Imaging device

Abstract

A camera device comprises a circuit board, a photosensitive element, a first adhesive layer, a lens group and a second adhesive layer. The circuit board comprises an assembly hole, and the assembly hole is provided with an inner ring surface. The photosensitive element is located in the assembly hole and comprises a front face, a back face and an outer periphery, the front face is provided with a photosensitive area and a non-photosensitive area, and the non-photosensitive area is located around the photosensitive area. The first adhesive layer is fixed on the outer periphery and the inner ring surface. The lens group comprises a base and a lens, the lens is arranged on the base and provided with an optical axis, the base comprises a bottom wall and an extension part, the bottom wall is provided with a bottom surface, the extension part extends from the bottom wall and is provided with a limiting surface, and the limiting surface and the non-photosensitive area are mutually overlapped in the optical axis direction. The second adhesive layer is provided with a positioning block and a limiting block, the positioning block is fixed on the bottom surface and the first surface, and the limiting block is fixed on the limiting surface and the non-photosensitive area.

Description

Technical Field

[0001] The present invention relates to an optical device, in particular to a camera device. Background Art

[0002] With the development of technology, camera devices are increasingly used in personal electronic products, automotive fields, medical fields, etc. to obtain external images. For example, most computer devices (such as laptops or tablets) have camera devices to support functions such as photography, web video or face recognition.

[0003] Generally speaking, a camera device has a circuit board and a photosensitive element. In order to make the overall thickness of the camera device thinner, the industry will install the photosensitive element in the hole of the circuit board. However, although this structure can achieve the purpose of reducing the thickness, it will also cause the photosensitive element to be easily displaced or deformed due to force, which will affect the quality of the image sensed by the photosensitive element. Summary of the invention

[0004] In view of the above, in one embodiment, a camera device is provided, including a circuit board, a photosensitive element, a first adhesive layer, a lens group, and a second adhesive layer. The circuit board includes an assembly hole and a first surface and a second surface opposite to each other, the assembly hole penetrates the first surface and the second surface, and the assembly hole has an inner annular surface. The photosensitive element is located in the assembly hole, the photosensitive element includes a front surface, a back surface, and an outer peripheral edge, the outer peripheral edge is connected between the front surface and the back surface, the front surface has a photosensitive area and a non-photosensitive area, and the non-photosensitive area is located around the photosensitive area. The first adhesive layer is then fixed to the outer peripheral edge of the photosensitive element and the inner annular surface of the assembly hole. The lens group is arranged on the first surface, the lens group includes a base and a lens, the lens is arranged on the base, the position of the lens corresponds to the photosensitive element and has an optical axis, the base includes a bottom wall and an extension member, the bottom wall has a bottom surface, the extension member extends from the bottom wall and has a limiting surface, wherein the bottom surface and the first surface overlap with each other in the direction of the optical axis, and the limiting surface and the non-photosensitive area of ​​the photosensitive element overlap with each other in the direction of the optical axis. The second adhesive layer is located between the base and the circuit board. The second adhesive layer has a positioning block and a limiting block. The positioning block is then fixed to the bottom surface of the base and the first surface of the circuit board. The limiting block is then fixed to the limiting surface of the extension piece and the non-photosensitive area of ​​the photosensitive element.

[0005] In summary, according to the camera device of the embodiment of the present invention, an extension piece extends through the bottom wall of the base, and the limiting surface of the extension piece and the non-photosensitive area of ​​the photosensitive element overlap with each other in the direction of the optical axis. The limiting block of the second adhesive layer is then fixed to the limiting surface and the non-photosensitive area of ​​the photosensitive element, so that the photosensitive element can be limited by the extension piece, thereby improving the overall structural strength of the camera device, avoiding the photosensitive element from being displaced or deformed due to force, and allowing the photosensitive element to maintain good image sensing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 It is a stereoscopic diagram of an embodiment of a camera device of the present invention.

[0007] Figure 2 It is an exploded perspective view of an embodiment of a camera device of the present invention.

[0008] Figure 3 It is a side view of an embodiment of a lens group of a camera device of the present invention.

[0009] Figure 4 yes Figure 1 Section view along line segment 4-4.

[0010] Figure 5 It is an exploded perspective view of another embodiment of the camera device of the present invention.

[0011] Figure 6 It is a side view of another embodiment of the lens group of the camera device of the present invention.

[0012] Figure 7 It is a cross-sectional view of another embodiment of the camera device of the present invention.

[0013] Figure 8 It is a partially enlarged cross-sectional view of another embodiment of the camera device of the present invention.

[0014] Description of reference numerals:

[0015] 1: Camera device

[0016] 10: Circuit Board

[0017] 11: First surface

[0018] 12: Second Surface

[0019] 15: Assembly hole

[0020] 16: Inner ring

[0021] 20: Photosensitive element

[0022] 21: Positive

[0023] 22: Photosensitive area

[0024] 23: Non-photosensitive area

[0025] 231: Continuation Zone

[0026] 232: Non-contiguous area

[0027] 24: Back

[0028] 25: Outer periphery

[0029] 30: First adhesive layer

[0030] 40: Lens Group

[0031] 41: Pedestal

[0032] 42: Bottom wall

[0033] 421: Bottom

[0034] 422: Inner Ring

[0035] 43, 43a: Extension

[0036] 431, 431a: Limiting surface

[0037] 44: Axis hole

[0038] 45: Lens

[0039] 50, 50a: Second adhesive layer

[0040] 51, 51a: Positioning block

[0041] 55, 55a: Limit block

[0042] A: Optical axis

[0043] D1: First spacing

[0044] D2: Second spacing

[0045] D3: The third spacing DETAILED DESCRIPTION

[0046] It should be noted that, in the description of each embodiment, the so-called "first" and "second" are used to describe different elements, and these elements are not limited by such predicates. The same reference numerals will be used to represent the same or similar elements in all drawings.

[0047] Figure 1 is a stereoscopic diagram of an embodiment of a camera device of the present invention, Figure 2 is an exploded perspective view of an embodiment of a camera device of the present invention, Figure 3 is a side view of an embodiment of a lens group of a camera device of the present invention, Figure 4 for Figure 1 The cross-sectional view along line segment 4-4. Figure 1 and Figure 2 As shown, the camera device 1 of the embodiment of the present invention includes a circuit board 10, a photosensitive element 20, a first adhesive layer 30, a lens group 40 and a second adhesive layer 50. In some embodiments, the camera device 1 can be applied to various electronic products to obtain images around the electronic products. For example, the camera device 1 can be applied to mobile devices (such as smart phones, tablet computers or laptops) or electronic products such as cameras.

[0048] like Figures 2 to 4 As shown, the circuit board 10 includes an assembly hole 15 and a first surface 11 and a second surface 12 opposite to each other, wherein the assembly hole 15 passes through the first surface 11 and the second surface 12, and the assembly hole 15 has an inner annular surface 16. In the present embodiment, the assembly hole 15 is a rectangular hole, but this is not limited to this. In other embodiments, the assembly hole 15 may also be a circular hole, an elliptical hole or a square hole, etc., depending on actual product requirements.

[0049] like Figures 2 to 4 As shown, the photosensitive element 20 is located in the assembly hole 15, and the photosensitive element 20 includes a front surface 21, a back surface 24, and an outer periphery 25, and the outer periphery 25 is connected between the front surface 21 and the back surface 24, wherein the front surface 21 and the first surface 11 of the circuit board 10 face the same direction, and the back surface 24 and the second surface 12 of the circuit board 10 face the same direction. In some embodiments, the shape of the photosensitive element 20 can be a rectangle (such as Figure 2 as shown), round, oval, square or other irregular shapes, etc.

[0050] like Figures 2 to 4 As shown, the front side 21 of the photosensitive element 20 has a photosensitive area 22 and a non-photosensitive area 23. The non-photosensitive area 23 is located around the photosensitive area 22. Figure 2 and Figure 4 In the figure, the photosensitive area 22 and the non-photosensitive area 23 are distinguished by dotted lines for the convenience of explanation and understanding. The dotted lines are not actual lines, which is explained in advance. The photosensitive element 20 can be made of semiconductor materials. The photosensitive area 22 can have tiny photosensitive units for sensing external light and generating images. The non-photosensitive area 23 is an area that does not participate in light sensing and image generation. For example, the non-photosensitive area 23 can be used to electrically connect the lines on the circuit board 10 to transmit signals.

[0051] In some embodiments, the photosensitive element 20 may be a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), or a complementary metal-oxide semiconductor active pixel sensor (CMOS active pixel sensor).

[0052] like Figures 2 to 4 As shown, the first adhesive layer 30 is then fixed to the outer periphery 25 of the photosensitive element 20 and the inner annular surface 16 of the assembly hole 15, so that the photosensitive element 20 is fixed inside the assembly hole 15 of the circuit board 10. With this structural configuration, the influence of dust, water vapor or dirt in the external environment on the photosensitive element 20 can be reduced, and the photosensitive element 20 is not stacked on the surface of the circuit board 10, which can also reduce the overall thickness of the camera device 1.

[0053] like Figures 2 to 4 As shown, the lens group 40 is disposed on the first surface 11 of the circuit board 10 and covers the assembly hole 15. The lens group 40 includes a base 41 and a lens 45. The lens 45 is disposed on the base 41, and the position of the lens 45 corresponds to the position of the photosensitive element 20, so that the external light can be focused on the photosensitive area 22 of the photosensitive element 20 after entering through the lens 45. In this embodiment, the base 41 is hollow and has an axial hole 44. The position of the axial hole 44 corresponds to the position of the assembly hole 15 of the circuit board 10. The lens 45 is fixed in the axial hole 44 and has an optical axis A, wherein the optical axis A may be perpendicular to the circuit board 10 and pass through the center of the lens 45, and the direction of the optical axis A may correspond to the direction of light propagation.

[0054] like Figures 2 to 4 As shown, the base 41 of the lens assembly 40 includes a bottom wall 42 and at least one extension member 43, the bottom wall 42 has a bottom surface 421, and the extension member 43 extends from the bottom wall 42 and has a limiting surface 431. In this embodiment, the bottom wall 42 is a rectangular annular wall and its bottom surface 421 is a rectangular annular surface, but this is not limited. In some embodiments, the bottom wall 42 can also be a circular annular wall, an elliptical annular wall or a square annular wall.

[0055] like Figures 2 to 4 As shown, the extension member 43 may be a plate member or a protrusion. In this embodiment, the number of the extension members 43 is multiple (four in this case), and the multiple extension members 43 are disposed on the inner circumference 422 of the bottom wall 42 and extend toward the shaft hole 44. The multiple extension members 43 are spaced apart from each other and surround the shaft hole 44. In some embodiments, the bottom wall 42 and the extension member 43 may be an integrally formed structure (such as Figures 2 to 4 As shown), or the extension member 43 can also be assembled and fixed to the bottom wall 42 by locking, adhering or snapping.

[0056] like Figures 2 to 4 As shown, the bottom surface 421 of the bottom wall 42 of the base 41 faces the first surface 11 of the circuit board 10, and the bottom surface 421 and the first surface 11 at least partially overlap each other in the direction of the optical axis A. The limiting surface 431 of each extension member 43 faces the front surface 21 of the photosensitive element 20, and the limiting surface 431 and the non-photosensitive area 23 of the photosensitive element 20 at least partially overlap each other in the direction of the optical axis A. In addition, in this embodiment, the bottom surface 421 of the base 41 and the limiting surface 431 of each extension member 43 are located in the same plane, but this is not limited.

[0057] like Figures 2 to 4 As shown, the second adhesive layer 50 is located between the base 41 and the circuit board 10. The second adhesive layer 50 has a positioning block 51 and at least one limiting block 55. Figure 4In the figure, the positioning block 51 and the limiting block 55 of the second adhesive layer 50 are distinguished by dotted lines for the convenience of explanation and understanding. The dotted lines are not actually existing lines, which is explained in advance. In this embodiment, the positioning block 51 corresponds to the shape of the bottom surface 421 and is a rectangular block. The number of limiting blocks 55 is multiple and corresponds to the number of the above-mentioned extension members 43. The positioning block 51 of the second adhesive layer 50 is then fixed to the bottom surface 421 of the base 41 and the first surface 11 of the circuit board 10, so that the base 41 and the circuit board 10 are adhered and fixed to each other. The limiting blocks 55 of the second adhesive layer 50 are then respectively fixed to the limiting surfaces 431 of each extension member 43 and the non-photosensitive area 23 of the photosensitive element 20, so that the base 41 and the photosensitive element 20 are also adhered and fixed to each other. In other embodiments, the range of the second adhesive layer 50 can be adjusted according to actual needs. For example, the second adhesive layer 50 can cover a portion of the bottom surface 421 of the base 41 and the limiting surface 431 of the extension member 43 , but the present invention is not limited thereto.

[0058] Thus, according to the camera device 1 of the embodiment of the present invention, the extension piece 43 is further extended from the bottom wall 42 of the base 41, and the limiting surface 431 of the extension piece 43 and the non-photosensitive area 23 of the photosensitive element 20 overlap each other in the direction of the optical axis A. In addition to being fixed to the bottom wall 42 of the base 41 and the first surface 11 of the circuit board 10, the second adhesive layer 50 is also fixed to the limiting surface 431 of the extension piece 43 and the non-photosensitive area 23 of the photosensitive element 20, so that the photosensitive element 20 can be further limited by the extension piece 43, thereby improving the overall structural strength of the camera device 1, preventing the photosensitive element 20 from being displaced or deformed due to force, and maintaining good image sensing quality of the photosensitive element 20. For example, when the photosensitive element 20 is subjected to a force in the direction of the base 41, the limiting surface 431 of the extension member 43 can press the photosensitive element 20 through the limiting block 55 of the second adhesive layer 50, and the bottom surface 421 of the bottom wall 42 presses the first surface 11 of the circuit board 10 through the positioning block 51, so that the circuit board 10 and the photosensitive element 20 are combined with the base 41 through the second adhesive layer 50 to increase the strength of the overall structure, thereby preventing the photosensitive element 20 from being displaced or deformed in the direction of the base 41, and also preventing the photosensitive element 20 from being separated from the circuit board 10 due to external force.

[0059] like Figures 2 to 4 As shown, in this embodiment, the limiting block 55 of the second adhesive layer 50 is further fixed to the inner ring surface 16 of the assembly hole 15 of the circuit board 10 and the first adhesive layer 30, so as to further strengthen the bonding strength between the circuit board 10, the photosensitive element 20 and the base 41, making it less likely for the photosensitive element 20 to be displaced or deformed. In this way, the photosensitive element 20, the first adhesive layer 30 and the circuit board 10 can be maintained in the same plane without the need for an additional reinforcement plate.

[0060] For example, if Figures 2 to 4As shown, the thickness of the photosensitive element 20 can be less than the thickness of the circuit board 10, for example, the thickness of the photosensitive element 20 can be 1 / 2 to 1 / 3 of the thickness of the circuit board 10, and the photosensitive element 20 is adjacent to the second surface 12. In this embodiment, the back surface 24 of the photosensitive element 20 and the second surface 12 of the circuit board 10 are located in the same plane, and the front surface 21 of the photosensitive element 20 is located inside the assembly hole 15 and between the first surface 11 and the second surface 12 of the circuit board 10. In this way, by making the thickness of the photosensitive element 20 smaller than the thickness of the circuit board 10, the limiting block 55 of the second adhesive layer 50 can enter the assembly hole 15 to be fixed to the inner annular surface 16 of the assembly hole 15, the first adhesive layer 30 and the non-photosensitive area 23 of the photosensitive element 20 at the same time.

[0061] In some embodiments, the first adhesive layer 30 and the second adhesive layer 50 may be different adhesive layers. For example, the second adhesive layer 50 may be a light-curable adhesive layer, such as an ultraviolet light-curable adhesive layer. The second adhesive layer 50 is in a liquid or semi-solid state before being cured. When the second adhesive layer 50 is irradiated with ultraviolet light (UV), it can be quickly hardened to produce a fixing effect. The first adhesive layer 30 may be a non-light-curable adhesive layer, such as a heat-curable adhesive layer. The first adhesive layer 30 may be heated to produce a chemical reaction, so that the heat-curable adhesive is cured to produce a fixing effect.

[0062] like Figures 2 to 4 As shown, in this embodiment, the second adhesive layer 50 is a photocurable adhesive layer, and the first adhesive layer 30 is a non-photocurable adhesive layer. During the manufacturing process of the camera device 1, the photosensitive element 20 can be firstly adhered and fixed in the assembly hole 15 of the circuit board 10 by the first adhesive layer 30, and then the uncured second adhesive layer 50 is coated on the first surface 11 of the circuit board 10 or the bottom of the base 41 corresponding to the shape of the bottom of the base 41. When the base 41 is placed on the first surface 11 of the circuit board 10, the uncured second adhesive layer 50 can flow and contact the bottom surface 421 of the base 41, the first surface 11 of the circuit board 10, the limiting surface 431 of the extension piece 43 and the non-photosensitive area 23 of the photosensitive element 20 at the same time. Next, the position of the base 41 can be manipulated to adjust relative to the circuit board 10. For example, a robot arm (not shown) can be used to clamp the base 41, and the robot arm can be used to control the base 41 to perform lifting, lateral movement, pitching or deflection relative to the circuit board 10, so as to adjust the relative position of the lens 45 on the base 41 and the photosensitive element 20 to maintain a predetermined imaging focal length. Finally, when the base 41 is adjusted, the uncured second adhesive layer 50 can be irradiated with a specific light (such as ultraviolet light) to cure the second adhesive layer 50. Finally, the circuit board 10, the photosensitive element 20 and the base 41 can be fixed to each other through a baking operation, and the manufacturing process of the camera device 1 is completed.

[0063] like Figures 2 to 4As shown, the non-photosensitive area 23 of the photosensitive element 20 is further divided into a bonding area 231 and a non-bonding area 232. Figure 4 In the figure, the bonding area 231 and the non-bonding area 232 are distinguished by a plurality of dotted lines for the convenience of explanation and understanding. The dotted lines are not actual lines, which are explained in advance. In this embodiment, the non-bonding area 232 is located between the photosensitive area 22 and the bonding area 231, and the limiting block 55 of the second adhesive layer 50 is only fixed to the bonding area 231 to prevent the limiting block 55 of the second adhesive layer 50 from being too close to the photosensitive area 22 or contacting the photosensitive area 22 to affect the image sensing effect.

[0064] In some embodiments, the bottom surface 421 of the base 41 and the limiting surfaces 431 of the extension members 43 may not be located on the same plane. Figures 5 to 8 FIG. 1 is another embodiment of the camera device 1 of the present invention. Figures 2 to 4 The difference between the embodiments is at least that each extension piece 43a of the present embodiment further protrudes from the bottom surface 421 of the bottom wall 42 of the base 41, and each extension piece 43a further extends into the assembly hole 15 so that the limiting surface 431a is located in the assembly hole 15, and the limiting surface 431a of each extension piece 43a is closer to the non-photosensitive area 23 of the photosensitive element 20 relative to the bottom surface 421.

[0065] Therefore, by reducing the distance between the limiting surface 431a of each extension piece 43a and the non-photosensitive area 23 of the photosensitive element 20, when the photosensitive element 20 is subjected to a force in the direction of the lens 45, the limiting surface 431a of each extension piece 43a can more immediately produce a blocking and limiting effect to prevent the photosensitive element 20 from being displaced or deformed. In addition, during the flow of the uncured second adhesive layer 50a, by reducing the distance between the limiting surface 431a and the non-photosensitive area 23, the flow rate of the uncured second adhesive layer 50a can also be slowed down, thereby preventing the uncured second adhesive layer 50a from flowing to the photosensitive area 22 of the photosensitive element 20 and affecting the image sensing effect.

[0066] In addition, Figures 5 to 8As shown, by extending the extension piece 43a toward the photosensitive element 20, the contact area between the second adhesive layer 50a and the extension piece 43a can also be increased, so as to increase the adhesion between the second adhesive layer 50a, the extension piece 43a and the bottom surface 421 of the bottom wall 42. For example, in this embodiment, there is a first distance D1 between each extension piece 43a and the inner annular surface 16 of the assembly hole 15, and there is a second distance D2 between the limiting surface 431a of each extension piece 43a and the non-photosensitive area 23 of the photosensitive element 20. There is a third distance D3 between the bottom surface 421 of the base 41 and the first surface 11 of the circuit board 10, and the positioning block 51a of the second adhesive layer 50a is then fixed within the third distance D3, so that the base 41 and the circuit board 10 are fixed to each other. The cross-section of each limiting block 55a of the second adhesive layer 50a is L-shaped and is then fixed within the first spacing D1 and the second spacing D2, so that the limiting block 55a can be simultaneously fixed to the inner annular surface 16 of the assembly hole 15, the first adhesive layer 30 and the non-photosensitive area 23 of the photosensitive element 20, thereby increasing the contact area between the second adhesive layer 50a and the extension piece 43a.

[0067] In some embodiments, at least two of the first distance D1, the second distance D2, and the third distance D3 may be different. Figures 5 to 8 As shown, in this embodiment, the third distance D3 is greater than the first distance D1 and the second distance D2, and the first distance D1 is smaller than the second distance D2. Thus, through the above-mentioned distance change, during the flow process of the above-mentioned uncured second adhesive layer 50a, the flow rate of the uncured second adhesive layer 50a can be accurately controlled to ensure that the second adhesive layer 50a can fill the first distance D1, the second distance D2 and the third distance D3 after curing and avoid affecting the photosensitive area 22 of the photosensitive element 20.

[0068] Although the technical contents of the present invention have been disclosed as above in the form of preferred embodiments, they are not intended to limit the present invention. Any slight changes and modifications made by any technician in the field without departing from the spirit of the present invention should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the appended claims.

Claims

1. A camera device, characterized in that: include: A circuit board comprises an assembly hole and a first surface and a second surface opposite to each other, wherein the assembly hole penetrates through the first surface and the second surface, and the assembly hole has an inner annular surface; A photosensitive element is located in the assembly hole, the photosensitive element includes a front side, a back side and an outer periphery, the outer periphery is connected between the front side and the back side, the front side has a photosensitive area and a non-photosensitive area, and the non-photosensitive area is located around the photosensitive area; A first adhesive layer is then fixed to the outer periphery of the photosensitive element and the inner annular surface of the assembly hole; A lens group is disposed on the first surface, the lens group includes a base and a lens, the lens is disposed on the base, the position of the lens corresponds to the photosensitive element and has an optical axis, the base includes a bottom wall and an extension member, the bottom wall has a bottom surface, the extension member extends from the bottom wall and has a limiting surface, wherein the bottom surface and the first surface overlap with each other in the direction of the optical axis, and the limiting surface and the non-photosensitive area of ​​the photosensitive element overlap with each other in the direction of the optical axis; as well as The second adhesive layer is located between the base and the circuit board. The second adhesive layer has a positioning block and a limiting block. The positioning block is then fixed to the bottom surface of the base and the first surface of the circuit board. The limiting block is then fixed to the limiting surface of the extension piece and the non-photosensitive area of ​​the photosensitive element.

2. The camera device according to claim 1, characterized in that The limiting block of the second adhesive layer is then fixed to the inner annular surface of the assembling hole and the first adhesive layer.

3. The imaging device according to claim 1, wherein: The first adhesive layer is different from the second adhesive layer.

4. The camera device according to claim 3, characterized in that: The second adhesive layer is a photocurable adhesive layer, and the first adhesive layer is a non-photocurable adhesive layer.

5. The imaging device according to claim 1, wherein: The base has an axial hole, the lens is located in the axial hole, the number of the extension pieces is multiple, the multiple extension pieces are arranged at intervals from each other and surround the axial hole, the number of the limiting blocks of the second adhesive layer is multiple, and the multiple limiting blocks are respectively fixed to the multiple limiting surfaces of the multiple extension pieces and the non-photosensitive area.

6. The imaging device according to claim 1, wherein: The non-photosensitive area is further divided into a bonding area and a non-bonding area. The non-bonding area is located between the photosensitive area and the bonding area. The limiting block of the second adhesive layer is fixed to the bonding area.

7. The imaging device according to claim 1, wherein: The bottom surface of the base and the limiting surface are located in the same plane.

8. The imaging device according to claim 1, wherein: The thickness of the photosensitive element is smaller than the thickness of the circuit board, and the photosensitive element is adjacent to the second surface. The extension piece also extends into the assembly hole so that the limiting surface is located in the assembly hole.

9. The imaging device according to claim 8, wherein: There is a first distance between the extension piece and the inner annular surface of the assembly hole, a second distance between the limiting surface of the extension piece and the non-photosensitive area, and the limiting block of the second adhesive layer is then fixed within the first distance and the second distance.

10. The imaging device according to claim 9, characterized in that: A third distance is provided between the bottom surface of the base and the first surface of the circuit board, and the positioning block of the second adhesive layer is then fixed within the third distance.

11. The imaging device according to claim 10, wherein: At least two of the first interval, the second interval, and the third interval are different.

12. The imaging device according to claim 11, wherein: The third interval is greater than the first interval and the second interval.

13. The imaging device according to claim 11, wherein: The first interval is smaller than the second interval.

Images