LED product repair equipment and repair method

Abstract

The application discloses LED product repair equipment and a repair method, and the LED product repair equipment comprises a product bearing moving device, a tin material supply device, a chip supply device, a tin point removing assembly module and a crystal taking and welding assembly module; the product bearing moving device comprises a workbench and a horizontal driving mechanism; the tin point removing assembly module comprises a first moving mechanism and a first moving table, a removing mechanism and a tin point mechanism are arranged on the first moving table, the first moving mechanism is connected with the first moving table and can drive the tin point mechanism to move above the tin material supply device or the workbench; the crystal taking and welding assembly module comprises a second moving mechanism and a second moving table, a crystal taking mechanism and a laser welding mechanism are arranged on the second moving table, the second moving mechanism is connected with the second moving table and can drive the crystal taking mechanism to move above the chip supply device and the workbench; the application can remove the defective chips on the LED product one by one and replace them with new chips, and can improve the repair efficiency.

Description

Technical Field

[0001] This invention relates to the field of LED repair equipment technology, and in particular to an LED product repair equipment and repair method. Background Technology

[0002] In related technologies, LED product rework equipment includes a product moving device, a rejection mechanism, a soldering mechanism, a die-mounting mechanism, and a soldering mechanism. The product moving device can drive the LED product to move along the X-axis, while the rejection mechanism, soldering mechanism, die-mounting mechanism, and soldering mechanism are arranged roughly along the X-axis. Thus, as the product moving device drives the LED product through the rejection mechanism, soldering mechanism, die-mounting mechanism, and soldering mechanism in sequence, defective chips can be rejected, soldered, new chips can be mounted, and soldered, thus effectively repairing the LED product. However, since an LED product may have multiple defective chips, this type of LED product rework equipment can only move downstream to perform the next step after completing the current repair step for all defective chips (for example, a new chip can only be mounted after all defective chips on the LED product have been rejected and soldered). Therefore, during the repair process, except for the mechanism corresponding to the current step, the other mechanisms will be in an idle state, resulting in relatively low rework efficiency. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes an LED product repair device that can replace defective chips on LED products one by one with new chips, and improves repair efficiency.

[0004] The present invention also provides a repair method for the above-mentioned LED product repair equipment.

[0005] According to a first aspect of the present invention, an LED product rework device includes a product carrying moving device, a solder supply device, a chip supply device, a soldering rejection assembly module, a die-taking and soldering assembly module, and a control system. The product carrying moving device includes a worktable and a horizontal driving mechanism. The worktable is connected to the horizontal driving mechanism and is capable of moving along the X-axis and Y-axis directions under the drive of the horizontal driving mechanism. The solder supply device is disposed on one side of the product carrying moving device in the X-axis direction and is used to supply solder. The chip supply device is disposed on the side of the product carrying moving device away from the solder supply device and is used to supply chips. The soldering rejection assembly module includes a first moving mechanism and a first moving stage. The first moving stage is provided with a first positioning mechanism, a rejection mechanism, and a soldering mechanism. The first positioning mechanism is used to position defective chips on the LED product, and the rejection mechanism is used to reject defective chips on the LED product. The first moving mechanism is connected to the first... A first moving stage is included, capable of being driven to move along the X-axis, so that the soldering mechanism can move to the solder supply device to pick up solder, and can move to the worktable to apply solder to the area where the LED product rejects the chip; the chip pickling and soldering assembly module includes a second moving mechanism and a second moving stage, the second moving stage is provided with a laser soldering mechanism and a chip picking mechanism, the second moving mechanism is connected to the second moving stage and can drive the second moving stage to move along the X-axis, so that the chip picking mechanism can move to the chip supply device to pick up the chip, and can move to the worktable to mount the chip to the area where the LED product is soldered, the laser soldering mechanism is used to solder the chip mounted to the soldering area by the chip picking mechanism to the LED product; the control system is electrically connected to the horizontal drive mechanism, the solder supply device, the chip supply device, the first moving mechanism, the first positioning mechanism, the rejection mechanism, the soldering mechanism, the second moving mechanism, the laser soldering mechanism and the chip picking mechanism.

[0006] The LED product repair equipment according to the first aspect of the present invention has at least the following beneficial effects:

[0007] In this embodiment, the LED product rework equipment, during the rework process, can first move the LED product to a preset position below the soldering rejection assembly module using a product-carrying moving device. Then, the first positioning mechanism obtains the position information of the defective chip on the LED product. Subsequently, the horizontal driving mechanism adjusts the position of the LED product so that one of the defective chips moves to the rejection position corresponding to the rejection mechanism, and then the rejection mechanism can remove this defective chip. Then, the first moving mechanism drives the first moving stage to move the soldering mechanism to the solder supply device to pick up solder, and then moves the soldering mechanism above the LED product, where the soldering mechanism can apply solder to the area of ​​the rejected chip on the LED product for soldering new chips. While removing defective chips, picking up solder, and applying solder, the equipment can also be driven by a second moving mechanism. The second moving stage, carrying the die-picking mechanism, moves to the chip supply device to pick up a new chip. It then moves the die-picking mechanism and the new chip to the die-bonding position on one side of the worktable to await soldering. Next, the second moving stage, driven by the second moving mechanism, moves the die-picking mechanism above the soldering area of ​​the LED product. The die-picking mechanism then attaches the new chip to the soldering area of ​​the LED product. Finally, a laser welding mechanism solders the new chip to the LED product, completing the repair of a defective chip. This process is repeated multiple times to remove all defective chips and replace them with new ones. Therefore, the LED product rework equipment of this embodiment can remove defective chips from LED products one by one and replace them with new ones. Furthermore, the die-picking mechanism can operate synchronously with the removal mechanism and the soldering mechanism during the repair process, thus improving rework efficiency.

[0008] According to some embodiments of the first aspect of the present invention, the LED product repair equipment includes a product carrying and moving device, which further includes a rotary drive mechanism connected to the worktable and used to drive the worktable to rotate in a horizontal plane. The rotary drive mechanism is electrically connected to the control system.

[0009] According to some embodiments of the first aspect of the present invention, the LED product repair equipment further includes a product input device and a product output device, which are disposed on opposite sides of the product carrying moving device in the X-axis direction. A product receiving mechanism is provided on the worktable, which can dock with the product input device or the product output device under the drive of the horizontal driving mechanism. The product input device and the product output device are electrically connected to the control system.

[0010] According to some embodiments of the first aspect of the present invention, an LED product rework device includes a product receiving mechanism comprising two first belt conveyor assemblies spaced apart and arranged opposite to each other. The two first belt conveyor assemblies are respectively used to carry two opposite edges of an LED product. Each first belt conveyor assembly is provided with a product clamping mechanism, which includes a first clamping member and a lifting assembly. The first clamping member is connected to the frame of the first belt conveyor assembly and is at least partially located above the conveying surface of the first belt conveyor assembly. The lifting assembly includes a lifting driver, a lifting synchronizing member, and a lifting member. The lifting member is slidably connected to the frame of the first belt conveyor assembly in the vertical direction and is located below the conveying surface of the first belt conveyor assembly and the first clamping member. The lifting synchronizing member is slidably connected to the frame of the first belt conveyor assembly in the horizontal direction and is provided with a plurality of spaced rollers. The lifting member is provided with a plurality of oblique grooves that slide in a one-to-one correspondence with the rollers. The lifting driver is connected to the lifting synchronizing member and is used to drive the lifting synchronizing member to slide horizontally.

[0011] According to some embodiments of the first aspect of the present invention, the LED product repair equipment includes a product receiving mechanism with a first product blocking mechanism disposed between two first belt conveyor assemblies and used to block the LED product to prevent the LED product from continuing to be conveyed backward.

[0012] According to some embodiments of the first aspect of the present invention, the LED product repair equipment includes a product output device comprising a product output mechanism and a product testing mechanism. The product output mechanism includes two second belt conveyor modules spaced apart and arranged opposite to each other. The two second belt conveyor modules are respectively used to carry two opposite edges of the LED product. The product testing mechanism is disposed between the two second belt conveyor modules and includes a lifting driver and a lifting platform. The upper surface of the lifting platform is provided with test terminals, which are used to connect to the connection terminals on the LED product and supply power to the LED product.

[0013] According to some embodiments of the first aspect of the present invention, the LED product repair equipment further includes a product output device, which includes a visual recognition mechanism. The visual recognition mechanism includes a visual recognition module disposed above the product output mechanism. The visual recognition module is capable of acquiring an image of the LED product on the product output mechanism and identifying whether there are unlit chips in the LED product through the image. The visual recognition module is electrically connected to the control system.

[0014] According to some embodiments of the first aspect of the present invention, the LED product repair equipment includes a chip supply device comprising a chip disk switching platform, a top chip mechanism, and a chip disk position adjustment mechanism. The chip disk switching platform includes a turntable and a plurality of annular chip disks connected to the periphery of the turntable. The annular chip disks are used to support a film densely covered with chips. The top chip mechanism is disposed on one side of the turntable. Each annular chip disk can be moved to the top of the top chip mechanism under the drive of the turntable. The top chip mechanism includes a pin and a lifting drive module. The lifting drive module is connected to the pin and is used to drive the pin to rise and fall. When the pin is lifted, it can lift the chip on the film. The chip disk position adjustment mechanism is connected to the chip disk switching platform and is used to change the position of the annular chip disks so that each chip on the annular chip disk located above the top chip mechanism can be moved to the top of the pin.

[0015] According to some embodiments of the first aspect of the present invention, the LED product repair equipment further includes a top crystal mechanism that can be extended and retracted in a vertical direction, a top pin is connected to the top of the top rod assembly, and the lifting drive module includes a motor and a cam connected to the output shaft of the motor, with the lower end of the top rod assembly abutting against the cam.

[0016] According to some embodiments of the second aspect of the present invention, a rework method is applied to the LED product rework equipment of the first aspect embodiment described above. The rework method includes the following steps:

[0017] S100, control the horizontal drive mechanism to drive the worktable to move the LED product to the preset position below the solder rejection assembly module;

[0018] S200: Control the first positioning mechanism to obtain the location information of the defective chip on the LED product;

[0019] S300: Based on the location information of the defective chip, control the horizontal drive mechanism to adjust the position of the LED product so that one of the defective chips moves to the rejection position corresponding to the rejection mechanism, and then the defective chip is rejected by the rejection mechanism.

[0020] S400: Control the first moving mechanism to drive the first moving stage to move the soldering mechanism to the solder supply device to pick up solder, and then control the first moving mechanism to drive the first moving stage to move the soldering mechanism to move above the LED product, and apply solder to the area of ​​the LED product where the chip is rejected through the soldering mechanism.

[0021] S500: Control the second moving mechanism to drive the second moving stage to move the chip picking mechanism to the chip supply device to pick up the chip, and then control the second moving mechanism to drive the second moving stage to move the chip picking mechanism to the die-bonding position located between the product carrying moving device and the chip supply device.

[0022] S600: Control the horizontal drive mechanism to drive the worktable to move towards the side closer to the die-taking mechanism, so that the area on the LED product with soldering is moved to the die-bonding position. Simultaneously control the second moving mechanism to drive the second moving stage to carry the die-taking mechanism to move above the die-bonding position.

[0023] S700: The chip is mounted onto the soldering area of ​​the LED product by the chip-taking mechanism, and then the chip mounted on the soldering area is soldered onto the LED product by the laser welding mechanism.

[0024] S800, Repeat steps S300 to S700 until all defective chips are replaced by new chips; wherein, step S500 is executed simultaneously during the execution of steps S300 and S400.

[0025] The rework method according to some embodiments of the second aspect of the present invention has at least the following beneficial effects:

[0026] By adopting the rework method of this embodiment, defective chips on LED products can be removed one by one and replaced with new chips. Furthermore, during the repair process, the chip removal mechanism can operate synchronously with the chip removal mechanism and the soldering mechanism, which helps to improve the rework efficiency.

[0027] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0029] Figure 1 This is a schematic diagram of the structure of an LED product repair equipment according to an embodiment of the present invention;

[0030] Figure 2 for Figure 1 A top view of the LED product repair equipment shown.

[0031] Figure 3 for Figure 2 The diagram shows the structure of the solder removal assembly module after the first moving mechanism has been removed.

[0032] Figure 4 for Figure 3 A schematic diagram of the rejection mechanism shown in the figure;

[0033] Figure 5 for Figure 2 A schematic diagram of the tin supply device shown in the figure;

[0034] Figure 6 for Figure 2 A schematic diagram of the chip supply device shown in the figure;

[0035] Figure 7 for Figure 6 A schematic diagram of the top crystal mechanism shown in the figure;

[0036] Figure 8 for Figure 7 The diagram shows the connection structure between the lifting drive module, the push rod assembly, the lifting seat, and the push pin.

[0037] Figure 9 for Figure 2 The schematic diagram of the die-taking and welding assembly module shown in the figure after removing the second moving mechanism and the laser welding mechanism;

[0038] Figure 10 for Figure 2 A schematic diagram of the chip angle detection device shown in the figure;

[0039] Figure 11 for Figure 2 A schematic diagram of the structure of the product-carrying moving device shown in the image;

[0040] Figure 12 for Figure 11 A schematic diagram of the workbench shown in the figure;

[0041] Figure 13 for Figure 12 A schematic diagram of the lifting assembly shown in the figure;

[0042] Figure 14 for Figure 2 A schematic diagram of the product input device shown in the image;

[0043] Figure 15 for Figure 2 The diagram shows the structure of the product output device.

[0044] Figure label:

[0045] Product carrying and moving device 10; workbench 11; first belt conveyor assembly 111; first clamping member 112; lifting driver 113; lifting synchronizing member 114; roller 115; lifting member 116; inclined chute 117; first product stopping mechanism 12; stopping driver 121; stopping member 123; horizontal drive mechanism 13; first X-axis driver 131; first Y-axis driver 132; rotary drive mechanism 14; solder supply device 20; cleaning tank 2 1; Slurry tray; 22; Chip supply device; 30; Crystal disk switching platform; 31; Turntable; 311; Annular crystal disk; 312; Crystal disk position adjustment mechanism; 32; Second X-axis driver; 321; Second Y-axis driver; 322; Crystal ejector mechanism; 33; Ejector pin; 331; Motor; 332; Cam; 333; Ejector rod assembly; 334; X-axis adjusting slide; 335; Y-axis adjusting slide; 336; Z-axis adjusting slide; 337; Lifting seat; 338; Solder removal assembly module; 40; First movement Mechanism 41; First moving stage 42; First camera assembly 431; Height measuring assembly 432; Rejection mechanism 44; Rejection Y-axis driver 441; Rejection lifting driver 442; Rejection adsorption assembly 443; Soldering mechanism 45; Soldering driver 451; Glue tube 452; Die picking and soldering assembly module 50; Second moving mechanism 51; Second moving stage 52; Die picking mechanism 53; Suction head 531; Suction head rotation driver 532; Suction head lifting driver 533; Chip positioning camera 534; Pick-up detection camera 535; Chip angle detection device 60; Chip angle detection camera 61; Product input device 70; Third belt conveyor assembly 71; Barcode scanner 72; Product output device 80; Product output mechanism 81; Second belt conveyor module 811; Product testing mechanism 82; Test driver 821; Lifting platform 822; Second product stop mechanism 83; Visual recognition mechanism 84; Visual recognition module 841; Crossbeam 90. Detailed Implementation

[0046] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0047] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, left, right, front, back, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0048] In the description of this invention, the use of "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0049] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0050] The following is for reference only. Figure 1 To be continued Figure 15 This describes an LED product repair device according to a first aspect embodiment of the present invention.

[0051] Reference Figures 1 to 3 ,as well as Figure 9 and Figure 11The LED product rework equipment of this embodiment includes a product carrying and moving device 10, a solder supply device 20, a chip supply device 30, a solder rejection assembly module 40, a die removal and soldering assembly module 50, and a control system. The product carrying and moving device 10 includes a worktable 11 and a horizontal drive mechanism 13. The worktable 11 is connected to the horizontal drive mechanism 13 and can move along the X-axis and Y-axis directions under the drive of the horizontal drive mechanism 13. The solder supply device 20 is located on one side of the product carrying and moving device 10 in the X-axis direction. It is used to supply solder; the chip supply device 30 is located on the side of the product carrying moving device 10 away from the solder supply device 20, and is used to supply chips; the solder dispensing and rejection assembly module 40 includes a first moving mechanism 41 and a first moving stage 42. The first moving stage 42 is provided with a first positioning mechanism, a rejection mechanism 44 and a solder dispensing mechanism 45. The first positioning mechanism is used to position defective chips on the LED product, and the rejection mechanism 44 is used to reject defective chips on the LED product. The first moving mechanism 41 is connected to the first moving stage 42 and can... The first moving stage 42 is driven to move along the X-axis, so that the soldering mechanism 45 can move to the solder supply device 20 to pick up solder, and can move to the worktable 11 to apply solder to the area where the LED product chip is rejected; the die-picking and soldering assembly module 50 includes a second moving mechanism 51 and a second moving stage 52. The second moving stage 52 is equipped with a laser soldering mechanism (not shown in the figure) and a die-picking mechanism 53. The second moving mechanism 51 is connected to the second moving stage 52 and can drive the second moving stage 52 to move along the X-axis, so that the first moving stage 42 can ... The chip picking mechanism 53 can move to the chip supply device 30 to pick up the chip, and can move to the worktable 11 to mount the chip onto the soldering area of ​​the LED product. The laser welding mechanism is used to weld the chip mounted by the chip picking mechanism 53 onto the soldering area onto the LED product. The control system is electrically connected to the horizontal drive mechanism 13, the solder supply device 20, the chip supply device 30, the first moving mechanism 41, the first positioning mechanism, the rejection mechanism 44, the soldering mechanism 45, the second moving mechanism 51, the laser welding mechanism, and the chip picking mechanism 53.

[0052] It should be understood that, during the rework process of LED products, the LED product rework equipment of this embodiment can first move the LED product to a preset position below the soldering rejection assembly module 40 via the product carrying moving device 10, then obtain the position information of the defective chip on the LED product through the first positioning mechanism, and then adjust the position of the LED product through the horizontal driving mechanism 13 so that one of the defective chips moves to the rejection position corresponding to the rejection mechanism 44, and then the rejection mechanism 44 can reject this defective chip; then, the first moving mechanism 41 drives the first moving stage 42 to carry the soldering mechanism 45 to the solder supply device 20 to pick up solder, and then drives the soldering mechanism 45 to move above the LED product, so that the soldering mechanism 45 can apply solder to the area of ​​the LED product where the chip was rejected, in preparation for soldering a new chip; while rejecting defective chips, picking up solder and soldering, the second moving mechanism 51 can be used simultaneously. The second moving stage 52, carrying the chip-picking mechanism 53, is moved to the chip supply device 30 to pick up a new chip. Then, the chip-picking mechanism 53, carrying the new chip, is moved to the die-bonding position located on one side of the worktable 11 to await soldering. Next, the second moving stage 52, carrying the chip-picking mechanism 53, is moved by the second moving mechanism 51 to the area above the soldering area of ​​the LED product. The chip-picking mechanism 53 then attaches the new chip to the soldering position of the LED product. Finally, the laser welding mechanism solders the new chip to the LED product, thus completing the repair of a defective chip. This process is repeated multiple times to remove all defective chips and replace them with new ones. Therefore, the LED product rework equipment of this embodiment can remove defective chips from LED products one by one and replace them with new chips. Furthermore, during the repair process, the chip-picking mechanism 53 can operate synchronously with the removal mechanism 44 and the soldering mechanism 45, thereby improving rework efficiency.

[0053] Understandably, referring to Figure 1 and Figure 2 In some embodiments, the first moving stage 42 and the second moving stage 52 are slidably disposed on the same crossbeam 90 extending along the X-axis direction. Similarly, the first moving mechanism 41 and the second moving mechanism 51 are also disposed on the crossbeam 90.

[0054] It is understood that, in some of these embodiments, reference is made to... Figure 3The first positioning mechanism includes a first camera assembly 431 and two height measuring components 432 fixedly mounted on the first moving stage 42. The first camera assembly 431 and the two height measuring components 432 are used to obtain the precise position information of the LED product in the height direction, X-axis direction and Y-axis direction. In addition, the LED product has been tested for power-on before rework and the position information of each defective chip on the LED product has been obtained. Then, based on the precise position information of the LED product in the height direction, X-axis direction and Y-axis direction in the rework equipment, and the position information of each defective chip on the LED product, the precise position information of each defective chip on the LED product in the LED product rework equipment can be obtained.

[0055] It is understood that, in some of these embodiments, reference is made to... Figure 3 The soldering mechanism 45 includes a soldering driver 451 and a glue cartridge 452, wherein the soldering driver 451 is connected to the glue cartridge 452 and can drive the glue cartridge 452 to move up and down. (Refer to...) Figure 5 The solder supply device 20 includes a cleaning tank 21 and a slurry tray 22. The slurry tray 22 stores the solder, while the cleaning tank 21 is used to clean the dispensing head of the glue cartridge 452, and refers to... Figure 1 and Figure 2 The cleaning tank 21 and the slurry tray 22 are arranged along the X-axis on one side of the product carrying moving device 10. Thus, the soldering mechanism 45 can pass over the cleaning tank 21 and the slurry tray 22 under the drive of the first moving mechanism 41. After moving to the top of the cleaning tank 21, the soldering mechanism 45 can drive the glue cylinder 452 to move down through the soldering driver 451, and the dispensing needle of the glue cylinder 452 enters the cleaning tank 21 to clean the dispensing needle before taking the solder, thereby preventing impurities from entering the slurry tray 22 and contaminating the solder. When the soldering mechanism 45 moves to the top of the slurry tray 22, it can drive the glue cylinder 452 to move down through the soldering driver 451, and the dispensing needle of the glue cylinder 452 enters the slurry tray 22, so that the glue cylinder 452 can pick up the solder in the slurry tray 22 through the dispensing needle.

[0056] It is understood that, in some of these embodiments, reference is made to... Figure 4The rejection mechanism 44 includes a rejection Y-axis driver 441, a rejection lifting driver 442, and a rejection adsorption component 443. The rejection lifting driver 442 is connected to the drive end of the rejection Y-axis driver 441, while the rejection adsorption component 443 is connected to the drive end of the rejection lifting driver 442. Before rejecting defective chips, the horizontal drive mechanism 13 drives the worktable 11 to move according to the position information of the defective chip to be rejected, thereby adjusting the position of the LED product so that the chip to be rejected is positioned correctly. At the rejection position on the Y-axis side below the rejection mechanism 44, when rejecting a defective chip, the rejection adsorption component 443 first moves down to the Y-axis side of the chip to be rejected under the drive of the rejection lifting driver 442, and then removes the defective chip from the LED product under the drive of the rejection Y-axis driver 441. Simultaneously, the rejection adsorption component 443 can also remove the rejected defective chip and solder debris to prevent these residues from remaining on the LED product and affecting the mounting and soldering of new chips. It should be understood that since the rejection adsorption component 443 is prior art, it will not be described in detail here.

[0057] It is understood that, in some of these embodiments, reference is made to... Figure 6The chip supply device 30 includes a wafer switching platform 31 and a top crystal mechanism 33. The wafer switching platform 31 includes a turntable 311 and multiple annular wafers 312 connected to the periphery of the turntable 311. The top crystal mechanism 33 is located on one side of the turntable 311. Each annular wafer 312 can move to the top of the top crystal mechanism 33 under the drive of the turntable 311. The top crystal mechanism 33 includes a pin 331 and a lifting drive module. The lifting drive module is connected to the pin 331 and is used to drive the pin 331 to rise and fall. When the pin 331 is lifted, it can lift the chip on the diaphragm, which facilitates the separation of the chip from the diaphragm when the chip picking mechanism 53 picks the chip, thereby improving the success rate of chip picking. It should be understood that LED products typically include multiple chips that emit different colors of light. Therefore, after rejecting defective chips, it is necessary to remount chips of the same type with the same light-emitting color as the defective chips onto the LED product. Different annular crystal disks 312 are used to carry chip films of different light colors. Based on the light color of the rejected defective chip, the annular crystal disk 312 with the corresponding light-colored chip can be switched above the top crystal mechanism 33 via the turntable 311, so that the chip of the corresponding light color can be lifted by the ejector pin 331. Furthermore, since the film is densely covered with chips, to ensure that each chip on the film can be picked up by the chip picking mechanism 53, the chip supply device 30 also includes a crystal disk position adjustment mechanism 32. The crystal disk position adjustment mechanism 32 is connected to the crystal disk switching platform 31 and is used to adjust the position of the annular crystal disk 312, so that each chip on the annular crystal disk 312 above the top crystal mechanism 33 can move above the ejector pin 331, thereby allowing each chip on the film to be lifted by the ejector pin 331.

[0058] It should be understood that, in one embodiment, reference is made to... Figure 6 The disk position adjustment mechanism 32 includes a second X-axis driver 321 and a second Y-axis driver 322. The second X-axis driver 321 is connected to the driving part of the second Y-axis driver 322, and the disk switching platform 31 is connected to the driving part of the second Y-axis driver 322. Thus, the disk switching platform 31 can be moved along the X-axis and Y-axis respectively by the second X-axis driver 321 and the second Y-axis driver 322.

[0059] It is understood that in some embodiments, the chip-fetching mechanism 33 further includes a vertically extendable push rod assembly 334, with the chip ejector pin 331 connected to the top of the push rod assembly 334. The lifting drive module includes a motor 332 and a cam 333 connected to the output shaft of the motor 332, with the lower end of the push rod assembly 334 abutting against the cam 333. It should be understood that by using the motor 332 and the cam 333 in conjunction to drive the chip ejector pin 331 to lift, the consistency of each lifting stroke of the chip ejector pin 331 can be ensured, thereby improving lifting accuracy and increasing the success rate of the chip-fetching mechanism 53 in picking up the chip. For example, in some embodiments, referring to… Figure 7 and Figure 8 The top crystal mechanism 33 includes an X-axis adjustment slide 335, a Y-axis adjustment slide 336, a Z-axis adjustment slide 337, and a lifting seat 338. The X-axis adjustment slide 335 is connected to the drive unit of the Y-axis adjustment slide 336, and the Z-axis adjustment slide 337 is connected to the drive unit of the X-axis adjustment slide 335. The lifting seat 338 is connected to the drive unit of the Z-axis adjustment slide 337. The motor 332 in the lifting drive module is fixedly connected to the lifting seat 338, and the push rod assembly 334 can slide vertically through the lifting seat 338. The X-axis adjustment slide 335, the Y-axis adjustment slide 336, and the Z-axis adjustment slide 337 can respectively adjust the position of the push pin 331 in the X-axis, Y-axis, and height directions, so that the push pin 331 can be accurately adjusted to a position set below the center of one of the annular crystal disks 312.

[0060] It is understood that, in some of these embodiments, reference is made to... Figure 9The crystal picking mechanism 53 includes a pick-up component, a chip positioning camera 534, and a pick-up detection camera 535. The pick-up component includes a pick-up head 531, a pick-up head rotation driver 532, and a pick-up head lifting driver 533. The pick-up head 531 is connected to the output shaft of the pick-up head rotation driver 532, and the pick-up head rotation driver 532 is connected to the driving part of the pick-up head lifting driver 533. Thus, when the crystal picking mechanism 53 moves to the corresponding position above the top crystal mechanism 33, the pick-up head 531 can be driven to move downward by the pick-up head lifting driver 533 to pick up the chip that has been lifted from the diaphragm by the ejector pin 331 on the annular crystal disk 312. And when the chip picked up by the pick-up head 531 has an angular orientation deviation, the pick-up head rotation driver 532 can be used to correct the deviation. The drive head 531 rotates to carry the chip to adjust its angle and orientation; the chip positioning camera 534 is connected to one side of the suction assembly and shoots downwards to obtain the position of the chip in the annular disk 312 above the top crystal mechanism 33, so that the disk position adjustment mechanism 32 can adjust any chip to the position above the top pin 331 based on the position of the chip detected by the chip positioning camera 534; the suction detection camera 535 is also set on one side of the suction assembly and shoots towards the suction end of the suction head 531, and is used to detect whether the suction head 531 has adsorbed the chip. When it is detected that the suction head 531 has not successfully adsorbed the chip, the chip picking mechanism 53 can repeatedly pick up the chip until it is successfully picked up.

[0061] It is understood that, in some of these embodiments, reference is made to... Figure 10 The LED product rework equipment also includes a chip angle detection device 60, which is located between the product carrying moving device 10 and the chip supply device 30. The chip angle detection device 60 includes a chip angle detection camera 61, which faces upwards. The chip picking mechanism 53 can move to the die-bonding position above the chip angle detection device 60 under the drive of the first moving mechanism 41. The chip angle detection camera 61 is used to detect the angle and orientation of the chip picked up by the pick-up head 531 when the pick-up mechanism 53 is in the die-bonding position. The chip angle detection camera 61 is electrically connected to the control system. Therefore, the control system can control the pick-up head rotation driver 532 to drive the pick-up head 531 to rotate according to the chip angle and orientation detected by the chip angle detection camera 61, so as to adjust the chip angle.

[0062] Understandably, since laser welding mechanisms are existing technology, they will not be described in detail here.

[0063] It is understood that the chips on different LED products may have different arrangement orientations. To enable the LED product rework equipment to rework different LED products, in some embodiments, the product carrying moving device 10 further includes a rotary drive mechanism 14. The rotary drive mechanism 14 is connected to the worktable 11 and is used to drive the worktable 11 to rotate in the horizontal plane. The rotary drive mechanism 14 is electrically connected to the control system, so that the control system can control the rotary drive mechanism 14 to drive the worktable 11 to rotate according to the mounting orientation of the chips in the LED product to be reworked, thereby adjusting the posture angle of the LED product so that the posture and angle of the defective chips on the LED product can correspond to the rejection mechanism 44, the soldering mechanism 45, the chip picking mechanism 53, and the laser welding mechanism, etc. For example, in one embodiment, referring to... Figure 11 The horizontal drive mechanism 13 includes a first X-axis driver 131 arranged along the X-axis direction and a first Y-axis driver 132 arranged along the Y-axis direction. The first X-axis driver 131 is disposed on the drive part of the first Y-axis driver 132. The rotary drive mechanism 14 is connected to the drive part of the first X-axis driver 131, and the worktable 11 is connected to the drive part of the rotary drive mechanism 14. Thus, the worktable 11 can be driven to move along the X-axis and Y-axis by the first X-axis driver 131 and the first Y-axis driver 132 respectively, and the worktable 11 can be driven to rotate in the horizontal plane by the rotary drive mechanism 14, thereby realizing the position and posture adjustment of the LED product in three degrees of freedom in the horizontal plane.

[0064] It is understood that, in some of these embodiments, reference is made to... Figure 1 and Figure 2The LED product repair equipment also includes a product input device 70 and a product output device 80. The product input device 70 is used to input LED products into the LED product repair equipment, while the product output device 80 is used to output the repaired LED products to the outside of the LED product repair equipment. Specifically, the product input device 70 and the product output device 80 are arranged along the X-axis on opposite sides of the product carrying and moving device 10. A product receiving mechanism is provided on the worktable 11. The product receiving mechanism can dock with the product input device 70 or the product output device 80 under the drive of the horizontal drive mechanism 13, and the product input device 70 and the product output device 80 are electrically connected to the control system. In the above structure, when LED products are being reworked, the LED products are first placed on the product input device 70. Then, the LED products are moved towards the side closest to the product carrying moving device 10 by the product input device 70. Simultaneously, the product receiving mechanism, driven by the rotary drive mechanism 14, rotates to a position capable of docking with the product input device 70. Then, driven by the horizontal drive mechanism 13, one end of the product receiving mechanism docks with the product input device 70 to receive the LED products transported by the product input device 70. Finally, driven by the horizontal drive mechanism 13 and the rotary drive mechanism 14, it moves in a suitable posture to a preset position below the solder rejection assembly module 40 to await the rejection of defective chips. When the LED product rework is completed, the product receiving mechanism, driven by the rotary drive mechanism 14, rotates to a position capable of docking with the product output device 80. Then, driven by the horizontal drive mechanism 13, one end of the product receiving mechanism docks with the product output device 80, and the LED products are transported to the product output device 80. Finally, the LED products are removed from the LED product rework equipment by the transport of the product output device 80.

[0065] It should be understood that, in some of these embodiments, reference is made to... Figure 14 The product input device 70 includes two third belt conveyor assemblies 71 that are spaced apart and arranged opposite to each other. A barcode scanner 72 is also provided above the two third belt conveyor assemblies 71. The two first belt conveyor assemblies 111 are respectively used to carry the two opposite edges of the LED product. The scanner can scan the LED product conveyed by the two third belt conveyor assemblies 71. The barcode scanner 72 is electrically connected to the control system, and can then transmit the information of the current LED product obtained by scanning (such as the coding information of the current LED product and the location information of each defective chip detected by the upstream inspection process on the LED product) to the control system.

[0066] It is understandable that the LED product needs to be positioned before rejecting defective chips to prevent it from moving on the product receiving mechanism and thus failing to accurately reject and replace the defective chips; for example, in one embodiment, referring to Figures 11 to 13 The product receiving mechanism includes two first belt conveyor assemblies 111 spaced apart and arranged opposite to each other. Each first belt conveyor assembly 111 is used to carry two opposite edges of the LED product. Each first belt conveyor assembly 111 is equipped with a product clamping mechanism, which includes a first clamping member 112 and a lifting assembly. The first clamping member 112 is connected to the frame of the first belt conveyor assembly 111 and is at least partially located above the conveying surface of the first belt conveyor assembly 111. The lifting assembly includes a lifting mechanism. The device includes a driver 113, a lifting synchronizing element 114, and a lifting element 116. The lifting element 116 is slidably connected vertically to the frame of the first belt conveyor assembly 111 and is located below the conveying surface of the first belt conveyor assembly 111 and the first clamping element 112. The lifting synchronizing element 114 is slidably connected horizontally to the frame of the first belt conveyor assembly 111 and is provided with a plurality of spaced rollers 115. The lifting element 116 is provided with a plurality of rollers that slide one-to-one with the rollers 115. The inclined slide 117 is matched with the lifting driver 113, which is connected to the lifting synchronizing member 114 and is used to drive the lifting synchronizing member 114 to slide horizontally. With the above structure, when the LED product is delivered to the product receiving mechanism, the lifting driver 113 pushes the lifting synchronizing member 114 to slide forward (for example, the lifting synchronizing member 114 slides towards the first product stopping mechanism 12), and then, with the cooperation of the roller 115 and the inclined slide 117, the lifting member 116 can be driven to lift upward, so that the lifting member 116... The first clamping member 112 can clamp and lock the LED product on the product receiving mechanism. After the LED product is repaired, the lifting driver 113 pushes the lifting synchronizing member 114 to slide in the opposite direction. Then, with the help of the roller 115 and the inclined slide 117, the lifting member 116 can be driven to move down, so that the lifting member 116 moves away from the first clamping member 112 and releases the LED product on the product receiving mechanism, so that the LED product can be transported to the product output device 80 by the first belt conveyor assembly 111.

[0067] It should be understood that, compared to the method of directly connecting the lifting driver 113 to the lifting member 116 with a vertically set lifting driver 113, the method of using the lifting synchronization member 114, roller 115 and inclined slide 117 in conjunction with the lifting driver 113 to drive the lifting member 116 can ensure that all parts of the lifting member 116 in the length direction can be lifted synchronously, thereby improving the stability of clamping and locking the LED product.

[0068] It is understood that in some embodiments, the product receiving mechanism is provided with a first product stopping mechanism 12, which is disposed between two first belt conveyor assemblies 111 and is used to stop the LED product to prevent it from continuing to be conveyed backward. This allows the LED product to be pre-positioned at a set position on the product receiving mechanism, thereby enabling the product clamping mechanism to clamp and lock the LED product at the set position. For example, refer to... Figure 12 and Figure 13 In one embodiment, the first product blocking mechanism 12 includes a blocking driver 121 and a blocking member 123. The end of the lifting member 116 facing away from the product input device 70 is opposite to the blocking member 123. The blocking driver 121 is connected to the blocking member 123 and is used to drive the blocking member 123 to move up and down between the blocking position and the avoidance position. When in the blocking position, the top of the blocking member 123 is higher than the conveying surface of the first belt conveyor assembly 111 to block the LED product conveyed by the first belt conveyor assembly 111. When in the avoidance position, the blocking member 123 is lower than the conveying surface, allowing the LED product to continue to be conveyed backward.

[0069] It is understood that, in order to detect whether LED products are qualified for rework, in some embodiments, the product output device 80 includes a product output mechanism 81 and a product testing mechanism 82. The product output mechanism 81 can receive LED products from the product receiving mechanism, while the product testing mechanism 82 is used to perform power-on tests on the LED products on the product output mechanism 81, so as to evaluate whether the rework is qualified by observing the lighting status of each chip on the LED products.

[0070] For example, in one embodiment, reference Figure 15The product output mechanism 81 includes two second belt conveyor modules 811 that are spaced apart and arranged opposite to each other. The two second belt conveyor modules 811 are respectively used to carry the two opposite edges of the LED product. The product testing mechanism 82 is arranged between the two second belt conveyor modules 811 and includes a test driver 821 and a lifting platform 822. The upper surface of the lifting platform 822 is provided with test terminals (not shown in the figure). The test terminals are used to connect to the connection terminals on the LED product and supply power to the LED product. Similarly, a second product blocking mechanism 83 is provided on the product output mechanism 81. The second product blocking mechanism 83 has the same structure as the first product blocking mechanism 12 and is located between the two second belt conveyor modules 811, on the side of the product output mechanism 81 away from the product carrying moving device 10. Thus, the second product blocking mechanism 83 can block the LED product from continuing to be conveyed backward, thereby pre-positioning the LED product in the set position of the product output mechanism 81, and making the connection terminal on the LED product above the test terminal on the lifting platform 822. Thus, after the test driver 821 drives the lifting platform 822 to lift, the test terminal can be correctly connected to the connection terminal of the LED product.

[0071] It is understandable that, in order to automatically identify whether LED products are qualified for repair, in some embodiments, reference is made to... Figure 15 The product output device 80 also includes a visual recognition mechanism 84, which includes a visual recognition module 841 disposed above the product output mechanism 81. The visual recognition module 841 can acquire images of LED products on the product output mechanism 81 and identify whether there are unlit chips in the LED products through the images, as well as obtain the position information of the unlit chips in the LED products. The visual recognition module 841 is electrically connected to the control system. When the visual recognition module 841 identifies that there are unlit chips in the LED products, it can transmit the current LED product's encoding information and the position information of the unlit chips in the current LED products to the control system, and then transmit it to the downstream process equipment so that the downstream process equipment can distinguish between qualified and unqualified LED products.

[0072] The following describes a rework method according to some embodiments of the second aspect of the present invention. The rework method of this embodiment is applied to the LED product rework equipment of the first aspect embodiment described above. The rework method of this embodiment includes, but is not limited to, the following steps S100 to S800.

[0073] S100: Control the horizontal drive mechanism 13 to drive the worktable 11 to move the LED product to a preset position below the soldering rejection assembly module 40.

[0074] S200: Control the first positioning mechanism to obtain the location information of defective chips on the LED product;

[0075] S300: Based on the location information of the defective chip, control the horizontal drive mechanism 13 to adjust the position of the LED product so that one of the defective chips moves to the rejection position corresponding to the rejection mechanism 44, and then the defective chip is rejected by the rejection mechanism 44.

[0076] S400: Control the first moving mechanism 41 to drive the first moving stage 42 to carry the soldering mechanism 45 to move to the solder supply device 20 to pick up solder, and then control the first moving mechanism 41 to drive the first moving stage 42 to carry the soldering mechanism 45 to move above the LED product, and apply solder to the area of ​​the LED product where the chip is rejected through the soldering mechanism 45.

[0077] S500: Control the second moving mechanism 51 to drive the second moving stage 52 to carry the chip picking mechanism 53 to move to the chip supply device 30 to pick up the chip, and then control the second moving mechanism 51 to drive the second moving stage 52 to carry the chip picking mechanism 53 to move to the die-bonding position located between the product carrying moving device and the chip supply device (30).

[0078] It should be understood that step S500 can be executed simultaneously with steps S300 and S400.

[0079] S600: Control the horizontal drive mechanism 13 to drive the worktable 11 to move closer to the die-taking mechanism 53, so that the area on the LED product with soldering is moved to the die-bonding position, and simultaneously control the second moving mechanism 51 to drive the second moving stage 52 to carry the die-taking mechanism 53 to move above the die-bonding position.

[0080] S700: The chip is mounted onto the soldering area of ​​the LED product by the chip-taking mechanism 53, and then the chip mounted on the soldering area is soldered onto the LED product by the laser welding mechanism.

[0081] S800: Repeat steps S300 to S700 until all defective chips are replaced by new chips.

[0082] It should be understood that by adopting the rework method of this embodiment, defective chips on LED products can be removed one by one and replaced with new chips. Furthermore, during the repair process, the chip removal mechanism 53 can operate synchronously with the rejection mechanism 44 and the soldering mechanism 45, which is beneficial to improving the rework efficiency.

[0083] It is understandable that for LED product repair equipment equipped with a product input device 70, the following steps S010 are included before performing the above step S100: placing the LED product on the product input device 70, then controlling the product input device 70 to transport the LED product to the side closer to the product carrying moving device 10. At the same time, controlling the rotary drive mechanism 14 to rotate and adjust the product receiving mechanism to an angle that can dock with the product input device 70, and then adjusting the position of the product receiving mechanism through the horizontal drive mechanism 13 so that the product receiving mechanism docks with the product input device 70 and receives the LED product.

[0084] It is understandable that for LED product repair equipment equipped with a product output device 80, after performing the above step S800, the following steps S910 and S920 are also included.

[0085] S910: Control the rotary drive mechanism 14 to rotate and adjust the product receiving mechanism to an angle that can dock with the product output device 80. Then, adjust the position of the product receiving mechanism through the horizontal drive mechanism 13 so that the product receiving mechanism docks with the product output device 80, and control the product receiving mechanism to deliver the LED product to the product output device 80.

[0086] S920: Control product output device 80 to output LED products to the outside of LED product repair equipment.

[0087] It should be understood that for the product output device 80, which includes a product testing mechanism 82 and a visual recognition mechanism 84, the above step S920 also includes the following sub-steps.

[0088] S921: Controls the test driver 821 to drive the lifting platform 822 to rise and connect the test terminals on the lifting platform 822 to the connection terminals on the LED product, and then supplies power to the LED product through the test terminals;

[0089] S922: The control vision recognition module 841 acquires an image of the LED product on the product output mechanism 81, and identifies whether there is an unlit chip in the LED product through the image, as well as the position information of the unlit chip in the LED product. When the vision recognition module 841 identifies that there is an unlit chip in the LED product, it transmits the current LED product's encoding information and the position information of the unlit chip in the current LED product to the control system, and then transmits it to the equipment of the downstream process through the control system.

[0090] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An LED product repair device, characterized in that, include: The product carrying and moving device includes a worktable and a horizontal drive mechanism. The worktable is connected to the horizontal drive mechanism and can move along the X-axis and Y-axis directions under the drive of the horizontal drive mechanism. A solder supply device is located on one side of the product carrying and moving device in the X-axis direction and is used to supply solder. A chip supply device is disposed on the side of the product carrying moving device away from the solder supply device, and is used to supply chips; The soldering rejection assembly module includes a first moving mechanism and a first moving stage. The first moving stage is equipped with a first positioning mechanism, a rejection mechanism, and a soldering mechanism. The first positioning mechanism is used to locate defective chips on the LED product, and the rejection mechanism is used to reject defective chips on the LED product. The first moving mechanism is connected to the first moving stage and can drive the first moving stage to move along the X-axis, so that the soldering mechanism can move to the solder supply device to pick up solder and can move to the worktable to apply solder to the area of ​​the LED product where the rejected chips are located. The die-taking and soldering assembly module includes a second moving mechanism and a second moving stage. The second moving stage is equipped with a laser soldering mechanism and a die-taking mechanism. The second moving mechanism is connected to the second moving stage and can drive the second moving stage to move along the X-axis, so that the die-taking mechanism can move to the chip supply device to pick up the chip and can move to the worktable to mount the chip onto the soldering area of ​​the LED product. The laser soldering mechanism is used to solder the chip mounted to the soldering area by the die-taking mechanism onto the LED product. The control system is electrically connected to the horizontal drive mechanism, the solder supply device, the chip supply device, the first moving mechanism, the first positioning mechanism, the rejection mechanism, the soldering mechanism, the second moving mechanism, the laser welding mechanism, and the crystal picking mechanism.

2. The LED product repair equipment according to claim 1, characterized in that, The product carrying and moving device also includes a rotary drive mechanism, which is connected to the worktable and is used to drive the worktable to rotate in the horizontal plane. The rotary drive mechanism is electrically connected to the control system.

3. The LED product repair equipment according to claim 2, characterized in that, It also includes a product input device and a product output device, which are located on opposite sides of the product carrying and moving device along the X-axis. A product receiving mechanism is provided on the worktable, which can dock with the product input device or the product output device under the drive of the horizontal drive mechanism. The product input device and the product output device are electrically connected to the control system.

4. The LED product repair equipment according to claim 3, characterized in that, The product receiving mechanism includes two first belt conveyor assemblies spaced apart and arranged opposite to each other. The two first belt conveyor assemblies are respectively used to carry two opposite edges of the LED product. Each first belt conveyor assembly is provided with a product clamping mechanism. The product clamping mechanism includes a first clamping member and a lifting assembly. The first clamping member is connected to the frame of the first belt conveyor assembly and is at least partially located above the conveying surface of the first belt conveyor assembly. The lifting assembly includes a lifting driver, a lifting synchronizing member, and a lifting member. The lifting member is slidably connected to the frame of the first belt conveyor assembly in the vertical direction and is located below the conveying surface of the first belt conveyor assembly and the first clamping member. The lifting synchronizing member is slidably connected to the frame of the first belt conveyor assembly in the horizontal direction and is provided with a plurality of spaced rollers. The lifting member is provided with a plurality of oblique grooves that slide in a one-to-one correspondence with the rollers. The lifting driver is connected to the lifting synchronizing member and is used to drive the lifting synchronizing member to slide horizontally.

5. The LED product repair equipment according to claim 4, characterized in that, The product receiving mechanism is provided with a first product stopping mechanism, which is located between the two first belt conveyor components and is used to stop the LED product to prevent the LED product from continuing to be conveyed backward.

6. The LED product repair equipment according to claim 3, characterized in that, The product output device includes a product output mechanism and a product testing mechanism. The product output mechanism includes two second belt conveyor modules that are spaced apart and arranged opposite each other. The two second belt conveyor modules are respectively used to carry the two opposite edges of the LED product. The product testing mechanism is arranged between the two second belt conveyor modules and includes a lifting driver and a lifting platform. The upper surface of the lifting platform is provided with test terminals. The test terminals are used to connect to the connection terminals on the LED product and supply power to the LED product.

7. The LED product repair equipment according to claim 6, characterized in that, The product output device also includes a visual recognition mechanism, which includes a visual recognition module disposed above the product output mechanism. The visual recognition module can acquire an image of the LED product on the product output mechanism and identify whether there are unlit chips in the LED product through the image. The visual recognition module is electrically connected to the control system.

8. The LED product repair equipment according to claim 1, characterized in that, The chip supply device includes a wafer switching platform, a top wafer mechanism, and a wafer position adjustment mechanism. The wafer switching platform includes a turntable and multiple annular wafers connected to the periphery of the turntable. The annular wafers are used to support films densely covered with chips. The top wafer mechanism is located on one side of the turntable. Each annular wafer can be moved above the top wafer mechanism under the drive of the turntable. The top wafer mechanism includes a pin and a lifting drive module. The lifting drive module is connected to the pin and is used to drive the pin to rise and fall. When the pin is lifted, it can lift the chips on the film. The wafer position adjustment mechanism is connected to the wafer switching platform and is used to change the position of the annular wafers so that each chip on the annular wafer located above the top wafer mechanism can be moved above the pin.

9. The LED product repair equipment according to claim 8, characterized in that, The top crystal mechanism also includes a top rod assembly that can be extended and retracted in a vertical direction. The top pin is connected to the top of the top rod assembly. The lifting drive module includes a motor and a cam connected to the output shaft of the motor. The lower end of the top rod assembly abuts against the cam.

10. A method for repairing LED products, characterized in that, The method, applied to the LED product repair equipment as described in any one of claims 1 to 9, comprises the following steps: S100: Control the horizontal drive mechanism to drive the workbench to move the LED product to a preset position below the solder removal assembly module; S200: Control the first positioning mechanism to obtain the location information of the defective chip on the LED product; S300. Based on the position information of the defective chip, control the horizontal driving mechanism to adjust the position of the LED product so that one of the defective chips moves to the rejection position corresponding to the rejection mechanism, and then the defective chip is rejected by the rejection mechanism. S400: Control the first moving mechanism to drive the first moving stage to carry the soldering mechanism to move to the solder supply device to pick up solder, and then control the first moving mechanism to drive the first moving stage to carry the soldering mechanism to move above the LED product, and apply solder to the area of ​​the LED product where the chip is rejected through the soldering mechanism. S500: Control the second moving mechanism to drive the second moving stage to carry the crystal picking mechanism to the chip supply device to pick up the chip, and then control the second moving mechanism to drive the second moving stage to carry the crystal picking mechanism to the position to be solidified between the product carrying moving device and the chip supply device; S600: Control the horizontal drive mechanism to drive the worktable to move towards the side closer to the die-taking mechanism, so that the area on the LED product with soldering is moved to the die-bonding position, and simultaneously control the second moving mechanism to drive the second moving stage to carry the die-taking mechanism to move above the die-bonding position. S700: The chip is mounted onto the soldering area of ​​the LED product by the chip-taking mechanism, and then the chip mounted onto the soldering area is soldered onto the LED product by the laser welding mechanism. S800, Repeat steps S300 to S700 until all defective chips are replaced by new chips. Step S500 is executed simultaneously during the execution of steps S300 and S400.

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