Double-sided edge sealing method for substrate

Abstract

A double-sided edge sealing method for a substrate uses a first carrier and a second carrier of a double-sided edge sealing jig to clamp the substrate with a laminated structure so as to heat the two sides of the substrate at the same time, thereby shortening the processing time, improving the productivity, and ensuring that the processing positions of the two sides of the substrate correspond to each other, thereby improving the processing accuracy.

Description

Technical Field

[0001] The invention relates to an edge sealing technology, in particular to a double-sided edge sealing method for a substrate. Background Art

[0002] There are many types and varieties of semiconductor packages at present. For example, it is known that circuits can be made on substrates with a stacked structure. As a carrier board for the circuit, the substrate with a stacked structure includes, for example: a core layer, a carrier layer formed on both sides of the core layer, and a functional layer formed on both sides of the carrier layer. If there is delamination between the layers of the substrate, in the wet process (such as copper plating), penetration may occur in the gap between the layers and cause reliability problems in the product. Therefore, in order to avoid gaps caused by delamination between the layers of the substrate, the outer periphery of the substrate is generally heated and the substrate is sealed before the circuit is made, so that the layers of the substrate are firmly joined and foreign matter cannot enter from the edge of the substrate.

[0003] In the related art, laser processing (such as a carbon dioxide laser) can be used to ablate the edge of the substrate, thereby bonding the layers of the substrate to each other. However, in the laser processing method, the service life of the laser processing equipment is short and its accuracy is not sufficient. For example, the accuracy of laser processing can only reach about + / -75um.

[0004] Furthermore, it takes a long time for the laser to heat the substrate along the trajectory, and it can only process a single side of the substrate at a time, that is, it is necessary to complete the processing of one side first, and then turn it over to process the other side. This will increase the time required for processing, for example, the total processing time may reach more than 100 seconds. In addition, after completing the processing of one side of the substrate, when the substrate is turned over, the position of the substrate may be offset, so that the processing positions of the two sides do not correspond to each other.

[0005] In addition, the processing width of laser processing may be less than 30um. In order to ensure that the layers of the substrate are firmly bonded and not easily separated, more than one laser processing may be required to strengthen the bonding between the layers. This will further increase the time required for processing and will also occupy more substrate space, compressing the space for subsequent production circuits.

[0006] Therefore, how to overcome the various problems of the above-mentioned prior art has become a topic that needs to be solved urgently. Summary of the invention

[0007] In view of the various deficiencies of the above-mentioned prior art, the present invention provides a double-sided edge sealing method for a substrate, comprising: providing a double-sided edge sealing tool including a first carrier and a second carrier, wherein the first carrier has a first body and a first heating head disposed on the first body, and the second carrier is disposed above the first carrier and has a second body and a second heating head disposed on the second body; placing a substrate having a stacked structure between the first carrier and the second carrier of the double-sided edge sealing tool, so that the first carrier carries the substrate, and the substrate is aligned with the first heating head of the first carrier; moving the second carrier toward the first carrier, so that the second heating head of the second carrier contacts the substrate, wherein the second heating head is opposite to the first heating head and has a corresponding position; and heating the substrate by means of the first heating head and the second heating head.

[0008] In a specific embodiment of the double-sided edge sealing method of the substrate, the first heating head and the second heating head heat the opposite first side and second side of the substrate simultaneously.

[0009] In a specific embodiment of the double-sided edge sealing method of the aforementioned substrate, the first heating head is circumferentially configured on the outer periphery of the first body, and the second heating head is also circumferentially configured on the outer periphery of the second body, that is, the first heating head and the second heating head are continuously formed corresponding to the outer periphery of the substrate and surround the functional area of ​​the substrate.

[0010] In a specific embodiment of the double-sided edge sealing method of the aforementioned substrate, the first heating head and the second heating head heat the two sides of the substrate simultaneously and the entire side is heated at one time.

[0011] In a specific embodiment of the double-sided edge sealing method of the substrate, the second carrier applies pressure to the substrate while heating the substrate.

[0012] In a specific embodiment of the double-sided edge sealing method of the aforementioned substrate, the first heating head and the second heating head are connected to an electric circuit and form a loop with the substrate, so as to heat the substrate by passing an electric current through the substrate.

[0013] In a specific embodiment of the double-sided edge sealing method of the aforementioned substrate, the first body has a first groove, the first heating head is arranged in the first groove and protrudes from the first groove to the surface of the first body, and the second body has a second groove, the second heating head is arranged in the second groove and protrudes from the second groove to the surface of the second body.

[0014] In a specific embodiment of the double-sided edge sealing method of the substrate, the depths of the first groove and the second groove are 2 to 7 mm.

[0015] In a specific embodiment of the double-sided edge sealing method of the aforementioned substrate, the height of the first heating head and the second heating head protruding from the surface of the first body and the surface of the second body respectively is 0.1 to 0.5 mm.

[0016] In a specific embodiment of the double-sided edge sealing method of the aforementioned substrate, the first heating head is formed into a pointed shape extending outward from the first groove and gradually narrowing in width, and the second heating head is formed into a pointed shape extending outward from the second groove and gradually narrowing in width.

[0017] In a specific embodiment of the double-sided edge sealing method of the aforementioned substrate, the width of the tips of the first heating head and the second heating head is 0.5 to 1 mm.

[0018] In a specific embodiment of the double-sided edge sealing method of the substrate, the first heating head and the second heating head are made of a heat-conducting material such as cast iron or carbide. In a specific embodiment, the carbide is tungsten carbide.

[0019] In a specific embodiment of the double-sided edge sealing method of the substrate, the surfaces of the first body and the second body are hard anodized.

[0020] From the above, it can be seen that in the double-sided edge sealing method of the substrate of the present invention, the substrate is mainly processed by clamping the two sides of the substrate with a stacked structure by the first carrier and the second carrier. Since the first heating head of the first carrier and the second heating head of the second carrier are opposite to each other and have corresponding positions, the two sides of the substrate can be heated at the same time. Therefore, compared with the prior art, the double-sided edge sealing tool of the present invention can shorten the processing time and improve the production capacity, and can ensure that the processing positions of the two sides of the substrate correspond, thereby improving the processing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a cross-sectional schematic diagram of the substrate of the present invention.

[0022] Figure 2 It is a three-dimensional schematic diagram of the double-sided edge banding jig of the present invention.

[0023] Figure 3A It is a cross-sectional schematic diagram of the double-sided edge-sealing jig of the present invention processing a substrate.

[0024] Figure 3B The cross-sectional schematic diagram is a diagram showing that an electric cylinder is arranged at the bottom of the first heating head of the double-sided edge banding jig of the present invention.

[0025] Figure 4 for Figure 3A A partial enlarged view of .

[0026] Figure 5 for Figure 3ASchematic diagram of top view of the substrate after processing.

[0027] The reference numerals are described as follows:

[0028] 1: Double-sided edge banding tooling

[0029] 10: First Vehicle

[0030] 11: The first ontology

[0031] 12: The first heating head

[0032] 13: First groove

[0033] 20: Second Vehicle

[0034] 21: Second Body

[0035] 22: Second heating head

[0036] 23: Second groove

[0037] 24: Mobile mechanism

[0038] 25: Electric cylinder

[0039] 251: Power tube

[0040] 30: Substrate

[0041] 30a: First side

[0042] 30b: Second side

[0043] 31: Core layer

[0044] 32: Carrier layer

[0045] 33: Functional layer

[0046] A: Functional area

[0047] B: Non-functional area

[0048] D: Distance

[0049] D1, D2: Depth

[0050] H1, H2: Height

[0051] P: Processing position

[0052] W1, W2, W3, W4: Width. DETAILED DESCRIPTION

[0053] The following describes the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0054] It should be noted that the structures, proportions, sizes, etc. shown in the attached drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed in the present invention. At the same time, the terms such as "on", "first", "second", "second" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0055] Figure 1 It is a cross-sectional schematic diagram of the substrate of the present invention. Figure 2 It is a three-dimensional schematic diagram of the double-sided edge banding jig of the present invention. Figure 3A This is a cross-sectional schematic diagram of the double-sided edge-sealing jig of the present invention processing a substrate. First, please refer to Figures 1 to 3A In the double-sided edge sealing method of the substrate shown in this embodiment, a double-sided edge sealing tool 1 is used to process a substrate 30 having a stacked structure so that the edge layers of the substrate 30 are joined and the inside is sealed.

[0056] The substrate 30 may be a carrier board for making circuits, and the substrate 30 may have a core layer 31, and a carrier layer 32 and a functional layer 33 are sequentially formed on opposite sides of the core layer 31. That is, the substrate 30 may have a laminated structure consisting of five layers, namely, the functional layer 33, the carrier layer 32, the core layer 31, the carrier layer 32, and the functional layer 33. It should be understood that although the substrate 30 is shown here to have a five-layer laminated structure, the present invention is not limited thereto, and in other embodiments, the substrate 30 may also be a laminated structure other than a five-layer structure, and may be adjusted as required.

[0057] In this embodiment, the core layer 31 may be an organic polymer sheet such as bismaleimide / triazine trap (BT) or a copper foil substrate, and the carrier layer 32 may be a metal layer of a copper layer (or copper foil), and the functional layer 33 may be another metal layer of a copper layer (or copper foil). The thickness of the carrier layer 32 may be 18um, and the thickness of the functional layer 33 may be 5um. After the double-sided edge sealing process of the substrate 30 is performed, the layers of the heated portion of the substrate 30 may be melted or plasticized, thereby combining them.

[0058] The double-sided edge banding tool 1 includes a first carrier 10 and a second carrier 20. The second carrier 20 is arranged above the first carrier 10 and is separated from the first carrier 10 by a distance, so that a substrate 30 is placed between the first carrier 10 and the second carrier 20, and the distance between the first carrier 10 and the second carrier 20 is adjusted so that the first carrier 10 and the second carrier 20 clamp the first side 30a and the second side 30b of the substrate 30 (such as Figure 3A As shown), the first side 30a and the second side 30b of the substrate 30 can be heated simultaneously.

[0059] In this embodiment, the first carrier 10 comprises: a first body 11 , a first groove 13 recessed in the first body 11 , and a first heating head 12 disposed in the first groove 13 and protruding from the first groove 13 to a surface of the first body 11 .

[0060] The first body 11 may be made of an insulating material with a heat-resistant and deformation-resistant surface treatment to ensure that it will not deform due to long-term use and cause layer deviation during hot pressing. The surface treatment is, for example, hard anodizing, but the present invention is not limited to the above, as long as the first body 11 is not deformed due to long-term use.

[0061] The first heating head 12 can be made of high thermal conductivity materials such as cast iron, carbide, etc., for example, tungsten carbide, which has high temperature resistance, high hardness, good thermal conductivity, and anti-oxidation properties, so it is beneficial for the first heating head 12 to repeatedly contact and heat the substrate 30.

[0062] like Figure 2 As shown, in this embodiment, the first groove 13 is circumferentially recessed on the upper surface of the outer periphery of the first body 11 corresponding to the size of the substrate 30, and is an annular groove, and correspondingly, the first heating head 12 is also circumferentially arranged on the outer periphery of the first body 11. In addition, the first heating head 12 may be an annular heating head, or one or more heating heads may be arranged in the first groove 13 and arranged in a ring shape (not shown). An alignment line or an alignment structure (not shown) may be arranged on the upper surface of the first body 11, and the user may place the substrate 30 on the upper surface of the first body 11 according to the alignment line or the alignment structure, so that the first heating head 12 is aligned with the processing position P of the substrate 30. The processing position P of the substrate 30 is shown in Figure 5 , which will be explained in more detail later.

[0063] Figure 4 for Figure 3A A partial enlarged view of Figure 4As shown, the depth D1 of the first groove 13 is 2 to 7 mm, such as 2, 3, 4, 5, 6 or 7 mm, and the height H1 of the first heating head 12 extending upward from the bottom of the first groove 13 and protruding from the surface of the first body 11 is 0.1 to 0.5 mm, such as 0.1, 0.2, 0.3, 0.4 or 0.5 mm. Since most of the first heating head 12 is buried in the first body 11, the first heating head 12 can be protected and the possibility of damage to the first heating head 12 can be reduced. It should be understood that as long as the first heating head 12 can be firmly set on the first body 11, the depth in the first groove 13 or the protruding height of the first heating head 12 can also be changed, or the way the first heating head 12 is configured on the first body 11 can be changed, and it is not limited to the above.

[0064] Furthermore, in this embodiment, the width W1 of the bottom of the first heating head 12 is 2 to 7 mm, such as 2, 3, 4, 5, 6 or 7 mm, and its width gradually narrows as it extends outward from the first groove 13, and the width W2 of the tip of the first heating head 12 is 0.5 to 1 mm, such as 0.5, 0.6, 0.7, 0.8, 0.9 or 1 mm. With this pointed blade-shaped heating head, the first heating head 12 can accurately contact the desired processing position P (such as Figure 5 As shown in FIG. 1 , and at the same time, since the first heating head 12 has a wider bottom, it can be ensured that the first heating head 12 has sufficient supporting force. It should be understood that as long as the first heating head 12 can accurately contact the processing position P of the substrate 30 and has sufficient supporting force, the first heating head 12 can also be formed in other shapes or sizes, and is not limited to the above.

[0065] In addition, heat insulation treatment can be performed above the first heating head 12 and an air blowing cooling function can be added. Figure 3B In the illustrated embodiment, at least one electric cylinder 25 may be disposed at the bottom of the first heating head 12, and the power tube 251 thereof abuts against the bottom of the first heating head 12 to perform torque control, thereby preventing the first heating head 12 from having different contact pressures and causing carbonization when the height of the first heating head 12 is uneven. Similarly, at least one electric cylinder may also be disposed at the bottom of the second heating head 22 described later to perform torque control (not shown).

[0066] In this embodiment, the second carrier 20 has a structure corresponding to the first carrier 10. Specifically, the second carrier 20 may also have: a second body 21, a second groove 23 recessed in the second body 21, and a second heating head 22 disposed in the second groove 23 and protruding from the second groove 23 to the surface of the second body 21.

[0067] Furthermore, the second body 21 may also be made of an insulating material with a heat-resistant and deformation-resistant surface treated by hard anodizing, and the second heating head 22 may also be made of a high thermal conductivity material such as cast iron, carbide, etc., such as tungsten carbide. In addition, the depth D2 of the second groove 23 may also be 2 to 7 mm, such as 2, 3, 4, 5, 6 or 7 mm, and the height H2 of the second heating head 22 protruding from the surface of the second body 21 may also be 0.1 to 0.5 mm, such as 0.1, 0..2, 0.3, 0.4 or 0.5 mm. The second heating head 22 may also be in a pointed shape with a bottom width W3 of 2 to 7 mm, such as 2, 3, 4, 5, 6 or 7 mm, and a tip width W4 of 0.5 to 1 mm, such as 0.5, 0.6, 0.7, 0.8, 0.9 or 1 mm. However, the present invention is not limited thereto, and the materials and sizes of the first carrier 10 and the second carrier 20 may be adjusted according to needs.

[0068] In addition, the second carrier 20 further has a moving mechanism 24 for moving the second body 21. The moving mechanism 24 can be a lifting device that enables the second body 21 to move up and down in the vertical direction relative to the first body 11. The height can be automatically adjusted by the parameters set by the control system, and the height can also be adjusted by the user at any time according to the situation. Furthermore, the moving mechanism 24 can be used to make the second carrier 20 apply pressure to the substrate 30 so that the layers of the substrate 30 that are heated to a molten or plastic state can be better combined.

[0069] In this embodiment, the second heating head 22 on the second body 21 is configured to be opposite to and positionally corresponding to the first heating head 12 on the first body 11. The moving mechanism 24 is used to lift and lower the second body 21 to change the distance between the first heating head 12 and the second heating head 22, so that the substrate 30 can be clamped between the first heating head 12 and the second heating head 22.

[0070] In this embodiment, the first heating head 12 and the second heating head 22 are connected to a circuit and serve as two electrodes. The first heating head 12 and the second heating head 22, serving as two electrodes, contact the first side 30a and the second side 30b of the substrate 30 respectively to form a loop, so that a high-frequency current passes through the substrate 30 to generate a resistive thermal effect, so as to heat the substrate 30 to a molten or plastic state, so that the various layers of the substrate 30 are combined. It should be understood that the heating method of the present invention is not limited to the above. In other embodiments, the first heating head 12 and the second heating head 22 can also be connected to a heating device respectively to heat the first heating head 12 and the second heating head 22 respectively. In addition, the heating temperature of the first heating head 12 and the second heating head 22 for the substrate 30 can be adjusted according to demand. The heating temperature is set to be higher than the melting point of each layer of the substrate 30, and its temperature range is, for example, 1000 to 2500°C.

[0071] Figure 5 for Figure 3A Schematic diagram of the top view of the substrate after processing. Figure 3A and Figure 5 As shown, the first heating head 12 and the second heating head 22 are configured to match the size of the substrate 30 to be processed, so that the processing position P of the first heating head 12 and the second heating head 22 on the substrate 30 is located in the non-functional area B outside the functional area A of the substrate 30, and the distance D between the processing position P and the edge of the substrate 30 is minimized as much as possible, for example, the distance D can be less than 3mm. Therefore, this double-sided edge sealing will not affect the subsequent circuit production in the functional area A of the substrate 30, and can ensure that the utilization rate of the functional area A of the substrate 30 is maximized. In addition, the processing position P is formed into a closed ring along the outer periphery of the substrate 30, thereby preventing foreign matter from entering the layers from the edge of the substrate 30.

[0072] When the double-sided edge banding jig 1 is used to perform double-sided edge banding processing on the substrate 30, the user places the substrate 30 on the upper surface of the first body 11, aligns the predetermined processing position P of the substrate 30 with the first heating head 12, and moves the second body 21 to make the second heating head 22 contact the substrate 30, so that the first heating head 12 and the second heating head 22 can simultaneously heat the first side 30a and the second side 30b of the substrate 30. In this way, since the first heating head 12 and the second heating head 22 can heat both sides of the substrate 30 at the same time, the processing time can be shortened and the production capacity can be improved. For example, the processing time only takes 20 to 40 seconds, and it can ensure that the processing positions P on both sides of the substrate 30 correspond to each other, thereby improving the processing accuracy.

[0073] Furthermore, since the first heating head 12 and the second heating head 22 are set to correspond to a full circle of the processing position P of the substrate 30, it is not necessary to move the laser along a trajectory for a circle as in the prior art, and a full circle of heating can be completed at one time, so the processing time can be further shortened and the production capacity can be improved. In addition, as long as the substrate 30 is placed in the correct position of the double-sided edge sealing fixture 1 using the graphic alignment method at the beginning, the predetermined processing position P of the substrate 30 can be heated quickly and accurately, and its accuracy can reach, for example, ±10um.

[0074] In summary, in the double-sided edge sealing method of the substrate of the present invention, the substrate is mainly processed by clamping the two sides of the substrate with a stacked structure by the first carrier and the second carrier. Since the first heating head of the first carrier and the second heating head of the second carrier are opposite to each other and have corresponding positions, the two sides of the substrate can be heated at the same time, thereby shortening the processing time and improving the production capacity, and ensuring that the processing positions of the two sides of the substrate correspond, thereby improving the processing accuracy.

[0075] Furthermore, since the first heating head of the first carrier and the second heating head of the second carrier are continuously formed along the edge of the substrate and surround the functional area of ​​the substrate, it can be ensured that the edges of the substrate are sealed to prevent foreign matter from entering between the layers from the edges of the substrate.

[0076] In addition, the double-sided edge banding jig constructed according to the above method has a long service life and does not need to be replaced frequently, thereby reducing manufacturing costs.

[0077] The above embodiments are only used to illustrate the principles and effects of the present invention, and are not used to limit the present invention. Those skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. A double-sided edge sealing method for a substrate, comprising: A double-sided edge banding tool is provided, comprising a first carrier and a second carrier, wherein the first carrier comprises a first body and a first heating head disposed on the first body, and the second carrier is disposed above the first carrier and comprises a second body and a second heating head disposed on the second body; Placing a substrate having a stacked structure between a first carrier and a second carrier of the double-sided edge-sealing tool, so that the first carrier carries the substrate, and the substrate is aligned with a first heating head of the first carrier; Move the second carrier toward the first carrier so that a second heating head of the second carrier contacts the substrate, wherein the second heating head faces the first heating head and has a corresponding position; and The substrate is heated by the first heating head and the second heating head.

2. The double-sided edge sealing method of a substrate according to claim 1, wherein: The first heating head and the second heating head heat the opposite first side and second side of the substrate simultaneously.

3. The double-sided edge sealing method of a substrate according to claim 1, wherein: The first heating head is circumferentially arranged on the outer periphery of the first body, and the second heating head is also circumferentially arranged on the outer periphery of the second body.

4. The double-sided edge sealing method of a substrate according to claim 1, wherein: The first heating head and the second heating head heat the two sides of the substrate simultaneously and the entire side is heated at one time.

5. The double-sided edge sealing method of a substrate according to claim 1, wherein: The second carrier applies pressure to the substrate while heating the substrate.

6. The double-sided edge sealing method of a substrate according to claim 1, wherein: The first heating head and the second heating head are connected to an electric circuit and form a loop with the substrate so as to heat the substrate by passing an electric current through the substrate.

7. The double-sided edge sealing method of a substrate according to claim 1, wherein: The first body has a first groove, the first heating head is arranged in the first groove and protrudes from the first groove to the surface of the first body, and the second body has a second groove, the second heating head is arranged in the second groove and protrudes from the second groove to the surface of the second body.

8. The double-sided edge sealing method of a substrate according to claim 7, wherein: The depths of the first groove and the second groove are 2 to 7 mm.

9. The double-sided edge sealing method of a substrate according to claim 7, wherein: The first heating head and the second heating head protrude from the surface of the first body and the surface of the second body respectively by a height of 0.1 to 0.5 mm.

10. The double-sided edge sealing method of a substrate according to claim 7, wherein: The first heating head is formed into a pointed shape extending outward from the first groove and gradually narrowing in width, and the second heating head is formed into a pointed shape extending outward from the second groove and gradually narrowing in width.

11. The double-sided edge sealing method of a substrate according to claim 10, wherein: The width of the tips of the first heating head and the second heating head is 0.5 to 1 mm.

12. The double-sided edge sealing method of a substrate according to claim 1, wherein: The first heating head and the second heating head are made of heat-conducting materials such as cast iron or carbide.

13. The double-sided edge sealing method of a substrate according to claim 12, wherein: The carbide is tungsten carbide.

14. The double-sided edge sealing method of a substrate according to claim 1, wherein: The surfaces of the first body and the second body are hard anodized.

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