Quick estimation method and system for depth of air gap defect of basin-type insulator

Abstract

The invention discloses a method and a system for quickly estimating the depth of an air gap defect of a basin-type insulator. The method comprises the following steps: acquiring a surface maximum temperature difference occurrence time vector of a target basin-type insulator with an air gap defect under first thermal excitation; all components in the surface maximum temperature difference occurrence time vector are subjected to fitting operation according to a first mathematical model, and a first fitting model is constructed; and quickly estimating the depth of the air gap defect of the basin-type insulator according to the first fitting model. Through the accurate mathematical model and the rapid calculation process, the detection efficiency and accuracy are remarkably improved. Compared with a traditional detection method, the detection time is shortened, the requirement for the skill level of an operator is lowered, and the detection process is more standardized and automated. In addition, the system is flexible in design, can be easily integrated into an existing GIS equipment detection process, and provides powerful technical support for safe operation of a power system.

Description

Technical Field

[0001] The invention relates to the technical field of rapid estimation of air gap defect depth of a pot-type insulator, and in particular to a method and system for rapid estimation of air gap defect depth of a pot-type insulator. Background Art

[0002] The pot insulator is one of the key components in the gas insulated switch (GIS). During the production, transportation, assembly and operation, defects such as air gaps near the surface will inevitably appear, which will seriously affect the reliability of the pot insulator. Existing non-destructive testing technologies, such as ultrasound and X-ray, have shortcomings such as poor anti-interference ability, complex equipment and high testing costs. In production and operation, when an accident occurs, it is difficult for traditional methods to clarify the cause of the accident, and there is a lack of effective prevention measures. In addition, during the production process, the withstand voltage and partial discharge methods can only make qualitative judgments on the electrical characteristics of the pot insulator, and it is impossible to establish the intrinsic relationship between its internal defects and electrical performance, which may cause defective insulating components to be put into operation, thereby seriously affecting the safety and stability of electrical equipment. The present invention aims to use a new type of infrared wave, which has good penetration ability for non-polar, non-metallic and dry materials, to study a pot insulator defect detection method based on infrared imaging technology, so as to achieve rapid detection of internal defects of GIS pot insulators, thereby improving and optimizing the production and operation conditions of pot insulators. Summary of the invention

[0003] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0004] In view of the above existing problems, the present invention is proposed.

[0005] Therefore, the present invention provides a method and system for quickly estimating the depth of air gap defects in pot-type insulators, which can solve the problems mentioned in the background technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] In a first aspect, the present invention provides a method for quickly estimating the depth of an air gap defect of a pot-type insulator, comprising:

[0008] Obtaining the appearance time vector of the maximum surface temperature difference of the target pot-type insulator with air gap defects under the first thermal excitation;

[0009] Performing a fitting operation on each component in the surface maximum temperature difference occurrence time vector according to the first mathematical model to construct a first fitting model;

[0010] The air gap defect depth of the pot-type insulator is quickly estimated according to the first fitting model.

[0011] As a preferred solution of the method for quickly estimating the depth of an air gap defect of a pot-type insulator according to the present invention, the method of obtaining the time vector of the maximum surface temperature difference of the target pot-type insulator containing an air gap defect under the first thermal excitation comprises:

[0012] The target pot-type insulator containing air gap defects is selected from a first preset defect planning table;

[0013] The first preset defect planning table includes defect sizes and defect depths occurring during the actual production process, and the defect depths and defect sizes are arranged in rows and columns of the defect planning table according to a first arrangement order.

[0014] As a preferred solution of the method for quickly estimating the depth of an air gap defect of a pot-type insulator according to the present invention, the method of obtaining the surface maximum temperature difference occurrence time vector of the target pot-type insulator containing an air gap defect under the first thermal excitation further includes:

[0015] Performing a first thermal excitation on the target pot-type insulator containing an air gap defect;

[0016] Acquiring surface temperature data of the region containing air gap defects under the first thermal excitation;

[0017] The temperature difference vector of the air gap defect surface is calculated according to the surface temperature data of the air gap defect region under the first thermal excitation, and the maximum temperature difference value is searched from the temperature difference vectors of the air gap defect surface.

[0018] As a preferred solution of the method for quickly estimating the depth of air gap defects of pot-type insulators according to the present invention, wherein: the components in the surface maximum temperature difference occurrence time vector are fitted according to the first mathematical model to construct the first fitting model, including:

[0019] The first fitting model is a fitting mathematical relationship between the time vector of the maximum surface temperature difference under different defect diameters and the defect depth.

[0020] As a preferred solution of the method for quickly estimating the depth of air gap defects of pot-type insulators according to the present invention, wherein: the components in the surface maximum temperature difference occurrence time vector are fitted according to the first mathematical model, and the construction of the first fitting model also includes:

[0021] The first fitting model is converted from the relationship model between the time vector of the maximum surface temperature difference and the defect depth to the relationship model between the defect depth and the time vector of the maximum surface temperature difference.

[0022] As a preferred solution of the method for rapidly estimating the air gap defect depth of a pot-type insulator according to the present invention, wherein: the rapidly estimating the air gap defect depth of a pot-type insulator according to the first fitting model comprises:

[0023] Obtain the actual defect diameter of the pot-type insulator to be tested and the actual maximum surface temperature difference occurrence time vector;

[0024] According to the actual defect diameter and the actual surface maximum temperature difference occurrence time vector, combined with the first fitting model, the air gap defect depth of the pot-type insulator is quickly estimated.

[0025] As a preferred solution of the method for quickly estimating the depth of air gap defects of pot-type insulators described in the present invention, it also includes:

[0026] When there is a new pot-type insulator to be tested, the testing process is directly entered to calculate the actual defect diameter of the pot-type insulator to be tested and the actual surface maximum temperature difference occurrence time vector, and the first fitting model is combined to quickly calculate the near-surface pore defect depth of the pot-type insulator.

[0027] In a second aspect, the present invention provides a system for quickly estimating the depth of a pot-type insulator air gap defect, comprising:

[0028] A parameter acquisition module, used for acquiring a surface maximum temperature difference occurrence time vector of a target pot-type insulator with an air gap defect under a first thermal excitation;

[0029] A model building module, used for fitting each component in the surface maximum temperature difference occurrence time vector according to the first mathematical model to construct a first fitting model;

[0030] A calculation module is used to quickly estimate the air gap defect depth of the pot-type insulator according to the first fitting model.

[0031] In a third aspect, the present invention provides a computer device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above-mentioned method when executing the computer program.

[0032] In a fourth aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program implements the steps of the method described above when executed by a processor.

[0033] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention proposes a method and system for quickly estimating the depth of air gap defects in pot-type insulators, obtaining the time vector of the maximum surface temperature difference of the target pot-type insulator containing air gap defects under the first thermal excitation; fitting each component in the time vector of the maximum surface temperature difference according to the first mathematical model to construct a first fitting model; and quickly estimating the depth of air gap defects in pot-type insulators according to the first fitting model. The present application significantly improves the detection efficiency and accuracy through precise mathematical models and fast calculation processes. Compared with traditional detection methods, the present application not only reduces the time required for detection, but also reduces the requirements for the skill level of operators, making the detection process more standardized and automated. In addition, the system design of the present application is flexible and can be easily integrated into the existing GIS equipment detection process, providing strong technical support for the safe operation of the power system. Through the implementation of the present application, power system failures caused by insulator defects can be effectively prevented, thereby ensuring the stability and reliability of the power grid. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0035] Figure 1 A method flow chart of a method and system for quickly estimating the depth of an air gap defect of a pot-type insulator provided by an embodiment of the present invention;

[0036] Figure 2 A detailed flowchart of a method and system for quickly estimating the depth of a pot-type insulator air gap defect provided by an embodiment of the present invention;

[0037] Figure 3 A schematic diagram of a maximum temperature difference-defect depth fitting image of a method and system for quickly estimating the air gap defect depth of a pot-type insulator provided by an embodiment of the present invention;

[0038] Figure 4 An internal structural diagram of a computer device of a method and system for quickly estimating the depth of an air gap defect of a pot-type insulator provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0039] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the drawings of the specification. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary persons in the art without creative work should fall within the scope of protection of the present invention.

[0040] Example 1

[0041] Reference Figure 1-Figure 4 , which is the first embodiment of the present invention, provides a method and system for quickly estimating the depth of a pot-type insulator air gap defect, including:

[0042] In the related art, there are a variety of methods for detecting insulator defects, but these methods often require complex equipment and professional technicians, and the detection process is time-consuming.

[0043] The present application provides a method that can effectively solve the above-mentioned problems. Next, a method and system for quickly estimating the depth of the air gap defect of the basin-type insulator will be described in detail in combination with multiple embodiments.

[0044] Figure 1 A method flow chart of a method and system for quickly estimating the depth of an air gap defect of a basin-type insulator is shown, comprising:

[0045] S101, obtaining a surface maximum temperature difference occurrence time vector of a target pot-type insulator with an air gap defect under a first thermal excitation;

[0046] In the embodiment of the present application, obtaining the surface maximum temperature difference occurrence time vector of the target pot-type insulator containing an air gap defect under the first thermal excitation includes:

[0047] The target pot-type insulator containing air gap defects is selected from a first preset defect planning table;

[0048] The first preset defect planning table includes defect sizes and defect depths occurring in an actual production process, and arranges the defect depths and defect sizes in rows and columns of the defect planning table according to a first arrangement order.

[0049] In the embodiment of the present application, obtaining the surface maximum temperature difference occurrence time vector of the target pot-type insulator containing an air gap defect under the first thermal excitation further includes:

[0050] Performing a first thermal excitation on a target pot-type insulator containing an air gap defect;

[0051] Acquiring surface temperature data of the region containing air gap defects under the first thermal excitation;

[0052] The temperature difference vector of the air gap defect surface is calculated according to the surface temperature data of the air gap defect region under the first thermal excitation, and the maximum temperature difference value is searched from the temperature difference vectors of the air gap defect surface.

[0053] In an optional embodiment, the first arrangement order can be arranged according to a uniform gradient, or arranged according to a uniform gradient in reverse order, or arranged according to a right triangle, etc., so that it can flexibly adapt to different detection requirements. In this way, it can be ensured that during the detection process, the defect area can be accurately located and the time point when the maximum temperature difference occurs can be quickly obtained.

[0054] In the embodiment of the present application, when the uniform gradient arrangement is selected, a defect planning table is designed according to the defect size and defect depth that may occur in the actual production process, and the defect depth and defect size are arranged in the rows and columns of the defect planning table according to a uniform gradient. One defect depth and one defect size constitute a complete defect containing two defect parameters;

[0055] Table 1: Example of defect planning table

[0056]

[0057] It should be noted that according to the defect planning table, the placement of the air gap defects in the pot-type insulator specimens is reasonably planned to ensure that there is a sufficiently large normal area around each air gap defect to avoid the mutual influence of the thermal conductivity between the defects. After that, the pot-type insulator specimens containing air gap defects are made and marked to distinguish the air gap defects with different parameters;

[0058] In an optional embodiment, the first thermal excitation may be thermal pulse heating, or thermal excitation may be performed in other ways, such as by an electric heater, an infrared heater, or other rapid heating equipment. During implementation, parameters such as the duration, intensity, and frequency of the thermal pulse need to be precisely controlled according to the thermal properties of the insulator material and the properties of the air gap defect to ensure the heating effect and measurement accuracy.

[0059] In the embodiment of the present application, when thermal pulse heating is selected to perform thermal pulse heating on the surface of the pot-type insulator, thermal pulse heating Q is performed on the surface of the pot-type insulator, and an infrared thermal imaging device is used to record the change of the surface temperature in the cooling stage at a high frame rate f, and the surface temperature data of the area containing the air gap defect is marked in particular;

[0060] Furthermore, the temperature data of the air gap defect surface and the normal area surface are extracted to calculate the temperature difference vector of the air gap defect surface

[0061]

[0062] in, is the temperature difference vector on the air gap defect surface, is the temperature vector of the defect area, is the temperature vector of the defect-free area, ΔT 1 ,ΔT 2 ,…,ΔT N Temperature difference vector of the sink surface N is the total number of times data is collected in the experiment, T d1 ,T d2 ,...,T dN With T s1 ,T s2 ,…,T sN They are and The N components of

[0063] Furthermore, the maximum temperature difference value ΔT is searched from the temperature difference vector of the air gap defect surface. max , and record the maximum temperature difference value ΔT max The time t at which the defect appears is taken as the maximum temperature difference occurrence time of the defect. The maximum temperature difference defect time of each air gap defect surface will be calculated Fill in the corresponding defects in the defect planning table to form the time matrix of the maximum temperature difference on the surface of the air gap defect [t max ] m×n ;

[0064] Furthermore, the maximum temperature difference occurs at time t max From the expression of max It is proportional to the square of the defect depth. The other parameters in the expression are fixed constants determined by the material properties and do not change with the thermal excitation parameters and defect parameters. Therefore, under the condition of fixed depth, the size of the defect has no effect on the time when the maximum temperature difference occurs. Each depth corresponds to a maximum temperature difference. Depth sequence z in the pot insulator sample 1 ,z 2 ,…,z n The corresponding defects will correspond to a unique maximum temperature difference value The time t when the maximum temperature difference occurs n The maximum temperature difference occurs at time t max , we can construct the maximum temperature difference occurrence time matrix [t max ] m×n :

[0065]

[0066] From the above formula, it can be deduced that the maximum temperature difference occurs at time t maxIt is only affected by the defect depth z, and does not change with the defect diameter d. Therefore, in fact, for any group of defects with the same depth and different diameters d 1 z x ,d 2 z x ,…,d n z x For example, the time when the maximum temperature difference occurs is unique, that is:

[0067]

[0068] So the maximum temperature difference time matrix [t max ] m×n Dimension reduction becomes the maximum temperature difference time vector

[0069]

[0070] in, is the maximum temperature difference occurrence time vector, which contains the same number of components m as the number of defect depth z groups set; is the time vector of the maximum temperature difference The m components of is the corresponding defect d n z m The time when the maximum temperature difference occurs;

[0071] It should be noted that step S101 can improve the computational efficiency by simplifying the data processing flow. In practical applications, by reducing the dimension of matrix operations, the consumption of computing resources can be significantly reduced, thereby speeding up the estimation of defect depth. In addition, since the maximum temperature difference occurrence time is only related to the defect depth, the influence of the defect diameter can be ignored when estimating the defect depth, simplifying the complexity of the model. Finally, by constructing the maximum temperature difference occurrence time vector, the air gap defect depth in the pot insulator can be quickly classified and identified, providing strong data support for the maintenance and replacement of insulators.

[0072] S102, performing a fitting operation on each component in the surface maximum temperature difference occurrence time vector according to a first mathematical model to construct a first fitting model;

[0073] In the embodiment of the present application, each component in the surface maximum temperature difference occurrence time vector is fitted according to the first mathematical model, and the first fitting model is constructed including:

[0074] The first fitting model is the fitting mathematical relationship between the time vector of the maximum surface temperature difference and the defect depth under different defect diameters.

[0075] In the embodiment of the present application, each component in the surface maximum temperature difference occurrence time vector is fitted according to the first mathematical model, and constructing the first fitting model further includes:

[0076] The first fitting model is converted from the relationship model between the time vector of the maximum surface temperature difference and the defect depth to the relationship model between the defect depth and the time vector of the maximum surface temperature difference.

[0077] In an optional embodiment, the temperature difference between the defective area and the non-defective area on the surface of the specimen can be derived according to the formula:

[0078]

[0079] Furthermore, the extreme value and the value of the independent variable corresponding to the extreme value can be obtained by taking the first-order derivative:

[0080]

[0081] The equation is equal to 0, and after arranging and simplifying, we can get:

[0082]

[0083] That is: when t = t max , ΔT can reach a maximum value, at which time the difference between the surface temperature of the defective area and the surface temperature of the non-defective area reaches the maximum, and the maximum temperature is:

[0084]

[0085] Get the maximum temperature difference time t max Relationship with air gap defect depth z:

[0086] t max ∝z 2

[0087] In an optional embodiment, the first fitting model can be fitted using a second-order polynomial fitting model, and can also be fitted using a linear fitting model, an exponential fitting model, or other mathematical models to adapt to data characteristics in different situations. By selecting a suitable fitting model, the accuracy of defect depth estimation can be improved. For example, a linear fitting model is suitable for situations where there is a linear relationship between defect depth and the time when the maximum temperature difference occurs, while an exponential fitting model is suitable for situations where the data presents an exponential growth or decay trend.

[0088] In an optional embodiment, when a second-order polynomial fitting model is selected for fitting, the time vector of the maximum surface temperature difference is calculated. The fitting mathematical relationship between the defect depth z and the defect depth z adopts a second-order polynomial fitting model, namely:

[0089] t max =p 1 z 2 +p 2 z+p 3

[0090] Among them, p 1 ,p 2 ,p 3 are the three constants to be calculated in the second-order polynomial fitting model. Then, the fitting curves of the maximum temperature difference occurrence time and the defect depth can be drawn in turn;

[0091] Furthermore, under the premise that the defect depth is known, the maximum temperature difference occurrence time of the defect surface can be quickly estimated based on the fitting model of the maximum temperature difference occurrence time and the defect depth, so that the on-site personnel can roughly determine the time window for identifying the defect;

[0092] Furthermore, based on the fitting relationship between the time when the maximum temperature difference on the air gap defect surface appears and the defect depth, the expression of the air gap defect depth can be inversely solved from the mathematical relationship. Using the root-finding formula method, the two roots of the maximum temperature difference appearance time function can be obtained. First, rearrange the maximum temperature difference appearance time t max The relationship with the defect depth z is:

[0093] p 1 z 2 +p 2 z+(p 3 -t max )=0

[0094] When the specific maximum temperature difference occurs at time t max This is a quadratic equation about the defect depth h. The root formula of the quadratic equation can be used to inversely solve the defect depth h:

[0095]

[0096] Two possible solutions for the defect depth can be obtained;

[0097] It should be noted that, considering the actual physical meaning of the defect depth z, the air gap defect depth h must be the only constant greater than 0, and the root range is limited according to the physical definition of the defect depth. From the above formula, it can be seen that the maximum temperature difference occurrence time increases more rapidly with the increase of the defect depth, and its relationship must be a second-order polynomial with an opening facing upward, that is, the maximum temperature difference occurrence time t max The relationship between p and the defect depth h 1It must be a positive value. When the sign in the defect depth expression is negative, the numerator in the expression of the defect depth z is negative, and the value of the defect depth z will be negative, which is obviously contrary to its physical definition. Therefore, when the sign in the defect depth expression is positive, the unique defect depth z can be determined:

[0098]

[0099] In an optional embodiment, for defects under all defect diameters in the defect planning table, the same method can be used to calculate the defect depth calculation expression z under each defect size: 1 ,z 2 ,…,z m :

[0100]

[0101] It should be noted that the benefit of step S102 is that it can provide a unified calculation framework for defects of different sizes, thereby simplifying the process of estimating the defect depth. In this way, the depth of defects of various sizes can be quickly estimated without having to perform complex calculations for each size separately. In addition, this method can also adapt to defect detection under different materials and environmental conditions, improving the versatility and flexibility of the detection system. In practical applications, this method can effectively assist engineers and maintenance personnel in fault diagnosis and preventive maintenance, thereby improving the reliability and safety of the power system.

[0102] S103, quickly estimating the air gap defect depth of the pot-type insulator according to the first fitting model.

[0103] In an embodiment of the present application, the rapid estimation of the air gap defect depth of the pot-type insulator according to the first fitting model includes:

[0104] Obtain the actual defect diameter of the pot-type insulator to be tested and the actual maximum surface temperature difference occurrence time vector;

[0105] According to the actual defect diameter and the actual time vector of the maximum surface temperature difference, the air gap defect depth of the pot insulator is quickly estimated in combination with the first fitting model.

[0106] In an optional embodiment, the specific steps of using the inversely solved air gap defect depth expressions for all defect sizes to form a set of air gap defect depth rapid estimation methods are as follows:

[0107] According to the calculated n defect diameters d n The calculation expression for all depths z 1 ,z 2 ,…,z m, construct the calculation formula of defect depth z for each defect diameter d: z = f(t max ):

[0108] Table 2: Example of defect depth calculation

[0109] defect Defect 1 Defect 2 ... Defect Defect depth <![CDATA[z 1 =f 1 (t max )]]> <![CDATA[z 2 =f 2 (t max )]]> ... <![CDATA[z n =f n (t max )]]>

[0110] In an optional embodiment, when a new pot-type insulator to be tested needs to be tested, the testing process is directly entered to calculate the actual defect diameter of the pot-type insulator to be tested and the actual surface maximum temperature difference occurrence time vector, and the first fitting model is combined to quickly calculate the near-surface pore defect depth of the pot-type insulator.

[0111] In the embodiments of the present application, Figure 2 As shown, the process starts here in 201. Sample Planning and Preparation 202 This step designs and prepares sample materials for testing or research purposes. Flaw Diameter 203 At this stage, the diameter of the flaw in the sample is measured or determined. Flaw Depth 204 Similarly, the depth of the flaw is measured or determined. Flaw Definition 205 This step involves classifying or defining the type of flaw observed. Infrared Heat Wave Testing 206 Experiments or tests are performed using infrared heat wave technology. Surface Temperature Data Form Maximum Temperature Difference Time Vector 207 Surface temperature data is collected and organized to create a vector representing the maximum temperature difference over time. Heat Transfer Physics 208 Apply heat transfer principles to understand the collected data. Maximum Temperature Difference Time-Flaw Depth Fitting Model 209 Build a model that relates the time when the maximum temperature difference occurs to the depth of the flaw. Rooting Formula 210 Use mathematical formulas to solve or calculate certain parameters. Experimental Data Acquisition 211 Acquire more data through experiments. Inverse Expression of Flaw Depth Equation Solution 212 Solve an equation that can be used to infer the depth of the flaw. Data processing flow 213 further processes and analyzes all collected data. Form defect depth fast estimation method 214 Using the results of the above steps, a method for fast estimation of defect depth is developed. End 215 The process ends here.

[0112] In summary, the present invention proposes a method and system for quickly estimating the depth of an air gap defect in a pot-type insulator, obtaining the time vector of the maximum surface temperature difference of a target pot-type insulator containing an air gap defect under a first thermal excitation; fitting each component in the time vector of the maximum surface temperature difference according to a first mathematical model to construct a first fitting model; and quickly estimating the depth of the air gap defect in the pot-type insulator according to the first fitting model. The present application significantly improves the detection efficiency and accuracy through an accurate mathematical model and a fast calculation process. Compared with traditional detection methods, the present application not only reduces the time required for detection, but also reduces the requirements for the skill level of the operator, making the detection process more standardized and automated. In addition, the system design of the present application is flexible and can be easily integrated into the existing GIS equipment detection process, providing strong technical support for the safe operation of the power system. Through the implementation of the present application, power system failures caused by insulator defects can be effectively prevented, thereby ensuring the stability and reliability of the power grid.

[0113] This embodiment also provides a system for quickly estimating the depth of a pot-type insulator air gap defect, including:

[0114] A parameter acquisition module, used for acquiring a surface maximum temperature difference occurrence time vector of a target pot-type insulator with an air gap defect under a first thermal excitation;

[0115] A model building module, used for fitting each component in the surface maximum temperature difference occurrence time vector according to the first mathematical model to construct a first fitting model;

[0116] The calculation module is used for quickly estimating the air gap defect depth of the pot-type insulator according to the first fitting model.

[0117] The above-mentioned unit modules may be embedded in or independent of a processor in a computer device in the form of hardware, or may be stored in a memory in a computer device in the form of software, so that the processor can call and execute operations corresponding to the above-mentioned modules.

[0118] This embodiment also provides a computer device, which may be a terminal, and its internal structure diagram may be as shown in FIG. Figure 4As shown. The computer device includes a processor, a memory, a communication interface, a display screen and an input device connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be achieved through WIFI, an operator network, NFC (near field communication) or other technologies. When the computer program is executed by the processor, a method for quickly estimating the depth of the air gap defect of a basin-type insulator is implemented. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covered on the display screen, or a key, trackball or touchpad set on the computer device housing, or an external keyboard, touchpad or mouse, etc.

[0119] This embodiment further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0120] Obtaining the appearance time vector of the maximum surface temperature difference of the target pot-type insulator with air gap defects under the first thermal excitation;

[0121] Performing a fitting operation on each component in the surface maximum temperature difference occurrence time vector according to the first mathematical model to construct a first fitting model;

[0122] The air gap defect depth of pot-type insulator is quickly estimated based on the first fitting model.

[0123] Example 2

[0124] Reference Figure 2-Figure 3 , which is an embodiment of the present invention, provides a method and system for quickly estimating the air gap defect depth of a pot-type insulator. In order to verify the beneficial effects of the present invention, scientific demonstration is carried out through experiments.

[0125] A portion of the defect planning table is taken as an example. The selected 6 defects have the same diameter, but different defect depths, and each depth will correspond to a unique maximum temperature difference occurrence time.

[0126] Table 3: Partial defect planning table

[0127]

[0128]

[0129] The 126kV pot-type insulator sample with the above defects was thermally excited. The thermal excitation was pulsed excitation, and its maximum heat flux density was Q=10 6 W / m 2 The pulse duration is t = 0.1s, and an infrared thermal imager is used to collect temperature change data on the surface of the pot insulator. The acquisition frequency is f = 10Hz. The acquired area includes the temperature changes in the defective area and the temperature changes in the non-defective area.

[0130] The maximum temperature difference occurrence time of each defect surface is calculated according to the calculation method in the invention content. The following maximum temperature difference occurrence time table can be obtained by calculation:

[0131] Table 4: Maximum temperature difference occurrence timetable

[0132] defect <![CDATA[d 1 With 1 ]]> <![CDATA[d 1 With 2 ]]> <![CDATA[d 1 With 3 ]]> <![CDATA[d 1 With 4 ]]> <![CDATA[d 1 With 5 ]]> <![CDATA[d 1 With 6 ]]> <![CDATA[t max ]]> 1.7s 4.0s 5.9s 8.3s 11.4s 15.3s

[0133] So the maximum temperature difference occurs at the time vector for:

[0134]

[0135] The maximum temperature difference occurs at the time vector Fitting is performed with the defect depth z. The fitting model adopts the second-order polynomial fitting model mentioned above, and the fitting result can be obtained:

[0136] Table 5 Fitting results

[0137]

[0138] exist Figure 3 The maximum temperature difference is drawn in the window at the time t max The scatter plot of the true value of the defect depth z and the fitting curve show that the fitting curve is a quadratic function with an opening upward, and it reflects the maximum temperature difference occurrence time t well. max Numerical relationship with defect depth z:

[0139] For the maximum temperature difference time t max Fitting function t with defect depth z max =0.182z 2 +1.519z–0.380, and use the root-finding formula to inversely solve the defect depth z:

[0140]

[0141] From the above analysis, it is meaningless when the ± in the numerator is -, so the only solution for the defect depth z is:

[0142]

[0143] The corresponding defect diameter d is obtained 1 =8mm. It is only necessary to measure the time when the maximum temperature difference occurs in the experiment. max , the defect depth z can be quickly calculated through the calculation formula of the defect depth z.

[0144] Example 3

[0145] According to the analysis of the previous embodiment, the corresponding defect diameter d 1 = Time t when the maximum temperature difference occurs when 8mm max The fitting function with the defect depth z is:

[0146] t max =0.182z 2 +1.519z–0.380

[0147] Corresponding defect diameter d under the same conditions 1 =8mm, the quick estimation expression of the defect depth z is:

[0148]

[0149] Setting a new defect in pot insulator d 1 z 7 To verify the effectiveness of the method for rapid estimation of the air gap defect depth described in the present invention. 1 z 7 The parameters are as follows:

[0150] d 1 =8mm,z 7 =2.5mm,t max =4.6s

[0151] It can be seen that the depth of this defect is different from any of the above defects. 1 z 7 When the parameters are known, first use the known defect depth z 7 Calculate the time when the maximum temperature difference occurs and verify the deviation. 7 =2.5mm Substitute the maximum temperature difference into the time t max Calculated in the fitting function:

[0152]

[0153] Calculated Value With the true value t max The relative error calculation is shown in the following table. It can be seen that the relative error is around 1%, and the calculation method of the present invention is more accurate.

[0154] Table 6 Error analysis results

[0155]

[0156] Then at the time t when the maximum temperature difference occurs max Calculate the defect depth z when the 7 , and verify the deviation. The maximum temperature difference time t max =4.6s Substituting into the fast estimation expression of defect depth z, we can get:

[0157]

[0158] Calculated Value and the true value z 7 The relative error calculation is shown in the following table. It can be seen that the relative error is around 1%, and the calculation method of the present invention is more accurate.

[0159] Table 7 Error analysis results

[0160]

[0161]

[0162] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

[0163] Those skilled in the art will appreciate that the embodiments of the present application can be provided as methods, systems, or computer program products. Therefore, the present application can adopt the form of complete hardware embodiments, complete software embodiments, or embodiments in combination with software and hardware. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code. The scheme in the embodiments of the present application can be implemented in various computer languages, for example, object-oriented programming language Java and literal scripting language JavaScript, etc.

[0164] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0165] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0166] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable device. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0167] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0168] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A method for quickly estimating the depth of air gap defects in pot-type insulators, characterized in that: include: Obtaining the appearance time vector of the maximum surface temperature difference of the target pot-type insulator with air gap defects under the first thermal excitation; Performing a fitting operation on each component in the surface maximum temperature difference occurrence time vector according to the first mathematical model to construct a first fitting model; The air gap defect depth of the pot-type insulator is quickly estimated according to the first fitting model.

2. The method for rapidly estimating the depth of air gap defects in pot-type insulators according to claim 1, characterized in that: The method of obtaining the target maximum surface temperature difference occurrence time vector of the pot-type insulator containing air gap defects under the first thermal excitation comprises: The target pot-type insulator containing air gap defects is selected from a first preset defect planning table; The first preset defect planning table includes defect sizes and defect depths occurring during the actual production process, and the defect depths and defect sizes are arranged in rows and columns of the defect planning table according to a first arrangement order.

3. The method for rapidly estimating the depth of air gap defects in pot-type insulators according to claim 2, characterized in that: The step of obtaining the target pot-type insulator having an air gap defect and the maximum surface temperature difference occurrence time vector under the first thermal excitation also includes: Performing a first thermal excitation on the target pot-type insulator containing an air gap defect; Acquiring surface temperature data of the region containing air gap defects under the first thermal excitation; The temperature difference vector of the air gap defect surface is calculated according to the surface temperature data of the air gap defect region under the first thermal excitation, and the maximum temperature difference value is searched from the temperature difference vectors of the air gap defect surface.

4. The method for quickly estimating the depth of air gap defects in pot-type insulators according to claim 3, characterized in that: The step of performing a fitting operation on each component in the surface maximum temperature difference occurrence time vector according to the first mathematical model to construct the first fitting model comprises: The first fitting model is a fitting mathematical relationship between the time vector of the maximum surface temperature difference under different defect diameters and the defect depth.

5. The method for quickly estimating the depth of air gap defects in pot-type insulators according to claim 4, characterized in that: The fitting operation of each component in the surface maximum temperature difference occurrence time vector according to the first mathematical model to construct the first fitting model also includes: The first fitting model is converted from the relationship model between the surface maximum temperature difference occurrence time vector and the defect depth to the relationship model between the defect depth and the surface maximum temperature difference occurrence time vector.

6. The method for rapidly estimating the depth of air gap defects in pot-type insulators according to claim 5, characterized in that: The fast estimation of the air gap defect depth of the pot-type insulator according to the first fitting model comprises: Obtain the actual defect diameter of the pot-type insulator to be tested and the actual maximum surface temperature difference occurrence time vector; According to the actual defect diameter and the actual surface maximum temperature difference occurrence time vector, combined with the first fitting model, the air gap defect depth of the pot-type insulator is quickly estimated.

7. The method for rapidly estimating the depth of air gap defects in pot-type insulators according to claim 6, characterized in that: Also includes: When there is a new pot-type insulator to be tested, the test process is directly entered to calculate the actual defect diameter of the pot-type insulator to be tested and the actual surface maximum temperature difference occurrence time vector, and the first fitting model is combined to quickly calculate the near-surface pore defect depth of the pot-type insulator.

8. A rapid estimation system for air gap defect depth of pot-type insulator, characterized in that: include: A parameter acquisition module, used for acquiring a surface maximum temperature difference occurrence time vector of a target pot-type insulator with an air gap defect under a first thermal excitation; A model building module, used for fitting each component in the surface maximum temperature difference occurrence time vector according to the first mathematical model to construct a first fitting model; A calculation module is used to quickly estimate the air gap defect depth of the pot-type insulator according to the first fitting model.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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