Wafer clamping device and wafer cleaning and drying equipment

Abstract

The invention relates to the technical field of semiconductors, and discloses a wafer clamping device and wafer cleaning and drying equipment. The wafer clamping device comprises a support; the first clamping piece is in sliding connection with the support, so that the first clamping piece can slide between a first position and a second position, the first clamping piece is located on a moving path of the wafer, and the sliding direction of the first clamping piece is parallel to the moving path of the wafer, so that the wafer can push the first clamping piece from the first position to the second position; the second clamping piece is connected with the support, and when the first clamping piece is pushed to a second position by the wafer, the second clamping piece abuts against the wafer, so that the first clamping piece and the second clamping piece clamp the wafer; the first buffer piece is arranged on the first clamping piece; the second buffering piece is arranged on the support, and magnetic resistance can be formed between the first buffering piece and the second buffering piece so that the falling speed of the first clamping piece can be reduced through the magnetic resistance.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a wafer clamping device and a wafer cleaning and drying equipment. Background Art

[0002] In the cleaning process after the chemical mechanical polishing (CMP) process, the vertical Marangoni pull-and-dry technology is used to dry the wafer. The wafer is usually lifted from the cleaning liquid by a wafer lifting device until it leaves the cleaning liquid, and nitrogen containing a certain concentration of isopropyl alcohol is sprayed onto the wafer surface through a spray bar set outside the cleaning liquid. When the wafer leaves the cleaning liquid, a tension gradient is generated at the boundary between the wafer surface and the liquid surface of the cleaning liquid, thereby pulling the cleaning liquid remaining on the wafer surface to the water surface, thereby achieving the purpose of complete drying.

[0003] When the wafer is lifted out of the cleaning liquid, a wafer clamping device is required to clamp the wafer outside the cleaning liquid. When the wafer is lifted to the upper part and leaves the cleaning liquid, the wafer disengages from the slide groove in the wafer lifting device that limits the horizontal movement of the wafer, and contacts with claws with a certain weight in the wafer clamping device. The claws can fix the wafer on both sides of the top of the wafer, and the claws can continue to move upward with the wafer until the wafer completely leaves the water surface. When the wafer completely leaves the water surface, the lower support plate will lift up to support the lower edge of the wafer, and the wafer lifting device will separate from the wafer and reset. The wafer is now clamped by the lower support plate and the upper claws. Then the wafer clamping device holds the wafer and flips it to a horizontal state. The wafer is then taken away by the robot to complete the wafer handover.

[0004] However, in the related art, after the wafer is taken away, the upper claw is in a free state. When the wafer clamping device flips back to an upright state to prepare for the next wafer handover, the upper claw will slide freely along the slide rail and hit the lower limit block to return to the initial position. The faster the flipping speed, the greater the impact force between the claw and the limit block. The strong impact will not only produce particles to contaminate the wafer and reduce the cleaning effect, but also produce noise and wear, reducing the service life of the wafer clamping device. Summary of the invention

[0005] The embodiments of the present application disclose a wafer clamping device and a wafer cleaning and drying device, which can slow down the falling speed of the clamping claws when the wafer clamping device is reset from a horizontal state to an upright state, reduce the generation of noise and wear, and avoid contamination of the wafer by particles generated by impact.

[0006] In order to achieve the above-mentioned purpose, in a first aspect, an embodiment of the present application discloses a wafer clamping device, which is used to clamp the wafer when the wafer lifting device lifts the wafer and leaves the cleaning liquid, and the wafer clamping device includes:

[0007] Bracket;

[0008] a first clamping member, the first clamping member being slidably connected to the bracket so that the first clamping member can slide between a first position and a second position, the first clamping member being located on a moving path of the wafer, and a sliding direction of the first clamping member being parallel to the moving path of the wafer, so that when the wafer is lifted, the first clamping member can be pushed from the first position to the second position;

[0009] a second clamping member, the second clamping member being connected to the bracket and disposed below the first clamping member, and when the first clamping member is pushed to the second position by the wafer, the second clamping member abuts against the wafer, so that the first clamping member and the second clamping member clamp the wafer;

[0010] A first buffer member, wherein the first buffer member is disposed on the first clamping member;

[0011] a second buffer, the second buffer being disposed on the bracket, and a magnetic resistance force being able to be formed between the first buffer and the second buffer, the magnetic resistance force being configured such that when the first clamping member falls back from the second position to the first position, the magnetic resistance force can slow down the falling speed of the first clamping member;

[0012] One of the first buffer and the second buffer is a non-magnetic metal member or a weakly magnetic metal member, and the other is a permanent magnetic member, or

[0013] One of the first buffer and the second buffer is an electromagnetic component, and the other is any one of a metal component, an electromagnetic component, and a permanent magnetic component.

[0014] As an optional implementation, a guide member is provided on the bracket, a sliding member is provided on the first clamping member, the guide member slidably cooperates with the sliding member, the guide member is arranged along the sliding direction of the first clamping member, and the second buffer member is parallel to the guide member.

[0015] As an optional implementation manner, the first buffer member and the second buffer member are spaced apart from each other, and a length of the second buffer member along the sliding direction of the first clamping member is greater than or equal to a distance between the first position and the second position.

[0016] As an optional embodiment, the wafer clamping device also includes an elastic component, which is arranged close to the first position and is located on the moving path of the first clamping member. When the elastic component contacts the first clamping member, the elastic component can provide a buffering force to the first clamping member in the opposite direction of the first clamping member falling back.

[0017] As an optional implementation, the elastic component includes:

[0018] A support seat, the support seat is connected to the bracket, and the support seat is provided with a mounting hole along the sliding direction of the first clamping member;

[0019] A support rod, the support rod comprising a contact portion and a support portion, the support portion is inserted into the mounting hole, and the contact portion is arranged at one end of the support portion facing the second position;

[0020] An elastic member, wherein the elastic member is sleeved on the support portion, one end of the elastic member abuts against the contact portion, and the other end of the elastic member abuts against the support seat;

[0021] When the first clamping member contacts the contact portion, the first clamping member can push the support rod to move so as to squeeze the elastic member.

[0022] As an optional implementation, the elastic member is a spring, the maximum buffering force provided by the spring is less than the gravity of the first clamping member, and the stiffness coefficient of the spring is 0.05N / mm-1N / mm.

[0023] As an optional implementation, the wafer clamping device also includes a flipping assembly, which is connected to the bracket to drive the bracket to flip between a first state and a second state. When the bracket is in the first state, the bracket is parallel to the moving path of the wafer.

[0024] As an optional implementation, the flip assembly includes:

[0025] a rotation axis extending perpendicular to a moving direction of the first clamping member;

[0026] A driving member connected to the rotating shaft to drive the bracket to flip around the axis of the rotating shaft;

[0027] A flexible member is arranged on the bracket, and the flexible member is arranged at one end of the guide member close to the first position. When the first clamping member contacts the flexible member, the flexible member can provide a buffering force to the first clamping member in the opposite direction of the falling direction of the first clamping member.

[0028] As an optional embodiment, the wafer clamping device also includes a pushing component, which is arranged on the bracket and abuts against the second clamping member. The pushing component can push the second clamping member to abut against the lower edge of the wafer when the first clamping member is pushed to the second position by the wafer.

[0029] As an optional implementation, the second clamping member is rotatably disposed on the bracket, and the pushing assembly includes:

[0030] a first telescopic member, the first telescopic member is disposed on the bracket, the first telescopic member abuts against a first end of the second clamping member, and when the first clamping member is pushed to the second position by the wafer, the first telescopic member can push the second clamping member to rotate so that the first end abuts against the wafer, and the first end is an end of the second clamping member away from the first clamping member;

[0031] A second telescopic member, the second telescopic member is arranged on the bracket, the second telescopic member is arranged above the first telescopic member along the sliding direction of the first clamping member, the second telescopic member can abut against the second end of the second clamping member, when the first clamping member moves from the first position to the second position, the second telescopic member can push the second clamping member to rotate so that the first end avoids the wafer, the second end is an end of the second clamping member close to the first clamping member, the first end and the second end of the second clamping member are respectively located on both sides of the rotation axis of the second clamping member.

[0032] In a second aspect, an embodiment of the present application discloses a wafer cleaning and drying device, comprising:

[0033] A cleaning box, wherein a cleaning liquid for cleaning wafers is provided in the cleaning box;

[0034] A wafer lifting device, the wafer lifting device is arranged in the cleaning box, and the wafer lifting device can lift the wafer;

[0035] a spray bar assembly, the spray bar assembly being configured to spray a gas capable of drying the wafer toward the intersection of the wafer and the liquid surface of the cleaning liquid when the wafer leaves the cleaning liquid;

[0036] The wafer clamping device described in the first aspect is arranged outside the cleaning box, and the wafer clamping device can clamp the wafer when the wafer leaves the cleaning liquid.

[0037] Compared with the prior art, the beneficial effects of this application are:

[0038] The wafer clamping device provided in the embodiment of the present application is configured such that a first buffer is arranged on the first clamping member, and a second buffer is arranged on the bracket corresponding to the first buffer. A magnetic resistance can be formed between the first buffer and the second buffer, and the device is configured such that the magnetic resistance is generated only when the first clamping member falls back from the second position to the first position. The magnetic resistance can slow down the falling speed of the first clamping member, thereby slowing down the falling speed of the first clamping member and reducing the impact and noise generated by the excessively fast falling speed of the first clamping member. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0040] Figure 1 A schematic diagram of the structure of a wafer clamping device disclosed in an embodiment of the present application;

[0041] Figure 2 A schematic structural diagram of a wafer clamping device disclosed in an embodiment of the present application from another perspective;

[0042] Figure 3 for Figure 1 A front view structural schematic diagram of a wafer clamping device;

[0043] Figure 4 for Figure 3 A schematic diagram of the structure of the elastic component in FIG.

[0044] Figure 5 for Figure 1 A schematic structural diagram of a wafer clamping device in which a first clamping member is located at a first position;

[0045] Figure 6 for Figure 1 A structural schematic diagram of a wafer clamping device in which a first clamping member moves from a first position to a second position;

[0046] Figure 7 for Figure 1 A schematic structural diagram of a support in a wafer clamping device when the support is in a second state;

[0047] Figure 8 for Figure 1 A schematic structural diagram of a second clamping member in a wafer clamping device in FIG. 1 when avoiding a wafer;

[0048] Fig. 9 for Figure 1 A schematic structural diagram of a second clamping member in a wafer clamping device clamping a wafer;

[0049] Fig.10 for Figure 1 Schematic diagram of the structure of the wafer cleaning and drying equipment.

[0050] Description of reference numerals:

[0051] 100-wafer clamping device; 10-wafer; 1-bracket; 11-guide member; 2-first clamping member; 3-second clamping member; 31-first end; 32-second end; 4-first buffer member; 5-second buffer member; 6-elastic component; 61-support seat; 611-mounting hole; 62-support rod; 621-support part; 622-contact part; 63-elastic member; 7-flipping component; 71-rotating axis; 72-driving member; 73-flexible member; 8-pushing component; 81-first telescopic member; 82-second telescopic member; 200-wafer cleaning and drying equipment; 201-cleaning box; 202-wafer lifting device; 203-slide. DETAILED DESCRIPTION

[0052] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0053] In the present application, the terms "upper", "lower", "top", "bottom", "inner", "vertical", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0054] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0055] In addition, the terms "disposed", "provided with", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0056] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0057] In the cleaning process after the wafer has undergone the chemical mechanical polishing (CMP) process, the wafer needs to be dried. In related technologies, when using the vertical Marangoni pull-and-dry technology to dry the wafer, the wafer is generally lifted from the cleaning liquid by a wafer lifting device until the wafer leaves the cleaning liquid. At the same time, a spray bar is provided outside the cleaning liquid, which sprays nitrogen containing a specific concentration of isopropyl alcohol toward the surface of the wafer. When the wafer leaves the cleaning liquid, a tension gradient will be generated at the boundary between the wafer surface and the liquid surface of the cleaning liquid, thereby pulling the cleaning liquid remaining on the surface of the wafer toward the water surface, ultimately achieving a completely dry effect.

[0058] During the process of the wafer being lifted out of the cleaning liquid, a wafer clamping device is required to clamp the wafer outside the cleaning liquid. When the wafer is lifted to the upper part and leaves the cleaning liquid, the wafer will detach from the wafer lifting device and contact the claws in the wafer clamping device. The claws can fix the wafer from the edges on both sides of the top of the wafer, and the claws can continue to move upward with the wafer until the wafer completely leaves the water surface. When the wafer completely leaves the water surface, the lower support plate will lift up to support the lower part of the wafer, and then the wafer lifting device will leave the wafer and reset. At this time, after the lower support plate and the upper claws clamp the wafer, the wafer clamping device will flip to a horizontal state, and then the robot will take away the wafer to complete the wafer handover.

[0059] In the related art, after the wafer is taken away, the upper claw is in a free state. When the wafer clamping device flips back to the upright state to prepare for the next wafer handover, the upper claw will slide freely along the slide rail, and then hit the lower limit block to return to the initial position. The faster the flipping speed, the greater the force of the impact between the claw and the limit block. This strong impact will not only produce particles to contaminate the wafer and reduce the cleaning effect, but also generate noise and cause wear, thereby shortening the service life of the wafer clamping device.

[0060] Based on this, the embodiments of the present application disclose a wafer clamping device and a wafer cleaning and drying device, which can slow down the falling speed of the clamping claws and reduce the generation of noise and wear when the wafer clamping device is reset from a horizontal state to an upright state.

[0061] The technical solution of the present application will be further described below in conjunction with embodiments and drawings.

[0062] See also Figure 1, Figure 2 and Figure 3 , Figure 1 It is a structural schematic diagram of a wafer clamping device 100 disclosed in an embodiment of the present application; Figure 2 It is a structural schematic diagram of the wafer clamping device 100 disclosed in the embodiment of the present application from another perspective; Figure 3 for Figure 1 FIG. 1 is a front view structural schematic diagram of the wafer clamping device 100 .

[0063] The embodiment of the present application discloses a wafer clamping device 100, which specifically includes:

[0064] Bracket 1;

[0065] A first clamping member 2, the first clamping member 2 is slidably connected to the bracket 1, so that the first clamping member 2 can slide between a first position and a second position, the first clamping member 2 is located on the moving path of the wafer 10, and the sliding direction of the first clamping member 2 is parallel to the moving path of the wafer 10, so that when the wafer 10 is lifted, the first clamping member 2 can be pushed from the first position to the second position;

[0066] The second clamping member 3 is connected to the bracket 1 and is disposed below the first clamping member 2. When the first clamping member 2 is pushed to the second position by the wafer 10, the second clamping member 3 abuts against the wafer 10, so that the first clamping member 2 and the second clamping member 3 clamp the wafer 10;

[0067] A first buffer member 4, the first buffer member 4 is disposed on the first clamping member 2;

[0068] The second buffer member 5 is arranged on the bracket 1, and a magnetic resistance force can be formed between the first buffer member 4 and the second buffer member 5. The magnetic resistance force is configured as follows: when the first clamping member 2 falls back from the second position to the first position, the magnetic resistance force can slow down the falling speed of the first clamping member 2.

[0069] Specifically, the support 1 is a basic structural component that supports and positions other components. Other components such as the first clamp 2, the second clamp 3, the first buffer 4 and the second buffer 5 are directly or indirectly connected to the support 1, and the support 1 provides a stable frame foundation for the wafer clamping device 100.

[0070] The first clamping member 2 can slide on the bracket 1 along a preset track. The first clamping member 2 is one of the components for clamping the wafer 10 and can contact the upper edge of the wafer 10 .

[0071] The second clamping member 3 is fixed on the bracket 1 and is another component for clamping the wafer 10. When the first clamping member 2 reaches the second position, the second clamping member 3 abuts against the lower edge of the wafer 10 and clamps the wafer 10 together with the first clamping member 2.

[0072] A magnetic resistance force can be formed between the first buffer member 4 and the second buffer member 5 .

[0073] In one embodiment, when the wafer 10 is ejected from the cleaning box 201 by the wafer lifting device 202, the wafer 10 contacts the first clamping member 2 located at the first position. When the wafer 10 is gradually lifted from the cleaning box 201 by the wafer lifting device 202, the wafer 10 pushes the first clamping member 2 to move from the first position to the second position.

[0074] In another embodiment, when the wafer 10 is lifted by the wafer lifting device 202 and completely leaves the cleaning box 201, the first clamping member 2 is pushed to the second position by the wafer 10, the second clamping member 3 abuts against the wafer 10 and cooperates with the first clamping member 2 to clamp the wafer 10, and the wafer lifting device 202 is separated from the wafer 10.

[0075] In one embodiment, when the wafer 10 is moved out from between the first clamp 2 and the second clamp 3 by the robot, the first clamp 2 falls freely due to the loss of the supporting force from the wafer 10, and a magnetic resistance is generated between the first buffer 4 and the second buffer 5 to slow down the falling speed of the first clamp 2.

[0076] In one embodiment, one of the first buffer 4 and the second buffer 5 is a permanent magnetic part, and the other is a non-magnetic metal part or a weakly magnetic metal part. When the wafer 10 pushes the first clamp 2 to move from the first position to the second position, the relative movement speed between the first buffer 4 and the second buffer 5 is slow, and no magnetic resistance is generated between the first buffer 4 and the second buffer 5.

[0077] When the wafer 10 is moved out from between the first clamp 2 and the second clamp 3 by the robot, the first clamp 2 falls freely due to the loss of the supporting force from the wafer 10. The first buffer 4 and the second buffer 5 have a faster falling speed due to the faster relative movement speed between the first buffer 4 and the second buffer 5, which generates a larger magnetic resistance, thereby slowing down the falling speed of the first clamp 2.

[0078] In another embodiment, one of the first buffer 4 and the second buffer 5 is an electromagnet, and the other is any one of metal, electromagnet, and permanent magnet. When the wafer 10 pushes the first clamp 2 to move from the first position to the second position, the electromagnet is powered off to make it non-magnetic, and no magnetic resistance is generated between the first buffer 4 and the second buffer 5.

[0079] When the wafer 10 is moved out from between the first clamp 2 and the second clamp 3 by the robot, the first clamp 2 falls freely due to the loss of the supporting force from the wafer 10, and the electromagnet is energized to make it magnetic, and magnetic resistance is generated between the first buffer 4 and the second buffer 5, thereby slowing down the falling speed of the first clamp 2. Exemplarily, taking the first buffer 4 as an electromagnet and the second buffer 5 as an electromagnet, when the first clamp 2 falls freely, the electromagnet is energized, and the first buffer 4 and the second buffer 5 are magnetically attracted to each other to generate magnetic resistance; taking the first buffer 4 as an electromagnet and the second buffer 5 as a permanent magnet or a magnetic metal as an example, when the first clamp 2 falls freely, the electromagnet is energized, and the first buffer 4 and the second buffer 5 are magnetically attracted to each other to generate magnetic resistance; taking the first buffer 4 as an electromagnet and the second buffer 5 as a non-magnetic metal or a weakly magnetic metal as an example, when the first clamp 2 falls freely, the electromagnet is energized, and the first buffer 4 and the second buffer 5 are magnetically attracted to each other to generate magnetic resistance.

[0080] In the wafer clamping device 100 provided in the embodiment of the present application, the first buffer 4 and the second buffer 5 are provided, and magnetic resistance can be generated between the first buffer 4 and the second buffer 5 to slow down the falling speed of the first clamp 2. In this way, the noise and wear generated by the first clamp 2 contacting the bracket 1 when falling are reduced, and the contamination of the wafer 10 by particles generated by the impact is reduced, thereby ensuring the quality of the wafer 10. Compared with the mechanical deceleration components such as the deceleration components or the clamping components, the non-contact buffer can ensure the service life of the first clamp 2 and the bracket 1.

[0081] It should be noted that one of the first buffer member 4 and the second buffer member 5 is a metal member, and the other is a magnetic member. The embodiment of the present application does not limit the selection of the first buffer member 4 and the second buffer member 5.

[0082] Specifically, see Figure 3 A guide member 11 is provided on the bracket 1, a sliding member is provided on the first clamping member 2, the guide member 11 is slidably matched with the sliding member, the guide member 11 is arranged along the sliding direction of the first clamping member 2, and the second buffer member 5 is parallel to the guide member 11.

[0083] Optionally, see Figure 1 , the length of the second buffer member 5 along the sliding direction of the first clamping member 2 is greater than or equal to the distance between the first position and the second position.

[0084] The distance between the first position and the second position is the moving distance of the first clamping member 2, that is, the moving distance of the first buffer member 4. If the length of the second buffer member 5 is smaller than the moving distance of the first clamping member 2, when the first clamping member 2 falls back from the second position to the first position, the relative motion trajectory of the first buffer member 4 and the second buffer member 5 is shortened, and the shortening of the relative motion trajectory of the first buffer member 4 and the second buffer member 5 will result in the first buffer member 4 and the second buffer member 5 being unable to provide magnetic resistance to the first clamping member 2 during the entire falling process of the first clamping member 2, thereby affecting the deceleration of the first clamping member 2.

[0085] If the length of the second buffer member 5 along the sliding direction of the first clamp member 2 is greater than or equal to the distance between the first position and the second position, it can be ensured that the first buffer member 4 and the second buffer member 5 provide magnetic resistance to the first clamp member 2 during the entire falling process of the first clamp member 2, thereby ensuring the deceleration effect of the first buffer member 4 and the second buffer member 5 on the first clamp member 2, thereby reducing collision and noise, and extending the service life of the first clamp member 2 and the bracket 1.

[0086] Optionally, the first buffer 4 and the second buffer 5 are spaced apart. It is understandable that if the first buffer 4 is in contact with the second buffer 5, the friction between the first buffer 4 and the second buffer 5 will affect the rising process of the wafer 10 during the process of the wafer 10 lifting the first clamp 2 from the first position to the second position, thereby making the surface pulling and drying effect of the wafer 10 worse. The first buffer 4 and the second buffer 5 are spaced apart to avoid the above problems. At the same time, during the fall back of the first clamp 2, magnetic resistance is generated between the first buffer 4 and the second buffer 5 to avoid the first clamp 2 from violently impacting the bracket 1.

[0087] See also Figures 1 to 6 , Figure 4 for Figure 3 A schematic structural diagram of the elastic component 6; Figure 5 for Figure 1 A schematic structural diagram of the wafer clamping device 100 when the first clamping member 2 is located at the first position;

[0088] Figure 6 for Figure 1 Schematic diagram of the structure when the first clamping member 2 in the wafer clamping device 100 moves from the first position to the second position. Optionally, the wafer clamping device 100 further includes an elastic component 6, which is arranged close to the first position and is located on the moving path of the first clamping member 2. When the elastic component 6 contacts the first clamping member 2, the elastic component 6 can provide a buffering force to the first clamping member 2 that is opposite to the falling direction of the first clamping member 2.

[0089] In one embodiment, see Figure 5When the first clamping member 2 is located at the first position, the first clamping member 2 contacts and squeezes the elastic component 6, and the elastic component 6 is deformed.

[0090] In one embodiment, see Figure 6 When the first clamping member 2 is pushed by the wafer 10 to move from the first position to the second position, the elastic component 6 gradually recovers its deformation as the first clamping member 2 moves.

[0091] In one embodiment, see Figure 3 When the first clamping member 2 is separated from the elastic component 6, the elastic component 6 remains stationary.

[0092] In one embodiment, after the wafer 10 is taken away by the robot, when the wafer clamping device 100 switches from the second state to the first state, the first clamping member 2 falls back from the second position to the first position, and when the first clamping member 2 contacts the elastic component 6, the elastic component 6 is squeezed by the first clamping member 2 and deformed, and the elastic component 6 provides a buffering force for the first clamping member 2 in the opposite direction of the falling direction of the first clamping member 2.

[0093] Among them, during the process of the first clamping member 2 falling back from the second position to the first position, the magnetic resistance between the first buffer member 4 and the second buffer member 5 can slow down its falling speed. In addition, the presence of the elastic component 6 can provide additional buffering force. The magnetic resistance and the buffering force of the elastic component 6 work together to more effectively reduce the falling speed of the first clamping member 2 and make the falling process smoother. Secondly, the elastic component 6 can absorb and disperse part of the energy of the first clamping member 2 when it falls back. When the first clamping member 2 contacts the elastic component 6, the elastic component 6 undergoes elastic deformation, converting the kinetic energy of the first clamping member 2 falling back into elastic potential energy and storing it, instead of directly transmitting the impact force to other components, thereby protecting the structural integrity of the wafer clamping device 100 and reducing the risk of damage caused by impact force.

[0094] On the other hand, the lifting device 202 moves at a constant speed to lift the wafer 10 away from the cleaning liquid surface. Before the wafer 10 is completely out of the cleaning liquid, Figure 5 The upper part of the wafer 10 shown first contacts the first clamping member 2 located at the first position. When the first clamping member 2 contacts the wafer 10, part of the gravity of the first clamping member 2 is borne by the elastic component 6. In the process of the wafer 10 pushing the first clamping member 2 from the first position to the separation of the first clamping member 2 and the elastic component 6, the gravity of the first clamping member 2 acting on the wafer 10 gradually increases. At the same time, the elastic component 6 gradually resets. When the elastic component 6 separates from the first clamping member 2, the entire gravity of the first clamping member 2 acts on the wafer 10.

[0095] Compared with the situation that the wafer 10 bears the entire gravity of the first clamping member 2 when in contact with the first clamping member 2, the elastic component 6 is provided to reduce the stress borne by the wafer 10 when in contact with the first clamping member 2, thereby ensuring that the contact portion 622 between the wafer 10 and the first clamping member 2 will not be damaged due to the excessive gravity of the first clamping member 2, and reducing the impact of the first clamping member 2 on the wafer 10 when in contact with the wafer 10, thereby reducing the impact on the lifting speed of the wafer 10, avoiding the change of the tension gradient at the boundary between the surface of the wafer 10 and the cleaning liquid surface caused by the drastic change of the lifting speed of the wafer 10, and avoiding liquid stains on the surface of the wafer 10, thereby ensuring the drying effect of the wafer 10 and improving the drying rate of the wafer 10.

[0096] Specifically, see Figure 4 , the elastic component 6 comprises:

[0097] A support seat 61, the support seat 61 is connected to the bracket 1, and the support seat 61 is provided with a mounting hole 611 along the sliding direction of the first clamping member 2;

[0098] The support rod 62 includes a contact portion 622 and a support portion 621. The support portion 621 is inserted into the mounting hole 611, and the contact portion 622 is disposed at one end of the support portion 621 facing the second position;

[0099] An elastic member 63, the elastic member 63 is sleeved on the support portion 621, one end of the elastic member 63 abuts against the contact portion 622, and the other end of the elastic member 63 abuts against the support seat 61;

[0100] When the first clamping member 2 contacts the contact portion 622 , the first clamping member 2 can push the support rod 62 to move so as to squeeze the elastic member 63 .

[0101] In one embodiment, see Figure 5 When the first clamping member 2 is located at the first position, the first clamping member 2 contacts the contact portion 622 and squeezes the elastic member 63, and the elastic member 63 undergoes maximum deformation.

[0102] In one embodiment, see Figure 6 When the first clamping member 2 is pushed by the wafer 10 from the first position to the second position, the elastic member 63 gradually recovers its deformation as the first clamping member 2 moves, and the support rod 62 moves upward as the elastic member 63 is reset.

[0103] In one embodiment, see Figure 3 When the first clamping member 2 is separated from the elastic component 6, the elastic member 63 recovers its deformation and remains stationary, and the support rod 62 returns to its natural state.

[0104] In one embodiment, after the wafer 10 is taken away by the robot, when the wafer clamping device 100 flips from the second state to the first state, the first clamping member 2 falls back from the second position to the first position, and when the first clamping member 2 contacts the contact portion 622 of the support rod 62, the elastic member 63 is squeezed by the first clamping member 2 and deformed, and the elastic member 63 provides a buffering force for the first clamping member 2 in the opposite direction of the falling direction of the first clamping member 2.

[0105] Among them, by setting the support rod 62, the elastic member 63 and the support seat 61, the buffering effect on the first clamping member 2 is achieved, so that the structure of the elastic component 6 is simple and compact, the complexity of the wafer clamping device 100 is reduced, and the cost is low, maintenance is convenient and simple, the reliability is high, and it can provide stable buffering force.

[0106] Optionally, the effect that the elastic component 6 can achieve can also be achieved by providing an air damper or mechanical friction.

[0107] It should be noted that the elastic member 63 may be a device such as a spring that can deform and restore the deformation, and the present application does not limit the selection of the elastic member 63 .

[0108] Optionally, the maximum buffering force provided by the elastic member 63 is less than the weight of the first clamping member 2. In a further embodiment, 0.9 times the weight of the first clamping member 2 ≤ the maximum buffering force provided by the elastic member 63 ≤ the weight of the first clamping member 2, preferably, 0.95 times the weight of the first clamping member 2 ≤ the maximum buffering force provided by the elastic member 63 ≤ the weight of the first clamping member 2. It can be understood that the maximum buffering force provided by the elastic member 63 when the maximum deformation occurs. Specifically, the elastic member 63 is a spring, and the stiffness coefficient of the spring can be 0.05N / mm-1N / mm, preferably, the stiffness coefficient of the spring can be 0.05N / mm-0.3N / mm.

[0109] In the above embodiment, the first clamping member 2 can fall back to the first position. During the lifting process of the wafer 10, the clamping effect of the first clamping member 2 on the wafer 10 is guaranteed. Moreover, during the process of the first clamping member 2 falling back to the first position, the buffering force provided by the elastic member 63 can reduce the impact force of the first clamping member 2 on the bracket 1.

[0110] In addition, when the first clamping member 2 is in the first position, the elastic member 63 can offset most of the weight of the first clamping member 2. During the lifting process of the wafer 10, it is ensured that the contact portion between the wafer 10 and the first clamping member 2 will not be damaged due to the excessive gravity of the first clamping member 2, and the distance between the detached position of the first clamping member 2 and the contact portion 622 and the first position is increased, thereby reducing the influence of the weight of the first clamping member 2 on the lifting speed of the wafer 10, avoiding the drastic change in the tension gradient at the boundary between the wafer surface and the cleaning liquid surface caused by the drastic change in the lifting speed of the wafer 10, and avoiding liquid stains on the surface of the wafer 10, thereby ensuring the drying effect of the wafer 10 and improving the drying rate of the wafer 10.

[0111] Optionally, Figure 1 and Figure 7 , Figure 7 for Figure 1 The wafer clamping device 100 is a schematic diagram of a structure when the support 1 is in the second state. The wafer clamping device 100 can also be provided with a flip assembly 7, and the flip assembly 7 is connected to the support 1 to drive the support 1 to flip between the first state and the second state. When the support 1 is in the first state, the support 1 is parallel to the moving path of the wafer 10.

[0112] in, Figure 1 The support 1 is in the first state, the wafer 10 is lifted by the wafer lifting device 202 and clamped by the wafer clamping device 100, Figure 7 The bracket 1 is in the second state. When the bracket 1 is in the second state, the bracket 1 clamps the wafer 10 in a horizontal state. The bracket 1 is driven by the flip component 7 to flip from the first state to the second state. When the bracket 1 is in the second state, the robot takes the wafer 10 away in the vertical direction.

[0113] In one embodiment, see Figure 1 When the wafer 10 is lifted by the wafer lifting device 202 and pushes the first clamping member 2 to move from the first position to the second position, the bracket 1 is in the first state.

[0114] In another embodiment, see Figure 7 When the wafer 10 pushes the first clamping member 2 to the second position, the second clamping member 3 abuts against the wafer 10, and the first clamping member 2 and the second clamping member 3 clamp the wafer 10. After the first clamping member 2 and the second clamping member 3 complete clamping the wafer 10, the flipping assembly 7 drives the bracket 1 to flip from the first state to the second state.

[0115] In one embodiment, after the wafer 10 is removed from the wafer clamping device 100 by the robot, the flipping assembly 7 drives the bracket 1 to flip and reset from the second state to the first state, and the first clamping member 2 falls back from the second position to the first position, so that the wafer clamping device 100 can perform the next wafer 10 clamping operation.

[0116] Among them, compared with the case where the bracket 1 is in the first state, the robot takes away the wafer 10. By setting the flip component 7 to drive the bracket 1 to flip to the second state, the robot only needs to take away the wafer 10 in the vertical direction, so that the unloading of the wafer 10 is more convenient and quick, thereby improving the unloading rate of the wafer 10.

[0117] Specifically, see Figure 3 , the flip assembly 7 comprises:

[0118] A rotating shaft 71, the rotating shaft 71 extends perpendicular to the moving direction of the first clamping member 2;

[0119] A driving member 72, the driving member 72 is connected to the rotating shaft 71 to drive the bracket 1 to flip around the axis of the rotating shaft 71;

[0120] The flexible member 73 is arranged on the bracket 1, and the flexible member 73 is arranged at one end of the guide member 11 close to the first position. When the first clamping member 2 contacts the flexible member 73, the flexible member 73 can provide a buffering force to the first clamping member 2 in the opposite direction of the falling direction of the first clamping member 2.

[0121] Among them, the flipping of the bracket 1 is realized by setting the rotating shaft 71 and the driving member 72, and the flipping angle and the motion trajectory can be realized by precise program control or mechanical design. Compared with manual operation, it can reduce labor costs, realize automation, and improve the efficiency of taking away the wafer 10. On the other hand, the flipping of the bracket 1 is realized by setting the driving member 72 and the rotating shaft 71, which has a simple structure, low cost, and low maintenance difficulty.

[0122] The above-mentioned flexible member 73 can cooperate with the first buffer member 4, the second buffer member 5 and the elastic component 6 to further avoid the collision between the first clamp member 2 and the bracket 1 when the first clamp member 2 falls back from the second position to the first position after flipping, thereby reducing the wear and noise between the first clamp member 2 and the bracket 1.

[0123] It should be noted that the above-mentioned driving member 72 can be a device such as a motor, a cylinder, etc. that can provide a rotational driving force, and the embodiment of the present application does not limit the selection of the driving member 72.

[0124] For example, in order to realize the driving of the second clamping member 3, a driving motor and a driving shaft may be provided, the second clamping member 3 is connected to the driving shaft, and the driving motor drives the driving shaft to rotate so as to rotate the second clamping member 3. Figure 2 , Figure 8 and Fig. 9 , Figure 8 for Figure 1 A schematic structural diagram of the second clamping member 3 in the wafer clamping device 100 when avoiding the wafer 10, Fig. 9 for Figure 1 The schematic diagram of the structure of the second clamping member 3 in the wafer clamping device 100 clamping the wafer 10. A pushing component 8 can also be provided in the wafer clamping device 100, the pushing component 8 is provided on the bracket 1, and the pushing component 8 abuts against the second clamping member 3. When the first clamping member 2 is pushed to the second position by the wafer 10, the pushing component 8 can push the second clamping member 3 to abut against the lower edge of the wafer 10.

[0125] Among them, when the first clamping member 2 is pushed to the second position by the wafer 10, the pushing component 8 can push the second clamping member 3 to abut against the lower edge of the wafer 10, and the second clamping member 3 cooperates with the first clamping member 2 to achieve simultaneous clamping of the upper and lower edges of the wafer 10. Compared with relying on only a single clamping member or an incomplete clamping method, this method of simultaneously clamping the upper and lower edges can more stably fix the wafer 10.

[0126] Specifically, the second clamping member 3 is rotatably disposed on the bracket 1, and the pushing assembly 8 includes:

[0127] A first telescopic member 81 is disposed on the bracket 1. The first telescopic member 81 abuts against the first end 31 of the second clamping member 3. When the first clamping member 2 is pushed to the second position by the wafer 10, the first telescopic member 81 can push the second clamping member 3 to rotate so that the first end 31 abuts against the wafer 10. The first end 31 is an end of the second clamping member 3 away from the first clamping member 2.

[0128] The second telescopic member 82 is arranged on the bracket 1. The second telescopic member 82 is arranged above the first telescopic member 81 along the sliding direction of the first clamping member 2. The second telescopic member 82 can abut against the second end 32 of the second clamping member 3. When the first clamping member 2 moves from the first position to the second position, the second telescopic member 82 can push the second clamping member 3 to rotate so that the first end 31 avoids the wafer 10. The second end 32 is one end of the second clamping member 3 close to the first clamping member 2. The first end 31 and the second end 32 of the second clamping member 3 are respectively located on both sides of the rotation axis of the second clamping member 3.

[0129] In one embodiment, see Figure 8 When the first clamping member 2 moves from the first position to the second position, the second telescopic member 82 pushes the second end 32 of the second clamping member 3 , so that the second clamping member 3 rotates to avoid the wafer 10 .

[0130] In another embodiment, see Fig. 9When the second clamping member 3 is pushed to the second position by the wafer 10, the second telescopic member 82 stops abutting and pushing the second clamping member 3, and the first telescopic member 81 pushes the first end 31 of the second clamping member 3, so that the second clamping member 3 rotates in the opposite direction of the above rotation, so that the second clamping member 3 abuts against the edge of the wafer 10 and cooperates with the first clamping member 2 to clamp the wafer 10.

[0131] Among them, on the one hand, the arrangement of the first telescopic member 81 and the second telescopic member 82 makes the rotation control of the second clamping member 3 more precise. The first telescopic member 81 can push the second clamping member 3 to rotate when the first clamping member 2 reaches the second position, so that the first end 31 of the second clamping member 3 abuts against the wafer 10, thereby clamping the wafer 10. The second telescopic member 82 can push the second clamping member 3 to rotate to avoid the wafer 10 when the first clamping member 2 moves from the first position to the second position, thereby ensuring the accurate clamping of the wafer 10 and avoiding collision or damage to the wafer 10 during operation.

[0132] On the other hand, when the first clamping member 2 moves from the first position to the second position, the second telescopic member 82 pushes the second clamping member 3 to rotate, so that the first end 31 avoids the wafer 10, thereby preventing the first end 31 of the second clamping member 3 from accidentally colliding with the wafer 10 during the movement of the first clamping member 2. During the processing of the wafer 10, an accidental collision may cause damage to the wafer 10. By providing the first telescopic member 81 and the second telescopic member 82, protection is provided for the wafer 10 in terms of the operation process.

[0133] Finally, compared with providing a motor and a rotating shaft 71 , providing the first telescopic member 81 and the second telescopic member 82 can save space, making the structure of the wafer clamping device 100 more compact and stable.

[0134] It should be noted that at least one of the first telescopic member 81 and the second telescopic member 82 is a cylinder, and the other of the first telescopic member 81 and the second telescopic member 82 is a spring or a cylinder. Taking the first telescopic member 81 and the second telescopic member 82 as an example, in the wafer clamping device 100, whether the first telescopic member 81 pushes the second clamping member 3 to rotate so that the first end 31 abuts against the wafer 10, or the second telescopic member 82 pushes the second clamping member 3 to rotate so that the first end 31 avoids the wafer 10, precise displacement control is required. Compared with a spring, a cylinder can achieve accurate control of the expansion and contraction amount according to a set air pressure value, thereby more accurately adjusting the position of the second clamping member 3 and ensuring the accuracy of the wafer 10 clamping operation.

[0135] Taking at least one of the first telescopic member 81 and the second telescopic member 82 as a cylinder, and the other of the first telescopic member 81 and the second telescopic member 82 as a spring as an example, the structure of the spring is relatively simple, the cost is low, and the cost can be saved. At the same time, the spring does not need to be equipped with auxiliary equipment such as an air source like a cylinder, which can save space and make the layout of the entire push assembly 8 more compact. And the spring has good buffering characteristics. When matched with the cylinder, for example, when the first telescopic member 81 is a cylinder and the second telescopic member 82 is a spring, the spring can play an auxiliary buffering role in the process of the cylinder pushing the second clamping member 3. When the second clamping member 3 rotates, the spring can absorb some of the impact forces that may be generated due to the cylinder pushing, so that the movement of the second clamping member 3 is more stable, reducing the impact on the wafer 10 and the wafer clamping device 100, and also can make up for the shortcomings of the cylinder in terms of buffering performance. The embodiment of the present application does not limit the selection of the first telescopic member 81 and the second telescopic member 82.

[0136] Second, see Fig.10 , Fig.10 for Figure 1 The present application embodiment discloses a wafer cleaning and drying device 200, comprising:

[0137] A cleaning box 201, wherein the cleaning box 201 is provided with a cleaning liquid for cleaning the wafer 10;

[0138] A wafer lifting device 202, which is disposed in the cleaning box 201 and can lift the wafer 10;

[0139] A spray bar assembly, wherein the spray bar assembly is configured to spray a gas capable of drying the wafer 10 toward the intersection of the wafer 10 and the liquid surface of the cleaning liquid when the wafer 10 leaves the cleaning liquid; in one embodiment, the gas is a mixture of isopropyl alcohol and nitrogen;

[0140] As in the wafer clamping device 100 of the first aspect described above, the wafer clamping device 100 is disposed outside the cleaning box 201 , and the wafer clamping device 100 can clamp the wafer 10 when the wafer 10 leaves the cleaning liquid.

[0141] In one embodiment, the wafer lifting device 202 gradually lifts the wafer 10 from the inside of the cleaning box 201 to the outside of the cleaning box 201. When the wafer 10 is lifted from the cleaning liquid to the surface of the cleaning liquid by the wafer lifting device 202, the wafer 10 contacts the wafer clamping device 100 and drives the first clamping member 2 of the wafer clamping device 100 to continue to move upward.

[0142] In another embodiment, the wafer lifting device 202 lifts the wafer 10 until it is completely out of the cleaning liquid, the wafer 10 is clamped by the first clamping member 2 and the second clamping member 3 of the wafer clamping device 100, the wafer lifting device 202 is separated from the wafer 10, and the wafer lifting device 202 is reset to the cleaning box 201.

[0143] It should be noted that when the wafer 10 is lifted up to the upper part and leaves the cleaning liquid, the wafer 10 is separated from the slide groove 203 in the wafer lifting device 202 that limits the horizontal movement of the wafer 10 .

[0144] Among them, the structure of the wafer clamping device 100 can be the same as the structure of any wafer clamping device 100 in the above embodiments, and can bring the same or similar beneficial effects. For details, please refer to the description of the wafer clamping device 100 in the above embodiments, and this embodiment will not be repeated here.

[0145] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer clamping device, used to clamp the wafer when the wafer lifting device lifts the wafer and leaves the cleaning liquid, characterized in that: The wafer clamping device comprises: Bracket; a first clamping member, the first clamping member being slidably connected to the bracket so that the first clamping member can slide between a first position and a second position, the first clamping member being located on a moving path of the wafer, and a sliding direction of the first clamping member being parallel to the moving path of the wafer, so that when the wafer is lifted, the first clamping member can be pushed from the first position to the second position; a second clamping member, the second clamping member being connected to the bracket and disposed below the first clamping member, and when the first clamping member is pushed to the second position by the wafer, the second clamping member abuts against the wafer, so that the first clamping member and the second clamping member clamp the wafer; A first buffer member, wherein the first buffer member is disposed on the first clamping member; The second buffer is arranged on the bracket, and a magnetic resistance can be formed between the first buffer and the second buffer, and the magnetic resistance is configured as follows: when the first clamp falls back from the second position to the first position, the magnetic resistance can slow down the falling speed of the first clamp.

2. The wafer clamping device according to claim 1, characterized in that: One of the first buffer and the second buffer is a non-magnetic metal member or a weakly magnetic metal member, and the other is a permanent magnetic member, or, One of the first buffer and the second buffer is an electromagnetic component, and the other is any one of a metal component, an electromagnetic component, and a permanent magnetic component.

3. The wafer clamping device according to claim 1, characterized in that: The bracket is provided with a guide member, the first clamping member is provided with a sliding member, the guide member and the sliding member are slidably matched, the guide member is arranged along the sliding direction of the first clamping member, and the second buffer member is parallel to the guide member.

4. The wafer clamping device according to claim 3, characterized in that: The first buffer member is spaced apart from the second buffer member, and a length of the second buffer member along a sliding direction of the first clamping member is greater than or equal to a distance between the first position and the second position.

5. The wafer clamping device according to claim 1, characterized in that: The wafer clamping device also includes an elastic component, which is arranged close to the first position and is located on the moving path of the first clamping member. When the elastic component contacts the first clamping member, the elastic component can provide a buffering force to the first clamping member in the opposite direction of the first clamping member falling back.

6. The wafer clamping device according to claim 5, characterized in that: The elastic component comprises: A support seat, the support seat is connected to the bracket, and the support seat is provided with a mounting hole along the sliding direction of the first clamping member; A support rod, the support rod comprising a contact portion and a support portion, the support portion is inserted into the mounting hole, and the contact portion is arranged at one end of the support portion facing the second position; An elastic member, wherein the elastic member is sleeved on the support portion, one end of the elastic member abuts against the contact portion, and the other end of the elastic member abuts against the support seat; When the first clamping member contacts the contact portion, the first clamping member can push the support rod to move so as to squeeze the elastic member.

7. The wafer clamping device according to claim 6, characterized in that: The elastic member is a spring, the maximum buffering force provided by the spring is less than the gravity of the first clamping member, and the stiffness coefficient of the spring is 0.05N / mm-1N / mm.

8. The wafer clamping device according to any one of claims 1 to 7, characterized in that: The wafer clamping device also includes a flipping assembly, which is connected to the bracket to drive the bracket to flip between a first state and a second state. When the bracket is in the first state, the bracket is parallel to the moving path of the wafer.

9. The wafer clamping device according to claim 8, characterized in that: The flip assembly comprises: a rotation axis extending perpendicular to a moving direction of the first clamping member; A driving member connected to the rotating shaft to drive the bracket to flip around the axis of the rotating shaft; A flexible member is arranged on the bracket, and the flexible member is arranged at one end of the guide member close to the first position. When the first clamping member contacts the flexible member, the flexible member can provide a buffering force to the first clamping member in the opposite direction of the falling direction of the first clamping member.

10. The wafer clamping device according to any one of claims 1 to 7, characterized in that: The wafer clamping device also includes a pushing component, which is arranged on the bracket and abuts against the second clamping member. When the first clamping member is pushed to the second position by the wafer, the pushing component can push the second clamping member to abut against the lower edge of the wafer.

11. The wafer clamping device according to claim 10, characterized in that: The second clamping member is rotatably disposed on the bracket, and the pushing assembly includes: a first telescopic member, the first telescopic member is disposed on the bracket, the first telescopic member abuts against a first end of the second clamping member, and when the first clamping member is pushed to the second position by the wafer, the first telescopic member can push the second clamping member to rotate so that the first end abuts against the wafer, and the first end is an end of the second clamping member away from the first clamping member; A second telescopic member, the second telescopic member is arranged on the bracket, the second telescopic member is arranged above the first telescopic member along the sliding direction of the first clamping member, the second telescopic member can abut against the second end of the second clamping member, when the first clamping member moves from the first position to the second position, the second telescopic member can push the second clamping member to rotate so that the first end avoids the wafer, the second end is an end of the second clamping member close to the first clamping member, the first end and the second end of the second clamping member are respectively located on both sides of the rotation axis of the second clamping member.

12. A wafer cleaning and drying device, characterized in that: include: A cleaning box, wherein a cleaning liquid for cleaning wafers is provided in the cleaning box; A wafer lifting device, the wafer lifting device is arranged in the cleaning box, and the wafer lifting device can lift the wafer; a spray bar assembly, the spray bar assembly being configured to spray a gas capable of drying the wafer toward the intersection of the wafer and the liquid surface of the cleaning liquid when the wafer leaves the cleaning liquid; The wafer clamping device as described in any one of claims 1 to 11 is arranged outside the cleaning box, and the wafer clamping device can clamp the wafer when the wafer leaves the cleaning liquid.

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