Display panel, manufacturing method thereof and display device

Abstract

The invention relates to a display panel, a manufacturing method thereof and a display device. The display panel comprises a first organic layer, a conductive layer and a second organic layer. The conductive layer is arranged on the first organic layer and comprises a signal transmission part; the second organic layer is arranged on one side, far away from the first organic layer, of the conductive layer and covers the signal transmission part; wherein the first organic layer comprises a first sub-part aligned with the signal transmission part in the first direction and a second sub-part connected to the first sub-part, the thickness of the second sub-part is smaller than that of the first sub-part, and the thickness of the side, close to the first sub-part, of the second sub-part is larger than that of the side, away from the first sub-part, of the second sub-part; the second sub-part and the signal transmission part are not overlapped along a first direction, and the first direction is a direction in which the first organic layer is close to the conductive layer; according to the display panel, an undercut structure can be prevented from being formed between the signal transmission part and the first organic layer, the probability that the film layer falls off is reduced, and the yield of the display panel is increased.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) display panel, also known as organic electroluminescent display panel, has broad application prospects due to its advantages of simple preparation process, low cost, low power consumption, high luminous brightness, wide operating temperature adaptability range, light and thin volume, fast response speed, easy to achieve color display and large-screen display, easy to match with integrated circuit drivers, and easy to achieve flexible display.

[0003] In an OLED display panel, a plurality of organic planar layers are often formed on an array substrate to improve the flatness of the surface of the array substrate, and a metal layer is formed between the plurality of organic planar layers to be used for signal transfer.

[0004] The metal layer is often etched with chlorine, which then needs to be replaced with oxygen to remove residual chlorine. However, oxygen will have an ashing effect on the organic flat layer below the metal layer, which can easily form an undercut structure at the edge of the metal layer. The organic flat layer above the metal layer is difficult to effectively fill the undercut structure. In subsequent processes, the gas in the undercut structure is prone to expansion, which can lead to adverse phenomena such as film shedding. Summary of the invention

[0005] The embodiments of the present application provide a display panel and a manufacturing method thereof, and a display device, which can avoid the formation of an undercut structure between the signal transmission part and the first organic layer, reduce the probability of film layer falling off, and improve the yield rate of the display panel.

[0006] An embodiment of the present application provides a display panel, comprising:

[0007] A first organic layer;

[0008] A conductive layer, disposed on the first organic layer, wherein the conductive layer includes a signal transmission portion;

[0009] A second organic layer is disposed on a side of the conductive layer away from the first organic layer and covers the signal transmission part;

[0010] Among them, the first organic layer includes a first sub-portion arranged in alignment with the signal transmission portion along the first direction and a second sub-portion connected to the first sub-portion, the thickness of the second sub-portion is smaller than the thickness of the first sub-portion, the thickness of the second sub-portion close to the first sub-portion is greater than the thickness of the second sub-portion away from the first sub-portion, and the second sub-portion does not overlap with the signal transmission portion along the first direction, and the first direction is the direction in which the first organic layer is close to the conductive layer.

[0011] In an embodiment of the present application, an orthographic projection of the signal transmission portion on the second organic layer coincides with an orthographic projection of the first sub-portion on the second organic layer.

[0012] In one embodiment of the present application, the first sub-portion has a first surface on a side close to the signal transmission portion, the second sub-portion has a second surface on a side close to the second organic layer, the second surface is connected to the first surface, and the second surface is a curved surface;

[0013] Wherein, an angle between a portion of the second surface close to the first surface and the first surface is greater than or equal to 90°.

[0014] In one embodiment of the present application, the first organic layer also includes a third sub-portion located on a side of the second sub-portion away from the first sub-portion, and the thickness of the third sub-portion is less than the minimum thickness of the second sub-portion, and the angle between a portion of the second surface close to the first surface and the first surface is positively correlated with the thickness of the third sub-portion.

[0015] In one embodiment of the present application, a difference in thickness between the first sub-portion and the third sub-portion is less than or equal to 2 micrometers.

[0016] In one embodiment of the present application, the signal transmission portion has a third surface and a fourth surface arranged opposite to each other along the first direction, the signal transmission portion further includes a side surface connected between the third surface and the fourth surface, and the third sub-portion has a fifth surface on a side close to the second organic layer;

[0017] One end of the second surface is connected to the side surface, and the other end of the second surface extends in a direction away from the first sub-portion and is connected to the fifth surface.

[0018] In an embodiment of the present application, the third surface is located on a side of the signal transmission portion away from the first sub-portion, and the second organic layer covers the second surface, the side surface, the third surface and the fifth surface.

[0019] In one embodiment of the present application, the display panel further includes:

[0020] a substrate, the first organic layer being disposed on the substrate;

[0021] A thin film transistor layer, disposed between the substrate and the first organic layer, the thin film transistor layer comprising a plurality of thin film transistors, the thin film transistor comprising an active layer, a gate, a source electrode and a drain electrode;

[0022] Wherein, the signal transmission part is connected to the source or the drain.

[0023] According to the above-mentioned object of the present application, an embodiment of the present application further provides a method for manufacturing a display panel, which includes:

[0024] forming a first organic layer;

[0025] forming a conductive layer on the first organic layer, wherein a signal transmission part is formed in the conductive layer;

[0026] The surfaces of the first organic layer and the conductive layer are replaced by a replacement gas, a first sub-portion and a second sub-portion connected to the first sub-portion are formed in the first organic layer, the thickness of the second sub-portion is less than the thickness of the first sub-portion, the thickness of the second sub-portion close to the first sub-portion is greater than the thickness of the second sub-portion away from the first sub-portion, wherein the signal transmission portion and the first sub-portion are arranged in alignment along a first direction, the second sub-portion and the signal transmission portion do not overlap along the first direction, and the first direction is the direction in which the first organic layer is close to the conductive layer;

[0027] A second organic layer is formed on a side of the conductive layer away from the first organic layer, and the second organic layer covers the signal transmission part.

[0028] In one embodiment of the present application, the step of replacing the surfaces of the first organic layer and the conductive layer with a replacement gas comprises:

[0029] The pressure of the replacement gas is greater than or equal to 30 mToorr and less than or equal to 210 mToorr;

[0030] And / or, the flow rate of the replacement gas is greater than or equal to 1500 sccm and less than or equal to 3000 sccm.

[0031] In one embodiment of the present application, the replacement gas includes at least one of oxygen, carbon tetrafluoride and an inert gas.

[0032] According to the above-mentioned purpose of the present application, an embodiment of the present application further provides a display device, which includes the display panel.

[0033] The present application provides a display panel and a manufacturing method thereof, and a display device, wherein the thickness of the second sub-portion is less than the thickness of the first sub-portion, the thickness of the second sub-portion close to the first sub-portion is greater than the thickness of the second sub-portion away from the first sub-portion, and the first sub-portion and the signal transmission portion are arranged in alignment along a first direction, the second sub-portion and the signal transmission portion do not overlap along the first direction, and the first direction is the direction in which the first organic layer is close to the conductive layer; the present application can avoid the formation of an undercut structure between the signal transmission portion and the first organic layer, improve the coverage of the second organic layer on the first organic layer and the signal transmission portion, reduce the probability of film layer falling off, and improve the yield rate of the display panel.

[0034] Other features and advantages of the present application will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0036] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same figure numbers represent the same parts in the following description.

[0037] Figure 1 A schematic diagram of the structure of a display panel provided by an embodiment;

[0038] Figure 2 A schematic diagram of a partial structure of a display panel provided in an embodiment of the present application;

[0039] Figure 3 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0040] Figure 4 Another partial structural schematic diagram of a display panel provided in an embodiment of the present application;

[0041] Figure 5 A schematic diagram of another partial structure of a display panel provided in an embodiment of the present application;

[0042] Figure 6 A flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0043] Figure 7 A film layer morphology diagram of a display panel in an embodiment provided in the present application;

[0044] Figure 8This is a film layer morphology diagram of the display panel in the comparative example provided in the embodiment of the present application.

[0045] Description of reference numerals:

[0046] 1. First organic flat layer; 2. Metal layer; 3. Second organic flat layer; 4. Undercut structure;

[0047] 10. first organic layer; 11. first sub-section; 12. second sub-section; 13. third sub-section; 111. first surface; 121. second surface; 131. fifth surface;

[0048] 20. conductive layer; 21. signal transmission unit; 211. third surface; 212. fourth surface; 213. side surface;

[0049] 30. second organic layer;

[0050] 40. Substrate;

[0051] 50, thin film transistor layer; 51, thin film transistor; 511, active layer; 512, first gate; 513, second gate; 514, source; 515, drain; 52, buffer layer; 53, first gate insulating layer; 54, second gate insulating layer; 55, first interlayer dielectric layer; 56, second interlayer dielectric layer;

[0052] 61. Anode; 62. Pixel definition layer; 63. Retaining wall. DETAILED DESCRIPTION

[0053] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0054] Please refer to Figure 1 At present, the OLED display panel includes a first organic flat layer 1, a metal layer 2 arranged on the first organic flat layer 1, and a second organic flat layer 3 arranged on the first organic flat layer 1 and covering the metal layer 2; the metal layer 2 is often patterned with chlorine, but it needs to be replaced with oxygen to remove the residual chlorine; during the oxygen replacement process, the oxygen will produce an ashing effect on the first organic flat layer 1 below the metal layer 2, and it is easy to form an undercut structure 4 at the edge of the metal layer 2, while the second organic flat layer 3 above the metal layer 2 is difficult to effectively fill the undercut structure 4. In the subsequent process, the gas in the undercut structure 4 is easy to expand, which leads to undesirable phenomena such as film shedding.

[0055] Please refer to Figure 2 An embodiment of the present application provides a display panel, which includes a first organic layer 10 , a conductive layer 20 and a second organic layer 30 .

[0056] The conductive layer 20 is disposed on the first organic layer 10 , and includes a signal transmission part 21 . The second organic layer 30 is disposed on a side of the conductive layer 20 away from the first organic layer 10 , and covers the signal transmission part 21 .

[0057] Furthermore, the first organic layer 10 includes a first sub-portion 11 arranged in alignment with the signal transmission portion 21 along the first direction M and a second sub-portion 12 connected to the first sub-portion 11, the thickness of the second sub-portion 12 is less than the thickness of the first sub-portion 11, the thickness of the second sub-portion 12 on a side close to the first sub-portion 11 is greater than the thickness of the second sub-portion 12 on a side away from the first sub-portion 11, and the second sub-portion 12 does not overlap with the signal transmission portion 21 along the first direction M, and the first direction M is the direction in which the first organic layer 10 is close to the conductive layer 20.

[0058] In an embodiment of the present application, the thickness of the second sub-portion 12 is less than the thickness of the first sub-portion 11, the thickness of the second sub-portion 12 on the side close to the first sub-portion 11 is greater than the thickness of the second sub-portion 12 on the side away from the first sub-portion 11, and the first sub-portion 11 and the signal transmission portion 21 are aligned along the first direction M, and the second sub-portion 12 and the signal transmission portion 21 do not overlap along the first direction M, and the first direction M is the direction in which the first organic layer 10 is close to the conductive layer 20; the present application can avoid the formation of an undercut structure between the signal transmission portion 21 and the first organic layer 10, improve the coverage of the second organic layer 30 on the first organic layer 10 and the signal transmission portion 21, reduce the probability of film layer falling off, and improve the yield rate of the display panel.

[0059] Specifically, please combine Figure 2 as well as Figure 3 The first organic layer 10 and the second organic layer 30 are two organic film layers stacked in the display panel, and the conductive layer 20 is located between the first organic layer 10 and the second organic layer 30 .

[0060] In some embodiments, the conductive layer 20 is a metal layer located between the first organic layer 10 and the second organic layer 30 , and the conductive layer 20 may include a stacked structure of Ti / Al / Ti.

[0061] In some embodiments, the display panel also includes a substrate 40 and a thin film transistor layer 50; the first organic layer 10 is disposed on the substrate 40; the thin film transistor layer 50 is disposed between the substrate 40 and the first organic layer 10, the conductive layer 20 is disposed on a side of the first organic layer 10 away from the thin film transistor layer 50, and the second organic layer 30 is disposed on a side of the first organic layer 10 away from the thin film transistor layer 50 and covers the signal transmission part 21.

[0062] The thin film transistor layer 50 includes a plurality of thin film transistors 51 , and the thin film transistor 51 includes an active layer 511 , a gate, a source 514 , and a drain 515 ; wherein the signal transmission unit 21 is connected to the source 514 or the drain 515 .

[0063] In some embodiments, the gate includes a first gate 512 disposed on a side of the active layer 511 away from the substrate 40 and a second gate 513 disposed on a side of the first gate 512 away from the active layer 511 ; the signal transmission unit 21 is connected to the drain 515 .

[0064] In some embodiments, the thin film transistor layer 50 further includes a plurality of insulating layers covering the thin film transistor 51. Specifically, the thin film transistor layer 50 further includes a buffer layer 52 disposed on the substrate 40, the active layer 511 disposed on the buffer layer 52, a first gate insulating layer 53 disposed on the buffer layer 52 and covering the active layer 511, a first gate 512 disposed on the first gate insulating layer 53 and located on a side of the active layer 511 away from the substrate 40, a second gate insulating layer 54 disposed on the first gate insulating layer 53 and covering the first gate 512, and a second gate insulating layer 55 disposed on the second gate insulating layer 54. A second gate 513 is disposed on and located on a side of the first gate 512 away from the active layer 511, a first interlayer dielectric layer 55 is disposed on the second gate insulating layer 54 and covers the second gate 513, the source 514 and the drain 515 are disposed on the first interlayer dielectric layer 55, and a second interlayer dielectric layer 55 is disposed on the first interlayer dielectric layer 55 and covers the source 514 and the drain 515; the source 514 and the drain 515 pass through the first interlayer dielectric layer 55, the second gate insulating layer 54 and the first gate insulating layer 53 and are respectively connected to the opposite sides of the active layer 511.

[0065] In some embodiments, the display panel also includes an anode 61 disposed on a side of the second organic layer 30 away from the conductive layer 20, a pixel definition layer 62 disposed on a side of the second organic layer 30 away from the conductive layer 20, and a retaining wall 63 disposed on a side of the pixel definition layer 62 away from the second organic layer 30, a pixel opening is opened in the pixel definition layer 62, and the pixel opening corresponds to exposing a portion of the surface of the anode 61, and the anode 61 passes through the second organic layer 30 and is connected to the signal transmission unit 21.

[0066] In some embodiments, the signal transmission unit 21 can be used to transfer signals, for example, connected between the anode 61 and the drain 515 . The signal transmission unit 21 can also be a VDD signal line. In addition, the signal transmission unit 21 can also be other devices in the conductive layer 20 .

[0067] In the embodiment of the present application, the direction in which the first organic layer 10 is close to the conductive layer 20 is set as the first direction M, that is, the first direction M is the thickness direction of the display panel.

[0068] The first organic layer 10 includes a first sub-portion 11 arranged in alignment with the signal transmission portion 21 along the first direction M and a second sub-portion 12 connected to the first sub-portion 11, and the thickness of the second sub-portion 12 is less than the thickness of the first sub-portion 11; in the process of manufacturing the display panel, after the conductive layer 20 is patterned, a replacement gas is required to replace the first organic layer 10 and the conductive layer 20 to remove residual etching gas, such as chlorine; and the replacement gas will produce an ashing effect on the first organic layer 10, causing part of the first organic layer 10 to be etched away, and therefore, the thickness of other parts of the first organic layer 10 except the first sub-portion 11 blocked by the signal transmission portion 21 will be reduced, and therefore, the thickness of the second sub-portion 12 is less than the thickness of the first sub-portion 11.

[0069] In an embodiment of the present application, the ashing effect of the replacement gas on the first organic layer 10 can be reduced by reducing the pressure and / or flow rate of the gas during the replacement process, or adjusting the composition of the replacement gas, thereby reducing the etched volume of the first organic layer 10, and improving the phenomenon that the first organic layer 10 forms an undercut structure at the edge of the signal transmission part 21 due to etching.

[0070] The thickness of the second sub-portion 12 gradually decreases along the direction from the first sub-portion 11 to the second sub-portion 12 , and the second sub-portion 12 does not overlap with the signal transmission portion 21 along the first direction M, so that the first organic layer 10 does not form a cavity at the edge bottom of the signal transmission portion 21 .

[0071] In some embodiments, an orthographic projection of the signal transmission portion 21 on the second organic layer 30 coincides with an orthographic projection of the first sub-portion 11 on the second organic layer 30 .

[0072] In some embodiments, the first sub-portion 11 has a first surface 111 on a side close to the signal transmission portion 21, and the second sub-portion 12 has a second surface 121 on a side close to the second organic layer 30, the second surface 121 is connected to the first surface 111, and the second surface 121 is a curved surface; further, the first surface 111 can be a concave curved surface.

[0073] In some embodiments, an angle A between a portion of the second surface 121 close to the first surface 111 and the first surface 111 is greater than or equal to 90°; in addition, the second direction N can be set as the direction in which the second sub-portion 12 is close to the first sub-portion 11, and an angle B between the second surface 121 close to the first surface 111 and the second direction N is less than or equal to 90°, so as to avoid the second surface 121 that sinks relative to the first surface 111 from falling into the coverage range of the signal transmission portion 21, thereby avoiding the generation of an undercut structure.

[0074] Furthermore, an angle A between a portion of the second surface 121 close to the first surface 111 and the first surface 111 is greater than or equal to 130°, and an angle B between the second surface 121 close to the first surface 111 and the second direction N is less than or equal to 50°.

[0075] In some embodiments, the first organic layer 10 further includes a third sub-portion 13 located on a side of the second sub-portion 12 away from the first sub-portion 11, and the thickness of the third sub-portion 13 is less than the minimum thickness of the second sub-portion 12, wherein the thickness of the third sub-portion 13 is uniform, and the thickness of the third sub-portion 13 increases with the decrease of the pressure and / or flow rate of the replacement gas, that is, the smaller the pressure and / or flow rate of the replacement gas, the smaller the ashing effect of the replacement gas on the first organic layer 10, and the smaller the volume of the first organic layer 10 etched away. The smaller the volume of the first organic layer 10 etched away is, the greater the thickness of the third sub-portion 13 is, and the angle A increases as the volume of the first organic layer 10 etched away decreases, so that the thickness change of the second sub-portion 12 is small and the change is more gradual; therefore, the angle A between the portion of the second surface 121 close to the first surface 111 and the first surface 111 is positively correlated with the thickness of the third sub-portion 13, and further, the angle B between the portion of the second surface 121 close to the first surface 111 and the second direction N decreases as the thickness of the third sub-portion 13 increases.

[0076] In some embodiments, since the embodiments of the present application reduce the pressure and / or flow rate of the replacement gas, or adjust the composition of the replacement gas, the volume of the first organic layer 10 etched away in the embodiments of the present application will also be reduced, and the difference D in thickness between the first sub-portion 11 and the third sub-portion 13 is less than or equal to 2 microns.

[0077] In some embodiments, the signal transmission portion 21 has a third surface 211 and a fourth surface 212 that are relatively arranged along the first direction M, and the signal transmission portion 21 also includes a side 213 connected between the third surface 2112 and the fourth surface 212, and the third sub-portion 13 has a fifth surface 131 on the side close to the second organic layer 30; wherein, one end of the second surface 121 is connected to the side 213, and the other end of the second surface 121 extends in a direction away from the first sub-portion 11 and is connected to the fifth surface 131, that is, in the embodiment of the present application, the portion where the thickness of the first organic layer 10 is reduced is located outside the coverage range of the signal transmission portion 21, and no undercut structure is generated at the edge of the signal transmission portion 21.

[0078] Furthermore, the third surface 211 is located on a side of the signal transmission portion 21 away from the first sub-portion 11, and the second organic layer 30 covers the second surface 121, the side surface 213, the third surface 211 and the fifth surface 131, so that the second organic layer 30 can completely cover the first organic layer 10 and the upper surface of the signal transmission portion 21, thereby avoiding the phenomenon of film layer falling off due to the inability to fill the undercut structure.

[0079] In addition, please combine Figure 2 , Figure 3 , Figure 4 as well as Figure 5 , Figure 2 Only the local structure of the signal transmission unit 21 is shown. Figure 4 and Figure 5 FIG. 2 shows a complete cross-sectional structure of the signal transmission part 21, wherein the structure of the signal transmission part 21 at the signal transfer part can be as follows: Figure 4 As shown, the structure where the signal transmission part 21 is not located at the signal transfer part can be as follows Figure 5 shown.

[0080] Understandably, Figure 4 and Figure 5 The structure on the left side of the signal transmission part 21 can be Figure 2 The same as Figure 4 and Figure 5 The structure on the middle right side can be arranged symmetrically with the structure on the left side.

[0081] As mentioned above, in the embodiment of the present application, the ashing effect of the replacement gas on the first organic layer 10 can be reduced by reducing the pressure and / or flow rate of the replacement gas, or adjusting the composition of the replacement gas, wherein the thickness of the second sub-portion 12 is less than the thickness of the first sub-portion 11, and the thickness of the second sub-portion 12 gradually decreases in the direction from the first sub-portion 11 to the second sub-portion 12, and the first sub-portion 11 and the signal transmission portion 21 are aligned along the first direction M, and the second sub-portion 12 and the signal transmission portion 21 do not overlap along the first direction M, and the first direction M is the direction in which the first organic layer 10 approaches the conductive layer 20; the present application can avoid the formation of an undercut structure between the signal transmission portion 21 and the first organic layer 10, improve the coverage of the second organic layer 30 on the first organic layer 10 and the signal transmission portion 21, reduce the probability of film layer falling off, and improve the yield rate of the display panel.

[0082] Please combine Figure 2 , Figure 3 as well as Figure 6 The present application also provides a method for manufacturing a display panel, which includes:

[0083] S10 , forming a first organic layer 10 .

[0084] S20 , forming a conductive layer 20 on the first organic layer 10 , wherein a signal transmission unit 21 is formed in the conductive layer 20 .

[0085] S30. The surfaces of the first organic layer 10 and the conductive layer 20 are replaced by replacement gas, wherein a first sub-portion 11 and a second sub-portion 12 connected to the first sub-portion 11 are formed in the first organic layer 10, wherein the thickness of the second sub-portion 12 is less than the thickness of the first sub-portion 11, and the thickness of the second sub-portion 12 on the side close to the first sub-portion 11 is greater than the thickness of the second sub-portion 12 on the side away from the first sub-portion 11, wherein the signal transmission portion 21 is aligned with the first sub-portion 11 along a first direction M, and the second sub-portion 12 and the signal transmission portion 21 do not overlap along the first direction M, and the first direction M is the direction in which the first organic layer 10 is close to the conductive layer 20.

[0086] S40 , forming a second organic layer 30 on a side of the conductive layer 20 away from the first organic layer 10 , wherein the second organic layer 30 covers the signal transmission part 21 .

[0087] In step S10 , a substrate 40 is first provided.

[0088] Next, the thin film transistor layer 50 is formed on the substrate 40 . The thin film transistor layer 50 includes a plurality of thin film transistors 51 . The thin film transistor 51 includes an active layer 511 , a gate electrode, a source electrode 514 , and a drain electrode 515 .

[0089] In some embodiments, the gate includes a first gate 512 disposed on a side of the active layer 511 away from the substrate 40 and a second gate 513 disposed on a side of the first gate 512 away from the active layer 511 .

[0090] In some embodiments, the thin film transistor layer 50 further includes a plurality of insulating layers covering the thin film transistor 51. Specifically, the thin film transistor layer 50 further includes a buffer layer 52 disposed on the substrate 40, the active layer 511 disposed on the buffer layer 52, a first gate insulating layer 53 disposed on the buffer layer 52 and covering the active layer 511, a first gate 512 disposed on the first gate insulating layer 53 and located on a side of the active layer 511 away from the substrate 40, a second gate insulating layer 54 disposed on the first gate insulating layer 53 and covering the first gate 512, and a second gate insulating layer 55 disposed on the second gate insulating layer 54. A second gate 513 is disposed on and located on a side of the first gate 512 away from the active layer 511, a first interlayer dielectric layer 55 is disposed on the second gate insulating layer 54 and covers the second gate 513, the source 514 and the drain 515 are disposed on the first interlayer dielectric layer 55, and a second interlayer dielectric layer 55 is disposed on the first interlayer dielectric layer 55 and covers the source 514 and the drain 515; the source 514 and the drain 515 pass through the first interlayer dielectric layer 55, the second gate insulating layer 54 and the first gate insulating layer 53 and are respectively connected to the opposite sides of the active layer 511.

[0091] Next, the first organic layer 10 is formed on a side of the thin film transistor layer 50 away from the substrate 10 .

[0092] In step S20, a conductive material layer is formed on a side of the first organic layer 10 away from the thin film transistor layer 50, and the conductive material layer is patterned to form the conductive layer 20; wherein the conductive layer 20 includes a signal transmission part 21, and the signal transmission part 21 can be connected to the drain electrode 515.

[0093] In some embodiments, chlorine gas may be used to perform dry etching on the conductive material layer. During etching, chlorine gas or chlorine element may remain on the surface of the film layer, which may damage the film layer and affect subsequent support.

[0094] In step S30, the replacement gas is used for replacement to remove the residual chlorine gas or chlorine element.

[0095] In an embodiment of the present application, in order to avoid the formation of an undercut structure at the edge of the signal transmission part 21 during the ashing process of the first organic layer 10 by the replacement gas, the embodiment of the present application can reduce the pressure and / or flow rate of the replacement gas, or adjust the composition of the replacement gas to reduce the etching intensity of the replacement gas on the first organic layer 10, thereby reducing the probability of the undercut structure being generated at the edge of the signal transmission part 21.

[0096] In some embodiments, the pressure of the replacement gas is greater than or equal to 30 mToorr and less than or equal to 210 mToorr.

[0097] In some embodiments, the flow rate of the replacement gas is greater than or equal to 1500 sccm and less than or equal to 3000 sccm.

[0098] It can be understood that, during the replacement process, the replacement gas can satisfy at least one of the above pressure ranges or flow ranges.

[0099] In some embodiments, the replacement gas includes at least one of oxygen, carbon tetrafluoride and an inert gas; wherein, when the replacement gas includes an inert gas, such as argon, and the reaction activity of the inert gas is less than that of oxygen, the etching intensity of the first organic layer 10 by the replacement gas can be effectively reduced.

[0100] Therefore, after the replacement gas is replaced, a first sub-portion 11 and a second sub-portion 12 connected to the first sub-portion 11 are formed in the first organic layer 10, the thickness of the second sub-portion 12 is less than the thickness of the first sub-portion 11, and the thickness of the second sub-portion 12 gradually decreases in the direction from the first sub-portion 11 to the second sub-portion 12, wherein the signal transmission portion 21 and the first sub-portion 11 are aligned with each other along the first direction M, and the second sub-portion 12 and the signal transmission portion 21 do not overlap along the first direction M, and the first direction M is the direction in which the first organic layer 10 is close to the conductive layer 20.

[0101] It can be understood that in the embodiment of the present application, the ashing effect of the replacement gas on the first organic layer 10 can be reduced by reducing the pressure and / or flow rate of the gas during the replacement process, or adjusting the composition of the replacement gas, thereby reducing the volume of the first organic layer 10 etched, and improving the phenomenon that the first organic layer 10 forms an undercut structure at the edge of the signal transmission part 21 due to etching.

[0102] The thickness of the second sub-portion 12 gradually decreases along the direction from the first sub-portion 11 to the second sub-portion 12 , and the second sub-portion 12 does not overlap with the signal transmission portion 21 along the first direction M, so that the first organic layer 10 does not form a cavity at the edge bottom of the signal transmission portion 21 .

[0103] In some embodiments, the orthographic projection of the signal transmission portion 21 on the substrate 40 coincides with the orthographic projection of the first sub-portion 11 on the substrate 40 .

[0104] In some embodiments, the first sub-portion 11 has a first surface 111 on a side close to the signal transmission portion 21, and the second sub-portion 12 has a second surface 121 on a side close to the second organic layer 30, the second surface 121 is connected to the first surface 111, and the second surface 121 is a curved surface; further, the first surface 111 can be a concave curved surface.

[0105] In some embodiments, an angle A between a portion of the second surface 121 close to the first surface 111 and the first surface 111 is greater than or equal to 90°; in addition, the second direction N can be set as the direction in which the second sub-portion 12 is close to the first sub-portion 11, and an angle B between the second surface 121 close to the first surface 111 and the second direction N is less than or equal to 90°, so as to avoid the second surface 121 that sinks relative to the first surface 111 from falling into the coverage range of the signal transmission portion 21, thereby avoiding the generation of an undercut structure.

[0106] Furthermore, an angle A between a portion of the second surface 121 close to the first surface 111 and the first surface 111 is greater than or equal to 130°, and an angle B between the second surface 121 close to the first surface 111 and the second direction N is less than or equal to 50°.

[0107] In some embodiments, the first organic layer 10 further includes a third sub-portion 13 located on a side of the second sub-portion 12 away from the first sub-portion 11, and the thickness of the third sub-portion 13 is less than the minimum thickness of the second sub-portion 12, wherein the thickness of the third sub-portion 13 is uniform, and the thickness of the third sub-portion 13 increases with the decrease of the pressure and / or flow rate of the replacement gas, that is, the smaller the pressure and / or flow rate of the replacement gas, the smaller the ashing effect of the replacement gas on the first organic layer 10, and the smaller the volume of the first organic layer 10 etched away. The smaller the volume of the first organic layer 10 etched away is, the greater the thickness of the third sub-portion 13 is, and the angle A increases as the volume of the first organic layer 10 etched away decreases, so that the thickness change of the second sub-portion 12 is small and the change is more gradual; therefore, the angle A between the portion of the second surface 121 close to the first surface 111 and the first surface 111 is positively correlated with the thickness of the third sub-portion 13, and further, the angle B between the portion of the second surface 121 close to the first surface 111 and the second direction N decreases as the thickness of the third sub-portion 13 increases.

[0108] In some embodiments, since the embodiments of the present application reduce the pressure and / or flow rate of the replacement gas, or adjust the composition of the replacement gas, the volume of the first organic layer 10 etched away in the embodiments of the present application will also be reduced, and the difference D in thickness between the first sub-portion 11 and the third sub-portion 13 is less than or equal to 2 microns.

[0109] In some embodiments, the signal transmission portion 21 has a third surface 211 and a fourth surface 212 that are relatively arranged along the first direction M, and the signal transmission portion 21 also includes a side 213 connected between the third surface 2112 and the fourth surface 212, and the third sub-portion 13 has a fifth surface 131 on the side close to the second organic layer 30; wherein, one end of the second surface 121 is connected to the side 213, and the other end of the second surface 121 extends in a direction away from the first sub-portion 11 and is connected to the fifth surface 131, that is, in the embodiment of the present application, the portion where the thickness of the first organic layer 10 is reduced is located outside the coverage range of the signal transmission portion 21, and no undercut structure is generated at the edge of the signal transmission portion 21.

[0110] In step S40 , the second organic layer 30 is formed on a side of the first organic layer 10 away from the thin film transistor layer 50 , and the second organic layer 30 covers the signal transmission part 21 .

[0111] Furthermore, the third surface 211 is located on a side of the signal transmission portion 21 away from the first sub-portion 11, and the second organic layer 30 covers the second surface 121, the side surface 213, the third surface 211 and the fifth surface 131, so that the second organic layer 30 can completely cover the first organic layer 10 and the upper surface of the signal transmission portion 21, thereby avoiding the phenomenon of film layer falling off due to the inability to fill the undercut structure.

[0112] In some embodiments, the display panel also includes an anode 61 formed on the side of the second organic layer 30 away from the conductive layer 20, a pixel definition layer 62 arranged on the side of the second organic layer 30 away from the conductive layer 20, and a retaining wall 63 arranged on the side of the pixel definition layer 62 away from the second organic layer 30, a pixel opening is opened in the pixel definition layer 62, and the pixel opening corresponds to exposing a portion of the surface of the anode 61, and the anode 61 passes through the second organic layer 30 and is connected to the signal transmission unit 21.

[0113] It should be noted that the signal transmission part 21 can be used to transfer signals, for example, connected between the anode 61 and the drain 515 . The signal transmission part 21 can also be a VDD signal line. In addition, the signal transmission part 21 can also be other devices in the conductive layer 20 .

[0114] Furthermore, the embodiments of the present application provide embodiments and comparative examples to verify the effect of improving the undercut structure of the manufacturing method of the display panel provided in the embodiments of the present application.

[0115] The conditions of the replacement gas used in the embodiments and comparative examples are shown in Table 1.

[0116] Table 1 Replacement gas parameters

[0117]

[0118] The film structure of the display panel obtained by the embodiment at the signal transmission part 21 is as follows: Figure 7 As shown, the film structure of the display panel obtained by the comparative example at the signal transmission part 21 is as follows Figure 8 As shown by Figure 7 and Figure 8 It can be seen that the embodiment of the present application can improve the phenomenon that the first organic layer 10 generates an undercut structure at the edge of the signal transmission part 21 due to ashing by adjusting the parameters of the replacement gas, such as reducing the pressure and flow rate of the replacement gas.

[0119] In summary, in the embodiment of the present application, the ashing effect of the replacement gas on the first organic layer 10 can be reduced by reducing the pressure and / or flow rate of the replacement gas, or adjusting the composition of the replacement gas, wherein the thickness of the second sub-portion 12 is less than the thickness of the first sub-portion 11, the thickness of the second sub-portion 12 on the side close to the first sub-portion 11 is greater than the thickness of the second sub-portion 12 on the side away from the first sub-portion 11, and the first sub-portion 11 and the signal transmission portion 21 are arranged in alignment along the first direction M, and the second sub-portion 12 and the signal transmission portion 21 do not overlap along the first direction M, and the first direction M is the direction in which the first organic layer 10 is close to the conductive layer 20; the present application can avoid the formation of an undercut structure between the signal transmission portion 21 and the first organic layer 10, improve the coverage of the second organic layer 30 on the first organic layer 10 and the signal transmission portion 21, reduce the probability of film layer falling off, and improve the yield rate of the display panel.

[0120] In addition, an embodiment of the present application further provides a display device, which includes the display panel described in the above embodiment.

[0121] It can be understood that, since the display device includes the display panel described in the above embodiment, the display device has the same beneficial effects as in the above embodiment, which will not be described in detail herein.

[0122] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0123] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0124] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0125] The above are only preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A display panel, characterized in that: include: A first organic layer; A conductive layer, disposed on the first organic layer, wherein the conductive layer includes a signal transmission portion; A second organic layer is disposed on a side of the conductive layer away from the first organic layer and covers the signal transmission part; Among them, the first organic layer includes a first sub-portion arranged in alignment with the signal transmission portion along the first direction and a second sub-portion connected to the first sub-portion, the thickness of the second sub-portion is smaller than the thickness of the first sub-portion, the thickness of the second sub-portion close to the first sub-portion is greater than the thickness of the second sub-portion away from the first sub-portion, and the second sub-portion does not overlap with the signal transmission portion along the first direction, and the first direction is the direction in which the first organic layer is close to the conductive layer.

2. The display panel according to claim 1, characterized in that: An orthographic projection of the signal transmission portion on the second organic layer coincides with an orthographic projection of the first sub-portion on the second organic layer.

3. The display panel according to claim 1, characterized in that: The first sub-portion has a first surface on a side close to the signal transmission portion, and the second sub-portion has a second surface on a side close to the second organic layer, the second surface is connected to the first surface, and the second surface is a curved surface; Wherein, an angle between a portion of the second surface close to the first surface and the first surface is greater than or equal to 90°.

4. The display panel according to claim 3, characterized in that: The first organic layer also includes a third sub-portion located on a side of the second sub-portion away from the first sub-portion, and the thickness of the third sub-portion is less than the minimum thickness of the second sub-portion, and the angle between a portion of the second surface close to the first surface and the first surface is positively correlated with the thickness of the third sub-portion.

5. The display panel according to claim 4, characterized in that: A difference in thickness between the first sub-portion and the third sub-portion is less than or equal to 2 micrometers.

6. The display panel according to claim 3, characterized in that: The signal transmission portion has a third surface and a fourth surface that are oppositely arranged along the first direction, the signal transmission portion also includes a side surface connected between the third surface and the fourth surface, and the third sub-portion has a fifth surface on a side close to the second organic layer; One end of the second surface is connected to the side surface, and the other end of the second surface extends in a direction away from the first sub-portion and is connected to the fifth surface.

7. The display panel according to claim 6, characterized in that: The third surface is located at a side of the signal transmission portion away from the first sub-portion, and the second organic layer covers the second surface, the side surface, the third surface, and the fifth surface.

8. The display panel according to claim 1, characterized in that: The display panel further includes: a substrate, the first organic layer being disposed on the substrate; A thin film transistor layer, disposed between the substrate and the first organic layer, the thin film transistor layer comprising a plurality of thin film transistors, the thin film transistor comprising an active layer, a gate, a source electrode and a drain electrode; Wherein, the signal transmission part is connected to the source or the drain.

9. A method for manufacturing a display panel, characterized in that: include: forming a first organic layer; forming a conductive layer on the first organic layer, wherein a signal transmission part is formed in the conductive layer; The surfaces of the first organic layer and the conductive layer are replaced by a replacement gas, a first sub-portion and a second sub-portion connected to the first sub-portion are formed in the first organic layer, the thickness of the second sub-portion is less than the thickness of the first sub-portion, the thickness of the second sub-portion close to the first sub-portion is greater than the thickness of the second sub-portion away from the first sub-portion, wherein the signal transmission portion and the first sub-portion are arranged in alignment along a first direction, the second sub-portion and the signal transmission portion do not overlap along the first direction, and the first direction is the direction in which the first organic layer is close to the conductive layer; A second organic layer is formed on a side of the conductive layer away from the first organic layer, and the second organic layer covers the signal transmission part.

10. The method for manufacturing a display panel according to claim 9, characterized in that: The step of replacing the surfaces of the first organic layer and the conductive layer with a replacement gas comprises: The pressure of the replacement gas is greater than or equal to 30 mToorr and less than or equal to 210 mToorr; And / or, the flow rate of the replacement gas is greater than or equal to 1500 sccm and less than or equal to 3000 sccm.

11. The method for manufacturing a display panel according to claim 9, characterized in that: The replacement gas includes at least one of oxygen, carbon tetrafluoride and an inert gas.

12. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 8.

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