Die bonding device for electronic component production

By designing a crystal solid device for electronic components production, the problems of poor motion stability and poor clamping effect of wafer drive devices in the prior art are solved, and higher crystal absorption accuracy and production efficiency are achieved.

CN119630135AActive Publication Date: 2025-03-14JIANGSU FENGYUAN ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202510153701.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-12
Publication Date
2025-03-14
Estimated Expiration
2045-02-12

AI Technical Summary

Technical Problem

The existing wafer driving devices have poor movement stability during use, which affects crystal absorption accuracy and efficiency. The clamping equipment has poor clamping effect on the side wall of the wafer, which is easy to cause deflection.

Method used

A solid crystal device for the production of electronic components is designed, including a base plate, a clamping fixing assembly and a driving assembly. The clamping fixing assembly realizes the adjustment of the wafer position through the fitting of the plug-in and the partition, and uses elastic capsules and gas circulation to achieve the fixation of the clamps and gears, thereby ensuring the stable fixation of the wafer.

Benefits of technology

It improves the accuracy and efficiency of wafer position adjustment, enhances the fixing effect on the wafer, reduces the risk of deflection, and thus improves crystal absorption accuracy and production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a die bonding device for electronic component production, and belongs to the technical field of electronic component production, the die bonding device comprises a bottom plate, a clamping and fixing assembly and a driving assembly are mounted on the bottom plate, one end of the driving assembly is arranged at the lower end of the clamping and fixing assembly and is movably connected with the bottom wall of the clamping and fixing assembly, and the other end of the driving assembly is movably connected with the bottom wall of the clamping and fixing assembly. A regulation and control assembly is mounted on the driving assembly, and the regulation and control assembly is connected with the clamping and fixing assembly in a penetrating manner; the inclined surfaces of the first plug-in unit and the second plug-in unit are gradually inserted into the groove holes between the partition plates in turn, the partition plates can be pushed to rotate clockwise, and the position of the wafer can be adjusted. When a clamping plate on the first clamping piece is pushed, a gear can be driven to rotate through one tooth piece, and then the other tooth piece is driven to move, so that a wafer placed on the adjusting disc can be fixed conveniently; and gas enters the upper fixing bag and the lower fixing bag, and the upper fixing bag and the lower fixing bag bulge to realize the fixation of the gear, so that the fixation of the wafer is realized.
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Description

Technical Field

[0001] The invention belongs to the technical field of electronic component production, and in particular relates to a crystal bonding device for electronic component production. Background Art

[0002] Die bonding is the process of bonding the chip to the designated area of ​​the bracket through colloid (generally conductive glue or insulating glue for LED) to form a thermal path or electrical path to provide conditions for subsequent wire bonding. The die bonding machine, also known as the die attaching machine, chip pasting machine or chip binding machine, is a mechanical equipment specially used in the semiconductor packaging process to fix the chip on an appropriate carrier for subsequent packaging processing, such as packaging, testing and assembly steps.

[0003] In the operation of the crystal bonding machine, the wafer is usually supported by the crystal supply platform, and then the chip on the wafer is sucked by the crystal bonding nozzle, and the solder joints between the chip and the packaging substrate are firmly connected to achieve crystal bonding. In the process of the crystal bonding nozzle sucking the chip, a wafer drive device is usually required to drive the crystal supply platform to rotate, so as to cooperate with the crystal bonding nozzle to make the chip suction more convenient. In the process of chip transfer, it is necessary to ensure that the wafer disk is fixed to facilitate adsorption and the position does not shift. However, most of the existing wafer drive devices have the problem of poor motion stability when used, which seriously affects the accuracy and efficiency of crystal suction. In addition, the existing clamping equipment for fixing the wafer disk usually clamps the wafer disk on both sides, but there are still the following defects: the side wall of the wafer disk is pressed and clamped, the clamping effect is poor, and it is easy to cause the wafer disk to deflect. Summary of the invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a die bonding device for electronic component production, which at least partially solves the above technical problems.

[0005] The technical solution adopted by the present invention is as follows: a die bonding device for electronic component production, comprising a base plate for supporting and fixing, a clamping and fixing component and a driving component are installed on the base plate, one end of the driving component is arranged at the lower end of the clamping and fixing component and is movably connected to the bottom wall of the clamping and fixing component, a regulating component is installed on the driving component, and the regulating component is connected through the clamping and fixing component; The cam is provided with a locking plate, and the locking plate is connected with a locking plate to lock the locking plate, wherein the locking plate is secured on a pivotal position to the bottom of the base and are secured on a platform.

[0006] Among them, a ventilation cavity is provided in the plug-in, a ventilation hole is provided on one side wall of the plug-in, a fixed bag is installed on the outer side of the plug-in, the ventilation hole is provided in the fixed bag, the ventilation cavity is connected with the ventilation hole, and the gas in the ventilation cavity enters the fixed bag through the ventilation hole.

[0007] Preferably, the clamping and fixing assembly includes a clamping member 1, an adjustment disk and a clamping member 2, the adjustment disk is movably arranged on the base plate, the base plate supports and fixes the adjustment disk, the clamping member 1 and the clamping member 2 are both movably clamped in the adjustment disk, and the clamping member 1 and the clamping member 2 are placed in a centrally symmetrical manner.

[0008] The cam is provided with a toothed assembly which is adapted to engage with the toothed assembly and to engage with the toothed assembly in a manner that is adapted to engage with the toothed assembly in a manner that is adapted to engage with the toothed assembly in a manner that is adapted to engage with the toothed assembly in a manner that is adapted to engage with the toothed assembly in a manner that is adapted to engage with the toothed assembly in a manner that is adapted to engage with the toothed assembly in a manner that is

[0009] Among them, the bottom wall of the adjustment plate is evenly installed with multiple groups of partitions for dividing the space at equal intervals in the circumferential direction, and slots are provided between two adjacent groups of partitions. The plug-in 1 is arranged on the outer side of the partition, and the plug-in 2 is arranged on the inner side of the partition. The spacing width between the slots is greater than the width of the partition.

[0010] Furthermore, the structures of the clamping member 1 and the clamping member 2 are the same, and only one group is introduced here. The clamping member 1 includes a clamping plate and a gear condition, one end of the gear condition is movably clamped in the cavity, and the other end of the gear condition extends out of the cavity. The gear condition on the clamping member 1 and the gear condition on the clamping member 2 are both meshed with the gear, and the gear condition on the clamping member 1 and the gear condition on the clamping member 2 are placed in a centrally symmetrical manner. The clamping plate is connected to one end of the gear condition extending out of the cavity.

[0011] Among them, the regulating component includes a connecting plate and a sliding plate, the connecting plate is arranged on the upper wall of the slider, the slider supports and fixes the connecting plate, the sliding plate is movably clamped on the upper wall of the slider, an elastic bag is installed between the connecting plate and the sliding plate, the connecting plate, the sliding plate and the elastic bag are sealed, and the side wall of the sliding plate is provided with a magnetic part.

[0012] As a preferred embodiment of the present invention, a ventilation pipe 1 is installed on the side wall of the connecting plate, and the ventilation pipe 1 connects the elastic bag and the ventilation cavity 1. A control valve is provided in the ventilation pipe 1 to facilitate the control of gas circulation. A ventilation pipe 2 is provided in the base plate, and a connecting pipe is installed on the base plate. One end of the connecting pipe passes through the connecting plate and is connected with the elastic bag, and the other end of the connecting pipe is connected with the ventilation pipe 2. The connecting pipe is made of foldable material, and the ventilation pipe 2 is connected with the ventilation pipe 3. A control valve is provided in the connecting pipe to facilitate the control of gas circulation.

[0013] Furthermore, a hydraulic rod is installed on the support seat, and a push plate 1 and a push plate 2 are installed on the movable end of the hydraulic rod. The push plate 2 is arranged at the end of the hydraulic rod and is arranged close to the clamping member 1. The push plate 1 is arranged between the baffle plate and the sliding plate. A magnetic member 2 is provided on one side wall of the push plate, and the magnetic properties of the magnetic member 1 and the magnetic member 2 are different.

[0014] Furthermore, a third vent hole is installed on the side wall of the sliding plate, and a control valve is installed in the third vent hole to facilitate the control of the flow of gas in the elastic bag.

[0015] After adopting the above structure, the beneficial effects of the present invention are as follows: (1) The inclined surfaces of plug-in 1 and plug-in 2 are gradually inserted into the slots between the partitions in turn. As the plug-ins continue to move, the inclined surfaces push the partitions to rotate clockwise, and the partitions drive the adjustment disk to rotate clockwise to adjust the wafer position.

[0016] (2) The sliding plate moves along the slider to squeeze the elastic bag, and the gas in the elastic bag enters the fixed bag through the ventilation tube 1, the ventilation cavity 1, and the ventilation hole 1. The fixed bag bulges and fits the side wall of the partition, which is convenient for fixing the plug-in 1, thereby achieving the fixation of the adjustment plate.

[0017] (3) When the clamping plate on the clamping part 1 is subjected to thrust, it drives the gear condition to move toward the direction close to the adjustment disk. The gear condition on the clamping part 1 drives the gear to rotate, and the gear drives another set of gear conditions to move, thereby driving the clamping plate on the clamping part 2 to move toward the direction close to the adjustment disk, thereby facilitating the fixation of the wafer placed on the adjustment disk.

[0018] (4) The gas in the elastic bag enters into the ventilation tube 2, and enters into the ventilation cavity 2 through the ventilation tube 3. The gas in the ventilation cavity 2 enters into the upper fixed bag and the lower fixed bag through the ventilation hole 2. The upper fixed bag and the lower fixed bag are both bulged and respectively arranged to fit the upper wall and the bottom wall of the cavity, thereby fixing the gear, thereby fixing the clamping plate, and further fixing the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0020] Figure 1 A schematic structural diagram of a die bonding device for electronic component production proposed by the present invention; Figure 2 This is a schematic diagram of the structure of the control component proposed in the present invention; Figure 3 This is a front perspective view of a die bonding device for electronic component production proposed by the present invention; Figure 4 for Figure 3 A local enlarged view of point A; Figure 5 for Figure 3 A local enlarged view of point B; Figure 6 A cross-sectional view of a die bonding device for electronic component production proposed by the present invention Figure 1 ; Figure 7 for Figure 6 A local enlarged view of point C; Figure 8 for Figure 6 A local enlarged view of D; Fig. 9 A cross-sectional view of a die bonding device for electronic component production proposed by the present invention Figure 2 ; Fig.10 A cross-sectional view of a die bonding device for electronic component production proposed by the present invention Figure 3 .

[0021] In the attached drawings: 1, bottom plate, 2, clamping and fixing assembly, 3, driving assembly, 4, regulating assembly, 5, limiting member, 6, slider, 7, supporting seat, 8, baffle, 9, spring, 10, plug-in 1, 11, plug-in 2, 12, placement groove, 13, ventilation cavity 1, 14, fixing bag, 15, ventilation hole 1, 16, clamping member 1, 17, adjusting plate, 18, clamping member 2, 19, mounting seat, 20, cavity, 21, Gear, 22, upper fixed bag, 23, lower fixed bag, 24, ventilation chamber two, 25, ventilation hole two, 26, ventilation tube three, 27, partition, 28, slot hole, 29, clamping plate, 30, gear condition, 31, connecting plate, 32, sliding plate, 33, elastic bag, 34, ventilation tube one, 35, ventilation tube two, 36, connecting tube, 37, hydraulic rod, 38, push plate one, 39, push plate two, 40, ventilation hole three. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0023] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0024] like Figure 1-Figure 10 As shown, a die bonding device for electronic component production includes a base plate 1 for supporting and fixing, a clamping and fixing component 2 and a driving component 3 are installed on the base plate 1, one end of the driving component 3 is arranged at the lower end of the clamping and fixing component 2, and is movably connected to the bottom wall of the clamping and fixing component 2, and a regulating component 4 is installed on the driving component 3, and the regulating component 4 is connected to the clamping and fixing component 2; The driving assembly 3 includes a limiter 5, which is arranged on the upper wall of the bottom plate 1, one end of which is arranged at the lower end of the clamping and fixing assembly 2, a limiter groove is arranged in the limiter 5, a slider 6 is movably connected in the limiter groove, and the regulating assembly 4 is arranged on the slider 6. The driving assembly 3 also includes a support seat 7, which is arranged on the upper wall of the bottom plate 1, and the support seat 7 is connected to one end of the limiter 5 away from the clamping and fixing assembly 2, and a baffle 8 is installed on the side of the slider 6 close to the support seat 7, and between the baffle 8 and the support seat 7 A spring 9 is installed, and a plug-in 10 and a plug-in 2 11 are installed on the upper wall of the slider 6 away from the support seat 7. The plug-in 10 is placed close to the support seat 7, and the plug-in 2 11 is placed away from the support seat 7. The plug-in 10 and the plug-in 2 11 are staggered. The end of the plug-in 10 close to the plug-in 2 11 is inclined, and the end of the plug-in 2 11 close to the plug-in 10 is inclined. A placement groove 12 is provided between the plug-in 10 and the plug-in 2 11, and balls are provided on the inclined surfaces of the plug-in 10 and the inclined surfaces of the plug-in 2 11.

[0025] A ventilation cavity 13 is provided in the plug-in 10, a ventilation hole 15 is provided on the side wall of the plug-in 10, a fixing bag 14 is installed on the outside of the plug-in 10, the ventilation hole 15 is provided in the fixing bag 14, the ventilation cavity 13 is connected with the ventilation hole 15, and the gas in the ventilation cavity 13 enters the fixing bag 14 through the ventilation hole 15.

[0026] The clamping and fixing assembly 2 includes a clamping member 16, an adjustment disk 17 and a clamping member 2 18. The adjustment disk 17 is movably arranged on the base plate 1. The base plate 1 supports and fixes the adjustment disk 17. The clamping member 16 and the clamping member 2 18 are both movably clamped in the adjustment disk 17, and the clamping member 16 and the clamping member 2 18 are placed in a centrally symmetrical manner.

[0027] A mounting seat 19 is provided at the center of the bottom wall of the adjustment disk 17, and the mounting seat 19 is movably mounted on the upper wall of the bottom plate 1. A cavity 20 is provided in the adjustment disk 17, and both ends of the cavity 20 are arranged through the side walls of the adjustment disk 17. The clamping member 16 and the clamping member 2 18 are both movably connected in the cavity 20. A gear 21 is movably installed in the middle of the cavity 20, and the gear 21 is arranged at the upper end of the mounting seat 19. The upper wall of the gear 21 is provided with an annular upper fixing capsule 22, and the bottom wall of the gear 21 is provided with an annular The gear 21 is provided with a ventilation cavity 24, and the upper wall and the bottom wall of the ventilation cavity 24 are provided with a plurality of ventilation holes 25 for gas circulation. The ventilation holes 25 on the upper wall of the ventilation cavity 24 are connected to the upper fixed sac 22, and the ventilation holes 25 on the bottom wall of the ventilation cavity 24 are connected to the lower fixed sac 23. The center of the mounting seat 19 is provided with a ventilation pipe 3 26 for gas circulation, and the upper end of the ventilation pipe 3 26 passes through the center of the gear 21 and is connected to the ventilation cavity 24. It should be noted that the gas in the ventilation tube three 26 enters into the ventilation cavity two 24, and the gas in the ventilation cavity two 24 enters into the upper fixed bag 22 and the lower fixed bag 23 through the ventilation hole two 25. The upper fixed bag 22 and the lower fixed bag 23 are both bulged and are respectively arranged to fit the upper wall of the cavity 20 and the bottom wall of the cavity 20, so as to facilitate the fixing of the gear 21.

[0028] The bottom wall of the adjustment plate 17 is evenly and evenly installed with multiple groups of partitions 27 for dividing the space in the circumferential direction, and a slot 28 is provided between two adjacent groups of the partitions 27. The plug-in 10 is provided on the outer side of the partition 27, and the plug-in 2 11 is provided on the inner side of the partition 27. The spacing width between the placement slots 12 is greater than the width of the partition 27.

[0029] In this embodiment, multiple groups of partitions 27 are provided, namely partition one, partition two ... partition N. Initially, partition one is arranged in the placement groove 12 between plug one 10 and plug two 11. At this time, the spring 9 is in a compressed state. When the slider 6 moves toward the direction close to the support seat 7, the baffle 8 continues to squeeze the spring 9. At the same time, the slider 6 drives the plug one 10 and the plug two 11 to move toward the direction close to the support seat 7. The inclined surface of the plug two 11 is gradually inserted into the slot 28 between the partition one and the partition two. The inclined surface of the plug two 11 is arranged in contact with one end of the partition one. As the plug two 11 continues to move, the inclined surface pushes the partition one to rotate clockwise, and the partition one drives the adjustment disk 17 to rotate clockwise. When the plug two 11 is arranged in the slot 28, The slider 6 moves in the direction away from the support seat 7, and the slider 6 drives the plug-in 10 and the plug-in 2 11 to move in the direction away from the support seat 7. The inclined surface of the plug-in 10 is gradually inserted into the slot 28 between the partition two and the partition three, and the inclined surface is set in contact with one end of the partition two. As the plug-in 10 continues to move, the inclined surface pushes the partition two to rotate clockwise, and the partition two drives the adjustment disk 17 to rotate clockwise. When the plug-in 10 is set in the slot 28, the adjustment disk 17 stops rotating. At this time, the spring 9 is in a natural state, and the gas in the ventilation cavity 13 enters the fixing bag 14 through the ventilation hole 15. The fixing bag 14 bulges and fits the side wall of the partition 27, which is convenient for fixing the plug-in 10, thereby realizing the fixation of the adjustment disk 17.

[0030] The clamping member 16 and the clamping member 2 18 have the same structure, and only one group is introduced here. The clamping member 16 includes a clamping plate 29 and a gear condition 30. One end of the gear condition 30 is movably clamped in the cavity 20, and the other end of the gear condition 30 extends out of the cavity 20. The gear condition 30 on the clamping member 16 and the gear condition 30 on the clamping member 2 18 are both meshed and connected with the gear 21, and the gear condition 30 on the clamping member 16 and the gear condition 30 on the clamping member 2 18 are centrally symmetrically placed, and the clamping plate 29 is connected to one end of the gear condition 30 extending out of the cavity 20; It should be noted that, initially, the upper fixed bag 22 and the lower fixed bag 23 are both arranged in contact with the upper wall and the lower wall of the gear 21. When the clamping plate 29 on the clamping member 16 is subjected to thrust, it drives the gear condition 30 to move toward the direction close to the adjustment disk 17. The gear condition 30 on the clamping member 16 drives the gear 21 to rotate, and the gear 21 drives another set of gear conditions 30 to move. The gear condition 30 drives the clamping plate 29 on the clamping member 18 to move toward the direction close to the adjustment disk 17, and the clamping plate 29 fixes the wafer placed on the adjustment disk 17.

[0031] The regulating component 4 includes a connecting plate 31 and a sliding plate 32. The connecting plate 31 is arranged on the upper wall of the slider 6. The slider 6 supports and fixes the connecting plate 31. The sliding plate 32 is movably connected to the upper wall of the slider 6. An elastic bag 33 is installed between the connecting plate 31 and the sliding plate 32. The connecting plate 31, the sliding plate 32 and the elastic bag 33 are sealed.

[0032] The side wall of the connecting plate 31 is installed with a vent pipe 34, the vent pipe 34 connects the elastic bag 33 and the ventilation cavity 13, and a control valve is arranged in the vent pipe 34 to control the gas circulation. The bottom plate 1 is provided with a vent pipe 2 35, and a connecting pipe 36 is installed on the bottom plate 1. One end of the connecting pipe 36 penetrates the connecting plate 31 and is connected with the elastic bag 33, and the other end of the connecting pipe 36 is connected with the vent pipe 2 35. The connecting pipe 36 is made of foldable material. The vent pipe 2 35 is connected with the vent pipe 3 26, and a control valve is arranged in the connecting pipe 36 to control the gas circulation. It should be noted that when the sliding plate 32 moves along the slider 6 to squeeze the elastic bag 33, the vent hole 340 on the side wall of the sliding plate 32 and the control valve in the connecting pipe 36 are closed, the control valve in the vent pipe 34 is opened, and the gas in the elastic bag 33 enters the ventilation chamber 13 through the vent pipe 34, and the fixed bag 14 bulges, which is convenient for fixing the adjustment plate 17. The control valve in the vent pipe 34 is closed. As the sliding plate 32 continues to move, the elastic bag 33 is squeezed and bulged, and then the control valve in the connecting pipe 36 is opened, and the gas in the connecting pipe 36 enters the vent pipe 2 35, and enters the vent pipe 3 26, and enters the ventilation chamber 24 through the vent pipe 3 26, inflating the upper fixed bag 22 and the lower fixed bag 23, thereby fixing the gear 21 and fixing the clamping plate 29.

[0033] A hydraulic rod 37 is installed on the support seat 7, and a push plate 1 38 and a push plate 2 39 are installed at the movable end of the hydraulic rod 37. The push plate 2 39 is arranged at the end of the hydraulic rod 37 and is arranged close to the clamping member 16. The push plate 1 38 is arranged between the baffle plate 8 and the sliding plate 32. A magnetic member 2 is arranged on the side wall of the push plate 1 38, and the magnetic properties of the magnetic member 1 and the magnetic member 2 are different. It should be noted that, initially, partition one is arranged in the placement groove 12 between plug-in one 10 and plug-in two 11. At this time, the spring 9 is in a compressed state, and the baffle 8 is arranged in contact with the push plate one 38. The push plate one 38 restricts the movement of the baffle 8. When the hydraulic rod 37 drives the push plate one 38 and the push plate two 39 to move toward the direction close to the support seat 7, the push plate one 38 squeezes the baffle 8, and the baffle 8 drives the slider 6 to move toward the direction close to the support seat 7. The spring 9 continues to be compressed. When the hydraulic rod 37 drives the push plate one 38 and the push plate two 39 to move away from the support seat 7, under the action of the spring 9, the baffle 8 pushes the slider 6 to move away from the support seat 7.

[0034] The side wall of the sliding plate 32 is provided with a vent hole 3 40 , and a control valve is installed in the vent hole 3 40 to control the flow of gas in the elastic bag 33 .

[0035] The specific usage is as follows: Initially, the upper fixing capsule 22 and the lower fixing capsule 23 are both arranged in contact with the upper wall and the lower wall of the gear 21, and a plurality of partitions 27 are arranged, namely, partition 1, partition 2, ... partition N. Initially, partition 1 is arranged in the placement groove 12 between the plug-in 10 and the plug-in 2 11. At this time, the spring 9 is in a compressed state, and the baffle 8 is arranged in contact with the push plate 1 38. The push plate 1 38 restricts the movement of the baffle 8. The wafer to be fixed is placed on the upper wall of the adjustment plate 17. When the hydraulic rod 37 drives the push plate 1 38 and the push plate 2 39 to approach the support seat 7, the hydraulic rod 37 drives the push plate 1 38 and the push plate 2 39 to move toward the support seat 7. When moving, the push plate 1 38 squeezes the baffle 8, and the baffle 8 drives the slider 6 to move in the direction close to the support seat 7. At the same time, the baffle 8 continues to squeeze the spring 9. At this time, the slider 6 drives the plug-in 10 and the plug-in 2 11 to move in the direction close to the support seat 7. The inclined surface of the plug-in 2 11 gradually inserts into the slot 28 between the partition 1 and the partition 2. The inclined surface of the plug-in 2 11 is set in contact with one end of the partition 1. As the plug-in 2 11 continues to move, the inclined surface pushes the partition 1 to rotate clockwise, and the partition 1 drives the adjustment disk 17 to rotate clockwise. When the second plug-in 11 is arranged in the slot hole 28, the hydraulic rod 37 drives the push plate 1 38 and the push plate 2 39 to move in the direction away from the support seat 7. Under the action of the spring 9, the baffle plate 8 drives the slider 6 to move in the direction away from the support seat 7, and the slider 6 drives the plug-in 10 and the plug-in 2 11 to move in the direction away from the support seat 7. The inclined surface of the plug-in 10 is gradually inserted into the slot hole 28 between the partition plate 2 and the partition plate 3, and the inclined surface is arranged in contact with one end of the partition plate 2. As the plug-in 10 continues to move, the inclined surface drives the partition plate 2 to rotate clockwise, and the partition plate 2 drives the adjusting disk 17 to rotate clockwise. At the same time, the slider 6 drives the connecting plate 31 and the sliding plate 32 to move. When the plug-in 10 is arranged in the slot hole 28, the adjusting disk 17 stops rotating. At this time, the spring 9 is in a natural state, the connecting plate 31 moves to the lower end of the adjusting disk 17, and the push plate 29 is arranged on the side wall position of the clamping plate 29 on the clamping member 16; As the hydraulic rod 37 continues to move, the push plate 1 38 and the push plate 2 39 continue to move away from the support seat 7, the push plate 1 38 presses the sliding plate 32, and the push plate 2 39 drives the clamping plate 29 on the clamping member 1 16; The sliding plate 32 moves along the slider 6 to squeeze the elastic bag 33, the vent hole 340 on the side wall of the sliding plate 32 and the control valve in the connecting pipe 36 are closed, the control valve in the vent pipe 34 is opened, the gas in the elastic bag 33 enters the ventilation chamber 13 through the vent pipe 34, the gas in the ventilation chamber 13 enters the fixed bag 14 through the vent hole 15, the fixed bag 14 bulges and fits the side wall of the partition 27, so as to fix the plug-in 10, thereby fixing the adjustment disk 17; then the control valve in the vent pipe 34 is closed, as the sliding plate 32 continues to move, the elastic bag 33 is squeezed and bulged, at this time the clamping plate 29 on the clamping member 16 is subjected to thrust, driving the gear condition 30 to move in the direction close to the adjustment disk 17, and the gear condition 30 on the clamping member 16 drives the gear 2 1 rotates, the gear 21 drives another set of gear conditions 30 to move, and the gear condition 30 drives the clamping plate 29 on the clamping member 2 18 to move in the direction close to the adjustment disk 17, and the clamping plate 29 fixes the wafer placed on the adjustment disk 17; then the control valve in the connecting pipe 36 is opened, and the gas in the elastic bag 33 enters the ventilation pipe 2 35 and enters the ventilation pipe 3 26, and the gas in the ventilation pipe 3 26 enters the ventilation cavity 24, and the gas in the ventilation cavity 24 enters the upper fixed bag 22 and the lower fixed bag 23 through the ventilation hole 25, and the upper fixed bag 22 and the lower fixed bag 23 are both bulged, respectively attached to the upper wall of the cavity 20 and the bottom wall of the cavity 20, so as to realize the fixation of the gear 21, thereby realizing the fixation of the clamping plate 29, and then realizing the fixation of the wafer, and the control valve in the connecting pipe 36 is closed; When the wafer position needs to be adjusted, the control valves in the vent hole three 40 and the vent pipe one 34 are opened, and the hydraulic rod 37 drives the push plate one 38 and the push plate two 39 to move in the direction close to the support seat 7. The push plate one 38 and the sliding plate 32 are adsorbed and connected by the magnetic parts one and two. The push plate one 38 drives the sliding plate 32 to move, and the elastic bag 33 is unfolded. The gas in the fixed bag 14 in the plug-in one 10 enters the elastic bag 33, and the external gas enters the elastic bag 33 through the vent hole three 40. When the push plate one 38 moves to the position of the baffle 8, as the hydraulic rod 37 continues to move, the push plate one 38 drives the baffle 8 to move in the direction close to the support seat 7, and the baffle 8 drives the slider 6 to move, and the slider 6 drives the plug-in one 10 and the plug-in two 11 to move. The partition 27 is arranged in the plug-in one 10 and the plug-in two 11, and then the adjustment disk 17 is driven to rotate clockwise according to the above steps to adjust the angle.

[0036] Although the embodiments of the present invention have been shown and described, it is understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents. In short, if those skilled in the art are inspired by them and design structural modes and embodiments similar to the technical solution without creativity without departing from the purpose of the present invention, they shall all fall within the scope of protection of the present invention.

Claims

1. A die bonding device for electronic component production, comprising a base plate for supporting and fixing, characterized in that: The bottom plate is provided with a clamping and fixing component and a driving component, one end of the driving component is arranged at the lower end of the clamping and fixing component and is movably connected to the bottom wall of the clamping and fixing component, and the driving component is provided with a regulating component, and the regulating component is connected through the clamping and fixing component; The cam is secured to the bottom of the base and is adapted to engage the cams of the linkage set to enable the linkage set to engage with the support member and to engage with the cam in a manner that allows the linkage set to engage with the cam.

2. The die bonding device for electronic component production according to claim 1, characterized in that: A ventilation cavity is provided in the plug-in, a ventilation hole is provided on one side wall of the plug-in, a fixing bag is installed on the outer side of the plug-in, the ventilation hole is provided in the fixing bag, and the ventilation cavity is connected with the ventilation hole.

3. The die bonding device for electronic component production according to claim 2, characterized in that: The clamping and fixing assembly includes a clamping member 1, an adjustment disk and a clamping member 2. The adjustment disk is movably arranged on the bottom plate. The clamping member 1 and the clamping member 2 are both movably clamped in the adjustment disk, and the clamping member 1 and the clamping member 2 are placed in a centrally symmetrical manner.

4. The die bonding device for electronic component production according to claim 3, characterized in that: A mounting seat is provided at the center of the bottom wall of the adjustment disk, and the mounting seat is movably mounted on the upper wall of the bottom plate, a cavity is provided in the adjustment disk, both ends of the cavity pass through the side walls of the adjustment disk, the clamping piece 1 and the clamping piece 2 are movably clamped and arranged in the cavity, a gear is movably installed in the middle of the cavity, the gear is arranged at the upper end of the mounting seat, the upper wall of the gear is provided with an annular upper fixed bag, and the bottom wall of the gear is provided with an annular lower fixed bag, and a ventilation cavity 2 is provided in the gear, and the upper wall and bottom wall of the ventilation cavity 2 are both provided with multiple groups of ventilation holes 2 for gas circulation, the ventilation holes 2 on the upper wall of the ventilation cavity 2 are through-connected with the upper fixed bag, and the ventilation holes 2 on the bottom wall of the ventilation cavity 2 are through-connected with the lower fixed bag, and a ventilation pipe 3 for gas circulation is provided in the center of the mounting seat, and the upper end of the ventilation pipe 3 passes through the center of the gear and is through-connected with the ventilation cavity 2.

5. The die bonding device for electronic component production according to claim 4, characterized in that: The bottom wall of the adjustment plate is evenly and evenly installed with multiple groups of partitions for dividing the space in the circumferential direction, and slots are arranged between two adjacent groups of partitions. The first plug-in is arranged on the outer side of the partition, and the second plug-in is arranged on the inner side of the partition. The spacing width between the slots is greater than the width of the partition.

6. The die bonding device for electronic component production according to claim 5, characterized in that: The clamping member 1 and the clamping member 2 have the same structure. The clamping member 1 includes a clamping plate and a gear condition. One end of the gear condition is movably clamped in the cavity, and the other end of the gear condition extends out of the cavity. The gear condition on the clamping member 1 and the gear condition on the clamping member 2 are both meshed with the gear, and the gear condition on the clamping member 1 and the gear condition on the clamping member 2 are placed in a centrally symmetrical manner. The clamping plate is connected to one end of the gear condition extending out of the cavity.

7. The die bonding device for electronic component production according to claim 6, characterized in that: The regulating component includes a connecting plate and a sliding plate, wherein the connecting plate is arranged on the upper wall of the slider, the sliding plate is movably connected to the upper wall of the slider, an elastic bag is installed between the connecting plate and the sliding plate, and a magnetic part 1 is arranged on the side wall of the sliding plate.

8. The die bonding device for electronic component production according to claim 7, characterized in that: A ventilation pipe 1 is installed on the side wall of the connecting plate, and the ventilation pipe 1 connects the elastic bag and the ventilation cavity 1. A ventilation pipe 2 is arranged in the bottom plate, and a connecting pipe is installed on the bottom plate. One end of the connecting pipe passes through the connecting plate and is connected with the elastic bag, and the other end of the connecting pipe is connected with the ventilation pipe 2, and the ventilation pipe 2 is connected with the ventilation pipe 3. Control valves are arranged in the connecting pipe and the ventilation pipe 1.

9. The die bonding device for electronic component production according to claim 8, characterized in that: A hydraulic rod is installed on the support seat, and a push plate 1 and a push plate 2 are installed on the movable end of the hydraulic rod. The push plate 2 is arranged at the end of the hydraulic rod and is arranged close to the clamping member 1. The push plate 1 is arranged between the baffle plate and the sliding plate. A magnetic member 2 is provided on one side wall of the push plate, and the magnetic properties of the magnetic member 1 and the magnetic member 2 are different.

10. The die bonding device for electronic component production according to claim 9, characterized in that: The side wall of the sliding plate is provided with a vent hole three, and a control valve is installed in the vent hole three.

Citation Information

Patent Citations

  • Die bonding device and die bonding equipment

    CN116759370A

  • Die bonding device of LED die bonder and die bonding method thereof

    CN117594725A

  • Mechanical clamping jaw and lead frame taking and placing manipulator

    CN217837455U