An intelligent wafer processing device

Abstract

The present invention relates to the technical field of wafer processing, and specifically relates to an intelligent wafer processing device, including a main body, on which a workbench is provided, and a cleaning head is movably arranged on the workbench. It also includes a water shield and a fixed column arranged at the center of the workbench. A support member for fixing and supporting the wafer is arranged inside the fixed column; an extension rod, a plurality of extension rods are arranged in a circumferential array outside the fixed column, and the plurality of extension rods are all slidably arranged outside the fixed column; an adaptive clamping assembly is arranged at the end of the extension rod, which can clamp the outer side of the wafer and cooperate with the support member to position the wafer during cleaning. This intelligent wafer processing device uses the alternating support of an electrostatic adsorption module and a support block, and through the cooperation of the extension rod and the pulling member, realizes the dynamic adjustment of the angle of the clamping plate, and can periodically expose the clamped side of the wafer, avoiding cleaning blind spots.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and particularly to an intelligent wafer processing device. Background Art

[0002] In the precision manufacturing process of semiconductor integrated circuit chips, the chemical mechanical planarization (CMP) processing step of wafers plays a crucial role. This step performs high-efficiency polishing on the wafer surface through the synergistic action of finely formulated abrasive slurry and specific chemical reagents, aiming to achieve a high degree of surface planarization. It belongs to the category of advanced wet process technologies. After the CMP process, the subsequent cleaning process is decisive for ensuring that the wafer surface is clean and free of impurities and avoiding defects in subsequent processes.

[0003] In the current cleaning process, the fixing methods of wafers are mainly divided into two main categories: One is the fixing method using an electrostatic chuck. With its advantages of uniform pressure distribution and effectively preventing wafer deformation, it is widely used in the industry. However, this fixing method has an inherent defect, that is, the area where the bottom of the wafer contacts the electrostatic chuck cannot be effectively cleaned, which may cause incomplete cleaning problems and affect the overall cleanliness of the wafer.

[0004] The other mainstream fixing method is to use a precisely designed jaw system to clamp the wafer. The advantage of this method is that it can achieve comprehensive coverage cleaning of the wafer surface, ensuring that the cleaning liquid can reach every corner of the wafer. However, the drawback is that the parts of the wafer clamped by the jaws are difficult to be effectively rinsed during the rinsing process, and when the particles carried by the fluid migrate outward during the rinsing process, they are often physically blocked by the jaws, resulting in the accumulation of particles at the clamping position. This not only reduces the cleaning efficiency but also may exacerbate the degree of wafer surface contamination, posing a potential threat to subsequent production processes. For this reason, we propose an intelligent wafer processing device. Summary of the Invention

[0005] To solve the above technical problems, an embodiment of the present application provides an intelligent wafer processing device, including a main body. A workbench is provided on the main body. A cleaning head is movably provided on the workbench. There are two cleaning heads and they are respectively located on the upper and lower sides of the wafer clamping station. It further includes:

[0006] A water baffle, which is provided on the workbench;

[0007] A fixing column, which is provided at the center of the workbench. A support member for fixing and supporting the wafer is provided inside the fixing column;

[0008] Extension rods. There are multiple extension rods and they are arranged in a circumferential array outside the fixing column. Multiple extension rods are all slidably provided outside the fixing column;

[0009] An adaptive clamping component is arranged at the end of the extension rod and can clamp the outer side of the wafer, cooperating with the support member to position the wafer during cleaning.

[0010] In some embodiments, a cavity is formed in the fixed column. The support member includes an electrostatic adsorption module and a support block. A plurality of the electrostatic adsorption modules and the support blocks are arranged in a staggered manner and are circumferentially arranged in the fixed column. The tops of the electrostatic adsorption module and the support block both slide through the top of the fixed column and extend to the outside thereof. A driving ring is rotatably arranged in the cavity. A plurality of convex blocks are arranged on the upper surface of the driving ring. When the driving ring rotates, the convex blocks are driven to rotate. When the convex blocks abut against the bottoms of the electrostatic adsorption module and the support block, they can lift them up.

[0011] In some embodiments, elastic members are arranged at the bottoms of both the electrostatic adsorption module and the support block. The bottom ends of the elastic members are connected to the bottom of the cavity. A reduction motor is arranged inside the fixed column. The output end of the reduction motor is connected to a driving shaft. The driving ring is fixedly connected to the outer side of the driving shaft.

[0012] In some embodiments, the elastic member is an elastic telescopic rod.

[0013] In some embodiments, a plurality of sliding grooves are formed on the outer side of the fixed column. One end of the extension rod is slidably arranged in the sliding groove. A magnetic block is embedded at the end of the extension rod. An electromagnet is arranged on the side wall of the sliding groove. When the electromagnet is energized, it can attract the magnetic block to drive the end of the extension rod to move towards the inside of the sliding groove. A connecting spring is arranged in the sliding groove. The two ends of the connecting spring are respectively fixedly connected to the extension rod and the side wall of the sliding groove.

[0014] In some embodiments, the adaptive clamping component includes a fixed cylinder fixedly arranged at the outer end of the extension rod. An installation block is fixedly arranged on the outer side of the fixed cylinder. A clamping plate is rotatably arranged on the installation block. The clamping plate is rotatably connected to the installation block through a rotating shaft. A plurality of flexible sheets are arranged on the surface of the clamping plate. Support springs are arranged on both the upper and lower sides of the installation block. The two ends of the support spring are respectively fixedly connected to the installation block and the clamping plate. Steel wires are fixedly arranged on both the upper and lower sides of the clamping plate. The ends of the steel wires penetrate through the installation block and the fixed cylinder and extend into the extension rod. A pulling member for pulling the steel wires is arranged in the extension rod.

[0015] In some embodiments, a moving groove is formed inside the outer end of the extension rod. The pulling member includes a moving block slidably disposed in the moving groove. One end of the moving block is provided with a return spring, and the other end of the return spring is fixedly connected to the inner wall of the moving groove. On both sides of the moving groove, a first sliding plate and a second sliding plate are respectively slidably disposed. A plurality of fixing rods are fixedly arranged in the moving groove. The first sliding plate and the second sliding plate are slidably disposed outside the fixing rods. Fixing springs are arranged at the bottoms of the first sliding plate and the second sliding plate, and the bottoms of the fixing springs are connected to the moving groove. The end of the steel wire connected to the upper end of the clamping plate is fixedly connected to the first sliding plate, and the end of the other steel wire is fixedly connected to the second sliding plate. Two connecting plates for driving the first sliding plate and the second sliding plate to move respectively are arranged at the end of the moving block. Top blocks are fixedly arranged at the bottoms of the two connecting plates, and the length of the connecting plate cooperating with the first sliding plate is greater than the length of the other connecting plate.

[0016] In some embodiments, a guide rod is fixedly arranged inside the fixed cylinder. Two groups of guide wheels are rotatably arranged on the guide rod. The two steel wires respectively bypass the two groups of guide wheels and are connected to the first sliding plate and the second sliding plate.

[0017] In some embodiments, the flexible sheet is made of silica gel.

[0018] In some embodiments, the water baffle is slidably arranged up and down on the workbench.

[0019] The present invention has at least the following beneficial effects:

[0020] 1. Omnidirectional cleaning: Through the cleaning head and the rotating structure of the workbench provided, the upper and lower sides of the wafer can be cleaned simultaneously, improving the cleaning efficiency. At the same time, by alternately supporting with the electrostatic adsorption module and the support block, the omnidirectional cleaning of the bottom of the wafer is realized, avoiding cleaning blind spots;

[0021] 2. Dynamic adjustment: Through the cooperation of the extension rod and the pulling member, the dynamic adjustment of the angle of the clamping plate is realized, and the side surface of the wafer clamped can be periodically exposed, enabling it to be comprehensively cleaned. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 is a schematic diagram of the partial structure of the present invention;

[0024] Figure 3 is a schematic diagram of the structure at the workbench of the present invention;

[0025] Figure 4 is a schematic diagram of the sectional structure of the fixed column of the present invention;

[0026] Figure 5Schematic diagram of the internal structure of the cavity of the present invention;

[0027] Figure 6 of the present invention Figure 5 Schematic diagram of the local explosion structure;

[0028] Figure 7 Schematic diagram of the local structure of the extension rod of the present invention;

[0029] Figure 8 of the present invention Figure 7 Schematic diagram of the sectional structure;

[0030] Figure 9 Schematic diagram of the sectional structure of the extension rod of the present invention;

[0031] Figure 10 Schematic diagram of the pulling member structure of the present invention;

[0032] Figure 11 Schematic diagram of the state where the wafer is clamped when the workbench of the present invention rotates at a low speed.

[0033] In the figure: 1 - main body; 2 - workbench; 3 - water shield; 4 - fixing column; 5 - support member; 51 - electrostatic adsorption module; 52 - support block; 53 - driving ring; 54 - bump; 55 - elastic member; 56 - driving shaft; 6 - extension rod; 7 - adaptive clamping assembly; 71 - fixing cylinder; 72 - mounting block; 73 - clamping plate; 74 - flexible sheet; 75 - support spring; 76 - steel wire; 8 - pulling member; 81 - moving block; 82 - return spring; 83 - slide plate one; 84 - slide plate two; 85 - fixing rod; 86 - fixing spring; 87 - connecting plate; 88 - top block; 9 - chute; 10 - magnetic block; 11 - electromagnet; 12 - connecting spring; 13 - moving groove; 14 - guiding rod; 15 - guiding wheel. Detailed implementation manners

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0035] Embodiment 1: Please refer to Figures 1-11, the present invention provides a technical solution: an intelligent wafer processing device, including a main body 1, on which a workbench 2 is provided. The workbench 2 is a rotary workbench 2, and its rotation structure is prior art and will not be elaborated here. A cleaning head is movably arranged on the workbench 2. There are two cleaning heads, which are respectively located on the upper and lower sides of the wafer clamping station, so that the upper and lower sides of the wafer can be cleaned during cleaning. There is also a water baffle 3 arranged on the workbench 2 to block the cleaning liquid during cleaning and prevent splashing. A fixing column 4 is arranged at the center of the workbench 2. A support member 5 for fixing and supporting the wafer is arranged inside the fixing column 4. A plurality of extension rods 6 are arranged outside the fixing column 4. The plurality of extension rods 6 are arranged in a circle, and the ends of the plurality of extension rods 6 are slidably arranged outside the fixing column 4. An adaptive clamping assembly 7 is arranged at the outer end of the extension rod 6, which can adjust the clamping state of the wafer according to the rotation speed of the workbench 2:

[0036] A cavity is formed inside the fixing column 4. The support member 5 includes an electrostatic adsorption module 51 and a support block 52. The electrostatic adsorption module 51 can adsorb and fix the bottom of the wafer by electrostatic adsorption. Its specific structure is prior art and will not be elaborated here. A plurality of electrostatic adsorption modules 51 and support blocks 52 are arranged alternately and are arranged in a circle inside the fixing column 4. The tops of the electrostatic adsorption module 51 and the support block 52 both slide through the top of the fixing column 4 and extend to the outside. A driving ring 53 is rotatably arranged inside the cavity. A plurality of bumps 54 are arranged on the upper surface of the driving ring 53. The number of bumps 54 is the same as that of the electrostatic adsorption module 51 and the support block 52. When the driving ring 53 rotates, it drives the bumps 54 to rotate. When the bumps 54 abut against the bottoms of the electrostatic adsorption module 51 and the support block 52, they can lift them up. Through the support of the bumps 54 on the support block 52 and the electrostatic adsorption module 51 respectively, the two can alternately support the bottom of the wafer during cleaning, so as to clean the wafer comprehensively.

[0037] Elastic members 55 are arranged at the bottoms of the electrostatic adsorption module 51 and the support block 52. The elastic members 55 are elastic telescopic rods, which can not only play an elastic support role for the two, but also ensure their stability during movement. The bottom ends of the elastic telescopic rods are connected to the bottom of the cavity. A reduction motor is arranged inside the fixing column 4. The output end of the reduction motor is connected to a driving shaft 56. The driving ring 53 is fixedly connected to the outside of the driving shaft 56;

[0038] The reduction motor drives the driving ring 53 to rotate through the driving shaft 56, and then drives the multiple bumps 54 on the driving ring 53 to rotate. When the bumps 54 rotate, the multiple bumps 54 will successively support the electrostatic adsorption module 51 and the support block 52 during the rotation process. When the bump 54 rotates to the bottom of the electrostatic adsorption module 51, it can lift the electrostatic adsorption module 51 to adsorb and fix the wafer. When the bump 54 rotates to the bottom of the support block 52, at this time the electrostatic adsorption module 51 stops working, and at the same time the support block 52 is lifted by the bump 54 to support the wafer, and cooperate with the adaptive clamping assembly 7 to complete the positioning of the wafer. It should be noted that when the rotation speed of the workbench 2 is relatively low, the support block 52 can be used to fix the wafer. When the rotation speed of the workbench 2 is relatively high, the electrostatic adsorption module 51 is required to adsorb and fix the wafer to ensure that the wafer will not shake or even deform due to high-speed rotation.

[0039] A plurality of sliding grooves 9 are formed on the outer side of the fixed column 4. One end of the extension rod 6 is slidably arranged in the sliding groove 9. A magnetic block 10 is embedded at the end of the extension rod 6. An electromagnet 11 is arranged on the side wall of the sliding groove 9. A connecting spring 12 is arranged in the sliding groove 9. Both ends of the connecting spring 12 are fixedly connected to the extension rod 6 and the side wall of the sliding groove 9 respectively. When the electromagnet 11 is energized, it can attract the magnetic block 10 to drive the end of the extension rod 6 to move towards the inside of the sliding groove 9, and then the extension rod 6 drives the adaptive clamping assembly 7 at its end to move towards the center of the workbench 2, thereby clamping the wafer disk.

[0040] The adaptive clamping assembly 7 includes a fixed cylinder 71 fixedly arranged at the outer end of the extension rod 6. An installation block 72 is fixedly arranged on the outer side of the fixed cylinder 71. A clamping plate 73 is rotatably arranged on the installation block 72. The clamping plate 73 is rotatably connected to the installation block 72 through a rotating shaft. A plurality of flexible sheets 74 are arranged on the surface of the clamping plate 73. The flexible sheets 74 are made of silica gel. Support springs 75 are arranged on both the upper and lower sides of the installation block 72. Both ends of the support springs 75 are fixedly connected to the installation block 72 and the clamping plate 73 respectively. Steel wires 76 are fixedly arranged on both the upper and lower sides of the clamping plate 73. The ends of the steel wires 76 penetrate through the installation block 72 and the fixed cylinder 71 and extend into the extension rod 6. A pulling member 8 for pulling the steel wires 76 is arranged in the extension rod 6. When the pulling member 8 pulls the steel wires 76, it can drive the clamping plate 73 to rotate, thereby changing the clamping angle of the wafer.

[0041] A moving groove 13 is formed inside the outer end of the extension rod 6. The pulling member 8 includes a moving block 81 slidably disposed in the moving groove 13. One end of the moving block 81 is provided with a return spring 82, and the other end of the return spring 82 is fixedly connected to the inner wall of the moving groove 13. A first sliding plate 83 and a second sliding plate 84 are respectively slidably disposed on both sides of the moving groove 13. A plurality of fixing rods 85 are fixedly disposed in the moving groove 13. The first sliding plate 83 and the second sliding plate 84 are slidably disposed outside the fixing rods 85. Fixed springs 86 are disposed at the bottoms of the first sliding plate 83 and the second sliding plate 84, and the bottoms of the fixed springs 86 are connected to the moving groove 13. The end of the steel wire 76 connected to the upper end of the clamping plate 73 is fixedly connected to the first sliding plate 83, and the end of the other steel wire 76 is fixedly connected to the second sliding plate 84. Two connecting plates 87 for driving the first sliding plate 83 and the second sliding plate 84 to move respectively are disposed at the end of the moving block 81. Top blocks 88 are fixedly disposed at the bottoms of the two connecting plates 87, and the length of the connecting plate 87 cooperating with the first sliding plate 83 is greater than the length of the other connecting plate 87;

[0042] During cleaning, the workbench 2 rotates to drive the fixed column 4 to rotate. At this time, the extension rod 6 will also rotate accordingly. When it rotates, under the action of centrifugal force, the moving block 81 inside it will also move along the moving groove 13, and the moving distance is related to the rotation speed of the workbench 2. The greater the rotation speed, the farther the moving block 81 moves. When the moving block 81 moves, it can drive the connecting plate 87 and the top block 88 to move. When the top block 88 moves to contact the first sliding plate 83 and the second sliding plate 84, it can drive the first sliding plate 83 and the second sliding plate 84 to move downward, and then pull the steel wire 76 to drive the clamping plate 73 to rotate;

[0043] And because the lengths of the two connecting plates 87 are inconsistent, the longer connecting plate 87 will drive the top block 88 at its end to contact the first sliding plate 83 first. The first sliding plate 83 drives the upper end of the clamping plate 73 to rotate through the steel wire 76. At this time, the rotation speed of the workbench 2 is relatively small. When the rotation speed of the workbench 2 continues to increase, the longer connecting plate 87 drives the top block 88 on it to cross the first sliding plate 83, and the other connecting plate 87 drives the top block 88 on it to abut against the second sliding plate 84, and then drives the lower end of the clamping plate 73 to rotate through the steel wire 76. When the clamping plate 73 is pulled by the steel wire 76 at its upper end, at this time, the angle formed by the upper half of the clamping plate 73 and the wafer is an obtuse angle. On the contrary, when the clamping plate 73 is pulled by the steel wire 76 at its lower end, at this time, the angle formed by the upper half of the clamping plate 73 and the wafer is an acute angle. In this way, by adjusting the angle of the clamping plate 73, the side surface of the wafer clamped can be periodically exposed, so that it can be cleaned. And when the rotation speed of the workbench 2 is relatively large, at this time, the electrostatic adsorption module 51 fixes the bottom of the wafer, and at the same time, the angle formed by the upper half of the clamping plate 73 and the wafer is an acute angle, achieving a better clamping effect and avoiding the dislocation of the wafer.

[0044] A guide rod 14 is fixedly arranged inside the fixed cylinder 71. Two sets of guide wheels 15 are rotatably arranged on the guide rod 14. Two steel wires 76 respectively bypass the two sets of guide wheels 15 and are connected to the first slide plate 83 and the second slide plate 84, which can reduce the wear of the steel wires 76 and make the pulling more smooth.

[0045] This intelligent wafer processing device drives the wafer to rotate through the rotary workbench 2, and at the same time, the cleaning heads on the upper and lower sides clean the wafer. During the cleaning process, the electrostatic adsorption module 51 and the support block 52 in the fixed column 4 achieve alternating support through the cooperation of the driving ring 53 and the convex block 54, ensuring that the bottom of the wafer is cleaned comprehensively. At the same time, the adaptive clamping component 7 on the extension rod 6 automatically adjusts the clamping state according to the rotation speed of the workbench 2, and realizes the dynamic adjustment of the angle of the clamping plate 73 through the cooperation of the pulling member 8 and the steel wire 76, so that the side part of the wafer clamped can also be cleaned. The whole device realizes the intelligent, efficient and comprehensive cleaning of the wafer.

[0046] Embodiment 2: The main structure of Embodiment 2 is the same as that of Embodiment 1. The difference is that in Embodiment 2, the water baffle 3 is slidably arranged up and down on the workbench 2, and a driving source capable of driving the water baffle 3 to move up and down is arranged inside the workbench 2. This driving source can be an electric push rod or other driving elements with linear motion characteristics.

[0047] Through the movable design of the water baffle 3, the movement process of the manipulator can be simplified. During the cleaning and processing of the wafer, generally, a manipulator needs to be used to transfer the wafer between various processes. If the water baffle 3 is designed as a fixed type, then the manipulator needs to move the end into the water baffle 3 to clamp the wafer, and an additional vertical motion driving module needs to be added to the manipulator to enable the manipulator to extend into the water baffle 3. Therefore, the water baffle 3 is set as a movable type. In this way, during the loading and unloading process of the wafer, the water baffle 3 can be retracted, and the manipulator can directly translate to clamp the wafer, improving the work efficiency.

[0048] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0049] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. An intelligent wafer processing device, comprising a main body (1), a workbench (2) is arranged on the main body (1), a cleaning head is movably arranged on the workbench (2), and there are two cleaning heads which are respectively located on the upper and lower sides of the wafer clamping station, and it is characterized in that: It further includes: A water baffle (3) arranged on the workbench (2); A fixed column (4) arranged at the center of the workbench (2), and a support member (5) for fixing and supporting the wafer is arranged inside the fixed column (4); Extension rods (6), multiple extension rods (6) are arranged and circumferentially arrayed outside the fixed column (4), and multiple extension rods (6) are all slidably arranged outside the fixed column (4); An adaptive clamping assembly (7) arranged at the end of the extension rod (6), which can clamp the outer side of the wafer and cooperate with the support member (5) to position the wafer during cleaning; A cavity is formed inside the fixed column (4), the support member (5) includes an electrostatic adsorption module (51) and a support block (52), multiple electrostatic adsorption modules (51) and support blocks (52) are arranged alternately and circumferentially inside the fixed column (4), the tops of the electrostatic adsorption module (51) and the support block (52) both slidably penetrate through the top of the fixed column (4) and extend to the outside thereof, a driving ring (53) is rotatably arranged inside the cavity, multiple bumps (54) are arranged on the upper surface of the driving ring (53), when the driving ring (53) rotates, the bumps (54) are driven to rotate, and when the bumps (54) abut against the bottoms of the electrostatic adsorption module (51) and the support block (52), they can lift them up.

2. The intelligent wafer processing device according to claim 1, wherein: Elastic members (55) are arranged at the bottoms of both the electrostatic adsorption module (51) and the support block (52), the bottom ends of the elastic members (55) are connected to the bottom of the cavity, a reduction motor is arranged inside the fixed column (4), the output end of the reduction motor is connected to a driving shaft (56), and the driving ring (53) is fixedly connected to the outside of the driving shaft (56).

3. The intelligent wafer processing device according to claim 2, wherein: The elastic member (55) is an elastic telescopic rod.

4. The intelligent wafer processing device according to claim 1, wherein: Multiple sliding grooves (9) are formed outside the fixed column (4), one end of the extension rod (6) is slidably arranged inside the sliding groove (9), a magnetic block (10) is embedded at the end of the extension rod (6), an electromagnet (11) is arranged on the side wall of the sliding groove (9), when the electromagnet (11) is energized, it can attract the magnetic block (10) to drive the end of the extension rod (6) to move towards the inside of the sliding groove (9), and a connecting spring (12) is arranged inside the sliding groove (9), and both ends of the connecting spring (12) are fixedly connected to the extension rod (6) and the side wall of the sliding groove (9) respectively.

5. The intelligent wafer processing device according to claim 1, wherein: The adaptive clamping assembly (7) includes a fixed cylinder (71) fixedly arranged at the outer end of the extension rod (6). An installation block (72) is fixedly arranged on the outer side of the fixed cylinder (71). A clamping plate (73) is rotatably arranged on the installation block (72). The clamping plate (73) is rotatably connected to the installation block (72) through a rotating shaft. A plurality of flexible sheets (74) are arranged on the surface of the clamping plate (73). Support springs (75) are arranged on both the upper and lower sides of the installation block (72). Both ends of the support springs (75) are fixedly connected to the installation block (72) and the clamping plate (73) respectively. Steel wires (76) are fixedly arranged on both the upper and lower sides of the clamping plate (73). The ends of the steel wires (76) penetrate through the installation block (72) and the fixed cylinder (71) and extend into the extension rod (6). A pulling member (8) for pulling the steel wires (76) is arranged in the extension rod (6).

6. The intelligent wafer processing device according to claim 5, wherein: A moving groove (13) is formed inside the outer end of the extension rod (6). The pulling member (8) includes a moving block (81) slidably arranged in the moving groove (13). One end of the moving block (81) is provided with a return spring (82). The other end of the return spring (82) is fixedly connected to the inner wall of the moving groove (13). A first sliding plate (83) and a second sliding plate (84) are respectively slidably arranged on both sides of the moving groove (13). A plurality of fixed rods (85) are fixedly arranged in the moving groove (13). The first sliding plate (83) and the second sliding plate (84) are slidably arranged on the outer sides of the fixed rods (85). Fixed springs (86) are arranged at the bottoms of the first sliding plate (83) and the second sliding plate (84). The bottoms of the fixed springs (86) are connected to the moving groove (13). The end of the steel wire (76) connected to the upper end of the clamping plate (73) is fixedly connected to the first sliding plate (83). The end of the other steel wire (76) is fixedly connected to the second sliding plate (84). Two connecting plates (87) for driving the first sliding plate (83) and the second sliding plate (84) to move respectively are arranged at the end of the moving block (81). Top blocks (88) are fixedly arranged at the bottoms of the two connecting plates (87). The length of the connecting plate (87) cooperating with the first sliding plate (83) is greater than the length of the other connecting plate (87).

7. The intelligent wafer processing device according to claim 6, wherein: A guide rod (14) is fixedly arranged in the fixed cylinder (71). Two groups of guide wheels (15) are rotatably arranged on the guide rod (14). The two steel wires (76) respectively bypass the two groups of guide wheels (15) and are connected to the first sliding plate (83) and the second sliding plate (84).

8. The intelligent wafer processing device according to claim 5, wherein: The flexible sheet (74) is made of silica gel material.

9. The intelligent wafer processing device according to claim 1, wherein: The water baffle (3) is slidably arranged up and down on the workbench (2).

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