Missile-borne antenna and missile-borne device

Abstract

The invention relates to a missile-borne antenna and a missile-borne device. The missile-borne antenna comprises an antenna reflecting plate; each first antenna comprises a first dielectric layer, a first radiation patch and a first circuit board, the first dielectric layer is located on one side of the first circuit board, and the first radiation patch is located on the side, away from the first circuit board, of the first dielectric layer; the first radiation patch is used for receiving a first feed signal through the first antenna feed pin so as to transmit a first satellite positioning signal under the excitation of the first feed signal; the second antenna comprises at least one second radiation branch knot and a second circuit board, each second radiation branch knot is located on one side of the second circuit board, each second radiation branch knot is spiral, and the extending direction of each second radiation branch knot is perpendicular to the plane where the second circuit board is located; and the second radiation branch knot is used for receiving a second feed signal so as to transmit a second satellite positioning signal under the excitation of the second feed signal. The missile-borne device comprises the missile-borne antenna.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a missile-borne antenna and a missile-borne device. Background Art

[0002] With the development of satellite navigation technology and the successful networking of Beidou III in recent years, Beidou navigation technology has been widely used in both military and civilian fields. At present, navigation antennas are easily interfered in complex environments. Therefore, navigation antennas need to have anti-interference performance to face some specific application environments, thereby ensuring that they still have certain navigation and positioning functions in a cluttered signal environment.

[0003] At present, in navigation antennas, array antennas are still the main form for realizing anti-interference functions, among which microstrip antennas still occupy the mainstream position in conventional array arrangements. By arranging anti-interference array antennas with microstrip antennas, the conventional practice is to set the array spacing to half the wavelength of air at the corresponding frequency. However, due to the high integration requirements for Beidou antennas today, antenna reflectors with smaller areas have emerged. However, in antenna reflectors with smaller areas, the coupling between antenna array elements will become stronger due to the smaller spacing between microstrip antennas, and will also cause interference with the anti-interference capability. Summary of the invention

[0004] Based on this, it is necessary to provide a missile-borne antenna and a missile-borne device that can improve anti-interference capabilities.

[0005] In a first aspect, the present application provides a missile-borne antenna. The missile-borne antenna comprises:

[0006] Antenna reflector;

[0007] At least one first antenna, each first antenna comprising a first dielectric layer, a first radiation patch and a first circuit board, the first dielectric layer being located on one side of the first circuit board, and the first radiation patch being located on a side of the first dielectric layer away from the first circuit board; the first radiation patch being used to receive a first feed signal through a first antenna feed needle, so as to transmit a first satellite positioning signal under the stimulation of the first feed signal;

[0008] The second antenna comprises at least one second radiating branch and a second circuit board, each second radiating branch is located on one side of the second circuit board, each second radiating branch is spiral and extends in a direction perpendicular to the plane where the second circuit board is located; the second radiating branch is used to receive a second feed signal, so as to transmit a second satellite positioning signal under the stimulation of the second feed signal;

[0009] Among them, each first antenna and second antenna is located on the reflection surface of the antenna reflection plate; the first antenna feed needle passes through the first dielectric layer and is welded on the first circuit board, and the second radiation branch is welded on the second circuit board.

[0010] In a second aspect, the present application provides a missile-borne device, which includes any missile-borne antenna according to the first aspect of the present application.

[0011] The above-mentioned missile-borne antenna and missile-borne device, the missile-borne antenna includes: an antenna reflector; at least one first antenna, each first antenna includes a first dielectric layer, a first radiation patch and a first circuit board, the first dielectric layer is located on one side of the first circuit board, and the first radiation patch is located on the side of the first dielectric layer away from the first circuit board; the first radiation patch is used to receive a first feed signal through a first antenna feed needle, so as to transmit a first satellite positioning signal under the excitation of the first feed signal; a second antenna, including at least one second radiation branch and a second circuit board, each second radiation branch is located on one side of the second circuit board, each second radiation branch is spiral and the extension direction is perpendicular to the plane where the second circuit board is located; the second radiation branch is used to receive a second feed signal, so as to transmit a second satellite positioning signal under the excitation of the second feed signal; wherein each first antenna and the second antenna are located on the reflecting surface of the antenna reflector; the first antenna feed needle is welded on the first circuit board after passing through the first dielectric layer, and the second radiation branch is welded on the second circuit board. The missile-borne antenna provided in the embodiment of the present application comprises a second antenna arranged on an antenna reflector plate, wherein each second radiating branch is spiral-shaped and the extension direction is perpendicular to the plane of the second circuit board of the second antenna. Thus, the coupling degree between the second antenna and at least one first antenna is reduced, and the low elevation angle gain of the second antenna is significantly improved, thereby improving the low elevation angle anti-interference capability of the missile-borne antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 A schematic diagram of the structure of a missile-borne antenna provided in an embodiment of the present application;

[0014] Figure 2 A schematic diagram of the structure of a missile-borne antenna provided in an embodiment of the present application. DETAILED DESCRIPTION

[0015] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0017] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0018] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0019] It can be understood that “at least one” means one or more, “plurality” means two or more, and “at least part of an element” means part or all of an element.

[0020] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0021] This application is made by the inventor based on the recognition and research of the following issues:

[0022] At present, in navigation antennas, array antennas are still the main form for realizing anti-interference functions, among which microstrip antennas still occupy the mainstream position in conventional array arrangements. By arranging anti-interference array antennas with microstrip antennas, the conventional practice is to set the array spacing to the half-wavelength of air at the corresponding frequency. However, within the reflection surface of the antenna reflector with a relatively small area size, the coupling degree between the antenna array elements will become stronger as the center spacing between the antenna array elements becomes smaller. At the same time, the coupling degree between the antenna array elements also has a great influence on the anti-interference ability of the array antenna. In addition, the low elevation gain of the microstrip antenna is low, but in the case where the array antenna is a missile-borne antenna, a better low elevation gain can be more conducive to improving the anti-interference ability of the missile-borne device equipped with the missile-borne antenna during flight. Therefore, how to reduce the coupling degree between the antenna array elements on a reflection surface with a smaller area size while increasing the low elevation gain to enhance the anti-interference ability of the antenna has become an urgent problem to be solved.

[0023] Based on this, an embodiment of the present application provides a missile-borne antenna. Figure 1 As shown, the missile-borne antenna of one embodiment includes:

[0024] Antenna reflector 10.

[0025] At least one first antenna 20, each first antenna 20 includes a first dielectric layer 202, a first radiation patch 204 and a first circuit board 206, the first dielectric layer 202 is located on one side of the first circuit board 206, and the first radiation patch 204 is located on the side of the first dielectric layer 202 away from the first circuit board 206; the first radiation patch 204 is used to receive a first feed signal through a first antenna feed needle 208, so as to transmit a first satellite positioning signal under the excitation of the first feed signal.

[0026] The second antenna 30 includes at least one second radiating branch node 302 and a second circuit board 304. Each second radiating branch node 302 is located on one side of the second circuit board 304. Each second radiating branch node 302 is spiral-shaped and extends in a direction perpendicular to the plane where the second circuit board 304 is located. The second radiating branch node 302 is used to receive a second feed signal to transmit a second satellite positioning signal under the excitation of the second feed signal.

[0027] The first antenna 20 and the second antenna 30 are located on the reflection surface of the antenna reflector 10 ; the first antenna feed pin 208 passes through the first dielectric layer 202 and is welded on the first circuit board 206 ; the second radiation branch 302 is welded on the second circuit board 304 .

[0028] Among them, the antenna reflector 10 includes a reflecting surface and a back surface; the reflecting surface refers to the part of the antenna reflector 10 used to reflect radio waves. Specifically, the reflecting surface is used to concentrate and reflect the electromagnetic waves emitted by the missile-borne antenna in a specific direction, and / or reflect the received electromagnetic waves back to the missile-borne antenna; the back surface is used as a structural support for the entire antenna reflector 10, providing the antenna reflector 10 with the necessary strength and rigidity to maintain the shape and stability of the antenna reflector 10.

[0029] Optionally, the first antenna 20 is a rectangular microstrip antenna, and accordingly, the first dielectric layer 202 can be a rectangular dielectric layer, the first radiation patch 204 can be a rectangular radiation patch, and the first circuit board 206 can be a rectangular circuit board. Optionally, in the case where the first antenna 20 is a rectangular microstrip antenna, the first antenna 20 can be a rounded rectangular microstrip antenna, a rectangular microstrip antenna with corners cut off, and further optionally, the rounded rectangular microstrip antenna can be a rectangular microstrip antenna with the rounded corners on the same side minus or other shapes, and the rectangular microstrip antenna with corners cut off can be a rectangular microstrip antenna with the corners on the same side cut off or other shapes. Optionally, the shapes of the first dielectric layer 202, the first radiation patch 204, and the first circuit board 206 can be the same or different.

[0030] Specifically, the second antenna 30 is a helical antenna, and thus, the second radiating branch 302 is a radiating branch in a helical shape and extending in a direction perpendicular to the plane where the second circuit board 304 is located. Optionally, the second circuit board 304 may be a circular circuit board, and further optionally, at least one notch may be provided at an edge position on the second circuit board 304, and thus, the second circuit board 304 may be welded to the reflecting surface of the antenna reflector 10 by soldering at the notch, so as to realize welding the second antenna 30 to the reflecting surface of the antenna reflector 10.

[0031] Specifically, the first circuit board 206 and the second circuit board 304 are respectively the physical basis and the electrical basis of the first antenna 20 and the second antenna 30, and the first circuit board 206 and the second circuit board 304 respectively provide the necessary mechanical support function and the electrical connection function for the first antenna 20 and the second antenna 30. Optionally, the first circuit board 206 and the second circuit board 304 can be manufactured using printed circuit technology, and the first circuit board 206 and the second circuit board 304 can be arranged with copper foil traces, pads, through holes and surface mount components, etc., to respectively realize the electrical connection between the first antenna 20 and the external circuit providing the first feed signal, and the second antenna 30 and the external circuit providing the second feed signal.

[0032] Optionally, a first ground patch is provided on the side of the first circuit board 206 away from the first radiation patch 204, and the shape of the first ground patch is the same as that of the first circuit board 206. For example, when the first antenna 20 is a rectangular microstrip antenna, the first ground patch is a rectangular ground patch; a second ground patch is provided on the side of the second circuit board 304 away from the second radiation branch 302, and the shape of the second ground patch is the same as that of the second circuit board 304. For example, when the second circuit board 304 is a circular circuit board, the second ground patch is a circular ground patch. It should be noted that the first ground patch and the second ground patch are the "ground" of the feeding network of the first circuit board 206 and the "ground" of the feeding network of the second circuit board 304, respectively.

[0033] Optionally, the number of the first antennas 20 may be seven, and the number of the second antenna 30 may be one. Thus, the seven first antennas 20 serve as peripheral antenna array elements of the missile-borne antenna, and the second antenna 30 serves as the central antenna array element of the missile-borne antenna.

[0034] Optionally, the first radiation patch 204 is a metal layer on the surface of the first dielectric layer 202. Further optionally, when the first radiation patch 204 is a metal layer on the surface of the first dielectric layer 202, the first radiation patch 204 may be coated on the surface of the first dielectric layer 202, or the first radiation patch 204 may be aligned and nested on the surface of the first dielectric layer 202.

[0035] Optionally, the first antenna feed needle 208 is sleeved in the dielectric tube, passes through the first dielectric layer 202 , and is then welded on the first circuit board 206 .

[0036] Specifically, the first antenna feed needle 208 passes through the first dielectric layer 202 and is then soldered to the feed network of the first circuit board 206 .

[0037] Optionally, the second radiation branch 302 can be welded on the second circuit board 304. In order to further fix the second radiation branch 302 on the second circuit board 304 more stably, at least one groove can be provided on the second circuit board 304, so that each second radiation branch 302 can be inserted into each groove, and then the second radiation branch 302 can be welded on the second circuit board 304 through each groove, so that each second radiation branch 302 can be connected to the second circuit board 304 while achieving the connection between each second radiation branch 302 and the second circuit board 304, and each second radiation branch 302 can be more stably fixed on the second circuit board 304. Specifically, each second radiation branch 302 is connected to the feeding network of the second circuit board 304.

[0038] Optionally, the number of second radiating branches 302 can be four, so that the second antenna 30 is a four-arm helical antenna; further, when grooves are provided on the second circuit board 304, the number of grooves is the same as the number of second radiating branches 302, that is, four, so that four spiral radiating branches can be respectively inserted into the four grooves to connect the four radiating branches to the feeding network of the second circuit board 304 respectively.

[0039] Optionally, the frequency band of the first satellite positioning signal and the frequency band of the second satellite positioning signal may be the same.

[0040] Specifically, the distances between the second radiation branches 302 are the same. In other words, at least one second radiation branch 302 is symmetrically disposed on one side of the second circuit board 304 .

[0041] Specifically, since each second radiating branch 302 is spiral and extends in a direction perpendicular to the plane where the second circuit board 304 is located, the second antenna 30 changes the direction of the radiation current to reduce the coupling degree between the second antenna 30 and each first antenna 20. Therefore, the embodiment of the present application can greatly improve the low-elevation-angle radiation gain of the second antenna 30 by adopting a spiral second antenna 30, so as to enhance the anti-interference capability of the missile-borne antenna at low elevation angles.

[0042] The above-mentioned missile-borne antenna includes: an antenna reflector; at least one first antenna, each first antenna includes a first dielectric layer, a first radiation patch and a first circuit board, the first dielectric layer is located on one side of the first circuit board, and the first radiation patch is located on the side of the first dielectric layer away from the first circuit board; the first radiation patch is used to receive a first feed signal through a first antenna feed needle, so as to transmit a first satellite positioning signal under the excitation of the first feed signal; a second antenna, including at least one second radiation branch and a second circuit board, each second radiation branch is located on one side of the second circuit board, each second radiation branch is spiral and the extension direction is perpendicular to the plane where the second circuit board is located; the second radiation branch is used to receive a second feed signal, so as to transmit a second satellite positioning signal under the excitation of the second feed signal; wherein, each first antenna and the second antenna are located on the reflecting surface of the antenna reflector; the first antenna feed needle is welded on the first circuit board after passing through the first dielectric layer, and the second radiation branch is welded on the second circuit board. The missile-borne antenna provided in the embodiment of the present application comprises a second antenna arranged on an antenna reflector plate, wherein each second radiating branch is spiral-shaped and the extension direction is perpendicular to the plane of the second circuit board of the second antenna. Thus, the coupling degree between the second antenna and at least one first antenna is reduced, and the low elevation angle gain of the second antenna is significantly improved, thereby improving the low elevation angle anti-interference capability of the missile-borne antenna.

[0043] like Figure 1As shown, in an exemplary embodiment, each first antenna 20 is disposed at an edge position of a reflecting surface of the antenna reflecting plate 10; and the second antenna 30 is disposed at a center position of the reflecting surface.

[0044] Among them, the edge position of the reflecting surface of the antenna reflecting plate 10 can also be understood as the surrounding positions of the reflecting surface of the antenna reflecting plate 10, and thus, each first antenna 20 can be understood as the surrounding antenna array elements of the missile-borne antenna; the center position of the reflecting surface can be understood as the geometric center position of the reflecting surface of the antenna reflecting plate 10, and thus, the second antenna 30 can be understood as the central antenna array element of the missile-borne antenna.

[0045] In this embodiment, a specific antenna radiation pattern can be formed by a specific antenna array element arrangement, and by arranging the second antenna in a spiral antenna at the center of the reflection surface, the anti-interference performance of the missile-borne antenna in the low elevation angle direction can be enhanced. Therefore, by arranging each first antenna at the edge of the reflection surface of the antenna reflector and arranging the second antenna at the center of the reflection surface, the anti-interference capability of the missile-borne antenna can be improved while improving the space utilization of the missile-borne antenna to improve the integration of the missile-borne antenna.

[0046] In some application scenarios, if the center spacing between the antenna elements of the whole antenna system is too small, the mutual coupling between different antennas will be enhanced, causing the radiation between the antenna elements to cancel each other out, and ultimately resulting in a decrease in the gain of the whole antenna system. When developing the anti-interference algorithm for the whole antenna system, as the coupling between the antenna elements increases, there will be a phenomenon of shallowing of the null in the directional synthesis, rapid attenuation of the null in the spatial response, and null drift. These phenomena will cause the signal-to-noise ratio of the output signal to decrease, thereby reducing the anti-interference ability of the whole antenna. Therefore, the degree of mutual coupling between the antenna elements directly determines the maximum suppression of interference-signal ratio of the whole antenna system. The stronger the mutual coupling between the antenna elements, the lower the signal-to-noise ratio of the output signal, and thus, the smaller the suppressible interference-signal ratio.

[0047] In view of the limitation of the area size of the antenna reflector, the spacing between adjacent antenna elements cannot be too large. Compared with the traditional microstrip antenna, the radiation surface of each antenna element is located in the same horizontal plane, and the adjacent antenna elements have a smaller center spacing in the horizontal plane. The current coupling between the radiation surfaces of each antenna element is stronger, so that the radiation between the antenna elements cancels each other, thereby causing the gain of the whole antenna system to decrease, and then, causing the anti-interference ability of the whole antenna system to decrease. The embodiment of the present application changes the radiation mode of the center antenna element by changing the traditional microstrip antenna to a spiral antenna, and changes the direction of the radiation current to reduce the coupling between the center antenna element and the surrounding antenna elements. At the same time, the gain of the whole antenna system can be improved by improving the isolation between the center antenna element and the surrounding antenna elements, thereby greatly improving the low elevation radiation gain of the center antenna element to improve the anti-interference ability of the whole antenna system at low elevation angles.

[0048] Based on this, in an exemplary embodiment, the center distance between adjacent first antennas 20 is smaller than the center distance between each first antenna 20 and the second antenna 30 .

[0049] The center distance between adjacent first antennas 20 refers to the distance between two center points of each pair of adjacent first antennas 20 in at least one first antenna 20; the center distance between each first antenna 20 and the second antenna 30 refers to the distance between the center point of each first antenna 20 and the center point of the second antenna 30.

[0050] Specifically, when the center spacing between adjacent first antennas 20 is too small, the mutual coupling between adjacent first antennas 20 will be enhanced, thereby causing the radiation between each first antenna 20 to cancel each other out, and further, causing the gain of the first antenna 20 to decrease. Therefore, in order to avoid the center spacing between adjacent first antennas 20 being too small, the center spacing between adjacent first antennas 20 can be optionally set to be greater than or equal to the first preset spacing, and the first preset spacing should not be too small.

[0051] Exemplarily, the center spacing between adjacent first antennas 20 is 0.26λ, and the center spacing between each first antenna 20 and the second antenna 30 is 0.3λ. It should be noted that the size of the center spacing between adjacent first antennas 20 and the center spacing between each first antenna 20 and the second antenna 30 provided in the embodiment of the present application is only used as an exemplary embodiment, and the embodiment of the present application does not limit the size of the center spacing between adjacent first antennas 20 and the size of the center spacing between each first antenna 20 and the second antenna 30.

[0052] In this embodiment, the center spacing between adjacent first antennas is smaller than the center spacing between each first antenna and the second antenna, and the center spacing between adjacent first antennas is not too small, thereby avoiding excessive mutual coupling between adjacent first antennas to avoid mutual cancellation of radiation between each first antenna. At the same time, since the second antenna is a spiral antenna and the extension direction is perpendicular to the plane where the second circuit board is located, the radiation mode of the second antenna as the central main array element is changed, and the direction of the radiation current is changed, which can further reduce the coupling between the central main array element and the first antenna as the surrounding antenna array element. Furthermore, the gain of the missile-borne antenna is improved by improving the isolation between each first antenna and the second antenna. At the same time, while improving the integration of the missile-borne antenna, the low-elevation-angle radiation gain of the central main array element can be greatly improved to improve the anti-interference ability of the missile-borne antenna at low elevation angles.

[0053] like Figure 1 As shown, in an exemplary embodiment, the second antenna 30 further includes:

[0054] At least one matching branch 306 is provided, each matching branch 306 is connected to each second radiation branch 302 , and the distance between each matching branch 306 and the connected second radiation branch 302 meets a preset spacing condition to achieve impedance matching.

[0055] Each matching branch 306 is soldered on the second circuit board 304 .

[0056] Optionally, the distance between each matching branch 306 and the connected second radiation branch 302 may refer to the shortest distance between the geometric center position of each matching branch 306 and the connected second radiation branch 302 .

[0057] Specifically, each matching branch 306 is soldered on the second ground patch of the second circuit board 304 .

[0058] In this embodiment, the second antenna also includes at least one matching branch. By reasonably setting the distance between each matching branch and the connected second radiating branch, impedance adjustment can be achieved. When the distance between each matching branch and the connected second radiating branch meets the preset spacing condition, impedance matching is achieved to reduce signal reflection, thereby improving the signal transmission efficiency of the missile-borne antenna.

[0059] like Figure 2 As shown, in an exemplary embodiment, the missile-borne antenna further includes:

[0060] The third antenna 40 includes a third dielectric layer 402, a third radiation patch 404 and a third circuit board 406. The third dielectric layer 402 is located on one side of the third circuit board 406, and the third radiation patch 404 is located between the third dielectric layer 402 and the second circuit board 304; the third radiation patch 404 is used to receive a third feed signal through a third antenna feed needle 408, so as to transmit a third satellite positioning signal under the excitation of the third feed signal.

[0061] The third antenna feed needle 408 passes through the third dielectric layer 402 and is then soldered onto the third circuit board 406 .

[0062] The third antenna 40 is a circular microstrip antenna, and accordingly, the third dielectric layer 402 is a circular dielectric layer, the third radiation patch 404 is a circular radiation patch, and the third circuit board 406 is a circular circuit board.

[0063] The third radiation patch 404 is used to form a conductive path on the surface of the third dielectric layer 402 for transmitting a third feeding signal.

[0064] The third circuit board 406 is the physical and electrical basis of the third antenna 40, and the third circuit board 406 provides necessary mechanical support and electrical connection functions for the third antenna 40. Optionally, the third circuit board 406 may be manufactured using printed circuit technology, and copper foil traces, pads, through holes, and surface mount components may be arranged on the third circuit board 406 to achieve electrical connection between the third antenna 40 and an external circuit that provides a third feed signal.

[0065] Optionally, the third radiation patch 404 is a metal layer on the surface of the third dielectric layer 402. Further optionally, when the third radiation patch 404 is a metal layer on the surface of the third dielectric layer 402, the third radiation patch 404 may be coated on the surface of the third dielectric layer 402, or the third radiation patch 404 may be aligned and nested on the surface of the third dielectric layer 402.

[0066] Optionally, the third antenna feed needle 408 is sleeved in the dielectric tube, passes through the third dielectric layer 402 , and then is welded on the third circuit board 406 .

[0067] Optionally, when at least one notch is provided at an edge position on the second circuit board 304, the second circuit board 304 can be welded to the third radiation patch 404 by soldering at the notch, thereby achieving welding of the second antenna 30 to the side of the third antenna 40 away from the antenna reflector 10.

[0068] Optionally, a third ground patch is provided on one side of the third circuit board 406 away from the third radiation patch 404, and the shape of the third ground patch is the same as that of the third circuit board 406. For example, when the third antenna 40 is a circular microstrip antenna, the third ground patch is a circular ground patch. It should be noted that the third ground patch is the "ground" of the feeding network of the third circuit board 406.

[0069] In the absence of interference, the positioning accuracy of the third satellite positioning signal is greater than the positioning accuracy of the first satellite positioning signal and the positioning accuracy of the second satellite positioning signal. Optionally, the frequency band of the third satellite positioning signal may be different from the frequency band of the first satellite positioning signal and the frequency band of the second satellite positioning signal.

[0070] It is easy to understand that the third radiation patch 404 is located between the third dielectric layer 402 and the second circuit board 304. Therefore, the second antenna 30 is arranged on the side of the third antenna 40 away from the antenna reflector 10. Furthermore, when the second antenna 30 is arranged at the center position of the reflecting surface, the third antenna 40 is also correspondingly arranged at the center position of the reflecting surface of the antenna reflector 10.

[0071] In this embodiment, the missile-borne antenna also includes a third antenna. Under the action of the third antenna, the missile-borne antenna can also transmit a third satellite positioning signal. Since the third satellite positioning signal has a higher positioning accuracy in the absence of interference, the missile-borne antenna can have a higher anti-interference ability at low elevation angles.

[0072] In an exemplary embodiment, the number of first antenna feed needles 208 corresponding to each first radiation patch 204 is two, the number of third antenna feed needles 408 corresponding to each third radiation patch 404 is two, the distances between the two first antenna feed needles 208 and the geometric center positions of the corresponding first antenna 20 are equal, and the distances between the two third antenna feed needles 408 and the geometric center positions of the corresponding third antenna 40 are equal.

[0073] Among them, the distance between the two first antenna feed needles 208 and the geometric center position of the corresponding first antenna 20 can both be the second preset spacing, and the size of the second preset spacing should meet the conditions for achieving impedance matching of the first antenna 20; similarly, the distance between the two third antenna feed needles 408 and the geometric center position of the corresponding third antenna 40 can both be the third preset spacing, and the size of the third preset spacing should meet the conditions for achieving impedance matching of the third antenna 40.

[0074] In this embodiment, each first antenna and third antenna adopts a dual feed point design, and the two feeding points of each first antenna are at an equal distance from the geometric center position of the first antenna. At the same time, the two feeding points of the third antenna are also at an equal distance from the geometric center position of the third antenna. Therefore, the dual feed point design can ensure the balance and symmetry of the first satellite positioning signal and the third satellite positioning signal, respectively, and can reduce the reflection and standing wave of the first satellite positioning signal and the third satellite positioning signal, respectively, thereby improving the energy transmission efficiency of the first satellite positioning signal and the third satellite positioning signal, respectively.

[0075] In an exemplary embodiment, the first dielectric layer 202 is a ceramic dielectric plate, and the third dielectric layer 402 is a high-frequency dielectric substrate.

[0076] Optionally, the ceramic dielectric plate may be composed of at least one of alumina, aluminum nitride, quartz, and titanate ceramics; the high-frequency dielectric substrate may be composed of at least one of polytetrafluoroethylene, polyimide, and epoxy resin glass fiber reinforced board.

[0077] In this embodiment, since the ceramic dielectric board has a higher dielectric constant, the higher dielectric constant allows more electrical energy to be stored in a smaller physical space, and thus, the antenna array element using the ceramic dielectric board can be appropriately reduced in size to achieve miniaturization of the antenna array element. Therefore, the first dielectric layer of each first antenna is a ceramic dielectric board, which can appropriately reduce the size of each first antenna to improve the space utilization of each first antenna on the antenna reflector. Since the high-frequency dielectric substrate has a lower dielectric constant, the high-frequency dielectric substrate has better transmission performance and lower loss. Therefore, the third dielectric layer of the third antenna is a high-frequency dielectric substrate, which can maintain the signal radiation capability of the missile-borne antenna while improving the anti-interference capability of the missile-borne antenna.

[0078] In an exemplary embodiment, the first circuit board 206 , the second circuit board 304 , and the third circuit board 406 are all implemented using a 3 dB orthogonal bridge.

[0079] In this embodiment, the feeding network on the first circuit board, the feeding network on the second circuit board, and the feeding network on the third circuit board are all implemented using a 3dB orthogonal bridge. Since the 3dB orthogonal bridge can distribute each input signal to the output port with equal amplitude, the signal power obtained by each output port is the same. At the same time, the 3dB orthogonal bridge can also ensure that the signal phase of each output port differs by 90 degrees (i.e., orthogonal), thereby ensuring that the first antenna, the second antenna, and the third antenna in the missile-borne antenna can all receive uniform signal power, thereby improving the anti-interference capability of the missile-borne antenna.

[0080] In an exemplary embodiment, the frequency bands of the first satellite positioning signal and the second satellite positioning signal are respectively first preset frequency bands, and the frequency band of the third satellite positioning signal is a second preset frequency band.

[0081] Among them, the first preset frequency band covers the frequency range of the B3 frequency band, and the frequency range covered by the B3 frequency band is 1250.618MHz-1286.432MHz. Therefore, the first preset frequency band should at least cover 1250.618MHz-1286.432MHz. The frequency bands of the first satellite positioning signal and the second satellite positioning signal meet the B3 frequency band respectively, which can provide higher positioning accuracy and stronger anti-interference capability for the missile-borne antenna.

[0082] The second preset frequency band covers the frequency range of the B1 frequency band, and the frequency range covered by the B1 frequency band is 1559.052MHz-1591.788MHz. Therefore, the second preset frequency band should at least cover 1559.052MHz-1591.788MHz. The frequency band of the third satellite positioning signal meets the B1 frequency band, which can further provide higher positioning accuracy for the missile-borne antenna, that is, the third satellite positioning signal transmitted by the third antenna 40 plays an auxiliary enhancement role in the missile-borne antenna.

[0083] In this embodiment, the frequency bands of the first satellite positioning signal and the second satellite positioning signal respectively cover the frequency range of the B3 frequency band, and the frequency band of the third satellite positioning signal covers the frequency range of the B1 frequency band. Thus, when the missile-borne antenna includes seven first antennas, one second antenna and one third antenna, the missile-borne antenna has eight antenna array elements covering the B3 frequency band and one antenna array element covering the B1 frequency band, that is, the missile-borne antenna is an 8B3+B1 array antenna. Furthermore, the missile-borne antenna can work in the B3 and B1 frequency bands at the same time, has a wider range of applications and better communication transmission compatibility, and the missile-borne antenna has higher positioning accuracy while also having better anti-interference capability in a complex electromagnetic environment.

[0084] It can be understood that the above-mentioned missile-borne antenna can also adopt other forms, not limited to the forms mentioned in the above embodiments, as long as it can achieve the function of improving the anti-interference capability.

[0085] The embodiment of the present application further provides a missile-borne device, which includes the missile-borne antenna in any of the above missile-borne antenna embodiments.

[0086] The missile-borne antenna can be applied to missile-borne devices or similar equipment that have certain requirements for anti-interference capabilities, such as missile systems, unmanned aerial vehicles or spacecraft.

[0087] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic description of the above terms does not necessarily refer to the same embodiment or example.

[0088] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A missile-borne antenna, characterized in that: The missile-borne antenna comprises: Antenna reflector; At least one first antenna, each of the first antennas comprises a first dielectric layer, a first radiation patch and a first circuit board, the first dielectric layer is located on one side of the first circuit board, and the first radiation patch is located on a side of the first dielectric layer away from the first circuit board; the first radiation patch is used to receive a first feed signal through a first antenna feed needle, so as to transmit a first satellite positioning signal under the stimulation of the first feed signal; The second antenna comprises at least one second radiating branch and a second circuit board, each of the second radiating branches is located on one side of the second circuit board, each of the second radiating branches is spiral-shaped and the extension direction is perpendicular to the plane where the second circuit board is located; the second radiating branch is used to receive a second feed signal, so as to transmit a second satellite positioning signal under the stimulation of the second feed signal; Among them, each of the first antenna and the second antenna is located on the reflecting surface of the antenna reflecting plate; the first antenna feed needle passes through the first dielectric layer and is welded on the first circuit board, and the second radiation branch is welded on the second circuit board.

2. The missile-borne antenna according to claim 1, characterized in that: Each of the first antennas is arranged at an edge position of a reflection surface of the antenna reflection plate; and the second antenna is arranged at a center position of the reflection surface.

3. The missile-borne antenna according to claim 1, characterized in that: The center distance between adjacent first antennas is smaller than the center distance between each first antenna and the second antenna.

4. The missile-borne antenna according to claim 1, characterized in that: The second antenna further includes: at least one matching branch, each of the matching branches is connected to each of the second radiation branches, and the distance between each of the matching branches and the connected second radiation branches meets a preset spacing condition to achieve impedance matching; Wherein, each of the matching branches is welded on the second circuit board.

5. The missile-borne antenna according to claim 1, characterized in that: The missile-borne antenna also includes: a third antenna, comprising a third dielectric layer, a third radiation patch and a third circuit board, wherein the third dielectric layer is located on one side of the third circuit board, and the third radiation patch is located between the third dielectric layer and the second circuit board; the third radiation patch is used to receive a third feed signal through a third antenna feed needle, so as to transmit a third satellite positioning signal under the stimulation of the third feed signal; The third antenna feed needle passes through the third dielectric layer and is then soldered on the third circuit board.

6. The missile-borne antenna according to claim 5, characterized in that: The number of the first antenna feed needles corresponding to each of the first radiation patches is two, the number of the third antenna feed needles corresponding to each of the third radiation patches is two, the distances between the two first antenna feed needles and the geometric center positions of the corresponding first antennas are equal, and the distances between the two third antenna feed needles and the geometric center positions of the corresponding third antennas are equal.

7. The missile-borne antenna according to claim 5, characterized in that: The first dielectric layer is a ceramic dielectric plate, and the third dielectric layer is a high-frequency dielectric substrate.

8. The missile-borne antenna according to claim 5, characterized in that: The first circuit board, the second circuit board and the third circuit board are all implemented by using a 3dB orthogonal bridge.

9. The missile-borne antenna according to claim 5, characterized in that: The frequency bands of the first satellite positioning signal and the second satellite positioning signal are respectively first preset frequency bands, and the frequency band of the third satellite positioning signal is a second preset frequency band.

10. A bomb-carrying device, characterized in that: It comprises the missile-borne antenna as described in any one of claims 1-9.

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