the roller scraper from the magnetic turntable is suitable for adjustment between 2mm and 20mm, so as to adjust the pressure on the polishing pad base as needed. The outer surface of the roller scraper is provided with a patterned concave-convex structure, and the pattern includes one or more of a straight line type, a folded line type, a grid type, a circle type, and a dot matrix. When the turntable rotates, the roller scraper scrapes the abrasive on the polishing pad base. The coating efficiency and uniformity of the abrasive can be improved by spin coating and scraping the film. At the same time, the roller scraper itself has a certain weight. During the coating and scraping process, its own weight can ensure that the slurry is well infiltrated into the polishing pad base, maintaining the flatness of the polishing pad and the uniformity of the abrasive. Patterned design can be performed when the roller scraper is scraping the film, which can improve the production efficiency of the polishing pad and facilitate the preparation of the required pattern on the surface of the polishing pad.

[0021] The polishing pad base is suitable for being connected to a stainless steel plate, and an intermediate layer is provided between the stainless steel plate and the polishing pad base. Specifically, the polishing pad base can be protected by providing an intermediate layer, and at the same time, during the scraping process, the intermediate layer is connected to the stainless steel plate, which can effectively reduce the damage to the polishing pad base during the scraping process. The intermediate layer is various fiber materials (such as fiber cloth) or non-woven fabric or polyurethane, or other soft materials. By connecting the polishing pad base to the stainless steel plate, the polishing pad base can be conveniently fixed on the magnetic turntable device 5 and can be easily disassembled.

[0022] In this embodiment, a supporting device 2 is also included, and the supporting device 2 is used to install the feeding device 3 and the stirring device 1.

[0023] Combination Figure 1 and Figure 4As shown, the feeding device 3 includes a conical feeding tank, which is arranged just above the center of the turntable, and a peristaltic pump 4 is arranged at the feeding port of the feeding tank, and the peristaltic pump 4 is suitable for controlling the opening of the feeding port and the feeding rate of the slurry. Since the slurry may have different viscosities and different speeds, a peristaltic pump is used as a control switch here, and the peristaltic pump can control the flow rate to achieve constant speed and quantity. In addition, the peristaltic pump comes with a micro-stepping motor and is compatible with silicone tubes or BPT tubes. The hose is the only consumable and is easy to maintain. The inner diameter of the hose is 2mm to 10mm, and the flow rate can be controlled between 1ml / min and 500ml / min. According to the uniformity of the required abrasive layer or the depth of the pattern, the flow rate can be adjusted to meet the needs of different patterns and abrasive thickness. The stirring device 1 is arranged in the feeding tank, which is suitable for continuously stirring the abrasive in the feeding tank to make the abrasive more uniform. The stirring device 1 can use an existing agitator, which will not be repeated here.

[0024] In one embodiment, the support device 2 is arranged on an XY axis motion mechanism (not shown), so that the feeding device 3 and the stirring device 1 can be driven to move above the plane of the polishing pad base. During preparation, a larger flow rate is first opened for feeding to quickly cover the polishing pad base with abrasive slurry, and then the film is scraped; then, according to the uniformity of the abrasive layer on the polishing pad base or the depth of the pattern, when the depth of a certain area is small, the feeding device can be controlled to move above the corresponding area, and the material is replenished at a smaller flow rate, and then the film is scraped again with a roller scraper, so that the pattern film layer of the entire polishing pad can be made more uniform and the waste of abrasive can be reduced. It should be noted that the uniformity of the abrasive layer of the polishing pad and the depth of the pattern can be judged by experience or by existing visual technology, which will not be repeated here.

[0025] Combination Figure 5As shown, in another embodiment, the magnetic suction turntable device includes a magnetic suction cup 53 and a turntable 54. The lower surface of the magnetic suction cup 53 is provided with a heating device 51, and the bottom of the heating device 51 is provided with a cooling circulation system 52; the magnetic suction cup 53 is arranged above the heating device 51, so that the heating device 51 can heat the magnetic suction cup, and the cooling circulation system 52 can quickly cool down the heating device 51 and the magnetic suction cup after stopping heating. The heating device 51 can be a heating sheet or a heating plate, which can provide heat to the polishing pad substrate and abrasive slurry during the rolling process, prevent the slurry from solidifying, and increase the speed of the abrasive slurry penetrating into the polishing pad substrate. It should be noted that the temperature provided by the heating device 51 here is adjustable to prevent damage to the polishing pad substrate; in addition, the heating device 51 can also accelerate the evaporation of the abrasive slurry when it is relatively thin; when working, the heating device 51 is first started to heat the polishing pad substrate and the abrasives, and the heating temperature is appropriate; then the roller scraper is used for rolling 1 to 3 turns are performed to form a preliminary pattern layer, and then the heating component is turned off and the cooling circulation system 52 is turned on to cool down the heating device 51 and the magnetic suction cup 53, and to cool down the polishing pad base and the abrasive grains, thereby reducing the fluidity of the abrasive slurry and causing the abrasive slurry to harden quickly on the polishing pad base. During this process, the rotation speed of the turntable 54 is reduced and the rolling is performed slowly to maintain the shape of the pattern layer. By setting up the heating device 51 and the cooling circulation system 52, they work in sequence to improve the processing efficiency of the polishing pad, and the temperature after molding is convenient for the user to take out the polishing pad.

[0026] In this embodiment, the abrasive is a slurry such as diamond slurry, aluminum oxide slurry, or silicon carbide slurry that can be used for polishing processing. The liquid part of the slurry is a viscous resin, flour, starch, chitosan, or sodium alginate liquid, and the concentration of the abrasive is adjustable, which is 0.01wt%~90wt%.

[0027] The waste collecting device 7 comprises a waste receiving tray, which is arranged below the rotating disk and has a diameter larger than that of the rotating disk, and is used to collect excess abrasives so as to collect the ejected abrasive particles.

[0028] During operation, the polishing pad base is magnetically attracted to the turntable, the height of the roller scraper is adjusted, the stirring device 1 is installed at the top of the supporting device 2, and the feeding device 3 is fixed above the supporting device 2. The slurry containing abrasive particles is added to the feeding device 3, and the stirring device 1 is used to continuously stir, and the slurry containing abrasive is added to the polishing pad base through the feeding device 3. After the abrasive drips onto the polishing pad base, the turntable will be spin-coated by centrifugal force during the rotation process and the slurry will be flattened by the roller scraper. The roller scraper itself has a certain weight and a concave-convex patterned texture on the surface. After the roller scraper is squeezed and scraped, a polishing pad with uniform surface slurry thickness and a certain pattern is finally obtained. During the scraping process, the excess slurry is collected by the waste collection device 7. The present invention can automatically and efficiently coat the abrasive layer on the polishing pad base, and the obtained polishing pad can be patterned and designed, which has good application prospects in the polishing fields of metals, ceramics, semiconductors, etc. This scheme can improve efficiency, control the amount of abrasive, and realize the unified batch production of polishing pads.

[0029] Example 2 W5 diamond abrasive is added to the resin to prepare a diamond abrasive slurry with a concentration of 3wt%; the slurry is added to the stirring device, the stirrer is turned on, the stirring speed is 50r / min, and the abrasive is controlled by the peristaltic pump control switch to drip from the discharge port with a diameter of 5mm to the polishing pad base at a speed of 5ml / s in a regular and quantitative manner; the polishing pad base with a diameter of 200mm is adsorbed on the magnetic chuck, the magnetic chuck rotates at a speed of 50r / min, and the roller scraper is located on the upper surface of the turntable. The material of the roller scraper is copper, the shape is a cylinder with a diameter of 10mm, and the length is 200mm. The surface of the cylinder is provided with straight stripes, and the roller scraper spans the upper surface of the polishing disk base, and the height from the upper surface of the polishing disk base is 3mm. After rotating for 5min, the abrasive is evenly coated on the polishing disk base, and a polishing pad with straight stripes distributed around the circumference is obtained. The polishing pad prepared in this embodiment can be used for polishing tools of various materials.

[0030] Example 3 W5 diamond abrasive is added to chitosan to prepare a diamond abrasive slurry with a concentration of 5wt%; the slurry is added to a stirring device, the stirrer is turned on, the stirring speed is 70r / min, and the slurry is controlled by a peristaltic pump to drip from a 6mm diameter outlet to the polishing pad base at a speed of 4ml / s in a regular and quantitative manner; the polishing pad base with a diameter of 100mm is adsorbed on a magnetic turntable device, the turntable rotates at a speed of 80r / min, and a roller scraper is located on the upper surface of the polishing disk. The material of the roller scraper is copper, the shape is a cylinder with a diameter of 8mm, the length is 100mm, and the surface of the cylinder is square stripes. The roller scraper spans the upper surface of the polishing disk base, and the height from the upper surface of the polishing disk base is 2mm. After rotating for 3min, the abrasive is evenly coated on the polishing disk base, and a polishing pad with a checkered pattern on the surface is obtained. The polishing pad prepared in this embodiment can be used for polishing tools of various materials.

[0031] It should be understood that the above are only preferred implementations of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention.

[0032] The above description of the drawings used in the implementation manner only illustrates certain embodiments of the present invention and should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

Claims

1. A patternable automatic coating scraper device for preparing a polishing pad, characterized in that: include: Stirring device, feeding device, magnetic turntable device, roller scraper device, waste collection device; wherein, The magnetic turntable device is suitable for placing the polishing pad base and driving the polishing pad base to rotate; The feeding device is arranged above the magnetic turntable device, and is suitable for continuously feeding abrasive to the polishing pad base; The stirring device is arranged in the feeding device, and is suitable for stirring the abrasive particles in the feeding device; The roller scraper device is arranged above the magnetic turntable device, and comprises a roller scraper with a pattern, and the roller scraper is suitable for rolling on the rotating polishing pad base so that the abrasive is evenly coated on the polishing pad base and forms a preset pattern; The waste material collecting device is arranged on the peripheral side of the magnetic turntable device to collect the excess abrasive material in the film scraping process.

2. The patternable automatic coating scraper device for preparing a polishing pad according to claim 1, characterized in that: It also includes a supporting device, which is used to install the feeding device and the stirring device.

3. The patternable automatic coating scraper device for preparing a polishing pad according to claim 1, characterized in that: The roller scraper device comprises a roller scraper, which is arranged in a cylindrical shape, and both ends of the roller scraper are respectively fixed on the outer edge of the magnetic turntable device, and the diameter is 5mm to 30mm.

4. The patternable automatic coating scraper device for preparing a polishing pad according to claim 3, characterized in that: The outer surface of the roller scraper is provided with a patterned concave-convex structure, and the pattern includes one or more of a straight line type, a folded line type, a grid type, a circle type, and a dot matrix type.

5. The patternable automatic coating scraper device for preparing a polishing pad according to claim 1, characterized in that: The polishing pad base is suitable for being connected to a stainless steel plate, and an intermediate layer is arranged between the stainless steel plate and the polishing pad base.

6. The patternable automatic coating scraper device for preparing a polishing pad according to claim 5, characterized in that: The middle layer is made of fiber material, non-woven fabric or polyurethane.

7. The patternable automatic coating scraper device for preparing a polishing pad according to claim 1, characterized in that: The abrasive is diamond slurry, or aluminum oxide slurry, or silicon carbide slurry, or cerium oxide slurry, the liquid part of the slurry is a viscous resin, or flour, or starch, or chitosan, or sodium alginate liquid, and the concentration of the abrasive is adjustable, which is 0.01wt%~90wt%.

8. The patternable automatic coating scraper device for preparing a polishing pad according to claim 1, characterized in that: The height of the roller scraper from the magnetic turntable is suitable for adjustment between 2mm and 20mm.

9. The patternable automatic coating scraper device for preparing a polishing pad according to claim 1, characterized in that: A peristaltic pump is arranged at the feeding port of the feeding device, and the peristaltic pump is suitable for controlling the opening and flow rate of the feeding port.

10. The patternable automatic coating scraper device for preparing a polishing pad according to claim 1, characterized in that: The magnetic turntable device comprises a turntable and a magnetic suction cup arranged on the turntable, a heating device is arranged on the lower surface of the magnetic suction cup, and a cooling circulation system is arranged at the bottom of the heating device.

Citation Information

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