Method for improving etching paste process efficiency

By performing heat etching on the substrate at 40-50°C, the problem of excessive etching time in the existing etching paste process is solved, and the etching time is significantly shortened and the production efficiency is improved.

CN119612969APending Publication Date: 2025-03-14TRULY OPTO ELECTRONICS
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202411501614.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-25
Publication Date
2025-03-14

AI Technical Summary

Technical Problem

When etching SIO2 and glass, the existing etching paste process is too long, resulting in low production efficiency and prone to appearance defects and poor functions.

Method used

After the etching paste is screen-printed on the product, the substrate is heated at 40-50°C to shorten the etching time and improve the etching efficiency.

Benefits of technology

The etching time is shortened from 500 seconds to 200 seconds, which significantly improves production efficiency and beats, and avoids appearance defects and poor functions.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119612969A_ABST
    Figure CN119612969A_ABST
Patent Text Reader

Abstract

A method for improving etching paste process efficiency specifically comprises the following steps: S1, preparation work in advance: cutting and forming a glass substrate to ensure that the size is accurate, the edge is not scorched or yellowed, the cutting depth of ITO glass is proper, and no flash or burr exists; s2, coating etching paste: uniformly coating the strippable etching paste on a screen printing plate at a certain angle (such as 75 degrees) through a scraper; s3, carrying out screen printing on the etching paste: carrying out screen printing on the etching paste on the glass by adopting a screen printing method; s4, heating the substrate: heating the substrate with 40-50 DEG C and carrying out screen printing on etching paste; S5, detecting, adjusting and cleaning; and S6, quality detection. According to the method for improving the efficiency of the etching paste process, after the etching paste is printed on a product in a silk-screen mode, the substrate is heated at the temperature of 40-50 DEG C to be etched, so that the etching efficiency is improved, the substrate can be completely etched within 200 seconds, and the production efficiency and the takt are greatly improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to the technical field of etching paste technology, and in particular to a method for improving the efficiency of etching paste technology. Background Art

[0002] The etching paste process is used in the touch screen and component manufacturing process to etch SIO2 and glass for etching patterns. It is necessary to ensure that the etched object can be etched cleanly to avoid appearance defects and poor functions caused by unclean etching. Usually, the etching paste is screen-printed on the etched surface using a screen printing mesh. Usually, the etching time is more than 500 seconds. Long-term etching has a great impact on production efficiency. Therefore, in order to improve its efficiency, after the etching paste is screen-printed on the product, the substrate is heated at 40℃-50℃ for etching, thereby improving the etching efficiency. The etching time can be etched cleanly within 200 seconds, greatly improving production efficiency and beat. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a method for improving the process efficiency of etching paste.

[0004] The objective of the present invention is achieved through the following technical solutions:

[0005] A method for improving the process efficiency of etching paste, specifically comprising the following steps: S1, advance preparation: cutting and shaping a glass substrate to ensure accurate size, no scorching or yellowing at the edge, appropriate cutting depth of ITO glass, and no sharp edges or burrs; S2, coating etching paste: using a strippable etching paste on a screen, and evenly coating the glass substrate at a certain angle (such as 75 degrees) by a scraper; S3, screen printing etching paste: screen printing the etching paste on the glass by a screen printing method; S4, heating the substrate: heating the substrate with 40-50°C to print the etching paste; S5, testing, adjusting and cleaning; S6, quality testing.

[0006] In one embodiment, before step S1, it is necessary to ensure that the square resistance of the raw material is within the required range to meet the etching requirements.

[0007] In one of the embodiments, in step S2, after the strippable etching paste is applied to the glass substrate, it needs to be dried, and the etching paste is allowed to dry naturally after being applied to fix the position of the etching paste on the glass substrate.

[0008] In one of the embodiments, during the step S3, the glass substrate coated with etching paste is placed in an acid tank for etching through a silk screen screen, and etching parameters such as temperature and speed need to be adjusted according to the concentration of the acid solution and the strength of the adhesion of the conductive layer of the material to ensure complete etching without short circuit.

[0009] In one of the embodiments, in step S4, when heating the substrate, it is necessary to heat the substrate while etching, and a special heating device is required to heat the substrate, and the temperature is stabilized between 40°C and 50°C.

[0010] In one of the embodiments, after step S4, when etching is completed, double-sided tape is needed to stick the pattern off the glass substrate to complete the stripping process of the etching paste.

[0011] In one embodiment, in step S5, the etched product is cleaned to remove residual etching paste and impurities, and a final inspection is performed to ensure product quality.

[0012] In one embodiment, in step S6, the first piece inspection is performed on the etched product to ensure that the etching effect meets the requirements.

[0013] In one embodiment, in steps S2, S3, and S4, the staff is required to pay attention to the temperature and working environment at all times.

[0014] In one embodiment, in step S2, the etching paste needs to be applied using an electronic coating device, and in step S4, the silk screen printing also needs to be etched using an automatic etching device to ensure its accuracy.

[0015] Compared with the prior art, the present invention has at least the following advantages:

[0016] The method for improving the process efficiency of etching paste of the present invention improves the etching efficiency by heating the substrate at 40-50° C. for etching after the etching paste is screen-printed on the product, so that the etching time can be completely etched within 200 seconds, thereby greatly improving the production efficiency and the beat. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 The present invention is a process flow diagram of a method for improving the process efficiency of etching paste. DETAILED DESCRIPTION

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0020] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0021] Unless otherwise clearly stipulated and limited, terms such as "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0023] like Figure 1 As shown, a method for improving the process efficiency of etching paste comprises the following steps:

[0024] S1. Advance preparation: Cut and shape the glass substrate to ensure accurate size, no burnt or yellowed edges, appropriate cutting depth of ITO glass, and no sharp edges or burrs; Before step S1, it is necessary to ensure that the square resistance of the raw material is within the required range to meet the etching requirements.

[0025] S2, coating etching paste: Use a strippable etching paste on the screen and evenly coat it on the glass substrate at a certain angle (such as 75 degrees) using a scraper; in step S2, after the strippable etching paste is applied to the glass substrate, it needs to be dried, and the etching paste is allowed to dry naturally after coating to fix the position of the etching paste on the glass substrate.

[0026] S3, screen printing etching paste: screen printing etching paste on glass; in step S3, the glass substrate coated with etching paste is placed in an acid tank for etching through a screen printing mesh, and etching parameters such as temperature and speed need to be adjusted according to the acid concentration and the strength of the conductive layer adhesion of the material to ensure complete etching without short circuit.

[0027] S4, heating the substrate: use 40-50℃ to heat the substrate. Silk screen etching paste: In step S4, the substrate needs to be heated while etching. A special heating device is needed to heat the substrate and stabilize the temperature between 40℃ and 50℃. After step S4, after etching is completed, double-sided tape is needed to stick the pattern off the glass substrate to complete the stripping process of the etching paste.

[0028] S5, detection, adjustment and cleaning: In step S5, the etched product is cleaned to remove residual etching paste and impurities, and a final inspection is performed to ensure product quality.

[0029] S6, quality inspection. In step S6, the first piece inspection is performed on the etched product to ensure that the etching effect meets the requirements.

[0030] like Figure 1 As shown, in one embodiment, in steps S2, S3, and S4, the staff is required to pay attention to the temperature and working environment at all times.

[0031] like Figure 1 As shown, in one embodiment, in step S2, an electronic coating device is required to apply the etching paste, and in step S4, an automatic etching device is also required to perform etching during silk screen printing to ensure its accuracy.

[0032] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for improving the process efficiency of etching paste, characterized in that: The specific steps include: S1. Advance preparation: Cut and shape the glass substrate to ensure accurate size, no burnt or yellowed edges, appropriate cutting depth of ITO glass, and no sharp edges or burrs; S2. Apply etching paste: Use a strippable etching paste on the screen and evenly apply it on the glass substrate at a certain angle (such as 75 degrees) using a scraper; S3, Silk screen etching paste: Silk screen etching paste is printed on the glass by silk screen printing; S4. Heating the substrate: Use 40-50℃ heating screen printing etching paste on the substrate: S5, detection, adjustment and cleaning; S6. Quality inspection.

2. A method for improving the process efficiency of etching paste according to claim 1, characterized in that: Before step S1, it is necessary to ensure that the square resistance of the raw material is within the required range to meet the etching requirements.

3. A method for improving the process efficiency of etching paste according to claim 1, characterized in that: In step S2, after the strippable etching paste is applied to the glass substrate, it needs to be dried. After the etching paste is applied, it is allowed to dry naturally to fix the position of the etching paste on the glass substrate.

4. A method for improving the process efficiency of etching paste according to claim 1, characterized in that: In the step S3, the glass substrate coated with etching paste is placed in an acid tank for etching through a silk screen screen. Etching parameters such as temperature and speed need to be adjusted according to the acid concentration and the adhesion of the conductive layer of the material to ensure complete etching without short circuit.

5. A method for improving the process efficiency of etching paste according to claim 1, characterized in that: In step S4, when heating the substrate, it is necessary to heat the substrate while etching. A special heating device is required to heat the substrate and stabilize the temperature between 40°C and 50°C.

6. A method for improving the process efficiency of etching paste according to claim 1, characterized in that: After step S4, when etching is completed, double-sided tape is needed to stick the pattern off the glass substrate to complete the stripping process of the etching paste.

7. A method for improving the process efficiency of etching paste according to claim 1, characterized in that: In step S5, the etched product is cleaned to remove residual etching paste and impurities, and a final inspection is performed to ensure product quality.

8. A method for improving the process efficiency of etching paste according to claim 1, characterized in that: In step S6, the first piece inspection is performed on the etched product to ensure that the etching effect meets the requirements.

9. A method for improving the process efficiency of etching paste according to claim 1, characterized in that: In steps S2, S3, and S4, the staff is required to pay attention to the temperature and working environment at all times.

10. A method for improving the process efficiency of etching paste according to claim 1, characterized in that: In step S2, the etching paste needs to be applied using an electronic coating device, and in step S4, the silk screen printing also needs to be etched using an automatic etching device to ensure its accuracy.